JP2003043458A - Method and device for sucking substrate for liquid crystal display element - Google Patents

Method and device for sucking substrate for liquid crystal display element

Info

Publication number
JP2003043458A
JP2003043458A JP2001231647A JP2001231647A JP2003043458A JP 2003043458 A JP2003043458 A JP 2003043458A JP 2001231647 A JP2001231647 A JP 2001231647A JP 2001231647 A JP2001231647 A JP 2001231647A JP 2003043458 A JP2003043458 A JP 2003043458A
Authority
JP
Japan
Prior art keywords
suction
substrate
resin substrate
liquid crystal
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001231647A
Other languages
Japanese (ja)
Inventor
Yasuhiro Hosokawa
育宏 細川
Hiroaki Mizuno
浩明 水野
Junya Yamamoto
純也 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001231647A priority Critical patent/JP2003043458A/en
Publication of JP2003043458A publication Critical patent/JP2003043458A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for sucking a substrate for liquid crystal display element for the purpose of obtaining liquid crystal display element with excellent display quality even when a substrate composed of resin is used. SOLUTION: A plurality of suction ports 4 for sucking are arranged on a surface plate 2A. Distributions of the suction ports 4 in regions R1-R5 are made to be respectively different and the respective regions are independently interchanged corresponding to details of treatment for a resin substrate 3. An air blower 1 is attached to the upper side of the surface plate 2A. Air is evacuated through the suction ports 4 with a vacuum pump while imparting wind pressure to the resin substrate 3. By this procedure, no warpage is generated on the resin substrate 3 in fixing and resist treatment and treatment for formation of an alignment layer are stabilized.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、樹脂基板を用いた
液晶表示素子基板の吸着方法、及び液晶表示素子基板の
吸着装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display element substrate suction method using a resin substrate and a liquid crystal display element substrate suction apparatus.

【0002】[0002]

【従来の技術】現在、液晶表示素子には主にガラスが使
われている。ガラス基板を用いた、液晶表示素子の製造
プロセスでは、フォトリソグラフィによる透明電極のパ
ターニング、配向膜形成、シール印刷等を行い、それら
の工程を経た2枚のガラス基板を貼り合せて作製され
る。従来のこれらの製造工程においては、基板の固定は
真空吸着によって行われている。これは、ガラスのよう
に剛性を有する基板では、基板にそりが発生することは
なく、基板が平坦であるため、平坦な定盤へ容易に吸着
できるためである。また、ガラス基板自身の剛性によ
り、真空吸着により部分的な変形も起こらない。
2. Description of the Related Art At present, glass is mainly used for liquid crystal display elements. In the manufacturing process of a liquid crystal display element using a glass substrate, patterning of a transparent electrode by photolithography, alignment film formation, seal printing, and the like are performed, and two glass substrates that have undergone these steps are bonded together. In these conventional manufacturing processes, the substrate is fixed by vacuum suction. This is because a substrate having rigidity such as glass does not warp on the substrate and the substrate is flat, so that it can be easily adsorbed to a flat platen. Further, due to the rigidity of the glass substrate itself, partial deformation does not occur due to vacuum suction.

【0003】[0003]

【発明が解決しようとする課題】このように液晶表示素
子の基板には主にガラスが用いられているが、最近の液
晶表示素子の薄型化、及び軽量化の要求を満たすために
基板の樹脂化が検討されている。樹脂基板の材料として
は、アクリル系樹脂、ポリカーボネート系樹脂、エポキ
シ系樹脂、ポリエーテルスルフォン系樹脂が検討されて
おり、基板の厚みは0.1mm から0.5mm である。
As described above, glass is mainly used for the substrate of the liquid crystal display element. However, in order to satisfy the recent demands for thinner and lighter liquid crystal display elements, the resin of the substrate is used. Is being considered. Acrylic resins, polycarbonate resins, epoxy resins, and polyethersulfone resins have been considered as materials for resin substrates, and the substrate thickness is 0.1 mm to 0.5 mm.

【0004】樹脂基板はガラス基板と異なり、図4に示
すように基板自身がITO形成面側に凸となる。この現
象は、均一なITOの成膜を行うために成膜時に基板に
熱をかけるが、ITOの成膜後に基板が冷却されると、
ITO膜と比較して樹脂基板の方が多く縮むために生じ
る。このように樹脂基板が反っていると、定盤2上で基
板の固定を行う際に、樹脂基板3と定盤2との間に広い
範囲に渡って間隙が生じる。このため、実質的に基板の
吸着が行うことができず、液晶表示素子の作製自体が行
えない。また、それを避けるために吸着口7による吸着
力を大きくすると、吸着は可能となるが、図5に示すよ
うに吸着部分が凹形状となり、基板全体の平坦性が確保
されにくくなる。
Unlike the glass substrate, the resin substrate is convex on the ITO forming surface side as shown in FIG. This phenomenon applies heat to the substrate during film formation in order to form a uniform ITO film, but when the substrate is cooled after the ITO film is formed,
This occurs because the resin substrate shrinks more than the ITO film. When the resin substrate is thus warped, a gap is formed over a wide range between the resin substrate 3 and the surface plate 2 when the substrate is fixed on the surface plate 2. Therefore, the substrate cannot be substantially adsorbed, and the liquid crystal display element itself cannot be manufactured. Further, if the suction force by the suction port 7 is increased in order to avoid this, suction is possible, but the suction portion becomes concave as shown in FIG. 5, and it becomes difficult to secure the flatness of the entire substrate.

