|
US6555449B1
(en)
*
|
1996-05-28 |
2003-04-29 |
Trustees Of Columbia University In The City Of New York |
Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
|
|
US6573531B1
(en)
*
|
1999-09-03 |
2003-06-03 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
|
|
US6830993B1
(en)
|
2000-03-21 |
2004-12-14 |
The Trustees Of Columbia University In The City Of New York |
Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
|
|
US6657157B1
(en)
*
|
2000-06-07 |
2003-12-02 |
Westar Photonics, Inc. |
Method, system and product for producing a reflective mask mirror and for ablating an object using said reflective mask mirror
|
|
AU2002211507A1
(en)
*
|
2000-10-10 |
2002-04-22 |
The Trustees Of Columbia University In The City Of New York |
Method and apparatus for processing thin metal layers
|
|
AU2002235144A1
(en)
*
|
2000-11-27 |
2002-06-03 |
The Trustees Of Columbia University In The City Of New York |
Process and mask projection system for laser crystallization processing of semiconductor film regions on a substrate
|
|
US6621044B2
(en)
*
|
2001-01-18 |
2003-09-16 |
Anvik Corporation |
Dual-beam materials-processing system
|
|
TW521310B
(en)
*
|
2001-02-08 |
2003-02-21 |
Toshiba Corp |
Laser processing method and apparatus
|
|
US6623103B2
(en)
|
2001-04-10 |
2003-09-23 |
Lexmark International, Inc. |
Laser ablation method for uniform nozzle structure
|
|
US7088758B2
(en)
*
|
2001-07-27 |
2006-08-08 |
Cymer, Inc. |
Relax gas discharge laser lithography light source
|
|
TW556350B
(en)
*
|
2001-08-27 |
2003-10-01 |
Univ Columbia |
A method to increase device-to-device uniformity for polycrystalline thin-film transistors by deliberately mis-aligning the microstructure relative to the channel region
|
|
WO2003043826A1
(fr)
*
|
2001-11-22 |
2003-05-30 |
Canon Kabushiki Kaisha |
Tete de jet de liquide
|
|
AU2003220611A1
(en)
*
|
2002-04-01 |
2003-10-20 |
The Trustees Of Columbia University In The City Of New York |
Method and system for providing a thin film
|
|
US6749285B2
(en)
*
|
2002-07-25 |
2004-06-15 |
Matsushita Electric Industrial Co., Ltd. |
Method of milling repeatable exit holes in ink-jet nozzles
|
|
CN1323797C
(zh)
*
|
2002-07-25 |
2007-07-04 |
松下电器产业株式会社 |
喷墨喷嘴和用于喷墨喷嘴的激光钻孔工艺
|
|
JP2004066327A
(ja)
*
|
2002-08-09 |
2004-03-04 |
Tdk Corp |
レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
|
|
WO2004017382A2
(en)
*
|
2002-08-19 |
2004-02-26 |
The Trustees Of Columbia University In The City Of New York |
Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity within areas in such regions and edge areas thereof, and a structure of such film regions
|
|
TWI360707B
(en)
|
2002-08-19 |
2012-03-21 |
Univ Columbia |
Process and system for laser crystallization proc
|
|
TWI331803B
(en)
|
2002-08-19 |
2010-10-11 |
Univ Columbia |
A single-shot semiconductor processing system and method having various irradiation patterns
|
|
WO2004017379A2
(en)
*
|
2002-08-19 |
2004-02-26 |
The Trustees Of Columbia University In The City Of New York |
Process and system for processing a thin film sample and thin film structure
|
|
WO2004075263A2
(en)
|
2003-02-19 |
2004-09-02 |
The Trustees Of Columbia University In The City Of New York |
System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
|
|
WO2004097915A1
(ja)
*
|
2003-04-25 |
2004-11-11 |
Semiconductor Energy Laboratory Co., Ltd. |
液滴吐出装置、パターンの形成方法、および半導体装置の製造方法
|
|
US6902604B2
(en)
*
|
2003-05-15 |
2005-06-07 |
Fleetguard, Inc. |
Electrostatic precipitator with internal power supply
|
|
US7450307B2
(en)
*
|
2003-09-09 |
2008-11-11 |
Semiconductor Energy Laboratory Co., Ltd. |
Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
|
|
WO2005029546A2
(en)
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
|
|
WO2005029548A2
(en)
*
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
System and process for providing multiple beam sequential lateral solidification
|
|
US7164152B2
(en)
|
2003-09-16 |
2007-01-16 |
The Trustees Of Columbia University In The City Of New York |
Laser-irradiated thin films having variable thickness
|
|
TWI351713B
(en)
|
2003-09-16 |
2011-11-01 |
Univ Columbia |
Method and system for providing a single-scan, con
|
|
US7364952B2
(en)
|
2003-09-16 |
2008-04-29 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for processing thin films
|
|
WO2005029550A2
(en)
*
|
2003-09-16 |
2005-03-31 |
The Trustees Of Columbia University In The City Of New York |
Method and system for producing crystalline thin films with a uniform crystalline orientation
|
|
TWI359441B
(en)
|
2003-09-16 |
2012-03-01 |
Univ Columbia |
Processes and systems for laser crystallization pr
|
|
US7318866B2
(en)
|
2003-09-16 |
2008-01-15 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for inducing crystallization of thin films using multiple optical paths
|
|
TWI366859B
(en)
*
|
2003-09-16 |
2012-06-21 |
Univ Columbia |
System and method of enhancing the width of polycrystalline grains produced via sequential lateral solidification using a modified mask pattern
|
|
WO2005034193A2
(en)
|
2003-09-19 |
2005-04-14 |
The Trustees Of Columbia University In The City Ofnew York |
