JP2003046408A - Hybrid high frequency component and mobile communication equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency circuit in which the number of active switch components such as diodes can be decreased and to provide a hybrid high frequency component. SOLUTION: The hybrid high frequency component 1 formed with the high frequency circuit 9 in compliance with the GSM(Global System for Mobile communications) and the DSC(Digital Cellular System) is provided with a high frequency switch section 10 and first and second diplexer sections 20, 30. The high frequency switch section 10 turn on/off two diodes 12, 15 at first and second control terminals VC1, VC2 to select transmission or reception. In the hybrid high frequency component 1, the first and second diodes 12, 15 are mounted on a major side 2B of a ceramic multi-layered board 2, and the high frequency switch section 10 and the first and second diplexer sections 20, 30 are integrally configured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency circuit used in a communication device such as a mobile communication system, a composite high frequency component realized by a single component, and a mobile communication device using the same.

[0002]

2. Description of the Related Art At present, as a mobile communication device, a DCS (Dig) using a plurality of high frequency bands, for example, 1.8 GHz band is used.
G using ital Cellular System) and 900MHz band
2 of SM (Global System for Mobile communications)
Dual-band mobile phones capable of operating in one communication system are known. Furthermore, for example, PCS (Persona
In addition to other communication systems such as lCommunication Services), triple band mobile phones that can operate with three communication systems have been proposed.

In such a portable telephone set, for example, a dual band portable telephone set, for example, as shown in FIG. 3, between a shared antenna ANT and a transmitting section or receiving section composed of an amplifier for a transmission signal or a reception signal. A high frequency circuit 100 shown in the circuit diagram is provided. The high frequency circuit 100 includes an antenna ANT and a transmitter TX1 in a GSM communication system.
Two transmitters T are provided between the receiver RX1 and the transmitters TX2 and RX2 in the DCS communication system.
The transmission signals output from X1 and TX2 are combined and transmitted from the antenna ANT, or the antenna ANT is connected.
The reception signal received by the two reception units RX according to the frequency
1 or RX2 is sent separately.

The high frequency circuit 100 is divided into a plurality of functional blocks. That is, it includes a diplexer unit 110 connected to the antenna ANT, first and second high frequency switch units 120 and 130, and first and second low pass filter units 140 and 150. The diplexer unit 110 includes a low-pass filter including capacitors 111 and 113 and a coil 112, and a high-pass filter including capacitors 114, 115 and 117 and a coil 116, and when transmitting, a DCS or GSM transmission signal. , And the received signal of DCS or GSM is distributed at the time of reception. Specifically, the first high frequency switch unit 120
The GSM transmission signal from the antenna ANT is transmitted to the antenna ANT, and the GSM reception signal from the antenna ANT is transmitted to the first high frequency switch unit 120. On the other hand, the DCS transmission signal from the second high frequency switch unit 130 is sent to the antenna ANT, and the DCS reception signal from the antenna ANT is sent to the second high frequency switch 130.

In the first high frequency switch section 120, the GS
The transmission unit TX1 side and the reception unit RX1 side of M are switched.
Specifically, when a positive potential is applied from the control terminal V1P to the anode side of the diode 122 through the coil 123 and a ground potential or a negative potential is applied from the control terminal V1M to the cathode side of the diode 125 through the resistor 127, 2
The two diodes 122 and 125 are turned on (low impedance). Therefore, the first low-pass filter unit 1
The GSM transmission signal transmitted from the transmission unit TX1 through 40 can be transmitted to the diplexer unit 110 through the diode 122 and the capacitor 121. On the other hand, since the diode 125 is in the ON state, the one end 124P of the ¼λ line 124 is in the grounded state, and the other end 124Q on the diplexer unit 110 side is phase-inverted and is in the open state. Therefore, from the side of the diplexer unit 110 and the side of the diode 122, the reception unit RX1 appears to be disconnected, and the reception signal cannot be transmitted.

On the other hand, when the control terminal V1P is set to the ground potential or the negative potential and the control terminal V1M is set to the positive potential or the ground potential, the two diodes 122 and 125 are provided.
Both are turned off (high impedance), and the transmitter TX
The GSM transmission signal sent from the
Is blocked and cannot be sent to the diplexer unit 110. On the other hand, since the diode 125 is in the off state, 1
A GSM reception signal can be sent from the diplexer unit 110 side to the reception unit RX1 through the / 4λ line 124.
As described above, in the first high-frequency switch unit 120, the GSM
The transmission signal and the reception signal in the communication system are switched.