【0005】この場合、その後のフォトリソグラフィ工
程のレジスト塗布で膜厚むらが生じ、その結果透明電極
パターンの開口率にばらつきが生じる。このため、液晶
パネルの表示状態で輝度むらが発生する。更に、配向膜
の印刷工程でも配向膜の膜厚むらが生じ、液晶パネルの
表示状態で液晶セルの閾値むらが発生する。更に、シー
ル印刷工程でシールの膜厚むらが生じ、液晶パネルの表
示状態でシール際のギャップむらが発生するという課題
がある。
In this case, unevenness of the film thickness occurs in the subsequent resist coating in the photolithography process, and as a result, the aperture ratio of the transparent electrode pattern varies. Therefore, uneven brightness occurs in the display state of the liquid crystal panel. Further, the unevenness of the thickness of the alignment film also occurs in the printing process of the alignment film, and the unevenness of the threshold value of the liquid crystal cell occurs in the display state of the liquid crystal panel. Further, there is a problem that unevenness of the film thickness of the sticker occurs in the sticker printing step, and unevenness of the gap at the time of sealing occurs in the display state of the liquid crystal panel.

【0006】本発明では、以上のような問題点に鑑みな
されたものであって、樹脂からなる基板を用いても、表
示品位に優れた液晶表示素子を得るための液晶表示素子
基板の吸着方法及び液晶表示素子基板の吸着装置を提供
することを目的としている。
The present invention has been made in view of the above problems, and a method of adsorbing a liquid crystal display element substrate for obtaining a liquid crystal display element excellent in display quality even when a resin substrate is used. Another object of the present invention is to provide a liquid crystal display element substrate suction device.

【0007】[0007]

【課題を解決するための手段】本願の請求項1の発明
は、液晶表示素子の樹脂基板を定盤に吸着させて各種の
処理を行う液晶表示素子基板の吸着方法において、複数
に分割された領域に夫々吸着口を有する平坦な定盤上に
樹脂基板を配置し、前記吸着口を通して吸着力を作用さ
せて樹脂基板を吸引し、前記複数の領域に分割された一
領域に前記定盤上方から加圧を行うと共に、加圧された
領域の吸着口から吸引して樹脂基板を吸着固定し、次い
で隣接する分割された吸着口の一領域を前記定盤上方か
ら加圧すると共に、その一領域にその前記樹脂基板の下
方から吸引を行い、前記隣接する分割された吸着口の一
領域の樹脂基板を吸着固定させ、これを分割された領域
全てで繰り返し、前記樹脂基板を全面吸着させることを
特徴とする。
The invention according to claim 1 of the present application is a method of adsorbing a resin substrate of a liquid crystal display element on a surface plate to perform various kinds of processing, and is divided into a plurality of parts. The resin substrate is arranged on a flat surface plate having suction ports in each region, and the resin substrate is sucked by applying suction force through the suction port, and the region above the surface plate is divided into a plurality of regions. And pressurize the resin substrate by suction from the suction port of the pressurized region, and then press one area of the adjacent divided suction port from above the surface plate and that area. Then, suction is performed from below the resin substrate to adsorb and fix the resin substrate in one area of the adjacent divided adsorption ports, and this is repeated in all the divided areas to adsorb the entire surface of the resin substrate. Characterize.

【0008】本願の請求項2の発明は、請求項1の液晶
表示素子基板の吸着方法において、前記定盤は、分割さ
れた領域ごとに吸着口の密度に差を設けて前記樹脂基板
に吸着力を作用させることを特徴とする。
According to a second aspect of the invention of the present application, in the liquid crystal display element substrate suction method according to the first aspect, the surface plate is sucked onto the resin substrate by providing a difference in the density of the suction port for each divided region. Characterized by applying force.

【0009】本願の請求項3の発明は、請求項1の液晶
表示素子基板の吸着方法において、前記定盤は、樹脂基
板が搭載される周辺部の吸着口の密度を大きく、その中
央部の吸着口の密度を小さくするようにしたことを特徴
とする。
According to a third aspect of the invention of the present application, in the liquid crystal display element substrate suction method according to the first aspect, the surface plate has a large density of suction ports in a peripheral portion on which a resin substrate is mounted and a central portion of the suction port is large. It is characterized in that the density of the suction port is reduced.

