JP2003017368A - Method for manufacturing solid electrolytic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high capacity solid electrolytic capacitor which can be connected directly with a semiconductor component and exhibiting excellent high frequency characteristics. SOLUTION: One side of an aluminum foil 3 applied with a protective film 5 is rendered porous by etching along with the wall face of through holes and a dielectric coating 2 is formed on the part rendered porous and on the wall face of the through holes 4. Subsequently, a through hole electrode 7 is formed in the through hole 4, a current collector layer 8 is provided on a solid electrolytic layer 6, an opening 9 is made in the protective film 5 of the aluminum foil 3 and a connection terminal 10 is formed on the opening 9 and the exposed surface of the through hole 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid electrolytic capacitor used in various electronic devices.

[0002]

2. Description of the Related Art As a conventional solid electrolytic capacitor, one side or an intermediate core portion in the thickness direction of a porous valve metal sheet body made of aluminum or tantalum is used as an electrode portion, and A dielectric film is formed on the surface of the part, a solid electrolyte layer such as a functional polymer is provided on the surface, a collector layer is provided on the surface of the solid electrolyte layer, and an electrode made of metal is provided on the collector layer. A layer is provided to form a capacitor element, and this capacitor element is made into a single body or a laminated body, and then the electrode part or electrode layer of each capacitor element is connected together to the external terminals, and then the exterior is formed to expose the external terminals. Was configured.

[0003]

In the above-mentioned conventional solid electrolytic capacitor, a large capacity and an equivalent series resistance (hereinafter referred to as E
Although it can be lowered, it must be mounted on a circuit board via an external terminal like a general solid electrolytic capacitor.

In the solid electrolytic capacitor thus surface-mounted on the circuit board like the semiconductor component, the ESR and equivalent series inductance (hereinafter referred to as ESL) characteristics in a state where an actual circuit is formed have terminal lengths and wirings. It has a problem that it becomes large due to the existence of a long length and inferior in high frequency response.

In order to solve these problems, a solid electrolytic capacitor has been proposed in which both the positive and negative electrodes are arranged on the surface of the solid electrolytic capacitor and the components are directly mounted on the solid electrolytic capacitor to reduce the ESR and ESL.

An object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor which can be directly connected to a semiconductor component as described above and which can realize a large-capacity solid electrolytic capacitor excellent in high frequency response.

[0007]

In order to solve the above-mentioned problems, the invention according to claim 1 of the present invention is characterized in that after a through hole is provided at a predetermined position of an aluminum foil having a protective film formed on one surface thereof, The other surface of the aluminum foil and the wall surface of the through hole are made porous by etching, and a dielectric film is formed on the other surface of the aluminum foil and the wall surface of the through hole, and the dielectric film including the wall surface of the through hole. A solid electrolyte layer is formed on top of the solid electrolyte layer, and a collector layer is formed on the solid electrolyte layer and in the solid electrolyte layer in the through-hole, and then an opening is formed at a predetermined position of the protective film. Is a method of manufacturing a solid electrolytic capacitor in which a connection terminal is formed on the exposed surface of a hole and a through-hole, and can be directly connected to a semiconductor component and easily produce a high-frequency capacitor. Kill.

According to a second aspect of the present invention, the other surface of the aluminum foil having a protective film formed on one surface is made porous by etching, and then through holes are formed at predetermined positions, and the through holes are provided. The wall surface of at least the through hole is made porous by re-etching the same, and a dielectric film including a dielectric film formed on the wall surface of the through hole after forming a dielectric film on the porous portion. A solid electrolyte layer is formed on the solid electrolyte layer, and a current collector layer is formed on the solid electrolyte layer and in the solid electrolyte layer in the through hole, and an opening is formed at a predetermined position of the protective film. Is a method for manufacturing a solid electrolytic capacitor in which a connection terminal is formed on the opening of the through hole and the exposed surface of the through hole. Performed at became conditions, it is possible to prevent short circuit between the connection terminals by implementing an optimum through-hole wall face shape in order to increase the insulating properties of a dielectric film.

