JP2003017908A - Electronic circuit member, and connection structure of the electronic circuit member and coupling structure for transmission line - Google Patents
Electronic circuit member, and connection structure of the electronic circuit member and coupling structure for transmission lineInfo
- Publication number
- JP2003017908A JP2003017908A JP2001195576A JP2001195576A JP2003017908A JP 2003017908 A JP2003017908 A JP 2003017908A JP 2001195576 A JP2001195576 A JP 2001195576A JP 2001195576 A JP2001195576 A JP 2001195576A JP 2003017908 A JP2003017908 A JP 2003017908A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- transmission line
- circuit member
- air transmission
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Combinations Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子回路部材同士
のマイクロ波帯やミリ波帯での信号伝送を、ボンディン
グによらずに安定して行うことができる電子回路部材並
びに電子回路部材の連結構造及び伝送路の結合構造に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit member capable of stably transmitting signals in the microwave band and the millimeter wave band between electronic circuit members without using bonding, and a connection between the electronic circuit members. The present invention relates to a structure and a coupling structure of transmission lines.
【０００２】[0002]
【従来の技術】電子機器は、各種の回路やデバイスを組
み合わせることにより構成される。実際に電子機器内に
回路を実装する一つの手段として、各種の回路ごとに電
子回路基板を形成し、これら電子回路基板同士を接続す
るようにしたものがある。2. Description of the Related Art Electronic equipment is constructed by combining various circuits and devices. As one means for actually mounting a circuit in an electronic device, there is one in which an electronic circuit board is formed for each type of circuit and these electronic circuit boards are connected to each other.
【０００３】電子回路基板同士を、コネクタやソケット
を使用することなく接続する方法としては、例えば、図
１に示すように、電子回路基板１，２の上面に形成した
マイクロストリップライン３，３が形成されて電子回路
基板同士を接続する場合、そのマイクロストリップライ
ン３，３の先端に、それぞれリボン，ワイヤー等の接続
部材４の両端をはんだ付けなどにより接続する。これに
より電子回路基板１，２上に形成された回路同士を接続
することができる。電子機器は、各種の回路やデバイス
を組合せることにより構成される。実際に機器内に回路
を実装する一つの手段としては、上記各種回路ごとに電
子回路基板を形成し、これら電子回路同士を接続するよ
うにしているものがある。As a method of connecting electronic circuit boards to each other without using connectors or sockets, for example, as shown in FIG. 1, microstrip lines 3 and 3 formed on the upper surfaces of electronic circuit boards 1 and 2 are used. When the formed electronic circuit boards are connected to each other, both ends of the connecting members 4 such as ribbons and wires are connected to the tips of the microstrip lines 3 by soldering or the like. Thereby, the circuits formed on the electronic circuit boards 1 and 2 can be connected to each other. Electronic equipment is configured by combining various circuits and devices. As one means for actually mounting a circuit in a device, there is one in which an electronic circuit board is formed for each of the various circuits and these electronic circuits are connected to each other.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
接続部材４を用いた電子回路基板１，２同士の接続構造
では、以下に示すの問題を有している。すなわち、マイ
クロ波やミリ波の領域で、上記接続部材４を用いて電子
回路基板１，２同士を接続すると、ワイヤーまたはリボ
ン等の接続部材４の形状（長さや屈曲形状），半田等の
ボンディング材の量、さらには電子回路基板を構成する
基板１，２間の隙間のバラツキが原因して伝送状態が不
安定になる。However, the connection structure of the electronic circuit boards 1 and 2 using the connection member 4 has the following problems. That is, when the electronic circuit boards 1 and 2 are connected to each other using the connecting member 4 in the microwave or millimeter wave region, the shape (length or bent shape) of the connecting member 4 such as a wire or ribbon, bonding of solder or the like. The transmission state becomes unstable due to the amount of material, and further, the variation in the gap between the substrates 1 and 2 forming the electronic circuit substrate.