【0010】本願の請求項4の発明は、請求項2の液晶
表示素子基板の吸着方法において、前記定盤の吸着口は
定盤の一辺に対応する領域の吸着口の密度を高く、他の
吸着口の密度を低くするようにしたことを特徴とする。
According to a fourth aspect of the present invention, in the suction method for a liquid crystal display element substrate according to the second aspect, the suction port of the surface plate has a high density of the suction port in a region corresponding to one side of the surface plate, and The feature is that the density of the adsorption port is made low.

【0011】本願の請求項5の発明は、複数に分割され
た各領域に夫々吸着口を複数個有する平坦な吸着面を有
する定盤と、前記定盤の吸着面に載置された樹脂基板の
上方からエアブローを与え、前記樹脂基板を前記定盤側
に押圧するエアブロー装置と、前記樹脂基板が前記エア
ブロー装置に押圧されたとき、前記吸着口のガスを排気
する排気装置と、前記定盤の各領域に夫々吸着口と前記
排気装置とを連結し、夫々の領域を独立して切り替える
バルブと、を有することを特徴とする。
According to a fifth aspect of the present invention, a surface plate having a flat suction surface having a plurality of suction ports in each of the plurality of divided areas, and a resin substrate mounted on the suction surface of the surface plate. An air blow device that applies air blow from above to press the resin substrate toward the platen side, an exhaust device that exhausts gas from the adsorption port when the resin substrate is pressed by the air blow device, and the platen And a valve that connects the suction port and the exhaust device to each area, and switches each area independently.

【0012】本願の請求項6の発明は、請求項5の液晶
表示素子基板の吸着装置において、前記定盤は、分割さ
れた領域ごとに吸着口の密度に差を設けて前記樹脂基板
に吸着力を作用させることを特徴とする。
According to a sixth aspect of the present invention, in the liquid crystal display element substrate suction device according to the fifth aspect, the surface plate sucks onto the resin substrate by providing a difference in the density of the suction port for each divided region. Characterized by applying force.

【0013】本願の請求項7の発明は、請求項5の液晶
表示素子基板の吸着装置において、樹脂基板が搭載され
る周辺部の吸着口の密度を大きく、その中央部の吸着口
の密度を小さくするようにしたことを特徴とする。
According to a seventh aspect of the invention of the present application, in the suction device for a liquid crystal display element substrate according to the fifth aspect, the density of the suction port in the peripheral portion where the resin substrate is mounted is increased and the density of the suction port in the central portion is increased. The feature is that it is made smaller.

【0014】本願の請求項8の発明は、請求項6の液晶
表示素子基板の吸着装置において、前記定盤の吸着口は
定盤の一辺に対応する領域の吸着口の密度を高く、他の
吸着口の密度を低くするようにしたことを特徴とする。
According to an eighth aspect of the present invention, in the liquid crystal display element substrate suction device according to the sixth aspect, the suction port of the surface plate has a high density of the suction port in a region corresponding to one side of the surface plate, and another The feature is that the density of the adsorption port is made low.

【0015】[0015]

【発明の実施の形態】以下に本発明の実施の形態につい
て、図面を用いて説明する。 (第1の実施の形態)使用した基板は厚さ0.4mm 、サイ
ズは300mm ×320mm のアクリル系の樹脂基板である。こ
のITO付の樹脂基板は、定盤上に置いたとき基板の中
央が約5mm定盤面から離れていた。はじめに基板を洗浄
し、フォトリソグラフィによる透明電極のパターニング
のためにレジストの塗布を行った。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) The substrate used is an acrylic resin substrate having a thickness of 0.4 mm and a size of 300 mm × 320 mm. When the resin substrate with ITO was placed on the surface plate, the center of the substrate was about 5 mm apart from the surface plate surface. First, the substrate was washed and a resist was applied for patterning the transparent electrode by photolithography.

【0016】図1は第1の実施の形態におけるスピンナ
ー型のレジスト塗布装置の断面図である。図2はスピン
ナー型のレジスト塗布装置の定盤の平面図である。1は
加圧用のエアーブロー装置、2は定盤、3は樹脂基板、
4は部分吸着口、5は真空ポンプ、6は切り替えバル
ブ、R1〜R7は夫々独立して吸引される領域を示す。
FIG. 1 is a sectional view of a spinner type resist coating apparatus according to the first embodiment. FIG. 2 is a plan view of a surface plate of a spinner type resist coating apparatus. 1 is an air blower for pressurization, 2 is a surface plate, 3 is a resin substrate,
4 is a partial suction port, 5 is a vacuum pump, 6 is a switching valve, and R1 to R7 are regions that are independently sucked.

