JP2003049197A - Agent for cleansing off and method for cleansing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an agent for cleaning off, which can surely remove organic stains such as oils and solder flux residues adhered to the surfaces of parts such as electronic parts or mechanical parts after soldered and slightly forming an oxidative corrosion on the metal surface of these parts. SOLUTION: This agent for cleaning includes at least one kind of anticorrosive agents selected from the group comprising a) 3-methoxy-3-methyl-1-butanol, b) N-methyl-2-pyrrolidone and c) benzotriazole, benzothiazole, 2- mercaptobenzothiazole, 2-mercaptbenzimidazole and thiourea, and d) 1-methyl-4- isopropenyl-1-cyclohexene modified to be soluble in water, as the essential components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning / removing agent and a cleaning method used for removing a solder flux residue adhered to the surface of a component after soldering various electronic components such as a printed wiring board and an IC.

[0002]

2. Description of the Related Art Generally, in the soldering of electronic parts, a rosin, an active rosin, or a rosin is used as a solder flux for cleaning the joint and preventing oxidation of the joint.
Organic fluxes such as stearic acid, oleic acid, aniline hydrochloride, urea, ethylenediamine are widely used.
However, these solder fluxes remain on the surface of the component after soldering as a form as it is or as a modified product generated by carbonization or decomposition by heat, which may cause circuit disconnection or conductivity failure, etc. It is important to remove the solder flux residue containing the substance. In addition, organic contaminants such as fats and oils are often attached to the surfaces of electronic components and mechanical components, and it is necessary to wash and remove the contaminants depending on the application.

Conventionally, fluorine-based solvents and chlorine-based solvents have been generally used for cleaning and removing solder flux residues and organic stains. However, in recent years, these solvents are becoming unusable due to ozone layer depletion, toxicity problems, and the like, so there is a strong demand for new cleaning and removing agents that can replace these solvents.

As an example of the cleaning / removing agent which does not use the above-mentioned fluorine-based solvent or chlorine-based solvent, Japanese Patent Laid-Open No. 7-3294 discloses an alcohol solvent having 3 or more carbon atoms, a hydrocarbon solvent, and a basic substance. 3 with quaternary ammonium base
A cleaning composition consisting of the components is shown. However, although this cleaning composition has a cleaning effect on solder flux residues and organic stains, its cleaning and removing effect is not sufficiently satisfactory.

However, as a new cleaning / removing agent that can replace the above-mentioned fluorine-based solvent or chlorine-based solvent, not only is it excellent in the removability and cleaning property of solder flux residues and organic stains, but also oxidative corrosion of metals. It is also important to be able to control. This is because electronic parts and mechanical parts are often re-soldered after cleaning and removing the solder flux residue and organic stains described above. This is because the wettability is lowered, resulting in a decrease in work efficiency in the next soldering and a soldering failure.

In view of the above situation, the inventors of the present invention have previously demonstrated excellent cleaning and removability with respect to organic contaminants such as solder flux residue and oil and fat adhered to the surface of components after soldering of various electronic components and mechanical components. Japanese Patent Application No. 2000-1 as a material capable of exhibiting oxidative corrosion with respect to a metal
99274, 3-methoxy-3-methyl-1.
-A cleaning agent containing butanol and N-methyl-2-pyrrolidone as main components, and 3-methoxy-3-methyl-
A cleaning remover containing 1-butanol and a water-soluble thioglycollate as main components is proposed.

In the present invention, the above proposed cleaning and removing agent is further improved as a prior art, so that the solder flux residue and the organic dirt adhered to the surface of the object to be cleaned can be removed more efficiently and reliably, and the object to be cleaned can be removed. It is an object of the present invention to provide a cleaning / removing agent capable of reliably suppressing the oxidative corrosion of the metal part of.

[0008]

In order to achieve the above object, the cleaning and removing agent according to claim 1 of the present invention comprises a) 3-methoxy-3-methyl-1-butanol and b) N-methyl. -2-pyrrolidone and c) benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-
At least one corrosion inhibitor component selected from the group consisting of mercaptobenzimidazole and thiourea, and d) water-solubilization 1
-Methyl-4-isopropenyl-1-cyclohexene is contained as an essential component.

