JP2003071729A - Grinding film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding film capable of implementing a plurality of grinding processes with a sheet of grinding film without using a plurality of grinding films in the plurality of grinding processes from rough grinding to finish grinding, and eliminating troubles of replacing the grinding film for each grinding process. SOLUTION: The grinding film is comprised of 2 base material film 2 and a grinding body 3 having a plurality of grinding layers laminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing film used for polishing an end face of an optical fiber connector, and more specifically to a polishing film provided with a polishing body formed by laminating a plurality of polishing layers. .

[0002]

2. Description of the Related Art Abrasive films used for polishing end faces of optical fiber connectors, FDs (flexible disks), HDs (hard disks), semiconductor wafers, magnetic heads, photosensitive drums and the like are base films and base films thereof. Abrasive films having at least abrasive particles formed on a material film and abrasive particles and a binder are widely known and used.

For example, when polishing the end face of an optical fiber connector, it is common to perform several polishing steps from rough polishing to finish polishing.

[0004]

However, when performing several polishing steps from rough polishing to finish polishing, it is necessary to use a plurality of polishing films having a polishing rate according to each polishing step. Yes, it was troublesome to replace the polishing film.

In particular, when polishing the end face of an optical fiber connector, the precision of polishing is important, and in order to stabilize the quality, it is necessary to perform a polishing process with different polishing rates a plurality of times. The troublesomeness of replacement has been a particular problem, which has also adversely affected the production efficiency of optical fiber connectors.

The present invention has been made in view of the above problems, and in a plurality of polishing steps from rough polishing to finish polishing, a plurality of polishing steps can be performed with one polishing film without using a plurality of polishing films. The main purpose is to provide a polishing film that can be performed.

[0007]

A polishing film according to a first aspect of the present invention is characterized by comprising a substrate film and a polishing body having a plurality of polishing layers laminated.

According to the present invention, since the polishing film is composed of the base film and the polishing body in which a plurality of polishing layers are laminated, the polishing film is polished according to each laminated polishing layer. It can be carried out. As a result, the labor of replacing the polishing film can be omitted.

In the polishing film according to a second aspect of the invention, the polishing body is composed of polishing layers having different polishing rates, and the polishing layers having a lower polishing rate are sequentially arranged from the base film side to the surface of the polishing film. The feature is that they are laminated.

According to the present invention, since the polishing bodies in the polishing film are composed of polishing layers having different polishing rates, it is possible to realize polishing with different polishing rates with one polishing film. Further, since the polishing body of the present invention is laminated in order from the polishing layer having the smallest polishing rate toward the surface of the polishing film from the base film side, one polishing film is polished in a plurality of polishing steps. It can be used as a film. Therefore, for example, a series of polishing operations from rough polishing to finish polishing, without replacing the polishing film,
It can be performed with one piece of the polishing film of the present invention.

The invention according to claim 3 is characterized in that the polishing film according to claim 1 or 2 is used for polishing an end face of an optical fiber connector.

According to the present invention, since the polishing film having the polishing body in which a plurality of polishing layers are laminated is used for polishing the end face of the optical fiber connector, the optical fiber polished by using several types of polishing films. The number of polishing films used in the connector end face polishing step can be reduced. As a result, the troublesomeness of exchanging the polishing film can be eliminated, and the production efficiency of the optical fiber connector can be improved.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The polishing film of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view for explaining the constitution of the polishing film of the present invention. As shown in FIG. 1, a polishing film 1 of the present invention is formed of a base film 2 and a polishing body 3 in which a plurality of polishing layers 3a and 3b are laminated, and in particular, the polishing film 1 of the present invention. A feature of the polishing film 1 is that a polishing body 3 for polishing a material to be polished is formed of a plurality of polishing layers 3a and 3b.

By using the polishing film 1 of the present invention having such characteristics, polishing with different polishing rates can be performed with one polishing film. as a result,
Since it is possible to reduce the number of polishing films used from the rough polishing process to the final polishing process, it is possible to eliminate the trouble of exchanging the polishing film and to improve the efficiency of the polishing process. .