According to a third aspect of the present invention, an aluminum foil having a resist film formed on a protective film is used, and the resist film is removed after the collector layer is formed. A method for manufacturing an electrolytic capacitor, which can prevent a solid electrolyte from being formed on the other surface of the aluminum foil which is not made porous and can prevent a short circuit between the connection terminals formed on the surface of the protective film.

According to a fourth aspect of the present invention, after forming a dielectric film, a resist film is formed on the entire surface of the surface layer on which the protective film is formed, and then a solid electrolyte layer is formed on the dielectric film including the inside of the through hole. The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein the resist film is removed.
It is possible to prevent the solid electrolyte from being formed on one surface of the aluminum foil which is not made porous and to prevent a short circuit between the connection terminals formed on the surface of the protective film.

According to a fifth aspect of the present invention, the through hole electrode is formed in the solid electrolyte layer formed in the through hole, and then the current collector layer is formed on the solid electrolyte layer.
The method for manufacturing a solid electrolytic capacitor as described in any one of 1 to 3, wherein the through-hole electrode and the current collector layer can be reliably joined and ESR can be reduced.

The invention according to claim 6 uses any one of an epoxy resin, a polyimide resin, a silicon resin, an acrylic resin and a phenol resin as a protective film.
The method for producing a solid electrolytic capacitor as described in any one of 1 above, wherein the function can be maintained without being deteriorated when the aluminum foil is etched, the dielectric film is formed, or the solid electrolyte is formed in the subsequent step.

The invention according to claim 7 is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 4, wherein either a photosensitive resin or an organic film having adhesiveness is used as the resist film. Therefore, it is possible to form a hole at a position corresponding to the through hole by patterning or to prevent the resist from penetrating into the through hole, so that the solid electrolyte layer can be surely formed at a predetermined portion.

The invention according to claim 8 uses any one of a dipping method, a spin coater method, a screen printing method and a film adhesion method as a method for forming a protective film and a resist film.
The method for producing a solid electrolytic capacitor as described in any one of 1 to 4, wherein the resist layer can be reliably formed on the protective layer by selecting an optimum forming method depending on the resist used.

The invention according to claim 9 uses any one of a laser machining method, a punching machining method, a drill machining method and an electric discharge machining method as a method of forming a through hole. According to the method for producing a solid electrolytic capacitor described above, it is possible to inexpensively and highly accurately form a hole by selecting the optimum hole processing depending on the through hole diameter and the number of holes.

The invention according to claim 10 is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 4, wherein the edge of the through hole on the surface on which the dielectric film is formed is chamfered. Insulation defects can be reduced.

The invention according to claim 11 uses a conductive adhesive as a method for forming a through-hole electrode.
In the method for producing a solid electrolytic capacitor described in (1), the resistance value of the through-hole electrode can be reduced and the anion-anode separation can be completed.

The invention according to claim 12 is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 4, wherein either a laser processing method or a grinding method is used as a method for forming the opening. By optimizing the laser output, the opening can be formed easily and with high accuracy.

The thirteenth aspect of the present invention is the method for producing a solid electrolytic capacitor according to any one of the first to fourth aspects, in which a conductive adhesive is used as a method for forming the connection terminal, and the productivity is improved. It can be excellent.

The invention according to claim 14 is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 4, wherein either electroplating or electroless plating is used as a method for forming the connection terminal. Therefore, the forming process is easy, and a large number of connection terminals can be formed with high homogeneity at one time.

According to a fifteenth aspect of the present invention, a composition containing a pi-electron conjugated polymer and / or another conductive polymer is used as a material for forming the solid electrolyte layer.
4 is a method for manufacturing a solid electrolytic capacitor according to any one of 4 to 4, which has excellent heat resistance and can reduce ESR.

