JP2003075811A - Manufacturing method for electrooptic device, the electrooptic device, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new technique which can increase operation efficiency and suppress a decrease in yield for a manufacturing method for an electrooptic device which has a process of dividing an original substrate. SOLUTION: On a large-sized panel 40, an adhesive 403a is arranged at the intersection of a 1st dividing line 40x and a 2nd dividing line 40y and an adhesive 403b is discretely arranged on the 2nd dividing line 40y other than the intersection. Those adhesives 403a and 403b are made of the same material with a sealing material 443 and arranged at the same time, and bonded between the 1st original substrate and 2nd original substrate. The large-sized panel 40 is divided along the 1st dividing lines 40x, 40z, and 40v first into intermediate panels, which are divided along the 2nd dividing line 40y into liquid crystal panels.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electro-optical device, an electro-optical device and an electronic device, and more particularly to a manufacturing technique for an electro-optical device formed by dividing an original substrate.

[0002]

2. Description of the Related Art Generally, in an electro-optical device such as a liquid crystal display device or an EL (electroluminescence) display device, a substrate and an electro-optical substance (electro-optical light modulator such as liquid crystal) arranged along the substrate. , An electro-optical luminescent material such as an inorganic EL material or an organic EL material), and an electro-optical panel (a liquid crystal panel, an EL panel, etc.). Here, for example, a liquid crystal panel has a structure in which a liquid crystal layer is sealed between a pair of transparent substrates made of glass or plastic, and transparent electrodes are arranged on both sides of the liquid crystal layer. In many cases, EL panels such as organic EL panels have a structure in which a dielectric layer, a light emitting layer, an electrode layer, and the like are sequentially stacked on a single insulating substrate.

In the case of manufacturing the electro-optical device as described above, after forming an electrode structure or a laminated structure on a large-sized original substrate, the original substrate may be divided to form a plurality of electro-optical panels. . 9 and 10 show steps for manufacturing a liquid crystal panel of this type.

In this method of manufacturing a liquid crystal panel, as shown in FIG. 13, first, a large-sized first glass substrate is used.
Inner surfaces of the original substrate 11 and the second original substrate 12 (surfaces that face each other when they are later bonded)
A transparent electrode, an alignment film, and, if necessary, a surface structure including a color filter, a reflective layer, and the like are formed thereon. After that, an alignment treatment such as a rubbing treatment performed on the alignment film is performed. Then, a sealing material composed of a thermosetting resin or a photo-curing resin is applied on the inner surface of the first original substrate 11, while a substrate space is provided on the inner surface of the second original substrate 12. Spacers for regulation are scattered. After that, the first original substrate 11 and the second original substrate 12 are bonded together via the above-mentioned sealing material, and the large-sized panel 10 shown in FIG. 12A is formed.

Next, the first original substrate 11 and the second original substrate 12 constituting the large-sized panel 10 are divided by the known scribe-break method. More specifically,
First, as shown in FIG. 12A, a plurality of scribe grooves 15 extending in the X direction in the figure are formed on the outer surfaces of the first original substrate 11 and the second original substrate 12 (primary scribe), and then the scribe grooves are formed. The first original substrate 11 and the second substrate 15
By applying stress to the original substrate 12, the first original substrate 11 and the second original substrate 12 are fractured along the scribe groove 15 (primary break), so that FIG.
The strip-shaped intermediate panel 13 shown in FIG.

In the strip-shaped intermediate panel 13 thus divided and formed, since the opening of the sealing material is exposed at the divided end portion divided in the previous step, this opening is formed. Liquid crystal is injected into the inside of the sealing material from the inside, and then the opening is closed by a sealing material or the like.

Next, as shown in FIG. 12 (c), a plurality of scribe grooves 16 extending in the Y direction in the drawing are formed on the outer surfaces of the two substrates of the intermediate panel 13 (secondary scribe), and thereafter. As a result of the substrate being broken along these scribe grooves 16 (secondary break), as shown in FIG.
The liquid crystal panel 14 shown in 2 (d) is formed. The liquid crystal panel 14 has a structure in which liquid crystal is sealed between a pair of substrates by a sealing material. After that, as shown in FIG. 13, a finishing process such as a mounting process of the liquid crystal driving IC and the flexible wiring board, a molding process of the mounting part, a process of assembling a backlight, a light guide plate and the like is performed on the liquid crystal panel 14. The liquid crystal display device is constructed by sequentially performing the steps.

[0008]

However, in the liquid crystal panel manufacturing method as described above, the large-sized panel 1 is used.
After performing the primary scribing on 0, the intermediate panel 13 is divided and formed by the primary break, and then the secondary scribing is performed on each of the divided intermediate panels 13 to further
Since the individual liquid crystal panels 14 are formed in the next breaking step, it is necessary to carry out the secondary scribing on each of the intermediate panels 13 divided into a plurality of parts. Since scribing and breaking are performed on each of the two substrates to be formed, it is necessary to repeatedly turn over the intermediate panel 13, which requires a lot of work and lowers manufacturing efficiency.

On the other hand, in the above manufacturing method, the scribe groove 15 formed by the primary scribe and the scribe groove 16 formed by the secondary scribe are formed in advance as the first original substrate 11 and the second original of the large-sized panel 10. It is conceivable to apply it to the substrate 12. With this configuration, it is not necessary to form the scribe groove for each individual intermediate panel 13 after the intermediate panel 13 is divided and formed, so that the manufacturing efficiency may be significantly improved. However, in practice, in this way, the substrate is unintentionally cracked along the scribe groove 16 after the step of breaking the original substrate along the scribe groove 15 and before the step of breaking the intermediate panel 13. In some cases, the yield will decrease, and the production efficiency will decrease.

Therefore, the present invention solves the above-mentioned problems, and it is an object of the present invention to improve work efficiency and suppress a decrease in yield in an electro-optical device manufacturing method having a step of dividing an original substrate. It is to provide a new manufacturing technique that can be performed.

[0011]

In order to solve the above-mentioned problems, a method of manufacturing an electro-optical device according to the present invention has a substrate and an electro-optical material arranged on the substrate, and the original substrate is a first substrate. A method of manufacturing an electro-optical device, wherein the substrate is formed by dividing along a dividing line and a second dividing line, wherein an adhesive is provided on the second dividing line and on the first surface of the original substrate. An adhering step of arranging; a cutting step of forming a cut along the first dividing line and the second dividing line on the second surface of the original substrate facing the first surface; A first dividing step of dividing along a dividing line; and a second portion of the substrate divided by the first dividing step.
A second dividing step of dividing along a dividing line.

