JP2003046140A - Light emitting device and method of manufacturing the same - Google Patents
Light emitting device and method of manufacturing the sameInfo
- Publication number
- JP2003046140A JP2003046140A JP2001226677A JP2001226677A JP2003046140A JP 2003046140 A JP2003046140 A JP 2003046140A JP 2001226677 A JP2001226677 A JP 2001226677A JP 2001226677 A JP2001226677 A JP 2001226677A JP 2003046140 A JP2003046140 A JP 2003046140A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- resin composition
- mounting substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光装置及びその
製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】近年、窒化ガリウム系化合物半導体によ
る青色光、あるいは紫外線を放射するＬＥＤチップが開
発された。このＬＥＤチップを、種々の蛍光体あるいは
顔料等と組合わせることにより、白色を含め、チップの
発光色とは異なる色合いの光を出すＬＥＤ発光装置の開
発が試みられている。小型、軽量、省電力といった長所
があり、現在、表示用光源、小型電球の代替、あるいは
液晶パネル用光源等として広く用いられている。2. Description of the Related Art In recent years, LED chips which emit blue light or ultraviolet rays made of gallium nitride compound semiconductor have been developed. By combining this LED chip with various phosphors, pigments, or the like, development of an LED light emitting device that emits light of a color tone including white, which is different from the light emission color of the chip, has been attempted. It has the advantages of small size, light weight, and power saving, and is currently widely used as a light source for display, a substitute for a small light bulb, a light source for liquid crystal panels, and the like.
【０００３】上記のＬＥＤにおける蛍光体あるいは顔料
等の固定方法としては、発光素子載置部に、蛍光体ある
いは顔料等を含む樹脂を充填する方法が一般的である。As a method of fixing the fluorescent substance or the pigment in the above LED, a method of filling the light emitting element mounting portion with a resin containing the fluorescent substance or the pigment is generally used.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記の従来技
術では、１個１個のＬＥＤ載置部に、蛍光体等を含む少
量の樹脂を滴下充填し、硬化させているので、工程が煩
雑で時間を要するという問題があった。また、樹脂滴下
量を制御することが困難であり、さらに、樹脂が硬化す
る時間内に、樹脂よりも比重の大きい蛍光体が沈下する
傾向がみられるが、その沈下度合いにも差異が生じやす
く、封止樹脂の形成条件を均一に保つことが困難となっ
て、結果的に、発光部ごとの色ばらつきや光量ばらつき
が大きいという問題点があった。However, in the above-mentioned prior art, a small amount of resin containing a fluorescent substance or the like is dropped and filled into each LED mounting portion and cured, so that the process is complicated. There was a problem that it took time. Further, it is difficult to control the amount of resin dropped, and further, within the time for the resin to harden, there is a tendency that the phosphor having a larger specific gravity than the resin tends to sink, but the degree of sinking also tends to differ. However, it is difficult to keep the formation conditions of the sealing resin uniform, and as a result, there is a problem in that there are large variations in color and variations in the amount of light among the light emitting units.
【０００５】本発明は上記の点に鑑みて為されたもので
あり、簡略化された工程にて、蛍光体あるいは顔料等が
含まれた樹脂部を製造することによって量産化を図り、
製造コストを低減するとともに、封止樹脂の品質を均一
化することによって、発光部ごと、製品ごとの色ばらつ
き、光量ばらつきが低減された発光装置及びその製造方
法を提供することを目的とするものである。The present invention has been made in view of the above points, and is intended to be mass-produced by manufacturing a resin portion containing a fluorescent substance or a pigment in a simplified process.
An object of the present invention is to provide a light emitting device and a method for manufacturing the same in which the manufacturing cost is reduced and the quality of the sealing resin is made uniform to reduce the color variation and the light amount variation for each light emitting unit and each product. Is.
【０００６】[0006]
【課題を解決するための手段】本発明の請求項１に係る
発光装置は、表面が平坦な実装基板１上に１又は複数の
発光素子２を搭載し、メッシュ状のマスク５を、このマ
スク５の開口５ａの内側に発光素子２が配置されるよう
にして実装基板１上に配置し、波長変換物質と光吸収体
のうちの少なくとも一方を含有する樹脂組成物６を実装
基板１上に塗布することによりマスク５の開口部５ａ内
に樹脂組成物６を充填し、メッシュ状のマスク５の上面
側に付着した樹脂組成物６を除去した後、樹脂組成物６
を硬化させることによって封止樹脂３を形成することに
より、封止樹脂３にて発光素子２を個別に封止して成る
ことを特徴とするものである。In a light emitting device according to claim 1 of the present invention, one or a plurality of light emitting elements 2 are mounted on a mounting substrate 1 having a flat surface, and a mesh mask 5 is provided. The light emitting element 2 is arranged on the mounting substrate 1 so that the light emitting element 2 is arranged inside the opening 5a, and the resin composition 6 containing at least one of the wavelength conversion substance and the light absorber is arranged on the mounting substrate 1. The resin composition 6 is filled in the openings 5a of the mask 5 by application, and the resin composition 6 attached to the upper surface side of the mesh-shaped mask 5 is removed.
The light emitting element 2 is individually sealed with the sealing resin 3 by forming the sealing resin 3 by curing the resin.
【０００７】また本発明の請求項２に係る発光装置は、
表面が平坦な実装基板１上に１又は複数の発光素子２を
搭載し、紫外線硬化性樹脂を含有すると共に波長変換物
質と光吸収体のうちの少なくとも一方を含有する樹脂組
成物６を実装基板１上に塗布することにより樹脂組成物
６中に発光素子２を埋め込み、発光素子２の周囲の樹脂
組成物６のみに紫外線を照射して硬化させることによっ
て封止樹脂３を形成することにより、封止樹脂３にて発
光素子２を個別に封止して成ることを特徴とするもので
ある。A light emitting device according to claim 2 of the present invention is
One or a plurality of light emitting elements 2 are mounted on a mounting substrate 1 having a flat surface, and a resin composition 6 containing an ultraviolet curable resin and at least one of a wavelength conversion substance and a light absorber is mounted on the mounting substrate. By embedding the light emitting element 2 in the resin composition 6 by coating the resin composition 6 on the resin composition 1 and irradiating only the resin composition 6 around the light emitting element 2 with ultraviolet rays to cure the resin composition 6, the sealing resin 3 is formed. It is characterized in that the light emitting elements 2 are individually sealed with a sealing resin 3.
【０００８】また請求項３の発明は、請求項１又は２に
おいて、発光素子２を封止する封止樹脂３を、実装基板
１側が幅狭となる断面略台形状に形成して成ることを特
徴とするものである。According to a third aspect of the present invention, in the first or second aspect, the sealing resin 3 for sealing the light emitting element 2 is formed in a substantially trapezoidal cross section whose width becomes narrower on the mounting substrate 1 side. It is a feature.
【０００９】また本発明の請求項４に係る発光装置の製
造方法は、表面が平坦な実装基板１上に１又は複数の発
光素子２を搭載し、メッシュ状のマスク５を、このマス
ク５の開口５ａの内側に発光素子２が配置されるように
して実装基板１上に配置し、波長変換物質と光吸収体の
うちの少なくとも一方を含有する樹脂組成物６を実装基
板１上に塗布することによりマスク５の開口５ａ内に樹
脂組成物６を充填し、メッシュ状のマスク５の上面側に
付着した樹脂組成物６を除去した後、樹脂組成物６を硬
化させることによって封止樹脂３を形成することを特徴
とするものである。According to a fourth aspect of the present invention, in a method for manufacturing a light emitting device, one or a plurality of light emitting elements 2 are mounted on a mounting substrate 1 having a flat surface, and a mesh mask 5 is provided. The light emitting element 2 is arranged on the mounting substrate 1 so as to be arranged inside the opening 5a, and the resin composition 6 containing at least one of the wavelength conversion substance and the light absorber is applied on the mounting substrate 1. As a result, the resin composition 6 is filled in the openings 5a of the mask 5, the resin composition 6 attached to the upper surface side of the mesh-shaped mask 5 is removed, and then the resin composition 6 is cured, whereby the sealing resin 3 is formed. Is formed.
