JP2003065488A - Radiation control bag and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensively manufacturable radiation control bag having high performance. SOLUTION: This radiation control bag A is manufactured by superposing an upper sheet 6 and a lower sheet 7, sealing their peripheral edges, and forming an aluminum deposition layer 9 on the approximately whole face of the upper sheet 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat storage floor heating apparatus for heating a floor while radiating heat accumulated in a heat storage material,
The present invention relates to a heat dissipation control bag used for controlling the amount of heat dissipation when releasing the stored heat and a method for manufacturing the heat dissipation control bag.

[0002]

2. Description of the Related Art A heat storage floor heating system is constructed as shown in FIGS. A heat storage board 2 is embedded between joists 1 erected on the floor, and a heater 3 such as a cord heater is attached to the lower surface side of the heat storage board 2. The heat storage board 2 is loaded with a heat storage material such as a latent heat storage material therein so that the heat of the heater 3 can be stored therein. A heat insulating material 4 is attached under the joists 1 so that heat can be prevented from escaping under the floor. A floor material 5 is attached on the joists 1, and a heat dissipation control bag A is interposed between the floor material 5 and the heat storage boat 2. The heat radiation control bag A can be inflated or deflated to control the amount of heat radiated. That is, FIG. 3A and FIG.
(A) shows a state in which the heat radiation control bag A is inflated by applying pressure, and this state is a heat radiation promoting state. Figure 3
4B and FIG. 4B show a state in which the pressure is not applied to the heat dissipation control bag A and the heat dissipation control bag A is deflated, and this state is a heat dissipation suppression state.

The heat dissipation control bag A is formed in a bag shape by stacking a resin upper sheet 6 and a resin lower sheet 7 and heat sealing the periphery. The upper sheet 6 and the lower sheet 7 are, for example, sheets obtained by laminating a PET film and a CPP (unstretched PP) film, and the CPP film surface of the upper sheet 6 and the CPP film surface of the lower sheet 6 are opposed to each other. The peripheral edges of 6 and the lower sheet 7 are heat-sealed. In the case of the example shown in FIG. 3, an aluminum foil 8 is attached to the lower surface side of the floor material 5 between the heat dissipation control bag A and the floor material 5. In the case of the example shown in FIG.
An aluminum foil 8 is stuck on the upper sheet 6 of the heat dissipation control bag A between the heat dissipation control bag A and the floor material 5. The aluminum foil 8 is provided with an antioxidant coating such as a fluorine coating.

[0004]

However, in the above-mentioned conventional example, although the aluminum foil 8 is attached, there is a problem that the aluminum foil 8 is thicker than the aluminum vapor-deposited layer, so that the cost is high. Further, in the conventional example of FIG. 3, there is a problem in that the aluminum foil 8 is attached to the lower surface of the floor material 5, so that the processing cost of attaching the aluminum foil 8 to the floor material 5 is high (it is more common to attach the films to each other. Cost is low because it is processed differently). Further, in the conventional example shown in FIG. 4, when the heat dissipation control bag A is squeezed into a heat dissipation suppressing state as shown in FIG. 4B, the shape of the heat dissipation control bag A is maintained by the aluminum foil 8 and the heat dissipation control bag A is sufficiently compressed. Because
There is a problem that the heat dissipation suppressing performance is deteriorated.

The present invention has been made in view of the above points, and an object of the present invention is to provide a heat dissipation control bag that can be manufactured at low cost and has good performance, and a method for manufacturing the same.

[0006]

A heat dissipation control bag A of the present invention for solving the above problems is formed in a bag shape by stacking an upper sheet 6 and a lower sheet 7 and sealing the peripheral edges to form a bag. It is characterized in that the aluminum vapor deposition layer 9 is formed over substantially the entire surface. Aluminum deposition layer 9 instead of aluminum foil
Since it is provided, the thickness is thin and the cost can be reduced. Since the aluminum vapor deposition layer 9 is provided on the upper sheet 6, the processing cost can be reduced as compared with the case where the aluminum sheet 9 is attached to the floor material 5. Further, even if it is provided on the upper sheet 6, since it is the aluminum vapor deposition layer 9 having a small thickness, the shape is not retained and the shape is smoothly collapsed, so that the performance is good.

