JP2003042990A - Sensor element and circuit board and sensor device equipped therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an automatically-mountable humidity sensor element. SOLUTION: A base plate 21, two comb-shaped patterns 22a, 22b formed on the base plate 21, and a polymer film on the comb-shaped patterns 22a, 22b are formed. This humidity sensor element 20 does not have a lead wire or a pin, and connection to a circuit on this circuit board is made through two connection parts 23. Since the humidity sensor element 20 does not have pins, a lead wire or the like drawn out from the base plate 21 to the outside, the element can be supplied to a surface mounting device ad a taping, and can be subjected to a reflow soldering process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor element, a circuit board, and a sensor device including the same. More specifically, the present invention relates to a sensor element that can be automatically mounted on a circuit board and a sensor element for mounting the sensor element. The present invention relates to a circuit board and a sensor device including the sensor element and the circuit board.

[0002]

2. Description of the Related Art In recent years, various elements have been automatically mounted on a circuit board by using a device such as a mounter. Due to the progress of this automatic mounting technology, the cost of the circuit board can be reduced. It is possible to provide in. Among such automatic mounting devices, a technique called surface mounting has a great advantage that it has high productivity and can use a reflow soldering process that can mount electronic components at low cost. In such a surface mounting technique, an element without lead wires or pins housed in so-called "taping" as shown in FIG. 7 is usually used. The reflow soldering process is realized by performing surface mounting using such taping.

[0003]

However, some elements such as the humidity sensor element cannot be accommodated in the above-mentioned taping for surface mounting. For example, in the humidity sensor element shown in FIG. 8, two comb patterns 12a and 12b are formed on the base plate 11, and a transparent polymer film is formed on the comb patterns 12a and 12b.
The humidity detecting unit 12 is configured by the interdigitated portions of the comb-shaped patterns 12a and 12b. Further, two pins 13 for taking out an electrical signal are provided from these comb-shaped patterns 12a and 12b. Due to the presence of the pin 13, the humidity sensor element cannot be housed in the above-described taping for surface mounting, and thus cannot be surface mounted.

Conventionally, an element having a connecting portion such as a pin 13 or a lead wire to a circuit board is manually mounted, not automatically mounted. However, such a manual mounting has a fundamental problem that the workability is significantly lower than that of the surface mounting.

Further, since such a humidity sensor element or the like requires contact with air, when mounted on a circuit board,
As shown in FIG. 9, it is attached so as to project from the circuit board 13. Therefore, there is a problem in that an extra space is required only for the humidity sensor element and a compact device cannot be constructed.

An object of the present invention is to provide a humidity sensor element that can be manufactured by surface mounting and reflow soldering processes. Another object of the present invention is to provide a circuit board that can constitute a compact device even if a sensor element that requires contact with air is mounted, and a further object of the present invention is to provide these. It is to provide a sensor device using the humidity sensor element and the circuit board.

[0007]

The sensor device of the present invention comprises:
A sensor device having a sensor element having a detection unit mounted on a circuit board, wherein a vent hole is provided at a position of the circuit board corresponding to the detection unit.

In this sensor device, since the vent hole is arranged at the position of the circuit board corresponding to the detecting portion of the sensor element, the flow of air in the vicinity of the detecting portion of the sensor element is not obstructed, and the sensor is also provided. Since the element is not attached so as to project from the circuit board, the device has a compact configuration. Further, since the humidity sensor element does not have a connecting portion such as a pin or a lead wire, it can be housed in taping to manufacture the sensor device by the surface mounting device and the reflow soldering process.

Further, the circuit board of the present invention is a circuit board for mounting a sensor element having a detection part, and a vent hole is provided at a position corresponding to the detection part of the sensor element. And a circuit board.

If this circuit board is used, it becomes possible to arrange a ventilation hole in the vicinity of the sensor element, the flow of air in the vicinity of the detection portion is not hindered, and the sensor element does not project from the circuit board. Can be attached.

Further, the humidity sensor element of the present invention has a base plate, a humidity detecting portion formed on the base plate, and a connecting portion for electrically connecting the humidity detecting portion to a circuit on a circuit board. The humidity sensor element is characterized in that the connecting portion is formed on the base plate.