According to a sixteenth aspect of the present invention, as a method for forming a solid electrolyte, chemical polymerization of a conductive polymer, and /
Alternatively, it is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 4, which uses electrolytic polymerization, and can be made easier in a forming process and more excellent in productivity.

According to a seventeenth aspect of the present invention, as a method for forming a solid electrolyte, a suspension of a conductive polymer powder is applied and dried, and then the conductive polymer is electrolytically polymerized to form a solid electrolyte. The method for manufacturing a solid electrolytic capacitor as described in any one of 1 to 4, wherein stress on the dielectric film can be further reduced.

The invention according to claim 18 is a method for producing a solid electrolytic capacitor according to any one of claims 1 to 4, wherein manganese nitrate is thermally decomposed to form manganese dioxide as a method for forming a solid electrolyte. Therefore, it can be reliably produced with the established technology.

The invention according to claim 19 is a method for forming a solid electrolyte, which is formed by thermally decomposing manganese nitrate to form manganese dioxide and then electrolytically polymerizing a conductive polymer. According to the method for producing a solid electrolytic capacitor described in any one of the above, it is possible to reliably produce a low ESR capacitor with the established technology.

The invention according to claim 20 is a solid electrolytic capacitor according to any one of claims 1 to 4, wherein a suspension of carbon fine particles and a conductive adhesive are used as a method for forming a current collector. In the manufacturing method, the current collector layer has a laminated structure of carbon fine particles and a conductive adhesive, so that the contact resistance with the solid electrolyte layer is reduced, the ESR is low, and the capacitor capacitance is efficiently used in the current collector layer. Can be withdrawn.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a solid electrolytic capacitor of the present invention will be described below with reference to embodiments and drawings.

(Embodiment 1) The invention described in claims 1, 6, and 8 to 20 will be described with reference to Embodiment 1 of the present invention and FIGS.

FIG. 1 is a perspective view of a solid electrolytic capacitor according to Embodiment 1 manufactured by the method of the present invention,
FIG. 2 is a sectional view of the same, and FIG. 3 is an enlarged sectional view of the main part.

In FIGS. 1, 2, and 3, reference numeral 1 is a sheet-shaped capacitor element, which is a protective film 5 on the aluminum foil 3.
After forming, the through hole 4 is formed at a predetermined position. One side of this aluminum foil 3 and through hole 4
The wall surface of is made porous by etching. The dielectric film 2 is formed on one surface of the porous aluminum foil 3 and the wall surface of the through hole 4. Next, the dielectric coating 2
The solid electrolyte layer 6 is provided on the above, and then the current collector layer 8 is provided so as to fill the top of the solid electrolyte layer 6 and the inside of the through hole 4.

Next, an opening 9 is formed at a predetermined position of the protective film 5 of the aluminum foil 3, and the opening 9 of the protective film 5 is formed.
On the exposed surface of and the exposed surface of the through hole 4
Are manufactured by forming. The exterior 11 is formed on the side surface of the capacitor element 1 and the surface of the current collector layer 8 configured as described above, and the first external terminal 12 and the current collector electrically connected to the aluminum foil 3 are formed on the exterior 11. The second external terminal 13 electrically connected to the body layer 8 is formed, and the connection bump 14 is formed on the connection terminal 10 to form a solid electrolytic capacitor.

Next, a method of manufacturing the solid electrolytic capacitor of the present invention will be described with reference to FIGS.

As shown in FIG. 4, a protective film 5 is formed on one surface of the aluminum foil 3. This is formed by using an epoxy resin, a polyimide resin, a silicon resin, an acrylic resin, or a phenol resin by an optimal method according to the material such as a coating method or film adhesion. As a coating method, various methods such as dipping, spin coater, screen printing and film adhesion can be selected.