The application of the polishing film 1 is shown in FIG.
As shown in, the optical fiber connector 11 including the optical fiber 12 and the ferrule 13 can be particularly preferably cited. Not only the optical fiber connector 11, but also precision parts such as semiconductor wafers, metals, ceramics, color filters (for liquid crystal displays), plasma displays, optical lenses, magnetic disks or optical disk substrates, magnetic heads, optical read heads, etc. It is also preferably applicable. Further, the invention is not limited to these, and may be applied to general parts and the like.

Here, the reason why the polishing film 1 of the present invention is preferably used for polishing the end surface or the surface of the optical fiber connector 11 or the like is that when the end surface of the optical fiber connector is conventionally polished, the rough polishing step is performed. This is because there are many polishing steps up to the final polishing step, and since it is necessary to use polishing films having different polishing rates, it is particularly troublesome to replace these films appropriately.

The constitution of the polishing film 1 of the present invention will be described in detail below.

The polishing film 1 may have any shape such as a long sheet having a wide width, a long strip having a narrow width, a square shape, and a circular shape. Regarding the specific usage of the polishing film 1, the shape can be appropriately specified and used according to the object to be applied and the polishing apparatus.
In particular, when polishing the optical fiber connector 11, a rotating disk type polishing apparatus is usually used, so that the polishing film 1 processed into a circular shape is preferably used.

The base film 2 is required to have mechanical strength, dimensional stability, heat resistance and the like. As the material for the base film, synthetic paper or plastic film is applied.
For example, polyethylene terephthalate, oriented polypropylene, polycarbonate, acetyl cellulose diester, acetyl cellulose triester, oriented polyethylene, polybutylene terephthalate and the like can be mentioned. The thickness of the base film 2 is 10 to 188 μm.
The thing of a grade is suitable.

The primer layer is the polishing film 1 of the present invention.
In the above, it is not an indispensable layer, and is provided as necessary mainly in consideration of the adhesiveness between the polishing body 3 and the base film 2. Such a primer layer is provided on the base film 2 side as an adjacent layer to the polishing body 3. Abrasive body 3 when a material to be polished is polished by forming a primer layer
Can be prevented. As the primer layer, it is possible to apply a primer layer having a conventionally known structure, for example, an easily adhesive primer layer, a surface modifier layer (surfactant layer) such as a silane coupling agent, or a vapor deposition layer. You can Examples of the vapor deposition layer include a metal vapor deposition layer such as aluminum, a metal oxide vapor deposition layer such as SiO ₂ , Al ₂ O ₃ and TiO ₂ , and a polymer thin film vapor deposition layer such as polyurea.

As the material for the primer layer which can be formed by coating, printing or vapor deposition, for example, polyvinyl chloride resin, polyvinyl acetate resin, polyacrylic or polymethacrylic resin, polyvinyl alcohol resin, ethylene Polymer, polyvinyl acetal resin, rubber resin, polyester resin, polyamide resin, phenol resin, amino-plast resin, epoxy resin, polyurethane resin, silicone resin,
A monomer that constitutes a resin such as a cellulosic resin,
There may be mentioned a composition containing one or more of a prepolymer, an oligomer or a polymer as a main component of a vehicle. The primer layer can be formed by preparing a coating liquid, a printing ink, or the like made of such a primer layer material, and coating, printing or vapor depositing it on the base film 2 in a predetermined thickness. Further, in order to improve the adhesiveness, a curing agent such as isocyanate may be added.

The polishing body 3 is provided on the base film 2, and is formed by laminating a plurality of polishing layers 3a and 3b. The polishing layer (for example, 3a) constituting the polishing body 3 will be described below.

The polishing layer constituting the polishing body 3 is formed of at least the abrasive particles 5 and the polishing layer binder 6.

Here, the abrasive particles 5 may be polished based on the fixed abrasive grain action or may be polished based on the free abrasive grain action.

When polishing is performed based on the action of a fixed abrasive, the type of abrasive particles is not particularly limited. Usually, the type and particle diameter of the abrasive particles 5 are set according to the type of the material to be polished and the degree of polishing. The particle size is usually handled as an average particle size. Examples of the abrasive particles 5 used include diamond, alumina (aluminum oxide), titanium oxide, zirconia (zirconium oxide), lithium silicate, silicon nitride, silicon carbide, iron oxide, chromium oxide, silica (silicon oxide), Inorganic solid particles such as antimony oxide may be mentioned. Generally, diamond and alumina are preferably used. Further, for the optical fiber connector 11 to which the polishing film 1 of the present invention is particularly preferably applied,
Diamond is particularly preferably used.

