JP2003031618A - Thermal pressure bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal pressure bonding device which enables (1) correct positioning of flexible electrode and (2) maintenance of parallelism between a thermal pressure connection head and receiving board. SOLUTION: This thermal pressure bonding device has the configuration that a main supporting surface 10 for attracting electrode body 19 of flexible electrode 2 and a sub-supporting surface 11 for attracting only a terminal portion 4 are provided. The sub-supporting surface 11 can be freely displaced between the horizontal position in the same surface level of the main supporting surface 10 and the drawing position isolated from the terminal 4. Each of the thermal pressure bonding tools of both terminals 3, 4 is respectively composed of a thermal pressure bonding head 5 which can be freely moved upward and downward and a pair of receiving boards 12. The thermal pressure bonding head 5 is coupled with a lifting mechanism 6 via two swinging axes 14, 15 and can freely be swung to the receiving board 12 in the two directions determined by the swinging axes 14, 15. Moreover, fixing means 28, 29 for holding to the lifting mechanism 6 the swinging attitude in the desired direction relative to the horizontal surface are provided on every swinging axis 14, 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding apparatus for electrically connecting a glass electrode and a flexible electrode found in a liquid crystal display panel or the like by thermocompression bonding.

[0002]

2. Description of the Related Art A glass electrode and a flexible electrode found in a liquid crystal display panel or the like are physically and electrically connected to each other by applying pressure and heat with a thermocompression bonding device in a state where both electrodes are stacked. Usually, each electrode has multiple terminals arranged in a plane,
(1) Perform thermocompression bonding so that the positions of the terminals are not displaced and (2) the crimping state (degree) of each terminal is uniform.
The above (1) is a problem of positioning both electrodes, and the above (2) is a thermocompression head and a pedestal for sandwiching both electrodes in a stacked state.
It is a problem of parallelism (combining the two and crimping tools).

For example, in Japanese Unexamined Patent Publication No. 09-097813, "Thermo-compression bonding apparatus", when a heater tool (here, only the thermo-compression bonding head) moves from a standby position to a compression bonding position, TCP is pressed to press the outer lead portion. A pressing member to be attached is provided. Previous thermocompression heads have the effects of pressure and heating,
The thermocompression bonding head and the pedestal have a function of parallelizing (parallelism correction), but in JP-A-09-097813, the function is divided.

[0004]

The cause of the positional deviation between the terminals of the glass electrode and the flexible electrode lies in the positioning accuracy of both before the thermocompression bonding. In the thermocompression bonding apparatus, both electrodes are first positioned to align both terminals, and the positioning mark provided on each electrode is used for this positioning. However, since the flexible electrode is slightly deformed or bent during manufacture, it is often the case that the positioning mark cannot be correctly captured. As a result, the recognition error of the positioning mark due to the deformation or bending appears as a positional deviation of the terminal to be crimped.

Next, the uniformity of the crimped state (degree) of each terminal
Depends on the parallelism of the thermocompression head and pedestal during thermocompression bonding.
Determined. Parallelism of thermocompression head and pedestal is several μm
It is an order. However, the heat (7
0-300 ℃) and pressure (approx. 100N / cm) ²) Is the strain on the thermocompression bonding head
Generate only mechanical strain (mechanical strain associated with thermal expansion and pressure). This
To maintain the parallelism of the thermocompression bonding head and pedestal
Requires regular correction. For the correction, for example,
Manually sandwich the pressure sensitive sheet between the thermocompression bonding head and the pedestal.
, While checking the parallelism from the color change of the pressure-sensitive sheet,
There is a method of mechanically adjusting the inclination of the crimping head. Only
However, this correction requires labor and time, and the actual heat and pressure
Since the correction is made under different conditions from the wear
Was not enough.

Therefore, (1) the first problem is to ensure that the flexible electrodes that are deformed or bent during manufacturing are correctly positioned to prevent the displacement of both electrodes during thermocompression bonding. (2) As a second problem, in order to properly connect both terminals of the glass electrode and the flexible electrode, automation for maintaining the parallelism of the thermocompression bonding head and the pedestal against the distortion of the thermocompression bonding head accompanying thermocompression bonding A thermocompression bonding device was examined with the goal of developing possible correction means.

