JP2003046825A - Imaging apparatus and imaging lens - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small and inexpensive imaging apparatus having a dustproof and moisture-proof structure and can be set accurately without requiring any adjustment while decreasing the number of components. SOLUTION: When the abutting part 1d at the leg part 1c of an optical member 1 abuts against the circumferential surface 2a of an imaging element 2b, a lens section 1a and the photoelectric converting section 2d of the imaging element 2b are aligned in the direction of optical axis. Consequently, the lens section 1a and the photoelectric converting section 2d of the imaging element 2b can be aligned in the direction of optical axis without using the four corner parts of the imaging element 2b where the surface accuracy is relatively low. Since the lens section 1a and the photoelectric converting section 2d of the imaging element 2b can be aligned in the direction orthogonal to the direction of optical axis because a mirror frame 4 is disposed on a substrate PC with reference to the photoelectric converting section 2d of the imaging element 2b, a high alignment accuracy can be achieved at a low cost without using the four corner parts of the imaging element 2b where the surface accuracy is relatively low.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device,
Especially mobile phones and personal computers (personal computers)
The present invention relates to an image pickup device that can be installed in, for example.

[0002]

2. Description of the Related Art In recent years, it has become possible to easily handle digital image data due to improvements in CPU performance and image processing technology. Especially mobile phones and P
In DA, a model equipped with a display capable of displaying an image is available on the market, and a dramatic improvement in wireless communication speed can be expected in the near future.
It is expected that image data will be frequently transferred between DAs.

By the way, at present, after converting a subject image into image data with a digital still camera or the like, such image data is transferred via the Internet via a personal computer or the like. However, in such a mode, in order to transfer image data, it is necessary to have both a digital still camera and a personal computer. On the other hand, there is an attempt to mount an image pickup device such as a CCD type image sensor on a mobile phone.
According to such an attempt, it is not necessary to own a digital still camera or a personal computer, and it is easy to take an image with a mobile phone that can be easily carried and send it to the other party.

[0004]

However, at present, if the mobile phone has the function of a digital still camera much larger than that of the mobile phone, the mobile phone itself becomes large and heavy, which makes it difficult to carry. There is a problem. In addition, the manufacturing cost increases accordingly.

In particular, even if the photographing optical system, which is a main component of the digital still camera, and the image pickup device are unitized, the photoelectric conversion section of the image pickup device is not properly set at the focus position of the image pickup optical system. The problem is how to make such adjustments. For example, when the image sensor and the photographic optical system are installed on the same substrate, the focus position of the photographic optical system may be affected by factors such as variations in the thickness of the adhesive used to attach the substrate and dimensional variations in the components. It can be said that it is difficult to assemble the photoelectric conversion unit of the image pickup device with high accuracy. Therefore, in order to improve the assembling accuracy of the focusing position of the photographing optical system and the photoelectric conversion unit of the image sensor, a highly accurate assembling technique is required, or a mechanism for separately adjusting the focusing position is required, Then, there is a problem that the manufacturing cost increases. The problems of the prior art will be pointed out by giving examples.

FIG. 6 is a sectional view showing an example of a conventional image pickup device. An image pickup element 110 is arranged on a glass epoxy substrate PC, and a large number of wires W are connected from terminals (not shown) on the upper surface. Then, it is connected to the image processing IC circuit 111 arranged on the back surface of the substrate PC.

A first casing 101 is arranged so as to cover the image pickup device 110, a second casing 102 is placed on the first casing 101, and the second casing 102 is fastened to the substrate with bolts 103.
An infrared cut filter 104 is arranged between the first housing 101 and the second housing 102.

The upper portion of the second housing 102 is cylindrical, and the internal thread 102a formed on the inner surface of the second housing 102 has a male thread 10a.
By screwing 5a, the lens barrel 105 including the lens 106 is attached to the second housing 102 so that the position thereof in the optical axis direction can be adjusted. Lens barrel 105
Has a narrowed portion 105b formed on the upper side.

As described above, the conventional image pickup apparatus is a relatively large-sized apparatus composed of a large number of parts. Therefore, it is troublesome to assemble these parts while avoiding the above-mentioned problem of manufacturing cost. , The image pickup device 110 and the lens 10 while rotating the lens barrel 105.
It is also necessary to adjust the relative position with respect to 6. To solve such a problem, for example, Japanese Patent Laid-Open No. 9-284617 discloses an image pickup apparatus in which an image pickup element and an optical system are unitized.

According to such an image pickup device, since the number of parts is reduced and the device is made compact by being unitized, it can be easily mounted on a mobile phone or the like. By the way, such an image pickup device uses the four corners of a so-called bare chip, which is the image pickup device itself, for positioning in the lens optical axis direction and for positioning in the direction orthogonal to the lens optical axis, whereby a focused image is captured by the photoelectric conversion unit of the bare chip. The image is formed at an appropriate position. However, the edges of the four corners of the bare chip are generally in a state where a silicon wafer having a thickness of about 0.5 mm is left cut,
As it is, the surface accuracy such as flatness and roughness is poor. Therefore, while utilizing the edges of the four corners of the bare chip, in order to improve the positioning accuracy, it is necessary to extend the holding portion of the lens portion from the four corners of the bare chip as long as possible along each surface. However, this causes a problem that the configuration becomes large. In particular, when wire bonding pads connected to the substrate are arranged on the lens portion side surface of the bare chip, these must be avoided, which makes the design of the holding portion difficult.

The present invention has been made in view of the above problems, and is inexpensive, can reduce the number of parts, can be downsized, and can be assembled accurately even without adjustment, and An object of the present invention is to provide an imaging device having a dustproof and moistureproof structure.

[0012]

In order to achieve such an object, an image pickup device according to a first aspect of the present invention is an image pickup device arranged on a substrate, wherein a photoelectric conversion portion in which pixels are arranged and the photoelectric conversion portion are arranged. A peripheral surface formed around the conversion unit and a side surface intersecting with the peripheral surface, and an object image formed on the image sensor mounted on the substrate and the photoelectric conversion unit included in the image sensor. An optical member having an image forming lens portion, a leg portion that is integrated with the lens portion and supports the lens portion, and an abutting surface that abuts on the image sensor, The contact surface may directly contact only the peripheral surface of the image sensor, or, if a surface material is provided on the peripheral surface of the image sensor, contact only the peripheral surface or the surface material. Is characterized by.