According to the present invention, since the first dividing step and the second dividing step are sequentially performed after forming the notches along the first dividing line and the second dividing line, the division is performed after the first dividing step. Since it is not necessary to form a cut along each of the individual substrate portions along the second dividing line, manufacturing efficiency can be improved. Further, by disposing the adhesive on the second dividing line of the original substrate, it is possible to reduce the possibility that the substrate is accidentally broken before the second dividing step due to the scribe groove along the second dividing line. It is possible to suppress a decrease in yield.

Note that the above-mentioned adhesive material means an object adhered in a state of being in contact with the substrate surface, and the adhesive material already adhered to the substrate surface has adhesiveness (adhesiveness) to other members. Need not have.

In the present invention, in the bonding step,
It is preferable that the adhesive is discretely arranged along the second dividing line.

According to the present invention, since the adhesive is discretely arranged along the second dividing line, the dividing of the substrate portion is prevented by the adhesive in the second dividing step, and the second breaking line is formed. It is possible to suppress deviation from the dividing line. In this case, the adhesive region of the adhesive material to the substrate surface has a diameter of 0.05 to 0.5 mm or an adhesive area equivalent to this, which does not prevent the division of the substrate portion during the second dividing step, and It is desirable to prevent substrate cracking before the dividing step.

In the present invention, in the bonding step,
It is preferable that the adhesive is arranged at an intersection of the first dividing line and the second dividing line.

According to the present invention, the adhesive is placed at the intersection of the first dividing line and the second dividing line, so that when the original substrate is divided along the first dividing line in the first dividing step, It is possible to prevent the substrate from cracking along the second dividing line.

In the present invention, in the bonding step,
It is preferable that the adhesive is disposed on a surface portion adjacent to an intersection of the first dividing line and the second dividing line.

According to the present invention, the adhesive material is disposed adjacent to both sides of the intersection of the first dividing line and the second dividing line, so that the adhesive material is along the first dividing line in the first dividing step. Therefore, it is possible to prevent the breakage of the original substrate and prevent the occurrence of substrate cracks along the second dividing line in the first dividing step.

In the present invention, it is preferable that the adhesive material is made of the same material as the sealing material for enclosing the electro-optical material.

According to the present invention, since the adhesive material is made of the same material as the seal material, it is not necessary to prepare a dedicated material to be used as the adhesive material, and at the same time as the seal material, the adhesive material is used in the same process. Since it will be possible to place
It is possible to avoid an increase in the number of manufacturing steps and complexity.

Next, another method of manufacturing an electro-optical device according to the present invention has a pair of substrates and an electro-optical material disposed between the pair of substrates, and the original substrate is a first dividing line and a first dividing line. A method of manufacturing an electro-optical device in which at least one substrate of the pair of substrates is formed by dividing along the two-division line, the electro-optical device being arranged on the second division line and facing the original substrate. An adhering step of disposing an adhesive material on the first surface of the original substrate facing the opposite substrate, and adhering the original substrate and the opposite substrate to each other; and the second surface of the original substrate facing the first surface. A cutting step of forming a cut along the first dividing line and the second dividing line, and
It is characterized by including a first dividing step of dividing along the dividing line and a second dividing step of further dividing the substrate portion divided by the first dividing step along the second dividing line.

According to the present invention, since the first dividing step and the second dividing step are sequentially performed after forming the notches along the first dividing line and the second dividing line, the dividing is performed after the first dividing step. Since it is not necessary to form a cut along each of the individual substrate portions along the second dividing line, manufacturing efficiency can be improved. Further, by disposing the adhesive on the second dividing line of the original substrate, it is possible to reduce the possibility that the substrate is erroneously broken before the second dividing step due to the cut along the second dividing line. It is possible to suppress a decrease in yield. Further, since the adhesive material adhered to the original substrate is also adhered to the surface of the counter substrate, since the cut portion of the original substrate is supported by the counter substrate via the adhesive material, the first division It is possible to prevent vibration from occurring in the above-mentioned portion of the original substrate during the process, and more reliably prevent substrate cracking along the second dividing line.

In the present invention, in the bonding step,
It is preferable that the adhesive is discretely arranged along the second dividing line.

According to the present invention, since the adhesive is discretely arranged along the second dividing line, the dividing of the substrate portion is prevented by the adhesive in the second dividing step and the second breaking line is formed. It is possible to suppress deviation from the dividing line. In this case, the adhesive region of the adhesive material to the substrate surface has a diameter of 0.05 to 0.5 mm or an adhesive area equivalent to this, which does not prevent the division of the substrate portion during the second dividing step, and It is desirable to prevent substrate cracking before the dividing step.

In the present invention, in the bonding step,
It is preferable that the adhesive is arranged at an intersection of the first dividing line and the second dividing line.

According to the present invention, the adhesive is placed at the intersection of the first dividing line and the second dividing line, so that when the original substrate is divided along the first dividing line in the first dividing step, It is possible to prevent the substrate from cracking along the second dividing line.

In the present invention, in the bonding step,
It is preferable that the adhesive is disposed adjacent to an intersection of the first dividing line and the second dividing line.

According to the present invention, since the adhesive material is arranged adjacent to the intersection of the first dividing line and the second dividing line, the adhesive material is along the first dividing line in the first dividing step. It does not hinder the original substrate from being broken, and further, it is possible to suppress the occurrence of substrate cracks along the second dividing line in the first dividing step.

In the present invention, it is preferable that the adhesive material is made of the same material as the sealing material for enclosing the electro-optical material.

According to the present invention, since the adhesive material is made of the same material as the seal material, it is not necessary to prepare a dedicated material used for the adhesive material, and the adhesive material is used in the same process at the same time as the seal material. Since it will be possible to place
It is possible to avoid an increase in the number of manufacturing steps and complexity.

In the present invention, the adhesive is preferably made of the same material as the adhesive for bonding the pair of substrates.

According to the present invention, by using the same material as the adhesive for bonding the original substrate and the counter substrate, there is no need to prepare a dedicated material used for the adhesive, and Since it becomes possible to bond and dispose the adhesive in the same step at the same time as the bonding of the original substrate and the counter substrate with the agent, it is possible to avoid an increase in the number of steps in the manufacturing process and troublesomeness.

In the present invention, the electro-optical material may be composed of liquid crystal. In this case, it is preferable that the adhesive material is made of the same material as a sealing material for sealing the liquid crystal and bonding the pair of substrates.

According to the present invention, since the liquid crystal is enclosed and the sealing material for bonding the pair of substrates is made of the same material, it is not necessary to prepare a dedicated material to be used as an adhesive material. Further, since the adhesive material can be bonded and arranged in the same step at the same time as the bonding of the original substrate and the counter substrate with the sealing material, it is possible to avoid an increase in the number of manufacturing steps and troublesomeness.

