JP2003037341A - Conductive contact element, film type connector and its connection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive contact element, a film type connector and its connection structure through which even a multi-electrode semiconductor package can be connected/disconnected correctly and easily while saving the space at the time of connection. SOLUTION: A thin film 5 is provided between the electrodes 2 and 4 of a circuit board 1, and a semiconductor package 3 and a plurality of resilient conductive contact elements 6 arranged in the XY direction are supported by the film 5 while penetrating it, wherein each conductive contact element 6 is a hardened silicon rubber composition comprising components (A), (B), (C) and (D). The components are; (A) organopolysiloxane having at least two aliphatic unsaturation group, (B) a conductive powder part produced by previously mixing powder selected from an inorganic filler and a spherical organic resin into silver powder, (C) spherical silicon elastomer particles having a mean particle size of 0.1-100 μm, and (D) a hardener of sufficient quantity for hardening the component (A).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is typified by conductive connection of electrical and electronic equipment, for example, mounting of a semiconductor package (for example, BGA, LGA, QFP, etc.) on a circuit board, conductive connection between circuit boards, and mobile phone. The present invention relates to a conductive contact element used for conductive connection between a liquid crystal module or an electro-acoustic component of a mobile terminal and a circuit board, conductive connection for a circuit board or a semiconductor package to be inspected, a film-type connector, and a connection structure thereof.

[0002]

2. Description of the Related Art Heretofore, when electrically and electronically connecting electrical and electronic devices, although not shown, soldering, electrical connection by a conversion substrate, electrical connection by a connector, electrical connection by a spring, or the like is used. For example, when mounting a surface mount type semiconductor package on a circuit board, it is connected directly by soldering, or a pin socket is soldered on the circuit board and the semiconductor package is soldered on this pin socket. . When inspecting a semiconductor package, a conversion board provided with a pin probe dedicated to the semiconductor package is produced, and the inspection board and the semiconductor package are electrically connected by this conversion board to inspect the semiconductor package.

Further, in the case of conductive connection between circuit boards, lead wires may be used for solder connection, or male and female mechanical connectors may be soldered to the circuit boards, and then male and female may be inserted and fixed. There is. Further, when the liquid crystal module and the electroacoustic component are conductively connected to the circuit board, they are conductively connected by a lead wire or by using a leaf spring or a coil spring.

[0004]

By the way, in recent years, the number of electrodes in semiconductor packages has been increasing with the increase in density. Therefore, about 2,000 to 3,000 electrodes are arranged on a circuit board or inspected at a low pitch. Must be conductively connected to the board.
When such a multi-electrode is connected to a circuit board by soldering, a solder bridge may occur between adjacent electrodes, and the insulation between the electrodes may not be ensured. Further, when the semiconductor package, the circuit board, or the like needs to be replaced, the solder connecting the electrodes must be removed each time, which complicates the work and, in addition, when removing the solder, the semiconductor package and Secondary defects such as breakage of fine patterns on a circuit board are also likely to occur. The defects due to these solders are the same not only when the semiconductor package is mounted on the circuit board but also when the circuit boards are electrically connected to each other or the electroacoustic components are electrically connected.

[0005] Further, in recent years, the electric and electronic devices have been made thinner, but it is very difficult to make them thinner with a mechanical connector, and the component cost and the manufacturing cost are increased.
Further, when the inspection board and the semiconductor package are electrically connected, there is a problem that it is difficult to accurately inspect the semiconductor package because the pin probe is affected by external noise and the like. Furthermore, in the case of conducting connection by using a leaf spring or a coil spring, fatigue may occur due to long-term connection and a connection failure may occur, or a conduction failure may occur due to abrasion of a mating electrode due to vibration or the like.

The present invention has been made in view of the above, and has a multi-electrode semiconductor package, a circuit board, an electric junction, for example.
It is an object of the present invention to provide a conductive contact element, a film-type connector, and a connection structure thereof, which can accurately and easily connect and disconnect even electroacoustic parts and the like, and can save space at the time of connection. .