Similarly, the second high frequency switch section 130 switches between the transmission section TX2 side and the reception section RX2 side of the DCS. Specifically, by applying a positive potential to the control terminal V2P and a ground potential or a negative potential to the control terminal V2M, 2
By turning on the two diodes 132 and 135, the transmission section T is transmitted through the second low-pass filter section 150.
The DCS transmission signal sent from X2 is transmitted to the diplexer unit 1
Send to 10. At this time, the reception unit RX2 appears to be disconnected from the diplexer unit 110 side and the diode 132 side, and the reception signal cannot be transmitted. On the other hand, the control terminal V1P is set to the ground potential or the negative potential and the control terminal V2
If M is a ground potential or a positive potential, the transmitter TX2
The DCS transmission signal sent from the receiving unit R is blocked by the diode 122 while the diplexer unit 110 side receives the signal from the receiving unit R.
A DCS reception signal can be sent to X2.

The first low-pass filter section 140
Transmits the GSM transmission signal and attenuates the second and third harmonics. In addition, the second low-pass filter section 150 passes the DCS transmission signal and attenuates the second harmonic and the third harmonic.

[0009]

However, it is necessary to use expensive active switch components such as diodes in the high frequency switch section of this high frequency circuit. In constructing such a high-frequency circuit as a composite high-frequency component made up of a multilayer substrate and chip components, capacitors, coils, etc. can be mounted as chip components on the main surface of the multilayer substrate. Can be incorporated into. However, since active switch components such as diodes must be mounted separately as chip components on the main surface of the multilayer substrate, etc., when the number of high-frequency switch parts increases, the number of active switch components such as diodes also increases. The area ratio occupying the main surface on which the chip is mounted becomes large, which may hinder the mounting of other chip parts.

The present invention has been made in view of the above problems, and an object thereof is to provide a high frequency circuit and a composite high frequency component in which the number of active switch components such as diodes is reduced.

[0011]

[Means for Solving the Problems, Actions and Effects] However, the means for solving the problems corresponds to a plurality of communication systems which use different high frequency bands, and combines transmission signals from the transmitters of the respective communication systems. A high frequency circuit that sends to the antenna side, separates the received signal from the antenna side and sends to the corresponding receiving section of the communication system, and sends the sending signal to the antenna side at the time of transmission and at the time of receiving. In order to send the received signal to the receiving unit side, a high-frequency switch unit configured to switch between transmission and reception,
A coupling circuit unit that combines the transmission signals from the transmission units of the respective communication systems and sends them to the high frequency switch unit, and a reception unit of the corresponding communication system that separates the reception signals from the high frequency switch units. And a separating circuit section for sending the high frequency circuit.

In the high-frequency circuit of the present invention, the high-frequency switch section that requires active switch components such as diodes is
Therefore, compared to the above-mentioned conventional technology,
The number of expensive active switch components such as diodes can be reduced. Looking at one communication system, the transmission signal and the reception signal are switched by the high frequency switch unit. Therefore, as in the above-mentioned conventional technique, the signals are first separated for each communication system by the frequency band,
After that, unlike the case where the transmission signal and the reception signal are switched with a switch, the separation between the transmission signal and the reception signal is good, and a part of the transmission signal leaks to the receiving unit, and crosstalk in which the user's voice is heard is less likely to occur. Become.

Another solution is to combine the transmission signals from the transmitters of the respective communication systems and send them to the antenna side,
A composite high-frequency component that separates the received signal from the antenna side and sends it to the corresponding receiving portion of the communication system,
When transmitting, the transmission signal is sent to the antenna side, and when receiving, the reception signal is sent to the receiving unit side.
A high-frequency switch unit configured to switch between transmission and reception, a coupling circuit unit that couples the transmission signals from the transmission units of the respective communication systems and sends the signals to the high-frequency switch unit, and a high-frequency switch unit. A separation circuit unit that separates the reception signal and sends the reception signal to a corresponding reception unit of the communication system, wherein the high-frequency switch unit has at least 2
Circuit elements including two independent active switch components, and among the circuit elements forming the high frequency switch section, the coupling circuit section, and the separation circuit section, some of the circuit elements are an insulating layer made of ceramic and a conductor. The remaining circuit elements formed inside the ceramic multilayer substrate formed by stacking layers with the active switch component are mounted on the main surface of the ceramic multilayer substrate, and the high-frequency switch unit, the coupling circuit unit, A composite high frequency component in which a separation circuit section is integrally formed.