【０００５】また、接続部材４をマイクロストリップラ
イン３の先端に熱融着，超音波融着により接続したり、
半田を用いて接続する場合には、接続時に生じる熱によ
り接続部材４に、熱収縮等に起因する形状変化が生じ易
くなり、伝送状態が不安定になることがある。また、電
子回路基板１，２の実働中においては、周囲温度の変化
により、電子回路基板１，２それ自体、或いは接続部材
４，マイクロストリップライン３等が熱膨張や熱伸縮
し、特性が変化したり、マイクロストリップライン３の
先端が、パターン剥離が生じ易くなる。Further, the connecting member 4 is connected to the tip of the microstrip line 3 by heat fusion or ultrasonic fusion,
When connecting using solder, the connection member 4 is likely to undergo a shape change due to heat shrinkage or the like due to the heat generated at the time of connection, and the transmission state may become unstable. Further, while the electronic circuit boards 1 and 2 are in operation, the electronic circuit boards 1 and 2 themselves, or the connection members 4, the microstrip line 3 and the like are thermally expanded or expanded and contracted due to a change in ambient temperature, and the characteristics are changed. The pattern peeling is likely to occur at the tip of the microstrip line 3.
【０００６】さらには、マイクロストリップライン３，
３間はＤＣ的に導通しているため、一方の電子回路基板
で生じた静電気電位，サージ電位等の異常電位は、他方
の電子回路基板に伝達され、結果として回路部品を破壊
してしまう危険性がある。Furthermore, the microstrip line 3,
Since there is DC continuity between the three, abnormal potentials such as electrostatic potentials and surge potentials generated in one electronic circuit board are transmitted to the other electronic circuit board, resulting in the risk of destroying circuit components. There is a nature.
【０００７】本発明は、上記した背景に鑑みてなされた
もので、その目的とするところは、上記した問題を解決
し、２つの電子回路部材に形成された回路を、ボンディ
ングによることなく接続し、回路相互間での信号伝送を
安定して行うことができる電子回路部材，電子回路部材
の連結構造及び伝送路の結合構造を提供することを目的
とする。The present invention has been made in view of the above background. An object of the present invention is to solve the above problems and to connect circuits formed on two electronic circuit members without bonding. An object of the present invention is to provide an electronic circuit member, a connecting structure of electronic circuit members, and a coupling structure of transmission lines, which can stably perform signal transmission between circuits.
【０００８】[0008]
【課題を解決するための手段】上記した目的を達成する
ため、本発明の電子回路部材は、端縁に平行に、他の電
子回路部材に高周波信号を伝送するための所定長さの空
中伝送用ラインが終端形成されていることを特徴とす
る。In order to achieve the above-mentioned object, the electronic circuit member of the present invention has an air transmission of a predetermined length for transmitting a high frequency signal to another electronic circuit member in parallel with an edge. It is characterized in that the working line is formed at the end.
【０００９】ここで、電子回路部材は、電子回路基板ま
たは電子回路デバイスである。Here, the electronic circuit member is an electronic circuit board or an electronic circuit device.
【００１０】本発明の電子回路部材では、通常、前記空
中伝送用ラインに直角に、高周波伝送ラインが形成さ
れ、前記空中伝送用ラインは、部材にパターン形成され
たストリップラインである。In the electronic circuit member of the present invention, a high-frequency transmission line is usually formed at a right angle to the aerial transmission line, and the aerial transmission line is a strip line patterned on the member.
【００１１】本発明の電子回路部材では、前記空中伝送
用ラインの部材裏面側にはグランドを形成してもよい
が、しなくてもよい。電子回路部材の裏面にグランドを
形成しない場合には、空中伝送用ライン同士の結合係数
が高くなる。In the electronic circuit member of the present invention, a ground may or may not be formed on the rear surface side of the member for the aerial transmission line. When the ground is not formed on the back surface of the electronic circuit member, the coupling coefficient between the air transmission lines becomes high.
【００１２】また、本発明の電子回路部材では、空中伝
送用ラインの終端には、ライン長を延長するために、複
数のパッドを形成することができる。さらに、空中伝送
用ラインの終端には、コンデンサを接続することができ
る。Further, in the electronic circuit member of the present invention, a plurality of pads can be formed at the end of the air transmission line in order to extend the line length. Furthermore, a capacitor can be connected to the end of the air transmission line.
【００１３】本発明の電子回路部材の連結構造は、上記
の電子回路部材が２つ１組で用いられるもので、一方の
前記電子回路部材の前記空中伝送用ラインが形成された
縁と、他方の前記電子回路部材の前記空中伝送用ライン
が形成された縁とが、平行でかつ近接するように当接し
ていることを特徴とする。The electronic circuit member connecting structure according to the present invention uses two electronic circuit members as a set, and one of the electronic circuit members has an edge at which the air transmission line is formed, and the other one. The edge of the electronic circuit member on which the aerial transmission line is formed is in contact with the edge so as to be parallel and close to each other.