Next, as shown in FIG. 5, a through hole 4 is formed at a predetermined position of the aluminum foil 3 having the protective film 5 formed thereon. The through hole 4 can be formed at low cost and with high dimensional accuracy by selecting the optimum method from among the laser processing method, punching processing method, drilling method and electric discharge processing method depending on the through hole diameter, the number of holes and the like. it can.
Although not always necessary, the insulation reliability of the dielectric film 2 can be improved by forming a chamfered portion on the edge of the through hole 4 on the other surface on which the protective film 5 is formed by wet etching or the like.

Next, as shown in FIG. 6, the through hole 4
The dielectric film 2 is also formed on the other surface and the wall surface of the through-hole 4 by making the other surface of the aluminum foil 3 and the wall surface of the through-hole hole 4 porous and then anodizing in a chemical conversion solution. .

Next, as shown in FIG. 7, a solid electrolyte layer 6 is formed on the other surface of the aluminum foil 3 and the dielectric film 2 formed on the wall surface of the through hole 4. As a forming method, a conductor polymer layer is formed by chemically or electrolytically polymerizing a composition containing a pi-electron conjugated polymer such as polypyrrole or polythiophene and a conductive polymer other than this.
The conductive polymer layer may be pre-coated by chemical polymerization and then electrolytically polymerized, or may be formed only by chemical polymerization, or a suspension of conductive polymer powder may be applied and dried, followed by electrolytic polymerization. Alternatively, manganese nitrate may be impregnated and then thermally decomposed to form manganese dioxide, and then the conductive polymer may be electrolytically polymerized. A fully established technology is the method of pyrolyzing manganese nitrate to form manganese dioxide, which aims to improve productivity and reliability by providing a precise and freely controllable thickness. Is possible.

Next, as shown in FIG. 8, the aluminum foil 3
A current collector layer 8 is formed on the other surface and on the solid electrolyte layer 6 formed on the wall surface of the through hole 4. The current collector layer 8 uses a suspension of carbon fine particles and a conductive adhesive, and has a laminated structure of a carbon layer and a silver paste layer, so that electric charges can be more efficiently extracted than the conductive polymer layer or manganese dioxide. Is. At this time, the current collector layer 6 formed so as to fill the through hole 4 serves as a current collector and a through hole electrode.

Next, as shown in FIG. 9, an opening 9 is formed at a predetermined position of the protective film 5 by a processing method such as a YAG laser, a carbon dioxide gas laser, an excimer laser or a grinder.
At this time, the current collector layer 6 formed on the wall surface of the through hole 4
In the case where the protective film 5 is excessively protruded, it may be removed in the same manner to surely form the space for forming the connection terminal 10.

In addition, before forming the protective film 5, a resist portion is formed at a predetermined position to form an opening on the non-porous surface of the aluminum foil 3, and after forming the current collector 8, the resist portion is formed. It is also possible to form the opening 9 by a method of peeling.

After that, as shown in FIG. 10, using a conductive adhesive, electroplating, or electroless plating,
The connection terminal 10 is formed on the opening 9 of the protective film 5 and the exposed surface of the through hole 4.

As the conductive adhesive, there is a mixture of low resistance metal powder and an adhesive, and its function can be achieved by heat curing or ultraviolet curing.

Further, as shown in FIG. 11, in order to improve the reliability by protecting the periphery of the capacitor element 1 from electrical insulation, moisture resistance and external stress, the exterior 11 is made of epoxy resin.
To form.

Subsequently, as shown in FIG. 12, a first external terminal 12 electrically connected to the aluminum foil 3 and a second external terminal electrically connected to the current collector layer 8 are provided on the outer package 11. By forming the terminal 13, a finished capacitor element is obtained. Although the above-mentioned configuration functions, the connection bump 14 is formed on the connection terminal 10 as shown in FIG. 13 in order to improve the connection reliability with the electrode of the semiconductor component or the electronic component connected to the capacitor portion. It is desirable to do.