An image pickup device according to a second aspect of the present invention is an image pickup device arranged on a substrate, comprising a photoelectric conversion part in which pixels are arranged and a peripheral surface formed around the photoelectric conversion part. An imaging element mounted on the substrate, a lens section that forms a subject image on the photoelectric conversion section provided in the imaging element, and a leg section that is integrated with the lens section and supports the lens section And an optical member having a contact surface that contacts the image sensor, and a lens frame that holds the optical member, wherein the contact surface of the optical member is a peripheral surface of the image sensor. In the case where a surface material is provided on the peripheral surface of the image sensor directly, or by contacting only with the peripheral surface or the surface material, the photoelectric conversion unit of the lens unit and the image sensor. Positioning in the optical axis direction with is performed, the lens frame, By being installed on the substrate and holding the optical member by the lens frame, the lens unit and the photoelectric conversion unit provided in the image sensor are positioned in a direction orthogonal to the optical axis. And

[0014]

An image pickup device according to a first aspect of the present invention is an image pickup device arranged on a substrate, which comprises a photoelectric conversion section in which pixels are arranged,
A peripheral surface formed around the photoelectric conversion unit, and a side surface intersecting with the peripheral surface, an image sensor mounted on the substrate, and a subject image on the photoelectric conversion unit included in the image sensor. An optical member having a leg portion for forming an image of a lens, a leg portion that is integrated with the lens portion and supports the lens portion, and an abutting surface that abuts on the imaging element. The contact surface directly abuts only on the peripheral surface of the image sensor, or, if a surface material is provided on the peripheral surface of the image sensor, only contacts the peripheral surface or the surface material. Since they are in contact with each other, the lens section and the light receiving surface of the image pickup element can be positioned in the optical axis direction without using the four corners or the side portions where the surface accuracy of the image pickup element is relatively poor. The surface material refers to a material such as a glass plate attached to the peripheral surface, but is not limited thereto. It should be noted that the peripheral surface in the present invention means a surface existing substantially on the same plane as the surface of the photoelectric conversion section of the image pickup device, and the side surface of the image pickup device is excluded.

Particularly, in the case where a connection terminal for connecting the image pickup device and the substrate is formed on the peripheral surface, the contact surface of the leg portion is more than the connection terminal. If the light-receiving surface side is configured to contact the peripheral surface, interference with the connection terminals can be suppressed and high-accuracy positioning can be achieved while maintaining the compact structure of the image sensor. Becomes

Further, when the photoelectric conversion section is arranged at the center of the image pickup device, a region of the peripheral surface where the contact surface of the leg section can contact is symmetrical with respect to the optical axis of the lens section. Therefore, it is possible to secure a large area of the contact surface and achieve stable positioning while maintaining the image pickup element in a compact structure.

If the image processing circuit of the image pickup device is arranged inside the image pickup device and inside the peripheral surface, it is necessary to provide the image processing circuit on the side of the board on which the image pickup device is mounted. It is possible to make the substrate compact.

Further, if the optical member is provided with an elastic member that presses in the optical axis direction, the elastic force of the elastic member can be used to press the optical member with an appropriate force along the optical axis direction. Therefore, excessive stress does not occur on the peripheral surface (active area) of the image pickup device in which the circuit is arranged inside.

Further, if a cover member which is disposed closer to the subject than the lens portion and presses the optical member through the elastic member, at least a part of which is transparent to light, is provided,
It is preferable that the lens portion is not exposed and can be protected.

Further, it is preferable that the light-transmitting portion of the cover member is made of a material having an infrared absorption property, since it is not necessary to separately provide an infrared cut filter and the number of parts can be reduced. However, instead of or in addition to forming the cover member from a material having an infrared absorbing property, a film having an infrared reflecting property may be coated on the surface of the cover member.

Further, in the image pickup apparatus of the first invention, since the leg portion of the optical member may be arranged at a position close to the photoelectric conversion portion of the image pickup element, the F-number of the lens portion may be arranged. By providing a first diaphragm that regulates the first diaphragm and a second diaphragm that is disposed on the subject side with respect to the first diaphragm and that regulates peripheral light flux, the incidence of unnecessary light is reduced and It is possible to prevent the internal reflection of the light from reaching the photoelectric conversion portion as a ghost. Thereby, a high quality image can be formed.

Further, if the lens section has a first diaphragm for defining the F number on the object side and is composed of a positive single lens with a surface having a strong curvature facing the image side, the photoelectric conversion element of the image pickup device will be described. The light beam incident on the conversion unit surface can be made to be incident at an angle close to vertical, that is, can be made nearly telecentric, whereby a high-quality image can be obtained.
Further, by forming the lens portion into a positive lens shape with a surface having a strong curvature facing the image side, the distance between the first aperture stop and the principal point of the lens portion can be increased, and a desirable configuration closer to telecentricity can be obtained. Becomes

Further, when the lens portion is composed of two or more lenses, the degree of freedom of aberration correction is increased, and a higher quality image can be obtained.

Furthermore, when the lens portion includes at least one positive lens and at least one negative lens, these lenses are used to favorably correct various aberrations such as spherical aberration and field curvature. be able to. Further, the influence of the change in the refractive index and the change in the lens shape when the temperature is changed, which tends to be a problem when the lens is made of a resin material, can be eliminated by combining the positive lens and the negative lens. It is possible to suppress the fluctuation of the image point position due to.

Further, if the lens closest to the image side of the lens section is a positive lens and the first diaphragm for defining the F number is arranged closer to the subject than the lens closest to the image side,
It is possible to improve the telecentric characteristic of the light beam incident on the photoelectric conversion unit of the image pickup device.

Further, if the lenses are positioned in the direction orthogonal to the optical axis by engaging the surfaces provided on the respective lenses of the lens section in parallel with the optical axes, the optical axes of the plurality of lenses are formed. Can be easily matched.

An image pickup device according to a second aspect of the present invention is an image pickup device arranged on a substrate, comprising a photoelectric conversion part in which pixels are arranged and a peripheral surface formed around the photoelectric conversion part. An imaging element mounted on the substrate, a lens section that forms a subject image on the photoelectric conversion section provided in the imaging element, and a leg section that is integrated with the lens section and supports the lens section And an optical member having a contact surface that contacts the image sensor, and a lens frame that holds the optical member, wherein the contact surface of the optical member is a peripheral surface of the image sensor. In the case where a surface material is provided on the peripheral surface of the image sensor directly, or by contacting only with the peripheral surface or the surface material, the photoelectric conversion unit of the lens unit and the image sensor. Positioning in the optical axis direction with is performed, the lens frame, Since the optical member is installed on the substrate and the optical member is held by the lens frame, the lens unit and the photoelectric conversion unit included in the image sensor are positioned in the direction orthogonal to the optical axis. The lens unit and the photoelectric conversion unit of the image pickup device can be positioned in the optical axis direction without using the four corners or side faces of the image pickup device whose surface accuracy is relatively poor, and the lens unit and the image pickup unit can be used. Positioning of the element in the direction perpendicular to the optical axis with the photoelectric conversion part is
Since it is achieved by installing the lens frame with respect to the substrate, similarly, it is possible to achieve high positioning accuracy at low cost without using the four corners or side surfaces where the surface accuracy of the image sensor is relatively poor. It can be achieved.