It is also preferable that the uppermost layer of the upper sheet 6 is an aluminum oxidation preventing layer having a high infrared transmittance, and an aluminum vapor deposition layer 9 is provided below the aluminum oxidation preventing layer.
In this case, the aluminum vapor deposition layer 9 can be prevented from being oxidized and the performance is good.

It is also preferable that the uppermost layer of the upper sheet 6 is an olefin resin film 10 and an aluminum vapor deposition layer 9 is directly provided below the olefin resin film 10. By covering the aluminum vapor deposition layer 9 with the olefin resin film 10, the aluminum vapor deposition layer 9 can be prevented from being oxidized and the performance is good. Also olefin resin film 1
The aluminum vapor deposition layer 9 can be easily formed by vapor deposition at 0.
Can be formed.

Further, in the method of manufacturing the heat dissipation control bag of the present invention, the aluminum vapor deposition layer 9 is vapor-deposited under the olefin resin film 10, and the polyester resin film 11 is attached under the aluminum vapor deposition layer 9 as well. An upper sheet 6 is formed by adhering an olefin-based heat sealing resin film 12 under a polyester-based resin film 11, and a polyester-based resin film 14 under the olefin-based heat sealing resin film 13. The lower sheet 7 is formed by pasting them together, and the upper and lower sheets 6 and 7 are overlapped with each other so that the heat sealing resin film 12 of the upper sheet 6 and the heat sealing resin film 13 of the lower sheet 7 face each other. It is characterized in that the edges of the sheet 6 and the lower sheet 7 are heat-sealed. As described above, the heat dissipation control bag A having the aluminum vapor deposition layer 9 on the upper sheet 6 can be easily manufactured. Further, by vapor deposition on the olefin resin film 10, the aluminum vapor deposition layer 9 can be easily formed, and the aluminum vapor deposition layer 9 can be covered with the resin film 10 to prevent oxidation. Further, the upper sheet 6 and the lower sheet 7 can be easily heat-sealed to form a bag.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The heat dissipation control bag A of the present invention is also used in the same manner as the conventional example, and the floor material 5 of the heat storage floor heating device is used.
It is provided between the heat storage board 2 and the heat storage board 2. The heat dissipation control bag A is composed of an upper sheet 6 and a lower sheet 7, and is formed by stacking the upper sheet 6 and the lower sheet 7 and fusing the edges by heat sealing.

As shown in FIG. 2A, the upper sheet 6 has an aluminum vapor deposition layer 9 laminated on an olefin resin film 10 and a polyester resin film 11 laminated on the aluminum vapor deposition layer 9. This resin film 11
Under the olefin resin film for heat sealing 1
It is formed by stacking two. Examples of the olefin resin film 10 include a PP film and a PE film. In this example, the olefin resin film 10 is, for example, an OPP (stretched PP) film and has a thickness of 15 μm. The resin film 10 is directly vapor-deposited to form the aluminum vapor deposition layer 9. The thickness of the aluminum vapor deposition layer 9 is about 500 Å (0.05 μm). In this example, the polyester-based resin film 11 is, for example, a PET film and has a thickness of 38 μm. Resin film 1 for olefin-based heat sealing
Examples of 2 include a PP film and a PE film, but in this example, a CPP (unstretched PP) film,
The thickness is 50 μm. When the aluminum vapor deposition layer 9 and the resin film 11 are attached to each other or the resin film 11 and the resin film 12 are attached to each other, for example, dry lamination is performed. This dry lamination is a method of laminating films using an adhesive 16 such as a urethane adhesive, and is a general method of laminating films.

As shown in FIG. 2B, the lower sheet 7 is formed by laminating a polyester resin film 14 under an olefin heat sealing resin film 13. Resin film 1 for olefin-based heat sealing
3 is a PP film or a PE film, and in the case of this example, it is a CPP film, for example, and has a thickness of 50 μm. In this example, the polyerter resin film 14 is a PET film and has a thickness of 38 μm. When the resin film 13 and the resin film 14 are attached to each other, dry lamination is performed as described above.