【００１０】また本発明の請求項５に係る発光装置の製
造方法は、表面が平坦な実装基板１上に１又は複数の発
光素子２を搭載し、紫外線硬化性樹脂を含有すると共に
波長変換物質と光吸収体のうちの少なくとも一方を含有
する樹脂組成物６中に発光素子を埋め込み、発光素子２
の周囲の樹脂組成物６のみに紫外線を照射して硬化させ
ることによって封止樹脂３を形成することを特徴とする
ものである。According to a fifth aspect of the present invention, in a method for manufacturing a light emitting device, one or a plurality of light emitting elements 2 are mounted on a mounting substrate 1 having a flat surface, which contains an ultraviolet curable resin and a wavelength conversion material. The light emitting device is embedded in the resin composition 6 containing at least one of
The sealing resin 3 is formed by irradiating only the resin composition 6 around it with ultraviolet rays to cure it.
【００１１】また本発明の請求項６に係る発光装置の製
造方法は、表面が平坦な実装基板１上に１又は複数の発
光素子２を搭載し、水又は有機溶媒に可溶な材料にて形
成されたメッシュ状のマスク５を、このマスク５の開口
５ａの内側に発光素子２が配置されるようにして実装基
板１上に配置し、波長変換物質と光吸収体のうちの少な
くとも一方を含有する樹脂組成物６を実装基板１上に塗
布し、メッシュ状のマスク５の上面側に付着した樹脂組
成物６を除去した後、樹脂組成物６を硬化させ、次いで
マスク５を水又は有機溶媒にて溶解除去することを特徴
とするものである。According to a sixth aspect of the present invention, there is provided a method for manufacturing a light emitting device, wherein one or a plurality of light emitting elements 2 are mounted on a mounting substrate 1 having a flat surface, and a material soluble in water or an organic solvent is used. The formed mesh-shaped mask 5 is arranged on the mounting substrate 1 so that the light emitting element 2 is arranged inside the opening 5a of the mask 5, and at least one of the wavelength conversion substance and the light absorber is arranged. The resin composition 6 contained is applied onto the mounting substrate 1, the resin composition 6 attached to the upper surface side of the mesh-shaped mask 5 is removed, and then the resin composition 6 is cured, and then the mask 5 is covered with water or an organic solvent. It is characterized by dissolving and removing with a solvent.
【００１２】また請求項７の発明は、請求項６におい
て、実装基板１上に配置する前のメッシュ状のマスク５
に対して、その開口５ａの内面に金属膜４を形成するこ
とを特徴とするものである。According to a seventh aspect of the invention, in the sixth aspect, the mesh-shaped mask 5 before being placed on the mounting substrate 1 is used.
On the other hand, the metal film 4 is formed on the inner surface of the opening 5a.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
【００１４】図１に、本発明の発光装置の第１の実施形
態を示す。FIG. 1 shows a first embodiment of the light emitting device of the present invention.
【００１５】本実施形態では、表面が平坦な実装基板１
上に、複数のＬＥＤ等の発光素子２が搭載されて、実装
基板１上に発光素子２が電気的に接続されており、各発
光素子２は、封止樹脂３にて別個に封止されている。以
下、実装基板１の発光素子２が実装されている側を発光
装置の上面とする。In this embodiment, the mounting substrate 1 having a flat surface
A plurality of light emitting elements 2 such as LEDs are mounted thereon, and the light emitting elements 2 are electrically connected to the mounting substrate 1. Each light emitting element 2 is individually sealed with a sealing resin 3. ing. Hereinafter, the side of the mounting substrate 1 on which the light emitting element 2 is mounted is referred to as the upper surface of the light emitting device.
【００１６】図１（ａ）に示す例では、発光素子２を封
止する封止樹脂３は断面矩形状に形成されており、また
図１（ｂ）に示す例では、封止樹脂３は実装基板１側が
幅広となる断面略台形状に形成されている。In the example shown in FIG. 1A, the sealing resin 3 for sealing the light emitting element 2 is formed in a rectangular cross section, and in the example shown in FIG. 1B, the sealing resin 3 is The mounting board 1 side is formed in a substantially trapezoidal shape with a wide width.
【００１７】このように発光素子２が個別に封止される
ことにより、発光素子２から放出される光は、封止樹脂
３の上面側だけでなく、側面側からも放出されることと
なり、発光素子２からの光の取り出し効率が向上するも
のである。By individually sealing the light emitting elements 2 in this way, the light emitted from the light emitting elements 2 is emitted not only from the upper surface side of the sealing resin 3 but also from the side surface side thereof. The efficiency of extracting light from the light emitting element 2 is improved.
【００１８】上記の封止樹脂３としては、発光素子２の
封止用に用いられるものであれば特に制限されず、熱硬
化性樹脂、熱可塑性樹脂、紫外線硬化性樹脂等を含む適
宜の樹脂組成物６の硬化物を適用することができる。ま
た、この封止樹脂３中には、波長変換物質と光吸収体の
うちの少なくともいずれかを含有させるものである。The encapsulating resin 3 is not particularly limited as long as it is used for encapsulating the light emitting element 2, and an appropriate resin including a thermosetting resin, a thermoplastic resin, an ultraviolet curable resin and the like. A cured product of the composition 6 can be applied. The sealing resin 3 contains at least one of a wavelength conversion substance and a light absorber.
【００１９】ここでいう波長変換物質は、発光素子２の
発光によって励起されて励起波長と異なる波長の光を放
射する蛍光体等の物質を意味するものであり、このよう
な性質を有するものであれば、蛍光体以外の適宜の物質
が用いられる。The wavelength conversion substance mentioned here means a substance such as a phosphor which is excited by the light emission of the light emitting element 2 and emits light having a wavelength different from the excitation wavelength, and has such a property. If so, an appropriate substance other than the phosphor is used.
【００２０】また、光吸収体は、発光素子２の発光の一
部（波長変換物質が含有されている場合には発光素子２
又は波長変換物質の発光の一部）を吸収する顔料、染料
等の物質を意味するものであり、このような性質を有す
るものであれば、顔料、染料以外の適宜の物質が用いら
れる。The light absorber is a part of the light emitted from the light emitting element 2 (when the wavelength converting substance is contained, the light emitting element 2
Or, it means a substance such as a pigment or a dye that absorbs a part of the light emission of the wavelength conversion substance, and an appropriate substance other than the pigment or the dye is used as long as it has such properties.
【００２１】図２に、本発明の発光装置の第２の実施形
態を示す。FIG. 2 shows a second embodiment of the light emitting device of the present invention.
【００２２】本実施形態では、第１の実施形態と同様
に、表面が平坦な実装基板１上に、複数のＬＥＤ等の発
光素子２が搭載されており、実装基板１上に発光素子２
が電気的に接続されている。各発光素子２は、封止樹脂
３にて別個に封止されている。In this embodiment, as in the first embodiment, a plurality of light emitting elements 2 such as LEDs are mounted on a mounting substrate 1 having a flat surface, and the light emitting element 2 is mounted on the mounting substrate 1.
Are electrically connected. Each light emitting element 2 is separately sealed with a sealing resin 3.
【００２３】また、この封止樹脂３の形状は、実装基板
１側が幅狭となる断面略台形状に形成されている。更
に、図２（ｂ）に示す例では、この封止樹脂３の側面に
金属膜４が形成されている。Further, the shape of the sealing resin 3 is formed into a substantially trapezoidal cross section whose width becomes narrower on the mounting substrate 1 side. Further, in the example shown in FIG. 2B, the metal film 4 is formed on the side surface of the sealing resin 3.