【0017】エアーブロー装置1は定盤2上に配置され
る樹脂基板3に向けて空気流を噴出するものであり、空
気流の幅は、樹脂基板3の幅とほぼ同等とする。このエ
アーブロー装置1は定盤2Aから高さ50mmの位置に設置
した。定盤2Aには吸着用の部分吸着口4が設けられて
おり、定盤2A内でダクトに連絡され、切り替えバルブ
6を介して真空ポンプ5に接続される。吸着口の径は0.
5mm から1.0mm とする。基板の中央部に当たる部分と基
板の周辺部とでは、吸着口4の密度を変えてある。領域
R1,R5及びR2,R3,R4の周辺部分の吸着口の
間隔は5.0mm から10.0mmである。中央部分の吸着口の間
隔は10.0mmから30.0mmである。樹脂基板は剛性がなく曲
がるため、スピンナー型のレジスト塗布装置では、回転
により樹脂基板の周囲が浮き周辺部分から真空吸着がで
きなくなる。そこで樹脂基板の周囲に相当する部分の吸
着口の密度を高くする。また、吸着領域R1〜R5の切
り替えは、切り替えバルブ6によって行う。
The air blower 1 jets an air flow toward the resin substrate 3 arranged on the surface plate 2, and the width of the air flow is substantially equal to the width of the resin substrate 3. The air blower 1 was installed at a position 50 mm in height from the surface plate 2A. The surface plate 2A is provided with a partial suction port 4 for suction, is connected to a duct in the surface plate 2A, and is connected to a vacuum pump 5 via a switching valve 6. The diameter of the suction port is 0.
5mm to 1.0mm. The density of the suction ports 4 is changed between the portion corresponding to the central portion of the substrate and the peripheral portion of the substrate. The distance between the suction ports around the areas R1, R5 and R2, R3, R4 is 5.0 mm to 10.0 mm. The distance between the suction ports in the center is 10.0 mm to 30.0 mm. Since the resin substrate has no rigidity and bends, in the spinner type resist coating device, the periphery of the resin substrate floats due to rotation, and vacuum adsorption cannot be performed from the peripheral portion. Therefore, the density of the suction port in the portion corresponding to the periphery of the resin substrate is increased. The switching valves 6 switch the suction regions R1 to R5.

【0018】このような構造にしたスピンナー型のレジ
スト塗布装置でレジスト塗布を行った。樹脂基板3の吸
着は図2に示すように、まず、領域R1にエアーブロー
装置1を用いて基板上部から圧力をかけると同時に、領
域R1の部分を切り替えバルブ6によって真空ポンプ5
に接続することにようにして真空吸着した。これにより
領域R1は固定される。このときの吸着のための真空度
は0.06MPa から0.10MPa であった。領域R1の真空吸着
は以後もそのまま維持した。
The resist coating was carried out by the spinner type resist coating device having such a structure. For adsorption of the resin substrate 3, as shown in FIG. 2, first, pressure is applied to the region R1 from above the substrate by using the air blower 1, and at the same time, the region R1 is switched by the switching valve 6 to the vacuum pump 5
It was vacuum-adsorbed so that it was connected to. As a result, the region R1 is fixed. The degree of vacuum for adsorption at this time was 0.06 MPa to 0.10 MPa. The vacuum suction of the region R1 was maintained as it was thereafter.

【0019】次に、エアーブローによって加圧を行った
状態で、エアーブロー装置1を領域R2に移動させた。
このときの圧力は、0.3MPaから0.5MPaであった。
Next, the air blow device 1 was moved to the region R2 while being pressurized by the air blow.
The pressure at this time was 0.3 MPa to 0.5 MPa.

【0020】その後、エアーブローによって圧力がかか
っている領域R2についても真空ポンプ5に接続し、真
空吸着を行った。これを領域R5まで繰り返し、樹脂基
板全体を固定した。
After that, the region R2 under pressure by the air blow was also connected to the vacuum pump 5 to perform vacuum suction. This was repeated up to the region R5 to fix the entire resin substrate.

【0021】この方法では、基板の一辺から対辺に向か
って圧力を加えるため、基板のたわみを除きながら基板
吸着を行うことが可能である。その後レジストを塗布
し、スピンナーを回転させレジスト膜の形成を行った。
このとき、樹脂基板が定盤から剥がれるようなことはな
かった。
In this method, since pressure is applied from one side of the substrate to the opposite side, it is possible to adsorb the substrate while removing the deflection of the substrate. After that, a resist was applied and the spinner was rotated to form a resist film.
At this time, the resin substrate did not peel off from the surface plate.

【0022】(第2の実施の形態)本発明の第2の実施
の形態では、定盤2Bは図3に示すように上方から領域
R1,R2・・・R5を有している。領域R1とR2と
は図示のように部分吸着口4の間隔が狭く、領域R3,
R4,R5では間隔を粗くするように構成されている。
その他の構成は第1の実施の形態と同様である。
(Second Embodiment) In the second embodiment of the present invention, the surface plate 2B has regions R1, R2, ... R5 from above as shown in FIG. The regions R1 and R2 have a narrow gap between the partial suction ports 4 as shown in the figure, and the regions R3 and R3
R4 and R5 are configured to have a narrow interval.
Other configurations are similar to those of the first embodiment.