[0007]

In order to achieve the above-mentioned object, the first and second electric contacts of the first and second electric junctions are opposed to each other. An electrically conducting material for an electrical joint, which is characterized by comprising a cured product of a silicone rubber composition comprising the following components (A), (B), (C) and (D). . (A) 100 parts by weight of an organopolysiloxane represented by the following general formula (I) and having at least two aliphatic unsaturated groups R ¹ _n SiO _{(4-n) / 2} (I) [Formula (I) R ¹ is the same or different and is an unsubstituted or substituted monovalent hydrocarbon group, and n is a positive number from 1.98 to 2.02] (B) An inorganic filler and a spherical organic resin are previously contained in the silver powder. 100 to 800 parts by weight (C) of conductive powder obtained by mixing 0.2 to 1.0% by weight of powder selected from the above, and 100 parts by weight of component (A) has an average particle diameter of 0.1. To 100 μm spherical silicone elastomer particles 2 to 100 parts by weight (D) Component (A)

According to the second aspect of the invention, in order to achieve the above object, an elastic conductive contact element is supported through a film, and the conductive contact element has the following components.
It is characterized by being a cured product of a silicone rubber composition comprising (A), (B), (C) and (D). (A) 100 parts by weight of an organopolysiloxane represented by the following general formula (I) and having at least two aliphatic unsaturated groups R ¹ _n SiO _{(4-n) / 2} (I) [Formula (I) R ¹ is the same or different and is an unsubstituted or substituted monovalent hydrocarbon group, and n is a positive number from 1.98 to 2.02] (B) An inorganic filler and a spherical organic resin are previously contained in the silver powder. 100 to 800 parts by weight (C) of conductive powder obtained by mixing 0.2 to 1.0% by weight of powder selected from the above, and 100 parts by weight of component (A) has an average particle diameter of 0.1. To 100 μm spherical silicone elastomer particles 2 to 100 parts by weight (D) Component (A)

The powder to be mixed with the silver powder is fine silica powder, and the average particle size of the fine silica powder is 0.005-5.
It is preferable that the surface area is 0 μm and the specific surface area is 50 m ² / g or more. In order to achieve the above object, in the invention of claim 4, the film-type connector according to claim 1 or 2 is interposed between the electrodes of the opposing first and second electrical joints. The connector is characterized in that the first and second electrical joints are electrically connected.

The inventor of the present invention has previously prepared a cured product of a silicone rubber composition for forming a conductive contact element into silver powder in advance.
By using a conductive powder in which a powder (fine powder silica having a specific surface area of 50 m ² / g or more) selected from 0.2 to 10% by weight of an inorganic filler and a spherical organic resin is mixed, It has been found that the excellent silver powder has a stable resistance value as compared with the case of using a simple silver powder. Further, the average particle diameter is 0.1 to 100 μm, preferably 0.5 to 40 with respect to 100 parts by weight of the component (A).
By mixing 2 to 100 parts by weight, preferably 5 to 80 parts by weight of spherical silicone elastomer particles of μm,
It has been found that even if the silver powder is highly filled to reduce the resistance, repeated compression and compression set can be maintained without deteriorating the rubber elasticity as silicone rubber.

That is, based on 100 parts by weight of the organopolysiloxane represented by the following general formula (I), 0.2 to 10% by weight of an inorganic filler and a spherical organic resin in silver powder are previously selected. 100 conductive powder prepared by mixing
˜800 parts by weight is added, and the average particle size is 0.1 to 1
2 to 10 parts of spherical silicone elastomer particles of 00 μm
By blending 0 parts by weight, aggregation of silver powder over time is small and the dispersibility when blended in a silicone rubber composition is excellent. Therefore, rubber properties such as repeated compression and compression set can be obtained with stable volume resistivity. It is possible to obtain a composition which does not deteriorate, and the obtained silicone rubber composition is a mixture of an organic peroxide and an organohydrogenpolysiloxane / platinum catalyst alone, or an organic peroxide and an organohydrogenpolysiloxane / platinum. Even when used in combination with a system catalyst alone, the composition becomes a stable, low electrical resistance (highly conductive) member that can withstand long-term compression and repeated compression. It has been found that it is most suitable for contact elements.