As a preferred embodiment of the cleaning / removing agent according to claim 1, in claim 2, the weight ratio of the a component / b component is 1
The composition is in the range of 1/89 to 94/6, and in claim 3, the composition is such that the c component is contained in the range of 0.05 to 6 wt% with respect to the total amount of the a component and the b component in the cleaning and removing agent. According to claim 4, the component a and b in the cleaning and removing agent are included.
The composition in which the d component is contained in the range of 10 to 50% by weight with respect to the total amount of the components, and in the claim 5, PH is 5.8 to 8.6.
The configurations within the range are adopted respectively. And
The cleaning method according to claim 6 is characterized in that the solder flux and its modified products remaining on the surface of the component after soldering are removed by cleaning using the cleaning / removing agent according to any one of claims 1-5. There is.

On the other hand, for the same purpose, the cleaning and removing agent of claim 7 is a) 3-methoxy-3-methyl-1-butanol, b) N-methyl-2-pyrrolidone, c) benzotriazole, benzo. Thiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole,
At least one corrosion inhibitor component selected from the group of thiourea and e) lactic acid ester are contained as essential components.

As a preferred embodiment of the cleaning / removing agent of claim 7, in claim 8, the weight ratio of the component a / component b is 1
The constitution in the range of 1/89 to 94/6, and in the constitution of claim 9, the c component is contained in the range of 0.05 to 6% by weight with respect to the total amount of the a component and the b component in the cleaning and removing agent. According to claim 10, the e component is 10 to 60% by weight relative to the total amount of the a component and the b component in the cleaning and removing agent.
In the structure included in the range, in claim 11, PH is 5.8 to.
Each of the configurations within the range of 8.6 is adopted. And the cleaning method according to claim 12 is the method according to claim 7 to
It is characterized in that the solder flux and its modified product remaining on the surface of the component after soldering are removed by cleaning with any one of the cleaning and removing agents of No. 11 and No. 11.

Further, for the same purpose, the cleaning and removing agent according to claim 13 is a) 3-methoxy-3-methyl-1-butanol, b) N-methyl-2-pyrrolidone, c) benzotriazole, benzo. Thiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, at least one corrosion inhibitor component selected from the group of thiourea, d) water-solubilized 1-methyl-4-isopropenyl-1-cyclohexene, and e) Lactate ester is included as an essential component.

A preferred embodiment of the cleaning / removing agent according to claim 13 is the structure according to claim 14, wherein the weight ratio of the a component / b component is in the range of 11/89 to 94/6.
In the cleaning and removing agent, the c component is contained in the range of 0.05 to 6% by weight with respect to the total amount of the a and b components. The composition is contained in the range of 10 to 50% by weight based on the total amount, and in the cleaning and removing agent, the a
The e component is 10 to 60 relative to the total amount of the component and the b component.
%, The composition contained in the range of 18% by weight, and the composition having a PH in the range of 5.8 to 8.6 are adopted. The cleaning method according to claim 19 removes the solder flux and its modified products remaining on the surface of the component after soldering by cleaning using the cleaning / removing agent according to any one of claims 13-18. It has a feature.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The first cleaning / removing agent according to the present invention is, as described above, a) 3-methoxy-3-methyl-1.
-Butanol and b) N-methyl-2-pyrrolidone,
c) at least one corrosion inhibitor component selected from the group of benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, thiourea, and d) water-solubilized 1-methyl-4-isopropenyl-1. -It contains cyclohexene as an essential component. In addition, the second cleaning / removing agent according to the present invention is the same as the above-mentioned first cleaning / removing agent in place of the component d) e).
It contains lactic acid ester as an essential component.
Furthermore, the third cleaning and removing agent according to the present invention is the above-mentioned a, b,
It essentially contains the five components c, d, and e.

