JP2003017837A5 - - Google Patents
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- Publication number
- JP2003017837A5 JP2003017837A5 JP2001196422A JP2001196422A JP2003017837A5 JP 2003017837 A5 JP2003017837 A5 JP 2003017837A5 JP 2001196422 A JP2001196422 A JP 2001196422A JP 2001196422 A JP2001196422 A JP 2001196422A JP 2003017837 A5 JP2003017837 A5 JP 2003017837A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- copper wiring
- film
- aqueous solution
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001196422A JP2003017837A (ja) | 2001-06-28 | 2001-06-28 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001196422A JP2003017837A (ja) | 2001-06-28 | 2001-06-28 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003017837A JP2003017837A (ja) | 2003-01-17 |
| JP2003017837A5 true JP2003017837A5 (enrdf_load_stackoverflow) | 2004-09-16 |
Family
ID=19034239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001196422A Pending JP2003017837A (ja) | 2001-06-28 | 2001-06-28 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003017837A (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5390979B2 (ja) * | 2009-08-01 | 2014-01-15 | ダイヤモンド電機株式会社 | 電動パワーステアリング用モータユニット及び電動パワーステアリング装置 |
| JP2011031756A (ja) * | 2009-08-01 | 2011-02-17 | Diamond Electric Mfg Co Ltd | 電動パワーステアリング用モータユニット及び電動パワーステアリング装置 |
| JP2011097038A (ja) | 2009-10-02 | 2011-05-12 | Ibiden Co Ltd | セラミック配線基板およびその製造方法 |
| CN102208352A (zh) * | 2010-03-29 | 2011-10-05 | 佑每佑科技股份有限公司 | 陶瓷镀铜基板制造方法及其结构 |
| JP2012114217A (ja) * | 2010-11-24 | 2012-06-14 | Nitto Denko Corp | 配線回路基板の製造方法 |
| CN103337587B (zh) * | 2013-06-14 | 2016-04-20 | 惠州市力道电子材料有限公司 | 一体化水冷直封大功率电子元件散热装置及其制造方法 |
| JP5987804B2 (ja) * | 2013-09-10 | 2016-09-07 | ウシオ電機株式会社 | 発光モジュール装置 |
| CN105899003B (zh) | 2015-11-06 | 2019-11-26 | 武汉光谷创元电子有限公司 | 单层电路板、多层电路板以及它们的制造方法 |
| KR102273696B1 (ko) * | 2019-11-29 | 2021-07-06 | 한국과학기술연구원 | 계면접착력이 우수한 회로 기판 및 이의 제조방법 |
| KR102398247B1 (ko) * | 2020-04-23 | 2022-05-17 | 한국과학기술연구원 | 용융염 티타나이징을 이용하여 제조한 질화물 회로 기판 및 이의 제조방법 |
| KR102315581B1 (ko) * | 2020-10-27 | 2021-10-22 | 한국과학기술연구원 | 소결이 억제된 티타늄 함유층을 포함하는 회로 기판 및 이의 제조방법 |
| EP3993575A1 (en) | 2020-10-27 | 2022-05-04 | Korea Institute of Science and Technology | Method for manufacturing circuit board including metal-containing layer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59167091A (ja) * | 1983-03-12 | 1984-09-20 | 松下電工株式会社 | 回路基板の製法 |
| JPH0726205B2 (ja) * | 1986-08-15 | 1995-03-22 | 松下電工株式会社 | 窒化アルミセラミック配線基板の製法 |
| JPH07150335A (ja) * | 1993-11-30 | 1995-06-13 | Mitsui Mining & Smelting Co Ltd | 基板の処理方法 |
| JP2000323618A (ja) * | 1999-05-07 | 2000-11-24 | Sumitomo Electric Ind Ltd | 銅回路接合基板及びその製造方法 |
-
2001
- 2001-06-28 JP JP2001196422A patent/JP2003017837A/ja active Pending
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