【００１４】また、本発明の伝送路の結合構造は、請求
項１から６の何れか１項に記載の前記電子回路部材が２
つ１組で用いられるもので、一方の前記電子回路部材の
前記空中伝送用ラインと、他方の前記電子回路部材の前
記空中伝送用ラインとが、平行でかつ近接していること
を特徴とする。Further, in the coupling structure of the transmission line according to the present invention, the electronic circuit member according to any one of claims 1 to 6 is provided.
The air transmission line of one of the electronic circuit members and the air transmission line of the other electronic circuit member are parallel and close to each other. .
【００１５】[0015]
【発明の実施の形態】以下、本発明の電子回路基板を用
いて、本発明の電子回路基板の連結構造及び伝送路の結
合構造を形成する実施の形態を説明する。図２，図３
は、本発明の第１の実施の形態を示している。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of forming a connecting structure of electronic circuit boards and a coupling structure of transmission lines of the present invention using the electronic circuit board of the present invention will be described below. 2 and 3
Shows a first embodiment of the present invention.
【００１６】同図に示すように、電子回路基板１，２の
表面には、所定のパターン形状からなるマイクロストリ
ップラインが形成され、所定の回路を構成している。電
子回路基板１，２は、ガラスエポキシ基板，テフロン
（登録商標）基板，セラミック基板等の誘電体基板が用
いられる。As shown in the figure, microstrip lines having a predetermined pattern are formed on the surfaces of the electronic circuit boards 1 and 2 to form a predetermined circuit. As the electronic circuit boards 1 and 2, dielectric boards such as glass epoxy boards, Teflon (registered trademark) boards, and ceramic boards are used.
【００１７】そして、本発明との関係で言えば、電子回
路基板１の表面の端縁１ａ近傍には、当該端縁１ａに沿
って平行に空中伝送用ライン１１が形成される。同様に
電子回路基板２の表面の端縁２ａ近傍には、当該端縁２
ａに沿って平行に空中伝送用ライン２１が形成されてい
る。空中伝送用ライン１１，２１の長さは同一であり、
これらは対となって結合器を構成する。In relation to the present invention, an air transmission line 11 is formed in parallel with the edge 1a on the surface of the electronic circuit board 1 along the edge 1a. Similarly, in the vicinity of the edge 2a on the surface of the electronic circuit board 2, the edge 2
An aerial transmission line 21 is formed in parallel along a. The lengths of the air transmission lines 11 and 21 are the same,
These make a pair to form a coupler.
【００１８】空中伝送用ライン１１，２１の終端してい
ない側の端部からは、各空中伝送用ライン１１，２１と
直交するように高周波伝送ライン１２，２２が形成され
ている。つまり、高周波伝送ライン１２，２２と空中伝
送用ライン１１，２１とによりＬ字状のパターンが形成
される。なお、高周波伝送ラインが、両端が終端した空
中伝送用ラインの中央から直角に延びて形成（Ｔ字形に
形成）されていてもよい。High-frequency transmission lines 12 and 22 are formed so as to be orthogonal to the air transmission lines 11 and 21 from the ends of the air transmission lines 11 and 21 which are not terminated. That is, the high frequency transmission lines 12 and 22 and the air transmission lines 11 and 21 form an L-shaped pattern. The high frequency transmission line may be formed to extend at a right angle (formed in a T shape) from the center of the air transmission line terminated at both ends.
【００１９】さらに、電子回路基板１，２の裏面には、
ほぼ全面に金属膜が形成され、グランド面１５，２５が
形成されている。これにより、上記した各ラインは、マ
イクロストリップラインとなる。さらに本形態では、グ
ランド面１５，２５は、空中伝送用ライン１１，２１の
直下ではパターンオフされている。換言すると、空中伝
送用ライン１１，２１が形成された電子回路基板１，２
の端縁１ａ，２ａ近傍位置は金属膜が形成されない。こ
のグランド面のパターンオフは必須ではないが、パター
ンオフした場合には、空中伝送用ライン１１，２１間の
結合係数を高くすることができる。Further, on the back surfaces of the electronic circuit boards 1 and 2,
A metal film is formed on almost the entire surface, and the ground surfaces 15 and 25 are formed. As a result, each line described above becomes a microstrip line. Further, in this embodiment, the ground planes 15 and 25 are patterned off immediately below the air transmission lines 11 and 21. In other words, the electronic circuit boards 1 and 2 on which the air transmission lines 11 and 21 are formed
A metal film is not formed near the edges 1a and 2a. The pattern off of the ground plane is not essential, but when the pattern is off, the coupling coefficient between the air transmission lines 11 and 21 can be increased.