R ¹ _n SiO _{(4-n) / 2} (I) [In the formula (I), R ¹ is the same or different, unsubstituted or substituted monovalent hydrocarbon group, and n is 1.98-2. .02 is a positive number]

The organopolysiloxane which is the first essential component of the silicone composition is represented by the following general formula (I). R ¹ _n SiO _{(4-n) / 2} (I) [In the formula (I), R ¹ is the same or different, unsubstituted or substituted monovalent hydrocarbon group, and n is 1.98 to 2.02. Is a positive number]

In the formula, R is a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group or another alkyl group, a cyclohexyl group or another cycloalkyl group, a vinyl group, an allyl group, a propenyl group, a butynyl group, Alkenyl group such as hexenyl group, phenyl group, aryl group such as tolyl group, benzyl group, aralkyl group such as phenylethyl group, etc., or a part or all of hydrogen atoms bonded to carbon atoms of these groups are halogen atoms, An unsubstituted or substituted monovalent group having the same or different type selected from a chloromethyl group substituted with a cyano group or the like, a trifluoropropyl group, a cyanoethyl group or the like, preferably having 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms. It is a hydrocarbon group.

In this case, it is necessary that R has at least two aliphatic unsaturated groups (alkenyl groups), and the content of aliphatic unsaturated groups in R is 0.001 to 20.
It is preferably in the range of mol%, particularly 0.025 to 5 mol%. Further, n is a positive number of 1.98 to 2.02. formula
The organopolysiloxane (I) is basically preferably linear, but may be one kind or a mixture of two or more kinds having different molecular structures. Further, the organopolysiloxane preferably has an average degree of polymerization of 100 to 10,000.

The silver powder is not particularly limited, and for example, powder, dendritic, flakes and the like produced by an electrolytic method, a pulverizing method, a heat treatment method, an atomizing method, a chemical production method, or the like, or A mixture having these shapes may be used. The silver powder may be glass beads or a material obtained by plating phenol resin with silver. The particle size of the silver powder is not particularly limited, but is preferably 0.05 to 100 μm, and practically preferably 0.1 to 10 μm. Further, in order to form a conductive contact element made of low-resistance silicone rubber, it is preferable that silver powder is partially connected, not completely independent dispersion.

The apparatus for pulverizing the silver powder is not particularly limited, and examples thereof include known techniques such as a stamp mill, a ball mill, a vibration mill, a hammer mill, a rolling roller and a mortar. The conditions for rolling the silver powder composed of reduced silver, anodized silver, electrolytic silver, or a mixture of two or more thereof are not particularly limited, and are selected depending on the diameter and shape of the silver powder used. .
It is also possible to add a known conductive material such as a conductive inorganic material such as conductive carbon black, conductive zinc white, and conductive titanium oxide in combination with the silver powder.

Since silver powder easily produces oxides and sulfides and these are insulating substances, if a conductive contact element containing silver particles, which is easy to manufacture, is left in the air, it will be oxidized or sulfided to cause resistance. There is a risk of increasing the value. Further, the flake-shaped silver powder used for forming the conductive contact element is
The one obtained by the pulverization method is used. Generally, when crushing silver powder, it is treated with saturated or unsaturated higher fatty acid such as silver laurin, myristic acid, palmitic acid, stearic acid, oleic acid, metal soap, higher aliphatic amine, polyethylene wax and the like. There is a way.

The compounds used in these treatments may cause vulcanization inhibition when added to silicone rubber. Therefore, washing the compound used in the above treatment,
After removal, it is kneaded with a conductive elastomer to make a conductive contact element, and the mercapto-based compound is dissolved in a solvent or water at the contact portion of the conductive contact element, and by coating / coating this, oxidation and sulfurization of silver powder is prevented. It is possible to obtain a stable resistance value.