[0007]

[Means for Solving the Problems] What has been developed as a result of the study is that thermocompression bonding is provided with a positioning portion for both electrodes and a crimping tool for both terminals in order to thermocompress both terminals of the glass electrode and the flexible electrode. In the device, the supporting surface for the flexible electrode has a main supporting surface for adsorbing the electrode body of the flexible electrode and a sub supporting surface for adsorbing only the terminal portion, and the sub supporting surface is flush with the main supporting surface. The main body and sub-supporting surface are provided so as to be displaceable between a horizontal position and a retracted position separated from the terminal, and the sub-supporting surface is displaced to the horizontal position so as to be flush with the main supporting surface when positioning the flexible electrode. The thermocompression bonding apparatus holds the terminals flush with each other and displaces the auxiliary support surface to the retracted position so that the terminals are free during thermocompression bonding and holds only the electrode body by the main support surface.

First, (1) As a solution to the first problem, in the present invention, the position of the flexible electrode is fixed by adsorption, and the electrode body and the terminal portion are adsorbed separately, so that the thermocompression bonding is performed. Only the electrode portion sandwiched between the thermocompression bonding head and the pedestal can be released. Conversely, since a flat state of the flexible electrode during thermocompression bonding is created at the time of positioning, the main supporting surface and the sub-supporting surface are flush with each other at the time of positioning so that the entire flexible electrode can be adsorbed and positioned correctly. By adsorption,
There is an advantage that even if the flexible electrode has any deformation or bending, it can be positioned in a uniformly flat state without any individual difference.

At the time of thermocompression bonding, the structure in which only the sub supporting surface is displaced from the state of being flush with the main supporting surface to the retracted position is free.
For example, the auxiliary support surface may be simply moved up and down by power, and may be moved up to a horizontal position flush with the main support surface, and moved down to a retracted position. Further, the sub-support surface may be pivotally attached to the main support surface by a rotation shaft, and may be rotatably provided between a horizontal position flush with the main support surface and a retracted position spaced downward from the terminal. Unlike the sub-supporting surface for vertical displacement, the sub-supporting surface for rotational displacement is separated from below the main supporting surface at the retracted position, and avoids interference with the supporting surface of the glass electrode during thermocompression bonding. There is an advantage that can be.

In the same thermocompression bonding apparatus, the thermocompression bonding tools for both terminals are composed of a thermocompression bonding head that can be raised and lowered and a pedestal paired with the thermocompression bonding head. The thermocompression bonding head is provided with an elevating mechanism and a two-axis swing shaft. Fixing means for each swinging shaft, which are connected to each other and can swing freely in two directions defined by the swinging shaft with respect to the pedestal, and hold a swinging posture in an arbitrary direction with respect to a horizontal plane with respect to the elevating mechanism portion. The second problem (2) was solved by the thermocompression bonding device provided in (1).

The thermocompression bonding head, which is connected to the elevating mechanism through two swing shafts, swings in accordance with the strain when the fixing means is released and pressed against the cradle, and is autonomously parallel to the cradle. You can correct the degree. When the thermocompression bonding head is connected to the elevating mechanism through a connecting mechanism having a degree of freedom in all directions like a universal joint, it is possible to autonomously correct parallelism by similarly swinging in any direction. In a thermocompression bonding head that applies high pressure, it becomes difficult to maintain the swinging posture. Therefore, two swing shafts whose swing directions are fixed are used.
By providing a shaft, the swinging of both is combined to realize a swinging posture in any direction. Since the heated thermocompression bonding head is brought into direct contact with the pedestal, the pedestal itself may be distorted. Therefore, a reference surface is formed on each of the thermocompression bonding head and the pedestal, and both reference surfaces are parallel surfaces. It is advisable to contact the parallel surfaces of the auxiliary blocks having

[0012] Specifically, an intermediary block axially attached to each of the first horizontal swing shaft suspended from the elevating mechanism and the second horizontal swing shaft provided upright from the thermocompression bonding head. The thermocompression bonding head is connected to the elevating mechanism through the first and second swing shafts, and the first and second swing shafts are orthogonal to each other in a horizontal plane. The first swing shaft swings the intermediate block and the thermocompression bonding head in one direction with respect to the elevating mechanism section. The second swing shaft swings only the thermocompression bonding head in one direction with respect to the intermediate block. Since the first swing shaft and the second swing shaft are orthogonal to each other in the horizontal plane, the thermocompression bonding head can realize a swing posture in an arbitrary direction by a combination of swings by both.