Particularly, in the case where a connection terminal for connecting the image pickup device and the substrate is formed on the peripheral surface, the contact surface of the leg portion is more than the connection terminal. If the photoelectric conversion unit side is configured to abut the peripheral surface, interference with the connection terminals is suppressed while maintaining a compact configuration of the image sensor, and highly accurate positioning is achieved. It will be.

Further, when the photoelectric conversion section is arranged at the center of the image pickup device, a region of the peripheral surface where the contact surface of the leg section can abut is symmetrical with respect to the optical axis of the lens section. Therefore, it is possible to secure a large area of the contact surface and achieve stable positioning while maintaining the image pickup element in a compact structure.

If the image processing circuit of the image pickup device is arranged inside the image pickup device and inside the peripheral surface, it is necessary to provide the image processing circuit on the side of the board on which the image pickup device is mounted. It is possible to make the substrate compact.

Furthermore, if the optical member has an elastic member that presses the lens frame in the optical axis direction, the elastic force of the elastic member is used to move the optical member in the optical axis direction with an appropriate force. This is preferable from the viewpoint of protecting the image pickup device, since it does not cause excessive stress on the peripheral surface (active region) of the image pickup device in which the circuit is arranged inside, and can be pressed along. Further, even when a large force is applied in the optical axis direction of the lens frame, the force is transmitted to the substrate but not directly to the image pickup element, which is preferable from the viewpoint of protecting the image pickup element.

Further, as long as it has a cover member which is arranged closer to the subject than the lens portion and presses the optical member through the elastic member, at least a part of which can transmit light,
It is preferable that the lens portion is not exposed and can be protected.

Further, it is preferable that the light-transmitting portion of the cover member is made of a material having an infrared absorbing property, since it is not necessary to separately provide an infrared cut filter and the number of parts can be reduced. However, instead of or in addition to forming the cover member from a material having an infrared absorbing property, a film having an infrared reflecting property may be coated on the surface of the cover member.

Further, when the optical member is insertable into the lens frame from the subject side, the assembling property of the lens portion is improved, and the automatic assembling can be easily performed.

Further, in the image pickup device of the second invention,
Since the leg portion of the optical member may be arranged at a position close to the photoelectric conversion portion of the image pickup element, the first diaphragm that defines the F number of the lens portion and the first diaphragm that defines the F number of the lens portion may be provided. On the other hand, by providing a second diaphragm that is arranged on the subject side and that regulates the peripheral light flux, the incidence of unnecessary light is reduced,
It is possible to prevent the internal reflection from the legs from reaching the photoelectric conversion unit as a ghost. Thereby, a high quality image can be formed.

Further, if the lens portion has a first diaphragm for defining the F number on the object side and is composed of a positive single lens with a surface having a strong curvature facing the image side, photoelectric conversion of the image pickup device is performed. It is possible to make the light beam incident on the section incident at an angle close to vertical, that is, to be close to telecentric,
Thereby, a high quality image can be obtained. Further, by forming the lens portion into a positive lens shape with a surface having a strong curvature facing the image side, the distance between the first aperture stop and the principal point of the lens portion can be increased, and a desirable configuration closer to telecentricity can be obtained. Becomes

Further, when the lens portion is composed of two or more lenses, the degree of freedom of aberration correction is increased and a higher quality image can be obtained.

When the lens portion includes at least one positive lens and at least one negative lens, these are used to favorably correct various aberrations such as spherical aberration and field curvature. be able to. Further, the influence of the change in the refractive index and the change in the lens shape when the temperature is changed, which tends to be a problem when the lens is made of a resin material, can be eliminated by combining the positive lens and the negative lens. It is possible to suppress the fluctuation of the image point position due to.

Further, the lens closest to the image side in the lens section is a positive lens, and the first diaphragm for defining the F number is
If the lens is located closer to the subject than the lens closest to the image side, the telecentric characteristic of the light beam incident on the photoelectric conversion unit of the image sensor can be improved.

If the surfaces of the lenses of the lens section parallel to the optical axis are engaged with each other, the positioning of the lenses in the direction orthogonal to the optical axis is performed. Can be easily matched.

[0041]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of the image pickup apparatus according to the present embodiment. FIG. 2 is a perspective view of the image pickup apparatus of FIG. FIG. 3 is a perspective view of an optical member,
FIG. 4 is a bottom view of the optical member. FIG. 5 is a top view of the image sensor.

The optical member 1 is made of a transparent resin material,
As shown in FIG. 1, a tubular leg portion 1c, four contact portions 1d (a lower surface of the contact portion 1d is a contact surface) formed at a lower end of the leg portion 1c as a part of the leg portion 1c, and the leg portion 1c. 1e formed around the upper end of the plate, and a plate-shaped upper surface 1 that closes the upper ends of the legs 1c
b and the convex lens portion 1a formed in the center of the upper surface portion 1b are integrally formed. In addition, on the upper surface of the upper surface portion 1b, around the convex lens portion 1a, there is a diaphragm plate 3 made of a light-shielding material and having an opening 3a as a first diaphragm that defines the F number of the convex lens portion 1a. It is fixed by adhesion.

A lens frame 4 made of a light-shielding material is arranged outside the optical member 1. As is apparent from FIG. 2, the lens frame 4 has a prismatic lower portion 4a and a cylindrical upper portion 4a.
b and are provided. The lower end of the lower portion 4a is in contact with the substrate PC and is fixed by the adhesive B. The upper surface of the lower portion 4a is covered with the partition wall 4c on the peripheral side, and the leg portion 1c of the optical member 1 is closely fitted to the circular inner peripheral surface of the partition wall 4c. Therefore, by using the optical sensor (not shown) provided in the automatic assembling machine for the substrate PC and the lens frame 4, for example, the center of the circular inner peripheral surface of the partition wall 4c and the image pickup device 2 described later.
The photoelectric conversion unit 2b of the image pickup device 2b, which will be described later, can be simply arranged by positioning so that the centers of the photoelectric conversion units 2d of b.
The lens portion 1a can be accurately positioned with respect to d in the direction orthogonal to the optical axis.