Next, still another method for manufacturing an electro-optical device according to the present invention has a pair of substrates and an electro-optical material arranged between the pair of substrates, and the pair of original substrates is divided into first parts. A method of manufacturing an electro-optical device in which the pair of substrates is formed by dividing the substrate along a line and a second dividing line, wherein at least a part of the second dividing line is between the pair of original substrates. A bonding step of arranging an adhesive and bonding the pair of original substrates, and a back surface of a surface of the pair of original substrates to which the adhesive is bonded, along the first dividing line and the second dividing line. A cutting step of forming a cut, a first dividing step of dividing the pair of original substrates along the first dividing line, and a substrate portion divided by the first dividing step further along the second dividing line. And a second dividing step of dividing by That.

According to the present invention, since the first dividing step and the second dividing step are sequentially performed after forming the notches along the first dividing line and the second dividing line, the division is performed after the first dividing step. Since it is not necessary to form a cut along each of the individual substrate portions along the second dividing line, manufacturing efficiency can be improved. Further, by disposing the adhesive on the second dividing line of the original substrate, it is possible to reduce the possibility that the substrate is accidentally broken before the second dividing step due to the scribe groove along the second dividing line. It is possible to suppress a decrease in yield. Further, since the adhesive is disposed between the pair of original substrates, the notched portion of the one original substrate is supported by the other original substrate through the adhesive, so that the first dividing step is performed. It is possible to prevent vibration from occurring in the above-mentioned portion of the original substrate, and more reliably prevent substrate cracking along the second dividing line.

In the present invention, it has the first dividing line for dividing only one of the pair of original substrates,
In the adhering step, it is preferable that the adhesive material is not arranged on the first dividing line where only one of the pair of original substrates is divided.

According to the present invention, the adhesive material is not arranged on the first dividing line that divides only one of the pair of original substrates, so that the original substrate is divided along the first dividing line. It is possible to prevent the separation of the original substrate from being hindered by the adhesive material adhered to the other original substrate that is not divided during the first dividing step.

In the present invention, only one of the pair of original substrates is divided into the first dividing line and the other of the pair of original substrates adjacent to the first dividing line. The first dividing line dividing only the substrate, and the first dividing line dividing only the one original substrate from the first dividing line dividing only the other original substrate in the bonding step. It is preferable that the adhesive is not arranged in a region up to the dividing line.

According to the present invention, the adhesive is arranged in a region from the first dividing line where only the one original substrate is divided to the first dividing line where only the other original substrate is divided. By not doing so, when the original substrate is divided in the first dividing step, it is possible to prevent the separation of the substrate portions divided by the adhesive from becoming difficult.

Next, the electro-optical device of the present invention comprises a substrate,
The electro-optical material is disposed along the substrate, and the adhesive material is disposed on at least a part of an edge portion of the substrate.

According to the present invention, since the adhesive is arranged on at least a part of the edge of the substrate, the stress absorbs the received stress and vibration when the impact is received. The impact resistance of the substrate can be enhanced, for example, it is possible to prevent the edge from being broken. Here, if the above-mentioned adhesive is configured so as to protrude even slightly outside the edge portion of the substrate, the influence of external stress can be further reduced.

In the present invention, it is preferable that the adhesive material is discretely arranged on the edge portion.

According to this invention, the impact resistance and the cushioning action can be further improved by disposing the adhesive material discretely along the edge portion.

In the present invention, the adhesive is preferably arranged at a corner where two sides of the substrate intersect.

According to the present invention, it is possible to more reliably protect the corner portion which is weak against impact and is susceptible to stress, and it is possible to prevent the corner portion from being chipped.

In the present invention, it is preferable that the adhesive material is disposed at an edge portion of the substrate, which is adjacent to a corner where two sides of the substrate intersect.

According to the present invention, it is possible to prevent the corner portion from being cracked by cracking the adjacent portion of the corner portion.

In the present invention, it is preferable that the adhesive material is made of the same material as the sealing material for enclosing the electro-optical material.

In the present invention, there is provided a counter substrate arranged to face the substrate, and the adhesive is arranged between the substrate and the counter substrate to bond the substrate and the counter substrate. Preferably.

Next, another electro-optical device according to the present invention comprises a pair of substrates, an electro-optical material disposed between the pair of substrates, and at least a part of edges of the pair of substrates facing each other. And an adhesive disposed on the.

According to the present invention, since the adhesive is disposed on at least a part of the edge portions of the pair of substrates, the stress and the vibration received are absorbed by the adhesive when the shock is applied. The impact resistance of the substrate can be enhanced, for example, the substrate can be prevented from cracking from its end.
Here, if the adhesive is configured so as to slightly protrude from the edge of the substrate, the influence of external stress can be further reduced. In particular, since the adhesive is bonded between the edges of the pair of opposing substrates, the edges of the substrates can be configured to support each other, so that the strength and impact resistance of the edges of the substrate can be improved. Can be greatly increased.

In the present invention, it is preferable that the adhesive material is discretely arranged on the edge portion.

According to the present invention, the impact resistance and the cushioning action can be further improved by disposing the adhesive material discretely on the edge portion.

In the present invention, it is preferable that the adhesive material is arranged between corner portions where two sides of the pair of substrates intersect each other, which are opposed to each other.

According to the present invention, it is possible to more reliably protect the corner portion which is weak against impact and susceptible to stress, and to prevent the corner portion from being chipped.

In the present invention, it is preferable that the adhesive material is disposed at a portion adjacent to each other between corner portions where two sides of the pair of substrates intersect each other.

According to the present invention, it is possible to prevent the corner portion from being broken due to the cracking of the adjacent portion of the corner portion.

In the present invention, it is preferable that the adhesive material is made of the same material as the sealing material for enclosing the electro-optical material.

In the present invention, it is preferable that the adhesive material is made of the same material as the adhesive material for bonding the pair of substrates.

In the present invention, the electro-optical material is preferably composed of liquid crystal.

In the present invention, it is preferable that the adhesive material is made of the same material as a sealing material for enclosing the liquid crystal and bonding the pair of substrates.

Next, the electronic equipment of the present invention is characterized by including the electro-optical device according to any one of the above, and a control means for controlling the electro-optical device.

According to the present invention, since the electro-optical device having high strength and high impact resistance is provided, it is possible to reduce failures and further reduce the size and thickness. In this case, it is particularly advantageous to apply to a portable electronic device (wristwatch, pocket watch, portable information terminal, mobile phone, etc.).

As a more specific mode of each of the above inventions, there is a case where the first dividing line and the second dividing line intersect (preferably orthogonal) to each other.
In addition, a plurality of first dividing lines and plural second dividing lines may be set on the original substrate.