The fixing means of the first swing shaft comprises a braking body which interlocks with the swing of the intermediary block and a fixed chuck which holds or releases the braking body. The fixing means of the second swing shaft is a thermocompression head. It is preferable to have a configuration including a braking body that interlocks with the swinging of and a fixed chuck that holds or releases the braking body. The pressure applied to the thermocompression bonding head after correcting the parallelism is from the direction normal to the parallelism, and the force that hinders the swinging posture is not applied to the thermocompression bonding head or is very small.
Therefore, the swinging posture of the thermocompression bonding head at the time of thermocompression bonding can be sufficiently maintained by a simple fixing means that only clamps the braking body by the fixed chuck. As the braking body, a braking plate made of a plate material having a plane parallel to a vertical plane including the swing direction of each swing shaft is preferable.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a main part of a thermocompression bonding apparatus according to the present invention, FIG. 2 is a front view showing the entire thermocompression bonding apparatus, and FIG. 3 is a left side view of the same. In this example, both terminals 3 of the glass electrode 1 and the flexible electrode 2,
4 (see FIG. 4 below), the thermocompression bonding head 5 for pre-compression bonding and the elevating mechanism part 6 for temporary connection, and the thermocompression bonding head 7 for main compression bonding and the elevating mechanism part 8 for main connection are arranged, and both thermocompression bonding heads 5, 7
In contrast to the common glass electrode supporting surface 9 and flexible electrode main and auxiliary supporting surfaces 10 and 11, a thermocompression bonding device that can be moved in parallel before and after the pedestal 12 is an example of a test device assuming a manufacturing line. is there. In practice, each support surface 9, 10, 11 and pedestal 12 may be fixedly provided for each thermocompression bonding head 5, 7, or more thermocompression bonding heads 5, 7 for pre-compression bonding and main compression bonding may be arranged. Good.

The thermocompression bonding apparatus of this embodiment is shown in FIG. 1, FIG. 2 and FIG.
As can be seen in FIG. 1, the first and second swing shafts 14, 1 are attached to the lifting mechanism section 6 (8) composed of a cylinder fixed in position in the apparatus body 13.
Thermocompression bonding head 5 (7) via intermediary block 16 with 5
Is hanging. A pedestal 12 is fixed to the device body 13 just below the thermocompression bonding head 5 (7). The glass electrode supporting surface 9 is arranged on the front side of the device and the main and sub supporting surfaces 10 and 11 for the flexible electrode are arranged on the rear side of the device so as to sandwich the cradle 12, and the supporting surface 9 for the glass electrode or the flexible electrode is formed. The main and sub supporting surfaces 10 and 11 are independently and integrally moved in parallel over the thermocompression bonding heads 5 and 7 on the left and right sides of the apparatus. Further, the supporting surfaces 9, 10, 11 approach and separate from the pedestal 12, and also slightly pivot forward, backward, leftward and rightward and horizontally in order to adsorb and position each electrode (see FIG. 4, which will be described later).

4 to 7 show a thermocompression bonding head 5 and respective supporting surfaces 9, 10, which represent the procedure of precompression bonding in the thermocompression bonding apparatus of this embodiment.
11 is a perspective view showing the movement of 11, and FIG. 4 shows a state in which the electrodes 1 and 2 are attracted to the supporting surfaces 9, 10 and 11 (the thermocompression bonding head 5 is an imaginary line), and FIG. The support surfaces 9, 10 and 11 are moved in parallel to each other.
12 and the terminals 3 and 4 of each electrode on the pedestal 12
FIG. 7 shows a state in which the thermocompression bonding head 5 is lowered to perform thermocompression bonding. In the thermocompression bonding apparatus of this example, the procedure of thermocompression bonding is the same between pre-compression bonding and main compression bonding, and on the pre-compression bonding side, a film supply unit that interposes ACF (anisotropic conductive film) between both terminals 3 and 4. The difference is that 17 is attached (see Fig. 2). In the following, the procedure relating to the present invention in the preliminary pressure bonding will be described.

First, the glass electrode 1 is placed on the glass electrode supporting surface 9 at a position parallel to the left side (left in FIG. 2) with respect to the pedestal 12, and the flexible electrode main and sub supporting surfaces 10 and 11 are mounted. Place the flexible electrode 2. In an actual production line, each electrode 1, 2 is carried into each support surface 9, 10, 11 by a robot or the like. Each of the glass electrode 1 and the flexible electrode 2 has a flat plate shape, but for example, a positioning step or a recess for engaging or fitting an outer peripheral edge or a minute protrusion is provided on each of the support surfaces 9, 10, 11. If provided, the positioning of the electrodes 1 and 2 at the time of placement becomes easy. In this example, the electrodes 1 and 2 placed on the supporting surfaces 9, 10 and 11 are sucked and adsorbed through the suction holes 18 provided in the supporting surfaces 9, 10 and 11, and the supporting surfaces 9, 10 and 11 are absorbed. Positioning mark provided on each electrode 1 and 2 after fixing the position to
(Not shown) or the outer shape is detected by a sensor (not shown), and the supporting surfaces 9, 10, 11 are moved by the front, rear, left, right, and turning motions of the supporting surfaces 9, 10, 11.
Align with 11 together.

