JP2003057008A - Matter recognition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a matter recognition apparatus capable of recognizing two matters accurately and rapidly while making it possible to avoid the size- increase of the apparatus. SOLUTION: A common image pickup means 7 is provided between first and second matters 1 and 2 so as to pick up the images of both matters. A first illumination means 5 for illuminating the first matter 1 and a second illumination means 6 for illuminating the second matter 2 are provided, and an obstruction means 8 for obstructing the irradiation of the first matter 1 with light of at least a certain wavelength range in the light reflected from the second matter 2 is provided, or a quantity-of-light regulation means 8X for making the ratio of quantity of light attenuated up to the image pickup means 4 from two matters almost same is provided. Alternatively, both of the obstruction means 8 and the quantity-of-light regulation means 8X are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention picks up images of two objects such as parts and products by a common image pickup means, and inspects the appearance and scratches of parts and products based on the image pickup data. The present invention relates to an object recognition device used for aligning electronic components mounted on a substrate.

[0002]

2. Description of the Related Art A case of mounting the above electronic parts on a substrate will be described as an example. Not only the object recognition device but also a gripping device for gripping the electronic parts and the substrate, and a gripping device for recognizing the object. This requires a control device for controlling the movement of the gripping device based on the position information of the device, a mounting device for mounting the electronic component on the board, and the like, which makes the entire device complicated and large. Therefore, a configuration is used in which two object are imaged by a common imager so that the object recognition device can be downsized and the cost can be reduced. Also, in the case of a configuration in which two objects are respectively imaged using two imaging means, since the positions of the imaging means are different, the positions of the two objects including the distance between the imaging means are accurately grasped. However, the common image pickup means is often used also from this point. Then, the conventional object recognition device has two illuminating devices that respectively illuminate the electronic component and the substrate arranged in a direction orthogonal to the optical axis direction of the image pickup means, and the light from these illuminating devices emits the electronic component and the electronic component. The position of the electronic component and the substrate can be grasped by taking in the reflected light that has been irradiated and reflected on the substrate into the image pickup means via a beam splitter (half mirror) or the like.

[0003]