Furthermore, regardless of whether or not the cut is a scribe groove formed by scribing, any cut can be used as long as it can break the substrate by applying some stress. , Linear grooves continuously formed on the substrate surface along the dividing line, scratches formed only on a part of the substrate surface along the dividing line, and perforations formed intermittently along the dividing line Including various things such as scars.

[0068]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an electro-optical device manufacturing method, an electro-optical device and an electronic apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment] (Manufacturing Process of Liquid Crystal Panel) FIG. 2 is a schematic perspective view (a) to (c) showing a schematic process of a manufacturing method of a liquid crystal display device according to the first embodiment of the present invention. Yes, FIG. 7 is a schematic flowchart showing a process flow of the manufacturing method. In the present embodiment, a transparent electrode made of a transparent conductor such as ITO is formed on the inner surfaces of the first original substrate 41 and the second original substrate 42 by using a sputtering method and a photolithography technique, and is formed thereon. By coating and forming an alignment film made of a polyimide resin or the like, a surface structure having a predetermined pattern and a predetermined laminated structure is formed.

Here, the first original substrate 41 and the second original substrate 4
The surface structure on the inner surface of 2 may include SiO ₂ or T between the transparent electrode and the alignment film, if necessary, in order to prevent vertical conduction failure due to dust or the like mixed in the liquid crystal layer of the liquid crystal panel.
A hard protective film composed of iO ₂ or the like may be included. Further, in the case of configuring a color display device, a color filter including a colored layer of a plurality of colors and a protective layer covering these colored layers is included. Further, in the case of configuring a reflective or reflective semi-transmissive display device, a reflective layer disposed under the transparent electrode, or a reflective electrode provided in place of the transparent electrode and functioning as a reflective layer is included. Be done.

Next, the first original substrate 41 and the second original substrate 42.
The inner surface of the liquid crystal is subjected to an alignment treatment for imparting a predetermined initial alignment direction to the liquid crystal molecules. Examples of this alignment treatment include a rubbing treatment in which the surface of the alignment film is rubbed with a cloth in which fine bristles are densely packed.

Next, on the inner surface of the first original substrate 41, a sealing material composed of a thermosetting resin, a photosetting resin or the like is applied. The sealing material is used to attach the first original substrate 41 and the second original substrate 42 to each other, and to seal liquid crystals in a liquid crystal panel manufactured later. In addition, spacers are scattered on the inner surface of the second original substrate 42 as needed. In this spacer, a gap (inter-substrate gap) between the first original substrate 41 and the second original substrate 42 bonded to each other is set to a predetermined value (about 3 to 10 μm).
For example, spherical or columnar fine particles made of an insulating material such as a synthetic resin can be used. It should be noted that the inter-substrate gap can be regulated only by mixing similar spacers in the sealing material in advance, without using the above-mentioned spacers that are dispersedly arranged between the substrates.

Next, the first original substrate 41 and the second original substrate 42, which have been processed as described above, are attached to each other via the sealing material. Then, in a state in which the first original substrate 41 and the second original substrate 42 are pressure-bonded to each other to obtain a predetermined gap between the substrates, the sealing material is subjected to curing treatment (heating treatment, light irradiation treatment, or the like), and FIG. The large-format panel 40 shown in (a) is formed.

FIG. 1 shows the first original substrate 41 as described above.
Large-sized panel 4 in which the second original substrate 42 and the second original substrate 42 are bonded together
It is an expansion plane perspective view of 0. Here, in the large-format panel 40, a plurality of liquid crystal panel planned areas 40P and 40Q are arranged in parallel vertically and horizontally. In each of the liquid crystal panel planned regions 40P and 40Q, as a part of the surface structure, an electrode pattern 41A or 4 including a plurality of transparent electrodes and wirings on the first original substrate 41.
1B (indicated by a diagonal line from the upper right to the lower left in the figure.
Each pattern 41A, 41B is shown only in one liquid crystal panel planned region, and the others are omitted. ) Is formed, and an electrode pattern 42A or 42 including a plurality of transparent electrodes and wirings is formed on the inner surface of the second original substrate 42.
B (indicated by diagonal lines from the upper left to the lower right in the figure. However, each pattern 42A, 42B is shown only in one liquid crystal panel planned region, and the others are omitted). In the illustrated example, the electrode pattern 4
1A and a row in which the liquid crystal panel planned area 40P in which the electrode pattern 42B is formed are arranged in the left and right in the figure, and a row in which the liquid crystal panel planned area 40Q in which the electrode pattern 41B and the electrode pattern 42A are formed are arranged in the left and the right in the figure. They are provided alternately in the vertical direction in the figure.

Further, the liquid crystal panel planned areas 40P, 40
On Q, a sealing material 443 is formed in a circular shape along the peripheral edge of the area. This seal material 443
Are arranged so as to surround a portion where the electrodes of the electrode patterns 41A and 42A are juxtaposed in a plan view, and bond and fix the first original substrate 41 and the second original substrate 42. The sealing material 443 is provided with an opening 443a for injecting liquid crystal in a later step.

The first dividing lines (first planned dividing lines) 40x, 40z, 40v shown by the alternate long and short dashed lines in FIG. 1 and the second dividing lines (second planned dividing lines) 40y shown by the two-dot chain lines are orthogonal to each other. ,
It is a boundary line between the liquid crystal panel planned regions 40P and 40Q. Although these dividing lines are mere imaginary ones, scribe grooves are formed along these dividing lines (planned dividing lines) in the scribing process described later.

In the large format panel 40, the first original substrate 4
A plurality of adhesives 403a and 403b made of the same material as the sealing material 443 are discretely arranged between the surface portions of the first and second original substrates 42 on the second dividing line 40y. , 403b are the first original substrate 41 and the second original substrate 41.
It is adhered to both inner surfaces of the original substrate 42. It is sufficient that these adhesive materials are adhered (that is, adhered in a state of contact) to the substrate surface, and the material itself does not need to have adhesiveness.

The adhesive material 403a is arranged in a state of being adhered to the surface portions of the first original substrate 41 and the second original substrate 42 at the intersection of the first dividing line 40x and the second dividing line 40y and in the vicinity thereof. . Further, the adhesive material 403b is on the second dividing line 40y, and the first dividing line 40x, 40z, 4
The first original substrate 41 and the second
They are arranged in a state of being adhered together on the surface portion of the original substrate 42. In addition, the adhesives 403a and 403b are both attached to the adjacent first dividing line 40z to the first dividing line 40v.
40s (including the vicinity of the intersections of the first dividing lines 40z, 40v and the second dividing line 40y) between them. As will be described later, when the large-sized panel 40 is to be divided along the first division lines 40x, 40z, 40v, the adhesive material is applied to the first original substrate 41 and the second original substrate 42 in the region 40s. This is because it becomes difficult to separate the adjacent intermediate panels 43 from each other if they are bonded together.