【0023】次にこの定盤とエアーブロー装置を用いて
ITOパターン上に配向膜を印刷形成する際に、樹脂基
板を吸着する方法について説明する。搬送アームで樹脂
基板3を定盤21から突き出たリフトピン上に載せた。
その後、リフトピンを下降させ、位置決めピンによって
位置決めを行った。その後、定盤2Bの上方のエアーブ
ロー装置1を基板の一端に配置し、このときエアーブロ
ーが当たった基板の位置の真空吸着を行った。こうして
吸着を行いつつ、エアーブロー装置1を樹脂基板の一端
からもう一端に向かって移動させた。配向膜印刷は、ロ
ールに巻いてある印刷版に塗られた配向膜インキ基板に
転写されて行われる。まず、印刷時に印刷版と基板は接
するため密着力が働く。次に、転写が終了すると基板の
進行方向前方からロール状の版が離れていく。この時、
版と基板には密着力が働いているため、基板には版が基
板を定盤から離そうとする力が働く。このため、定盤の
穴の密度は、第1の実施の形態の場合と異なり、基板の
進行方向前方部分の吸着口密度を高くした。
Next, a method of adsorbing a resin substrate when an alignment film is printed on an ITO pattern by using this surface plate and an air blower will be described. The resin substrate 3 was placed on the lift pins protruding from the surface plate 21 by the transfer arm.
Then, the lift pins were lowered and the positioning pins were used for positioning. Then, the air blow device 1 above the surface plate 2B was arranged at one end of the substrate, and vacuum suction was performed at the position of the substrate hit by the air blow at this time. The air blowing device 1 was moved from one end to the other end of the resin substrate while adsorbing. Alignment film printing is performed by transferring to an alignment film ink substrate coated on a printing plate wound on a roll. First, when printing, the printing plate and the substrate come into contact with each other, so that an adhesive force is exerted. Next, when the transfer is completed, the roll-shaped plate is separated from the front side in the traveling direction of the substrate. This time,
Since the plate and the substrate have an adhesive force, the plate exerts a force to separate the substrate from the surface plate. Therefore, the density of holes on the surface plate is different from that in the first embodiment, and the density of the suction ports in the front portion of the substrate in the traveling direction is increased.

【0024】次に配向膜を印刷した後、250°ツイス
トのSTNモードの液晶を実現するようにレーヨン布を
用いた回転ラビングにより配向処理を行った。対向基板
も同様にして作成し、一方の基板の周囲部分にはガラス
ファイバを1.0wt %混入した紫外線硬化性シール樹脂を
印刷した。シール印刷の場合も配向膜印刷の場合と同様
の方法で基板の吸着を行った。
After printing the alignment film, alignment treatment was performed by rotary rubbing using rayon cloth so as to realize STN mode liquid crystal of 250 ° twist. An opposite substrate was also prepared in the same manner, and an ultraviolet curable sealing resin mixed with 1.0 wt% of glass fiber was printed on the peripheral portion of one substrate. In the case of sticker printing as well, the substrate was adsorbed by the same method as in the case of alignment film printing.

【0025】次に他方の基板上には所定の径の樹脂ビー
ズを200 個/mm2 の割合で散布して互いに貼り合わせ紫
外線照射によりシール樹脂を硬化した。その後、Δn=
0.14のエステル系ネマチック液晶に所定の量のカイ
ラル剤を混ぜた混合液晶を真空注入した。そして紫外線
硬化樹脂で封口した後、紫外線照射により硬化後、熱処
理し、液晶セルを得た。さらにこれを用いて液晶表示素
子を試作した。
Next, 200 beads / mm 2 of resin beads having a predetermined diameter were sprayed on the other substrate, and the beads were attached to each other and the sealing resin was cured by irradiation with ultraviolet rays. After that, Δn =
A mixed liquid crystal in which a predetermined amount of a chiral agent was mixed with 0.14 ester nematic liquid crystal was vacuum-injected. After sealing with an ultraviolet curable resin, it was cured by irradiation with ultraviolet rays and then heat-treated to obtain a liquid crystal cell. Further, a liquid crystal display device was prototyped using this.

【0026】このような製造方法を用いて試作した液晶
パネルの表示特性を評価した。この結果、レジストの膜
厚むらに起因する輝度むらは見られなかった。また、こ
の方法を用いて配向膜印刷を行い、試作した液晶パネル
の表示特性を評価したが、配向膜の膜厚むらによる液晶
の閾値むらは見られなかった。更に、この方法を用いて
シール印刷を行い、試作した液晶パネルの表示特性を評
価したが、シールの膜厚むらによるシール際のギャップ
むらは見られなかった。
The display characteristics of the liquid crystal panel prototyped using such a manufacturing method were evaluated. As a result, the uneven brightness due to the uneven film thickness of the resist was not observed. In addition, when an alignment film was printed using this method and the display characteristics of a prototype liquid crystal panel were evaluated, the unevenness of the liquid crystal threshold due to the unevenness of the thickness of the alignment film was not observed. Further, seal printing was performed using this method to evaluate the display characteristics of a prototype liquid crystal panel, but no gap unevenness was observed during sealing due to uneven film thickness of the seal.