In the present invention, the silicone composition is blended with a conductive filler prepared by previously mixing one or more powders selected from an inorganic filler and a spherical organic resin in silver powder. In this case, as the inorganic filler, silica, alumina, titanium dioxide, mica, barium sulfate,
Examples include carbon black. Among these, silica, alumina and carbon black are preferable, and silica is most preferable. As the silica, fine powder silica is preferable, and examples thereof include fumed silica and precipitated silica. Further, those whose surfaces are hydrophobized with chlorosilane, hexamethyldisilazane, organopolysiloxane, alkoxyrisilane or the like are also suitably used. Examples of the spherical organic resin include polyolefins such as polyethylene, polyvinyl chloride, polypropylene and polystyrene, styrene, acrylonitrile copolymer, acrylic resins such as polymethylmethacrylate, amino resins, fluorine-containing resins and nitrile resins. , Especially polymethylmethanol is the most suitable.

The inorganic filler and the spherical organic resin are silver powders.
The purpose is to prevent aggregation, and the average particle size is 0.005 to 50μ.
m, preferably 0.01 to 30 μm. Also, the ratio table
Area (BET method) is 50m²/ G or more, particularly 100 to 30
0m²/ G is preferable. These have an average particle size
0.005 μm or less, 50 μm or more, specific surface area 50 m
²If it is less than / g, a sufficient aggregation effect can be obtained.
This is because there is a possibility that there will be no.

A powder selected from an inorganic filler and a spherical organic resin is used in an amount of 0.2 to 10% by weight, preferably 0.5 to 5% by weight, based on the silver powder by using a Turbula stirrer or the like.
Mixing for about 5 minutes to 5 hours is recommended. This is because when the amount of powder added is less than 0.2% by weight, the agglomeration effect decreases, and when it exceeds 10% by weight, the electrical resistance value increases. It should be noted that, instead of using a conductive powder prepared by previously mixing a powder with a silver powder, even if the silver powder and the powder are mixed with the organopolysiloxane when preparing the composition,
The effect of the present invention cannot be obtained.

The amount of silver powder blended is preferably 100 to 800 parts by weight with respect to parts by weight of organopolysiloxane. This is because if it is less than 100 parts by weight, sufficient conductivity cannot be obtained, and if it exceeds 800 parts by weight, molding processing and compoundability of the conductive contact element become difficult.

The spherical silicone elastomer particles have an average particle diameter of 0.1 to 100 μm, preferably 0.1.
Those having a thickness of 5 to 40 μm are used. This is because when the average particle diameter is less than 0.1 μm, it is difficult to produce particles and it is not possible to expect a sufficient addition effect. On the other hand, when the average particle diameter exceeds 100 μm, the properties (mechanical properties, electrical properties) of the rubber cured product that is the conductive contact element are impaired, and stable production cannot be achieved. By blending the spherical silicone elastomer particles, it is possible to prevent fluctuations in the conductivity of the molded product at the time of molding due to high filling of the conductive powder. Further, it is possible to improve the reduction in compression set of the silicone rubber due to high filling. If the spherical silicone elastomer particles are blended, for example, about 30 to 3
A compression set as high as 5% can be improved.

The spherical silicone elastomer particles can be freely used as long as they are cured products of organohydropolysiloxane having an average particle diameter, without any limitation in kind, grade and manufacturing method. Specifically, a method of curing a curable organohydropolysiloxane composition as spherical silicone elastomer particles in a spray dryer at 230 to 300 ° C. to obtain a granular silicone elastomer (JP-A-59-96122). ,
A curable organohydropolysiloxane composition, for example, an addition reaction type organopolysiloxane composition composed of a vinyl group-containing organohydropolysiloxane and an organohydrogenpolysiloxane, is used in water with a surfactant to obtain emulsion particles having a particle size of 20 μm. Emulsify as shown below, add platinum-based catalyst for addition reaction,
Those obtained by a method of curing the organopolysiloxane contained in the emulsion particles before or after spray drying (Japanese Patent Laid-Open No. 62-257939) can be used. In particular, it is preferable that the vinyl group-containing organohydropolysiloxane and the organohydrogenpolysiloxane are made into an emulsion by using a surfactant, subjected to an addition reaction with a platinum-based catalyst, and cured to produce the emulsion. As the elastomer particles, those whose surface is treated with silane, siloxane or the like in advance or during the production thereof can be used.