In the alignment with the supporting surfaces 9, 10, 11 as one body, in the present invention, in order to suppress the influence of deformation and bending due to the manufacture of the flexible electrode 2, the flexible electrode 2 is prevented.
While adsorbing the electrode main body 19 of 1 to the main supporting surface 10, the terminal 4 portion is adsorbed to the separate sub supporting surface 11 and aligned in a flattened state. The sub-supporting surface 11 of this example is located between a horizontal position that is flush with the main supporting surface 9 around the pivot shaft 20 provided on the main supporting surface 10 and a retracted position that is spaced downward from the terminal 4. It can be rotated freely. As shown in FIG. 4, when aligning, it rises from below to a horizontal position, but avoids interference with the pedestal 12 during thermocompression bonding (that is, pedestal 1
The sub-support surface 11 is not required to mount the terminal 4 on the 2)
The sub-support surface 11 pivots downward and descends to the retracted position (see FIG. 5 and below).

After completion of the alignment, as shown in FIG. 5, the respective support surfaces 9, 10, 11 move in parallel to the position sandwiching the pedestal 12. At this time, since the sub-supporting surface 11 that has adsorbed the terminal 4 portion of the flexible electrode 2 is no longer necessary, the sub-supporting surface 11 has descended to the retracted position. Each electrode 1,
After sucking 2, the support surfaces 9, 10, 11 may be moved in parallel to the position where the pedestal 12 is sandwiched first, and then aligned. In this case, the sub-supporting surface 11 remains in the horizontal position until the alignment is completed (see FIG. 4), and the sub-supporting face 11 moves to the retracted position again after the alignment.
(See Figure 5).

Next, as shown in FIG. 6, the glass electrode support surface 9 and the flexible electrode main support surface 10 approach the pedestal 12, respectively, and the flexible electrode is placed on the terminal 3 of the glass electrode 1. Both terminals 3, so that terminal 4 of 2 is overlapped,
Place 4 on cradle 12. Although not shown, the ACF is fed so as to be interposed between the terminals of both electrodes. Then, as shown in FIG. 7, the thermocompression bonding head 5 is lowered according to the elevating mechanism 6 (only the lowermost connecting portion is shown and represented), and the thermocompression bonding head 5 heats and pressurizes both electrodes. The terminals 3 and 4 of 1 and 2 are connected. Pre-align each electrode 1, 2
Since the terminals 3 and 4 are correctly placed on the receiving base 12, both terminals 3 and 4 can be uniformly thermocompression bonded if the parallelism between the thermocompression bonding head 5 and the receiving base 12 is correct. In the thermocompression bonding apparatus of this example, the main electrodes 3 and 4 are completely connected to each other after the main pressure bonding.

FIGS. 8 to 10 show a thermocompression bonding head 5 and supporting surfaces 9 and 1 showing the procedure of parallelism correction in the thermocompression bonding apparatus of this embodiment.
FIGS. 8A and 8B are a perspective view and a front view showing the movements of 0 and 11, and FIG. 8 is a state in which the auxiliary blocks 21 and 21 attached to the glass electrode supporting surface 9 are advanced toward the reference surface 22 of the pedestal 12. 9 is a state in which the thermocompression bonding head 5 is lowered so as to sandwich the auxiliary block 21 between the reference surfaces 22 and 23, and FIG. 10 is a front view for explaining the parallelism correction in the state of FIG. In this example, the auxiliary block 21 sandwiched between the reference surfaces 22 and 23 so that the thermocompression bonding head 5 does not directly contact the pedestal 12 when the parallelism is corrected.
The parallelism of the thermocompression bonding head 5 with respect to the pedestal 12 is corrected via the.