According to the above structure, the electronic parts and the board are arranged so that the positional error of the electronic parts and the board can be further reduced. The light radiated to a portion of metal or the like having a relatively high rate may be reflected and reach the other electronic component side, which causes a problem that the imaging information on the electronic component side is erroneously recognized. In order to avoid this, a light blocking member such as a shutter is arranged on both sides of the beam splitter so that only one of the light from the substrate and the light from the electronic component that enters the beam splitter is allowed to enter. In order to achieve this, it is possible to drive two light blocking members. However, since the light from the substrate and the electronic components cannot be captured all at once, not only can they not be quickly aligned, A driving device for driving the light blocking member is required, and there is a disadvantage that the entire device becomes large, which is difficult to implement. Further, there are other disadvantages in the case where two common objects, that is, the substrate 2 and the electronic component 1 are imaged by the common image pickup means as described above, which will be described. First, in FIG. 3, the total amount of light emitted from one (lower) illuminating means 6 to the substrate 2 is 100, and the reflectance of the substrate 2 is 100% (depending on the object).
Assuming that 100 lights reach point A in the figure. A
The light that reaches the point is divided into two directions, that is, the upper direction and the right direction in the figure, and proceeds. That is, it is divided into light L1 that travels straight in the same direction as the direction of light until reaching point A, and light L2 that travels after being reflected toward the total reflection mirror 10 side. At this time, the light L1, L2
Are approximately 50 light quantities (100 to 50).
Decays to). The 50 lights that hit the total reflection mirror 10 are reflected and reach the point A again. Pass point A 5
The light of 0 is divided into light L3 that travels straight in the same direction and light L4 that travels toward the substrate 2 side. At this time, the amounts of light L3 and L4 are approximately 25 (attenuated from 50 to 25). That is, the amount of 100 light emitted from the illuminating means 6 from the lower side to the substrate 2 is attenuated to the amount of 25 light when it reaches the image pickup means 4 via the beam splitter 9. On the other hand, in FIG. 4, the total amount of light emitted from the other (upper) illuminating means 5 to the electronic component 1 is 1
Assuming that the reflectance of the electronic component 1 is 100% (it varies depending on the object), 100 lights reach the point A in the figure. The light that has reached the point A is divided into two directions, that is, the lower direction and the left direction in the figure, and advances. That is, it is divided into light La that travels straight in the same direction as the light that reaches the point A and light Lb that travels after being reflected toward the imaging means 4. At this time, the lights La and Lb each have an amount of light of about 50 (attenuated from 100 to 50). That is, it means that 100 amount of light emitted from the upper illuminating means 5 to the electronic component 1 is attenuated to almost 50 light when reaching the image pickup means 4 through the beam splitter 9. At this time, the brightness of the light L3 when the reflected light from the substrate 2 reaches the image pickup means 4 and the light Lb when the reflected light from the other electronic component 1 reaches the image pickup means 4.
It is necessary to adjust the brightness to the same level for observation, and for that purpose, it is considered that the brightness ratio of the lighting means 6 on the substrate 2 side and the lighting means 5 on the electronic component 1 side is set to about 2: 1. To be For example, here, the brightness of the lighting unit 6 on the substrate 2 side is set to 2
00 and the brightness of the illuminating means 5 on the electronic component 1 side is 100, the lights L3 and L reaching the imaging means 4 respectively.
Both b have a brightness of about 50. However, in this state, of the reflected light from the substrate 2, the light L1 that reaches the electronic component 1 on the opposite side through the beam splitter 9 has a brightness of 100, and the brightness of the illuminating means 5 on the electronic component 1 side is 100. It is about the same as 100. At this time, if the surface of the electronic component 1 is close to a mirror surface, the image of the substrate 2 will be reflected in the electronic component. This is because not only the image on the electronic component side cannot be normally captured, but also the illumination means 5 on the electronic component 1 side is turned off and only the illumination means 6 on the substrate 2 side is turned on to capture only the image on the substrate 2. In this case, there is a problem that the image of the electronic component 1 is also captured at the same time. At this time, on the other hand, of the reflected light from the electronic component 1, the light La that reaches the substrate 2 on the opposite side through the beam splitter 9 has a brightness of 50, and the brightness of the illumination means 6 on the substrate 2 side. The amount of light is about a quarter of that of 200, which is less affected than the deterioration of the S / N ratio that can be imaged on the electronic component side described above. This problem is a structural problem that is determined by the difference between the upper and lower optical paths that reach the image pickup means 4 through the beam splitter 9 and how many times the light passes through the half mirror surface that splits the light. It cannot be avoided by changing the amount of light.

In view of the above-mentioned situation, the present invention is to solve the problem by providing an object recognition device capable of recognizing two objects accurately and quickly while avoiding the increase in size of the device. It is in the point of providing.

[0005]

In order to solve the above-mentioned problems, the present invention images a two objects between a first object and a second object opposed to the first object. A common imaging means is provided, and a first illumination means for illuminating the first object and a second illumination means for illuminating the second object are provided,
Providing blocking means for blocking at least a certain wavelength range of light reflected from the first object or the second object from illuminating the other second object or the first object, or To make the ratio of the amount of light attenuated by the reflected light from the first object to reach the image pickup means and the ratio of the amount of light attenuated by the reflected light from the second object until it reaches the image pickup means to be substantially the same. The object recognition device is configured by providing the light quantity adjusting means of 1 or the blocking means and the light quantity adjusting means. It is possible to prevent the imaging accuracy of the object from being lowered by blocking the light irradiated to the object by the illumination means from reaching the other object side by being reflected by the metal part of the object or the like. it can. Also, the first
By avoiding by the light quantity adjusting means that the light quantity reaching the image pickup means from the object and the light quantity reaching the image pickup means from the second object are attenuated by an optical instrument such as a beam splitter and different from each other, the image pickup accuracy for the object is lowered. You can avoid that. Moreover, by disposing the blocking means or the light quantity adjusting means, the first illuminating means and the second illuminating means are turned on one by one, or both are turned on at the same time, and two objects are turned on one by one or simultaneously (in one go). Not only is it possible to take an image, but it is possible to avoid an increase in the size of the device. As the light quantity adjusting means, by arranging a filter for attenuating light in the optical path on the side where a large amount of light is taken into the image pickup means,
This is advantageous in terms of device miniaturization and cost. Similar to the light quantity adjusting means, it is advantageous to use a filter for the blocking means in terms of downsizing and cost of the apparatus.