【００２４】このように形成される発光装置では、発光
装置から側方に向けて放出された光が、封止樹脂３の内
部において、封止樹脂３の傾斜した側面にて反射され
て、上面側へと向かうこととなり、発光装置の上面側に
向けての光の取り出し効率が更に向上するものである。
特に、図２（ｂ）に示すように封止樹脂３の側面に金属
膜４を設ければ、封止樹脂３の内部における封止樹脂３
の傾斜した側面での光の反射効率が向上し、発光装置の
上面側に向けての光の取り出し効率が更に向上するもの
である。In the light-emitting device thus formed, the light emitted laterally from the light-emitting device is reflected by the inclined side surface of the sealing resin 3 inside the sealing resin 3, and the upper surface thereof is reflected. As a result, the light extraction efficiency toward the upper surface side of the light emitting device is further improved.
In particular, if the metal film 4 is provided on the side surface of the sealing resin 3 as shown in FIG.
The light reflection efficiency on the inclined side surface of the light emitting device is improved, and the light extraction efficiency toward the upper surface side of the light emitting device is further improved.
【００２５】以下の実施形態において、発光装置の製造
工程を説明する。In the following embodiments, the manufacturing process of the light emitting device will be described.
【００２６】図３に、本発明の第３の実施形態を示す。FIG. 3 shows a third embodiment of the present invention.
【００２７】本実施形態では、まず表面が平坦に形成さ
れた実装基板１の上面に複数の発光素子２を搭載し、更
にこの実装基板１の上面に複数の開口５ａを有するメッ
シュ状のマスク５を配置する。このマスク５の開口５ａ
は、実装基板１上の発光素子２の位置と合致する位置に
形成されており、その開口５ａ形状は所望の封止樹脂３
の形状と同一形状に形成される。図示の例では開口５ａ
の形状は、実装基板１側が幅広となった断面略台形状に
形成されており、また実装基板１上にマスク５を配置す
る際は発光素子２がこの開口５ａの略中央部分に配置さ
れるようにする。In this embodiment, first, a plurality of light emitting elements 2 are mounted on the upper surface of a mounting substrate 1 having a flat surface, and a mesh-shaped mask 5 having a plurality of openings 5a on the upper surface of the mounting substrate 1. To place. The opening 5a of the mask 5
Is formed at a position that matches the position of the light emitting element 2 on the mounting substrate 1, and the shape of the opening 5a is the desired sealing resin 3.
Is formed in the same shape as the shape. In the illustrated example, the opening 5a
Is formed in a substantially trapezoidal shape in cross section with the mounting substrate 1 side being wide, and when the mask 5 is arranged on the mounting substrate 1, the light emitting element 2 is arranged at a substantially central portion of the opening 5a. To do so.
【００２８】次に波長変換物質と光吸収体のうちの少な
くともいずれかを含有する封止用の樹脂組成物６を実装
基板１の上面に塗布することにより、この樹脂組成物６
をメッシュ状のマスク５の開口５ａ内に充填する。この
ときマスク５の上面側にも余分な樹脂組成物６が付着す
るものであり、この余分な樹脂組成物６は、図３（ａ）
に示すようにスキージ８等を用いて除去する。Next, a resin composition 6 for encapsulation containing at least one of a wavelength conversion substance and a light absorber is applied to the upper surface of the mounting substrate 1 to form the resin composition 6.
Is filled in the opening 5a of the mesh-shaped mask 5. At this time, the excess resin composition 6 is also attached to the upper surface side of the mask 5, and the excess resin composition 6 is formed as shown in FIG.
As shown in, the squeegee 8 or the like is used for removal.
【００２９】次に、マスク５の開口５ａ内に充填された
樹脂組成物６を、樹脂組成物６の種類に応じた適宜の方
法により硬化させて、封止樹脂３を成形した後、実装基
板１上からマスク５を引き上げて除去する。Next, the resin composition 6 filled in the openings 5a of the mask 5 is cured by an appropriate method according to the type of the resin composition 6 to mold the sealing resin 3, and then the mounting substrate is mounted. The mask 5 is pulled up from above 1 and removed.
【００３０】このようにすると、図３（ｂ）に示すよう
に実装基板１上の複数の発光素子２を個別に封止する封
止樹脂３が形成されるものであり、このとき封止樹脂３
は、メッシュ状のマスク５の開口５ａ形状と同一形状と
なって、所定の形状を有する封止樹脂３が容易に形成さ
れる。これにより、波長変換物質や光吸収体を含有する
所定の形状の封止樹脂３を、各発光素子２ごとに略同一
条件で作製できるので、発光部ごとの色ばらつき、光量
ばらつきが低減できるものであり、また簡便な工法であ
るために製造コストの低減が可能である。In this way, as shown in FIG. 3B, the sealing resin 3 for individually sealing the plurality of light emitting elements 2 on the mounting substrate 1 is formed. At this time, the sealing resin 3 is formed. Three
Has the same shape as the opening 5a of the mesh-shaped mask 5, so that the sealing resin 3 having a predetermined shape can be easily formed. As a result, the sealing resin 3 having a predetermined shape containing the wavelength converting substance and the light absorber can be manufactured under substantially the same conditions for each light emitting element 2, so that color variation and light amount variation between light emitting parts can be reduced. In addition, the manufacturing cost can be reduced because the method is simple.
【００３１】図４に、本発明の第４の実施形態を示す。FIG. 4 shows a fourth embodiment of the present invention.
【００３２】本実施形態では、まず表面が平坦に形成さ
れた実装基板１の上面に複数の発光素子２を搭載する次
に波長変換物質と光吸収体のうちの少なくともいずれか
を含有する封止用の樹脂組成物６を、実装基板１の上面
の全面に、所望の封止樹脂３の厚みと同一の厚みに塗布
し、発光素子２をこの樹脂組成物６内に埋め込む。この
樹脂組成物６としては、樹脂成分としてアクリル系紫外
線硬化性樹脂等の紫外線硬化性樹脂を含有するものを用
いる。In this embodiment, first, a plurality of light emitting elements 2 are mounted on the upper surface of a mounting substrate 1 having a flat surface, and then a sealing containing at least one of a wavelength conversion substance and a light absorber. The resin composition 6 for application is applied to the entire upper surface of the mounting substrate 1 in the same thickness as the desired thickness of the sealing resin 3, and the light emitting element 2 is embedded in the resin composition 6. As the resin composition 6, a resin composition containing a UV curable resin such as an acrylic UV curable resin as a resin component is used.
【００３３】次に、この塗布された樹脂組成物６の上方
に、各発光素子２を中心とする所望の封止樹脂３の形成
位置が紫外線に対して透明に形成されると共にそれ以外
の箇所には紫外線を透過させない遮光部７ａが形成され
たフォトマスク７を配置し、このフォトマスク７を介し
て樹脂組成物６に向けて、図４（ａ）の矢印のように紫
外線を照射する。これにより封止樹脂３となる部分を露
光硬化させる。Next, above the applied resin composition 6, a desired sealing resin 3 is formed around each light emitting element 2 so that the desired sealing resin 3 is formed transparent to ultraviolet rays and at other locations. A photomask 7 on which a light-shielding portion 7a that does not transmit ultraviolet rays is formed is disposed on the substrate, and the resin composition 6 is irradiated with ultraviolet rays through the photomask 7 as shown by the arrow in FIG. As a result, the portion that becomes the sealing resin 3 is exposed and cured.
