JP2003064470A - Electron beam vapor deposition apparatus and treating method of wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce maintenance time resulting from aluminum scattered in a product chamber part (3) of an electron beam (EB) aluminum vapor deposition apparatus (1). SOLUTION: In the EB vapor deposition apparatus (1) having a planetary (9) in the product chamber part (3), sticking preventing plates on the inside wall of the product chamber part (3) are eliminated or the number is reduced by arranging blind sticking preventing plates (19) and sticking preventing top plates (20) to cover the planetary (9) by surrounding.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an aluminum vapor deposition apparatus using an electron beam.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, as a metal coating method for forming electrodes and the like, there is a manufacturing method using an aluminum vapor deposition apparatus using an electron beam (hereinafter referred to as an EB aluminum vapor deposition apparatus).

FIG. 7 is a diagram showing a conventional EB aluminum vapor deposition apparatus. (1) is an EB aluminum vapor deposition device, (2) is a source chamber part, (3) is a product chamber part,
(4) is a cryopump, (5) is a filament,
(6) is a filament stand, (7) is an aluminum ingot,
(8) Wafer, (9) Planetary, (13) Planetary (9) Disk on back side, (10) Rotary motor, (11) Control panel, (12) Rail, (13) Disk Each part is represented.

The EB aluminum vapor deposition apparatus (1) is mainly composed of a lower source chamber section (2) and an upper product chamber section (3). The valves V1 and V2 are opened and closed, and an external cryopump (4) is provided. ) By EB
The inside of the aluminum vapor deposition device (1) is brought to a high vacuum state (4 Pa (pascal)). A filament stand (6) having a filament (5) inside is installed in the source chamber part (2). Filament (5) is about 10000V from the E / B power source outside the EB aluminum vapor deposition device (1).
At, a current of 1.1 A is supplied. An aluminum ingot (7) with a purity of 99.999% is installed on the filament stand (6), and the electron beam emitted from the filament (5) collides with the ingot (6), thereby producing a high vacuum product. Aluminum particles are scattered in the chamber part (3). At this time, it is calculated that the scattered aluminum particles are not deposited on the floor surface of the product chamber section (3).

In the product chamber section (3), a plurality of planetaries (9) to which a plurality of wafers (8) are attached (dome-shaped wafer attaching device) are installed. The planetary (9) is rotated by the rotary motor (10) located on the upper outside of the product chamber (3).
The scattered aluminum particles are deposited on the surface of the wafer (8) rotating with the planetary (9) in a locus like an arrow in the figure to form a metal foil coating which is an initial object. The control panel (11) controls the vacuum in the source chamber part (2) and the product chamber part (3), the aluminum deposition state, and the like. The rail (12) has a circular shape having a groove, and the disk portion (13) installed on the back surface of the planetary (9) passes through the groove, whereby the planetary (9) rotates.

In the above aluminum vapor deposition step, it took about 60 minutes until the aluminum vapor deposition on the surface of the wafer (8) was completed (hereinafter referred to as one batch).

[0007]

In the conventional EB aluminum vapor deposition apparatus (1), aluminum particles scattered on the ceiling and side wall surfaces (hereinafter, generally referred to as wall surfaces) in the product chamber section (3) during its operation. Adheres. When the amount of these adhered substances increases, it affects the time until vacuuming (work for forming a high vacuum) to a predetermined vacuum state, and the time required for one batch increases. According to the practice of the inventor of the present application, it has been confirmed that when excessive aluminum particles adhere to the wall surface, it takes 80 to 90 minutes or more to complete one batch. Up to now, a removable plate (hereinafter referred to as a deposition preventive plate) has been installed on the wall surface inside the product chamber section (3). When aluminum is excessively vapor-deposited on the wall surface, it has been dealt with by appropriately removing the deposition preventive plate installed on the side wall surface and cleaning (maintenance) with an etchant such as phosphoric acid or an alkaline cleaner. These cleanings require maintenance approximately once every 300 batches.