In the composite high frequency component of the present invention, since only one high frequency switch section requires an active switch component such as a diode, an expensive active switch component such as a diode is more expensive than, for example, the prior art described above. The number of can be reduced. Further, since the number of active switch components such as diodes to be mounted on the main surface of the ceramic multilayer wiring board can be reduced, other chip components can be easily mounted. Alternatively, the dimensions of the ceramic multilayer wiring board can be made smaller.

Looking at one communication system, the transmission signal and the reception signal are switched by the high frequency switch section. For this reason, unlike the above-mentioned conventional technique, unlike the case where the signal is first separated for each communication system according to the frequency band and then the transmission signal and the reception signal are switched by a switch, the separation between the transmission signal and the reception signal is performed. Is good, and a part of the transmitted signal leaks to the receiving unit, and crosstalk in which the user's voice can be heard is less likely to occur.

Still another solution corresponds to a plurality of communication systems using different high frequency bands, has an antenna terminal, a plurality of transmission input terminals, and a plurality of reception output terminals, and each of the above communication systems. The transmission signal input to the transmission input terminal from the transmission unit is combined and output from the antenna terminal to the antenna side, the reception signal input from the antenna side to the antenna terminal is separated, and the reception is performed. A composite high frequency component for outputting from an output terminal to a corresponding receiving section of the communication system, wherein the transmission signal is output from the antenna terminal during transmission, and the reception signal is received during reception. The high-frequency switch section configured to be capable of switching between the transmission and the reception so as to be transmitted to the side and the transmission signal from each of the transmission input terminals are coupled to each other. A coupling circuit section for sending to the switch section and a separating circuit section for separating the received signal from the high frequency switch section and sending it to the corresponding reception output terminal, wherein the high frequency switch section has one end side thereof. Between a first capacitor connected to the antenna terminal, a first diode interposed between the other end of the first capacitor and the coupling circuit part, and between the other end of the first capacitor and the separation circuit part. And a control circuit section for turning on or off the first diode and the second diode according to a control signal input to the first control terminal and the second control terminal. Among the circuit elements constituting the coupling circuit section and the separation circuit section, some of the circuit elements are inside a ceramic multilayer substrate in which an insulating layer made of ceramic and a conductor layer are laminated. Is formed, the remainder of the circuit elements including a first diode and a second diode, is mounted on the main surface of the ceramic multilayer substrate,
A composite high-frequency component in which the high-frequency switch section, the coupling circuit section, and the separation circuit section are integrally configured.

In the composite high frequency component of the present invention, the high frequency switch section is constructed by using two diodes. Therefore, the number of expensive diodes can be reduced as compared with the above-mentioned conventional technique using four diodes. Therefore, among the components to be mounted on the board, the main surface of the board is largely occupied by the diode having a relatively large area,
It is possible to prevent the mounting of other components from becoming difficult, and to prevent a large substrate from being mounted for mounting other components. In addition, the number of expensive diodes can be reduced to form an inexpensive composite high frequency component. Further, even when supporting three or more communication systems, it is not necessary to increase the number of diodes.

Looking at one communication system, the transmission signal and the reception signal are switched by the high frequency switch section. Therefore, unlike the above-described conventional technique, first, the signal is separated for each communication system according to the frequency band, and thereafter, unlike the case where the transmission signal and the reception signal are switched by the switch, the transmission signal leaks to the receiving unit. Since it is necessary to pass through the second diode that is in the off state, the separation between the transmission signal and the reception signal is good, and part of the transmission signal leaks to the receiving section, and crosstalk in which the user's voice is heard is unlikely to occur. Become.

