JPH11290269A - Solid photographing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid photographing apparatus in which positioning can be simply and accurately fixed and which is suitable for miniaturization. SOLUTION: A solid photographing apparatus 1 is provided with a CCD chip 3 with a photosensitizing part at the center of a CCD base plate 2, an LED 4 so as to be embedded in the vicinity of the front face of the CCD base plate 2 projecting more forward than the photosensitizing part around it and furthermore, a recessed part 7 for positioning and fixing an objective lens group 23 at the front part of the photosensitizing part to provide a structure being suitable for miniaturization and in which the objective lens group 23 can be simply and accurately positioned and fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device having a solid-state imaging device and a light-emitting device on the same substrate.

[0002]

2. Description of the Related Art In recent years, endoscopes have been widely used in the medical and industrial fields. The endoscope includes an optical endoscope employing an image guide for transmitting an optical image formed by an objective lens, and a charge-coupled device (abbreviated as CCD) at a position where the image is formed by the objective lens. 2. Description of the Related Art There is an electronic endoscope in which a solid-state imaging device such as) is arranged, and an image signal picked up by the solid-state imaging device is signal-processed and displayed on a monitor.

In order to reduce the size of an electronic endoscope, Japanese Patent Application Laid-Open No.
Japanese Patent Application Publication No. -153097 discloses a solid-state imaging device provided with a light-emitting element. This publication discloses a solid-state imaging device in which an imaging element section and a light-emitting element section are provided on the same semiconductor substrate.

[0004]

However, in the conventional example of the above publication, when an apparatus having a function of performing illumination and imaging such as an electronic endoscope is to be constructed, an objective optical system and the like may be further provided. This necessitates time and effort in assembling the objective optical system, and also necessitates adjustment of the deviation of the optical axis in the assembling, which makes it difficult to accurately position them.

An object of the present invention is to provide a solid-state imaging device which can be easily and accurately positioned and fixed, and is suitable for miniaturization.

[0006]

A solid-state imaging device having a solid-state imaging device having a photosensitive portion for receiving and photoelectrically converting light on the same substrate, and a light-emitting device for emitting light, the substrate having the solid-state imaging device in front of the photosensitive portion. By providing a concave portion for accommodating the objective optical system to be installed and providing a light emitting element around the concave portion, the size can be reduced, and the objective optical system can be accommodated in the concave portion and easily positioned and fixed accurately.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIGS. 1 to 5 relate to a first embodiment of the present invention, FIG. 1 shows a configuration of a solid-state imaging device according to the first embodiment, and FIG. 3 is a cross-sectional view of the solid-state imaging device with the objective optical system attached thereto, FIG. 4 shows a structure of the objective optical system in the first modification, and FIG. 14 shows a solid-state imaging device according to a second modification.

As shown in FIG. 1, in a solid-state imaging device 1 according to a first embodiment of the present invention, for example, a charge imaging device (abbreviated as CCD) chip 3 is provided at a central portion of a CCD substrate 2. For example, up and down (left and right in FIG. 2) of the CCD chip 3
A light emitting diode (LE) as a plurality of light emitting elements
D) 4 and a solid-state imaging device (charge coupled device in a specific example) 5 integrally provided. The CCD substrate 2 is formed of a heat-resistant substrate made of, for example, ceramic or another insulating material, but may be formed of a semiconductor substrate.

The CCD chip 3 has, for example, a square plate shape, and a mosaic filter 6a for optically color-separating is attached to a light receiving surface as a photosensitive portion for receiving light on the front surface of the CCD chip 3 and performing photoelectric conversion. Further, the front surface is protected by a cover glass 6b.

FIG. 2 shows this solid-state image pickup device 5 portion. As shown in FIG. 2, a cylindrical concave portion 7 is provided in the front part of the light receiving surface of the CCD chip 3 as an objective optical system mounting portion (or a positioning and fixing portion of the objective optical system).

In this case, for example, a square light receiving surface is provided so that the center position coincides with the center position of the CCD chip 3, and the concave portion 7 is formed so that the central axis of the concave portion 7 coincides with the central axis. It is provided on the CCD substrate 2.

The LEDs 4 arranged on both sides of the CCD chip 3 project forward from the light receiving surface, and are provided on the CCD substrate 2 so as to be embedded in the CCD substrate 2 so as to be located near the front surface of the CCD substrate 2. And LED4
The LED lead 9 extending from the CCD substrate 2 passes through the inside of the CCD substrate 2 and protrudes from the back surface of the CCD substrate 2.