FIG. 8 is a perspective view showing the product chamber portion (3) of FIG. The inside of the product chamber section (3) is omitted for the sake of explanation. (14) is the door
(15) is a door window part, (16) is an exhaust port for vacuuming, and (17) is an aluminum scattering port through which aluminum particles scatter. The product chamber part (3) is composed of a ceiling and four side wall surfaces. Since one wall surface of the product chamber part (3) has a size of about 1 m to 2 m, one wall surface is divided by two deposition preventive plates, and a ceiling and a side wall surface are provided for a total of five wall surfaces. A total of 10 anti-adhesion plates have been installed (see FIG. 8). Then, one piece of the deposition preventive plate was fixed to the wall surface with a plurality of screws.

For the door portion (14), the door window portion (15) of the peephole for confirming whether the amount of the ingot (7) is appropriate.
Is formed, and the aluminum vapor deposition device (1) is in operation,
At any time, the inside of the product chamber part (3) can be confirmed through the glass part installed in the door window part (15). Inside the door window portion (15), a metal deposition plate is installed, and this deposition plate is removable.

At the time of maintenance, a plurality of screws fixed to the 10 anti-adhesion plates were removed and replaced with a new or washed anti-adhesion plate manually. In the practice of the inventor of the present application, when one person is in charge of the work for replacing the deposition-prevention plate, it takes about 80 minutes. During the replacement work, the EB aluminum vapor deposition device (1) was completely stopped, so that a loss was generated in terms of operating time. In other words, if it is possible to further shorten the replacement / replacement work time of the deposition preventive plate, it is possible to increase the operation time of the EB aluminum vapor deposition apparatus, and it is expected that the operation rate is improved.

The present invention has been made in view of the above problems, and reduces the number of times the aluminum vapor deposition apparatus (1) is replaced by reducing the number of deposition-preventing plates in the product chamber section (3) or facilitating replacement. It is a thing.

[0012]

The present application relates to a planetary on a rotating disk, on which a plurality of wafers are mounted, a rail provided to rotate the plurality of planetaries, and a filament stand located below the rails. A chamber portion provided below the filament stand for heating an ingot made of a metal material, the planetary, the rail, the filament stand, and the filament provided inside the chamber part; and the outside of the chamber part. In the electron beam evaporation apparatus equipped with a cryopump installed in, a columnar deposition preventive plate formed to cover the entire planetary is arranged in the chamber,
An electron beam vapor deposition apparatus and a plurality of wafers, characterized in that a truncated cone-shaped anti-sticking top plate disposed inside the anti-sticking plate is arranged so as to maintain a sufficient space for the planetary to rotate. Install the planetary in which is installed in the chamber so that the disk part on the back side contacts the rail in the product chamber part, and the cylindrical anti-adhesion plate so as to surround the entire planetary. It is installed so as to cover the columnar trapezoidal protection top plate from above the columnar deposition preventive plate on the planetary upper part, and from the source chamber part below the product chamber part, metal particles Scatter,
A step of forming a metal film having a predetermined film thickness on the surface of the wafer, and most of the aluminum particles other than those vapor-deposited on the wafer are formed on the inner surface of the columnar protection plate and the protection top plate. Provided is a method for processing a wafer, which is characterized in that the wafer is processed so as to adhere to the wafer.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an overall view showing an EB aluminum vapor deposition apparatus representing a first embodiment of the present invention. Hereinafter, the same components as those in the conventional example (FIG. 7) are designated by the same reference numerals. (19) is a blind protection plate, and (20) is a protection top plate.

A feature of the present invention is that the conventional EB aluminum vapor deposition apparatus (1) of FIG. 7 has a columnar anti-sticking plate that covers the entire planetary (9) to minimize the scattering frame of aluminum particles. (Hereinafter, blind protection plate (19)
, And the shape of a truncated cone (the upper circular surface is completely closed and the lower circular surface is open) that prevents aluminum particles from scattering and adhering to the ceiling of the product chamber (3). ) Is arranged so as to cover the entire planetary (9) from above. Hereinafter, these will be described in detail.

FIG. 2 (A) is a plan view of the blind protection plate (19), and FIG. 2 (B) is a side view thereof. R represents the diameter of the circle formed by the blind protection plate (19).

