JPH04180402A - Input/output circuit board - Google Patents
Input/output circuit boardInfo
- Publication number
- JPH04180402A JPH04180402A JP2309707A JP30970790A JPH04180402A JP H04180402 A JPH04180402 A JP H04180402A JP 2309707 A JP2309707 A JP 2309707A JP 30970790 A JP30970790 A JP 30970790A JP H04180402 A JPH04180402 A JP H04180402A
- Authority
- JP
- Japan
- Prior art keywords
- input
- circuit board
- output circuit
- strip line
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 230000008878 coupling Effects 0.000 claims abstract description 4
- 238000010168 coupling process Methods 0.000 claims abstract description 4
- 238000005859 coupling reaction Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 abstract description 11
- 239000000919 ceramic Substances 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は入出力回路基板に関し、特にマイクロ波半導体
装置用のストリップラインを有する入出力回路基板に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an input/output circuit board, and particularly to an input/output circuit board having a strip line for a microwave semiconductor device.
従来の超高周波用入出力基板は、第４図に示すように、
裏面に導体層４を設けたセラミック基板３の表面にパタ
ーニングして設けたストリップライン１０ａ、１０ｂに
半田又は銀ペーストを用いてチップコンデンサ９を接合
し、ストリップラインｌｏａと１０ｂを直流的に遮断し
た構成を有していた。The conventional ultra-high frequency input/output board is as shown in Figure 4.
A chip capacitor 9 was bonded to strip lines 10a and 10b patterned on the surface of a ceramic substrate 3 with a conductor layer 4 on the back surface using solder or silver paste, and the strip lines loa and 10b were cut off in terms of direct current. It had a structure.
上述した従来の超高周波用入出力回路基板は、セラミッ
ク基板上に設けたストリップラインに直流を遮断するた
めのチップコンデンサを半田やＡｇペーストを用いて接
合しているため、半田やＡｇペーストがチップコンデン
サの下側に流れ込み、ストリップラインが短絡するとい
う問題点を有している。In the conventional ultra-high frequency input/output circuit board mentioned above, a chip capacitor for cutting off direct current is bonded to a strip line provided on a ceramic substrate using solder or Ag paste. This has the problem that it flows under the capacitor and short-circuits the strip line.
又、チップコンデンサの接合部が小さいため、精度良く
取付けることが難かしいという問題点もあった。Furthermore, since the joint portion of the chip capacitor is small, there is also the problem that it is difficult to mount the chip capacitor with high precision.
本発明の入出力回路基板は、超高周波半導体素子と外部
回路とを接続するための絶縁基板上に設けたストリップ
ラインを有する入出力回路基板において、前記ストリッ
プラインに接続して半波長側結合フィルタを構成するカ
ップルラインを備えている。The input/output circuit board of the present invention is an input/output circuit board having a strip line provided on an insulating substrate for connecting an ultra-high frequency semiconductor element and an external circuit, in which a half wavelength side coupling filter is connected to the strip line. It has a couple lines that make up the line.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は、本発明の第１の実施例の斜視
図及び平面図である。FIGS. 1(a) and 1(b) are a perspective view and a plan view of a first embodiment of the present invention.
第１図（ａ）、（ｂ）に示すように、裏面に導体層４を
設けたセラミック基板３の表面にストリップラインｌａ
、ｌｂの各先端に長さがそれぞれ半波長λ／４のカップ
ルライン２ａ、２ｂを間隔Ｓで互に対向させて設けた構
成を有している。As shown in FIGS. 1(a) and 1(b), a strip line la is formed on the surface of a ceramic substrate 3 with a conductor layer 4 provided on the back surface.
, lb have a configuration in which couple lines 2a and 2b each having a length of half a wavelength λ/4 are provided facing each other at an interval S.
第２図は本発明の入出力回路基板の実装状態を示す斜視
図である。FIG. 2 is a perspective view showing the state in which the input/output circuit board of the present invention is mounted.