As shown in FIG. 1, a CCD lead 11 projecting from the back surface of the CCD substrate 2 is connected to a signal line 13 forming
Some are connected to a circuit board 14 arranged on the back surface of the.

Electronic components such as an IC 16 and a capacitor 17 sealed with a sealing resin 15 are mounted on the circuit board 14.
The output signal of the CD chip 3 is subjected to current amplification or impedance conversion, etc., to prevent the output signal from being attenuated when the signal is transmitted through the signal line 13 connected to the circuit board 14, and to achieve a good S / N ratio. Secure.

The CCD lead 11, the circuit board 14 and the like are CC
The outer periphery of the rear end of the D substrate 2 is covered with a conductive shield frame 18 whose front end is fixed, and an insulating filler 1
9, and the outside thereof is covered with an insulating covering member 20 such as a heat-shrinkable tube.

As the LED 4 in the present embodiment, for example, a white light emitting LED is employed. As schematically shown in FIG. 1, the white light emitting LED is disposed in a blue light emitting LED 21a which emits blue light in an LED package, and is disposed on the front surface thereof. And a white fluorescent plate 21b that emits white light by receiving blue light. An illumination lens 22 such as a convex lens is provided in front of the white fluorescent plate 21b. In addition, LED
The package is made of metal and has a function of blocking light so that light does not leak to the side.

In this embodiment, the solid-state imaging device 5 is provided with a cylindrical concave portion 7, and as an objective optical system (for example, a first lens 23a and a second lens 23a) as shown in FIG.
The objective lens group 23 (comprising the lens 23b) can be easily positioned and fixed.

That is, when the objective lens group 23 is mounted, as shown in FIG. 3, an annular spacer (interval ring) 24a fitted in the concave portion 7 and fitted at a predetermined interval is fitted into the concave portion 7. The second lens 23b to be inserted is fitted, the next spacer 24b is further fitted, and the first lens 23a is fitted and fixed with an adhesive or the like.
3 can be accurately positioned and fixed. The illumination lens 22 provided on the LED 4 is a lens having characteristics suitable for illuminating the image formation range of the objective lens group 23.

The solid-state imaging device 1 is housed at the distal end of the insertion portion of the electronic endoscope, so that it is possible to form a small-sized imaging means for performing illumination and imaging. The general cable 12 is inserted through the electronic endoscope and connected to a video processor (not shown) as a signal processing device.

In the video processor, an LED power supply unit connected to the LED 4 via the integrated cable 12 and C
A drive circuit that outputs a drive signal to the CD chip 3 and a video signal processing circuit that generates a standard video signal by, for example, amplifying a photoelectrically converted signal from the CCD chip 3 are connected.

The LED power supply unit supplies, for example, a DC light emitting power supply to the LED 4 to emit white light, and a subject such as a diseased part illuminated with the white light is subjected to a light receiving surface of the CCD chip 3 by the objective lens group 23. The signal is subjected to color separation by the mosaic filter 6a, is formed into an image, and the photoelectrically converted signal is converted into a standard video signal by a video signal processing circuit, and a subject image is displayed in color on a monitor device (not shown).

In this embodiment, a small-sized solid-state imaging device 5 provided with a CCD chip 3 as a solid-state imaging device having a photosensitive portion for receiving light and performing photoelectric conversion on the same CCD substrate 2 and an LED 4 for emitting light is provided. Since the solid-state imaging device 1 is formed, when the electronic imaging device is housed in the distal end portion of the electronic endoscope, the distal end portion can be downsized.

Further, since the concave portion 7 for fitting and storing the objective optical system provided in front of the photosensitive section is provided on the CCD substrate 2, the objective optical system can be easily and accurately positioned and fixed in the concave portion 7. .

Therefore, even in the case of a small objective optical system,
Positioning and fixing can be easily performed, adjustment of mounting can be made almost unnecessary, assembly can be performed with required accuracy without trouble, and deterioration of image quality can be prevented. On the other hand, in the conventional example, the size can be reduced, but since the positioning means is not taken into consideration, it takes time and effort to adjust the mounting. This has the effect of deteriorating the image quality).

Further, since the LEDs 4 having the illumination lenses 22 integrated on both sides around the objective optical system are integrally disposed on the CCD substrate 2, no additional labor for assembling the illumination lenses is required.