【0027】従来の樹脂基板を用いた製造工程では、樹
脂基板のそりが大きいために基板の吸着が不可能だった
り、無理に吸着することでレジストの膜厚むら起因の輝
度むら、配向膜の膜厚むら起因の閾値むら、シールの膜
厚むら起因のシール際のギャップむらが生じていた。し
かし、上記のような方法で液晶表示素子を作製したとこ
ろ、容易に基板の吸着が行え、むらのない良好な特性の
液晶表示素子が得られた。
In the conventional manufacturing process using a resin substrate, since the warpage of the resin substrate is large, it is impossible to adsorb the substrate, or the adsorbing force causes the unevenness of brightness due to the unevenness of the resist film and the alignment film. There was unevenness in the threshold value due to the uneven film thickness and unevenness in the gap at the time of sealing due to the uneven film thickness of the seal. However, when a liquid crystal display device was manufactured by the above method, the substrate could be easily adsorbed, and a liquid crystal display device with good characteristics without unevenness was obtained.

【0028】尚、以上の実施の形態において、吸着後の
プロセスにおいて基板が剥がれないようにするために、
樹脂基板の周囲や、樹脂基板前方に相当する位置の定盤
の吸着口の密度を部分的に変更したが、その部分の吸着
力自体を上げて、吸着を行っても同様の特性の樹脂基板
を得ることが可能である。尚、基板の吸着に用いた圧力
及び基板上方から加えた圧力は、基板の厚みや基板の剛
性によって変更してもよい。尚、基板の吸着は基板の1
辺から対辺に向かって行うだけでなく、基板の中央から
外側に向かって行ってもよい。又吸着口の径についても
基板の中央部と周辺部の径を同一としてもよく、又異な
らせてもよい。
In the above embodiment, in order to prevent the substrate from peeling in the process after adsorption,
The density of the suction port of the surface plate around the resin substrate and the position corresponding to the front of the resin substrate was partially changed, but the resin substrate with the same characteristics even if suction is performed by increasing the suction force itself of that part It is possible to obtain The pressure used for sucking the substrate and the pressure applied from above the substrate may be changed depending on the thickness of the substrate and the rigidity of the substrate. In addition, the adsorption of the substrate
The process may be performed not only from the side to the opposite side but also from the center of the substrate to the outside. Regarding the diameter of the suction port, the central portion and the peripheral portion of the substrate may have the same diameter or may have different diameters.

【0029】[0029]

【発明の効果】以上説明したように本発明によれば、そ
りのある樹脂基板を定盤に容易に吸着することができ、
輝度むら、閾値むら、シール際のギャップむらの無い液
晶表示素子を作成することができる。
As described above, according to the present invention, a warped resin substrate can be easily adsorbed on a surface plate,
It is possible to manufacture a liquid crystal display element without uneven brightness, uneven threshold, and uneven gap at the time of sealing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施の形態におけるスピンナー
型のレジスト塗布装置の断面図
FIG. 1 is a sectional view of a spinner type resist coating apparatus according to a first embodiment of the present invention.

【図2】本発明の第1の実施の形態におけるスピンナー
型のレジスト塗布装置の定盤の平面図
FIG. 2 is a plan view of a surface plate of a spinner type resist coating apparatus according to the first embodiment of the present invention.

【図3】本発明の第2の実施の形態における配向膜印刷
装置の定盤の平面図
FIG. 3 is a plan view of a surface plate of an alignment film printing apparatus according to a second embodiment of the present invention.

【図4】従来の定盤上に置いた樹脂基板の状態を示す断
面図
FIG. 4 is a sectional view showing a state of a resin substrate placed on a conventional surface plate.

【図5】従来の定盤上で吸着を行った樹脂基板の状態を
示す断面図
FIG. 5 is a cross-sectional view showing a state of a resin substrate that has been adsorbed on a conventional surface plate.

【符号の説明】[Explanation of symbols]

1 エアーブロー装置 2A,2B 定盤 3 樹脂基板 4 部分吸着口 5 真空ポンプ 6 切り替えバルブ R1〜R7 領域 12 吸着口 1 Air blow device 2A, 2B surface plate 3 resin substrate 4 Partial suction port 5 vacuum pump 6 switching valve R1-R7 area 12 Adsorption port

───────────────────────────────────────────────────── フロントページの続き (72)発明者 山本 純也 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 2H088 FA17 FA18 FA29 FA30 HA01 JA13 MA04 2H090 JB03 JC02 JC12 JC14 KA08 3C016 DA02 DA12 DA15 5F031 CA05 HA14 MA26 PA14    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Junya Yamamoto             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 2H088 FA17 FA18 FA29 FA30 HA01                       JA13 MA04                 2H090 JB03 JC02 JC12 JC14 KA08                 3C016 DA02 DA12 DA15                 5F031 CA05 HA14 MA26 PA14