When the heat dissipation control bag A constructed as described above is manufactured, for example, it is carried out as follows. Aluminum is vapor-deposited under a resin film 10 such as an OPP film to form an aluminum vapor deposition layer 9 (there is a film generally sold as an OPP film with aluminum vapor deposition), and the aluminum vapor deposition layer 9 of the resin film 10 is formed.
To the resin film 11 such as PET film by dry lamination and CPP to the resin film 11.
A resin film 12 such as a film is attached by dry lamination to form the upper sheet 6. Meanwhile, CPP
A resin film 14 such as a PET film is attached to a resin film 13 such as a film by dry lamination to form the lower sheet 7. The upper sheet 6 and the lower sheet 7 are stacked so that the heat-sealing resin film 12 of the upper sheet 6 and the heat-sealing resin film 13 of the lower sheet 7 face each other, and the peripheral edge of the upper sheet 6 and the peripheral edge of the lower sheet 7 are overlapped. Are heat-sealed and the resin films 12 and 13 are fused at the periphery to form a bag, thereby forming the heat dissipation control bag A.
In the above example, the heat-sealing resin film 12 such as a CPP film is attached under the resin film 11 such as the PET film of the upper sheet 6 by dry lamination.
The resin film 12 may be formed by applying a resin such as PP melted to the above.

The heat dissipation control bag A constructed as described above is shown in FIG.
As shown in Fig. 1, it is installed in the heat storage floor heating system.
When pressure is applied to the heat dissipation control bag A as shown in (a) to inflate the heat dissipation control bag A, heat dissipation is promoted, and pressure is not applied to the heat dissipation control bag A as shown in FIG. 1 (b). When it is squeezed, the heat dissipation is suppressed. At this time, the thickness of the aluminum vapor deposition layer 9 of the upper sheet 6 of the heat dissipation control bag A is 500Å
(0.05 μm) and aluminum foil (even the thinnest one is about 10 μm), it is very thin, so there is no strength to hold the shape like aluminum foil, and the heat dissipation control bag A is sufficiently dented, The ability to suppress heat dissipation is retained.

The olefin resin film 1 is formed on the aluminum vapor-deposited layer 9 of the heat dissipation control bag A constructed as described above.
The olefin resin film 10 coated with 0 serves as an aluminum anti-oxidation layer having a high infrared transmittance, prevents the aluminum vapor deposition layer 9 from being oxidized, and can improve the performance and has a high infrared transmittance. The heat emissivity is kept low. That is, since the aluminum vapor deposition layer 9 is formed of the resin film 10 made of a material having a high infrared transmittance, the thermal emissivity is kept low. For example, the thickness of the OPP film as the resin film 10 is 15 μm.
As m, the emissivity is 0.1 with only the aluminum vapor deposition layer 9.
The emissivity can be maintained as low as 0.15.
Instead of covering the aluminum vapor deposition layer 9 with the resin film 10 such as an OPP film as described above, a fluorine coating may be applied as an aluminum antioxidant layer having a high infrared transmittance.

The upper sheet 6 and the lower sheet 7 are heat-sealed to form the heat dissipation control bag A. In this example, the uppermost resin film 10 of the upper sheet 6 is an OPP (stretched PP) film and heat is applied. Resin films 12 and 13 for sealing
Since it is a CPP (unstretched PP) film, heat sealing is easy. In other words, the OPP film is C
The resin film 12, 13 made of a CPP film when heat-sealed because it has a higher melting point than that of the PP film.
However, there is no adverse effect that the resin film 10 made of the OPP film melts when it is heat-sealed.

[0017]

The heat dissipation control bag of the present invention is formed by stacking an upper sheet and a lower sheet and sealing the periphery to form a bag, and forming an aluminum vapor deposition layer over substantially the entire surface on the upper sheet. Since it is not an aluminum foil but an aluminum vapor deposition layer is provided, it is thin and inexpensive.
Moreover, since the aluminum vapor deposition layer is provided on the upper sheet, the processing cost can be reduced compared to sticking it on the floor material, and even if it is provided on the upper sheet, the aluminum vapor deposition layer is thin. Therefore, the shape is not retained, and the shape is smoothly collapsed, so that the performance is good.