In FIGS. 2A and 2B, (21) is an inner ring wire, (22) is an outer ring wire, (23) is each blind plate, (24) is a shaft, (25) is a joint portion, (26)
Is an upper ring, (27) is a lower ring, (28) is a fastener,
(29) represents a window. In addition, FIG.
In (B), the same parts are designated by the same reference numerals.

The blind protection plate (19) comprises a plurality of blind plates (23), an upper ring (26) and a lower ring (2).
7) and an inner ring (21) and an outer ring (2)
Form a circle along 2). At this time, the inner ring (2
1) and the outer ring line (22) represent the inner and outer contours of the ring. Further, the radius difference between the inner ring (21) and the outer ring (22) is formed to be a distance d. The diameter R of the blind protection plate (19) is the product chamber part (3)
Although it depends on the inner size, it is about 1000 to 1500 mm.

The blind part (19) has a circumferential portion (a side surface of a cylinder) formed of 26 blind plates (23).
Is formed by. Blind plate (23) is 1mm thick
Made of stainless steel, each has a rectangular shape,
Its dimensions are height (long side) of about 500 mm, width (short side) 1
It is about 00 mm. As described above, the adjacent blind plates (23) are formed so as to have an overlapping area and form a constant gap d. One end of the long side of one blind plate (23) is arranged on the inner ring line (21), and the other end of the long side is arranged on the outer ring line (22). That is, the blind plates (23) are arranged so that they are all contained within a constant interval (distance d). At this time, 24 of the 26 blind plates (23) are completely fixed by the upper ring (26) and the lower ring (27) so that the ends of the blind plates (23) overlap each other by about 10 mm. Two blind plates (23) adjacent to each other are formed in a blind shape and are fixed with a constant gap d. This gap d is
It substantially matches the distance d that is the difference in radius described above. The gap d substantially matches the distance d described above.

In the present invention, the blind adhesion prevention plate (1
9) is formed into the blind shape shown in FIG.
The reason is to improve the exhaust conductance of the aluminum gas inside the blind deposition preventing plate (19). If the blind deposition prevention plate (19) is composed of one cylindrical plate without a gap, aluminum gas will stay inside,
Inside the blind deposition prevention plate (19), the gas concentration may not be uniform, and aluminum vapor deposition with an appropriate film thickness may not be possible. Further, outside the blind deposition prevention plate (19), the gas far from the exhaust port bypasses the blind deposition protection plate (19) and is exhausted, so that it takes more time to evacuate. Since the gap d of the present invention is present between the blind deposition prevention plates (19), these gas that easily stays can pass through the inside of the blind deposition protection plate (19), and vacuuming can be performed in a short time. . According to an experiment conducted by the inventor of the present application, since the gas containing aluminum particles has a straight traveling property, when the gap d is about 6 to 12 mm, preferably about 8 to 10 mm, only the aluminum particles are blind plates (23 It was found that only the gas remaining after the collision and adhered to () passed through the gap d and reached the exhaust port.

Four shafts (24) are arranged at equal intervals on the outer peripheral surface side of the circle of the blind protection plate (19). This axis (2
4) is a rod made of metal or the like having sufficient strength so that 26 blind plates (23) form a circle,
The upper ring (26) and the lower ring (27) are fixed. There is no particular limitation on the number of the axes (24).

Two joints (25) are formed on the circumference of the upper ring (26) and the lower ring (27) forming a circle.
They are separated by a diameter R. As a result, the two joints (25) have the furthest positional relationship on the circumference. The function of the joint portion (25) will be described later. In FIG. 2 (B), a total of two blind plates (23) located near two joints (25) of the 26 blind plates (23) are respectively a blind plate (23A) and a blind plate (23A). ). Both are arranged farthest on the circumference and separated by a diameter R.

The 24 blind plates (23) excluding the blind plate (23A) and the blind plate (23B) are completely fixed by the upper and lower rings (26) and (27) and the fasteners (28). . The fastener (28) may be welded or the like. At this time, the blind plate (23A) and the blind plate (23B) are replaced by the blind protection plate (19).
To be removable. As an example of the detachable method, a groove (not shown) corresponding to the blind plate (23) is formed on the surface of the upper ring (26) and the lower ring (27) on the side where the blind plate (23) contacts. , Blind plate (23A) and blind plate (23
There is a method of sliding B), but it is not particularly limited to this method.