As shown in FIGS. 8 and 10, the thermocompression bonding head 5 of this embodiment is connected to the lifting mechanism 6 via an intermediary block 16. A first oscillating shaft 14 and a second oscillating shaft 15 which are orthogonal to each other are rotatably attached to the intermediary block 16, and the first oscillating shaft 14 is lowered from the elevating mechanism section 6 by a first flange 24. , 24 are supported in the horizontal direction, and the second swing shaft 15 is supported in the horizontal direction by the second flanges 25, 25 protruding from the thermocompression bonding head 5. Since the lifting mechanism 6 is fixed in position except the lifting direction, the thermocompression bonding head 5 swings relative to the lifting mechanism 6 in any direction relative to the first swing shaft 14 and the second swing shaft 15. it can. A first or second braking flat plate 26, 27 is integrally provided on each swing shaft 14, 15, and each braking flat plate 26, 27 is supported by a sliding contact block 28 and an intermediate block 16 mounted on the outer surface of the intermediate block 16. It is clamped or released by the clamp cylinder 29. Sliding contact block 28 and clamp cylinder
29 constitutes a fixed chuck.

In parallel correction, as shown in FIG. 8, first, similarly to the thermocompression bonding, the support surfaces 9, 10, 11 are moved in parallel so as to sandwich the pedestal 12, and the glass electrode support surface 9 is sandwiched. The auxiliary block 21 attached to the above is projected according to the support rail 30, and the auxiliary block 21 is placed on the reference surface 22 so that the lower surface is in contact with the reference surface 22 formed on the receiving table 12. Since it is sufficient that the auxiliary block 21 can be interposed between the thermocompression bonding head 5 and the pedestal 12, the auxiliary block may be attached to the main support surface for the flexible electrode, or the pedestal itself may be provided with the auxiliary block. .

Then, the clamp cylinders 29 of the fixed chucks are retracted to release the braking flat plates 26 and 27, thereby freeing the swing shafts 14 and 15, and the thermocompression bonding head 5 as shown in FIG. The reference surface 23 of the thermocompression bonding head 5 is brought into contact with the upper surface of the auxiliary block 21. After that, if pressure is applied in the same manner as during thermocompression bonding, the thermocompression bonding head 5 swings in accordance with the pedestal 12 so as to reduce uneven distribution of stress due to strain, and autonomous correction is realized. As shown in FIG. 10, the parallelism obtained is more practical because the parallelism between the thermocompression bonding head 5 and the pedestal 12 is corrected under the same conditions as during thermocompression bonding. In addition, the accuracy of the correction is finally determined by the thermocompression bonding head 5 and the pedestal 12.
However, since the polishing can be performed on the order of several μm, the accuracy of the parallelism correction according to the present invention is
It will be extremely expensive.

Although the auxiliary block 21 is interposed in this embodiment, the auxiliary block 21 is merely an auxiliary member for protecting the pedestal 12, and the thermocompression bonding head 5 and the pedestal 12 are substantially in contact with each other. You can think that Therefore, the swinging of the thermocompression bonding head 5 in an arbitrary direction is self-sustaining so that the thermocompression bonding head 5 in which distortion occurs is in uniform contact with the pedestal 12 (minimizing uneven stress distribution). This makes it possible for the thermocompression bonding head 5 to have an appropriate swinging posture including distortion. Further, as is clear from each figure, the thermocompression bonding head 5
Since no power is required to swing the
A simple structure consisting of only 14,15 and fixing means 28,29 can be adopted, and automation is also possible. Above all, the correction of the parallelism according to the present invention can be appropriately performed between the connection work of the electrodes, and therefore, there is an advantage that the productivity is not impaired.

[0026]

EFFECTS OF THE INVENTION According to the present invention, (1) the flexible electrodes that are deformed or bent due to manufacturing can be reliably positioned, and the positional displacement of both electrodes during thermocompression bonding does not occur. (2) solving the problem of (2), easily and practically realize the correction for maintaining the parallelism of the thermocompression bonding head and the pedestal against the distortion of the thermocompression bonding head due to the thermocompression bonding (solving the problems of the table), It is possible to provide a thermocompression bonding apparatus with improved production efficiency while maintaining the accuracy of electrode connection. The main and sub supporting surfaces used for positioning the flexible electrode of the present invention, the swing shaft and the fixing means for correcting the parallelism of the thermocompression bonding head and the pedestal can be independently used in the thermocompression bonding apparatus. ,
By using both of them together, it is possible to connect the terminals of the electrodes of high quality with high accuracy without completely stopping the production line.

Especially, the correction of the parallelism of the thermocompression bonding head and the pedestal proposed by the present invention is different from the conventional one, and in particular, the power is not required to change the swinging posture of the thermocompression bonding head.
There is an advantage that it is possible to appropriately swing the thermocompression bonding head according to the strain without measuring how much strain has occurred. Furthermore, since the correction under the same conditions as in the thermocompression bonding can be appropriately performed between the electrode connecting operations, it is not necessary to stop the manufacturing line, and thus there is an effect that productivity is not reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a thermocompression bonding apparatus according to the present invention.