【００３４】次に、フォトマスク７を取り外し、樹脂組
成物６の非露光部分を紫外線硬化性樹脂の種類に応じた
適宜の薬剤にて現像除去することにより、封止樹脂３を
残存させ、図４（ｂ）に示すような、封止樹脂３の断面
形状が略矩形状の発光装置が得られるものである。Next, the photomask 7 is removed, and the non-exposed portion of the resin composition 6 is developed and removed with an appropriate chemical according to the type of the ultraviolet curable resin, so that the sealing resin 3 remains. As shown in FIG. 4 (b), a light emitting device in which the sealing resin 3 has a substantially rectangular cross-sectional shape can be obtained.
【００３５】このようにすると、実装基板１上の複数の
発光素子２を個別に封止する封止樹脂３が形成されるも
のであり、このとき封止樹脂３は、フォトマスク７の透
明部分と同一形状となって、所定の形状を有する封止樹
脂３が容易に形成される。これにより、波長変換物質や
光吸収体を含有する所定の形状の封止樹脂３を、各発光
素子２ごとに略同一条件で作製できるので、発光部ごと
の色ばらつき、光量ばらつきが低減できるものであり、
また簡便な工法であるために製造コストの低減が可能で
ある。By doing so, the sealing resin 3 for individually sealing the plurality of light emitting elements 2 on the mounting substrate 1 is formed. At this time, the sealing resin 3 is a transparent portion of the photomask 7. The sealing resin 3 having the same shape as the above and having a predetermined shape is easily formed. As a result, the sealing resin 3 having a predetermined shape containing the wavelength converting substance and the light absorber can be manufactured under substantially the same conditions for each light emitting element 2, so that color variation and light amount variation between light emitting parts can be reduced. And
In addition, the manufacturing cost can be reduced because the method is simple.
【００３６】図５に、本発明の第５の実施形態を示す。FIG. 5 shows a fifth embodiment of the present invention.
【００３７】本実施形態では、まず表面が平坦に形成さ
れた実装基板１の上面に複数の発光素子２を搭載する。
このとき、発光素子２としては、青色又は紫外線光を放
射するＬＥＤ等が用いられる。In this embodiment, first, a plurality of light emitting elements 2 are mounted on the upper surface of the mounting substrate 1 having a flat surface.
At this time, an LED or the like that emits blue or ultraviolet light is used as the light emitting element 2.
【００３８】次に波長変換物質と光吸収体のうちの少な
くともいずれかを含有する封止用の樹脂組成物６を、実
装基板１の上面の全面に、所望の封止樹脂３の厚みと同
一の厚みに塗布し、発光素子２をこの樹脂組成物６内に
埋め込む。この樹脂組成物６としては、樹脂成分として
アクリル系紫外線硬化性樹脂等の紫外線硬化性樹脂を含
有するものを用いる。Next, a sealing resin composition 6 containing at least one of a wavelength conversion substance and a light absorber is formed on the entire upper surface of the mounting substrate 1 to have the same thickness as the desired sealing resin 3. And the light emitting element 2 is embedded in the resin composition 6. As the resin composition 6, a resin composition containing a UV curable resin such as an acrylic UV curable resin as a resin component is used.
【００３９】次に、実装基板１上の発光素子２を所定時
間点灯させて、図５（ａ）の矢印のように各発光素子２
の周囲に発光素子２から放射される光を照射し、樹脂組
成物６を露光硬化させる。Next, the light emitting elements 2 on the mounting substrate 1 are turned on for a predetermined time, and each light emitting element 2 is turned on as indicated by an arrow in FIG.
The resin composition 6 is exposed and cured by irradiating the periphery of the resin composition 6 with light emitted from the light emitting element 2.
【００４０】次に、樹脂組成物６の非露光部分を紫外線
硬化性樹脂の種類に応じた適宜の薬剤にて現像除去する
ことにより、封止樹脂３を残存させ、図５（ｂ）に示す
ような発光装置が得られるものである。Next, the non-exposed portion of the resin composition 6 is developed and removed by a chemical suitable for the type of the UV-curable resin, so that the sealing resin 3 is left and is shown in FIG. 5 (b). Such a light emitting device can be obtained.
【００４１】また、発光素子２が搭載された実装基板１
を、容器内の紫外線硬化性樹脂中に浸漬することにより
発光素子２を樹脂組成物６中に埋め込んだ状態で、実装
基板１上の発光素子２を所定時間点灯させても、同様に
各発光素子２の周囲において樹脂組成物６を露光硬化さ
せて、封止樹脂３を形成し、発光装置を得ることもでき
る。The mounting substrate 1 on which the light emitting element 2 is mounted
Even if the light emitting element 2 on the mounting substrate 1 is turned on for a predetermined time with the light emitting element 2 embedded in the resin composition 6 by immersing the The light emitting device can also be obtained by exposing and curing the resin composition 6 around the element 2 to form the sealing resin 3.
【００４２】このようにすると、実装基板１上の複数の
発光素子２を個別に封止する封止樹脂３が形成されるも
のであり、このとき封止樹脂３は、フォトマスク７を用
いなくても所定の形状を有する封止樹脂３が容易に形成
される。これにより、波長変換物質や光吸収体を含有す
る所定の形状の封止樹脂３を、各発光素子２ごとに略同
一条件で作製できるので、発光部ごとの色ばらつき、光
量ばらつきが低減できるものであり、また簡便な工法で
あるために製造コストの低減が可能である。By doing so, the sealing resin 3 for individually sealing the plurality of light emitting elements 2 on the mounting substrate 1 is formed. At this time, the sealing resin 3 does not use the photomask 7. However, the sealing resin 3 having a predetermined shape is easily formed. As a result, the sealing resin 3 having a predetermined shape containing the wavelength converting substance and the light absorber can be manufactured under substantially the same conditions for each light emitting element 2, so that color variation and light amount variation between light emitting parts can be reduced. In addition, the manufacturing cost can be reduced because the method is simple.
【００４３】図６に、本発明の第６の実施形態を示す。FIG. 6 shows a sixth embodiment of the present invention.
【００４４】本実施形態では、まず表面が平坦に形成さ
れた実装基板１の上面に複数の発光素子２を搭載し、更
にこの実装基板１の上面にメッシュ状のマスク５を配置
する。このマスク５の開口５ａは、実装基板１上の発光
素子２の位置と合致する位置に形成されており、その開
口５ａ形状は、実装基板１側が幅狭となった断面略台形
状に形成されており、また実装基板１上にマスク５を配
置する際は発光素子２がこの開口５ａの略中央部分に配
置されるようにする。In the present embodiment, first, a plurality of light emitting elements 2 are mounted on the upper surface of the mounting substrate 1 having a flat surface, and the mesh-shaped mask 5 is arranged on the upper surface of the mounting substrate 1. The opening 5a of the mask 5 is formed at a position corresponding to the position of the light emitting element 2 on the mounting substrate 1, and the shape of the opening 5a is formed in a substantially trapezoidal cross section in which the mounting substrate 1 side is narrow. In addition, when the mask 5 is arranged on the mounting substrate 1, the light emitting element 2 is arranged substantially in the center of the opening 5a.
【００４５】このとき、メッシュ状のマスク５として
は、水又は有機溶媒に可溶な材料にて形成されたものが
用いられるものであり、例えば水に可溶なポリビニルア
ルコールにて成形されたものを挙げることができる。At this time, as the mesh-shaped mask 5, one formed of a material soluble in water or an organic solvent is used, for example, one formed of polyvinyl alcohol soluble in water. Can be mentioned.
【００４６】次に封止用の樹脂組成物６を実装基板１の
上面に塗布することにより、この樹脂組成物６をメッシ
ュ状のマスク５の開口５ａ内に充填する。このときマス
ク５の上面側にも余分な樹脂組成物６が付着するもので
あり、この余分な樹脂組成物６は、図６（ａ）に示すよ
うにスキージ８等を用いて除去する。Next, the resin composition 6 for sealing is applied to the upper surface of the mounting substrate 1 to fill the openings 5a of the mesh-shaped mask 5 with the resin composition 6. At this time, the excess resin composition 6 also adheres to the upper surface side of the mask 5, and the excess resin composition 6 is removed using a squeegee 8 or the like as shown in FIG.