This humidity sensor element does not have a connecting portion such as a pin or a lead wire drawn out from the base plate to the outside. A connecting portion for electrically connecting the humidity detecting portion to a circuit on the circuit board is formed on the base plate. Therefore, the humidity sensor element of the present invention can be supplied to the surface mounting device by using taping, and a reflow soldering process can be adopted.

Further, the humidity sensor element of the present invention has a base plate, a humidity detecting portion formed on the base plate, and a connecting portion for electrically connecting the humidity detecting portion to a circuit on a circuit board. The humidity sensor element is characterized in that the connecting portion is formed on the front surface of the base plate and the side surface of the base plate or the side surface of the recess, and further, if necessary, on the back surface of the base plate.

With this configuration, the sensor element can be mounted on the circuit board without directing the humidity detecting section toward the circuit board side, and the air flow in the vicinity of the detecting section is prevented by the mounting on the circuit board. There is no. Also,
Since it is not necessary to provide a connecting portion such as a pin or a lead wire, it is possible to supply the surface mounting device using taping, and it is possible to adopt a reflow soldering process.

The humidity sensor device of the present invention comprises the humidity sensor element described above and the circuit board for mounting the humidity sensor element, the circuit board being provided in the vicinity of the ventilation port. Has another connecting portion that is electrically connected to the humidity sensor element to fix the humidity sensor element, and by fixing the humidity sensor to the other connecting portion, the humidity detecting portion of the humidity sensor element is It is characterized in that it is arranged at a position corresponding to the vent hole.

In this humidity sensor device, since the vent hole is arranged at the position of the circuit board corresponding to the humidity detecting portion of the humidity sensor element, the circulation of air near the detecting portion of the humidity sensor element is secured. Therefore, accurate humidity measurement can be performed. Moreover, since the humidity sensor element does not protrude from the circuit board, a compact humidity sensor device can be configured.

Further, the humidity sensor device of the present invention comprises the humidity sensor element described above and a circuit board for mounting the humidity sensor element, wherein the humidity sensor element is a surface of the base plate and a side surface of the base plate. , Further via the connection portion formed on the back surface, if necessary,
It is characterized in that it is electrically connected to a circuit on the circuit board.

With this configuration, in this humidity sensor device, since the sensor element is mounted on the circuit board without directing the humidity detecting section toward the circuit board side, air circulation in the vicinity of the detecting section is mounted on the circuit board. Not be hindered by. Moreover, since it is not necessary to use a humidity sensor element having a connecting portion such as a pin or a lead wire, automation by a surface mounting device using taping becomes possible.

Further, the taping according to the present invention is characterized in that any one of the above humidity sensor elements is housed. As a result, it becomes possible to mount the humidity sensor element on the surface as in the case of a normal electronic component, and it is possible to adopt a reflow soldering process.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a planar configuration of a humidity sensor element according to an embodiment of the present invention. The humidity sensor element 20 includes a base plate 21, and two comb-shaped patterns 22a and 22b are formed on the base plate 21 by screen printing or the like. Comb pattern 2
2a and 22b are made of a screen-printable conductor such as gold, ruthenium oxide, or carbon. Comb pattern 22
A glass film 28 is formed on the root portions of a and 22b. Further, a transparent polymer film (not shown) is formed on the comb patterns 22a and 22b. The humidity detecting unit 22 is formed by the interdigitated portions of the comb-shaped portions 22a and 22b and the polymer film formed thereon. Connection parts 23 made of a conductive metal are connected to the comb patterns 22a and 22b, respectively. The humidity sensor element 20 does not have lead wires or pins for electrically connecting the element 20 to a circuit on the circuit board, and the connection to the circuit on the circuit board is made by using this lead wire as will be described later. This is done via two connections 23.

FIG. 2 is a plan view showing a case where the humidity sensor element 20 of FIG. 1 is attached to the circuit board 25 according to the embodiment of the present invention. The circuit board 25 has a circuit for processing an output signal from the humidity sensor element 20, and has a rectangular vent hole 26 inside the circuit board 25. The ventilation hole 26 is provided in the humidity detecting portion 22 when the humidity sensor element 20 of FIG. 1 is attached to the circuit board 25.
It is provided to allow air to flow through. In Figure 2,
The circuit on the circuit board 25 is formed on the back side of FIG. 2, and the humidity sensor element 20 attached to the circuit board 25 is also shown in addition to the circuit board 25. Therefore, in the same drawing, the humidity detecting unit 2 of the humidity sensor element 20 from the vent hole 26
2 is visible.