The adhesives 403a and 403b are simultaneously placed on the first original substrate 41 in the step of placing the sealant 443 on the first original substrate 41. Therefore, in the step of arranging the sealing material 443, when the sealing material is arranged by a printing method such as screen printing, the printing pattern is simply changed, and the sealing material is arranged so as to be drawn by a precision dispenser or the like. In this case, by simply changing the drawing pattern, the adhesive materials 403a and 403 can be very easily processed without increasing the number of processes.
b can be arranged. And these adhesive materials 4
03a and 403b are the same as the sealing material.
When 1 and the second original substrate 42 are bonded together, they are also adhered to the inner surface of the second original substrate 42. Further, these adhesive materials are hardened together with the sealing material.

With respect to the large-sized panel 40 having the above-described structure, a well-known scribing device or the like is used as shown in FIG.
As shown in (a), the first original substrate 41 and the second original substrate 4
Scribe grooves 45 and 46 are formed on the outer surface of No. 2 (XY scribing), respectively. These scribe grooves 4
5, 46 are engraved by moving a disk-shaped scribe cutter, which is preferably rotatably supported, while being pressed against the substrate surface. However, the scribing method in this scribing step is not limited to the above method, and may be any method as long as it forms a scratch on the surface of the substrate that may be a trigger for breaking the substrate.

Here, the scribe groove 45 is formed so as to extend in the X direction in the figure along the first dividing lines 40x, 40z, 40v shown in FIG. The first original substrate 41 is provided with scribe grooves 45 along the first dividing line 40x and the first dividing line 40z, and the second original substrate 42 is provided with the first dividing line 40x and the first dividing line 40x. A scribe groove 45 is provided along the dividing line 40v. That is, the first dividing line 40z
The upper scribe groove 45 is formed only on the first original substrate 41, and the scribe groove 45 on the first dividing line 40v is formed only on the second original substrate 42. On the other hand, the scribe groove 46 is formed in the second original substrate 41 and the second original substrate 42.
It is provided along the dividing line 40y.

Next, the large-sized panel 40 is fractured along the scribe groove 45, and the strip-shaped intermediate panel 43 shown in FIG. 2B is divided and formed (primary break). In this step, for example, the original substrate to be broken is placed in contact with a flexible member such as a rubber material,
In this state, a method of applying mechanical stress from the opposite side of the original substrate at a position corresponding to the scribe groove 45 is used. Also, instead of such a mechanical break method,
A method of irradiating the scribe groove 45 with laser light to break the substrate due to thermal stress generated by the laser light (laser cleaving method) may be used.

In this primary break process, as shown in FIG. 5, the first original substrate 41 is connected to the first dividing line 40x and the first dividing line 40x.
The first intermediate substrate 431 is divided by the dividing line 40z, and the second original substrate 42 is divided by the first dividing line 40x and the first dividing line 40v.
The second intermediate substrate 432 is the first intermediate substrate 43, and the second intermediate substrate 432 has the substrate overhanging portion that extends beyond the outer shape of the second intermediate substrate 43.
The intermediate panel 43 having the substrate projecting portion projecting from the outer shape of No. 1 is separated. At this time, as described above, since the adhesive is not arranged in the region 40s of the large-sized panel 40, since the inner surfaces of the substrate overhanging portions of the adjacent intermediate panels 43 are adhered by the adhesive, It does not occur that the adjacent intermediate panels 43 are difficult to separate from each other.

In this primary breaking step, the adhesive material 403a arranged at the intersection of the first dividing line 40x and the second dividing line 40y acts so as to prevent breakage along the first dividing line 40x. However, the adhesive material 403a is provided only at the intersections, that is, the liquid crystal panel planned regions 40P, 4
Only the parts corresponding to the corners of 0Q are arranged, and the parts are discretely dispersed and arranged.
The fracture itself along the division line 40x is not possible, and the fracture line does not deviate from the first division line 40x at the portion where the adhesive material 403a is arranged. Also,
The adhesive material 403a arranged at the intersection is the first dividing line 4
When the first original substrate 41 and the second original substrate 42 are broken along 0x, at the same time, the substrates are prevented from being broken along the second dividing line 40y. The occurrence of unintended breakage along the second dividing line 40y is also prevented by the adhesive material 403b arranged on the second dividing line 40y other than the above-mentioned intersection.

Intermediate panel 4 formed as described above
As shown in FIG. 2 (b), in No. 3, the first intermediate substrate 431 and the second intermediate substrate 432, which are divided into strips, have the sealing material 4.
43 (see FIG. 1). Then, in the case of the present embodiment, the first intermediate substrate 4 of the intermediate panel 43 is subjected to the XY scribing process described above.
31 and the second intermediate substrate 432 already have scribed grooves 46.
Are formed.

In the intermediate panel 43, since the opening 443a of the seal material 443 shown in FIG. 1 is exposed at the panel end formed by breaking the original substrate, the opening 443a is formed. Liquid crystal is injected by a known method. For example, the intermediate panel 43 is placed in a decompression space and the exposed panel end of the opening 443a is immersed in liquid crystal, or liquid crystal is dropped into the opening 443a and the opening 443a is a liquid crystal liquid. It is blocked by drops. Next, the pressure of the decompression space in which the intermediate panel 43 is arranged is increased, and the liquid crystal is injected inside the sealing material 443 due to the difference in internal and external pressures generated thereby. After the liquid crystal is injected inside the sealant 443 in this way, a sealant made of a photocurable resin or the like is attached so as to seal the opening 443a, and then the sealant is cured. Liquid crystal is sealed (above, liquid crystal injection sealing step).

Next, the intermediate panel 43 is divided along the already formed scribe grooves 46 (secondary break). This secondary break step can be performed by the same method as the above-mentioned primary break step. In this secondary break process, as shown in FIG.
Both the intermediate substrate 431 and the second intermediate substrate 432 are broken along the second dividing line 40y, and as a result, as shown in FIG. 2C, the individual liquid crystal panels 44 are divided and formed. When the first intermediate substrate 431 and the second intermediate substrate 432 are broken along the second dividing line 40y in the secondary break process,
As shown in FIG. 1, the adhesives 403a and 403b arranged on the second dividing line 40y act so as to prevent breakage of the substrate, but the adhesives 403a and 403b do not adhere to the second dividing line 40y.
Since the substrates are discretely arranged along the line, the breakage of the substrate is not possible, and the break line does not deviate from the second dividing line 40y at the bonding portion of the adhesive materials 403a and 403b.