By using these first to third cleaning / removing agents, a new oxide film due to oxidative corrosion does not form on the metal part of the object to be cleaned, and it adheres to the surface of the electronic component after soldering. It has been found that it is possible to efficiently and reliably clean the organic flux such as the solder flux residue (including the modified product generated by carbonization and decomposition due to heat, etc.) and oils and fats. Further, these first to third cleaning and removing agents are
Since the blended components are water-soluble, they have a high flash point and low toxicity, so they are excellent in safety during handling.

Of the three components a, b, and c commonly used for the first to third cleaning / removing agents, a-component 3-methoxy-3-methyl-1-butanol and b-component N are used. -Methyl-2-pyrrolidone is a compound that is liquid at room temperature, and functions as a solvent that exerts a dissolving power for rosin, higher fatty acids, fats and oils that are often used in solder flux, When the cleaning product is immersed and subjected to cleaning treatment such as ultrasonic cleaning, the above-mentioned organic stains are strongly dissolved by the synergistic action of both components, and both are water-soluble. As a result, the dirt is easily removed from the surface of the object to be cleaned in a dissolved state.

However, the a-component 3-methoxy-3-methyl-1-butanol has a dissolving power for rosin, higher fatty acids, fats and oils as described above, but its dissolving power is b.
Since it is weaker than the component N-methyl-2-pyrrolidone, component a alone is not sufficient to completely dissolve and remove the organic stains. On the other hand, the component b, N-methyl-2-pyrrolidone, which has a strong dissolving power, has a slight oxidative corrosiveness with respect to the metal, and therefore it also causes troubles by itself. Therefore, in the present invention,
By using both a and b components together, the advantages of both are utilized, and in order to reliably contain the oxidative corrosiveness of the component b against metals, a c component corrosion inhibitor is added to improve the dissolution and removal of organic stains. As described above, in the first cleaning / removing agent, the water-solubilized 1-methyl-4-isopropenyl-1-cyclohexene of the component d is used, and in the second cleaning / removing agent, the lactic acid ester of the component e is added. In the cleaning and removing agent of No. 2, both d and e components are contained as essential components.

As described above, the component c corrosion inhibitor is selected from the group consisting of benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole and thiourea. Triazole is most suitable because it is excellent in the effect of preventing discoloration and inhibiting corrosion of non-ferrous metals such as copper, brass and solder as compared with other components of corrosion inhibitor.

The component d) 1-methyl-4-isopropenyl-used as an essential component in the first and third cleaning and removing agents.
1-Cyclohexene has a boiling point of 170 to 1 obtained by fractional distillation of orange oil, lemon oil, mandarin oil, camphor white oil, etc.
It is a colorless to slightly yellow liquid at 80 ° C, which is an organic stain,
In particular, it has an excellent effect of dissolving and removing flux stains, and functions to synergistically enhance the cleaning power of the cleaning / removing agent in cooperation with the above-mentioned components a, b or further component e.

Further, since this 1-methyl-4-isopropenyl-1-cyclohexene has a preferable refreshing lemon odor or orange odor, it has an effect of masking other odors, and particularly, the flux generated during soldering. It has the advantage of mitigating the odor of and releasing an aroma that gives comfort to the surroundings. On the other hand, in recent years, people's hygiene orientation has become stronger and it is not uncommon to perform antibacterial treatment on the housing of electronic devices, but since 1-methyl-4-isopropenyl-1-cyclohexene has an antibacterial action, If the electronic parts are washed with the cleaning and removing agent described above, the electronic parts can be subjected to antibacterial treatment at the same time. Therefore, not only the conventional case of the electronic device but also the inside of the electronic device can be antibacterial specifications, and the hygiene-oriented answer can be achieved. You can

However, since 1-methyl-4-isopropenyl-1-cyclohexene itself has poor hydrophilicity, it is used in a water-solubilized form in the present invention. The means for water solubilization is not particularly limited, but as a suitable water solubilization method, 1-methyl-4-isopropenyl-1-cyclohexene is added to polyoxyalkylene alkyl ether, alkyl polyglucoside, polyoxyethylene alkyl ether, polyoxy A method of mixing a nonionic surfactant such as ethylene glyceryl alkyl ether, alkylaminoxide, polyoxyalkylene block polymer, and polyoxypropylene diglyceryl ether with 3-methoxy-3-methyl-1-butanol as a solvent is Recommended. In addition, since the nonionic surfactant has a function of lowering the surface tension, by using water-solubilized 3-methoxy-3-methyl-1-butanol,
There is an advantage that the cleaning power of the cleaning / removing agent is further improved.
Further, since 3-methoxy-3-methyl-1-butanol is also the above-mentioned component a, 1-methyl-4-isopropenyl-1-cyclohexene solubilized with it is used as the a- It has an advantage that it can be easily mixed uniformly with other compounding ingredients including the ingredients.