第２図に示すように、半導体素子５の入出力端子のそれ
ぞれに入出力回路基板のストリップライン１ａを接続し
ている。As shown in FIG. 2, the input/output terminals of the semiconductor element 5 are connected to the strip lines 1a of the input/output circuit board, respectively.
第３図は本発明の第２の実施例の平面図である。FIG. 3 is a plan view of a second embodiment of the invention.
第３図に示すように、ストリップラインｌａ。As shown in FIG. 3, the strip line la.
１ｂにそれぞれ接続し且つ互に対向させて設けたカップ
ルライン７ａ、、７ｂを円弧状に形成した以外は第１の
実施例と同じ構成を有しており、この実施例は円弧状の
カップルライン７ａ、、７ｂの形成により入出力回路基
板の長さを短くてきるという利点がある。This embodiment has the same configuration as the first embodiment except that the couple lines 7a, 7b, which are connected to the respective terminals 1b and facing each other, are formed in an arc shape. The formation of 7a, 7b has the advantage that the length of the input/output circuit board can be shortened.
以上説明したように本発明は、入出力回路基板上に設け
たストリップラインの先端を互に対向させて設けた半波
長カップルラインを形成した構造にすることにより、従
来の直流遮断用に使用していたチップコンデンサを不用
とし、チップコンデンサ接合時の半田や銀ペーストの流
れ込みによる短絡を防止できるという効果を有する。As explained above, the present invention has a structure in which the tips of the strip lines provided on the input/output circuit board are opposed to each other to form a half-wavelength couple line, thereby eliminating the need for conventional DC blocking. This eliminates the need for chip capacitors, and has the effect of preventing short circuits caused by solder or silver paste flowing in when bonding chip capacitors.
第１図（ａ）、（ｂ）は本発明の第１の実施例の斜視図
及び平面図、第２図は本発明の入出力回路基板の実装状
態を示す斜視図、第３図は本発明の第２の実施例の平面
図、第４図は従来の入出力回路基板の一例を示す断面図
である。
１ａ、１ｂ・・・ストリップライン、２ａ、２ｂ・・カ
ップルライン、３・・・セラミック基板、４・・・導体
層、５・半導体チップ、７ａ、７ｂ・・・カップルライ
ン、９・・・チップコンデンサ、１０ａ、１０ｂ・・・
ストリップライン。FIGS. 1(a) and (b) are a perspective view and a plan view of the first embodiment of the present invention, FIG. 2 is a perspective view showing the mounting state of the input/output circuit board of the present invention, and FIG. FIG. 4 is a plan view of the second embodiment of the invention, and a sectional view showing an example of a conventional input/output circuit board. 1a, 1b... Strip line, 2a, 2b... Couple line, 3... Ceramic substrate, 4... Conductor layer, 5... Semiconductor chip, 7a, 7b... Couple line, 9... Chip Capacitor, 10a, 10b...
strip line.
Claims (1)
縁基板上に設けたストリップラインを有する入出力回路
基板において、前記ストリップラインに接続して半波長
側結合フィルタを構成するカップルラインを備えたこと
を特徴とする入出力回路基板。An input/output circuit board having a strip line provided on an insulating substrate for connecting an ultra-high frequency semiconductor element and an external circuit, comprising a couple line connected to the strip line to constitute a half-wavelength side coupling filter. An input/output circuit board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309707A JPH04180402A (en) | 1990-11-15 | 1990-11-15 | Input/output circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309707A JPH04180402A (en) | 1990-11-15 | 1990-11-15 | Input/output circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04180402A true JPH04180402A (en) | 1992-06-26 |
Family
ID=17996323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2309707A Pending JPH04180402A (en) | 1990-11-15 | 1990-11-15 | Input/output circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04180402A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003003501A1 (en) * | 2001-06-27 | 2003-01-09 | Fdk Corporation | Electronic circuit member and linking structure for electronic circuit member and coupling structure for transmission line |
-
1990
- 1990-11-15 JP JP2309707A patent/JPH04180402A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003003501A1 (en) * | 2001-06-27 | 2003-01-09 | Fdk Corporation | Electronic circuit member and linking structure for electronic circuit member and coupling structure for transmission line |
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