Also, when polishing is performed based on the action of loose abrasive grains, the type is not particularly limited.
Examples of the abrasive particles used include inorganic solid particles such as silica (silicon oxide), zirconia, titania, ceria, and calcium carbonate. Since these particles are cheaper than diamond particles, the cost of the polishing film 1 can be reduced.

The binder 6 for the polishing layer in the case of using the abrasive particles 5 for polishing based on the fixed abrasive function has a role of fixing the abrasive particles 5 in the polishing layer 3. The binder 6 is not particularly limited as long as it has such an action, and various binders used as a binder for a general polishing film can be selected and applied. For example, polyester resin,
Polyvinyl chloride resin, polyvinyl acetate resin, polyacrylic or polymethacrylic resin, polyvinyl alcohol resin, ethylene copolymer, polyvinyl acetal resin, rubber resin, polyester resin, polyamide resin, phenol resin Resin, amino-plast-based resin, epoxy resin, polyurethane-based resin, cellulosic resin, other resin-constituting monomers, prepolymers or oligomers or polymers, or blends thereof, or reaction modified products may be used. it can. Such resins also include UV curable resins and EB curable resins. In the present invention, polyester resin, polyvinyl chloride resin, polyvinyl acetate resin, polyacrylic resin, polyurethane resin, UV curable resin and EB curable resin can be particularly preferably used.

Further, as the binder 6 for the polishing layer in the case of using the abrasive particles 5 for polishing based on the action of the free abrasive grains, the binder 6 for the polishing layer has a siloxane bond (Si) in its structure, such as a silicone resin or a silicone resin. -O bond) -containing monomer, prepolymer or oligomer, polymer, or the like can be used. For example, polysiloxane, a derivative thereof, a modified product thereof, or a blended product thereof, and further, a monomer, prepolymer or oligomer thereof, etc. Can be used. Specifically, for example, a monomer, a prepolymer or an oligomer or a polymer forming a polysiloxane, as well as a monomer, a prepolymer or an oligomer or a polymer forming the polysiloxane, for example, a polyester resin, a polyvinyl chloride -Based resin, polyvinyl acetate-based resin, polyacrylic-based or polymethacrylic-based resin, polyvinyl alcohol-based resin, ethylene copolymer, polyvinyl acetal-based resin, rubber-based resin, polyamide-based resin, phenol-based resin, amino-plast-based resin ,Epoxy resin,
It is possible to use a polyurethane resin, a cellulosic resin, a blended product of a monomer, a prepolymer or an oligomer, or a polymer that constitutes another resin, or a reaction modified product. Such resins also include UV curable resins and EB curable resins.

Particularly, in the present invention, polyester resin, polyvinyl chloride resin, polyvinyl acetate resin,
It is preferable to use a blended product or a reaction modified product obtained by mixing a prepolymer or oligomer or polymer such as polyacrylic resin or polyurethane resin with a prepolymer or oligomer or polymer of polysiloxane. More specifically, in the present invention, a polyester resin, a polyvinyl chloride resin, a polyvinyl acetate resin, a polyacrylic resin,
The main chain is prepolymer or oligomer or polymer such as polyurethane resin, and the side chain is reacted with prepolymer or oligomer or polymer of polysiloxane, for example, by graft polymerization, etc. It is desirable to use an organic-inorganic composite polymer having a chain portion made of an inorganic material having a siloxane bond, a prepolymer or an oligomer thereof.

The polishing film of the present invention is characterized in that it has a polishing body 3 in which a plurality of polishing layers formed from at least the abrasive particles 5 and the polishing layer binder 6 described above are laminated. is doing. less than,
The polishing body 3, which is a feature of the present invention, and the relationship between the polishing layers (for example, 3a and 3b) constituting the polishing body 3 will be described.