【００４７】次に、マスク５の開口５ａ内に充填された
樹脂組成物６を、樹脂組成物６の種類に応じた適宜の方
法により硬化させて、封止樹脂３を成形した後、マスク
５の材質に応じて水又は有機溶媒にてマスク５を溶解除
去する。Next, the resin composition 6 filled in the opening 5a of the mask 5 is cured by an appropriate method according to the type of the resin composition 6 to mold the sealing resin 3, and then the mask 5 is formed. The mask 5 is dissolved and removed with water or an organic solvent depending on the material.
【００４８】このようにすると、図６（ｂ）に示すよう
に、実装基板１上の複数の発光素子２を個別に封止する
封止樹脂３が形成されるものであり、このとき封止樹脂
３は、メッシュ状のマスク５の開口５ａ形状と同一形状
となって、所定の形状を有する封止樹脂３が容易に形成
される。これにより、波長変換物質や光吸収体を含有す
る所定の形状の封止樹脂３を、各発光素子２ごとに略同
一条件で作製できるので、発光部ごとの色ばらつき、光
量ばらつきが低減できるものであり、また簡便な工法で
あるために製造コストの低減が可能である。By doing so, as shown in FIG. 6B, the sealing resin 3 for individually sealing the plurality of light emitting elements 2 on the mounting substrate 1 is formed. At this time, the sealing resin 3 is sealed. The resin 3 has the same shape as the opening 5a of the mesh-shaped mask 5, so that the sealing resin 3 having a predetermined shape can be easily formed. As a result, the sealing resin 3 having a predetermined shape containing the wavelength converting substance and the light absorber can be manufactured under substantially the same conditions for each light emitting element 2, so that color variation and light amount variation between light emitting parts can be reduced. In addition, the manufacturing cost can be reduced because the method is simple.
【００４９】更に、形成される封止樹脂３の形状にかか
わらず、メッシュ状のマスク５を容易に除去することが
でき、例えば発光装置の製造方法についての上記の第３
〜５の実施形態では作製な困難な、実装基板１側が幅狭
となった断面略台形状の封止樹脂３を有する発光装置
も、上記のように水又は有機溶剤にて可溶な材料からな
るマスク５を用いることにより、容易に作製可能なもの
である。Further, regardless of the shape of the sealing resin 3 formed, the mesh-shaped mask 5 can be easily removed. For example, the third method described above in the method of manufacturing a light emitting device is used.
The light emitting device having the sealing resin 3 having a substantially trapezoidal cross section whose width is narrower on the mounting substrate 1 side, which is difficult to manufacture in the embodiments of to 5, is made of a material soluble in water or an organic solvent as described above. It can be easily manufactured by using the mask 5.
【００５０】図７は本発明の第７の実施形態を示す。FIG. 7 shows a seventh embodiment of the present invention.
【００５１】本実施形態は、上記の第６の実施形態にお
いて、メッシュ状のマスク５の開口５ａの内面に金属膜
４を形成したものである。In this embodiment, the metal film 4 is formed on the inner surface of the opening 5a of the mesh-shaped mask 5 in the sixth embodiment.
【００５２】ここでは、まず表面が平坦に形成された実
装基板１の上面に複数の発光素子２を搭載し、更にこの
実装基板１の上面に、開口５ａ内面に金属膜４を形成し
たメッシュ状のマスク５を配置する。Here, first, a plurality of light emitting elements 2 are mounted on the upper surface of the mounting substrate 1 having a flat surface, and further, on the upper surface of the mounting substrate 1, the metal film 4 is formed on the inner surface of the opening 5a in a mesh shape. The mask 5 is placed.
【００５３】このマスク５の開口内面に金属膜４を形成
するにあたっては、例えば水又は有機溶媒に可溶な材料
にてマスク５を成形した後、蒸着法等によってマスク５
の外面に金属膜を形成し、次いで開口５ａ内面を除くマ
スク５の表面における金属膜を研磨等により除去するこ
とにより、開口５ａ内面のみに金属膜４を残存させるも
のである。In forming the metal film 4 on the inner surface of the opening of the mask 5, for example, the mask 5 is formed by a material soluble in water or an organic solvent, and then the mask 5 is formed by a vapor deposition method or the like.
Is formed on the outer surface of the opening 5a, and then the metal film on the surface of the mask 5 excluding the inner surface of the opening 5a is removed by polishing or the like to leave the metal film 4 only on the inner surface of the opening 5a.
【００５４】このマスク５の開口５ａは、実装基板１上
の発光素子２の位置と合致する位置に形成されており、
その開口５ａ形状は、実装基板１側が幅狭となった断面
略台形状に形成されており、また実装基板１上にマスク
５を配置する際は発光素子２がこの開口５ａの略中央部
分に配置されるようにする。The opening 5a of the mask 5 is formed at a position matching the position of the light emitting element 2 on the mounting substrate 1,
The shape of the opening 5a is formed in a substantially trapezoidal cross-section with a narrower width on the mounting substrate 1 side, and when the mask 5 is arranged on the mounting substrate 1, the light emitting element 2 is located at the substantially central portion of the opening 5a. To be placed.
【００５５】このとき、メッシュ状のマスク５として
は、第６の実施の形態と同様に水又は有機溶媒に可溶な
材料にて形成されたものが用いられる。At this time, as the mesh-shaped mask 5, a mask formed of a material soluble in water or an organic solvent is used as in the sixth embodiment.
【００５６】次に封止用の樹脂組成物６を実装基板１の
上面に塗布することにより、この樹脂組成物６をメッシ
ュ状のマスク５の開口５ａ内に充填する。このときマス
ク５の上面側にも余分な樹脂組成物６が付着するもので
あり、この余分な樹脂組成物６は、図７（ａ）に示すよ
うにスキージ８等を用いて除去する。Next, the resin composition 6 for sealing is applied to the upper surface of the mounting substrate 1 to fill the openings 5 a of the mesh-shaped mask 5 with the resin composition 6. At this time, the excess resin composition 6 also adheres to the upper surface side of the mask 5, and the excess resin composition 6 is removed using a squeegee 8 or the like as shown in FIG. 7A.
【００５７】次に、マスク５の開口５ａ内に充填された
樹脂組成物６を、樹脂組成物６の種類に応じた適宜の方
法により硬化させて、封止樹脂３を成形した後、マスク
５の材質に応じて水又は有機溶媒にてマスク５を溶解除
去する。Next, the resin composition 6 filled in the opening 5a of the mask 5 is cured by an appropriate method according to the type of the resin composition 6 to mold the sealing resin 3, and then the mask 5 is formed. The mask 5 is dissolved and removed with water or an organic solvent depending on the material.
【００５８】このようにすると、図７（ｂ）に示すよう
に、実装基板１上の複数の発光素子２を個別に封止する
封止樹脂３が形成されるものであり、このとき封止樹脂
３は、メッシュ状のマスク５の開口５ａ形状と同一形状
となって、所定の形状を有する封止樹脂３が容易に形成
される。また、マスク５の溶解除去の際には、マスク５
の開口５ａ内面に設けられていた金属膜４が残存し、こ
のため、封止樹脂３の側面に金属膜４が設けられる。In this way, as shown in FIG. 7B, the sealing resin 3 for individually sealing the plurality of light emitting elements 2 on the mounting substrate 1 is formed. At this time, the sealing resin 3 is sealed. The resin 3 has the same shape as the opening 5a of the mesh-shaped mask 5, so that the sealing resin 3 having a predetermined shape can be easily formed. When the mask 5 is dissolved and removed, the mask 5
The metal film 4 provided on the inner surface of the opening 5a remains, so that the metal film 4 is provided on the side surface of the sealing resin 3.