Therefore, according to the present embodiment, the objective optical system can be accurately positioned and fixed, for example, the size of the solid-state imaging device 1 can be reduced and the deviation of the optical axis can be reduced.
Variation can be reduced, and image quality obtained by imaging can be secured (high quality image quality can be maintained).

The ring-shaped peripheral portion of the second lens 23b in FIG. 3 with which the spacers 24a and 24b abut may be formed in a planar shape so that the objective lens group 23 can be accurately positioned and fixed. In this case, the positioning can be performed more accurately. In addition, a structure that can be positioned and fixed more easily and accurately as described below may be adopted.

For example, a first modification shown in FIG. 4 may be used. In this modification, the first lens 23 in which the spacer 24b of FIG.
a ', and the second lens 23b is a second lens 23b' to which the spacer 24a of FIG. 3 is integrally attached. According to this modification, it is possible to easily assemble the effects of the first embodiment. Further, the deviation of the optical axis can be reduced. Also in this case, the portion of the second lens 23b that contacts the spacer 24b may be flat.

FIG. 5 shows a mounting structure of an objective optical system according to a second modification. In the second modification, the objective optical system is a single lens unit 31. That is, the first lens 23a and the second lens 2 that constitute the objective lens group 23
3b is fixed to a predetermined position on the lens frame 32 by a spacer 33 in advance.

Therefore, according to the second modification, as shown in FIG. 5, the lens unit 31 may be fitted into the concave portion 7 and fixed with an adhesive or the like. In the second modified example, the positioning and fixing can be performed with high accuracy without further assembling and fixing.

In the above description, the LED 4 is described as a white LED that emits white light. However, an LED that emits red, green, and blue lights at the same time to emit white illumination light may be used. Surface-sequential illumination light may be obtained in which LEDs emitting blue light are sequentially emitted.

(Second Embodiment) FIG. 6 shows a second embodiment of the present invention.
1 shows a solid-state imaging device 41 according to the embodiment. The solid-state imaging device 41 according to the present embodiment is basically the same as the first embodiment except that a cooling unit is provided.

In the solid-state imaging device 41 shown in FIG. 6, a Peltier device 42 is provided on the back of the CCD substrate 2 of the solid-state imaging device 5.
The heat-absorbing side substrate 43 provided on one surface of the substrate is fixed.
The heat radiation side substrate 44 on the other surface of the Peltier element 42 is connected to a Peltier element power supply line 45 provided on the integrated cable 12.

In this embodiment, since the heat absorbing side substrate 43 is attached to the back surface of the CCD substrate 2, the structure shown in FIG.
The CCD lead 11 projecting from the back of the CD substrate 2 is
It extends rearward from the upper and lower surfaces of the CD substrate 2 and is connected to the signal lines 13 and the circuit substrate 14 as in the case of FIG.

Also, since the CCD leads 11 are provided on the upper and lower surfaces of the CCD substrate 2, in this embodiment, the CCD holder 46 is provided on the outer periphery of the CCD substrate 2 and the shield frame 18 is provided.
, And the outside thereof is covered with a covering member 20. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

According to the present embodiment, in addition to the effects of the first embodiment, the CCD chip 3 of the solid-state
It is possible to effectively prevent the temperature from rising due to the heat generated at the time of light emission of D4, and to effectively prevent the characteristic deterioration or destruction of the CCD chip 3 from occurring.

That is, the CCD chip 3 and the LED 4 are connected to C
When provided on the CD substrate 2, the LED 4 generates heat and the heat is conducted to the CCD chip 3 side, and the temperature of the CCD chip 3 may exceed the operating range. 3 can suppress the temperature rise.

A temperature sensor may be provided at a position near the CCD chip 3 on the CCD substrate 2 to control the cooling operation of the Peltier element 42 by the temperature sensor.
For example, normally, the cooling operation of the Peltier element 42 is turned off.
When the temperature reaches a certain level or higher, the cooling operation of the Peltier element 42 may be turned on.

When the cooling operation of the Peltier element 42 is always turned on and the temperature still exceeds a certain level, the light emission of the LED 4 is restricted (low light emission or light emission is stopped), In accordance with this, the functions of the CCD imaging and signal processing are controlled.