FIG. 3 shows a cross section taken along the line PP of FIG. In FIG. 3, the back surface of FIG. 2 is shown on the upper side. As shown in FIG. 3, the humidity sensor element 20 includes two connecting portions 23 (FIG. 1) and two other connecting portions (not shown) provided at positions on the circuit board 25 corresponding to the connecting portions 23. Are connected by the soldering portion 27. Therefore, in the present embodiment, the humidity detecting portion 22 of the humidity sensor element 20 is connected to the circuit board 2 via the two soldering portions 27.
5 will be electrically connected. By mounting the humidity sensor element 20 on the circuit board 25 in this manner, the humidity sensor device according to the embodiment of the present invention in which the humidity detecting portion 22 is arranged at the position of the vent hole 26 is obtained.

The humidity sensor element 20 of FIG. 1 does not have pins, lead wires, etc. drawn out from the base plate 21 to the outside. Since the connecting portion 23 for electrically connecting the humidity detecting portion 22 to the circuit on the circuit board 25 is formed on the base plate 21, the humidity sensor element 20 of the present invention is used as a taping in a surface mounting device. It is possible to supply.

Further, when the circuit board 25 of FIG. 2 is used, since the ventilation holes 26 are arranged in the circuit board 25, the circulation of the air in the vicinity of the humidity detecting portion 22 is not obstructed, and the circuit board 25 is used. The humidity sensor element 20 can be attached without protruding from. Therefore, a compact humidity sensor device can be configured.

FIG. 4 shows a planar structure of a sensor element according to another embodiment of the present invention. The humidity sensor element 30 of the present embodiment includes a base plate 31, and on the base plate 31, two comb-shaped patterns 32a and 32b made of screen printable gold, ruthenium oxide, carbon and the like similar to the above are formed. . Comb pattern 32
A transparent polymer film (not shown) is formed on a and 32b. These comb-shaped patterns 32a, 32b
The humidity detecting unit 32 is configured by the portions in which the comb-shaped portions of the above are interdigitated with each other and the polymer film formed thereon. Connection parts 33 made of a conductive metal are connected to the comb patterns 32a and 32b, respectively. Glass films 36, 36 are formed on the roots of the comb-shaped patterns 32a, 32b. In this embodiment,
The base plate 31 is provided with a semicircular recess 33a,
The above-mentioned connecting portion 33 is also formed on the side surface of this recess 33a.

The humidity sensor element 30 of this embodiment is attached to the circuit board 35 as shown in FIG. That is,
The circuit board 35 of FIG. 5 is provided with connecting portions (not shown) at positions corresponding to the two connecting portions 33 of the humidity sensor element 30, and the connecting portion 33 of the humidity sensor element 30 is soldered to this connecting portion. It is fixed by the attachment part 37. As a result, the humidity detector 32 is electrically connected to the circuit on the circuit board 35.

FIG. 6 is a sectional view taken along the line QQ of FIG. With the configuration of the present embodiment in which the connecting portion 33 is formed on the surface of the base plate 31 and the side surface of the concave portion 33a, the soldering portion 37 includes the humidity sensor element 30 as shown in FIG.
The electrical connection between the connection portion 33 and the connection portion of the circuit board 35 can be reliably performed. Further, since the humidity sensor element 30 can be mounted on the circuit board 35 without directing the humidity detecting section 32 toward the circuit board 35 side, the air flow in the vicinity of the humidity detecting section 32 is prevented by the mounting on the circuit board 35. It will not be done.

In this embodiment, the base plate 31
The case where the recess 33a is provided in the base plate 31 has been described, but the base plate 31 is not provided with the recess 33a.
You may form the direct connection part 33 in the side surface of 1.