The first object is an electronic component, and the second object is
An object is a board on which the electronic component is mounted, and it is possible to configure an optimum object recognition device for recognizing the positions of the electronic component and the board by the imaging unit.

The second illuminating means for illuminating the second object comprises a large number of light emitting diodes which emit red light, and the blocking means comprises a filter for blocking light traveling from the second object to the first object. At the same time, the wavelength range of the light to be blocked is set to a range including a wavelength range of 600 nm or more.

A beam splitter for reflecting the light from the first object and the light from the second object respectively in the directions of approximately 90 degrees by using the front and back reflecting surfaces, and the one reflecting surface of the beam splitter. In order to change the direction of the second reflected light, which is reflected by the beam splitter in the direction opposite to the reflected light by the beam splitter, by 180 degrees to the image pickup means, the one reflected first reflected light is taken into the image pickup means as it is. And a total reflection mirror arranged at a position facing the image pickup means.

By rotating the beam splitter, XY
By providing the beam splitter so that the position thereof can be freely changed in at least one of the Z-axis directions, even when two objects are imaged with their positions deviated from a predetermined position,
Only by rotating the beam splitter and changing the position of the beam splitter in at least one of the XYZ axis directions (two or three directions), the image can be corrected to an accurate position and an image can be picked up.

The first illuminating means is arranged between the first object and the image pickup means, and the second illuminating means is arranged between the second object and the image pickup means. However, a large number of light-emitting diodes are provided on a substantially umbrella-shaped substrate that has an opening for light insertion substantially in the center and has a tapered surface that expands toward the first object side or the second object side in the light insertion direction. By providing the ring shape in an annular manner, it is possible to increase the amount of light in a predetermined range, and particularly when the first object such as a small electronic component is mounted on the second object such as the substrate, the positions of both can be accurately detected. . or,
By using the light emitting diode as the lighting means, it is advantageous in terms of power consumption and heat generation as compared with other lighting means such as a halogen lamp. Further, the light emitting diode can be used stably because the light quantity does not change greatly with the passage of time unlike a halogen lamp. Further, the halogen lamp has a short life and deteriorates and darkens with the passage of time, but the life of the light emitting diode is dramatically long and the deterioration speed is slow. Further, the light emitting diode is strong in switching operation and can easily turn on and off the light instantaneously by strobe.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a position recognition device which is an example of the object recognition device of the present invention. This position recognition device is configured to recognize the positions of two objects, an electronic component (semiconductor chip) 1 that is a first object and a substrate 2 that is a second object for mounting the electronic component 1. ing. That is, the conversion unit 3 that is arranged between the electronic component 1 and the substrate 2 that are opposed to each other and that converts the reflected light from them into a direction orthogonal to their optical axes, and the light from the conversion unit 3. A telecentric lens (other lens may be used) 4 arranged so that its optical axis is along a direction orthogonal to the reflected light, and an electronic component 1 for illuminating the electronic component 1. And a second illuminating means 6 arranged between the substrate 2 and the converting section 3 to illuminate the substrate 2, and position recognition is provided. Configure the device. An image pickup means 7 is composed of the conversion unit 3, the telecentric lens 4, and a CCD camera (not shown) mounted on the base end of the telecentric lens 4. Here, the position recognition device for confirming the mounting position of the electronic component 1 on the substrate 2 is shown, but an object recognition device used for inspection of a scratch on the substrate 2 or the electronic component may be used. Further, a control means (not shown) for controlling the image obtained by the CCD camera by an image processing device (not shown) so as to automatically eliminate the positional deviation based on the image-processed information. ) May be provided, or the processed image may be displayed on a monitor or the like to visually judge whether or not there is a positional shift, and the positional shift may be eliminated by an artificial switch operation or the like. Good. K shown in FIG.
Is the optical axis of the telecentric lens 4.