The lower ring (2) of the blind plate (23A)
A window portion (29) having an opening is formed at a position biased to the 7) side. This window portion (29) is a peep window for confirming whether the aluminum ingot (7) shown in FIG. 1 maintains an appropriate amount. Depending on the situation, this window (29) may not be needed. The window portion (29) and the door window portion (15) described above are arranged so that the amount of the aluminum ingot (7) can be confirmed.

FIG. 3 is a view when the blind plate (23A) and the blind plate (23B) are removed, and the blind protection plate (19) is disassembled into two elements at the joint portion (25). In the figure, the element shown in the upper part of FIG. 3 is referred to as the blind deposition plate (19A), and the element shown in the lower part of FIG. 3 is referred to as the blind deposition plate (19B). Blind protection plate (19A) upper ring (26A) and lower ring (27
At the end of (A) (four places in total), joint recesses (29) as shown in the figure are formed. Similarly, the blind shield plate (19
At the ends of the upper ring (26B) and the lower ring (27B) of B) (total of 4 places), the joining protrusions (3
0) is formed. By fitting the joint concave portion (29) and the joint convex portion (30) at these four places, respectively, the blind protection plate (19A) and the blind protection plate (19B) are integrated with each other in the present invention. A blind shield plate (19) is formed. Blind protection plate (1
The reason (9) can be disassembled as shown in FIG. 3 is that it is considered to be more useful during transportation, transportation and cleaning. still,
The blind deposition prevention plate (19) of the present invention is not limited to the one that can always be disassembled.

FIG. 4 is a side view showing the anti-adhesion top plate (20). The anti-adhesion top plate (20) has a top surface circle (31) and side surfaces (3
2), forming a truncated cone consisting of the lower surface circle (33), which is mainly made of stainless metal. At this time, although the upper surface circle (31) and the side surface portion (32) are made of metal, the lower surface circle (3
3) is open. The diameter of the upper surface circle is about 450 mm, and the diameter of the lower surface circle is about 700 mm. Protective top plate (20)
Is a disc part (1) on the rear side of the planetary (9) that runs on the rail (14) inside the blind protection plate (19).
3) Install on top. Therefore, the disk supports the anti-adhesion top plate (20) while rotating, and the anti-adhesion top plate (20) also rotates. The anti-adhesion top plate (20) is installed in order to prevent the scattered aluminum particles from adhering to the ceiling of the product chamber section (3).

As described above, according to the first embodiment of the present invention, the number of deposition-preventing plates in the product chamber section (3), which is 11 in the related art, is the blind-preventing plate (19) and the deposition-preventing top plate (20). The number of door windows (15) can be reduced to three.

FIG. 5 shows an E representing a second embodiment of the present invention.
It is an overall view showing a B aluminum vapor deposition device. FIG. 6 is an enlarged and detailed view of the product chamber section (3) of the EB aluminum vapor deposition apparatus of FIG. 5, but the planetary (9) and the like are omitted for convenience. (28) is a partial protective plate, (28
A) to (28D) are four partial deposition plates (28),
(29) is the door of the product chamber (3),
(16) indicates an exhaust port, (17) indicates an aluminum scattering port, and other reference numerals indicate the same as those in FIG.

The feature of the second embodiment of the present invention is that the blind attachment plate (19) having a reduced height is provided on the rail (12).
It is to install on top. The blind protection plate (19) has a diameter R of about 800 mm, and one rectangular blind plate (23) has a long side of about 300 mm and a short side of about 100 mm. The anti-adhesion top plate (20) is the same as that of the first embodiment of the present invention. Reference numeral (28) represents a partial deposition preventive plate, which is attached to the inner surface of the door portion (29).
A), a partial deposition plate (28B) attached to the wall surface continuous with the door portion (29), a partial deposition plate (28C) attached to the wall surface opposite to the door portion (29), and a partial deposition It consists of a plate (28B) and a partial deposition prevention plate (28D) attached to the wall surface on the opposite side.
At this time, the partial deposition prevention plate (28A) and the partial deposition prevention plate (2
8C) has the same shape, but a partial deposition prevention plate (28D)
Has an exhaust port (16) for evacuating, and thus has a shape having an opening part partially matching the exhaust port (16) as shown in FIG. These partial protective plates (28
A) to (28D) are about 1/2 to 1/3 of the area of the fixed wall surface, and are fixed with screws or the like as in the conventional example.