【００２０】本実施の形態によれば、結合する２つの電
子回路基板１，２を、前記端縁１ａ，２ａ同士が所定の
間隔をおいて配置する。より具体的には、結合器を構成
する空中伝送用ライン１１，２１が、平行でかつ所望の
距離をおくように配置する。これにより、一方の高周波
伝送ライン１２を伝播されてきた信号は、一対の空中伝
送用ライン１１，２１間の空間を伝播し、他方の高周波
伝送ライン２２に伝達される。なお、本実施の形態で
は、電子回路基板１の端縁１ａと、電子回路基板２の端
縁２ａとは一定の間隔をおいて配置しているが、当接さ
せてもよい。According to the present embodiment, the two electronic circuit boards 1 and 2 to be coupled are arranged such that the edges 1a and 2a are spaced apart from each other by a predetermined distance. More specifically, the air transmission lines 11 and 21 forming the coupler are arranged in parallel and at a desired distance. As a result, the signal propagated through one of the high frequency transmission lines 12 propagates through the space between the pair of air transmission lines 11 and 21, and is transmitted to the other high frequency transmission line 22. In addition, in the present embodiment, the edge 1a of the electronic circuit board 1 and the edge 2a of the electronic circuit board 2 are arranged at a constant interval, but they may be in contact with each other.
【００２１】ところで、結合器の共振周波数が目的の値
からずれている場合には、例えば図４に示すように、空
中伝送用ライン１１の先端１１ａ側をカッターＫによ
り、適宜の長さ分だけ除去することにより対応できる。
すなわち、よく知られているように、空中伝送用ライン
の長さは、長いことが好ましいが、その長さは波長λの
値に支配される（通常は、λ／４の値に支配される）。
ライン長がλ／４を超えると、空中伝送用ラインはイン
ダクタンス特性を持つため、インピーダンス整合がとれ
ず、伝送の効率が低下する。２つの電子回路基板同士を
結合した場合、基板の加工公差等が起因して、上記のλ
／４が崩れることがある。このような場合には、コンデ
ンサ等によりインピーダンス整合をとることができる。By the way, when the resonance frequency of the coupler is deviated from the target value, for example, as shown in FIG. 4, the tip end 11a side of the air transmission line 11 is cut by an appropriate length by a cutter K. It can be dealt with by removing.
That is, as is well known, the length of the air transmission line is preferably long, but the length is governed by the value of the wavelength λ (usually, by the value of λ / 4). ).
When the line length exceeds λ / 4, the air transmission line has an inductance characteristic, so that impedance matching cannot be achieved and transmission efficiency decreases. When two electronic circuit boards are connected to each other, due to the processing tolerance of the boards, etc.
/ 4 may collapse. In such a case, impedance matching can be achieved with a capacitor or the like.
【００２２】なお、すでに形成した空中伝送用ライン１
１の先端にさらにパターン要素を接続することに比べる
と、図示したように切除する方が簡単にできる。従っ
て、空中伝送用ライン１１の寸法を予め少し長めに設定
しておき、その後、パターンの一部を除去して周波数調
整をするとよい。The air transmission line 1 already formed
As compared to connecting a pattern element to the tip of 1, it is easier to cut as shown. Therefore, it is advisable to set the dimension of the air transmission line 11 to be slightly longer in advance, and then remove a part of the pattern to adjust the frequency.
【００２３】なお、図示の例では一方の電子回路基板１
側を例にあげて説明したが、電子回路基板２側でも同様
である。この点は、後述する各実施の形態においても同
様である。In the illustrated example, one electronic circuit board 1
Although the side has been described as an example, the same applies to the electronic circuit board 2 side. This point is the same in each embodiment described later.