By manufacturing a solid electrolytic capacitor by such a method, it is possible to directly manufacture a solid electrolytic capacitor having excellent high frequency response because it can be directly connected to a semiconductor component.

(Embodiment 2) The invention according to claims 3 and 7 will be described with reference to Embodiment 2 of the present invention and FIG.

As shown in FIG. 14, after forming the protective film 5 on one surface of the aluminum foil 3, a resist film 15 is formed on the entire surface of the protective film 5. After that, the through hole 4 is formed at a predetermined position as in the first embodiment. One surface of the aluminum foil 3 and the wall surface of the through hole 4 are made porous by etching. The dielectric coating 2 is formed on this porous portion. Next, the solid electrolyte layer 6 is provided on the dielectric coating 2, and then the current collector layer 8 is formed on the solid electrolyte layer 6 formed on the other surface of the aluminum foil 3 and on the wall surface of the through hole 4. Formed in layer 6.

After that, the resist film 15 is peeled off, so that the solid electrolyte layer 6 and the current collector layer 8 formed in the through hole 4 are not formed on one surface of the aluminum foil 3. After that, as in the first embodiment, the opening 9 is formed at a predetermined position of the protective film 5 of the aluminum foil 3,
It is manufactured by forming the connection terminal 10 on the opening 9 of the protective film 5 and the exposed surface of the through hole 4. The outer surface 11 is formed on the side surface of the capacitor element 1 and the surface of the current collector layer 8 configured as described above, and the first external terminal 1 electrically connected to the aluminum foil 3 is formed on the outer surface 11.
2 and the second external terminal 13 electrically connected to the current collector layer 8 are formed, and then the connection bump 1 is formed on the connection terminal 10.
4 to form a solid electrolytic capacitor.

As described above, since the resist film 15 has the solid electrolyte layer 6 and the current collector layer 8 formed on the protective film 5 through the through-holes 4, the connection formed on the protective film 5 is made. Effective for preventing short circuit between terminals. As the resist film 15 used at this time, either a photosensitive resin or an organic film having an adhesive property is used, and is formed in the same manner as the protective film 5.

As described above, according to the method for manufacturing a solid electrolytic capacitor of the second embodiment, positive electrode separation is prevented by preventing the solid electrolyte layer 6 and the current collector layer 8 from wrapping over the protective film 5 through the through-holes 4. Can be reliably performed.

(Embodiment 3) The invention according to claim 4 will be described with reference to Embodiment 3 of the present invention and FIG.

As in the first embodiment, the aluminum foil 3
After forming the protective film 5 on one side of the above, the through hole 4 is formed at a predetermined position. The other surface of the aluminum foil 3 and the wall surface of the through hole 4 are made porous by etching. The dielectric coating 2 is formed on this porous portion.

Thereafter, as shown in FIG. 15, a resist film 15 is formed on the entire surface of the protective film 5. Next, the first embodiment
Similarly to the above, the solid electrolyte layer 6 is formed on the dielectric coating 2.

Then, the resist film 15 is peeled off. Then, similarly to the first embodiment, a current collector layer 8 is formed on the solid electrolyte layer 6 formed on the other surface of the aluminum foil 3 and in the solid electrolyte layer 6 formed in the through hole 4. After that, the opening 9 is formed at a predetermined position of the protective film 5 of the aluminum foil 3, and the connection terminal 10 is formed on the opening 9 of the protective film 5 and the exposed surface of the through hole 4. The exterior 11 is formed on the side surface of the capacitor element 1 and the surface of the current collector layer 8 configured as described above, and the first external terminal 12 and the current collector electrically connected to the aluminum foil 3 are formed on the exterior 11. The second external terminal 13 electrically connected to the body layer 8 is formed, and the connection bump 14 is formed on the connection terminal 10 to form a solid electrolytic capacitor.