Although not shown in FIG. 1, the electronic component 1 is gripped by, for example, a robot hand or the like.
1 and the substrate 2 is also moved to a predetermined position shown in FIG. 1 by a gripping means (not shown) so that these two objects can be held at the predetermined positions.
Then, as described above, the positions of the electronic component 1 and the substrate 2 are recognized by the position recognizing device, and the relative positional deviation of these two objects is automatically or automatically detected by the electronic component 1 or the substrate 2 or both of them using the robot or the like. The position recognition device is retracted to a position where it does not interfere with the electronic component 1 and the substrate 2, and the electronic component 1 is mounted on the substrate.

Since the two illuminating means 5 and 6 have the same structure, only one illuminating means 5 will be described. As shown in FIG. 2, a casing 5 having an opening 5A having a circular outer shape at the center (may be slightly displaced).
A substantially umbrella-shaped substrate 5D having a tapered surface 5C that expands toward the electronic component 1 side in the light insertion direction is disposed in B, and a large number of light emission in a row (annular) along the circumferential direction on the substrate 5D. The illuminating means 5 is configured by attaching the diode 5E. Besides arranging the light emitting diodes 5E in one row, a plurality of rows may be provided in the light insertion direction to increase the irradiation light amount. In addition, the substrate 5D is formed in a substantially umbrella shape having a tapered surface 5C that becomes wider toward the electronic component 1 side, so that the light emitting diodes 5 are arranged in a row.
Even if E is arranged, it is not only possible to efficiently illuminate only the narrow part (main part) required for alignment, but it is also advantageous in achieving a thin and compact illumination means. In the case of uniformly illuminating the entire surface of the substrate 2, an illuminating means other than that described above is used. The light emitting diode 5E and the light emitting diode of the lower illumination means 6 are configured to emit an orange color close to red, that is, an orange color having a central wavelength of 610 nm, and particularly 610n.
Although it is configured to emit a red color of m or more, it may be configured to emit a color having a center wavelength of less than 610 nm, for example, a green color, a white color, a blue color, or the like. When, for example, white is used as the light emission color of the light emitting diode, there is an advantage that stains adhering to the surface of the substrate 2 can be clearly imaged, and when blue is used, BGA solder is used. In the ball inspection, the gold pattern on the background can be erased to make only the solder balls stand out, and an accurate image can be obtained by selecting the illumination color according to the shape, state, color, and imaging purpose of the object. You can Although the illuminating means 5 and 6 are configured to have an annular shape, it is advantageous in terms of downsizing, but a large number of light emitting diodes are arranged so as to irradiate from a direction orthogonal to the irradiation surface of the object, It may be a so-called coaxial type illumination means in which the light emitted from the light emitting diode is irradiated by a half mirror to change the irradiation direction and irradiates an object.