The liquid crystal panel 44 thus divided and formed is subjected to various treatments depending on the configuration of the liquid crystal display device to be manufactured. For example, in the case of a COG (Chip On Glass) type liquid crystal panel as in the present embodiment, a semiconductor IC incorporating a liquid crystal drive circuit and the like is mounted as described later. Further, a flexible wiring board or the like is connected to the panel end portion. Then, after that, the mounting area of the semiconductor IC, the connection area of the flexible wiring board, and the like are molded using a molding agent such as silicone resin. Further, a light guide plate forming a part of the backlight is attached to the liquid crystal panel 44 processed as described above, a reflection plate is attached, or the liquid crystal panel 44 is also attached as a light guide plate. It is attached to the frame.

(Structure of Liquid Crystal Panel) Next, the structure of the liquid crystal panel manufactured by the above manufacturing method is shown in FIG.
And FIG. 4 will be described in more detail. 3 is a schematic perspective plan view of the liquid crystal panel 44, and FIG. 4 is a schematic vertical cross-sectional view of the liquid crystal panel 44.

In the liquid crystal panel 44, the substrates 441 and 442 are attached to each other by the sealing material 443, and the sealing material 4
The liquid crystal 44 is provided inside the substrate 43 and between the substrates 441 and 442.
4 is enclosed. Here, the liquid crystal injection port 443a is closed by a sealing material 445.

A transparent electrode 446 and an alignment film 447 are formed on the inner surface of the substrate 441, and the transparent electrode 446 is a wiring that extends outside the sealing material 443 and is drawn out onto the substrate overhanging portion 441a. In addition, the transparent electrode 448 and the alignment film 449 are formed on the inner surface of the substrate 442.
Reference numeral 48 is connected to the wiring on the substrate overhanging portion 441a through a vertical conducting portion (not shown) (for example, configured by a part of the sealing material 443 formed as an anisotropic conductor).

A semiconductor IC 450 forming a liquid crystal drive circuit is mounted on the surface of the substrate extension 441a. The semiconductor IC 450 includes the wiring on the substrate overhanging portion 441a that is electrically connected to the transparent electrodes 446 and 448, and the substrate overhanging portion 441.
It is in a state of being conductively connected together with the input terminal 451 formed at the end portion of a. Here, depending on the structure of the liquid crystal device, processing such as conductively connecting the flexible wiring board to the input terminal 451 or sealing the surface of the board overhanging portion 441a with a sealing agent such as silicone resin is performed. Be seen.

In this liquid crystal panel 44, as shown in FIG. 3, adhesive materials 403A and 403B that are discretely attached to the inner surfaces of the edges of the substrates 441 and 442 are arranged. The adhesives 403A and 403B are in a state of being adhered to both the inner surface of the edge of the substrate 441 and the inner surface of the edge of the substrate 442. Also, the adhesive material 403A
Are attached between the corners of the substrates 441, 442.

When the original substrate is divided along the first dividing line 40x in the primary breaking process, the adhesive material 403a is divided into two along with the divided substrate portion, and further, 2
When the substrate is divided along the second dividing line 40y in the next breaking step, the adhesive material 403A is left after being divided into two parts together with the divided substrate portion. Also,
In the secondary break process, the intermediate substrate is the second dividing line 40y.
The adhesive material 403b is divided into two parts together with the divided substrate parts when the adhesive material 403 is divided along the
B.

Thus, the substrate 44 of the liquid crystal panel 44
Since the adhesives 403A and 403B are attached to the edges of the substrates 1 and 442, the possibility that the edges of the substrates 441 and 442 are damaged, such as cracks, can be reduced. And the impact resistance can be improved. In particular, since the adhesives 403A and 403B are attached to the edges of both substrates together, the edges of the substrate 441 and the edge of the substrate 442 support each other, and the strength of the panel edge is significantly increased. Can be increased. In particular, since the adhesive material 403A is arranged at the corner of the substrate,
It is effective in preventing cracks at the corners.

The outer edges of the adhesives 403A and 403B are
The liquid crystal panel 44 may be located on the inner side (on the side of the sealing material 443) of the end surfaces of the substrates 441 and 442 depending on the residual state at the end portion of the liquid crystal panel 44.
In some cases, it may be located so as to project outward from the end faces of 1,442. Especially in the latter case, the liquid crystal panel 44
It can be expected that the adhesive materials 403A and 403B function as a cushioning material when the panel end portion receives an external stress.

[Second Embodiment] Next, referring to FIG.
A method of manufacturing the liquid crystal panel according to the second embodiment of the present invention will be described. In the second embodiment, only the plane patterns of the sealing material and the adhesive material of the large-sized panel 50 and the electrode patterns are different from those of the large-sized panel 40 of the first embodiment, and other structures and manufacturing steps are the same as those of the first embodiment. Therefore, only different parts will be described below, and description of other similar parts will be omitted.

In this embodiment, the electrode patterns 51A, 51B, 52A and 52B formed on the first and second original substrates constituting the large-sized panel 50 are so-called COFs.
It corresponds to a (Chip On FPC) type liquid crystal panel, and when it becomes a liquid crystal panel, each liquid crystal panel is planned as a wiring pattern portion arranged on the substrate overhanging portion similar to the first embodiment. A conductive pattern structure configured to be directly mounted on the flexible wiring board is provided in each of the regions 50P and 50Q.

Further, in this embodiment, the first dividing line 50
No adhesive is arranged at the intersection of x and the second dividing line 50y, and instead, a pair of adhesives 503a are arranged at positions adjacent to both sides of the intersection. here,
Similar to the first embodiment, the adhesive 503b is discretely arranged on the second dividing line 50y other than the intersections.

In the large-sized panel 50, the sealing material 543 having the opening 543a is arranged for each of the liquid crystal panel planned areas 50P and 50Q, and the adhesive materials 503a and 5
03b is made of the same material as the sealing material 543.
Further, the adhesives 503a and 503b are arranged at the same time as the sealing material in the step of applying the sealing material 543, as in the first embodiment.

Also in this embodiment, for the same reason as in the first embodiment, no adhesive is arranged in the region 50s between the first dividing line 50z and the first dividing line 50v.

In this embodiment, the adhesive 503 is adjacent to both sides of the intersection of the first dividing line 50x and the second dividing line 50y.
Since a is arranged, the adhesive 403a does not act in the primary break step to prevent the breakage of the substrate as in the first embodiment, and the primary break can be performed more smoothly. Further, since the adhesive material 503a is disposed adjacent to both sides of the intersection, in the primary break step of dividing the original substrate along the first dividing line 50x, undesired along the second dividing line 50y. Substrate cracking is also prevented.

In the second embodiment, unlike the other embodiments, the liquid crystal panel planned areas 50 belonging to the adjacent rows are provided.
The opening 543 of the sealing material 543 provided in P and 50Q
The a is arranged so as to partially overlap each other.