Polishing body 3 in the polishing film 1 of the present invention
It suffices that a plurality of polishing layers described above are laminated and configured, and the relationship between the polishing layers constituting this is not particularly limited. Therefore, depending on the material of the material to be polished, the degree of finishing after polishing, etc., the relationship between the polishing layers to be laminated (for example, the number of polishing layers to be laminated, the type and size of abrasive particles in the polishing layer, the type of binder resin) , And polishing rate, etc.) can be arbitrarily determined.

However, it is preferable that the polishing rates of the respective polishing layers (for example, 3a and 3b) constituting the polishing body 3 of the present invention are different from each other. Polishing body 3 by laminating polishing layers having different polishing rates
By configuring the polishing film 1, the polishing film 1 of the present invention can be polished at various polishing rates, and as a result,
It is possible to solve the trouble of exchanging the polishing film for each polishing rate.

The polishing rate means the ratio or ability of the polishing layer to polish the material to be polished. Therefore, the polishing layer having a high polishing rate can efficiently polish the polishing surface of the material to be polished, but the polishing surface becomes rough to that extent and is suitable for rough polishing. On the other hand, a polishing layer having a low polishing rate has poor polishing efficiency, but is capable of finely polishing the polishing surface of the material to be polished, and is therefore suitable for finish polishing.

In the polishing film 1 of the present invention, the respective polishing layers (for example, 3a and 3b) are laminated in order from the polishing layer having the smallest polishing rate from the base film side toward the surface of the polishing film. Is preferred.
That is, in the polishing film 1 of the present invention shown in FIG. 1, the polishing rate of the polishing layer 3a is preferably smaller than the polishing rate of the polishing layer 3b. The reason for this is as follows.

That is, by laminating in this way, when polishing a material to be polished, it is possible to first perform rough polishing with the polishing layer 3b having a high polishing rate. Then, by continuing to polish the material to be polished by the polishing layer 3b, the polishing layer 3b wears and disappears.
However, in the polishing film 1 of the present invention, when the polishing layer 3b disappears due to wear, the polishing layer 3a laminated under the polishing layer 3b appears on the surface, so that the polishing layer 3a causes the material to be polished to It will be continuously polished. In this case, since the polishing rate of the polishing layer 3a is smaller than the polishing rate of the polishing layer 3b, the polishing surface of the material to be polished roughly polished by the polishing layer 3b can be finally polished by the polishing layer 3a. Thus, the polishing layer constituting the polishing body 3 in the polishing film 1 of the present invention,
By laminating from the base material film side to the surface of the polishing film in order from the polishing layer having the smallest polishing rate, it becomes possible to perform rough polishing to finish polishing on one polishing film.

Next, the adjustment of the polishing rate of each polishing layer (polishing layers 3a, 3b) will be described. In the polishing film of the present invention, as described above, it is preferable to stack the polishing layers in order from the polishing rate with the smallest polishing rate from the substrate film side toward the surface of the polishing film. It is necessary to adjust the polishing rate of 3a, 3b).

Regarding the method of adjusting the polishing rate of the polishing layer, (1) adjustment by the kind, shape and particle size of the abrasive particles in the polishing layer, (2) mixing ratio of the abrasive particles to the binder for the polishing layer However, the present invention is not limited to these.

(1) Adjustment by Abrasive Particle Type, Shape, and Particle Size in Polishing Layer As one of the methods for adjusting the polishing rate of each polishing layer constituting the polishing body, the polishing material in each polishing layer is used. There is a method of adjusting the type of particles.

For example, as shown in FIG. 1, when the polishing body 3 is formed by laminating the polishing layers 3a and 3b, the polishing layer 3b is used to roughly polish the material to be polished. Since 3a is used for the final polishing, the abrasive particles contained in the polishing layer 3b for rough polishing are, for example, alumina, and silica having a hardness smaller than that of alumina is used for the final polishing. By including it in the polishing layer 3a, the hardnesses of alumina and silica are different, so that the polishing rate of the polishing layer can be adjusted. Thus, by laminating the polishing layers containing the abrasive particles having different hardness, the polishing rate of each polishing layer constituting the polishing body can be adjusted.