As shown in FIG. 1, a filter 8 as a blocking unit for blocking light having a wavelength of 600 nm or more is arranged between the first illuminating unit 5 and the converting unit 3. By arranging the filter 8 in this manner, as described above, the irradiation light that emits an orange light having a central wavelength at 610 nm from the second illuminating means 6 that illuminates the substrate 2 is applied to the substrate 2 or the like. It is possible to block the reflected light reflected by the metal part so as not to reach the electronic component 1 side, and it is possible to satisfactorily image the outline of the electronic component 1, which is effective in performing alignment. It should be noted that although some of the light from the first illuminating means 5 reflected by the electronic component 1 is blocked by the orange light when passing through the filter 8, a sufficient amount of light can be captured by the image capturing means 4. You can do it, it doesn't matter. By thus setting the attenuation rate to be about 50% like the filter 8X described later by blocking a part of the orange light, the amounts of light from the two objects are almost the same. Further, there is an advantage that the ratio of the amount of light reflected from the substrate 2 reaching the electronic component 1 can be reduced, and the imaging accuracy of the imaging unit 4 can be further improved. That is, in FIG. 3 and FIG.
The filter 8X (not shown) is attached to the beam splitter 9
When the brightness of the illuminating means 6 on the side of the substrate 2 and the brightness of the illuminating means 5 on the side of the electronic component 1 are both set to 200, the board 2 and the electronic component 1 are respectively inserted. Light L3, L reflected from the light and reaching the imaging means 4
The brightness of both b is about 50, and the image pickup means 4
In this way, both images can be captured well,
In this state, of the reflected light from the substrate 2 that passes through the beam splitter 9 and reaches the electronic component 1 on the opposite side, the brightness of the light L1 and the reflected light from the electronic component 1 that passes through the beam splitter 9 and is on the opposite side. Both of the brightness of the light La reaching the substrate 2 is about 50, which is improved to about 1/4 of the light amount of the light emitted from each illumination means. Further, when the illuminating means 5 and 6 located above and below can be used by changing the color, the side where the optical path to the imaging means 4 is short and the number of times of passing through the half mirror surface is small, that is, electronic parts in FIG. Between the illuminating means 5 and the beam splitter 9 on the side, the side where the optical path to the imaging means 4 is long and the number of times of passing through the half mirror surface is large, that is, the substrate 2
It is effective to install a filter that blocks the irradiation light of the side illumination means 6 and transmits the irradiation light of the illumination means. This is because the difference in the amount of light when the reflected light from the electronic component 1 side reaches the substrate 2 side and the amount of light from the illumination means 6 that irradiates the substrate 2 side can be ensured to be four times the original amount. The reflected light from the side 1 is not completely blocked, and further, the irradiation light from the lighting means 5 on the electronic component 1 side is blocked between the lighting means 6 on the substrate 2 side and the beam splitter 9 to illuminate. If a filter that transmits the irradiation light of the means 6 is installed, the interference due to the reflected light on the electronic component 1 side and the substrate 2 side is eliminated, and even if the respective reflecting surfaces are mirror surfaces, they are independent of each other (one side). It is possible to take images even at the same time.

When the illuminating means 5 located on the upper side emits green and the illuminating means 6 located on the lower side emits red, 600 nm or more is provided at the position of the filter 8 arranged in FIG. It is sufficient to use a filter that cuts light of the wavelength. Although only the filter 8 may be provided, in order to completely prevent the reflection of light from the top and bottom, a filter for cutting light having a wavelength of 600 nm or less is further provided between the lower illumination means 6 and the beam splitter 9. Good. In short, when the upper and lower illumination means 5 and 6 are configured to emit red light,
By attenuating the light from the upper side to the imaging means 4,
A filter is used as a light quantity adjusting means for adjusting the quantity of light so that the quantity of light coming into the image pickup means 4 from the two objects 1 and 2 is almost the same, and the illumination means 5 located on the upper side is set to green. When the illuminating means 6 located on the lower side emits red light, the filter is used as means for blocking light (preventing reflection). A beam splitter (half mirror) can be used instead of the filter, but it is disadvantageous in terms of space.

The filter 8 is configured to block light in a specific wavelength range, but by attenuating light from the upper side to the image pickup means 4, the two objects 1 and 2 enter the image pickup means 4. You may comprise the light quantity adjustment means which adjusts the quantity of light so that the quantity of light may be made substantially the same. As shown in FIGS. 3 and 4 and as described above, of the light entering the image pickup means 4, the light from the upper electronic component 1 side is twice as much as the light from the lower substrate 2 side. It is bright,
Filter 8X (Fig. 1) with attenuation set to 50%
(Refer to FIG. 2) is arranged between the electronic component 1 and the beam splitter 9 so that the imaging means 4 can be operated from the two objects 1 and 2.
The amount of incoming light may be made substantially the same. The attenuation factor of the filter 8X will be changed according to the difference between the two light amounts.