The spherical silicone elastomer particles are used in an amount of 2 to 100 parts by weight, particularly 5 to 100 parts by weight of the spherical silicone elastomer particles based on 100 parts by weight of the polymer of the general formula (I).
80 parts by weight is preferred. This is because when the amount of the spherical silicone elastomer particles is less than 2 parts by weight, it is impossible to obtain the effect of addition (in particular, the improvement of the elastic properties, the improvement of the permanent set, and the repetitive property), and conversely, the addition amount of the spherical silicone elastomer particles is 100 parts by weight. If the amount exceeds the limit, the properties (mechanical properties, electrical properties) of the rubber cured product that is the conductive contact element will be impaired, and stable manufacturing will not be possible.

By including a large amount of silver particles, the properties of the elastic elastomer (hardness, repetitive properties, permanent set of the elastic elastomer, etc.) are deteriorated, and repeated during pressure contact connection, long-term mounting connection, and inspection. At the time of press contact, a problem occurs in connection, resulting in problems such as lack of stability. However, by blending the spherical silicone elastomer particles, these problems can be solved. In particular,
The improved compression set can increase reliability and certainty in packaging and inspection applications.

As the curing agent, a known organohydrogenpolysiloxane / platinum-based catalyst (curing agent for addition reaction) or an organic peroxide catalyst can be used. Platinum-based catalysts include elemental platinum, platinum compounds,
Examples thereof include a platinum complex, chloroplatinic acid, an alcohol compound of chloroplatinic acid, an aldehyde compound, an ether compound, and a complex with various olefins. The amount of platinum-based catalyst added is based on the organopolysiloxane of the first component.
The platinum atom is preferably in the range of 1 to 2,000 ppm.

On the other hand, the organohydrogenpolysiloxane has at least 2 hydrogen atoms directly bonded to silicon atoms.
It is not particularly limited as long as it has one or more, and it may be linear, branched or cyclic, but R ¹ _a
H _b SiO _{(4-ab) / 2} (R ¹ is the same unsubstituted or substituted 1 as R 1
It is a valent hydrocarbon and preferably does not have an aliphatic unsaturated bond. a and b are 0 ≦ a <3, 0 <b <3, 0 <a
It is a number of + b <3. It is preferable that the degree of polymerization is 300 or less.

Specifically, a diorganopolysiloxane whose end is blocked with a dimethylhydrogensilyl group,
Dimethylsiloxane units and methyl hydrogen polysiloxane units, and terminal copolymers of trimethylsiloxane units _{(H (CH 2) 2 SiO} 0 .6 units) and a low viscosity fluid consisting of SiO ₂ units, 1,3,5 , 7-Tetrahydrogen-1,3,5,7-tetramethylcyclotetrasiloxane, 1-Propyl-3,5,7-trihydrogen-1,3,5,7-tetramethylcyclotetrasiloxane, 1 , 5-dihydrogen-3,7-dihexyl-1,3,5,7-tetramethylcyclotetrasiloxane and the like are exemplified.