The orientation of the first and second diodes in the high-frequency switch section, that is, whether the first capacitor side is the anode side or the cathode side, depends on what potential is used for controlling each diode. It may be appropriately selected depending on whether the control voltage (positive voltage or negative voltage) is applied.

Still another solution corresponds to a plurality of communication systems using different high frequency bands, has an antenna terminal, a plurality of transmission input terminals, and a plurality of reception output terminals, and each of the above communication systems. The transmission signal input to the transmission input terminal from the transmission unit is combined and output from the antenna terminal to the antenna side, the reception signal input from the antenna side to the antenna terminal is separated, and the reception is performed. A composite high frequency component for outputting from an output terminal to a corresponding receiving section of the communication system, wherein the transmission signal is output from the antenna terminal during transmission, and the reception signal is received during reception. The high-frequency switch unit configured to switch between the transmission and the reception so as to be transmitted to the side, and the transmission signal from each of the transmission input terminals are coupled to each other to increase the high frequency. Comprising a coupling circuit unit for sending to the switch unit, separates the received signal from the high-frequency switch section, and the corresponding separation circuit for sending to the reception output terminals, a,
The high frequency switch section has a first capacitor connected to the antenna terminal at one end side thereof, a cathode side connected to the other end of the first capacitor, and the transmission signal from the coupling circuit section is inputted from the anode side. A first diode, a second diode whose cathode side is connected to the other end of the first capacitor, and which outputs the reception signal from the anode side to the separation circuit section, and an anode of the first diode at its one end side. A first choke coil connected to the first control terminal at the other end, and a second choke coil connected to the anode of the second diode at its one end and connected to the second control terminal at the other end; The above-mentioned first at one end side of self
A third choke coil connected to the other end of the capacitor and connected to the ground terminal on the other end side, and a part of each of the circuit elements forming the high frequency switch section, the coupling circuit section, and the separation circuit section Circuit element is formed inside a ceramic multilayer substrate formed by laminating an insulating layer made of ceramic and a conductor layer, and the remaining circuit elements including the first diode and the second diode are the main components of the ceramic multilayer substrate. A composite high frequency component mounted on a surface and integrally including the high frequency switch section, the coupling circuit section, and the separation circuit section.

In the composite high frequency component of the present invention, the high frequency switch section is constructed by using two diodes. Therefore, the number of expensive diodes can be reduced as compared with the above-described conventional technique using four diodes, and an inexpensive composite high frequency component can be obtained. For this reason, among the components to be mounted on the board, a diode having a relatively large area occupies a large portion of the main surface of the board, which makes it difficult to mount other components, or a large board for mounting other components. Can be prevented. Further, even when supporting three or more communication systems, it is not necessary to increase the number of diodes.

Looking at one communication system, the transmission signal and the reception signal are switched by the high frequency switch section. Therefore, unlike the above-described conventional technique, first, the signal is separated for each communication system according to the frequency band, and thereafter, unlike the case where the transmission signal and the reception signal are switched by the switch, the transmission signal leaks to the receiving unit. Since it is necessary to pass through the second diode that is in the off state, the separation between the transmission signal and the reception signal is good, and part of the transmission signal leaks to the receiving section, and crosstalk in which the user's voice is heard is unlikely to occur. Become.

The cathode of the first diode is connected to the other end of the first capacitor, and the other end of the first capacitor is grounded through the third choke.
By applying a positive potential to the first control terminal, the first diode can be turned on and a transmission signal can be sent from the coupling circuit section to the antenna terminal. Similarly, since the cathode side of the second diode is also connected to the other end of the first capacitor, the second diode can be applied to the second control terminal by applying a positive potential to the second diode.
The reception signal can be sent from the antenna terminal to the separation circuit unit by turning on the diode. Therefore, it can be easily controlled by the first and second control terminals. If necessary, a current limiting resistor may be interposed between the first diode and the first control terminal, between the second diode and the second control terminal, or between the third choke coil and the ground terminal. Is preferred.

Furthermore, it is preferable that the mobile communication device is compatible with a plurality of communication systems that use different high frequency bands and that uses the composite high frequency component described in any one of the above.