On the other hand, a light shielding plate 5 is attached by an adhesive B to the upper end of the upper portion 4b of the lens frame 4. Light shield 5
Has an opening 5a as a second diaphragm in the center thereof. Below the opening 5a of the light shielding plate 5, a filter 7 made of a material having an infrared absorbing property is attached by an adhesive agent B. The light shielding plate 5 and the filter 7 form a cover member.

In FIG. 1, an elastic member 6 made of rubber or a spring member is disposed between the shading plate 5 and the step portion 1e of the optical member 1, and the shading plate 5 is attached to the lens frame 4. Elastically deforms, and the elastic force presses the optical member 1 downward in FIG. Therefore, the force from the light shielding plate 5 is transmitted to the substrate PC via the lens frame 4, but is not directly transmitted to the image pickup element 2b. If the elastic member 6 is formed integrally with the diaphragm plate 3, the number of parts can be reduced.

In FIG. 5, the image pickup unit 2 is a CMO.
S (Complementary Metal Oxid
An image sensor 2b such as an eSemiconductor type image sensor. Image sensor 2 in the shape of a rectangular thin plate
The lower surface of b is attached to the upper surface of the substrate PC. A photoelectric conversion unit 2d in which pixels are two-dimensionally arranged is formed in the center of the upper surface of the image sensor 2b, and an image processing circuit is formed inside and inside the image sensor 2b around the photoelectric conversion unit 2d. A surrounding surface 2a is formed. A large number of pads 2c are arranged in the vicinity of the outer edge of the peripheral surface 2a that intersects the thin side surface at right angles. The pad 2c, which is a connection terminal, is connected to the substrate PC via the wire W as shown in FIG. The wire W is connected to a predetermined circuit on the substrate PC.

Further, as is apparent from FIG. 4, the abutting portion 1d of the optical member 1 projects in an arc shape from the lower end of the leg portion 1c and constitutes a part of the leg portion 1c, and is indicated by a dotted line in FIG. As shown, on the peripheral surface 2a of the image pickup device 2b, only the contact portion 1d is arranged inside the pad 2c so as to be in contact therewith. Therefore, regarding the surface flatness, it is sufficient if only the lower surface (contact surface) of the contact portion 1d is maintained within a predetermined range. In this embodiment, four contact portions are provided, but two or three contact portions may be provided. With the contact portion 1d in contact with the peripheral surface 2a of the image sensor 2b, the optical member 1
Since a gap Δ is formed between the lower surface of the step portion 1e and the partition wall 4c of the lower portion 4a of the lens frame 4,
The distance L (that is, the positioning in the optical axis direction) between the lens portion 1a and the photoelectric conversion portion 2d of the image pickup element 2b is set accurately by the length of the leg portion 1c. Further, since the optical member 1 is made of a plastic material, it is possible to reduce the shift of the focusing position due to the change in the refractive index of the lens portion when the temperature changes. That is, as the temperature of a plastic lens increases, the refractive index of the lens decreases,
The image formation position changes in the direction away from the lens. On the other hand, since the leg portion 1c extends due to the temperature rise, it has the effect of reducing the focus position shift. Since the optical member 1 of the present embodiment is made of a plastic material having a relatively light specific gravity, it is lighter in weight than glass even in the same volume and has excellent shock absorption characteristics. Even if
There is an advantage that damage to the image pickup device 2b can be suppressed as much as possible.

Further, as shown in FIG. 5, when the optical member 1 has a structure capable of rotating freely within the lens frame 4, the contact portion 1d interferes with the pad 2c, so that the rotation is restricted. A structure to be assembled (for example, a rotation stopper is provided on the lens frame 4) is preferable.

The operation of this embodiment will be described. The lens portion 1a of the optical member 1 captures a subject image with the image sensor 2b.
An image is formed on the photoelectric conversion unit 2d. The image pickup device 2b is adapted to convert an electric signal corresponding to the amount of received light into an image signal or the like and output it via the pad 2c and the wire W.

Furthermore, in the present embodiment, the optical member 1 is not mounted on the substrate PC, but the image pickup device 2b.
Since it is mounted on the peripheral surface 2a of the optical member 1, by controlling the dimensional accuracy of the leg portion 1c (including the contact portion 1d) of the optical member 1, that is, the accuracy of the distance L described above, the lens portion 1a can be assembled. It is possible to eliminate the need for adjusting the focus position of. Since the image pickup apparatus according to the embodiment of the present invention does not have a focus adjustment mechanism according to the subject distance, the lens of the image pickup apparatus is focused from a long-distance subject to a short-distance subject.
Must be a pan focus lens. Therefore, the image point position of the lens unit 1a at the hyperfocal length U≈f ² / (F × 2P) (where f is the focal length of the lens, F is the F number of the lens, and P is the pixel pitch of the image sensor). By matching the position in the optical axis direction with the photoelectric conversion unit 2d of the image pickup device 2b, geometrically optics can be performed at a distance of U / 2 from infinity.
The object at a distance of can be regarded as being in focus. For example, f = 3.2 mm, F = 2.8, P = 0.0
For 056Mm, as a reference object distance, the image point position of the lens portion 1a in the hyperfocal distance U ≒ ^f 2 /(F×2P)=0.33m, the optical axis direction of the photoelectric conversion unit 2d of the image pickup element 2b If the above-mentioned distance L is set so that the positions coincide with each other, the state is in focus from infinity to a distance of about 0.17 m. Further, it is not always necessary to set the hyperfocal length as the reference subject distance. For example, when it is desired to focus on the image quality at a longer distance, the reference subject distance may be set farther than the hyperfocal length (specifically, the above-mentioned Distance L
Should be slightly shorter. ). Here, in terms of the accuracy of the distance L, in order to eliminate the need for adjusting the in-focus position as the pan focus lens, the photoelectric conversion unit 2d of the imaging device 2b is used.
And the deviation in the optical axis direction of the image point at the reference object distance of the lens unit 1a is ± 0.5 × (F × 2P) in air conversion length.
(F: F number of taking lens, P: pixel pitch of image sensor) need to be suppressed. Also, preferably ±
It is preferable to suppress it to about 0.25 × (F × 2P). If this deviation is large, the image quality at infinity or at a close range is deteriorated, which is not preferable.