The addition amount of the organohydrogenpolysiloxane is such that the hydrogen atom directly bonded to the silicon atom is 50 to 500 mol% with respect to the aliphatic unsaturation amount (alkenia group) of the organopolysiloxane as the first component. It is desirable to use. Examples of organic peroxide catalysts include benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, p-methylbenzoyl peroxide, 2,4-dicumyl peroxide, and 2,5-dimethyl-bis (2,2). 5-t-butylperoxy) hexane,
Examples thereof include di-t-butyl peroxide and t-butyl perbenzoate. The amount of organic peroxide catalyst added is
The optimum amount is 0.1 to 5 parts by weight based on 100 parts by weight of the first component organopolysiloxane.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of the present invention will be described below with reference to the drawings. A conductive contact element, a film type connector and a connection structure thereof in this embodiment are as shown in FIGS. 1 and 2. A thin and rectangular film 5 interposed between a plurality of electrodes 2 and 4 of the circuit board 1 which is the first and second electric junctions facing each other and the surface mounting type semiconductor package 3 made of LGA, A plurality of elastic conductive contact elements 6 are arranged in the XY direction on the film 5 and are supported through the conductive contact elements 6 in a cylindrical shape.
A cured product of a silicone rubber composition composed of (A), (B), (C), and (D). (A) 100 parts by weight of an organopolysiloxane represented by the following general formula (I) and having at least two aliphatic unsaturated groups R ¹ _n SiO _{(4-n) / 2} (I) [Formula (I) R ¹ is the same or different and is an unsubstituted or substituted monovalent hydrocarbon group, and n is a positive number from 1.98 to 2.02] (B) An inorganic filler and a spherical organic resin are previously contained in the silver powder. 100 to 800 parts by weight (C) of conductive powder obtained by mixing 0.2 to 1.0% by weight of powder selected from the above, and 100 parts by weight of component (A) has an average particle diameter of 0.1. To 100 μm spherical silicone elastomer particles 2 to 100 parts by weight (D) Component (A)

The film-type connector is a film 5 made of a known engineering plastic film (for example, PET or polyimide film is applicable, but polyimide is most suitable because it is heat-resistant and has little temperature deformation during molding).
And a plurality of conductive contact elements 6 inserted into the film 5
It has and. The film 5 has, for example, a thickness of 50 to 30.
It is formed into a square of 0 μm, preferably 50 to 200 μm, and a plurality of holes for supporting the conductive contact element are 1.0 in the XY directions.
Perforations are arranged in parallel in a matrix at a pitch of ˜1.27 mm, and positioning holes are selectively perforated at the four corners (2-4 holes) so as not to hinder the conductive connection. Each hole is 0.
Perforated to a diameter of 5 to 0.8 mm.

The conductive contact element 6 is manufactured by molding the above conductive silicone composition in a mold. The hardness of the conductive contact element 6 is 50 to 80 ° H, preferably 60 to 80, because the conductive contact element 6 is pressed to be connected.
° H is good. With the hardness in this range, it is possible to achieve a uniform connection even when the compression ratio is as small as 2 to 10% in the conductive connection. The shape of the conductive contact element 6 is not particularly limited, such as a cylindrical shape having the same diameter as the hole diameter, a conical shape having a symmetry plane of the film 5 and having a larger diameter than the hole diameter of the film 5, a hemispherical shape, or a barrel shape. The shape of the conductive contact element 6 is appropriately selected according to the electrode shape of the semiconductor package 3, the electrode shape of the circuit board 1 or the inspection board, the pressure contact force at the time of conductive connection, and the like.

When manufacturing a film type connector,
First, a plurality of holes are punched in the film 5 so as to correspond to the plurality of electrodes 4 of the semiconductor package 3, the film 5 is set in a mold, and the conductive silicone composition is formed on the film 5 to form the conductive contact element 6. Place enough, then
By pressurizing and heating with a die, a film type connector in which a flexible conductive contact element 6 is integrated in each hole of the film 5 can be obtained. When a film-type connector is used for conductive connection of electro-acoustic components used in a mobile phone, a plurality of films 5 are provided on the film 5 so as to correspond to a plurality of electrodes of the electro-acoustic components (microphone, speaker, etc. are two poles). The conductive contact element 6 is molded, punched into the shape of the electroacoustic component, and integrally molded with the elastic elastomer so as to cover the outer peripheral surface of the electroacoustic component.

In the case of the conductive connection of the liquid crystal module, the ITO electrode of the liquid crystal module and the circuit board 1 are conductively connected by the conductive contact element 6. At this time, the number of ITO electrodes of the liquid crystal module is formed in the film 5. (5 to 10 pieces in one or two rows) may be provided to form the positioning holes. Further, when the film substrate is connected to the ITO electrode of the liquid crystal module, the electrode of the film substrate and the circuit board 1
And the conductive contact element 6 are electrically connected to each other.
Is the same as the connection with the ITO electrode. In any of these conductive connections, the conductive contact element 6 is compressed and connected.