【００５９】これにより、波長変換物質や光吸収体を含
有する所定の形状の封止樹脂３を、各発光素子２ごとに
略同一条件で作製できるので、発光部ごとの色ばらつ
き、光量ばらつきが低減できるものであり、また簡便な
工法であるために製造コストの低減が可能である。As a result, the sealing resin 3 having a predetermined shape and containing the wavelength converting substance and the light absorber can be manufactured under substantially the same conditions for each light emitting element 2, so that the color variation and the light amount variation among the light emitting portions are caused. In addition, the manufacturing cost can be reduced because the method is simple and the method is simple.
【００６０】更に、第３〜５の実施形態では作製な困難
な、実装基板１側が幅狭となった断面略台形状の封止樹
脂３を有する発光装置も、上記のように水又は有機溶剤
にて可溶な材料からなるマスク５を用いることにより、
容易に作製可能なものであり、またこのような封止樹脂
３の側面に対して、容易に金属膜４を設けることができ
るものである。Further, the light emitting device having the sealing resin 3 having a substantially trapezoidal cross section whose width on the mounting substrate 1 side is narrow, which is difficult to manufacture in the third to fifth embodiments, is also used in the water or organic solvent as described above. By using the mask 5 made of a soluble material in
It can be easily manufactured, and the metal film 4 can be easily provided on the side surface of such a sealing resin 3.
【００６１】[0061]
【発明の効果】本発明の請求項１に係る発光装置は、表
面が平坦な実装基板上に１又は複数の発光素子を搭載
し、メッシュ状のマスクを、このマスクの開口の内側に
発光素子が配置されるようにして実装基板上に配置し、
波長変換物質と光吸収体のうちの少なくとも一方を含有
する樹脂組成物を実装基板上に塗布することによりマス
クの開口内に樹脂組成物を充填し、メッシュ状のマスク
の上面側に付着した樹脂組成物を除去した後、樹脂組成
物を硬化させることによって封止樹脂を形成することに
より、封止樹脂にて発光素子を個別に封止するため、平
坦な実装基板上に発光素子が搭載されると共にこの発光
素子が個別に封止樹脂にて封止された発光装置を得るこ
とができ、このとき封止樹脂は、メッシュ状のマスクの
開口形状と同一形状となって、所定の形状を有する封止
樹脂が容易に形成され、波長変換物質や光吸収体を含有
する所定の形状の封止樹脂を、各発光素子ごとに略同一
条件で作製できて、発光部ごとの色ばらつき、光量ばら
つきが低減できるものであり、また簡便な工法であるた
めに製造コストの低減が可能なものである。また、発光
素子の本来の発光色とは異なる色合いの光を発すること
ができ、且つ、発光素子から放出される光は、封止樹脂
の上面側だけでなく、側面側に向けて放出される光も取
り出すことができ、発光素子からの光の取り出し効率が
向上するものである。In the light emitting device according to the first aspect of the present invention, one or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface, and a mesh-shaped mask is provided inside the opening of the mask. So that they are placed on the mounting board,
A resin composition containing at least one of a wavelength conversion substance and a light absorber is applied onto the mounting substrate to fill the resin composition in the opening of the mask, and the resin adhered to the upper surface side of the mesh-shaped mask. After the composition is removed, the resin composition is cured to form the encapsulating resin, and the light emitting elements are individually encapsulated by the encapsulating resin, so that the light emitting element is mounted on a flat mounting substrate. In addition, it is possible to obtain a light emitting device in which the light emitting elements are individually sealed with a sealing resin, and at this time, the sealing resin has the same shape as the opening shape of the mesh-shaped mask and has a predetermined shape. It is possible to easily form the encapsulating resin that has the encapsulating resin of a predetermined shape containing the wavelength conversion substance and the light absorber under substantially the same conditions for each light emitting element, and to obtain color variation and light amount for each light emitting part. Variation can be reduced And than, also those which can reduce the manufacturing cost for a convenient method. In addition, it is possible to emit light having a hue different from the original emission color of the light emitting element, and the light emitted from the light emitting element is emitted not only to the upper surface side of the sealing resin but also to the side surface side. Light can also be extracted, and the efficiency of extracting light from the light emitting element is improved.
【００６２】また本発明の請求項２に係る発光装置は、
表面が平坦な実装基板上に１又は複数の発光素子を搭載
し、紫外線硬化性樹脂を含有すると共に波長変換物質と
光吸収体のうちの少なくとも一方を含有する樹脂組成物
を実装基板上に塗布することにより樹脂組成物中に発光
素子を埋め込み、発光素子の周囲の樹脂組成物のみに紫
外線を照射して硬化させることによって封止樹脂を形成
することにより、封止樹脂にて発光素子を個別に封止す
るため、平坦な実装基板上に発光素子が搭載されると共
にこの発光素子が個別に封止樹脂にて封止された発光装
置を得ることができ、このとき封止樹脂は、紫外線の照
射域の設定により所定の形状を有する封止樹脂が容易に
形成され、波長変換物質や光吸収体を含有する所定の形
状の封止樹脂を、各発光素子ごとに略同一条件で作製で
きて、発光部ごとの色ばらつき、光量ばらつきが低減で
きるものであり、また簡便な工法であるために製造コス
トの低減が可能なものである。また、発光素子の本来の
発光色とは異なる色合いの光を発することができ、且
つ、発光素子から放出される光は、封止樹脂の上面側だ
けでなく、側面側に向けて放出される光も取り出すこと
ができ、発光素子からの光の取り出し効率が向上するも
のである。The light emitting device according to claim 2 of the present invention is
One or more light emitting elements are mounted on a mounting substrate having a flat surface, and a resin composition containing an ultraviolet curable resin and at least one of a wavelength conversion substance and a light absorber is applied on the mounting substrate. By embedding the light emitting element in the resin composition by doing so, the resin composition around the light emitting element is irradiated with ultraviolet rays to be cured to form the sealing resin, and thus the light emitting element is individually separated by the sealing resin. Since the light emitting device is mounted on a flat mounting substrate and the light emitting device is individually sealed with a sealing resin, the sealing resin is A sealing resin having a predetermined shape can be easily formed by setting the irradiation area of, and a sealing resin having a predetermined shape containing a wavelength conversion substance or a light absorber can be produced under substantially the same conditions for each light emitting element. And each light emitting unit Color variation is intended light amount variation can be reduced, also those which can reduce the manufacturing cost for a convenient method. In addition, it is possible to emit light having a hue different from the original emission color of the light emitting element, and the light emitted from the light emitting element is emitted not only to the upper surface side of the sealing resin but also to the side surface side. Light can also be extracted, and the efficiency of extracting light from the light emitting element is improved.
【００６３】また請求項３の発明は、請求項１又は２に
おいて、発光素子を封止する封止樹脂を、実装基板側が
幅狭となる断面略台形状に形成するため、発光装置から
側方に向けて放出された光が、封止樹脂の内部におい
て、封止樹脂の傾斜した側面にて反射されて、上面側へ
と向かうこととなり、発光装置の上面側に向けての光の
取り出し効率が更に向上するものである。According to a third aspect of the present invention, in the first or second aspect, the sealing resin for sealing the light emitting element is formed in a substantially trapezoidal cross section with a narrow width on the mounting substrate side. The light emitted toward the light is reflected by the inclined side surface of the sealing resin inside the sealing resin and travels toward the upper surface side, and the light extraction efficiency toward the upper surface side of the light emitting device is increased. Is further improved.