The conversion unit 3 is 45 in the optical insertion direction.
Beam splitter (half mirror) tilted by 9 degrees
Of the light reflected by the beam splitter 9, a total reflection mirror 10 for reflecting the light traveling toward the opposite side of the telecentric lens 4 by 180 degrees and returning it to the telecentric lens 4. Other configurations may be used. The movement of the light from the electronic component 1 and the substrate 2 entering the telecentric lens 4 will be described. As shown in FIG. 1, the light from the electronic component 1 includes the aperture 5A of the first illuminating means 5 and the filter 8 And then reflected by one surface of the beam splitter 9 to change the direction of light by 90 degrees and enter the telecentric lens 4. Further, the light from the substrate 2 passes through the opening 6A of the second illuminating means 6 and is reflected by the other surface of the beam splitter 9, and the direction of the light is changed by 90 degrees so that it is 180 degrees with respect to the telecentric lens 4. Move to the other side.
Then, the light is reflected by the total reflection mirror 10 and passes through the beam splitter 9 to enter the telecentric lens 4. Light from the substrate 2 is blocked by the filter 8 and therefore does not reach the electronic component 1 side. The two lights incident on the telecentric lens 4 are processed by the image processing device as described above.

Although not shown, by rotating the rotating shaft of the beam splitter 9 by using a driving mechanism (not shown), at least one of the XYZ axis directions (there may be two or three directions). The position of the beam splitter 9 can be changed. In this way, the beam splitter 9 is moved in one direction or two directions or three directions in the XYZ axis directions.
By changing the position in the direction, the electronic component 1 can be positioned with respect to the substrate 2 with high accuracy, and particularly, the mounting accuracy can be improved. The beam splitter 9 is rotated by rotating the beam splitter 9.
The total reflection mirror 10 which is integrated with the above will be similarly repositioned.

[0019]

According to the first aspect of the present invention, the blocking means prevents the light emitted from the illumination means from illuminating the object from being reflected by the metal part of the object and reaching the other object side.
By making the amounts of light from the two objects substantially equal by the light amount adjusting means, it is possible to avoid deterioration of the imaging accuracy of the objects, and to perform inspection work and electronic component mounting work quickly and efficiently. It is possible to provide an object recognition device capable of performing the above. By combining both the blocking unit and the light amount adjusting unit, the imaging accuracy can be further enhanced. Moreover, not only can the two objects be simultaneously (immediately) imaged simply by disposing the blocking means or the light quantity adjusting means, but it is also possible to prevent the apparatus from increasing in size. By configuring the blocking means or the light amount adjusting means with a filter, it is advantageous in terms of downsizing and cost of the device.

According to the sixth aspect of the present invention, by rotating the beam splitter and arranging the beam splitter so that the position can be freely changed in at least one of the XYZ axis directions, the positions of the two objects are deviated from the predetermined positions and the images are captured. XYZ by rotating the beam splitter even when
By simply changing the position in at least one of the axial directions, it is possible to correct the image to an accurate position by the image pickup means, and to take an image.
The imaging work can be performed accurately and efficiently.

According to the invention of claim 7, the first illuminating means is arranged between the first object and the image pickup means, and the second illuminating means is arranged between the second object and the image pickup means. Each of the means has a large number of light emitting diodes on a substantially umbrella-shaped substrate that has an opening for light insertion substantially at the center and has a tapered surface that expands outward toward the first object side or the second object side in the light insertion direction. It is possible to increase the amount of light in a predetermined range by providing the first and second electronic components such as small electronic parts.
When the object is mounted on the second object such as the substrate, the positions of the both can be detected with high accuracy, and the object recognition device can have high reliability. Further, by using the annular illumination means, there is an advantage that it can be made more compact than the coaxial illumination means. Further, by using the light emitting diode as the light emitting body, it is more advantageous in terms of power consumption and heat generation than the halogen lamp, and is advantageous in terms of use. Further, the light emitting diode can be used stably because the light amount does not change greatly with the passage of time unlike the halogen lamp. Further, the halogen lamp has a short life and deteriorates with time to become dark, but the life of the light emitting diode is dramatically long and the deterioration speed is slow, which is advantageous in terms of use. Further, the light emitting diode is strong in switching operation, and can easily turn on and off the strobe light which cannot be performed by the halogen lamp, thereby saving labor.