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 液晶表示素子の樹脂基板を定盤に吸着さ
せて各種の処理を行う液晶表示素子基板の吸着方法にお
いて、 複数に分割された領域に夫々吸着口を有する平坦な定盤
上に樹脂基板を配置し、前記吸着口を通して吸着力を作
用させて樹脂基板を吸引し、 前記複数の領域に分割された一領域に前記定盤上方から
加圧を行うと共に、加圧された領域の吸着口から吸引し
て樹脂基板を吸着固定し、 次いで隣接する分割された吸着口の一領域を前記定盤上
方から加圧すると共に、その一領域にその前記樹脂基板
の下方から吸引を行い、前記隣接する分割された吸着口
の一領域の樹脂基板を吸着固定させ、 これを分割された領域全てで繰り返し、前記樹脂基板を
全面吸着させることを特徴とする液晶表示素子基板の吸
着方法。
1. A method for adsorbing a liquid crystal display element substrate, wherein a resin substrate of a liquid crystal display element is adsorbed on a surface plate to perform various kinds of processing, wherein a flat surface plate having adsorption ports in each of a plurality of divided regions is provided. A resin substrate is arranged, suction force is applied to the resin substrate through the suction port to suck the resin substrate, and pressure is applied to one region divided into the plurality of regions from above the surface plate. The resin substrate is sucked and fixed by suction from the suction port, and then one area of the adjacent divided suction ports is pressed from above the surface plate, and suction is made to the one area from below the resin substrate, A method for adsorbing a liquid crystal display element substrate, which comprises adsorbing and fixing a resin substrate in one area of an adjoining divided adsorption port, and repeating this in all the divided areas to adsorb the entire surface of the resin substrate.
【請求項2】 前記定盤は、分割された領域ごとに吸着
口の密度に差を設けて前記樹脂基板に吸着力を作用させ
ることを特徴とする請求項1記載の液晶表示素子基板の
吸着方法。
2. The suction of a liquid crystal display element substrate according to claim 1, wherein the platen has a different suction port density for each divided area to exert a suction force on the resin substrate. Method.
【請求項3】 前記定盤は、樹脂基板が搭載される周辺
部の吸着口の密度を大きく、その中央部の吸着口の密度
を小さくするようにしたことを特徴とする請求項1記載
の液晶表示素子基板の吸着方法。
3. The surface plate according to claim 1, wherein a density of a suction port in a peripheral portion on which a resin substrate is mounted is high and a density of a suction port in a central portion thereof is low. Liquid crystal display device substrate adsorption method.
【請求項4】 前記定盤の吸着口は定盤の一辺に対応す
る領域の吸着口の密度を高く、他の吸着口の密度を低く
するようにしたことを特徴とする請求項2記載の液晶表
示素子基板の吸着方法。
4. The suction port of the platen has a high density of suction ports in a region corresponding to one side of the platen, and a low density of other suction ports. Liquid crystal display device substrate adsorption method.
【請求項5】 複数に分割された各領域に夫々吸着口を
複数個有する平坦な吸着面を有する定盤と、 前記定盤の吸着面に載置された樹脂基板の上方からエア
ブローを与え、前記樹脂基板を前記定盤側に押圧するエ
アブロー装置と、 前記樹脂基板が前記エアブロー装置に押圧されたとき、
前記吸着口のガスを排気する排気装置と、 前記定盤の各領域に夫々吸着口と前記排気装置とを連結
し、夫々の領域を独立して切り替えるバルブと、を有す
ることを特徴とする液晶表示素子基板の吸着装置。
5. A surface plate having a flat suction surface having a plurality of suction ports in each of a plurality of divided areas; and air blow from above the resin substrate placed on the suction surface of the surface plate. An air blow device for pressing the resin substrate toward the surface plate side, and when the resin substrate is pressed by the air blow device,
A liquid crystal comprising: an exhaust device that exhausts the gas in the adsorption port; and a valve that connects the adsorption port and the exhaust device to each region of the surface plate, and that switches each region independently. Adsorption device for display element substrate.
【請求項6】 前記定盤は、分割された領域ごとに吸着
口の密度に差を設けて前記樹脂基板に吸着力を作用させ
ることを特徴とする請求項5記載の液晶表示素子基板の
吸着装置。
6. The suction of a liquid crystal display element substrate according to claim 5, wherein the platen has a difference in the density of the suction port for each of the divided regions to apply a suction force to the resin substrate. apparatus.
【請求項7】 前記定盤は、樹脂基板が搭載される周辺
部の吸着口の密度を大きく、その中央部の吸着口の密度
を小さくするようにしたことを特徴とする請求項5記載
の液晶表示素子基板の吸着装置。
7. The surface plate according to claim 5, wherein a density of a suction port in a peripheral portion on which a resin substrate is mounted is high and a density of a suction port in a central portion thereof is low. Liquid crystal display device substrate suction device.
【請求項8】 前記定盤の吸着口は定盤の一辺に対応す
る領域の吸着口の密度を高く、他の吸着口の密度を低く
するようにしたことを特徴とする請求項6記載の液晶表
示素子基板の吸着装置。
8. The suction port of the platen has a high density of suction ports in a region corresponding to one side of the platen, and a low density of other suction ports. Liquid crystal display device substrate suction device.
JP2001231647A 2001-07-31 2001-07-31 Method and device for sucking substrate for liquid crystal display element Pending JP2003043458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001231647A JP2003043458A (en) 2001-07-31 2001-07-31 Method and device for sucking substrate for liquid crystal display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001231647A JP2003043458A (en) 2001-07-31 2001-07-31 Method and device for sucking substrate for liquid crystal display element