FIG. 10A shows a planar structure of the surface of a sensor element according to still another embodiment of the present invention, and FIG.
Shows the plan configuration of the back surface. As shown in FIG. 10A, the humidity sensor element 50 of the present embodiment includes a base plate 51, and two comb-shaped patterns 52a made of the same material as the humidity sensor element 20 of FIG. 1 are provided on the base plate 51. , 52b are formed by screen printing or the like. A transparent polymer film (not shown) is formed on the comb patterns 52a and 52b. The humidity detecting unit 52 is configured by the interdigitated portions of the comb-shaped patterns 52a and 52b and the polymer film formed thereon. Comb pattern 5
A connecting portion 53 made of a conductive metal is connected to each of 2a and 52b. Each comb-shaped pattern 52a, 52
A glass film 56 is formed on the base of b. Also in this embodiment, a semicircular recess 53a is provided in the base plate 51, and the above-mentioned connecting portion 53 is also formed on the side surface of this recess 53a. In this embodiment, as shown in FIG. 10B, the connection portion 53 is also formed on the back surface of the base plate 31.

The humidity sensor element 30 of this embodiment can be attached to the circuit board in the same manner as in FIG. That is,
The humidity sensor element 50 of the present embodiment is connected to the connection portion on the circuit board.
By fixing the connecting portion 53 of No. 2 by soldering, the humidity detecting unit 52 is electrically connected to the circuit on the circuit board. Further, in the present embodiment, since the connection portion 53 is also provided on the back surface of the base plate 51, the humidity sensor element 50 can be reliably fixed on the circuit board by soldering. Further, since the humidity sensor element 50 can be mounted on the circuit board without directing the humidity detecting section 52 toward the circuit board side, the air flow in the vicinity of the humidity detecting section 52 may be hindered by the mounting on the circuit board. Absent.

In the present embodiment as well, it is not always necessary to provide the recess 53a in the base plate 51, and the connecting portion 53 may be formed directly on the side surface of the base plate 31. Further, in the above-described embodiment of FIG. 4, the connection portion 33 is not provided on the back surface of the base plate 31, but FIG.
The connection portion 33 may be provided on the back surface of the base plate 31 as in the above embodiment.

FIG. 7 is a perspective view of a taping accommodating the humidity sensor element 20 of FIG. 1 according to an embodiment of the present invention. In this taping, the humidity sensor element 20 is housed in a large number of recesses 41 formed by blow molding a resin film, and a back sheet 42 of paper, resin film or the like is attached from the back side. Since the humidity sensor element 20 does not have a connecting portion such as a pin or a lead wire,
It can be stored as taping. By housing in the taping, the humidity sensor element 20 can be mounted on the circuit board 25 using a surface mounting device.

Although the humidity sensor element 20 is stored as taping in FIG. 7, it goes without saying that the humidity sensor element 30 in FIG. 4 can also be stored as taping as in FIG. 7. In addition, depending on the thickness of the humidity sensor element 20, it is possible to produce the taping by simply sandwiching it between sheet-shaped resin films or the like without providing the recess 41.

In each of the above embodiments, the sensor device having the humidity sensor element has been described, but the present invention is not limited to this. For example, a sensor element such as a thermometer that requires air flow. If so, it can be applied.

[0035]

In the sensor device of the present invention, since the vent hole is arranged at the position of the circuit board corresponding to the detection portion of the sensor element, the air flow in the vicinity of the detection portion of the sensor element is not obstructed. Moreover, the sensor element does not protrude from the circuit board. Therefore, a compact sensor device is provided.

Further, in the circuit board of the present invention, since the vent holes are arranged in the circuit board, the sensor element can be provided without obstructing the flow of air in the vicinity of the detecting portion and without protruding from the circuit board. Can be installed.

Further, the humidity sensor element of the present invention does not have a connecting portion such as a pin or a lead wire drawn out from the base plate to the outside. Therefore, the humidity sensor element of the present invention can be supplied to the surface mounting device by using taping, and a reflow soldering process can be adopted.

[Brief description of drawings]

FIG. 1 is a plan view of a humidity sensor element according to an embodiment of the present invention.

FIG. 2 is a plan view showing a case where a humidity sensor element is attached to the circuit board according to the embodiment of the present invention.

3 is a cross-sectional view taken along the line PP of FIG.

FIG. 4 is a plan view of a sensor element according to another embodiment of the present invention.