FIG. 7 shows a main part of the first modification.
In the first modification, the solid-state imaging device 5 extends rearward on the back surface of the CCD substrate 2 so that the CCD lead 11 penetrates, for example, the Peltier element 42, similarly to the first embodiment. Further, the heat radiation side substrate 44 of the Peltier element 42
Is connected to a Peltier element power supply line 45.

FIG. 8 shows a solid-state imaging device 51 of a second modification. In the second modification, LED4 is replaced with LED4 in FIG.
4 ', a solid-state imaging device 5' in which the LED 4 'is formed adjacent to the light receiving surface of the CCD chip 3, and a lens in which an illumination lens group 53 and an objective lens group 23 mounted by a CCD holder 46 are mounted. The frame 52 and the CCD substrate 2 are fixed.

Further, in the second modified example, the LED 4 ′ has a structure in which, for example, the illumination lens 22 is not provided in the LED 4 of FIG. The other configuration is the same as that of FIG. 6, and the same members are denoted by the same reference numerals and description thereof will be omitted.

In the solid-state imaging device 51, the CCD substrate 2 itself is not provided with the concave portion 7 for positioning and fixing the objective optical system, but means for positioning and fixing the objective optical system and the illumination optical system are formed by the CCD holder 46. I have. Therefore, also in this case, the objective optical system in front of the light receiving surface of the CCD chip 3 can be accurately positioned, and the illumination optical system in front of the LED 4 can be accurately positioned.

A groove is provided on one of the inner peripheral surface of the CCD holder 46 and the outer peripheral surface of the lens frame 52, and a convex portion which fits into the groove is provided on the other, so that circumferential positioning can be performed. May be.

FIG. 9 shows the structure of the distal end portion 61 of the insertion section 60 of the electronic endoscope which can switch between direct viewing and side viewing. Tip 6
In FIG. 1, a direct-view objective lens group 62 and a direct-view illumination lens group 63 are arranged adjacent to each other in the longitudinal direction, and a solid-state image sensor 64 is arranged at a rear position on the optical axis.

The solid-state imaging device 64 has a CCD substrate 65 on which a CCD chip 66 and an LED 67 are provided adjacent to each other.
The light receiving surface of the CCD chip 66 is covered with a cover glass 68. The center of the light receiving surface of the CCD chip 66 is located at the rear position on the optical axis of the direct-view objective lens group 62, and the LED 67 emits light at the rear position on the optical axis of the direct-view illumination lens group 63. It is arranged so that the center of the part is located.

Further, between the direct-viewing objective lens group 62 and the CCD chip 66, and between the direct-viewing illumination lens group 63 and the LED 6
The prisms 70 and 71 attached to the prism frame 69 are removably inserted between the prisms 7 and 7. These two prisms 70 and 71 are arranged so as to be shifted from each other in the longitudinal direction of the distal end portion 61.

Further, on the side portion of the distal end portion 61, for example, on the side surface portion which becomes the upper side, the optical axis thereof is directed to the side portion, and the objective lens group 72 for side view and the illumination lens group 73 for side view ( Note that the lens denoted by reference numeral 73 'moves together with the prism frame 69). Further, a rod lens 74 is disposed on the front surface of the LED 67.

Then, as shown in FIG.
Between the light receiving surface of the CCD chip 66 and the prism 70, 71
In a state where the ED 67 is arranged at a position facing the ED 67, the illumination light is emitted in the side viewing direction, and an image can be captured in the side viewing direction.

FIG. 10 is a schematic view of this state viewed from the front end surface.
Shown in The prisms 70 and 71 are positioned on the optical axis of the direct-view objective lens group 62 and the direct-view illumination lens group 63. In this state, the light of the LED 67 is emitted to the side and the side is imaged. In FIG. 10, a nozzle 75 is provided adjacent to the direct-view objective lens group 62, and a channel 76 is provided adjacent to the direct-view illumination lens group 63.

When the prism frame 69 is moved from this state to the other side as shown by a dotted line in FIG. 10, illumination and imaging can be performed in the direct viewing direction. This prism frame 6
9 can be moved by driving an operation wire (not shown) or a motor (not shown).

Further, as shown in FIG.
The CCD lead 78 protruding from the rear surface of the cable 79 is connected to the signal line 80 of the cable 79 and the circuit board 81. Electronic components such as an IC 83 and a capacitor 84 sealed with a sealing resin 82 are mounted on the circuit board 81. The circuit board 81 is connected to the signal line 80.