The aluminum scattering port (17) is an opening for scattering aluminum particles from the aluminum ingot (7) arranged inside the source chamber part (2) provided at the bottom. The aluminum scattering port (17) completely closes the source chamber part (2) and the product chamber part (3) by closing the valve V3 when replacing the wafer (8).

In the second embodiment of the present invention, the main reason for arranging the blind protection plate (19) on the rail (12) is to install the planetary (9) under the rail (12) at the end of one batch. This is to secure a space for taking in and out for replacement. By providing this space, it is necessary to prevent aluminum particles from scattering under the rail (12). In order to prevent these scattering, it is dealt with by attaching a partial deposition prevention plate (28) to the scattering range below the rail (12) on the four wall surfaces in the product chamber part (3) (see FIG. 6). .

From the above, the number of deposition-preventing plates for preventing aluminum particles from scattering in the present invention is the following seven points. Blind protection plate (19) (1 point), protection top plate (20) (1
Points), the partial deposition prevention plate (28) (4 points), and the door window portion (15) (1 point). The partial deposition shield (28) is fixed to the four walls of the product chamber section (3) with screws, but the blind deposition shield (19) is attached to the rail (1).
2) It is just placed on top, and the deposition-proof top plate (20)
Similarly, it is only covered so as to be hidden in the blind protection plate (19). The scattering of aluminum particles above the rails (12) can be completely prevented by two points, the blind protection plate (19) and the protection top plate (20).

According to the first and second embodiments of the present invention,
Since the blind protection plate (19) and the protection top plate (20) are not fixed with screws or the like, they can be removed very quickly and easily during replacement.

In the present invention, a blind shape is incorporated in the adhesion-preventing plate, but in terms of speeding up the replacement work of the adhesion-preventing plate, which is the original purpose of the present invention, it is not the blind adhesion-preventing plate but the gap There is no particular problem even if it is a mere metal columnar deposition preventive plate.

[0034]

As described above, according to the present invention, by using the blind deposition prevention plate (19) and the deposition protection top plate (20), the deposition protection plate inside the aluminum vapor deposition apparatus has 11 to 3 points or 7 points. And can be greatly reduced. Also, since the blind deposition prevention plate (19) and the deposition protection top plate (20) are simply placed inside the product chamber part (3), the replacement time for removing the adhered aluminum is compared with the conventional example. It can be greatly shortened. According to the implementation result of the inventor of the present application, in the second embodiment of the present invention, the blind adhesion preventing plate (1
With an EB aluminum vapor deposition apparatus using 9) or the like, when one person is in charge, the replacement work can be performed in about 30 minutes or less, and the work is completed in less than half the time of the conventional example.
As a result, the operating time of the EB aluminum vapor deposition apparatus (1) can be increased by the amount corresponding to the shortened working time, and improvement in operating efficiency can be expected.

In addition, a blind shape 2 is provided in which a certain gap is provided on the side surface of the blind protection plate (19).
Six blind plates (23) are formed. By forming a gap in the blind plate (23), the fluidity of the aluminum particle gas scattered inside the blind deposition prevention plate (19) is increased, and the film thickness of aluminum adhered to the wafer (8) is constant. Have.

[Brief description of drawings]

FIG. 1 is a side view showing a first embodiment of the present application.

2A and 2B are a plan view and a side view of the blind adhesion preventing plate of the present application.

FIG. 3 is a perspective view of a blind protection plate of the present application.

FIG. 4 is a side view of the anti-adhesion top plate of the present application.

FIG. 5 is a side view showing a second embodiment of the present application.

6 is an enlarged view of the product chamber portion of FIG.

FIG. 7 is a side view showing a conventional aluminum vapor deposition apparatus.