[Third Embodiment] Next, referring to FIG.
A method of manufacturing the liquid crystal panel according to the third embodiment of the present invention will be described. In the third embodiment, only the plane patterns of the sealing material and the adhesive material of the large-sized panel 60 and the electrode patterns are different from those of the large-sized panel 40 of the first embodiment, and other structures and manufacturing methods are the same as those of the first embodiment. Since they are common, only different parts will be described below, and description of other similar parts will be omitted.

In this embodiment, the electrode patterns 61A, 61B, 62A and 62B formed on the first original substrate and the second original substrate constituting the large-sized panel 60 are the COF type liquid crystal as in the second embodiment. It corresponds to a panel, and when it becomes a liquid crystal panel, as a wiring pattern portion arranged on the same board overhanging portion as in the first embodiment,
A conductive pattern structure configured to be directly mounted on the flexible wiring substrate is provided for each of the liquid crystal panel planned regions 60P and 60Q.

Further, in this embodiment, as in the first embodiment, the adhesives 603a and 603b are the second dividing lines 60y.
They are arranged discretely above. Also, the adhesive material 60
3a is arranged at the intersection of the first dividing line 60x and the second dividing line 60y, and the adhesive material 603b is arranged along the second dividing line 60y. However, unlike the first embodiment, the adhesive material 603b is integrally configured with the seal material 643 arranged in the liquid crystal panel planned regions adjacent to both sides. This is the sealing material 64 that is adjacent to the second dividing line 60y.
This is because it is difficult to dispose an adhesive that is separate from the sealing material 643 as in the first and second embodiments because the interval of 3 is small.

When the adhesive material 603b is integrally formed with the sealing materials 643 on both sides in this way, the sealing material 6
If a flat area closed by 43 and the adhesive 603b is present, there is no escape area for air, and it becomes difficult to bond the first original substrate and the second original substrate. Adhesive 6 is provided between adjacent liquid crystal panel planned areas so that a closed flat area does not occur
Only one 03b is provided. Note that the adhesive material 603
As described above, b does not have to be integrally connected to the sealing materials on both sides adjacent to each other, and may be connected only to the sealing material on either one side (either the left or right side in the figure). .

[Fourth Embodiment] Finally, an embodiment in which a liquid crystal device including the above liquid crystal panel is used as a display device of electronic equipment will be described. FIG. 10 is a schematic configuration diagram showing the overall configuration of this embodiment. The electronic device shown here has a liquid crystal panel 44 similar to the above, and a control means 70 for controlling this. The liquid crystal panel 44 is provided with a drive circuit configured by the semiconductor IC 150 described above. Further, the control means 70 includes a display information output source 71,
It has a display processing circuit 72, a power supply circuit 73, and a timing generator 74.

The display information output source 71 is a ROM (Read Onl
y Memory), RAM (Random Access Memory), and the like, a storage unit such as a magnetic recording disk and an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal.
The display information is supplied to the display information processing circuit 72 in the form of an image signal of a predetermined format or the like based on various clock signals generated by.

The display information processing circuit 72 includes a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit,
Various well-known circuits such as a gamma correction circuit and a clamp circuit are provided, the input display information is processed, and the image information is supplied to the drive circuit together with the clock signal CLK.
The drive circuit configured in the semiconductor IC 150 includes a scan line drive circuit, a data line drive circuit, and an inspection circuit. Also,
The power supply circuit 73 supplies a predetermined voltage to each of the above components.

FIG. 11 shows a mobile phone 900 which is an embodiment of an electronic device according to the present invention. This mobile phone 900
The circuit board 901 is disposed inside the case body 910, and the liquid crystal panel 44 described above is attached to the circuit board 901.
Has been implemented. Operation buttons 920 are arranged on the front surface of the case body 910, and the antenna 930 is provided from one end.
Is attached so that it can appear and disappear freely. A speaker is arranged inside the earpiece 940, and a microphone is built inside the transmitter 950.

The liquid crystal panel 44 installed in the case body 910 is constructed so that the display surface can be viewed through the display window 960.

The liquid crystal device and the electronic equipment of the present invention are not limited to the above-described illustrated examples, and it goes without saying that various modifications can be made without departing from the scope of the present invention. For example, although the liquid crystal panel shown in each of the above embodiments has a simple matrix type structure,
It can also be applied to an active matrix type liquid crystal device using an active element (active element) such as (thin film transistor) or TFD (thin film diode).

The liquid crystal panel of the above-mentioned embodiment is so-called C.
Although it has an OG type or COF type structure, it may be configured to connect a TAB substrate to a liquid crystal panel, for example.

Further, in each of the liquid crystal panels of the above-mentioned embodiments, the substrate overhanging portion formed by one substrate overhanging the outer shape of the other substrate is provided only along one edge of the panel. It is also possible to apply to a liquid crystal panel having a shape in which a substrate overhang is provided along one or more edges.

[0116]

As described above, according to the present invention,
An electro-optical device can be efficiently manufactured while suppressing a decrease in yield.

[Brief description of drawings]

FIG. 1 is an enlarged plan perspective view schematically showing a planar structure of a large-sized panel of a first embodiment according to the invention.

FIG. 2 is schematic perspective views (a) to (c) showing the panel structure during the manufacturing process of the first embodiment.

FIG. 3 is a schematic plan perspective view schematically showing the structure of the liquid crystal panel manufactured by the manufacturing method of the first embodiment.

FIG. 4 is a schematic vertical cross-sectional view schematically showing the structure of the liquid crystal panel manufactured by the manufacturing method of the first embodiment.

FIG. 5 is a schematic cross-sectional view schematically showing an aspect of substrate division in the primary break process of the first embodiment.

FIG. 6 is a schematic cross-sectional view schematically showing an aspect of substrate division in the secondary break process of the first embodiment.

FIG. 7 is a schematic flowchart showing a procedure of a manufacturing process of the first embodiment.

FIG. 8 is an enlarged plan perspective view schematically showing a planar structure of a large-sized panel of a second embodiment according to the invention.

FIG. 9 is an enlarged plan perspective view schematically showing the planar structure of a large-sized panel according to the third embodiment of the present invention.

FIG. 10 is a configuration block diagram showing a schematic configuration of an electronic device according to a fourth embodiment of the invention.

FIG. 11 is a schematic perspective view showing an appearance of an electronic device according to a fourth embodiment.

FIG. 12 is schematic perspective views (a) to (d) showing a panel structure in a conventional liquid crystal panel manufacturing method.

FIG. 13 is a schematic flowchart showing a procedure of a conventional method for manufacturing a liquid crystal panel.