Further, according to the present embodiment, the optical member 1
The contact portion 1d of the leg portion 1c of the front surface of the imaging element 2b is the peripheral surface 2a.
The lens portion 1a and the photoelectric conversion portion 2d of the image sensor 2b are positioned in the optical axis direction by abutting against the lens portion 1a, and thus the lens portion 1a is used without using the four corner portions with relatively poor surface accuracy. 1a and photoelectric conversion unit 2d of image sensor 2b
And can be positioned in the optical axis direction. Further, the lens frame 4 is installed on the substrate PC with the photoelectric conversion unit 2d of the image pickup device 2b as a positioning reference, so that the lens unit 1a and the photoelectric conversion unit 2d of the image pickup device 2b can be positioned in the direction orthogonal to the optical axis. Since this is performed, similarly, it is possible to achieve high positioning accuracy at low cost without using the four corner portions of the image pickup element 2b where surface accuracy is relatively poor.

Particularly, when the pad 2c and the wire W for connecting the image pickup device 2b and the substrate PC are formed on the peripheral surface 2a of the image pickup device 2b, the contact portion 1d of the leg portion 1c is If it is configured so as to contact the peripheral surface 2a on the photoelectric conversion portion 2d side of the pad 2c, the image pickup device 2b
While maintaining a compact structure, a large contact area of the contact portion 1d can be secured, thereby stabilizing the optical member 1 and suppressing the surface pressure of the contact surface to a low level. While the above-mentioned protection is aimed at, the interference with the pad 2c and the wire W is suppressed, and moreover, highly accurate positioning is achieved. Further, when the photoelectric conversion unit 2d is arranged at the center of the image pickup device 2b, the area of the peripheral surface 2a with which the contact portion 1d of the leg 1c can come into contact is the lens unit 1.
Since the image pickup device 2b can be arranged symmetrically with respect to the optical axis of a, the area of the lower surface of the contact portion 1d can be secured large while maintaining the compact configuration of the image pickup device 2b, and stable positioning can be achieved.
Desirably, as shown in FIG. 5, the center of the photoelectric conversion unit 2d should be aligned with the center of the image sensor 2b. As a result, the overall structure of the image pickup device 2b becomes a structure that is nearly symmetrical with respect to the optical axis of the lens portion 1a of the optical member 1, so that the component shape can be simplified. It should be noted that the lens frame 4 is adhered to the substrate PC and, together with the other two adhering portions, is kept in a sealed state so that foreign matter does not enter the outside of the image pickup apparatus. The adverse effect of foreign matter on the photoelectric conversion unit 2d of 2b can be eliminated. The adhesive used for these preferably has moisture resistance. As a result, it is possible to prevent surface deterioration of the image pickup device and the pad due to invasion of moisture.

Further, since the elastic member 6 for pressing the optical member 1 against the lens frame 4 in the optical axis direction is provided, the elastic force of the elastic member 6 is used to apply the optical member 1 with an appropriate force. It can be pressed along the optical axis direction, and excessive stress does not occur on the peripheral surface 2a of the image pickup element 2b in which the circuit is arranged inside. Further, even when a large force is applied to the lens frame 4 in the optical axis direction, the force is transmitted to the substrate PC via the lens frame 4, but is not directly transmitted to the image pickup element 2b.
It is preferable from the viewpoint of protection of the image sensor 2b.

Further, since the cover member composed of the light shielding plate 5 and the filter 7 is arranged closer to the subject side than the lens portion 1a, the lens portion 1a can be protected without being exposed and the lens surface can be protected. It is possible to prevent foreign matter from adhering to the surface. Furthermore, since the filter 7 is formed of a material having an infrared absorption characteristic, it is not necessary to separately provide an infrared cut filter, and the number of parts can be reduced, which is preferable. Instead of providing the filter 7 with an infrared ray cutting property, it is possible to form the optical member 1 itself from a material having an infrared ray absorbing property, or to coat the surface of the lens 1a with a film having an infrared ray cutting property.

Furthermore, at the time of assembly, the optical member 1 can be inserted into the lens frame 4 from the subject side with the light shield plate 5 removed from the lens frame 4, and then the light shield plate 5 is attached to the lens frame. 4 can be assembled. With such a configuration, the assembling property of the optical member 1 is improved, and automatic assembly or the like can be easily performed. At this time, if an air escape hole is formed in any of the lower portions 4a of the lens frame 4, the lens frame 4
Even if there is a slight gap between the optical member 1 and the optical member 1, the assembly can be easily performed. However, it is preferable that the air escape hole is sealed with a filler or the like after assembling to prevent foreign matter from entering from the outside and surface deterioration of the image pickup device and the pad due to moisture. Further, in this case, the filler preferably has a light shielding property so as to suppress light leakage. The optical member 1 may be inserted after the lens frame 4 is adhered to the substrate PC, or the unit may be adhered to the substrate PC after the optical member 1 is attached to the lens frame 4. This ensures the flexibility of the process. In the case of the latter assembling procedure, the partition wall 4c of the lens frame 4 can also have a function of preventing the optical member 1 from slipping off.

Since the leg portion 1c of the optical member 1 is arranged in the vicinity of the image pickup element 2b photoelectric conversion portion 2d, a light beam which does not contribute to image formation is reflected by the leg portion 1c and is incident on the photoelectric conversion portion 2d. Therefore, there is concern that it may cause ghosts and flares. To prevent this, the F of the lens unit 1a
It is effective to reduce the incidence of unnecessary light by disposing a second diaphragm (aperture 5a) that regulates peripheral light flux on the object side of the first diaphragm (aperture 3a) that defines the number. Since the angle of view differs depending on the short side / long side of the photoelectric conversion unit 2d of the image pickup device 2b and the diagonal direction, a further effect can be obtained by making the opening 5a of the second diaphragm rectangular. Furthermore, in the present embodiment, the opening 5a of the light shielding plate 5 is provided with this function. However, the subject side of the filter 7 is coated or coated with a light-shielding film in a region other than the required apertures to reduce the aperture. May be formed. Further, for the same reason, it is preferable that at least a part of the leg portion 1c be subjected to an inner surface antireflection treatment. The inner surface antireflection treatment includes, for example, forming a surface having a rough surface so as to scatter a light flux that does not contribute to image formation, and applying an antireflection coating or a paint having a low reflection property.

Further, since the diaphragm plate 3 having the opening 3a is provided on the incident surface side of the lens portion 1a, the luminous flux incident on the photoelectric conversion portion 2d of the image pickup element 2b is made incident at an angle close to vertical, that is, It can be close to telecentric, whereby a high quality image can be obtained. Further, the shape of the lens portion 1a is the shape of a positive lens with a surface having a strong curvature facing the image side, whereby the first diaphragm (opening 3
The distance between a) and the principal point of the lens portion 1a can be widened, and a desirable configuration closer to telecentricity can be obtained. In this embodiment, the lens portion 1a has a positive meniscus shape with a convex surface facing the object side. Further, in order to obtain a higher quality image, it is preferable that the lens portion is composed of a plurality of lenses as in the third embodiment described later.