According to the above structure, the volume resistivity is low, the resistance value is stable, and the silver powder is used.
A large amount of current can be passed. Further, the variation in resistance value is small, a stable connection state can be obtained, and a minute current can be coped with very easily. In addition, since low compression connection is possible for mounting and inspecting the semiconductor package 3, the load applied to the circuit board 1, the semiconductor package 3, the inspection board, etc. is extremely small, which causes a secondary failure of the semiconductor package 3. Nor.

Further, since a reliable connection can be obtained and it is hardly affected by external noise, precise inspection can be greatly expected. Further, since it is not a mechanical connector, it can be made thin, and it is possible to reduce the component cost and the manufacturing cost. Further, since the conductive connection is not made by using the leaf spring or the coil spring, there is no possibility that the connection will occur due to fatigue due to long-term connection, or the conductive failure due to abrasion of the mating electrode due to vibration or the like. .

[0039]

EXAMPLES Examples of the film type connector and its connection structure according to the present invention will be described below together with comparative examples. Example 1 First, a methyl vinyl polysiloxane having an average degree of polymerization of about 8000 consisting of 99.85 mol% of dimethyl siloxane units and 0.15 mol% of methyl vinyl siloxane units was added,
Finely powdered hydrophobic silica on silver powder with an average particle size of 1.5 to 1.7 μm [trade name R-972 manufactured by Nippon Aerosil Co., Ltd.
0.5 wt% of specific surface area 130 m ² / g] was added, and silver powder and fine powder hydrophobic silica were stirred and mixed for 30 minutes using a turbula stirrer to obtain conductive powder. When the conductive powder is obtained in this way, 10 parts by weight of spherical silicone elastomer particles having a particle size of 3 to 10 μm [trade name KMP594 manufactured by Shin-Etsu Chemical Co., Ltd.] are mixed with the conductive powder, and dicumyl peroxide as a curing agent is added to 0 parts. 0.5 parts by weight was compounded.

Next, the prepared conductive material is placed at approximately the center of a plurality of holes in a film made of a polyimide film having a thickness of 125 μm, and press-heated and molded under the molding conditions of 170 ° C. for 10 minutes with upper and lower molds, A total of 2,000 conductive contact elements having a substantially columnar shape were produced to obtain a film type connector. A plurality of holes have a diameter of 0.8 mm and a pitch of 1.27.
2,000 holes were punched in mm. Each conductive contact element has a height of 1 mm and a diameter of 1.0 mm,
0.45 mm was projected from each of the front and back surfaces of the film.

When the film type connector is obtained in this way, the film type connector is sandwiched between a plurality of electrodes (2,000 pieces) of the circuit board and the semiconductor package made of LGA,
Compress 10% to make it electrically conductive, then open it again 10%
The operation of compressing was repeated 100 times. as a result,
No change was observed in the conduction resistance or the shape of the conductive contact element. Further, as shown in Table 1, the volume resistance value is low,
The compression set (according to JIS K 6262) was 42%. Further, when an electroacoustic component or a liquid crystal module connected by a conductive contact element was subjected to a vibration test and a shock test, each electrode did not change at all and was in the same connection state as the initial state.

Example 2 Basically the same as Example 1, but finely divided hydrophobic silica
[Nippon Aerosil Co., Ltd., trade name R-972, specific surface area 130 m ² / g] was added in an amount of 3.0 wt%, and 20 parts by weight of spherical silicone elastomer particles [Shin-Etsu Chemical Co., Ltd. trade name, KMP594] were blended. The above work 1
When it was repeated 00 times, no change was observed in the conduction resistance or the shape of the conductive contact element. Further, as shown in Table 1, the volume resistance value is low, and the compression set (JIS K
(According to 6262) was 40%.

Comparative Example 1 Basically the same as in Example 1, except that spherical silicone elastomer particles [trade name KMP5 manufactured by Shin-Etsu Chemical Co., Ltd.
94] was omitted. When the above work was repeated 100 times, the conduction resistance and the shape of the conductive contact element changed, and as shown in Table 1, the volume resistance was high and the compression set (according to JIS K 6262) was 62%. And did not get good results. Comparative Example 2 Basically the same as in Example 1, but finely divided hydrophobic silica
[Product name R-972 manufactured by Nippon Aerosil Co., Ltd., specific surface area 130 m ² / g] is omitted. When the above operation was repeated 100 times, as shown in Table 1, the volume resistance value was so high that good results could not be obtained.