In the present invention, the above composite high frequency component is used in the mobile communication device. For this reason, the separation between the transmission signal and the reception signal is good, and a portion of the transmission signal leaks to the receiving unit, and crosstalk in which the user's voice can be heard is unlikely to occur. Moreover, since a compact and inexpensive composite high frequency component is used, a small and inexpensive mobile communication device can be obtained.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to FIGS.
Will be described with reference to. A high frequency circuit 9 shown in FIG. 2 is formed in the composite high frequency component 1 shown in FIG. Specifically, a circuit element formed inside a ceramic multilayer substrate 2 having glass ceramic as an insulating layer and Ag as a conductive layer (not shown), diode chips 3 and 4 mounted on the main surface 2B, and a chip. The resistor 5 constitutes a high frequency circuit 9. The ceramic multilayer substrate 2 has a substantially rectangular parallelepiped shape, and the main surface 2B thereof has the above-mentioned chip component 3,
4, 5 are installed. Also, the four side surfaces 2S
1, 2S2, 2S3, 2S4 have a semi-cylindrical concave portion in the lower part of the drawing, and a plurality of castellations 6 serving as conductor layers are formed on the inner side surfaces thereof. By this castellation 6, the composite high-frequency component 1 can be mounted and connected on another substrate on the back surface 2C side. The castellation 6 corresponds to an antenna terminal TA, transmission input terminals T1 and T2, reception output terminals R1 and R2, control terminals VC1 and VC2, a ground terminal TG, and the like in a high-frequency circuit 9 described below.

The high frequency circuit 9 formed in the composite high frequency component 1 will be described with reference to FIG. The high frequency circuit 9 is divided into a plurality of functional blocks. That is,
The high frequency switch unit 10, the first diplexer unit 20, the second diplexer unit 30, the first low pass filter unit 40, and the second low pass filter unit 50 that are connected to the antenna ANT are provided.

The high frequency switch section 10 transmits the transmission signal from the first diplexer section 20 at the antenna terminal T when transmitting.
It is configured to be switchable between transmission and reception so as to output from A and send a reception signal to the second diplexer unit 30 upon reception. Specifically, one end of the capacitor 11 is connected to the antenna ANT at the antenna terminal TA. The other end 11C of the capacitor 11 has a first diode 12,
The first diplexer unit 20 is connected via the capacitor 13. In addition, the second diode 15 and the capacitor 16
The second diplexer unit 30 is connected via. Further, a choke coil 18 and a current limiting resistor 19 are inserted in series between the other end 11C of the capacitor 11 and the ground terminal TG set to the ground potential.

The first diode 12 has its anode 12
AN is arranged on the side of the first diplexer unit 20 (specifically, on the side of the capacitor 13) and the cathode 12CA is arranged on the side of the other end 11C of the capacitor 11 and the anode 12AN.
Via the choke coil 14 to the first control terminal VC1
Are connected. Similarly, the second diode 15 also
The anode 15AN is arranged on the second diplexer unit 30 side (specifically, the capacitor 16 side), and the cathode 15CA is arranged on the other end 11C side of the capacitor 11, and the anode 15AN is arranged via the choke coil 17 to the first side. Two
The control terminal VC2 is connected. As described above, the high frequency switch unit 10 includes not only the first and second diodes 12 and 15 and the capacitors 13 and 16 but also the choke coil 14 between the first and second control terminals VC1 and VC2 and the ground terminal TG. , 17, 18 and a current limiting resistor 19 are included in the control circuit section.

Since the high frequency switch section 10 has such a structure, for example, when the first control terminal VC1 is set to a positive potential and the second control terminal VC2 is set to a ground potential or a negative potential, The first diode 12 is turned on (low impedance), the second diode 15 is turned off (high impedance), and the transmission signal sent from the first diplexer unit 20 is transferred to the capacitor 13 and the first diode 1.
2. It can be sent to the antenna ANT through the capacitor 11. On the contrary, the second control terminal VC2
Is set to a positive potential and the first control terminal VC1 is set to a ground potential or a negative potential, the second diode 15 is turned on (low impedance) and the first diode 12 is turned off (high impedance). , The reception signal received by the antenna ANT, the capacitor 11, the second diode 1
5, and can be sent to the second diplexer unit 30 through the capacitor 16.