Publications (1)

Publication Number Publication Date
JP2003043458A true JP2003043458A (en) 2003-02-13

Family

ID=19063671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001231647A Pending JP2003043458A (en) 2001-07-31 2001-07-31 Method and device for sucking substrate for liquid crystal display element

Country Status (1)

Country Link
JP (1) JP2003043458A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100654808B1 (en) 2005-07-01 2006-12-08 삼성전자주식회사 Panel supporting apparatus
JP2010129706A (en) * 2008-11-27 2010-06-10 Hioki Ee Corp Suction apparatus and inspection apparatus
JP2010142891A (en) * 2008-12-17 2010-07-01 Linkstar Japan Co Ltd Substrate table and laser processing apparatus using the same
JP2010267746A (en) * 2009-05-13 2010-11-25 Nikon Corp Semiconductor processing apparatus
KR101561329B1 (en) * 2011-08-05 2015-10-19 주식회사 엘지화학 Attaching Device
KR101785736B1 (en) 2011-12-27 2017-10-17 하이디스 테크놀로지 주식회사 RUBBING STAGE for RUBBING APPARATUS
KR101790226B1 (en) * 2015-07-01 2017-10-27 주식회사 제이스텍 The flexible substrate transport stage for displays
KR101921854B1 (en) 2018-01-05 2018-11-23 마상희 Vacuum chuck and vacuum chuck apparatus
CN111919167A (en) * 2018-05-17 2020-11-10 株式会社Lg化学 Method for manufacturing optical device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100654808B1 (en) 2005-07-01 2006-12-08 삼성전자주식회사 Panel supporting apparatus
JP2010129706A (en) * 2008-11-27 2010-06-10 Hioki Ee Corp Suction apparatus and inspection apparatus
JP2010142891A (en) * 2008-12-17 2010-07-01 Linkstar Japan Co Ltd Substrate table and laser processing apparatus using the same
JP2010267746A (en) * 2009-05-13 2010-11-25 Nikon Corp Semiconductor processing apparatus
KR101561329B1 (en) * 2011-08-05 2015-10-19 주식회사 엘지화학 Attaching Device
KR101785736B1 (en) 2011-12-27 2017-10-17 하이디스 테크놀로지 주식회사 RUBBING STAGE for RUBBING APPARATUS
KR101790226B1 (en) * 2015-07-01 2017-10-27 주식회사 제이스텍 The flexible substrate transport stage for displays
KR101921854B1 (en) 2018-01-05 2018-11-23 마상희 Vacuum chuck and vacuum chuck apparatus
CN111919167A (en) * 2018-05-17 2020-11-10 株式会社Lg化学 Method for manufacturing optical device

Similar Documents

Publication Publication Date Title
JP3059360B2 (en) Liquid crystal panel manufacturing method and manufacturing press device
US7276445B2 (en) Method for forming pattern using printing method
US8720337B2 (en) Printing device system and patterning method using the same
KR20040062016A (en) Method for fabricating an alignment film of a liquid crystal display device
KR101308441B1 (en) Appartus For Fabricating Thin Film Pattern And Method For Fabricating Using The Same
JP2005141235A (en) Apparatus for forming orientation film and method for forming the same
JP2003043458A (en) Method and device for sucking substrate for liquid crystal display element
US7528927B2 (en) Fabrication method of liquid crystal display panel and seal pattern forming device using the same
US6836311B2 (en) Seal pattern for liquid crystal display device including first, second and third dummy seal patterns in non-active area
US20080011170A1 (en) Printing device, patterning method using the same, and method of fabricating a liquid crystal display device using the same
JP2003045946A (en) Method of absorbing liquid crystal device substrate and apparatus for absorbing liquid crystal device substrate
US20020030783A1 (en) Liquid crystal display and method for fabricating the same
KR101658152B1 (en) Apparatus and method of fabricating flat display device
JP2011258851A (en) Light-emitting element substrate and method of manufacturing the same
KR20070067995A (en) Apparatus for fabricating flat panel display device and method for fabricating thereof
KR101622639B1 (en) Apparatus and method of fabricating flat display device
JP3245550B2 (en) Manufacturing method of liquid crystal display element
JP3306409B2 (en) Liquid crystal display device manufacturing equipment
JP3218205B2 (en) Manufacturing method of liquid crystal display element
JP4471593B2 (en) Organic film substrate pasting method
JP2004246092A (en) Liquid crystal cell and method for manufacturing the same
KR20010025773A (en) Method of forming a seal pattern for liquid crystal display device
US7441502B2 (en) Printing apparatus and method for forming patterns for liquid crystal display device using the same
JP3306408B2 (en) Liquid crystal display device manufacturing equipment
KR100650341B1 (en) a press apparatus