【００２４】図５は、本発明の第２の実施の形態を示し
ている。本実施の形態では、空中伝送用ライン１１の先
端の延長線上に複数のパッド１６ａ，１６ｂ，１６ｃを
設けている（もちろん、設置する個数は、図示のように
３個に限ることは無く、さらには１個でもよい）。ま
た、このパッド１６ａ〜１６ｃは、空中伝送用ライン１
１のパターン形成時に同時に形成することができる。FIG. 5 shows a second embodiment of the present invention. In the present embodiment, a plurality of pads 16a, 16b, 16c are provided on the extension line of the tip of the air transmission line 11 (of course, the number of pads to be installed is not limited to three as shown in the drawing, and Can be one). The pads 16a to 16c are used for the air transmission line 1
It can be formed simultaneously when one pattern is formed.
【００２５】そして、空中伝送用ライン１１と、パッド
１６ａをワイヤ１７などにて接続することにより、この
ワイヤ並びにパッド１６ａの部分も空中伝送用ライン１
１と一体化して結合器の一部を構成することになり、空
中伝送用ライン１１の長さを延長したものと同様にな
る。By connecting the air transmission line 11 and the pad 16a with a wire 17 or the like, the wire and the pad 16a are also connected to the air transmission line 1.
1 is integrated with 1 to form a part of the coupler, which is the same as the extension of the length of the air transmission line 11.
【００２６】同様に、隣接する２つのパッド１６ａ，１
６ｂをリボンで接続するとさらに長くなり、隣接する２
つのパッド１６ｂ，１６ｃをリボンで接続するとより長
くなる。Similarly, two adjacent pads 16a, 1
If 6b is connected with a ribbon, it will become even longer, and adjacent 2
If the two pads 16b and 16c are connected by a ribbon, the length becomes longer.
【００２７】これにより、空中伝送用ラインの実質的な
長さを変更し、周波数特性を変更することができる。な
お、空中伝送用ライン１１とパッドの接続並びにパッド
同士の接続は、上記した説明では隣接するもの同士を接
続するようにしたが、本発明はこれに限るとことは無
く、例えば、空中伝送用ライン１１の先端とパッド１６
ｂを接続したり、パッド１６ａとパッド１６ｃを接続す
るというように隣接しないもの同士を接続するようにし
てももちろんよい。なお、その他の構成並びに作用効果
は、上記した実施の形態と同様であるので、対応する部
材に同一符号を付し、その詳細な説明を省略する。As a result, the substantial length of the air transmission line can be changed and the frequency characteristic can be changed. In the above description, the connection between the air transmission line 11 and the pads and the connection between the pads are made so that adjacent ones are connected. However, the present invention is not limited to this. Tip of line 11 and pad 16
Of course, it is also possible to connect non-adjacent ones such as connecting b and connecting pads 16a and 16c. Since other configurations and effects are the same as those in the above-described embodiment, corresponding members are designated by the same reference numerals, and detailed description thereof will be omitted.
【００２８】図６は、本発明の第３の実施の形態を示し
ている。本実施の形態では、上記した第１の実施の形態
を基本とし、コンデンサにより空中伝送用ラインのイン
ピーダンス整合をとる場合の一例を示している。同図に
示すように、空中伝送用ライン１１の先端１１ａと、そ
の近くに設けたパッド１８との間に終端コンデンサ１９
が接続されている。なお、このパッド１８は、スルーホ
ール２０を介してグランド面１５に接地されている。FIG. 6 shows a third embodiment of the present invention. The present embodiment is based on the above-described first embodiment, and shows an example of a case where impedance matching of the air transmission line is performed by a capacitor. As shown in the figure, a terminating capacitor 19 is provided between the tip 11a of the air transmission line 11 and a pad 18 provided in the vicinity thereof.
Are connected. The pad 18 is grounded to the ground plane 15 via the through hole 20.
【００２９】本実施の形態によれば、電子回路基板１
は、空中伝送用ライン１１が終端コンデンサ１９により
インピーダンス整合がとられているので、伝送率が低下
するのを防ぐことができる。なお、その他の構成並びに
作用効果は、上記した実施の形態と同様であるので、対
応する部材に同一符号を付し、その詳細な説明を省略す
る。According to the present embodiment, the electronic circuit board 1
Since the air transmission line 11 is impedance-matched by the terminating capacitor 19, it is possible to prevent the transmission rate from decreasing. Since other configurations and effects are the same as those in the above-described embodiment, corresponding members are designated by the same reference numerals, and detailed description thereof will be omitted.