On the other hand, examples of the lactic acid ester of the component e used as an essential component in the second and third cleaning and removing agents include methyl lactate, ethyl lactate, isopropyl lactate, butyl lactate and the like. However, lactic acid ester has a hydroxyl group and an ester group in the molecule, and thus is well miscible with water and most solvents, and also has a wide range of organic substances such as cellulosic compounds, natural and synthetic resins, and synthetic fibers. It is a water-soluble solvent that has an excellent dissolving power for a.
It functions synergistically to enhance the cleaning power of the cleaning / removing agent in cooperation with the component b, or further with the component d.

All of the lactate esters have an LD50 of 2000 mg / kg or more (50% for ethyl lactate).
00 mg / kg or more), and since ethyl lactate and butyl lactate are extremely safe substances as approved by the FDA for food use, by blending them,
It is possible to reduce toxicity while enhancing the cleaning power of the cleaning / removing agent. In addition, lactate has the advantage that it is biodegradable and does not impose a burden on the environment.

In the first to third cleaning and removing agents, the compounding ratio of a-component 3-methoxy-3-methyl-1-butanol and b-component N-methyl-2-pyrrolidone is a component / a.
The weight ratio of the b component is preferably in the range of 11/89 to 94/6. If the a component is too small, the oxidative corrosion property to the metal appears, and if the b component is too small, the dissolving power for the organic stain is insufficient. become.

The amount of the corrosion inhibitor component of the component c in the first to third cleaning / removing agents is in the range of 0.05 to 6% by weight based on the total amount of the components a and b. If the amount is too small, a sufficient corrosion inhibiting action is not exhibited, and if the amount is too large, the corrosion (oxidation) inhibiting action is not further increased, resulting in high cost.

Further, the compounding amount of 1-methyl-4-isopropenyl-1-cyclohexene of the component d in the first and third cleaning and removing agents is 10 to 50% by weight based on the total amount of the components a and b. The range is preferably in the range of%, and when the amount is too small, the improvement of the detergency is insufficient and the odor masking effect is also lowered, and when the amount is too high, the removability (rinsability) of the detergent upon washing with water is lowered. At the same time, the smell of lemon or orange becomes too strong.

On the other hand, the content of the lactic acid ester as the component e in the second and third cleaning / removing agents is preferably 10 to 60% by weight based on the total amount of the components a and b, and is too small. It is not possible to obtain a sufficient improvement in detergency.
Further, when the content of the e component exceeds 60% by weight, the flash point of the cleaning / removing agent becomes 73 ° C. or lower, so that more careful handling is required rather than the fourth type third petroleum. It is not desirable because it will be a Type 4 second oil.

The cleaning operation using these first to third cleaning / removing agents is performed by simply immersing the electronic parts, mechanical parts, etc. soldered using the organic solder flux in the cleaning / removing agent for a required time. Often, this causes the flux residue remaining on the surface of the component to dissolve in the scavenger along with other organic contaminants. Then, in this immersion, if ultrasonic cleaning is particularly adopted, the dirt containing the flux residue can be more surely dissolved and removed in a short time. In addition, by performing water washing after the immersion, the cleaning / removing agent containing dirt can be completely removed from the surface of the component. Note that these cleaning / removing agents include a diluting liquid form in which water is added to the above-mentioned essential components, but the detergency is reduced by the amount of dilution.