If the uppermost layer of the upper sheet is made of an aluminum antioxidation layer having a high infrared transmittance and an aluminum vapor deposition layer is provided below the aluminum antioxidation layer, the aluminum vapor deposition layer can be prevented from being oxidized and the performance is good.

If the uppermost layer of the upper sheet is made of an olefin resin film and an aluminum vapor deposition layer is provided directly under the resin film, the aluminum vapor deposition layer is covered with the olefin resin film so that the aluminum vapor deposition layer is oxidized. It can be prevented and has good performance, and an aluminum vapor deposition layer can be easily formed by vapor deposition on an olefin resin film.

Further, in the method for manufacturing the heat dissipation control bag of the present invention, the aluminum vapor deposition layer is vapor-deposited under the olefin resin film, and the polyester resin film is attached under the aluminum vapor deposition layer, and the polyester resin An olefin-based heat-sealing resin film is attached below the film to form an upper sheet, and a polyester-based resin film is attached below the olefin-based heat-sealing resin film to form a lower sheet,
A resin film for heat-sealing the upper sheet and a resin film for heat-sealing the lower sheet are laminated such that the upper and lower sheets are overlapped and the peripheral edges of the upper sheet and the lower sheet are heat-sealed, Thus, the heat dissipation control bag having the aluminum vapor deposition layer on the upper sheet can be easily manufactured, and the aluminum vapor deposition layer can be easily formed by vapor deposition on the olefin resin film. It can be covered with a resin film to prevent oxidation, and the upper sheet and the lower sheet can be easily heat-sealed to form a bag.

[Brief description of drawings]

FIG. 1 is a sectional view of an example of a heat storage floor heating device having a heat dissipation control bag of the present invention, in which (a) is a heat dissipation promoting state,
(B) is a heat dissipation suppression state.

FIG. 2A is an enlarged cross-sectional view of an essential part of an upper sheet of the heat dissipation control bag, and FIG. 2B is an enlarged sectional view of an essential part of a lower sheet of the heat dissipation control bag.

FIG. 3 is a cross-sectional view of a conventional heat storage floor heating system,
(A) is a heat dissipation promotion state, (b) is a heat dissipation suppression state.

FIG. 4 is a cross-sectional view of another conventional heat storage floor heating system, in which (a) is a heat dissipation promotion state and (b) is a heat dissipation suppression state.

[Explanation of symbols]

A heat dissipation control bag 6 Upper sheet 7 lower sheet 9 Aluminum vapor deposition layer

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) // B65D 30/02 B65D 30/02 (72) Inventor Toshiro Hotta 1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd. Inner F-term (reference) 3E064 BA24 BB03 BC18 BC20 EA18 FA01 GA04 3H036 AA09 AB11 AB32 AC06 3L071 CC05 CD01 CE01 CF06 3L072 AA02 AB03 AC02 AD06 4F100 AB10B AK03A AK03D AK03E AK41E16B12B16B12B16B10B16B10BBAE BA05 BA07 BA05 BA07 BA10 BA10 BA10 BA12 BA10

Claims (4)

[Claims] 1. A heat dissipation control bag characterized in that an upper sheet and a lower sheet are overlapped with each other and a peripheral edge is sealed to form a bag shape, and an aluminum vapor deposition layer is formed on substantially the entire surface of the upper sheet. 2. The heat dissipation control bag according to claim 1, wherein the uppermost layer of the upper sheet is an aluminum antioxidation layer having a high infrared transmittance, and an aluminum vapor deposition layer is provided below the aluminum antioxidation layer. 3. The heat dissipation control bag according to claim 1, wherein an uppermost layer of the upper sheet is an olefin resin film, and an aluminum vapor deposition layer is directly provided below the olefin resin film. 4. An aluminum vapor deposition layer is vapor-deposited under an olefin resin film, a polyester resin film is attached under the aluminum vapor deposition layer, and an olefin heat seal is formed under the polyester resin film. The resin film for heat sealing of the above-mentioned upper sheet is formed by laminating the resin film of the above to form the upper sheet, and the resin sheet for polyester is laminated under the resin film for heat sealing of the olefin type. And a heat-sealing resin film of the lower sheet are opposed to each other, and the peripheral edges of the upper sheet and the lower sheet are heat-sealed, and the heat dissipation control bag is manufactured.