JP2003007650A - Dicing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dicing machine which will not peel off a dicing sheet from a frame, due to the grinding water pressure during dicing in a dicing work for dividing a work adhered to the frame via the dicing sheet into individual chips. SOLUTION: A frame holder 32 for mounting a frame F is provided in a ring shape on a cutting table 30 of the dicing machine, so as to support the entire periphery of the frame F with a flat part 32A of its upside. Thus the flat part 32A of the frame holder 32 holds the entire periphery of a dicing sheet S, sufficient for blocking the dicing sheet S from being peeled off the frame F, if the pressure of grinding water acts to peel the dicing sheet S off the frame F.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing machine, and more particularly to a dicing machine for cutting wafers (workpieces) such as semiconductors into a grid pattern.

[0002]

2. Description of the Related Art A dicing machine is an apparatus for cutting a work (semiconductor wafer or the like) into individual chips by rotating a rotary blade (blade) at high speed.

As shown in FIG. 1, the work is a dicing sheet S having a rigid frame F and an adhesive on one surface.
The work W is attached integrally with the dicing sheet S and the frame F via the, and is put into the dicing device in this state. In the dicing apparatus, as shown in FIG. 5, the work W is placed on the cutting table 30 and the rotating blade 21 rotating at a high speed and the cutting direction (X
(Direction) feed and Y-direction index feed of the rotary blade 21 cuts all streets in one direction (CH
1 cutting). Next, the work W is moved 90 degrees by the θ rotation unit 35.
It is rotated once, and similarly, all streets in the direction perpendicular to the CH1 direction are cut (CH2 cutting). During cutting, cooling water is supplied from the cooling water nozzle 22. By the way, the thickness of the frame F to which the work W is integrally attached is generally 1.5 mm in the case of a stainless steel frame and 3 mm in the case of a resin frame, which is thicker than the semiconductor wafer which is the work. Therefore, when the work W is fully cut, it may interfere with the rotary blade 21. In particular, in the case of a dual spindle type dicing device in which two spindles with rotary blades attached to the tips are arranged opposite to each other in the Y direction, whichever is the case depending on the arrangement of the two spindles in the Y direction and the cutting sequence. It may happen that the rotary blade interferes with the frame. Therefore, as shown in FIGS. 5 and 6, the cutting table 30 has pedestals 50, 5 for mounting the frames F provided at four locations on the circumference.
The upper surfaces 50A, 50A, ... Of 0, ... Are located one step lower than the upper surface of the suction plate 31 of the cutting table 30. Here, when the work W is placed on the cutting table 30, the work W portion is sucked and fixed by the suction plate 31 of the cutting table 30, and the frame F portion is placed on the pedestal 50 while stretching the dicing sheet S. Then, the frame is fixed by the frame clamper 34 attached to the rotary cylinder 33 provided on each pedestal. The work W placed on the cutting table 30 in this manner is subjected to CH1 cutting and CH2 cutting as described above without the rotary blade 21 and the frame F interfering with each other.
It is cut and cut into individual chips.

[0004]

As described above, when the work W is cut into individual chips at the processing portion, the dicing sheet S is stretched and fixed to the cutting table 30. Cooling water is supplied to the work W and the rotary blade 21, and the cooling water is accelerated by the rotary blade 21 and sprayed onto the dicing sheet S. The pressure of the cooling water sprayed on the dicing sheet S causes the dicing sheet S to move to the frame F.
Work to peel it off. Furthermore, the dicing sheet S is
Since it is stretched and has tension as described above, it is even easier to peel off.

However, since the portion of the dicing sheet S attached to the frame F is supported by the receiving table upper surface 50A of the receiving table 50, the dicing sheet S is not peeled off here.

However, as shown in FIG. 6, the pedestal 50 is provided only at four positions on the circumference, and the frame F is not supported at other portions. Therefore, in the portion not supported by the upper surface 50A of the pedestal, as shown in FIG. A phenomenon occurs in which the dicing sheet S is sprayed near the boundary and peeled off from the frame F. If the dicing sheet S is peeled off, it will hinder the subsequent transportation and spin cleaning, and also hinder the chip mounting process subsequent to the dicing process.

The present invention has been made in view of the above circumstances, and provides a dicing machine in which the dicing sheet S is not peeled off from the frame F by water pressure during dicing.

[0008]

In order to achieve the above-mentioned object, the present invention is a dicing apparatus for dividing a work adhered to a frame through a dicing sheet into individual chips, and processing the work. In a dicing machine having a rotary blade, a nozzle for supplying cooling water to the work and the rotary blade, and a cutting table for mounting the work, the cutting table is a suction plate for suction-mounting a portion of the work and the frame. And a frame receiver for mounting the part of the frame receiver, and the frame receiver has a ring shape,
It is characterized in that the upper surface is formed so as to hold the frame over the entire circumference.

According to the present invention, since the frame portion is supported on the upper surface of the ring-shaped frame receiver without being circumferentially chipped, the dicing sheet can be peeled off from the frame by the pressure of the cooling water. Absent.

The present invention further provides that the upper surface of the frame support is
When a frame to which a work is adhered is placed via the dicing sheet, it has a flat portion that supports the frame portion and an inclined surface that is continuous with the flat portion toward the inside of the flat portion along the dicing sheet. It is characterized by doing.