Further, these first to third cleaning / removing agents are
In either case, the pH of the liquid is preferably set in the range of 5.8 to 8.6. That is, by setting the above PH range, in addition to being able to more reliably prevent the oxidative corrosion of the metal surface of the object to be cleaned during the cleaning process, the stability of the quality becomes high, so storage and management become easy, Further, the waste liquid after cleaning the electronic parts can be made to meet the drainage water quality standard. It should be noted that this PH may be set empirically by adjusting the type and the quantitative relationship of the compounding ingredients in each cleaning and removing agent.

[0030]

EXAMPLES The present invention will be specifically described below with reference to examples.

Production Example 1 3-methoxy-3-methyl-1-butanol as the component a, N-methyl-2-pyrrolidone as the component b, benzotriazole as the component c, and 1-methyl- as the component d.
4-isopropenyl-1-cyclohexene was used respectively, and the mixture was put into a stainless steel tank at the compounding ratio (parts by weight) shown in Tables 1 and 2 below, stirred and mixed, and then taken out while being filtered and washed to remove No1 to No51. I got an agent. The pH of these cleaning / removing agents is 5.8 to 8.6.
Was in the range.

Production Example 2 The same a, b, and c components as in Production Example 1 and lactic acid ester as e component were used at the compounding ratios shown in Tables 3 and 4 below. No121
Was obtained. The pH of each of these cleaning and removing agents was in the range of 5.8 to 8.6.

Production Example 3 The same a, b, c and d components as in Production Example 1 and the same e component as in Production Example 2 were used at the compounding ratios shown in Tables 5 and 6 below, and the same as in Production Example 1. No122 ~ No18
A wash remover of 3 was obtained. The pH of each of these cleaning and removing agents was in the range of 5.8 to 8.6.

Cleaning and removing agent No. obtained in Production Examples 1 to 3
For No. 1 to No. 183, the removability of the flux residue when used for cleaning and the oxidative corrosiveness with respect to metals were tested. The results of these tests are shown in Tables 1 to 6 below. The test methods and evaluations for each item are as follows.

[Removability of flux residue] Copper plate (20 m
m × 70 mm × 1 mm) is coated with rosin flux on the surface and soldered (Sn 60%, Pb 40%) and left for about 24 hours to be the object to be cleaned. A second test was conducted, and the results were evaluated according to the following three grades. The second test is more difficult to remove the flux than the first test.

<First Test> The object to be cleaned is immersed in a cleaning and removing agent placed in an ultrasonic cleaning machine, the liquid temperature is maintained at 35 to 40 ° C., and ultrasonic cleaning is performed for 20 minutes. The removed object to be cleaned was rinsed with pure water for 5 seconds, immersed in isopropyl alcohol for dehydration, naturally dried, and then the flux residue was eluted with acetone, and the flux residue amount was determined from the mass difference before and after the removal test. .

<Second Test> Separately from the first test, the object to be cleaned was immersed in a cleaning / removing agent having a liquid temperature kept at 25 ° C. for 240 minutes (only immersion without ultrasonic cleaning). Rinse the object to be cleaned taken out with pure water for 5 seconds, immerse it in isopropyl alcohol to dehydrate it and let it naturally dry, then elute the flux residue with acetone, and obtain the flux residue amount from the mass difference before and after the removal test. It was

<Evaluation of Removability of Flux Residue> ⊚: No solder flux residue in both the first and second tests ○: No solder flux residue in the first test
Solder flux residue was present in the second test ..... Solder flux residue was present in both the first and second tests.

[Oxidative Corrosion to Metals] Each of a copper plate, a brass plate, a rolled steel plate and a solder was immersed in a cleaning / removing agent, allowed to stand at a liquid temperature of 20 to 25 ° C. for 5 days, and then taken out to remove an oxide film on the surface. Quantitative analysis was carried out by Auger electron spectroscopy, and the results were evaluated in the following two stages. A: No new oxide film. B: A new oxide film is formed.