FIG. 8 is a perspective view showing a conventional aluminum vapor deposition apparatus.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroyuki Soeda             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. (72) Inventor Nobuyuki Yata             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. F-term (reference) 4K029 AA06 BA03 BC03 BD01 CA01                       DA10 DB21 JA03                 4M104 BB02 DD34 DD35

Claims (10)

[Claims] 1. A planetary on a rotating disk, on which a plurality of wafers are mounted, a rail provided to rotate the plurality of planetaries, a filament stand located below the rail, and a position below the filament stand. And a filament for heating an ingot made of a metal material, the planetary, the rail, the filament stand,
A chamber part provided with the filament therein, and a cryopump installed outside the chamber part,
In an electron beam vapor deposition apparatus comprising: a columnar deposition preventive plate formed so as to cover the entire planetary is arranged in the chamber, a truncated cone-shaped deposition preventive plate arranged inside the deposition preventive plate, An electron beam evaporation apparatus, wherein the planetary is arranged so as to maintain a sufficient space for rotation. 2. The electron beam vapor deposition apparatus according to claim 1, wherein the side surface portion of the deposition-inhibitory plate is formed of a plurality of blind deposition-inhibitory plates, and the plates overlap each other and form a few gaps. An electron beam vapor deposition apparatus characterized in that it has a blind shape arranged. 3. The electron beam vapor deposition apparatus according to claim 2, wherein the gap is 6 to 12 mm. 4. A planetary on a rotating disk, on which a plurality of wafers are mounted, a rail provided to rotate the plurality of planetaries, a filament base located below the rail, and a position below the filament base. And a filament for heating an ingot made of a metal material, the planetary, the rail, the filament stand,
A chamber part provided with the filament therein, and a cryopump installed outside the chamber part,
In the electron beam vapor deposition apparatus having the above, a columnar deposition prevention plate disposed on the rail upper portion and formed so as to cover the entire planetary on the rail upper portion is disposed, and a truncated cone disposed inside the deposition prevention plate. An electron beam vapor deposition apparatus, characterized in that a deposition-proof top plate is arranged so as to maintain a sufficient space for the planetary to rotate. 5. The electron beam vapor deposition apparatus according to claim 4, wherein a side surface portion of the deposition-inhibitory plate is formed of a plurality of fixed blind deposition-inhibitory plates, and the plates are overlapped with each other and a gap is provided. An electron beam vapor deposition apparatus, which is in the form of a blind arranged so as to form an electron beam. 6. The electron beam vapor deposition apparatus according to claim 5, wherein the gap is 6 to 12 mm. 7. A step of installing a planetary on which a plurality of wafers are installed in the chamber so that a disk part on the back surface of the planetary part abuts on a rail in the product chamber part, and surrounding the entire planetary. A columnar deposition preventive plate is installed, and the columnar trapezoidal deposition preventive plate is installed from above the columnar deposition preventive plate to cover the upper part of the planetary, and below the product chamber section. A step of scattering metal particles from a certain source chamber part to form a metal film having a predetermined film thickness on the surface of the wafer, and most of the aluminum particles other than those deposited on the wafer are the circles. A method for processing a wafer, characterized in that the wafer is treated so as to be attached to the inner surface of the columnar deposition preventing plate and the deposition preventing top plate. 8. The columnar deposition preventing plate has a side surface formed of a plurality of deposition preventing plates, and the plurality of deposition preventing plates are formed so as to overlap each other and have a constant gap. The method for processing a wafer according to claim 7, wherein: 9. A step of installing a planetary, on which a plurality of wafers are installed, in the chamber so that the disk part on the rear surface thereof abuts on a rail in the product chamber part; A columnar deposition plate is installed on the rail so as to surround the planetary, and is installed so that the columnar trapezoidal deposition top plate covers the planetary upper part from above the column deposition plate. And a step of forming metal coatings of a predetermined thickness on the surface of the wafer by scattering metal particles from the source chamber below the product chamber, except for vapor deposition on the wafer. Most of the aluminum particles are adhered to the inner surface of the columnar deposition-inhibiting plate and the deposition-inhibiting top plate. 10. The columnar deposition preventing plate has a side surface formed of a plurality of deposition preventing plates, and the plurality of deposition preventing plates are formed so as to overlap each other and have a constant gap. The wafer processing method according to claim 9, wherein