The resist film 15 can prevent the solid electrolyte layer 6 and the current collector layer 8 from being formed on the protective film 5 through the through-holes 4, and the connection terminals between the connecting terminals formed on the protective film 5 can be prevented. Effective for short circuit prevention. Further, it is preferable to use an organic film having adhesiveness as the resist film 15 since the influence of clogging of the through hole 4 is small.

As described above, the aluminum foil 3 to be formed later by the method of manufacturing the solid electrolytic capacitor according to the third embodiment.
It is possible to prevent the solid electrolyte layer 6 and the current collector layer 8 from wrapping around the opening 9 and positively separate the cathode and cathode.

(Embodiment 4) The invention according to claim 5 will be described with reference to Embodiment 4 and FIG. First, as in the first embodiment, the protective film 5 is formed on one surface of the aluminum foil 3, and then the through hole 4 is formed at a predetermined position. The other surface of the aluminum foil 3 and the wall surface of the through hole 4 are made porous by etching. The dielectric coating 2 is formed on the other surface of the aluminum foil 3 and the portion where the wall surface of the through hole 4 is made porous. Next, the solid electrolyte layer 6 is provided on the dielectric coating 2.

After that, as shown in FIG. 16, the through-hole electrode 7 is formed in the through-hole 4. Through-hole electrode 7
A method of filling a conductive adhesive mixed with low-resistance metal particles such as Ag paste or Cu paste as an electrode material for forming the film and then curing the same can be used. In this way, by blocking the holes of the through-holes 4 with the through-hole electrodes 7, it is possible to prevent a short circuit between the connection terminals 10 via the through-holes 4.

After that, the current collector layer 8 is formed in the same manner as in the first embodiment, the opening 9 is formed at a predetermined position of the protective film 5 of the aluminum foil 3, and the connection terminal is formed on the exposed surface of the opening 9. It is manufactured by forming 10. The exterior 11 is formed on the side surface of the capacitor element 1 and the surface of the current collector layer 8 configured as described above, and the first external terminal 12 and the current collector electrically connected to the aluminum foil 3 are formed on the exterior 11. The second external terminal 13 electrically connected to the body layer 8 is formed, and the connection bump 14 is formed on the through-hole electrode 7 and the connection terminal 10 to form a solid electrolytic capacitor.

By manufacturing the solid electrolytic capacitor by such a method, it is possible to ensure the electrical connection between the through-hole electrode 7 and the current collector layer 8, reduce the ESR, and produce the solid electrolytic capacitor having excellent reliability. You can

(Embodiment 5) The invention according to claim 2 will be described with reference to Embodiment 5 of the present invention and FIGS.

First, as in the first embodiment, the protective film 5 is formed on one surface of the aluminum foil 3.

Next, as shown in FIG. 17, the other surface of the aluminum foil 3 is subjected to etching treatment to make it porous so that the first porous portion 16 is formed.

Then, as shown in FIG. 18, the through hole 4 is formed at a predetermined position of the aluminum foil 3 having the protective film 5 formed thereon.
To form.

Further, as shown in FIG. 19, the wall surface of the through hole 4 is subjected to an etching treatment to make it porous so that the first porous portion 17 is formed. In this way, by changing the degree of porosity between the other surface of the aluminum foil 3 and the wall surface of the through hole 4, it is possible to realize an optimal porous shape of the through hole wall surface in order to ensure the insulation, and thus the connection terminal 10
Insulation reliability can be improved by preventing a short circuit between them.

Thereafter, in the same manner as in the first embodiment, the dielectric coating 2 is formed on the first and second porous portions by chemical conversion treatment. Next, a solid electrolyte layer 6 is provided on the dielectric coating 2, and then a current collector layer 8 is formed on the solid electrolyte layer 6 formed on the other surface of the aluminum foil 3 and in the solid electrolyte layer 6 in the through hole 4. Form. After that, the opening 9 is formed at a predetermined position of the protective film 5 of the aluminum foil 3, and the connection terminal 10 is formed on the opening 9 of the protective film 5 and the exposed surface of the through hole 4. The exterior 11 is formed on the side surface and the surface of the current collector layer 8 of the thus configured capacitor element 1, and the first external terminal 12 electrically connected to the aluminum foil 3 is further provided on the exterior 11.
And the 2nd external terminal 13 electrically connected with the collector layer 8 is formed, and the connection bump 14 is formed on the connection terminal 10, and it is set as a solid electrolytic capacitor.