According to this further invention, the frame portion of the dicing sheet is supported by the flat portion of the ring-shaped frame receiving upper surface, and the portion inside the frame is also the inclined surface of the frame receiving upper surface. Since it is supported, the support becomes stronger and the dicing sheet can be prevented from being peeled off from the frame.

[0012]

DETAILED DESCRIPTION OF THE INVENTION A dicing apparatus according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 2 is a front view of the dicing apparatus 10 according to the embodiment of the present invention, and FIG. 3 is a plan view of the cutting table 30. Note that FIG. 3 shows the cutting table 30 in a state where the frame F to which the work W is attached via the dicing sheet S is not placed. As shown in FIGS. 2 and 3, in the dicing device 10, the spindle 23 having the rotary blade 21 at the tip is arranged and index-fed in the Y direction. It is cut and fed in the direction. The rotary blade 21 is covered with a flange cover 24 except the front surface and the lower surface thereof. The flange cover 24 has two nozzles 22 and 22 for supplying cooling water to the rotary blade 21 and the work W. It is attached so as to sandwich the rotary blade 21 from the front and rear.

The cutting table 30 is the X table 4
0 is provided on the θ rotation part 35 for rotating the work W in the θ direction, a suction plate 31 provided on the θ rotation part 35 for adsorbing and fixing the work W, and a portion of the frame F. And a ring-shaped frame receiver 32 to be placed. The flat portion 32A on the upper surface of the frame receiver 32 is formed at a position lower than the upper surface of the suction plate 31 by about 3 mm, and the rotary blade 21 does not interfere with the frame F when the work W is placed and fixed on the cutting table 30. It is like this. When the work W is placed and fixed, the work W is placed on the suction plate 31 of the cutting table 30 and is pressed against the upper flat portion 32A of the frame receiver 32 while pushing the frame F downward. The rotary cylinders 33, 33, ... Provided at the four circumferential side surfaces are operated to fix the frame F by the frame clampers 34 attached to the rotary cylinders 33.

The frame F, to which the work W is integrally attached via the dicing sheet S, is held on the entire circumference in this manner without being chipped, so that the work W is
In cutting, the dicing sheet S is not peeled off from the frame F due to the pressure of the cooling water.

FIG. 4 shows another example of the embodiment of the present invention. As shown in FIG. 4, when the frame F to which the work W is attached is placed via the dicing sheet S, the flat portion 32A for receiving the portion of the frame F and the flat portion 32A on the upper surface of the ring-shaped frame receiver 32. An inclined surface 32B, which is continuous with the flat portion 32A in the previous period and extends along the dicing sheet S, is formed upward inward.

Since the dicing sheet S is held in this way, the supporting force against the downward force is further strengthened, and the dicing sheet S is peeled from the frame F due to the pressure of water when the work W is processed. It is even more effective.

In the above-described embodiment of the present invention, the height direction position of the flat portion 32A on the upper surface of the frame receiver 32 is formed at a position lower than the upper surface of the suction plate 31 by about 3 mm. Is the size of frame F, work W
And the thickness and material of the dicing sheet are appropriately selected.

Further, the flat portion 32A and the upper surface of the suction plate 31 may be formed at the same height. In this case, the inclined surface 32B shown in the other example of the embodiment may be an extended surface of the flat portion 32A without being inclined.

[0020]

As described above, according to the dicing machine of the present invention, the frame portion of the dicing sheet, which integrally attaches the work and the frame, is a ring-shaped frame receiver and is entirely on the circumference. Since it is supported over the dicing sheet, the dicing sheet is not peeled off from the frame due to the pressure of the cooling water at the time of processing the work.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a form of a work handled by a dicing machine.

FIG. 2 is a front view of a dicing machine according to an embodiment of the present invention.

FIG. 3 is a plan view of a cutting table of the dicing machine according to the embodiment of the present invention.

FIG. 4 is a front view illustrating another example of the dicing machine according to the embodiment of the present invention.

FIG. 5 is a front view showing a conventional dicing machine.

FIG. 6 is a plan view showing a conventional dicing machine.

FIG. 7 is an explanatory view showing how a dicing sheet is peeled off by a conventional dicing machine.

[Explanation of symbols]

F ... Frame, S ... Dicing sheet, W ... Work, 1
0 ... Dicing device, 21 ... Rotary blade, 22 ... Nozzle, 3
0 ... Cutting table, 31 ... Suction plate, 32 ... Frame receiver, 32A ... Flat part, 32B ... Sloping surface

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takayuki Kaneko             9-7 Shimorenjaku, Mitaka City, Tokyo Stocks             Company Tokyo Seimitsu F term (reference) 3C058 AA03 AB04 CB02 CB06 DA17

Claims (2)

[Claims] 1. A dicing device for dividing a work adhered to a frame via a dicing sheet into individual chips, the rotary blade processing the work, and a nozzle for supplying cooling water to the work and the rotary blade. And a cutting table on which the work is placed, the cutting table has a suction plate for suctioning and mounting the part of the work, and a frame receiver for mounting the part of the frame, The frame receiver has a ring shape,
A dicing machine, characterized in that it is formed so as to hold the frame on the entire upper surface thereof. 2. The upper surface of the frame receiver is a flat portion that supports a frame portion when the frame to which the work is attached via the dicing sheet is placed, and a flat portion in the previous period toward the upper side inside thereof. 2. An inclined surface that extends along the dicing sheet.
The dicing machine described in.