【００３０】次に、本発明の効果を実証する実験結果を
示す。まず、図７は、図２，図３に示した第１の実施の
形態に示す構成における電子回路基板１，２との結合構
造を、
基板条件：誘電率εr＝９．４，厚さｈ＝０．２５４ｍ
ｍ，導体厚ｔ＝８μｍ
パターン：幅ｗ＝０．２２４ｍｍ，長さＬ＝１０ｍｍ，
ｓ＝１．２２４ｍｍ
ｇａｐ：２０μｍ
としたときの周波数特性を示す。Next, experimental results demonstrating the effect of the present invention will be shown. First, FIG. 7 shows a coupling structure with the electronic circuit boards 1 and 2 in the configuration shown in FIGS. 2 and 3 according to the first embodiment, the substrate condition: permittivity εr = 9.4, thickness h = 0.254m
m, conductor thickness t = 8 μm pattern: width w = 0.224 mm, length L = 10 mm,
The frequency characteristic when s = 1.224 mm gap: 20 μm is shown.
【００３１】また、図８は、図１に示した従来例の電子
回路基板１，２との結合構造を、
基板条件：誘電率εr＝９．４，厚さｈ＝０．２５４ｍ
ｍ，導体厚ｔ＝８μｍ
パターン：幅ｗ＝０．２２４ｍｍ，長さＬ＝１０ｍｍ，
Ａｕリボン厚＝２０μｍ
接続部材：Ａｕリボン
としたときの周波数特性を示す。FIG. 8 shows a connection structure with the conventional electronic circuit boards 1 and 2 shown in FIG. 1 under the following conditions: Substrate condition: permittivity εr = 9.4, thickness h = 0.254 m
m, conductor thickness t = 8 μm Pattern: width w = 0.224 mm, length L = 10 mm, Au ribbon thickness = 20 μm Connection member: frequency characteristics when an Au ribbon is used.
【００３２】各図から明らかなように、図８の従来の結
合構造では、通過損失Ｓ２１が全体的に低く、伝達係数
Ｓ１１が２４．５ＧＨｚ付近で高い。これに対して、本
実施の形態では、図７からわかるように、通過損失Ｓ２
１が低く、伝達係数Ｓ１１が２３．３ＧＨｚ付近で高
い。したがって、本発明により、伝送路の結合が良好に
行えることが実証される。As is clear from each figure, in the conventional coupling structure shown in FIG. 8, the pass loss S21 is generally low and the transfer coefficient S11 is high near 24.5 GHz. On the other hand, in this embodiment, as can be seen from FIG. 7, the passage loss S2
1 is low, and the transmission coefficient S11 is high near 23.3 GHz. Therefore, the present invention demonstrates that the transmission lines can be coupled well.
【００３３】また図９は、空中伝送用ラインの長さを変
更した場合の周波数特性を示す。図９に示すように、長
さが変更されることにより、周波数特性が変動すること
が確認できた。さらに、長さの変更量が大きくなるほど
共振周波数の変動量も大きくなる。FIG. 9 shows the frequency characteristic when the length of the air transmission line is changed. As shown in FIG. 9, it was confirmed that the frequency characteristics fluctuate as the length is changed. Furthermore, the greater the amount of change in length, the greater the amount of change in resonance frequency.
【００３４】[0034]
【発明の効果】以上のように、本発明では、以下の効果
を奏することができる。すなわち、接続される電子回路
基板上の回路同士を、ワイヤーやリボンにボンディング
によらずに、空間結合で接続できる。その結果、形状
（長さや屈曲形状），半田等のボンディング材の量が原
因して、伝送状態が不安定になるといった不都合は生じ
ない。また、ワイヤーやリボンの取り付け時の熱伸縮に
より、電子回路基板上に形成されたパターンが応力を受
けて剥離するといった不都合も生じない。As described above, according to the present invention, the following effects can be obtained. That is, the circuits on the electronic circuit board to be connected can be connected to each other by a space bond without using a wire or a ribbon. As a result, there is no inconvenience that the transmission state becomes unstable due to the shape (length or bent shape) and the amount of bonding material such as solder. In addition, there is no inconvenience that the pattern formed on the electronic circuit board is stressed and peeled off due to thermal expansion and contraction when the wire or ribbon is attached.