By manufacturing the solid electrolytic capacitor by such a method, the insulation in the through hole 4 can be surely realized, and the solid electrolytic capacitor having high reliability can be manufactured.

[0067]

As described above, according to the method for producing a solid electrolytic capacitor of the present invention, a large capacity solid electrolytic capacitor having excellent high frequency characteristics and high reliability can be easily produced by directly connecting to a semiconductor component. it can.

[Brief description of drawings]

FIG. 1 is a perspective view of a solid electrolytic capacitor according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is an enlarged cross-sectional view of the relevant part.

FIG. 4 is a cross-sectional view of a state in which a protective film is formed on one surface of the aluminum foil.

FIG. 5 is a cross-sectional view of the aluminum foil with through holes formed therein.

FIG. 6 is a sectional view showing a state in which a dielectric film is formed on the other surface of the aluminum foil and the wall surface of the through hole.

FIG. 7 is a sectional view showing a state in which a solid electrolyte layer is formed on the dielectric film.

FIG. 8 is a cross-sectional view showing a state where a current collector layer is formed on the solid electrolyte layer.

FIG. 9 is a cross-sectional view showing a state in which an opening is formed in the protective film.

FIG. 10 is a cross-sectional view showing a state in which a connection terminal is formed on the opening and the through hole.

FIG. 11 is a cross-sectional view showing a state in which an exterior is formed on the capacitor element.

FIG. 12 is a cross-sectional view showing a state in which external terminals are formed on the same exterior.

FIG. 13 is a cross-sectional view showing a state where connection bumps are formed on the same exterior.

FIG. 14 is a sectional view showing a state in which a resist film is formed on the protective film according to the second embodiment of the present invention.

FIG. 15 is a cross-sectional view of a state in which a resist film is formed on the entire surface layer of the protective film according to the third embodiment of the present invention.

FIG. 16 is a sectional view showing a state in which a through-hole electrode is formed in the through-hole according to the fourth embodiment of the present invention.

FIG. 17 is a cross-sectional view of a state in which the other surface of the aluminum foil according to the fifth embodiment of the present invention is etched.

FIG. 18 is a sectional view showing a state where through holes are formed in the aluminum foil.

FIG. 19 is a cross-sectional view showing a state where the wall surface of the through hole is etched.

[Explanation of symbols]

1 Capacitor element 2 Dielectric film 3 aluminum foil 4 Through hole 5 protective film 6 Solid electrolyte layer 7 Through-hole electrode 8 Current collector layer 9 openings 10 connection terminals 11 Exterior 12 First external terminal 13 Second external terminal 14 connection bump 15 Resist film 16 First porous part 17 Second porous part

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01G 9/04 304 H01G 9/02 331H 321 9/05 H G (72) Inventor Shin Nakano 1006 Kadoma, Kadoma City, Osaka Prefecture Address Matsushita Electric Industrial Co., Ltd. (72) Inventor Ryo Kimura 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Tatsuo Fujii, Kazoma 1006, Kadoma City, Osaka

Claims (20)