The current limiting resistor 19 can limit the current flowing between the first and second control terminals VC1 and VC2 and the ground terminal TG. The current limiting resistor is interposed between the ground terminal TG and the other end 11C of the capacitor 11, and the anode 12 of the first diode 12 is used.
Between the AN and the first control terminal VC1, and the second diode 1
It may be provided between the fifth anode 15AN and the second control terminal VC2.

Next, the first diplexer section 20 will be described. The first diplexer unit 20 includes a low pass filter including capacitors 21 and 23 and a coil 22, and a high pass filter including capacitors 24, 25 and 27 and a coil 26. More specifically, this low-pass filter has a configuration in which a capacitor 21 and a coil 22 are arranged in parallel, and grounded by a capacitor 23 on the side of the first low-pass filter 40 with respect to this. The high-pass filter is a T-type filter and has a configuration in which a series circuit of a coil 26 and a capacitor 27 is interposed between the two capacitors 24 and 25 connected in series and the ground potential. The first diplexer unit 20 combines the GSM and DCS transmission signals at the time of transmission and sends them to the above-described high frequency switch unit 10. Specifically, the GSM transmission signal sent from the transmission unit TX1 through the first transmission input terminal T1 and the first low pass filter unit 40, and the transmission unit TX2 through the second transmission input terminal T2 and the second low pass filter unit 50. DCS sent
Is transmitted to the high-frequency switch unit 10 by being combined with the transmission signal of the first diplexer unit 20.

The first low-pass filter section 40 has a G
The SM transmission signal is passed, and the second harmonic and the third harmonic are attenuated. In addition, the second low pass filter unit 50
It passes the DCS transmission signal and attenuates the second harmonic and the third harmonic. Specifically, the first low-pass filter 40 is a π-type filter, and a capacitor 4 and a coil 43 are connected in parallel before and after the parallel circuit.
It is configured to be grounded via 1, 44. Similarly, the second low-pass filter 50 is also a π-type filter,
The front and rear of the parallel circuit of the capacitor 52 and the coil 53 are grounded via the capacitors 51 and 54, respectively.

On the other hand, the second diplexer unit 30 has the same structure as the above-mentioned first diplexer unit 20. That is, a low pass filter including the capacitors 31 and 33 and the coil 32 and a high pass filter including the capacitors 34, 35 and 37 and the coil 36 are provided. More specifically, this low-pass filter includes a capacitor 3
1 and the coil 32 are arranged in parallel, and are grounded by the capacitor 33 on the first reception output terminal R1 side (GSM reception section RX1 side) from this. The high-pass filter is a T-type filter, and has a configuration in which a series circuit of a coil 36 and a capacitor 37 is interposed between the two capacitors 34 and 35 connected in series and the ground potential. In the second diplexer unit 30, the reception signal sent from the high frequency switch unit 10 at the time of reception is compared with a reception signal of a relatively low frequency corresponding to GSM and D
The signal is separated into a relatively high frequency reception signal corresponding to CS, and is received by the GSM reception unit RX1 through the first reception output terminal R1.
Alternatively, it is sent to the receiving unit RX2 of the DCS through the second reception output terminal R2.

As described above, this high frequency circuit 9
Then, as an active switch component, two diodes 1
2, 15 are used. Therefore, the four diodes 12
With a smaller number of diodes than the above-described high frequency circuit 100 (see FIG. 3) using 2,124,132,134, similarly, corresponding to two communication systems (GSM and DCS), the transmitters TX1 and TX2 are connected to each other. The respective transmission signals can be sent to the antenna ANT, or the reception signals can be separated from the antenna ANT and sent to the receiving units RX1 and RX2. Therefore, the number of expensive diodes used can be reduced, and the composite high-frequency component 1 can be manufactured at a lower cost.

Further, in the high frequency circuit 9, the separation between the transmitter and the receiver is better than that of the above-described high frequency circuit 100 (see FIG. 3). More specifically, for example, the transmission signal from the transmission unit TX1 of GSM is the capacitor 2 of the first low-pass filter unit 40 and the first diplexer unit 20.
It is sent to the antenna ANT through a low-pass filter including the coils 1 and 23 and the coil 22, and the capacitor 13 and the first diode 12 in the ON state in the high frequency switch unit 10. In order for this transmission signal to leak to the reception section RX1 of GSM, further, the second diode 15 and the capacitor 16 which are in the off state in the high frequency switch section 10, and the capacitor 31, in the second diplexer section 30,
It is necessary to pass through a low pass filter composed of 33 and the coil 32.