【００６４】また本発明の請求項４に係る発光装置の製
造方法は、表面が平坦な実装基板上に１又は複数の発光
素子を搭載し、メッシュ状のマスクを、このマスクの開
口の内側に発光素子が配置されるようにして実装基板上
に配置し、波長変換物質と光吸収体のうちの少なくとも
一方を含有する樹脂組成物を実装基板上に塗布すること
によりマスクの開口内に樹脂組成物を充填し、メッシュ
状のマスクの上面側に付着した樹脂組成物を除去した
後、樹脂組成物を硬化させることによって封止樹脂を形
成するため、平坦な実装基板上に発光素子が搭載される
と共にこの発光素子が個別に封止樹脂にて封止された発
光装置を得ることができ、このとき封止樹脂は、メッシ
ュ状のマスクの開口形状と同一形状となって、所定の形
状を有する封止樹脂が容易に形成され、波長変換物質や
光吸収体を含有する所定の形状の封止樹脂を、各発光素
子ごとに略同一条件で作製できて、発光部ごとの色ばら
つき、光量ばらつきが低減できるものであり、また簡便
な工法であるために製造コストの低減が可能なものであ
る。According to a fourth aspect of the present invention, in a method for manufacturing a light emitting device, one or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface, and a mesh-shaped mask is provided inside an opening of the mask. The resin composition is disposed in the opening of the mask by arranging the light emitting element on the mounting substrate so that the resin composition containing at least one of the wavelength conversion substance and the light absorber is applied on the mounting substrate. After the resin composition adhered to the upper surface side of the mesh-shaped mask is filled with the material, the resin composition is cured to form the sealing resin, so that the light emitting element is mounted on the flat mounting substrate. In addition, it is possible to obtain a light emitting device in which the light emitting elements are individually sealed with a sealing resin, and at this time, the sealing resin has the same shape as the opening shape of the mesh-shaped mask and has a predetermined shape. Sealing resin A sealing resin that is easily formed and contains a wavelength conversion substance and a light absorber and that has a predetermined shape can be manufactured under substantially the same conditions for each light emitting element, and can reduce color variation and light amount variation between light emitting parts. In addition, since it is a simple construction method, the manufacturing cost can be reduced.
【００６５】また本発明の請求項５に係る発光装置の製
造方法は、表面が平坦な実装基板上に１又は複数の発光
素子を搭載し、紫外線硬化性樹脂を含有すると共に波長
変換物質と光吸収体のうちの少なくとも一方を含有する
樹脂組成物中に発光素子を埋め込み、発光素子の周囲の
樹脂組成物のみに紫外線を照射して硬化させることによ
って封止樹脂を形成するため、平坦な実装基板上に発光
素子が搭載されると共にこの発光素子が個別に封止樹脂
にて封止された発光装置を得ることができ、このとき封
止樹脂は、紫外線の照射域の設定により所定の形状を有
する封止樹脂が容易に形成され、波長変換物質や光吸収
体を含有する所定の形状の封止樹脂を、各発光素子ごと
に略同一条件で作製できて、発光部ごとの色ばらつき、
光量ばらつきが低減できるものであり、また簡便な工法
であるために製造コストの低減が可能なものである。According to a fifth aspect of the present invention, in the method for manufacturing a light emitting device, one or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface, the ultraviolet light curable resin is contained, and the wavelength converting substance and the light are used. A light-emitting element is embedded in a resin composition containing at least one of absorbers, and only the resin composition around the light-emitting element is irradiated with ultraviolet rays to be cured to form a sealing resin. It is possible to obtain a light emitting device in which a light emitting element is mounted on a substrate and the light emitting element is individually sealed with a sealing resin. At this time, the sealing resin has a predetermined shape depending on the setting of the irradiation range of ultraviolet rays. A sealing resin having is easily formed, and a sealing resin having a predetermined shape containing a wavelength conversion substance or a light absorber can be produced under substantially the same conditions for each light emitting element, and color variation for each light emitting unit,
The variation in light quantity can be reduced, and the manufacturing cost can be reduced due to the simple construction method.
【００６６】また本発明の請求項６に係る発光装置の製
造方法は、表面が平坦な実装基板上に１又は複数の発光
素子を搭載し、水又は有機溶媒に可溶な材料にて形成さ
れたメッシュ状のマスクを、このマスクの開口の内側に
発光素子が配置されるようにして実装基板上に配置し、
波長変換物質と光吸収体のうちの少なくとも一方を含有
する樹脂組成物を実装基板上に塗布し、メッシュ状のマ
スクの上面側に付着した樹脂組成物を除去した後、樹脂
組成物を硬化させ、次いでマスクを水又は有機溶媒にて
溶解除去するため、平坦な実装基板上に発光素子が搭載
されると共にこの発光素子が個別に封止樹脂にて封止さ
れた発光装置を得ることができ、このとき封止樹脂は、
メッシュ状のマスクの開口形状と同一形状となって、所
定の形状を有する封止樹脂が容易に形成され、波長変換
物質や光吸収体を含有する所定の形状の封止樹脂を、各
発光素子ごとに略同一条件で作製できて、発光部ごとの
色ばらつき、光量ばらつきが低減できるものであり、ま
た簡便な工法であるために製造コストの低減が可能なも
のである。また、形成される封止樹脂の形状にかかわら
ず、メッシュ状のマスクを容易に除去することができ
て、封止樹脂の形状を種々の形状に形成することが容易
なものであり、例えば実装基板側が幅狭となった断面略
台形状の封止樹脂を有する発光装置も容易に作製可能な
ものである。According to a sixth aspect of the present invention, in a method for manufacturing a light emitting device, one or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface, and the light emitting device is formed of a material soluble in water or an organic solvent. The mesh-shaped mask is placed on the mounting substrate so that the light emitting element is placed inside the opening of the mask.
A resin composition containing at least one of a wavelength conversion substance and a light absorber is applied onto a mounting substrate, and after removing the resin composition attached to the upper surface side of the mesh-shaped mask, the resin composition is cured. Then, since the mask is dissolved and removed with water or an organic solvent, it is possible to obtain a light emitting device in which the light emitting element is mounted on a flat mounting substrate and the light emitting element is individually sealed with a sealing resin. , At this time, the sealing resin is
A sealing resin having the same shape as the opening shape of the mesh-shaped mask is easily formed, and the sealing resin having a predetermined shape containing a wavelength conversion substance or a light absorber is used for each light emitting element. They can be manufactured under substantially the same conditions for each of them, and the color variation and the light amount variation of each light emitting portion can be reduced, and the manufacturing cost can be reduced because of the simple construction method. Further, regardless of the shape of the sealing resin to be formed, the mesh-shaped mask can be easily removed, and the sealing resin can be easily formed into various shapes. A light-emitting device having a sealing resin having a substantially trapezoidal cross section with a narrower substrate side can be easily manufactured.
【００６７】また請求項７の発明は、請求項６におい
て、実装基板上に配置する前のメッシュ状のマスクに対
して、その開口の内面に金属膜を形成するため、メッシ
ュ状のマスクを溶解除去する際に金属膜が残存し、封止
樹脂の側面に対して金属膜を容易に設けることができる
ものである。According to a seventh aspect of the present invention, in the sixth aspect, since the metal film is formed on the inner surface of the opening of the mesh-shaped mask before being placed on the mounting substrate, the mesh-shaped mask is dissolved. The metal film remains when it is removed, and the metal film can be easily provided on the side surface of the sealing resin.
【図１】（ａ）（ｂ）は本発明の第１の実施形態を示す
概略の断面図である。1A and 1B are schematic cross-sectional views showing a first embodiment of the present invention.
【図２】（ａ）（ｂ）は本発明の第２の実施形態を示す
概略の断面図である。2A and 2B are schematic cross-sectional views showing a second embodiment of the present invention.
【図３】（ａ）（ｂ）は本発明の第３の実施形態におけ
る工程を示す概略の断面図である。3 (a) and 3 (b) are schematic cross-sectional views showing steps in a third embodiment of the present invention.