As shown in FIG. 1, when the polishing body is formed by laminating two polishing layers, the combination of the respective abrasive particles is not only alumina and silica as described above but also those for rough polishing. The abrasive particles contained in the polishing layer is silicon carbide, a combination of the abrasive particles contained in the polishing layer for finishing is silica, and the abrasive particles contained in the polishing layer for rough polishing are alumina, A combination in which the abrasive particles contained in the polishing layer for finishing is cerium oxide is preferable.

It is also possible to adjust the polishing rate depending on the shape of the abrasive particles contained in each polishing layer, regardless of the type of the abrasive particles. For example, by setting the shape of the abrasive particles contained in the polishing layer 3b for rough polishing shown in FIG. 1 to be a polygon, while the shape of the abrasive particles contained in the polishing layer 3a for final polishing is made substantially spherical. The polishing rate of the polishing layer containing the respective abrasive particles can be adjusted.

Further, the polishing rate can be adjusted by the particle size of the abrasive particles contained in each polishing layer.
This is because by increasing the particle size of the abrasive particles contained in the polishing layer, the probability of contact between the polishing end surface of the material to be polished and the abrasive particles increases, and the polishing rate also increases accordingly. .

For example, as shown in FIG. 1, when a polishing body is formed by laminating two polishing layers, the particle diameter of the abrasive particles contained in the polishing layer 3a is 0.01-0.01.
The polishing layer 3b has a particle size of 1.0 μm, the particle size of the abrasive particles contained in the polishing layer 3b is larger than the particle size of the abrasive particles contained in the polishing layer 3a, and is 0.05 to 10 μm. Can be used as a polishing layer for rough polishing, and the polishing layer 3a can be used as a polishing layer for final polishing.

In the polishing film of the present invention, the particle size of the abrasive particles contained in each polishing layer constituting the polishing body is not particularly limited and is arbitrarily determined so as to obtain a desired polishing rate. be able to.

However, when using abrasive particles that act as fixed abrasive, the particle size is 0.01 to 2
The particle size is preferably within the range of 0 μm, and when using abrasive particles that act as a free abrasive flow, the particle size is
It is preferably in the range of 0.01 to 10 μm. Further, even in this range, particularly when contained in the polishing layer for finish polishing, the particle diameter of the abrasive particles acting as a fixed abrasive flow is preferably 0.01 to 3.0 μm, The particle size of the abrasive particles that act as a loose abrasive flow is
The thickness is preferably 0.01 to 1.0 μm.

(2) Adjustment by Mixing Ratio of Abrasive Particles to Binder for Polishing Layer As a method of adjusting the polishing rate of each polishing layer constituting the polishing body, the polishing agent particles contained in each polishing layer are adjusted. There is a method of adjusting the mixing ratio.

For example, in the polishing layer 3b for rough polishing and the polishing layer 3a for finish polishing in the polishing film 1 of the present invention shown in FIG. 1, the content of the abrasive particles contained in the polishing layer 3b for rough polishing is included. By setting the ratio higher than the content ratio of the abrasive particles contained in the polishing layer 3a for finish polishing, the polishing rate of the polishing layer 3b can be made higher than the polishing rate of the polishing layer 3a.

The specific mixing ratio in each polishing layer is not particularly limited, and may be arbitrarily selected so that the polishing rate is the target within the range that can be contained in the binder for the polishing layer. can do. For example, the mixing ratio of the abrasive particles and the binder for the polishing layer is as follows: abrasive particles: binder = 20: 80 to 95:
5 can be arbitrarily selected within the range of the compounding ratio (weight% ratio) of 5, and when the polishing layer 3b for rough polishing is used, the abrasive particles: binder = 40: 60 to 90:10. It is preferable that the polishing layer 3a for finish polishing, which is provided below the polishing layer 3b, has an arbitrary compounding ratio smaller than the compounding ratio of the polishing layer 3b.

Next, the thickness of the polishing layer constituting the polishing body will be described.