[0040]

[Table 1]

[0041]

[Table 2]

From the results of Tables 1 and 2, the components a, b,
The cleaning / removing agent (No. 7 to 46) containing the c component and the d component exhibits dissolution and removability for the flux residue remaining on the surface of the copper plate after soldering, and particularly, the weight ratio of the a component / b component is 11/89. Cleaning / removing agent within the range of 94/6 (N
It is found that the flux residue can be completely removed according to No. 12 to 41). However, a cleaning agent (No 42 having a ratio of the b component in the weight ratio of the a component / b component of 90% or more (No 42
51 to 51) show good results with respect to the removability of the flux residue, but it is clear that the problem of oxidative corrosion of the metal surface occurs. The ratio of the component b in the weight ratio of component a / component b is 5% or less.
With the cleaning and removing agents 7 to 11, the flux residue was not completely removed, but No 1 to which the b component was not blended
It has been confirmed that the amount of residual flux residue is smaller than that of the cleaning and removing agent of No. 6.

Regarding the benzotriazole as the component c,
More than 0.05% by weight based on the total amount of a and b components (N
o13-16, 18-21, 23-26, 28-31,
33-36, 38-41), the oxidative corrosion resistance to the metal surface is suppressed, but when the ratio of the b component to the a component is too large (No 42 to 51), the effect of suppressing the oxidative corrosion property is not sufficient. I understand. Even if benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, or thiourea is used as a corrosion inhibitor for the component c, the suppression of oxidative corrosion on the metal surface is almost the same as when using benzotriazole. It is known that the effect can be obtained.

Then, water-solubilized 1-methyl-4- component d
For isopropenyl-1-cyclohexene, a,
When it is blended in an amount of 10% by weight or more based on the total amount of the component b, the removability of flux residue is further improved.

[0045]

[Table 3]

[0046]

[Table 4]

From the results of Tables 3 and 4, the components a, b,
Cleaning and removing agent containing components c and e (Nos. 59 to 11)
4) exhibits a dissolving and removing property with respect to the flux residue remaining on the copper plate surface after soldering, and in particular, a cleaning and removing agent (No 66 to 107) in which the weight ratio of a component / b component is in the range of 11/89 to 94/6. According to (), it is understood that the flux residue can be completely removed. However, with the detergents (No. 108 to 121) in which the proportion of the b component in the weight ratio of the a component / b component is 90% or more, good results are shown with respect to the flux residue removability, but the metal surface is oxidized and corroded. It is clear that this causes the problem of The ratio of the component b in the weight ratio of component a / component b was 5
%, The flux residue was not completely removed, but the flux residue remained less than the No. 52-58 cleaning remover containing no b component. It has been confirmed.

Regarding the benzotriazole as the component c,
0.05 wt% or more based on the total amount of the components a and b (No 60 to 65, 67 to 72, 74 to 79, 81 to 8)
6, 88 to 93, 95 to 100, 102 to 107), the oxidative corrosion property on the metal surface is suppressed, but when the ratio of the b component to the a component is too large (No.
It is understood that 108 to 121) do not have a sufficient effect of suppressing oxidative corrosion. Even if benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, or thiourea is used as a corrosion inhibitor for the component c, the suppression of oxidative corrosion on the metal surface is almost the same as when using benzotriazole. It is known that the effect can be obtained.

With regard to the lactic acid ester of the component e, if it is added in an amount of 10% by weight or more based on the total amount of the components a and b (No 67 to 72, 74 to 79, 81 to 86, 88).
~ 93, 95-100, 102-107), the removability of flux residue is further improved.

[0050]

[Table 5]

[0051]

[Table 6]

From the results of Tables 5 and 6, the components a, b,
Cleaning and removing agent containing c component, d component and e component (No. 12
Nos. 8 to 183) exhibit a dissolving and removing property with respect to the flux residue remaining on the copper plate surface after soldering, and in particular, a cleaning and removing agent (No135 having a weight ratio of a component / b component of 11/89 to 94/6). ~ 176), the flux residue can be completely removed. However, even with the cleaning agents (No. 177 to 183) in which the ratio of the b component in the weight ratio of the a component / b component is 90% or more, good results are shown for the flux residue removability, but It is clear that it causes the problem of oxidative corrosion. In addition, in the cleaning and removing agents of Nos. 128 to 134 in which the ratio of the b component in the weight ratio of the a component / b component is 5% or less, the flux residue is not completely removed, but the No 122 in which the b component is not blended. It has been confirmed that the residue of flux residue is less than that of the cleaning and removing agents of ~ 127.