FIG. 7 is a diagram showing an image pickup apparatus according to the second embodiment. The second embodiment is different from the above-described embodiment only in that the configurations of the diaphragm plate and the light shielding plate are changed, and therefore, the same reference numerals are given to the other similar configurations and the description will be given. Omit it.

In FIG. 7, a holding member 5'having a thin light shielding sheet 8 attached to the upper surface of the upper portion 4b of the lens frame 4 is attached.
Are attached by an adhesive B. In the central opening 5a 'of the holding member 5'made of a light-shielding material,
A filter 7'made of a material having an infrared absorption characteristic is fitted and arranged. A taper surface 5b 'is formed on the upper edge of the opening 5a' of the holding member 5 ', and the adhesive B
By attaching the, the holding member 5'and the filter 7'can be joined. Furthermore, the holding member 5 '
Is provided with a diameter-reduced portion 5c 'which projects downward from the opening 5a' and whose inner diameter is gradually reduced, and the most narrowed portion at the lower end thereof constitutes a first aperture 5d '. Further, the central opening 8a of the light shielding sheet 8 constitutes a second diaphragm. The holding member 5 ′, the filter 7 ′, and the light shielding sheet 8 form a cover member.

According to this embodiment, the cover member composed of the holding member 5 ', the filter 7'and the light shielding sheet 8 is
Since the optical member 1 is arranged closer to the subject side than the lens portion 1a, the lens portion 1a can be protected without being exposed, and foreign matter can be prevented from adhering to the lens surface. Further, since the cover member can be integrally formed, it contributes to reduction of the number of parts of the entire image pickup apparatus.

As in the above-described embodiment, the leg portion 1c of the optical member 1 is arranged near the photoelectric conversion portion 2d of the image pickup device 2b, so that a light beam that does not contribute to image formation is reflected by the leg portion 1c. However, there is a concern that ghost and flare may occur when the light enters the photoelectric conversion unit 2d. In the present embodiment, the second diaphragm (aperture 8a) that regulates the peripheral light flux is arranged on the subject side of the first diaphragm 5a 'that defines the F number of the lens unit 1a to reduce the incidence of unnecessary light. ing. Since the angle of view differs depending on the short side / long side and the diagonal direction of the photoelectric conversion unit 2d of the image pickup device 2b, the aperture 8 of the second diaphragm is formed.
By making a rectangular, a further effect can be obtained.

FIG. 8 is an aberration diagram for the first example (Example 1) of the lens portion 1a of the optical member 1 applicable to the embodiments of FIGS. Further, [Table 1] shows lens data of the lens unit of the present embodiment.

[Table 1] Regarding the symbols in the tables used in this specification, f is the focal length of the entire system (mm), F is the F number, ω is the half angle of view (°), r is the radius of curvature (mm), and d is the upper surface of the shaft. Interval (m
m) and nd are the refractive indices for the d-line, and vd is the Abbe number.

The surface No. The symbol * indicates an aspherical surface. Such an aspherical surface has an apex curvature of C, in an orthogonal coordinate system with the apex of the surface as the origin and the optical axis direction as the X axis.
The conic constant is K, the aspherical coefficient is A ₄ , A ₆ , A ₈ ,
A ₁₀ and A ₁₂ are represented by the following mathematical expressions.

[Equation 1]

[Equation 2]

FIG. 9 is an aberration diagram for the second example (Example 2) of the lens portion 1a of the optical member 1 applicable to the embodiments of FIGS. Further, [Table 2] shows lens data of the lens unit of the present embodiment.

[Table 2]

FIG. 10 is a diagram showing an image pickup apparatus according to the third embodiment. The third embodiment is different from the embodiment of FIG. 2 mainly in that the configuration of the optical member is changed so as to have a plurality of lens portions, so that the contact between the leg portion and the image sensor is achieved. With respect to other similar configurations including positions, the same reference numerals are given and description thereof is omitted.

In FIG. 10, the optical member 19 is composed of an image side lens 1'and a subject side lens 9 each made of a plastic material. The image-side lens 1'has a shape similar to that of the optical member 1 shown in FIG. 1, but the height of the ring portion 1f 'formed on the upper side in the optical axis direction is increased. The inner surface of the ring portion 1f ′ in the radial direction and the upper surface portion 1
A subject-side lens 9 is arranged above b ′ via a diaphragm plate 3 that defines the F number. The subject side lens 9 has a flange portion 9b fitted to the inner circumference of the ring portion 1f '.
And a lens portion 9a formed in the center. The lens portion 1a 'of the image side lens 1'is a positive lens, whereas the lens portion 9a of the subject side lens 9 is a negative lens. In the present embodiment, the diaphragm plate 3
Serves as a spacer that regulates the distance between lenses of the lens portions 1a ′ and 9a, and the opening 3a of the diaphragm plate 3 functions as a first diaphragm that regulates the F number.

The inner peripheral surface of the ring portion 1f ′ of the image side lens 1 ′ and the outer peripheral surface of the flange portion 9b of the subject side lens 9 are
Since they have the same diameter as each other and are parallel to the optical axis, the lens portions 1a ′, 9
Positioning of a in the direction orthogonal to the optical axis can be performed, and those optical axes can be easily matched. The subject side lens 9 is bonded to the image side lens 1'by an adhesive B applied to the periphery thereof.

On the upper end of the upper portion 4b of the lens frame 4, a holding member 5'having a thin light-shielding sheet 8 attached on its upper surface is attached by an adhesive B. A filter 7'made of a material having an infrared absorbing property is fitted and arranged in an opening 5a 'at the center of a holding member 5'made of a light-shielding material. At the upper edge of the opening 5a 'of the holding member 5', the tapered surface 5
b'is formed, and by attaching the adhesive B thereto, the holding member 5'and the filter 7'can be joined. Further, the holding member 5 ′ has a reduced diameter portion 5 that protrudes downward of the opening 5a ′ and has a gradually reduced inner diameter.
Although c'is provided, such a portion functions as a light shielding portion that suppresses intrusion of unnecessary light. The central opening 8a of the light shielding sheet 8 constitutes a second diaphragm.

FIG. 11 shows a third lens portion (1a ′, 9a) of the optical member 19 applicable to the embodiment of FIG.
8 is an aberration diagram for Example (Example 3) of FIG. Further, [Table 3] shows lens data of the lens unit of the present embodiment.