On the other hand, the above-mentioned conventional high frequency circuit 1
In 00, the transmission signal transmitted from the transmitter TX1 of the GSM passes through the first low-pass filter 140 and the diode 122 in the ON state of the first high-frequency switch 120, and passes through the 1 / 4λ line 124, and then the GSM. RX section of
Leaks to 1. As described above, in the high-frequency circuit 9 of the present embodiment, in order for the transmission signal to leak to the reception units RX1 and RX2, the diode 15 that is in the off state and has high impedance is used.
Since it is necessary to go through the transmission line, the transmission units TX1 and TX2 are well separated from the reception units RX1 and RX2, and crosstalk can be reduced.

Further, in this embodiment, the first and second
Chip parts 3, 4, and 5 are used as the second diodes 12 and 15 and the current limiting resistor 19, and these are mounted on the main surface 2B of the ceramic multilayer substrate 2. Here, as described above, since the number of diodes used can be reduced, the number of chip components mounted on the main surface 2B can be reduced. Therefore, when other circuit elements are realized by chip parts and can be mounted on the main surface 2B, they can be easily mounted. On the contrary, in order to mount a large number of chip parts on the main surface 2B, the main surface 2B can be mounted. Therefore, it is possible to prevent the size of the ceramic multilayer substrate 2 (composite high frequency component 1) from increasing.

Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments, and it is needless to say that the invention can be appropriately modified and applied without departing from the scope of the invention. Nor. For example, in the above embodiment, the second low pass filter 30 and the reception output terminal R1,
R2 (receiver RX1, RX2) was directly connected, but S
A filter such as an AW filter may be interposed. Further, in the above embodiment, the first and second diodes 12, 1 are arranged so that the other end 11C side of the capacitor 11 serves as a cathode.
5 was placed. However, the first and second control terminals VC1, V
By appropriately selecting the potential of the control signal applied to C2, the first diode 12 or the second diode 15 may be arranged so that the other end 11C side becomes the anode.

[Brief description of drawings]

FIG. 1 is a perspective view showing a form of a composite high-frequency component according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a functional block and a circuit diagram of a high-frequency circuit according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a functional block and a circuit diagram of a high-frequency circuit according to a conventional technique.

[Explanation of symbols]

1 Composite high frequency components 2 Ceramic layer substrate 2B main surface 3,4,5 Chip parts 9 high frequency circuit 10 High frequency switch section 11 Capacitor (first capacitor) 12,15 Diodes (active switch parts) 14 Choke coil (1st choke coil) 17 Choke coil (2nd choke coil) 18 Choke coil (3rd choke coil) 19 Current limiting resistor 20 1st diplexer section (coupling circuit section) 30 Second diplexer section (separation circuit section) 40,50 low pass filter TA antenna terminal T1, T2 transmission input terminals R1 and R2 reception output terminals

Claims (5)