In the polishing film of the present invention, it is necessary to determine the thickness of each polishing layer in accordance with the time for polishing the material to be polished using the polishing layer. The polishing film of the present invention utilizes the fact that the laminated polishing layers are worn away during the polishing step, and the polishing layer provided immediately below appears on the surface, so that the polishing rate can be increased with one polishing film. The purpose is to carry out different polishing. Therefore, the thickness of each polishing layer corresponds to the time for which the polishing layer is used, and it is necessary to set the thickness according to the material of the material to be polished and the degree of polishing.

Specifically, for example, when the polishing film 1 shown in FIG. 1 is used as a polishing film for polishing an end face of an optical fiber connector, the polishing layer 3b for rough polishing (alumina is used as abrasive particles) is used. Polishing layer 3a for final polishing with a thickness of 2 μm (using silica as abrasive particles)
The thickness is preferably 4 μm.

The thickness of each polishing layer can be arbitrarily determined in consideration of the type and size of the abrasive particles, the time for polishing by each polishing layer, and the like.
The total thickness of the polishing body formed by laminating the polishing layers is 10 to 200.
It is preferable that the thickness is μm. When the thickness of the polishing body is less than 10 μm, the thickness of each polishing layer constituting the polishing body becomes very thin, which may be impractical, and the thickness of the polishing body is more than 200 μm. In this case, the strength of the polishing body may decrease, and the polishing layer is likely to be peeled or dropped during polishing.

The polishing body of the polishing film 1 shown in FIG. 1 is composed of two polishing layers, a polishing layer 3a and a polishing layer 3b, but the polishing film of the present invention has a particularly limited number of polishing layers to be laminated. However, it is also possible to stack two or more polishing layers.

As described above, by laminating two or more polishing layers, it is possible to form a polishing film that can be polished at the polishing rate of the laminated layers. As a result, in a series of polishing operations from the rough polishing process to the finish polishing process,
It is convenient because it reduces the number of times the polishing film needs to be replaced,
It is also possible to improve the efficiency of the polishing work.

[0056]

EXAMPLES Hereinafter, the polishing film of the present invention will be described in more detail with reference to Examples and Comparative Examples. Needless to say, the present invention is not limited to the following examples.

Example 1 A polishing film 31 of the present invention as shown in FIG. 3 was prepared.

A polyethylene terephthalate film having a thickness of 75 μm and having a primer layer formed on one surface thereof was used as the base film 32.

As the polishing layer binder 36, 20 parts by weight of a polyalkylsiloxane resin solution (methyl alcohol solvent, solid content: 30% by weight), which is a kind of organic-inorganic composite polymer, is used as the abrasive particles 35, and the average particle diameter is from 0.010 to 0.10.
80 parts by weight of 0.015 μm colloidal silica sol was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of 1 micrometer of filtration precision, and produced the coating liquid (a) for polishing layers.

This coating solution (a) was applied to the surface of the base film 32 on which the primer layer was formed (hereinafter referred to as the primer-coated surface) by the gravure reverse coating method.
The polishing layer 34 was formed on the base material film by uniformly coating so as to have a dry thickness of 4 μm, heating and drying, and further curing by heating at 100 ° C. for 20 minutes.

Furthermore, 20 parts by weight of a polyalkylsiloxane resin solution of an organic-inorganic composite polymer (methyl alcohol solvent, solid content 30% by weight) was used as the binder 39 for the polishing layer, and the average particle diameter of the abrasive particles 38 was 0.050 to 0.050.
80 parts by weight of 0.100 μm colloidal silica sol was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of filtration precision 2 micrometers, and produced the coating liquid (b) for polishing layers.

This coating solution (b) was uniformly applied onto the already formed polishing layer 34 by the gravure reverse coating method so that the thickness when dried was 1 μm, and was heated and dried, and further The polishing layer 37 was formed on the base material film 2 by heat-curing at 100 ° C. for 20 minutes.

In this way, a polishing film having a polishing body 33 in which the polishing layers 34 and 37 are laminated is formed,
This is Example 1.

(Example 2) Example 2 was manufactured by the following method.

A polyethylene terephthalate film having a thickness of 75 μm and having a primer layer formed on one surface thereof was used as a substrate film.