For the benzotriazole as the component c,
More than 0.05% by weight based on the total amount of a and b components (N
o 136-141, 143-148, 150-155,
157-162, 164-169, 171-176) suppresses oxidative corrosion on the metal surface, but when the ratio of the b component to the a component is too large (N
177-183), the effect of suppressing oxidative corrosion is not sufficient. In addition, benzothiazole, 2-mercaptobenzothiazole, 2-
It has been found that even when mercaptobenzimidazole and thiourea are used, the effect of suppressing oxidative corrosion on a metal surface, which is approximately the same as when benzotriazole is used, can be obtained.

Further, 10% by weight or more of 1-methyl-4-isopropenyl-1-cyclohexene as the component d is added to the total amount of the components a and b, and the lactate ester as the component e is also 1% by weight.
0% by weight or more (No 136 to 141, 143 to 14
8, 150-155, 157-162, 164-16
9, 171-176), the flux residue removability is further improved.

Incidentally, the above Nos. 13-16, 18-21,
23-26, 28-31, 33-36, 38-41, 6
7-72, 74-79, 81-86, 88-93, 95
~ 100, 102-107, 136-141, 143-
148, 150-155, 157-162, 164-1
It was confirmed that when each of the cleaning removal agents 69 and 171-176 was used for cleaning the rectangular chip resistor, it exhibited excellent cleaning power and did not cause oxidative corrosion on the metal surface of the chip.

[0056]

According to the first to fourth aspects of the present invention, as a cleaning / removing agent, it is possible to surely secure organic flux such as solder flux residue and grease adhered to the surfaces of various electronic parts and machine parts after soldering. In addition to being removable, an oxide film due to oxidative corrosion at the time of cleaning is not easily formed on the metal surface of the object to be cleaned, it is also excellent in handling safety, and it provides a preferable aroma by masking the odor of flux etc. .

According to the fifth aspect of the present invention, the above cleaning remover can more reliably prevent oxidative corrosion of the metal surface of the object to be cleaned and is excellent in quality stability, which is advantageous for storage and management. Also provided is one that facilitates wastewater treatment after cleaning.

According to the cleaning method of the sixth aspect of the present invention,
It is possible to efficiently and surely remove the solder flux residue attached to the surface of the component after soldering and its deformation, and to prevent oxidative corrosion of the metal surface of the object to be cleaned.

According to the seventh to tenth aspects of the present invention, as the cleaning / removing agent, it is possible to reliably remove the organic residue such as the solder flux residue and the oil and fat adhered to the component surface after the soldering of various electronic components and mechanical components. In addition, an oxide film is less likely to be formed on the metal surface of the object to be cleaned due to oxidative corrosion during cleaning, is excellent in handling safety, and is less toxic.

According to the eleventh aspect of the present invention, the above cleaning remover can more reliably prevent oxidative corrosion of the metal surface of the object to be cleaned, has high quality stability, and is advantageous for storage and management. Also provided is one that facilitates wastewater treatment after cleaning.

According to the cleaning method of the twelfth aspect of the invention, the solder flux residue adhering to the surface of the component after soldering and its deformation can be removed efficiently and reliably, and the metal surface of the object to be cleaned is oxidized. Can prevent corrosion.

According to the thirteenth to seventeenth aspects of the present invention, as the cleaning / removing agent, it is possible to reliably remove the organic residue such as the solder flux residue and the oil and fat adhered to the surface of the component after the soldering of various electronic components and mechanical components. In addition, it is excellent in handling safety, can mask odors such as flux, and has relatively low toxicity.

According to the eighteenth aspect of the present invention, the above cleaning remover can more reliably prevent oxidative corrosion of the metal surface of the object to be cleaned, has high quality stability, and is advantageous for storage and management. Also provided is one that facilitates wastewater treatment after cleaning.