[0044]

[Table 1]

[0045]

As described above, according to the present invention, it is possible to accurately and easily connect or disconnect even an electric joint, for example, a multi-electrode semiconductor package, a circuit board, an electroacoustic component, or the like. There is. In addition, it is possible to save space when connecting the electrical joint.

[Brief description of drawings]

FIG. 1 is an overall explanatory view showing an embodiment of a conductive contact element, a film type connector and a connection structure thereof according to the present invention.

FIG. 2 is an explanatory view showing an embodiment of a conductive contact element and a film type connector according to the present invention.

[Explanation of symbols]

1 circuit board (electrical connection) 2 electrodes 3 Semiconductor package (electrical junction) 4 electrodes 5 films 6 Conductive contact element

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G01R 31/26 G01R 31/26 J H01R 11/01 501 H01R 11/01 501A 501C 501G H05K 3/32 H05K 3 / 32 B F term (reference) 2G003 AA07 AB01 AG03 AG07 AG12 2G011 AA16 AB08 AC14 AE22 4J002 BB023 BB113 BC023 BD033 CP032 CP131 DA037 DA076 DA118 DD048 DE137 DE147 DE168 DG047 DJ017 DJ057 EK038 EK048 EK058 FD116 GQ02 5E319 AA03 AB02 AC01 BB20 GG01 5E344 AA04 CD01 CD12 CD31 DD08 EE21

Claims (4)

[Claims] 1. A conductive contact element interposed between electrodes of opposing first and second electrical joints for electrically conducting these first and second electrical joints, the component comprising: A conductive contact element comprising a cured product of a silicone rubber composition comprising A), (B), (C), and (D). (A) 100 parts by weight of an organopolysiloxane represented by the following general formula (I) and having at least two aliphatic unsaturated groups R ¹ _n SiO _{(4-n) / 2} (I) [Formula (I) R ¹ is the same or different and is an unsubstituted or substituted monovalent hydrocarbon group, and n is a positive number from 1.98 to 2.02] (B) An inorganic filler and a spherical organic resin are previously contained in the silver powder. 100 to 800 parts by weight (C) of conductive powder obtained by mixing 0.2 to 1.0% by weight of powder selected from the above, and 100 parts by weight of component (A) has an average particle diameter of 0.1. To 100 μm spherical silicone elastomer particles 2 to 100 parts by weight (D) Component (A) 2. A film-type connector in which an elastic conductive contact element is supported through a film, wherein the conductive contact element is composed of the following components (A), (B), (C) and (D): A film-type connector characterized by being a cured product of a silicone rubber composition. (A) 100 parts by weight of an organopolysiloxane represented by the following general formula (I) and having at least two aliphatic unsaturated groups R ¹ _n SiO _{(4-n) / 2} (I) [Formula (I) R ¹ is the same or different and is an unsubstituted or substituted monovalent hydrocarbon group, and n is a positive number from 1.98 to 2.02] (B) An inorganic filler and a spherical organic resin are previously contained in the silver powder. 100 to 800 parts by weight (C) of conductive powder obtained by mixing 0.2 to 1.0% by weight of powder selected from the above, and 100 parts by weight of component (A) has an average particle diameter of 0.1. To 100 μm spherical silicone elastomer particles 2 to 100 parts by weight (D) Component (A) 3. The powder mixed with the silver powder is fine powder silica, and the average particle diameter of the fine powder silica is 0.005 to 50 μm.
The film-type connector according to claim ² , wherein m and the specific surface area are 50 m ² / g or more. 4. The film-type connector according to claim 2 or 3 is interposed between opposing electrodes of the first and second electric joints, and the first and second electric joints are electrically connected by the film-type connector. A film-type connector connection structure, characterized in that it is electrically conducted.