[Explanation of symbols]

40 large format panel 40P, 40Q LCD panel planned area 40x, 40z, 40v First dividing line 40y Second dividing line 41 First original board 42 Second original substrate 43 Intermediate panel 44 LCD panel 45,46 scribe groove 403a, 403b Adhesive 443 sealing material 443a opening

Claims (31)

[Claims] 1. An electro-optical device comprising a substrate and an electro-optical material disposed on the substrate, wherein the substrate is formed by dividing an original substrate along a first dividing line and a second dividing line. A method of manufacturing a device, comprising: an adhesive step of disposing an adhesive material on a first surface of the original substrate on the second dividing line; and a second surface of the original substrate facing the first surface. A cutting step of forming a cut along the first dividing line and the second dividing line; a first dividing step of dividing the original substrate along the first dividing line; and a dividing by the first dividing step. A second dividing step of further dividing the substrate portion along the second dividing line, and a manufacturing method of the electro-optical device. 2. In the adhering step, the adhesive material is
The method of manufacturing an electro-optical device according to claim 1, wherein the electro-optical device is arranged discretely along the second dividing line. 3. In the bonding step, the adhesive material is
The method for manufacturing an electro-optical device according to claim 1, wherein the electro-optical device is arranged at an intersection of the first dividing line and the second dividing line. 4. In the bonding step, the adhesive material is
The method for manufacturing an electro-optical device according to claim 1, wherein the electro-optical device is arranged adjacent to an intersection of the first dividing line and the second dividing line. 5. The electro-optical device according to claim 1, wherein the adhesive material is made of the same material as a sealing material for enclosing the electro-optical material. Device manufacturing method. 6. A pair of substrates, comprising a pair of substrates and an electro-optical material disposed between the pair of substrates, and dividing the original substrate along a first dividing line and a second dividing line. A method of manufacturing an electro-optical device in which at least one of the substrates is formed, the first surface of the original substrate facing a counter substrate arranged on the second dividing line and facing the original substrate. A bonding step of arranging an adhesive on the first substrate and the counter substrate, and bonding the first and second dividing lines to the second surface of the original substrate facing the first surface. A cutting step of forming a cut along the first dividing line, a first dividing step of dividing the original substrate along the first dividing line, and a substrate portion divided by the first dividing line further along the second dividing line. A second dividing step of dividing by Method of manufacturing an electro-optical device that. 7. The adhesive in the step of adhering,
The method of manufacturing an electro-optical device according to claim 6, wherein the electro-optical device is arranged discretely along the second dividing line. 8. The adhesive in the step of adhering,
The method for manufacturing an electro-optical device according to claim 6, wherein the method is arranged at an intersection of the first dividing line and the second dividing line. 9. The adhesive in the step of adhering,
8. The method for manufacturing an electro-optical device according to claim 6, wherein the first division line and the second division line are arranged adjacent to an intersection of the second division line and the second division line. 10. The electro-optical device according to claim 6, wherein the adhesive material is made of the same material as a sealing material for enclosing the electro-optical material. Device manufacturing method. 11. The electro-optical device according to claim 6, wherein the adhesive material is made of the same material as the adhesive material for bonding the pair of substrates. Device manufacturing method. 12. The method of manufacturing an electro-optical device according to claim 1, wherein the electro-optical material is composed of liquid crystal. 13. The manufacturing of the electro-optical device according to claim 12, wherein the adhesive material is made of the same material as a sealing material for enclosing the liquid crystal and bonding the pair of substrates. Method. 14. A pair of substrates, and an electro-optic material disposed between the pair of substrates, wherein the pair of original substrates are divided along a first dividing line and a second dividing line to form the pair of substrates. A method for manufacturing an electro-optical device in which the substrate is formed, wherein an adhesive is disposed between the pair of original substrates and at least a part of the second dividing line to bond the pair of original substrates. A step of forming a notch along the first dividing line and the second dividing line on the back surface of the surface of the pair of original substrates to which the adhesive is adhered; A first dividing step of dividing along the first dividing line; and a second dividing step of further dividing the substrate portion divided by the first dividing step along the second dividing line. Method for manufacturing electro-optical device. 15. The first dividing line, which divides only one of the pair of original substrates, wherein only one of the pair of original substrates is divided in the bonding step. The method of manufacturing an electro-optical device according to claim 14, wherein the adhesive is not arranged on one division line. 16. The first dividing line that divides only one of the pair of original substrates, and only the other original substrate of the pair of original substrates that is adjacent to the first dividing line. And a first dividing line that divides the first dividing line that divides only the one original substrate from the first dividing line that divides only the one original substrate in the bonding step. 15. The method of manufacturing an electro-optical device according to claim 14, wherein the adhesive is not arranged in the regions up to. 17. An electro-optical device comprising: a substrate, an electro-optical material disposed on the substrate, and an adhesive material disposed on at least a part of an edge portion of the substrate. 18. The electro-optical device according to claim 16, wherein the adhesive material is discretely arranged on the edge portion. 19. The adhesive material is arranged at a corner portion where two sides of the substrate intersect with each other.
Alternatively, the electro-optical device according to claim 18. 20. The adhesive material according to claim 17, wherein the adhesive material is arranged at an edge portion of the substrate, which is adjacent to a corner portion where two sides of the substrate intersect.
8. The electro-optical device according to item 8. 21. The electrical device according to claim 17, wherein the adhesive material is made of the same material as a sealing material for enclosing the electro-optical material. Optical device. 22. A counter substrate is arranged to face the substrate, and the adhesive is arranged between the substrate and the counter substrate to bond the substrate and the counter substrate. 22. The electro-optical device according to claim 17, wherein: 23. A pair of substrates, an electro-optical material arranged between the pair of substrates, and an adhesive material arranged at least at a part of end portions of the pair of substrates facing each other. An electro-optical device characterized by. 24. The electro-optical device according to claim 23, wherein the adhesive is discretely arranged on the edge portion. 25. The electricity according to claim 23 or 24, wherein the adhesive material is arranged between corner portions of the pair of substrates, where two sides of the pair of substrates intersect each other. Optical device. 26. The adhesive material according to claim 23, wherein the adhesive material is arranged at a portion adjacent to each other between corner portions where two sides of the pair of substrates intersect each other, which face each other. The electro-optical device described. 27. The electrical device according to claim 23, wherein the adhesive material is made of the same material as a sealing material for enclosing the electro-optical material. Optical device. 28. The electrical device according to claim 23, wherein the adhesive material is made of the same material as the adhesive material for bonding the pair of substrates. Optical device. 29. The electro-optical device according to claim 23, wherein the electro-optical material is liquid crystal. 30. The electro-optical device according to claim 29, wherein the adhesive material is made of the same material as a sealing material for enclosing the liquid crystal and bonding the pair of substrates. 31. An electronic device comprising the electro-optical device according to claim 17 and a control unit that controls the electro-optical device.