[Table 3]

FIG. 12 is a diagram showing an image pickup apparatus according to the fourth embodiment. The fourth embodiment also differs from the first and second embodiments mainly in that the configuration of the optical member is changed so as to have a plurality of lens portions. Are denoted by the same reference numerals and description thereof will be omitted.

In FIG. 12, the optical member 19 'is composed of an image side lens 1'and a subject side lens 9'which are respectively made of a plastic material. Image side lens 1 '
Has a shape similar to that of the optical member 1 shown in FIG. 1, but the height of the ring portion 1f 'formed on the upper side in the optical axis direction is increased. A subject side lens 9'is arranged above the upper surface portion 1b 'via an aperture plate 3 which defines the F number. The subject-side lens 9 ′ includes a cylindrical portion 9c ′ fitted to the outer periphery of the ring portion 1f ′, a lens portion 9a ′ formed in the center, and a step portion 9 provided on the outer periphery of the lens portion 9a ′.
b '. The lens portion 1a 'of the image side lens 1'is a positive lens, whereas the lens portion 9a' of the subject side lens 9'is a negative lens.
The diaphragm plate 3 functions as a spacer that regulates the distance between the lenses of the lens portions 1a 'and 9a'.

In this embodiment, the elastic member 6 is
It contacts the stepped portion 9b 'of the subject side lens 9', and therefore its elastic force is transmitted from the subject side lens 9'through the diaphragm plate 3 to the image side lens 1 '. . Also, the outer peripheral surface of the ring portion 1f 'of the image side lens 1',
Since the inner peripheral surface of the cylindrical portion 9c 'of the subject side lens 9'has the same diameter and is parallel to the optical axis, the lens portions 1a', 9a 'are engaged by the engagement of these surfaces.
Can be positioned in the direction orthogonal to the optical axis, and their optical axes can be easily matched. The object side lens 9'is joined to the image side lens 1'by the adhesive B applied to the lower end of the cylindrical portion 9c '.

FIG. 13 is an aberration diagram for the fourth example (Example 4) of the lens portions (1a ′, 9a ′) of the optical member 19 ′ applicable to the embodiment of FIG. or,
[Table 4] shows lens data of the lens unit of the present embodiment.

[Table 4]

According to the present embodiment, by providing at least one positive lens 1a 'and at least one negative lens 9a' in this way, it is possible to favorably correct spherical aberration and field curvature. You can Also, correction of chromatic aberration becomes easy. Further, the influence of the change in the refractive index and the change in the lens shape due to the temperature change, which tends to be a problem when the lens is made of the resin material, can be eliminated by combining the positive lens 1a ′ and the negative lens 9a ′. The fluctuation of the image point position due to the temperature change can be suppressed to be small.

Further, like the lens portions 1a 'and 9a', 2
By configuring the photographing optical system with one or more lenses, the degree of freedom in aberration correction increases, and higher quality images can be obtained.

Furthermore, the lens portion 1a 'closest to the image side is a positive lens, and the diaphragm (aperture 3a) that defines the F number is
If the lens unit 1a ′ closest to the image side is disposed on the subject side, the telecentric characteristic of the light beam incident on the photoelectric conversion unit 2d of the image sensor 2b can be improved. Here, when two lenses are used as in the third and fourth embodiments, the leg portion 1c ′ (contact portion 1) of the image side lens 1 ′ is used.
Not only the dimensions (including d '), but also the lens 9 on the subject side
By accurately managing the distance between the image-side lens 1'and the image-side lens 1 ', it is possible to eliminate the need for adjusting the focusing position at the time of assembly. The distance between the subject-side lens 9 and the image-side lens 1'can be finely corrected by changing the thickness of the diaphragm plate 3.

Note that, regardless of the above embodiment, the subject side lenses 9 and 9'may be a positive lens, a tele converter, a wide converter or the like. Further, when higher image quality is desired, the lens unit may be composed of three or more lenses. Furthermore, if the lens unit is configured as a zoom lens composed of a plurality of lens groups, the focal length can be made variable, and it becomes possible to cope with more shooting applications.

Although the present invention has been described above with reference to the exemplary embodiments, the present invention should not be construed as being limited to the above-described exemplary embodiments, but it goes without saying that appropriate modifications and improvements are possible. is there. For example, in the present embodiment, the image sensor 2b and the substrate PC are connected by the wire W, but the image sensor 2 is provided with wiring inside.
A configuration in which a signal is taken out from the back surface (the side opposite to the photoelectric conversion unit) or the side surface of b is also considered. With such a configuration, it is possible to secure a wide peripheral surface of the image sensor and easily connect the wires. Further, in the present embodiment, the image pickup unit is composed of only the bare chip image pickup element, but it is also conceivable to form a monolithic image pickup unit by sticking a plate material such as glass on the upper surface or the lower surface thereof. The image pickup device of the present invention is a mobile phone, a personal computer, a PD.
It can be incorporated into various devices such as A, AV devices, televisions, home appliances, etc.

[0079]

According to the present invention, the image pickup apparatus is inexpensive, can reduce the number of parts, can be miniaturized, can be accurately assembled even without adjustment, and has a dustproof and moistureproof structure. Can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view of an image pickup apparatus according to a first embodiment.

FIG. 2 is a perspective view of the image pickup apparatus in FIG.

FIG. 3 is a perspective view of an optical member.

FIG. 4 is a bottom view of an optical member.

FIG. 5 is a top view of the image sensor.

FIG. 6 is a cross-sectional view showing an example of a conventional imaging device.

FIG. 7 is a cross-sectional view of an imaging device according to a second embodiment.

FIG. 8 is an aberration diagram regarding a first example (Example 1) of the lens portion 1a of the optical member 1 that is applicable to the embodiments of FIGS.

FIG. 9 is an aberration diagram of a second example (Example 3) of the lens portion 1a of the optical member 1 that can be applied to the embodiments of FIGS.

FIG. 10 is a cross-sectional view of an image pickup apparatus according to a third embodiment.

11 is an aberration diagram regarding a third example (Example 3) of lens portions 1a ′ and 9a of the optical member 19 applicable to the embodiment in FIG.

FIG. 12 is a cross-sectional view of an image pickup apparatus according to a third embodiment.

FIG. 13 is an aberration diagram regarding a fourth example (Example 4) of lens portions 1a ′ and 9a ′ of an optical member 19 ′ that can be applied to the embodiment in FIG.