【００３５】接続される電子回路基板上の回路同士を、
ワイヤーやリボンにボンディングによらずに、空中伝送
用ラインの長さを伸張，短縮することで、伝達特性を変
化させることができるので、周波数変更に対処すること
が容易であり、信号伝送ライン上の信号周波数の変更や
調整に容易に対応することができる。また電子回路基板
回路の接続パッド等に剥離が生じることはない。The circuits on the electronic circuit board to be connected are
The transfer characteristics can be changed by extending and shortening the length of the air transmission line instead of bonding it to a wire or ribbon, so it is easy to handle frequency changes and It is possible to easily deal with the change and adjustment of the signal frequency of. Moreover, peeling does not occur in the connection pads and the like of the electronic circuit board circuit.
【００３６】さらにストリップライン間の距離のバラツ
キは、本発明では伝送特性に影響をほとんど与えない。
回路上に静電気による電位，サージ等の異常電位が現わ
れたとしても、一方の電子回路基板上の回路から他方の
電子回路基板上の回路に伝送されることはない。Further, the variation in the distance between the strip lines hardly affects the transmission characteristics in the present invention.
Even if an abnormal potential such as a potential due to static electricity or a surge appears on the circuit, it is not transmitted from the circuit on one electronic circuit board to the circuit on the other electronic circuit board.
【図１】従来例を示す図である。FIG. 1 is a diagram showing a conventional example.
【図２】本発明の第１の実施の形態を示す斜視図であ
る。FIG. 2 is a perspective view showing a first embodiment of the present invention.
【図３】（ａ）は本発明の第１の実施の形態を示す平面
図である。（ｂ）は本発明の第１の実施の形態を示す側
面図である。FIG. 3A is a plan view showing the first embodiment of the present invention. FIG. 3B is a side view showing the first embodiment of the present invention.
【図４】空中伝送用ラインの長さを短縮する様子を示す
図である。FIG. 4 is a diagram showing how the length of an air transmission line is shortened.
【図５】本発明の第２の実施の形態を示す斜視図であ
る。FIG. 5 is a perspective view showing a second embodiment of the present invention.
【図６】本発明の第３の実施の形態を示す斜視図であ
る。FIG. 6 is a perspective view showing a third embodiment of the present invention.
【図７】図２に示した２つの電子回路基板に形成された
空中伝送用ライン同士の結合構造についての周波数特性
を示す図である。FIG. 7 is a diagram showing frequency characteristics of a coupling structure of air transmission lines formed on the two electronic circuit boards shown in FIG.
【図８】図１に示した２つの電子回路基板に形成された
空中伝送用ライン同士の結合構造についての周波数特性
を示す図である。8 is a diagram showing frequency characteristics of a coupling structure of air transmission lines formed on the two electronic circuit boards shown in FIG.
【図９】空中伝送用ラインの長さを変更した場合の周波
数特性を示す図である。FIG. 9 is a diagram showing frequency characteristics when the length of the air transmission line is changed.
１，２ 電子回路基板 １ａ，２ａ 端縁 ３ マイクロストリップライン ４ 接続部材 １１，２１ 空中伝送用ライン １２，２２ 高周波伝送ライン １５，２５ グランド面 １１ａ 空中伝送用ラインの先端 １６ａから１６ｃ パッド １７ ワイヤ １８ パッド １９ 終端コンデンサ ２０ スルーホール 1,2 electronic circuit board 1a, 2a Edge 3 microstrip line 4 connection members 11,21 Air transmission line 12,22 High frequency transmission line 15, 25 Ground plane 11a Tip of air transmission line 16a to 16c pads 17 wires 18 pads 19 Termination capacitor 20 through holes
Claims (9)
電子回路部材に高周波信号を伝送するための所定長さの
空中伝送用ラインが終端形成されていることを特徴とす
る電子回路部材。1. An air transmission line of a predetermined length for transmitting a high frequency signal to another electronic circuit member is formed along the edge of the substrate and in parallel with the edge. Electronic circuit member.
波伝送ラインが形成されていることを特徴とする請求項
１に記載の電子回路部材。2. The electronic circuit member according to claim 1, wherein a high frequency transmission line is formed at right angles to the aerial transmission line.