[Brief description of drawings]

FIG. 1 is a schematic explanatory diagram of an object recognition device (position recognition device).

2 shows a lighting means, (a) a longitudinal side view thereof, FIG.
(B) is a plan view of it.

FIG. 3 is an explanatory diagram showing a state in which light from a substrate enters an image pickup unit.

FIG. 4 is an explanatory diagram showing a state until light from an electronic component enters an image pickup unit.

[Explanation of symbols]

1 electronic component (first object) 2 substrate (second object) 3 converter 4 Telecentric lens 5 First lighting means 5A opening 5B Casing 5C Tapered surface 5D substrate 5E light emitting diode 6 Second Illumination Means 7 Imaging Means 8 filters (blocking means) 8X filter (light intensity control means) 9 Beam splitter 10 Total reflection mirror K optical axis L1-L4, La, Lb light

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F065 AA03 AA07 AA20 AA49 CC01                       CC25 DD02 DD06 DD11 FF04                       GG07 GG14 GG17 GG22 GG23                       JJ03 JJ26 LL12 LL24 LL26                       LL46 LL59 NN20 QQ31                 5E313 AA02 AA11 CC04 DD03 DD13                       EE03 EE24 FF24 FF26 FF28                       FF29 FF33 FF40 FG02

Claims (7)

[Claims] 1. A first imaging device for illuminating the first object, wherein a common imaging means for imaging the two objects is provided between the first object and a second object located opposite to the first object. Illumination means and second illumination means for illuminating the second object are provided, and light of at least a certain wavelength range of light reflected from the first object or the second object is the other second object or the first object. A blocking means for blocking the irradiation of the object is provided, or the ratio of the amount of light attenuated by the reflected light from the first object before reaching the imaging means and the reflected light from the second object Providing a light quantity adjusting means for making the ratio of the light quantity attenuated until reaching the means substantially the same,
Alternatively, the object recognizing device is provided with the blocking unit and the light amount adjusting unit. 2. The first illuminating means and the second illuminating means are turned on one by one, or both of them are turned on at the same time, so that mainly the first object only, or mainly the second object only, or the first object only.
The object recognition device according to claim 1, wherein reflected light from both the object and the second object can reach the image pickup unit. 3. The first object is an electronic component, the second object is a substrate for mounting the electronic component, and the image pickup means recognizes the positions of the electronic component and the substrate. The object recognition device according to claim 1. 4. The filter for blocking the light traveling from the second object to the first object, wherein the second lighting means for illuminating the second object comprises a plurality of light emitting diodes for emitting red light. The object recognition apparatus according to claim 1, wherein the object recognition device is configured to include a wavelength range of the light to be blocked and a range including a wavelength range of 600 nm or more. 5. A beam splitter for reflecting light from the first object and light from the second object in directions of approximately 90 degrees using front and back reflecting surfaces, and a reflecting surface of one of the beam splitters. One of the first reflected light reflected by the beam splitter is directly taken into the image pickup means, and the other second reflected light reflected by the beam splitter in the opposite direction to the reflected light is changed in direction by 180 degrees to the image pickup means. The object recognition device according to claim 1, further comprising: a total reflection mirror arranged at a position facing the imaging means. 6. The beam splitter is rotated for X
The object recognition device according to claim 5, wherein the beam splitter is provided so that its position can be changed in at least one of the YZ axis directions. 7. The first illuminating means is arranged between the first object and the image pickup means, and the second illuminating means is provided with the second illuminating means.
It is arranged between an object and the image pickup means, and each of the two illumination means is provided with an opening for light insertion substantially at the center,
In the light insertion direction, the first object side or the second object side, respectively.
The object recognizing device according to claim 1, wherein a large number of light emitting diodes are annularly provided on a substantially umbrella-shaped substrate having a tapered surface that becomes wider toward the object side.