According to this electronic endoscope, direct and side viewing can be observed with a small size by switching operation. Therefore, one electronic endoscope can be used for a wide range of applications. It should be noted that embodiments and the like configured by combining the above-described embodiments and the like in a partial manner also belong to the present invention.

[Appendix] 1. In a solid-state imaging device including a solid-state imaging device having a photosensitive unit that receives light and performs photoelectric conversion on the same substrate, and a light-emitting device that emits light, an objective optical system installed in front of the photosensitive unit is housed on the substrate. A solid-state imaging device comprising: a concave portion; and a light emitting element disposed around the concave portion. 2. 2. The solid-state imaging device according to claim 1, wherein a Peltier element is integrally provided on the substrate.

3. A solid-state imaging device including a solid-state imaging device having a photosensitive portion that receives light and performs photoelectric conversion on the same substrate and a light-emitting device that emits light, wherein the Peltier element is integrally provided on the substrate. 4. In a solid-state imaging device having a solid-state imaging device having a photosensitive portion that receives light and performs photoelectric conversion on the same substrate and a light-emitting device that emits light, an objective optical system installed in front of the photosensitive portion on the substrate is fixedly positioned. A solid-state imaging device, comprising:

5. In a solid-state imaging device having a solid-state imaging device having a photosensitive portion that receives light and performs photoelectric conversion on the same substrate, and a light-emitting device that emits light, the solid-state imaging device is provided in front of the objective optical system and the light-emitting device installed in front of the photosensitive portion. A solid-state imaging device comprising a ring-shaped member for positioning and fixing an illumination optical system to be arranged.

[0057]

As described above, according to the present invention, there is provided a solid-state imaging device including a solid-state imaging device having a photosensitive portion that receives light and performs photoelectric conversion on the same substrate, and a light-emitting device that emits light. A concave portion for accommodating the objective optical system installed in front of the photosensitive portion is provided on the substrate, and the light emitting element is arranged around the concave portion, so that the size can be reduced, and
The objective optical system is housed in the concave portion, and can be easily positioned and fixed with high accuracy.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a solid-state imaging device according to a first embodiment of the present invention.

FIGS. 2A and 2B are a front view and a perspective view showing a solid-state imaging device; FIG.

FIG. 3 is a cross-sectional view of the solid-state imaging device with an objective optical system attached.

FIG. 4 is a side view showing the structure of an objective optical system according to a first modification.

FIG. 5 is a cross-sectional view illustrating a solid-state imaging device according to a second modification.

FIG. 6 is a cross-sectional view illustrating a configuration of a solid-state imaging device according to a second embodiment of the present invention.

FIG. 7 is a sectional view showing the structure of a solid-state imaging device according to a first modification of the second embodiment;

FIG. 8 is a cross-sectional view illustrating a configuration of a solid-state imaging device according to a second modification of the second embodiment.

FIG. 9 is a diagram showing a structure of a distal end portion of an electronic endoscope that can switch between direct viewing and side viewing.

FIG. 10 is a schematic view as viewed from the front in FIG. 9;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Solid-state imaging device 2 ... CCD board 3 ... CCD chip 4 ... LED 5 ... Solid-state imaging device 6b ... Cover glass 7 ... Concave 9 ... LED lead 11 ... CCD lead 12 ... Overall cable 13 ... Signal line 14 ... Circuit board 18 ... Shield frame 19 ... Filler 20 ... Covering member 21a ... Blue light emitting LED 21b ... White fluorescent plate 22 ... Illumination lens 23 ... Objective lens group 24a, 24b ... Spacer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H04N 7/18 H04N 7/18 M (72) Inventor Keiichi Arai 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industrial Co., Ltd. Within the company (72) Inventor Takashi Mihori 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industrial Co., Ltd. (72) Inventor Akihiro Miyashita 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industrial Co., Ltd. Inside the company (72) Inventor Masakazu Omoto 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Industrial Co., Ltd. (72) Inventor Makoto Tsunakawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Inside the corporation

Claims (1)

[Claims] 1. A solid-state imaging device having a solid-state imaging device having a photosensitive portion for receiving light and performing photoelectric conversion on the same substrate, and a light-emitting device for emitting light, wherein an object installed on the substrate in front of the photosensitive portion. A solid-state imaging device comprising a concave portion for housing an optical system, and a light-emitting element disposed around the concave portion.