ターン形成されたストリップラインであることを特徴と
する請求項１または２に記載の電子回路部材。3. The electronic circuit member according to claim 1, wherein the aerial transmission line is a strip line patterned on the substrate.
グランドが形成されていないことを特徴とする請求項１
から３の何れか１項に記載の電子回路部材。4. The ground is not formed on the back surface side of the member of the aerial transmission line.
4. The electronic circuit member according to any one of 1 to 3.
ン長を延長するための複数のパッドが形成されているこ
とを特徴とする請求項１から４の何れか１項に記載の電
子回路部材。5. The electronic circuit according to claim 1, wherein a plurality of pads for extending the line length are formed at the end of the aerial transmission line. Element.
デンサが接続されていることを特徴とする請求項１から
５の何れか１項に記載の電子回路部材。6. The electronic circuit member according to claim 1, wherein a capacitor is connected to the end of the air transmission line.
は電子回路デバイスであることを特徴とする請求項１か
ら６の何れか１項に記載の電子回路部材。7. The electronic circuit member according to claim 1, wherein the electronic circuit member is an electronic circuit board or an electronic circuit device.
子回路部材が２つ１組で用いられる電子回路部材の連結
構造であって、 一方の前記電子回路部材の前記空中伝送用ラインが形成
された端縁と、他方の前記電子回路部材の前記空中伝送
用ラインが形成された端縁とが、平行でかつ近接するよ
うに当接していることを特徴とする電子回路部材の連結
構造。8. A structure for connecting electronic circuit members according to any one of claims 1 to 6, wherein the electronic circuit members are used in pairs, wherein one of the electronic circuit members is used for air transmission. An edge on which a line is formed and an edge on which the air transmission line of the other electronic circuit member is formed are in contact with each other in parallel and close to each other. Connection structure.
記電子回路部材が２つ１組で用いられる、伝送路の結合
構造であって、 一方の前記電子回路部材の前記空中伝送用ラインと、他
方の前記電子回路部材の前記空中伝送用ラインとが、平
行でかつ近接していることを特徴とする伝送路の結合構
造。9. A coupling structure of transmission lines, wherein two electronic circuit members according to any one of claims 1 to 6 are used in pairs, wherein one of the electronic circuit members is the aerial transmission. The transmission line coupling structure, wherein the transmission line and the aerial transmission line of the other electronic circuit member are parallel and close to each other.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001195576A JP2003017908A (en) | 2001-06-27 | 2001-06-27 | Electronic circuit member, and connection structure of the electronic circuit member and coupling structure for transmission line |
| PCT/JP2002/005550 WO2003003501A1 (en) | 2001-06-27 | 2002-06-05 | Electronic circuit member and linking structure for electronic circuit member and coupling structure for transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001195576A JP2003017908A (en) | 2001-06-27 | 2001-06-27 | Electronic circuit member, and connection structure of the electronic circuit member and coupling structure for transmission line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003017908A true JP2003017908A (en) | 2003-01-17 |
Family
ID=19033526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001195576A Pending JP2003017908A (en) | 2001-06-27 | 2001-06-27 | Electronic circuit member, and connection structure of the electronic circuit member and coupling structure for transmission line |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2003017908A (en) |
| WO (1) | WO2003003501A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7544897B2 (en) | 2004-08-05 | 2009-06-09 | Seiko Epson Corporation | Connecting substrate, connecting structure. connection method and electronic apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3965445A (en) * | 1975-02-03 | 1976-06-22 | Motorola, Inc. | Microstrip or stripline coupled-transmission-line impedance transformer |
| JPS6359101A (en) * | 1986-08-28 | 1988-03-15 | Matsushita Electric Ind Co Ltd | Microwave circuit connector |
| JPH04180402A (en) * | 1990-11-15 | 1992-06-26 | Nec Yamagata Ltd | Input/output circuit board |
| JP3961199B2 (en) * | 2000-07-14 | 2007-08-22 | 日本電工株式会社 | Ion exchange resin transfer container and ion exchange resin transfer device |
-
2001
- 2001-06-27 JP JP2001195576A patent/JP2003017908A/en active Pending
-
2002
- 2002-06-05 WO PCT/JP2002/005550 patent/WO2003003501A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7544897B2 (en) | 2004-08-05 | 2009-06-09 | Seiko Epson Corporation | Connecting substrate, connecting structure. connection method and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003003501A1 (en) | 2003-01-09 |
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