20 parts by weight of a polyalkylsiloxane resin solution of an organic-inorganic composite polymer (methyl alcohol solvent, solid content: 30% by weight) was used as a binder for a polishing layer, and abrasive particles having an average particle diameter of 0.010 to 0.015 μm were used. 80 parts by weight of colloidal silica sol was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of 1 micrometer of filtration precision, and produced the coating liquid (c) for polishing layers.

This coating solution (c) was applied to the surface of the base film 2 on which the primer layer was formed (hereinafter referred to as the primer coating surface) by a gravure reverse coating method to give a dry thickness of 4 μm. The coating layer was uniformly applied so that it was heated and dried, and then heat-cured at 100 ° C. for 20 minutes to form a polishing layer on the substrate film.

Further, 10 parts by weight of a polyalkylsiloxane resin solution of an organic-inorganic composite polymer (methyl alcohol solvent, solid content: 30% by weight) was used as a binder for a polishing layer, and an average particle size of 0.050 to 0. 10
90 parts by weight of 0 μm alumina sol was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of 1 micrometer of filtration precision, and produced the coating liquid (d) for polishing layers.

This coating solution (d) was uniformly applied onto the already formed polishing layer by the gravure reverse coating method so that the thickness when dried was 1 μm, and the coating was heated and dried to further 100 times. The polishing layer was formed on the base material film by heating and curing under conditions of 20 ° C. and 20 minutes.

In this way, a polishing film having a polishing body formed by laminating a polishing layer was formed, and this was used as Example 2
And

Example 3 Example 3 was manufactured by the following method.

A polyethylene terephthalate film having a thickness of 75 μm and having a primer layer formed on one surface thereof was used as a substrate film.

30 parts by weight of a polyalkylsiloxane resin solution of an organic-inorganic composite polymer (methyl alcohol solvent, solid content: 30% by weight) was used as a binder for a polishing layer, and abrasive particles having an average particle diameter of 0.020 to 0.030 μm were used. 70 parts by weight of cerium oxide was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of filtration precision 1 micrometer, and produced the coating liquid (e) for polishing layers.

The coating liquid (e) was applied to the surface of the base film 2 on which the primer layer was formed (hereinafter referred to as the primer coating surface) by a gravure reverse coating method to give a dry thickness of 4 μm. The coating layer was uniformly applied so that it was heated and dried, and then heat-cured at 100 ° C. for 20 minutes to form a polishing layer on the substrate film.

Furthermore, 30 parts by weight of a polyalkylsiloxane resin solution of an organic-inorganic composite polymer (methyl alcohol solvent, solid content 30% by weight) was used as a binder for a polishing layer, and an average particle diameter of 0.050 to 0. 10
70 parts by weight of 0 μm alumina sol was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of 1 micrometer of filtration precision, and produced the coating liquid (f) for polishing layers.

This coating liquid (f) was uniformly applied onto the already formed polishing layer (polishing layer of the coating liquid (e)) by the gravure reverse coating method so that the thickness when dried was 1 μm. To 100 ° C and 2
The polishing layer was formed on the base material film by heating and curing under the condition of 0 minutes.

Thus, a polishing film having a polishing body formed by laminating a polishing layer was formed, and this was used as Example 3
And

Comparative Example 1 A polyethylene terephthalate film having a thickness of 75 μm and a primer layer formed on one surface thereof was used as a base film.

30 parts by weight of a polyalkylsiloxane resin solution of an organic-inorganic composite polymer (methyl alcohol solvent, solid content: 30% by weight) was used as a binder for the polishing layer, and abrasive particles having an average particle diameter of 0.010 to 0.015 μm were used. 70 parts by weight of colloidal silica sol was added, and these were mixed and ultrasonically dispersed. Then, it filtered with the filter of filtration precision 1 micrometer, and produced the coating liquid (g) for polishing layers.

This coating solution (g) was applied to the surface of the base film 2 on which the primer layer was formed (hereinafter referred to as the primer-coated surface) by a gravure reverse coating method to give a dry thickness of 4 μm. It was uniformly applied as described above, dried by heating, and further cured by heating at 100 ° C. for 20 minutes to form a polishing layer on the substrate film, which was designated as Comparative Example 1.