[Claims] 1. After forming a through hole at a predetermined position of an aluminum foil having a protective film formed on one surface, the other surface of the aluminum foil and the wall surface of the through hole are made porous to make the porous. Dielectric film is formed on the other surface and the wall surface of the through hole, and the solid electrolyte layer is formed on the dielectric film including the wall surface of the through hole and at the same time on the solid electrolyte layer and in the solid electrolyte layer inside the through hole. A method for producing a solid electrolytic capacitor, comprising forming a current collector layer, then forming an opening at a predetermined position of a protective film, and forming a connection terminal on the opening of the protective film and the exposed surface of the through hole. 2. An aluminum foil having a protective film formed on one side is made porous by etching the other side, and then a through hole is formed at a predetermined position, and the through hole is re-etched. As a result, at least the wall surface of the through hole is made porous, and a dielectric film is formed on this porous portion, and then a solid electrolyte layer is formed on the dielectric film including the dielectric film formed on the wall surface of the through hole. Then, a current collector layer is formed on the solid electrolyte layer on the solid electrolyte layer and in the through hole, and an opening is formed at a predetermined position of the protective film. A method for manufacturing a solid electrolytic capacitor in which a connection terminal is formed on the exposed surface. 3. The method for producing a solid electrolytic capacitor according to claim 1, wherein an aluminum foil having a resist film formed on a protective film is used, and the resist film is removed after the collector layer is formed. 4. After forming the dielectric film, a resist film is formed on the entire surface of the surface layer on which the protective film is formed, and then a solid electrolyte layer is formed on the dielectric film including the inside of the through holes, and the resist film is removed. A method for manufacturing the solid electrolytic capacitor according to claim 1. 5. The solid electrolysis according to claim 1, wherein a through hole electrode is formed in the solid electrolyte layer formed in the through hole, and then a current collector layer is formed on the solid electrolyte layer. Capacitor manufacturing method. 6. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of epoxy resin, polyimide resin, silicon resin, acrylic resin, and phenol resin is used as the protective film. 7. A photosensitive resin or an organic film having adhesiveness is used as the resist film.
4. The method for manufacturing the solid electrolytic capacitor as described in any one of 4 above. 8. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of dipping, spin coater, screen printing and film adhesion is used as a method for forming the protective film and the resist film. 9. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of a laser processing method, a punching processing method, a drill processing method and an electric discharge processing method is used as a method of forming a through hole. Method. 10. The method for producing a solid electrolytic capacitor according to claim 1, wherein the edge of the through hole on the surface on which the dielectric film is formed is chamfered. 11. The method for producing a solid electrolytic capacitor according to claim 5, wherein a conductive adhesive is used as a method for forming the through-hole electrode. 12. The method for manufacturing a solid electrolytic capacitor according to claim 1, wherein a laser processing method or a grinding method is used as a method for forming the opening. 13. The method for producing a solid electrolytic capacitor according to claim 1, wherein a conductive adhesive is used as a method for forming the connection terminal. 14. The method for producing a solid electrolytic capacitor according to claim 1, wherein either electroplating or electroless plating is used as a method of forming the connection terminal. 15. The solid electrolytic capacitor according to claim 1, wherein a composition containing a pi-electron conjugated polymer and / or a conductive polymer other than this is used as a material for forming the solid electrolyte layer. Production method. 16. The method for producing a solid electrolytic capacitor according to claim 1, wherein chemical polymerization and / or electrolytic polymerization of a conductive polymer is used as a method for forming a solid electrolyte. 17. The method for forming a solid electrolyte according to claim 1, wherein a conductive polymer powder suspension is applied and dried, and then the conductive polymer is electrolytically polymerized. The method for producing a solid electrolytic capacitor as described in 1. 18. The method for producing a solid electrolytic capacitor according to claim 1, wherein manganese nitrate is pyrolyzed to form manganese dioxide as a method for forming a solid electrolyte. 19. The method for forming a solid electrolyte according to claim 1, wherein manganese nitrate is thermally decomposed to form manganese dioxide, and then a conductive polymer is electrolytically polymerized. Manufacturing method of solid electrolytic capacitor. 20. A suspension of carbon fine particles and a conductive adhesive are used as a method for forming a current collector.
4. The method for manufacturing the solid electrolytic capacitor as described in any one of 4 above.