【図４】（ａ）（ｂ）は本発明の第４の実施形態におけ
る工程を示す概略の断面図である。FIGS. 4A and 4B are schematic cross-sectional views showing steps in a fourth embodiment of the present invention.
【図５】（ａ）（ｂ）は本発明の第５の実施形態におけ
る工程を示す概略の断面図である。5 (a) and 5 (b) are schematic sectional views showing steps in a fifth embodiment of the present invention.
【図６】（ａ）（ｂ）は本発明の第６の実施形態におけ
る工程を示す概略の断面図である。6 (a) and 6 (b) are schematic cross-sectional views showing the steps in the sixth embodiment of the present invention.
【図７】（ａ）（ｂ）は本発明の第７の実施形態におけ
る工程を示す概略の断面図である。7 (a) and 7 (b) are schematic sectional views showing steps in a seventh embodiment of the present invention.
１ 実装基板 ２ 発光素子 ３ 封止樹脂 ４ 金属膜 ５ マスク ５ａ 開口 ６ 樹脂組成物 1 Mounting board 2 light emitting element 3 Sealing resin 4 metal film 5 masks 5a opening 6 resin composition
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 23/31 Ｈ０１Ｌ 23/30 Ｆ (72)発明者 木村 秀吉 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 塩濱 英二 大阪府門真市大字門真1048番地松下電工株 式会社内 Ｆターム(参考） 4M109 AA01 BA03 CA10 DA03 EA15 EC12 EC20 EE11 GA01 5F041 AA09 AA42 CA40 DA01 DA43 DA56 FF01 5F061 AA01 BA03 CA10 CA26 FA01─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01L 23/31 H01L 23/30 F (72) Inventor Hideyoshi Kimura 1048 Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd. In-company (72) Inventor Eiji Shiohama 1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd. F-term in company (reference) 4M109 AA01 BA03 CA10 DA03 EA15 EC12 EC20 EE11 GA01 5F041 AA09 AA42 CA40 DA01 DA43 DA56 FF01 5F061 AA01 BA03 CA10 CA26 FA01
Claims (7)
発光素子を搭載し、メッシュ状のマスクを、このマスク
の開口の内側に発光素子が配置されるようにして実装基
板上に配置し、波長変換物質と光吸収体のうちの少なく
とも一方を含有する樹脂組成物を実装基板上に塗布する
ことによりマスクの開口内に樹脂組成物を充填し、メッ
シュ状のマスクの上面側に付着した樹脂組成物を除去し
た後、樹脂組成物を硬化させることによって封止樹脂を
形成することにより、封止樹脂にて発光素子を個別に封
止して成ることを特徴とする発光装置。1. One or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface, and a mesh-shaped mask is arranged on the mounting substrate such that the light emitting elements are arranged inside an opening of the mask. Then, the resin composition containing at least one of the wavelength conversion substance and the light absorber is applied on the mounting substrate to fill the resin composition in the opening of the mask and adhere to the upper surface side of the mesh-shaped mask. After removing the resin composition described above, the light emitting device is individually sealed with the sealing resin by forming the sealing resin by curing the resin composition.
発光素子を搭載し、紫外線硬化性樹脂を含有すると共に
波長変換物質と光吸収体のうちの少なくとも一方を含有
する樹脂組成物中に発光素子を埋め込み、発光素子の周
囲の樹脂組成物のみに紫外線を照射して硬化させること
によって封止樹脂を形成することにより、封止樹脂にて
発光素子を個別に封止して成ることを特徴とする発光装
置。2. A resin composition in which one or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface and which contains an ultraviolet curable resin and at least one of a wavelength conversion substance and a light absorber. The light-emitting element is individually sealed with the sealing resin by embedding the light-emitting element in, and irradiating the resin composition around the light-emitting element with ultraviolet rays to cure the resin to form the sealing resin. A light emitting device characterized by.
板側が幅狭となる断面略台形状に形成して成ることを特
徴とする請求項１又は２に記載の発光装置。3. The light emitting device according to claim 1, wherein a sealing resin for sealing the light emitting element is formed in a substantially trapezoidal cross section having a narrow width on the mounting substrate side.
発光素子を搭載し、メッシュ状のマスクを、このマスク
の開口の内側に発光素子が配置されるようにして実装基
板上に配置し、波長変換物質と光吸収体のうちの少なく
とも一方を含有する樹脂組成物を実装基板上に塗布する
ことによりマスクの開口内に樹脂組成物を充填し、メッ
シュ状のマスクの上面側に付着した樹脂組成物を除去し
た後、樹脂組成物を硬化させることによって封止樹脂を
形成することを特徴とする発光装置の製造方法。4. One or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface, and a mesh-shaped mask is arranged on the mounting substrate such that the light emitting elements are arranged inside the openings of the mask. Then, the resin composition containing at least one of the wavelength conversion substance and the light absorber is applied on the mounting substrate to fill the resin composition in the opening of the mask and adhere to the upper surface side of the mesh-shaped mask. A method for manufacturing a light-emitting device, comprising: forming a sealing resin by curing the resin composition after removing the resin composition.
発光素子を搭載し、紫外線硬化性樹脂を含有すると共に
波長変換物質と光吸収体のうちの少なくとも一方を含有
する樹脂組成物中に発光素子を埋め込み、発光素子の周
囲の樹脂組成物のみに紫外線を照射して硬化させること
によって封止樹脂を形成することを特徴とする発光装置
の製造方法。5. A resin composition in which one or a plurality of light emitting elements are mounted on a mounting substrate having a flat surface and which contains an ultraviolet curable resin and at least one of a wavelength conversion substance and a light absorber. A method for manufacturing a light-emitting device, comprising: embedding a light-emitting element in a substrate, and irradiating only a resin composition around the light-emitting element with ultraviolet rays to cure the resin, thereby forming a sealing resin.
発光素子を搭載し、水又は有機溶媒に可溶な材料にて形
成されたメッシュ状のマスクを、このマスクの開口の内
側に発光素子が配置されるようにして実装基板上に配置
し、波長変換物質と光吸収体のうちの少なくとも一方を
含有する樹脂組成物を実装基板上に塗布し、メッシュ状
のマスクの上面側に付着した樹脂組成物を除去した後、
樹脂組成物を硬化させ、次いでマスクを水又は有機溶媒
にて溶解除去することを特徴とする発光装置の製造方
法。6. A mesh-shaped mask formed by mounting one or a plurality of light-emitting elements on a mounting substrate having a flat surface and forming a material soluble in water or an organic solvent inside the opening of the mask. The light emitting element is arranged on the mounting substrate so that the resin composition containing at least one of the wavelength conversion substance and the light absorber is applied on the mounting substrate, and the resin composition containing the wavelength converting substance and the light absorber is applied on the upper surface side of the mesh-shaped mask. After removing the adhered resin composition,
A method for manufacturing a light-emitting device, which comprises curing the resin composition and then dissolving and removing the mask with water or an organic solvent.
マスクに対して、その開口の内面に金属膜を形成するこ
とを特徴とする請求項６に記載の発光装置の製造方法。7. The method for manufacturing a light emitting device according to claim 6, wherein a metal film is formed on the inner surface of the opening of the mesh-shaped mask before being placed on the mounting substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001226677A JP4122737B2 (en) | 2001-07-26 | 2001-07-26 | Method for manufacturing light emitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001226677A JP4122737B2 (en) | 2001-07-26 | 2001-07-26 | Method for manufacturing light emitting device |
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| Publication Number | Publication Date |
|---|---|
| JP2003046140A true JP2003046140A (en) | 2003-02-14 |
| JP4122737B2 JP4122737B2 (en) | 2008-07-23 |
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| JP2001226677A Expired - Lifetime JP4122737B2 (en) | 2001-07-26 | 2001-07-26 | Method for manufacturing light emitting device |
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