(Experiment and Results) The polishing films of Examples 1 to 3 and Comparative Example 1 prepared as described above each had a diameter of 12
It was punched into a circle of 7 mm, and these were used for final polishing of the end face of the optical fiber connector. However, the optical fiber connector used for the evaluation is one in which the adhesive has been removed in advance, and then spherical polishing has been performed by polishing with a diamond polishing film having an average particle diameter of 9 μm. As an optical fiber connector polisher, SFP-12 manufactured by Seiko Giken
0A was used.

The results are shown in Table 1 below.

[0083]

[Table 1]

As is clear from Table 1, since the polishing film of the present invention (Examples 1 to 3) has a polishing body in which polishing layers having different polishing rates are laminated,
When polishing the end face of the optical fiber connector using this, it is possible to polish two polishing layers with one sheet, and as a result, the state of the end face can be improved. In addition, in order to examine the shape of the connector, the amount of pull-in and the radius of curvature were examined, and both were good. Furthermore, the return loss was also measured, but all were good.

On the other hand, the polishing film of Comparative Example 1 does not have a polishing body in which a plurality of polishing layers are laminated, so that the end face of the optical fiber connector cannot be polished at different polishing rates. As a result, scratches that could not be completely removed remained on the end faces after polishing. The connector shape and return loss were the same as those of the polishing film of the present invention.

The state of the end face of the optical fiber connector is
It measured using the optical microscope (800 times). For the connector shape, see ACCIS NC3000-TN.
(Manufactured by NTT-AT), J
DS FITEL RM3750B was used.

Further, conventional polishing steps (adhesive removal, spherical surface forming step, primary polishing step, secondary polishing step, final polishing step) and polishing using the polishing films of Examples 1 to 3 were carried out. Table 2 below shows the time required for the steps (the primary polishing step and the secondary polishing step can be omitted).

[0088]

[Table 2]

As is clear from Table 2, when the polishing film of the present invention (Examples 1 to 3) is used, the primary polishing step and the secondary polishing step which are required in the conventional steps are omitted. Therefore, it is possible to significantly reduce the process time. Further, since the diamond polishing film has been conventionally used in the primary polishing step and the secondary polishing step, a significant cost reduction can be realized by omitting these steps.

[0090]

As described above, according to the polishing film of the present invention, since the polishing film has a plurality of polishing layers laminated, the polishing rates of the laminated polishing layers are different from each other. By setting different polishing rates, it is possible to polish with different polishing rates with one polishing film. As a result, it is not necessary to replace the polishing film for each polishing rate, and a series of polishing steps from the rough polishing step to the final polishing step can be performed with one polishing film.

Such a polishing film is particularly preferably applied to polishing an end face of an optical fiber connector composed of an optical fiber and a ferrule, as well as a semiconductor wafer, metal,
Finishing polishing or intermediate polishing or general polishing on the surface, end surface, etc. of precision parts such as ceramics, color filters (for liquid crystal displays), plasma displays, optical lenses, magnetic disks or optical disk substrates, magnetic heads, optical read heads, etc. It can be suitably applied to a film.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of a polishing film of the present invention.

FIG. 2 is a cross-sectional view showing one aspect of polishing the end face of an optical fiber connector using the polishing film of the present invention.

FIG. 3 is a sectional view showing Example 1 of the polishing film of the present invention.

[Explanation of symbols]

1,31 polishing film 2, 32 Base film 3,33 Polished body 3a, 3b, 34, 37 polishing layer 5, 35, 38 Abrasive particles 6, 36, 39 Binder for polishing layer 11 Optical fiber connector 12 optical fiber 13 ferrules 14 Optical fiber end face 15 ferrule end face

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideki Izawa             1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo             Dai Nippon Printing Co., Ltd. F-term (reference) 3C049 AA07 AA09 CA01                 3C063 AA03 AB07 BF02 BG08 BG22                       EE01

Claims (3)

[Claims] 1. A polishing film comprising a substrate film and a polishing body in which a plurality of polishing layers are laminated. 2. The polishing body is composed of polishing layers having different polishing rates, and is laminated in order from the polishing layer having a smaller polishing rate from the base material film side toward the surface of the polishing film. The polishing film according to claim 1. 3. The polishing film according to claim 1, which is used for polishing an end surface of an optical fiber connector.