FIG. 2 is a front view showing the entire thermocompression bonding apparatus.

FIG. 3 is a left side view showing the entire thermocompression bonding apparatus.

FIG. 4 is a perspective view showing movements of a thermocompression bonding head and each support surface in a state where each electrode is attracted to the support surface.

FIG. 5 is a perspective view showing the movements of the thermocompression bonding head and each support surface when the support surfaces are moved in parallel to the front and rear positions of the cradle.

FIG. 6 is a perspective view showing the movements of the thermocompression bonding head and each support surface in a state where each support surface is brought close to the pedestal and terminals of each electrode are superposed on the pedestal.

FIG. 7 is a perspective view showing movements of the thermocompression bonding head and each supporting surface in a state where the thermocompression bonding head is lowered to perform thermocompression bonding.

8A and 8B are a perspective view and a front view showing the movement of the thermocompression bonding head and each supporting surface in a state where the auxiliary block is advanced toward the reference surface of the pedestal.

9A and 9B are a perspective view and a front view showing the movement of the thermocompression bonding head and each supporting surface when the thermocompression bonding head is lowered so as to sandwich the auxiliary block between the reference surfaces.

10 is a front view for explaining parallelism correction in the state of FIG. 9.

[Explanation of symbols]

1 glass electrode 2 Flexible electrode 5 Thermocompression bonding head for preliminary pressure bonding 6 Lifting mechanism for pre-crimping 9 Glass electrode support surface 10 Main support surface for flexible electrodes 11 Sub-supporting surface for flexible electrode 12 cradle 14 First swing shaft 15 Second swing shaft 16 Broker block 21 Auxiliary block 26 First braking plate 27 Second braking plate 28 Sliding contact block 29 Clamp cylinder

Claims (6)

[Claims] 1. A thermocompression bonding apparatus comprising a positioning part for both electrodes and a crimping tool for both terminals for thermocompressing both terminals of a glass electrode and a flexible electrode, wherein a support surface for the flexible electrode is flexible. The electrode has a main supporting surface for adsorbing the electrode body and a sub supporting surface for adsorbing only the terminal portion, and the sub supporting surface is between a horizontal position flush with the main supporting surface and a retracted position separated from the terminal. The main body and terminals are held flush by the main and sub-supporting surfaces that are displaced horizontally so that the sub-supporting surfaces are displaced horizontally so that they are flush with the main supporting surface when positioning the flexible electrode. The thermocompression bonding apparatus is characterized in that the sub-supporting surface is displaced to the retracted position so as to be free, and only the electrode body is held by the main supporting surface. 2. The sub-supporting surface is pivotally attached to the main supporting surface by a rotating shaft, and is rotatably provided between a horizontal position flush with the main supporting surface and a retracted position spaced downward from the terminal. The thermocompression bonding apparatus according to claim 1. 3. A thermocompression bonding apparatus having a positioning portion for both electrodes and a crimping tool for both terminals for thermocompression-bonding both terminals of the glass electrode and the flexible electrode, the thermocompression bonding tool for both terminals being movable up and down. A thermocompression bonding head and a pedestal paired with the thermocompression bonding head. The thermocompression bonding head is connected to the elevating mechanism through a two-axis swing shaft, and swings in two directions defined by the swing shaft with respect to the base. A thermocompression-bonding device, characterized in that fixing means for freely holding a swinging posture in an arbitrary direction with respect to a horizontal plane with respect to the lifting mechanism portion is provided for each swinging shaft. 4. A horizontal first unit suspended from a lifting mechanism unit.
The thermocompression bonding head is connected to the elevating mechanism through intermediary blocks axially attached to the rocking shaft and the horizontal second rocking shaft provided upright from the thermocompression bonding head. The thermocompression bonding apparatus according to claim 3, wherein the two swing axes are orthogonal to each other in a horizontal plane. 5. The thermocompression bonding apparatus according to claim 3, wherein the fixing means of the first swing shaft comprises a braking body that interlocks with the swinging of the intermediary block and a fixed chuck that holds or releases the braking body. 6. The thermocompression bonding apparatus according to claim 3, wherein the fixing means for the second swing shaft comprises a braking body that interlocks with the swing of the thermocompression bonding head and a fixed chuck that holds or releases the braking body.