According to the cleaning method of the nineteenth aspect of the present invention, the solder flux residue and its variants adhered to the surface of the component after soldering can be removed efficiently and reliably, and the metal surface of the object to be cleaned is oxidized. Can prevent corrosion.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C11D 7/32 C11D 7/32 7/34 7/34 7/50 7/50 H05K 3/26 H05K 3 / 26 (72) Koichi Ikemoto, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Manabu Numata 1-12-14 Yokoe, Ibaraki City, Osaka Crane Chemical Co., Ltd. ) Inventor Junji Sugano 3-5-19, Naruiku, Joto-ku, Osaka-shi, Osaka Prefecture F-term in Aiken Co., Ltd. (reference) 3B201 AA01 AA48 BB01 BB83 CC01 4H003 DA15 DB00 DC04 EB09 ED03 ED29 ED31 ED32 FA01 FA03 FA15 FA28 FA45 5E343 BB54 CC23 EE02 FF23 GG11

Claims (19)

[Claims] 1. A) 3-methoxy-3-methyl-1-butanol, b) N-methyl-2-pyrrolidone, and c).
At least one corrosion inhibitor component selected from the group of benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and thiourea, and d) water-solubilized 1-methyl-4-isopropenyl-1-cyclohexene A cleaning remover containing and as essential components. 2. The weight ratio of the component a / component b is 11 /
The cleaning and removing agent according to claim 1, which is in a range of 89 to 94/6. 3. The component c is contained in an amount of 0.05 to 6% by weight based on the total amount of the components a and b.
Or the cleaning / removing agent according to 2. 4. The component d is contained in the range of 10 to 50% by weight with respect to the total amount of the components a and b.
The cleaning / removing agent according to any one of 3 above. 5. The cleaning / removing agent according to claim 1, wherein the pH is in the range of 5.8 to 8.6. 6. A cleaning / removing agent using the cleaning / removing agent according to any one of claims 1 to 5 is used to remove the solder flux and its variants remaining on the surface of the component after soldering. How to wash. 7. A) 3-methoxy-3-methyl-1-butanol, b) N-methyl-2-pyrrolidone, and c).
A cleaning and removing agent containing, as essential components, at least one corrosion inhibitor component selected from the group of benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and thiourea, and e) lactic acid ester. 8. The weight ratio of the component a / component b is 11 /
The cleaning and removing agent according to claim 7, which is in a range of 89 to 94/6. 9. The c component is contained in the range of 0.05 to 6% by weight based on the total amount of the a and b components.
Or the cleaning / removing agent according to item 9. 10. The cleaning / removing agent according to claim 7, wherein the e component is contained in the range of 10 to 60% by weight with respect to the total amount of the a and b components. 11. The cleaning / removing agent according to claim 7, which has a PH in the range of 5.8 to 8.6. 12. A cleaning / removing agent using the cleaning / removing agent according to any one of claims 7 to 11, wherein the solder flux and its variants remaining on the surface of the component after soldering are removed. How to wash. 13. A) 3-methoxy-3-methyl-1-
Butanol and b) N-methyl-2-pyrrolidone,
c) at least one corrosion inhibitor component selected from the group of benzotriazole, benzothiazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, thiourea, and d) water-solubilized 1-methyl-4-isopropenyl-1. -Cleaning and removing agent containing cyclohexene and e) lactic acid ester as essential components 14. The weight ratio of the a component / b component is 11
The cleaning / removing agent according to claim 13, which is in a range of / 89 to 94/6. 15. The cleaning / removing agent according to claim 13, wherein the component c is contained in an amount of 0.05 to 6% by weight based on the total amount of the components a and b. 16. The component d is contained in an amount of 10 to 50% by weight based on the total amount of the components a and b.
The cleaning / removing agent according to any one of 3 to 15. 17. The e component is contained in the range of 10 to 60% by weight with respect to the total amount of the a and b components.
The cleaning / removing agent according to any one of 3 to 16. 18. The cleaning / removing agent according to claim 13, which has a PH in the range of 5.8 to 8.6. 19. A cleaning and removing agent using the cleaning and removing agent according to any one of claims 13 to 18 is used to remove the solder flux and its variants remaining on the surface of the component after soldering. How to wash.