5 is a plan view showing a humidity sensor element attached to a circuit board 35. FIG.

6 is a cross-sectional view taken along the line QQ of FIG.

7 is a perspective view of a taping accommodating the humidity sensor element of FIG. 1. FIG.

FIG. 8 is a plan view of a conventional humidity sensor element.

FIG. 9 is a perspective view showing a state in which a conventional humidity sensor element is mounted on a circuit board.

FIG. 10A is a plan view showing a front surface of a sensor element according to still another embodiment of the present invention, and FIG. 10B is a plan view showing a back surface.

[Explanation of symbols]

20, 30, 50 Humidity sensor element 21, 31, 51 Base plate 22, 32, 52 Humidity detector 22a, 22b comb-shaped pattern 32a, 32b comb pattern 52a, 52b comb pattern 23, 33, 53 Connection 25,35 circuit board 26 Vent 27,37 Soldering part 33a recess 41 recess 42 Back sheet

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toyohiro Usui             2-7 Muroya, Nishi-ku, Kobe-shi, Hyogo             Inside Kobe Techno Center Co., Ltd. F term (reference) 2F076 BD01 BD13                 2G046 AA09 BA01 BB02 BC03 BC04                       BC08 BF02 BF05 FA01 FE00                       FE35                 2G060 AA01 AB02 AE19 AG06 AG10                       JA01                 5E338 AA01 BB02 BB13 BB75 CC01                       EE01 EE32 EE60

Claims (11)

[Claims] 1. A sensor device in which a sensor element having a detection section is mounted on a circuit board, wherein a vent hole is provided at a position of the circuit board corresponding to the detection section. Characteristic sensor device. 2. A circuit board for mounting a sensor element having a detection part, wherein a vent hole is provided at a position corresponding to the detection part of the sensor element. 3. A humidity sensor element having a base plate, a humidity detecting portion formed on the base plate, and a connecting portion for electrically connecting the humidity detecting portion to a circuit on a circuit board, the humidity sensor element comprising: The humidity sensor element, wherein the connecting portion is formed on the base plate. 4. A humidity sensor element having a base plate, a humidity detecting portion formed on the base plate, and a connecting portion for electrically connecting the humidity detecting portion to a circuit on a circuit board, the humidity sensor element comprising: The humidity sensor element, wherein the connecting portion is formed on a surface of the base plate and a side surface of the base plate. 5. A humidity sensor element having a base plate, a humidity detecting portion formed on the base plate, and a connecting portion for electrically connecting the humidity detecting portion to a circuit on a circuit board, the humidity sensor element comprising: A humidity sensor element, wherein a recess is provided in the base plate, and the connecting portion is formed on a surface of the base plate and a side surface of the recess. 6. The humidity sensor element according to claim 4, wherein the connection portion is also formed on the back surface of the base plate. 7. The humidity sensor element according to claim 3, and the circuit board according to claim 2 for mounting the humidity sensor element, wherein the circuit board is provided in the vicinity of the ventilation port. The humidity sensor is fixed to the other connection portion by being electrically connected to the humidity sensor element, and the humidity sensor is fixed to the other connection portion, so that the humidity detection portion of the humidity sensor element is ventilated. A humidity sensor device, which is arranged at a position corresponding to a mouth. 8. The humidity sensor element according to claim 4, and a circuit board for mounting the humidity sensor element, wherein the humidity sensor element is formed on a surface of the base plate and a side surface of the base plate. A humidity sensor device, which is electrically connected to a circuit on the circuit board via a connection portion. 9. The humidity sensor element according to claim 5, and a circuit board for mounting the humidity sensor element, wherein the humidity sensor element is formed on a surface of the base plate and a side surface of a recess of the base plate. A humidity sensor device, wherein the humidity sensor device is electrically connected to a circuit on the circuit board via the connection portion. 10. The humidity sensor element according to claim 6, and a circuit board for mounting the humidity sensor element, wherein the humidity sensor element is formed on the front surface of the base plate and the back surface of the base plate. A humidity sensor device, which is electrically connected to a circuit on the circuit board via a connection portion. 11. A taping for automatic mounting, characterized in that the humidity sensor element according to claim 3 is housed therein.