[Claims] 1. Corresponding to a plurality of communication systems using different high frequency bands, the transmission signals from the transmission units of the respective communication systems are combined and sent to the antenna side, and the reception signals from the antenna side are separated. A high-frequency circuit for sending to the corresponding receiving part of the communication system, wherein the sending signal is sent to the antenna side when transmitting, and the receiving signal is sent to the receiving part side when receiving,
A high-frequency switch unit configured to switch between transmission and reception, a coupling circuit unit that couples the transmission signals from the transmission units of the respective communication systems and sends the signals to the high-frequency switch unit, A separation circuit unit that separates the received signal and sends it to the corresponding reception unit of the communication system,
High frequency circuit equipped with. 2. Corresponding to a plurality of communication systems using different high frequency bands, the transmission signals from the transmission units of the respective communication systems are combined and sent to the antenna side, and the reception signals from the antenna side are separated. A composite high-frequency component to be sent to the corresponding receiving section of the communication system, wherein the transmitting signal is sent to the antenna side when transmitting, and the receiving signal is sent to the receiving section side when receiving. ,
A high-frequency switch unit configured to switch between transmission and reception, a coupling circuit unit that couples the transmission signals from the transmission units of the respective communication systems and sends the signals to the high-frequency switch unit, A separation circuit unit that separates the received signal and sends it to the corresponding reception unit of the communication system,
The high-frequency switch section is composed of a circuit element including at least two independent active switch components, and a part of each of the circuit elements forming the high-frequency switch section, the coupling circuit section, and the separation circuit section is included. The circuit element is formed inside a ceramic multilayer substrate formed by laminating an insulating layer made of ceramic and a conductor layer, and the remaining circuit elements including the active switch component are mounted on the main surface of the ceramic multilayer substrate. A composite high frequency component in which the high frequency switch section, the coupling circuit section, and the separation circuit section are integrally configured. 3. Corresponding to a plurality of communication systems using different high frequency bands, having an antenna terminal, a plurality of transmission input terminals, and a plurality of reception output terminals, each of which is provided from a transmitter of the communication system. The transmission signal input to the transmission input terminal is combined and output from the antenna terminal to the antenna side, the reception signal input to the antenna terminal from the antenna side is separated, and the reception output terminal responds. A composite high-frequency component that outputs to the receiving section of the communication system, wherein the transmission signal is output from the antenna terminal during transmission, and the reception signal is transmitted to the reception output terminal side during reception. A high-frequency switch unit configured to switch between transmission and reception, and a coupling for coupling the transmission signals from the respective transmission input terminals to send to the high-frequency switch unit A road section, separates the received signal from the high-frequency switch section,
The high-frequency switch unit includes a first capacitor connected to the antenna terminal at one end side thereof, the other end of the first capacitor and the coupling circuit unit. And a second diode interposed between the other end of the first capacitor and the separation circuit section, and a control signal input to the first control terminal and the second control terminal. And a control circuit section for turning on and off the first diode and the second diode, among the circuit elements constituting the high frequency switch section, the coupling circuit section, and the separation circuit section, a part of the circuit elements. Is formed inside a ceramic multilayer substrate formed by laminating an insulating layer made of ceramics and a conductor layer, and the remaining circuit elements including the first diode and the second diode are A composite high frequency component mounted on the main surface of the ceramic multi-layer substrate and integrally configured with the high frequency switch section, the coupling circuit section, and the separation circuit section. 4. Corresponding to a plurality of communication systems using mutually different high frequency bands, having an antenna terminal, a plurality of transmission input terminals, and a plurality of reception output terminals, each of which is provided from a transmitter of the communication system. The transmission signal input to the transmission input terminal is combined and output from the antenna terminal to the antenna side, the reception signal input to the antenna terminal from the antenna side is separated, and the reception output terminal responds. A composite high-frequency component that outputs to the receiving section of the communication system, wherein the transmission signal is output from the antenna terminal during transmission, and the reception signal is transmitted to the reception output terminal side during reception. A high-frequency switch unit configured to switch between transmission and reception, and the transmission signal from each of the transmission input terminals is combined and sent to the high-frequency switch unit. And covering the circuit portion, and separating said received signal from the high-frequency switch section,
The high-frequency switch unit includes a first capacitor connected to the antenna terminal at one end side thereof, and a cathode side connected to the other end of the first capacitor. A first diode that receives the transmission signal from the coupling circuit section from the anode side and a cathode side that is connected to the other end of the first capacitor, and that outputs the reception signal from the anode side to the separation circuit section 2 diodes, a first choke coil connected to the anode of the first diode at one end side thereof and connected to the first control terminal at the other end side, and connected to the anode of the second diode at one end side thereof A second choke coil connected to the second control terminal on the end side, and a third choke connected to the other end of the first capacitor on one end side and connected to the ground terminal on the other end side. A part of the circuit elements of the high-frequency switch section, the coupling circuit section, and the separation circuit section, which include a coil, and are formed by laminating an insulating layer made of ceramic and a conductor layer. The remaining circuit elements formed inside the ceramic multi-layer substrate, including the first diode and the second diode, are mounted on the main surface of the ceramic multi-layer substrate, and the high-frequency switch unit, the coupling circuit unit, and the isolation circuit. A high-frequency composite component whose parts are integrally formed. 5. A mobile communication device compatible with a plurality of communication systems using different high frequency bands, wherein the composite high frequency component according to claim 2 is used.