[Explanation of symbols]

1, 19, 19 'optical member 1a, 1a 'lens part 1c leg 1d contact part 2 Imaging unit 2a Surrounding surface 2b image sensor 2d photoelectric converter 3 diaphragm 4 mirror frame 5 Light shield 6 Elastic member 7 filters 8 Light-shielding sheet 9 Subject side lens 9a, 9a 'lens part 1'Image side lens 5'holding member 7'filter

─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. ⁷ Identification Code FI Theme Coat (Reference) G02B 7/02 G02B 7/02 Z 13/00 13/00 13/18 13/18 H04N 5/335 H04N 5 / 335 V (72) Inventor Kazuo Niu 2970 Ishikawa-cho, Hachioji-shi, Tokyo Konica stock company (72) Inventor Yasushi Hoshino 2970 Ishikawa-cho, Hachioji-shi, Tokyo F term (reference) 2H044 AA09 AA15 AA17 AB09 AB11 AB13 AB25 AE01 AG01 2H087 KA02 KA03 LA01 PA01 PA02 PA17 PB01 PB02 QA02 QA03 QA07 QA12 QA21 QA32. EX51 GY31

Claims (27)

[Claims] 1. An image pickup device arranged on a substrate, comprising: a photoelectric conversion unit in which pixels are arranged; a peripheral surface formed around the photoelectric conversion unit; and a side surface intersecting with the peripheral surface. An image sensor mounted on the substrate; a lens unit for forming a subject image on the photoelectric conversion unit included in the image sensor; and a leg unit that is integrated with the lens unit and supports the lens unit. And an optical member having a contact surface that contacts the image sensor, wherein the contact surface of the optical member directly contacts only the peripheral surface of the image sensor, or An imaging device, wherein when a surface material is provided on the peripheral surface of the element, the element is in contact with only the peripheral surface or the surface material. 2. A connection terminal for connecting the image pickup device and the substrate is formed on the peripheral surface, and the contact surface of the optical member is located at a position closer to the photoelectric terminal than the connection terminal. The image pickup apparatus according to claim 1, wherein the image pickup apparatus is in contact with the peripheral surface on the conversion unit side. 3. The image pickup device according to claim 1, wherein the photoelectric conversion unit is arranged in a central portion of the image pickup element. 4. The image processing circuit of the image pickup device according to claim 1, wherein an image processing circuit of the image pickup device is arranged inside the image pickup device and inside the peripheral surface. Imaging device. 5. The image pickup apparatus according to claim 1, further comprising an elastic member that presses the optical member in an optical axis direction. 6. The lens unit is disposed closer to the subject than the lens unit,
The image pickup apparatus according to claim 5, further comprising a cover member that presses the optical member via the elastic member, at least a part of which is capable of transmitting light. 7. The image pickup apparatus according to claim 6, wherein the light-transmittable portion of the cover member is formed of a material having an infrared absorption property. 8. A first diaphragm that defines an F number of the lens unit, and a second diaphragm that is disposed on the subject side with respect to the first diaphragm and that regulates peripheral light flux. The imaging device according to any one of claims 1 to 7. 9. The lens unit has a first diaphragm that defines an F number on the subject side and is composed of a positive single lens with a surface having a strong curvature facing the image side. ~
9. The imaging device according to any one of 8. 10. The image pickup apparatus according to claim 1, wherein the lens unit is composed of two or more lenses. 11. The image pickup apparatus according to claim 10, wherein the lens unit includes at least one positive lens and at least one negative lens. 12. The lens closest to the image side of the lens unit is a positive lens, and a first diaphragm defining an F number is arranged closer to the subject than the lens closest to the image side. The imaging device according to claim 10. 13. The lens is positioned in the direction orthogonal to the optical axis by engaging a surface provided on each lens of the lens unit parallel to the optical axis. The imaging device according to any one of 1 to 12. 14. An image pickup device arranged on a substrate, comprising: a photoelectric conversion unit in which pixels are arranged; and a peripheral surface formed around the photoelectric conversion unit, the image pickup device being mounted on the substrate. An image pickup element, a lens section for forming a subject image on the photoelectric conversion section provided in the image pickup element, a leg section that is integrated with the lens section and supports the lens section, and abuts on the image pickup element An optical member having an abutting surface, and a lens frame that holds the optical member, wherein the abutting surface of the optical member directly abuts a peripheral surface of the image pickup element, or the imaging In the case where a surface material is provided on the peripheral surface of the element, the lens section and the photoelectric conversion section of the image sensor can be positioned in the optical axis direction by contacting only the peripheral surface or the surface material. And the lens frame is installed on the substrate. And wherein in that the optical member is held by the lens frame, an image pickup apparatus with a positioning direction perpendicular to the optical axis of the lens portion and said photoelectric conversion unit provided in the image pickup device is performed. 15. A connection terminal for connecting the image pickup device and the substrate is formed on the peripheral surface,
The imaging device according to claim 14, wherein the contact surface of the optical member contacts the peripheral surface on the photoelectric conversion unit side with respect to the connection terminal. 16. The photoelectric conversion unit is arranged in the central portion of the image pickup device, according to claim 14 or 1.
The imaging device according to item 5. 17. The image processing circuit of the image pickup device is arranged inside the image pickup device and inside the peripheral surface, according to any one of claims 14 to 16. Imaging device. 18. The image pickup apparatus according to claim 14, further comprising an elastic member that presses the optical member against the lens frame in the optical axis direction. 19. The cover member, which is disposed closer to the subject than the lens portion and presses the optical member via the elastic member, at least a part of which has a cover member capable of transmitting light. The imaging device described. 20. The image pickup device according to claim 19, wherein the light-transmittable portion of the cover member is formed of a material having an infrared absorption property. 21. The image pickup apparatus according to claim 14, wherein the optical member is insertable into the lens frame from the subject side. 22. A first diaphragm that defines an F number of the lens unit, and a second diaphragm that is disposed on the subject side with respect to the first diaphragm and that regulates peripheral light flux. The imaging device according to any one of claims 14 to 21. 23. The lens unit has a first diaphragm that defines an F number on the object side, and is composed of a positive single lens with a surface having a strong curvature facing the image side.
The imaging device according to any one of 4 to 22. 24. The image pickup apparatus according to claim 14, wherein the lens unit is composed of two or more lenses. 25. The image pickup apparatus according to claim 24, wherein the lens unit includes at least one positive lens and at least one negative lens. 26. The lens closest to the image side in the lens unit is a positive lens, and the first diaphragm defining the F number is disposed closer to the subject than the lens closest to the image side. The imaging device according to claim 24 or 25. 27. The positioning of each lens in the direction orthogonal to the optical axis is performed by engaging a surface provided on each lens of the lens unit parallel to the optical axis. 27. The imaging device according to any one of to 26.