Single scan irradiation for crystallization of thin films
|
|
US7633033B2
(en)
|
2004-01-09 |
2009-12-15 |
General Lasertronics Corporation |
Color sensing for laser decoating
|
|
US7273773B2
(en)
*
|
2004-01-26 |
2007-09-25 |
Semiconductor Energy Laboratory Co., Ltd. |
Display device, method for manufacturing thereof, and television device
|
|
US7462514B2
(en)
|
2004-03-03 |
2008-12-09 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and method for manufacturing the same, liquid crystal television, and EL television
|
|
US7642038B2
(en)
*
|
2004-03-24 |
2010-01-05 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for forming pattern, thin film transistor, display device, method for manufacturing thereof, and television apparatus
|
|
CN100485868C
(zh)
*
|
2004-03-31 |
2009-05-06 |
日本电气株式会社 |
半导体薄膜制造方法及装置、光束成形掩模及薄膜晶体管
|
|
US7494923B2
(en)
|
2004-06-14 |
2009-02-24 |
Semiconductor Energy Laboratory Co., Ltd. |
Manufacturing method of wiring substrate and semiconductor device
|
|
US8158517B2
(en)
|
2004-06-28 |
2012-04-17 |
Semiconductor Energy Laboratory Co., Ltd. |
Method for manufacturing wiring substrate, thin film transistor, display device and television device
|
|
US8319150B2
(en)
*
|
2004-07-09 |
2012-11-27 |
General Electric Company |
Continuous motion laser shock peening
|
|
US7645337B2
(en)
|
2004-11-18 |
2010-01-12 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for creating crystallographic-orientation controlled poly-silicon films
|
|
US8221544B2
(en)
|
2005-04-06 |
2012-07-17 |
The Trustees Of Columbia University In The City Of New York |
Line scan sequential lateral solidification of thin films
|
|
WO2007067541A2
(en)
|
2005-12-05 |
2007-06-14 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for processing a film, and thin films
|
|
DE102006022722B4
(de)
|
2006-05-12 |
2010-06-17 |
Hueck Engraving Gmbh & Co. Kg |
Verfahren und Vorrichtung zur Oberflächenstrukturierung eines Pressbleches oder eines Endlosbandes
|
|
GB2438601B
(en)
*
|
2006-05-24 |
2008-04-09 |
Exitech Ltd |
Method and unit for micro-structuring a moving substrate
|
|
US8536483B2
(en)
*
|
2007-03-22 |
2013-09-17 |
General Lasertronics Corporation |
Methods for stripping and modifying surfaces with laser-induced ablation
|
|
US8481887B2
(en)
*
|
2007-05-03 |
2013-07-09 |
Electro Scientific Industries, Inc. |
Method for machining tapered micro holes
|
|
US20090008827A1
(en)
*
|
2007-07-05 |
2009-01-08 |
General Lasertronics Corporation, A Corporation Of The State Of California |
Aperture adapters for laser-based coating removal end-effector
|
|
US8614471B2
(en)
|
2007-09-21 |
2013-12-24 |
The Trustees Of Columbia University In The City Of New York |
Collections of laterally crystallized semiconductor islands for use in thin film transistors
|
|
WO2009042784A1
(en)
|
2007-09-25 |
2009-04-02 |
The Trustees Of Columbia University In The City Of New York |
Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films
|
|
US8288682B2
(en)
*
|
2007-09-28 |
2012-10-16 |
Intel Corporation |
Forming micro-vias using a two stage laser drilling process
|
|
US8012861B2
(en)
|
2007-11-21 |
2011-09-06 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for preparing epitaxially textured polycrystalline films
|
|
KR20100105606A
(ko)
|
2007-11-21 |
2010-09-29 |
더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 |
에피택셜하게 텍스쳐화된 후막의 제조를 위한 시스템 및 방법
|
|
WO2009067688A1
(en)
|
2007-11-21 |
2009-05-28 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for preparing epitaxially textured polycrystalline films
|
|
WO2009111340A2
(en)
|
2008-02-29 |
2009-09-11 |
The Trustees Of Columbia University In The City Of New York |
Flash lamp annealing crystallization for large area thin films
|
|
KR20110094022A
(ko)
|
2008-11-14 |
2011-08-19 |
더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 |
박막 결정화를 위한 시스템 및 방법
|
|
JP5148717B2
(ja)
*
|
2009-08-03 |
2013-02-20 |
東芝機械株式会社 |
パルスレーザ加工装置およびパルスレーザ加工方法
|
|
US9087696B2
(en)
|
2009-11-03 |
2015-07-21 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for non-periodic pulse partial melt film processing
|
|
US9646831B2
(en)
|
2009-11-03 |
2017-05-09 |
The Trustees Of Columbia University In The City Of New York |
Advanced excimer laser annealing for thin films
|
|
US8440581B2
(en)
|
2009-11-24 |
2013-05-14 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for non-periodic pulse sequential lateral solidification
|
|
US10112257B1
(en)
*
|
2010-07-09 |
2018-10-30 |
General Lasertronics Corporation |
Coating ablating apparatus with coating removal detection
|
|
US9828278B2
(en)
|
2012-02-28 |
2017-11-28 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of strengthened glass and articles produced thereby
|
|
US10357850B2
(en)
*
|
2012-09-24 |
2019-07-23 |
Electro Scientific Industries, Inc. |
Method and apparatus for machining a workpiece
|
|
US9895771B2
(en)
|
2012-02-28 |
2018-02-20 |
General Lasertronics Corporation |
Laser ablation for the environmentally beneficial removal of surface coatings
|
|
US9828277B2
(en)
|
2012-02-28 |
2017-11-28 |
Electro Scientific Industries, Inc. |
Methods for separation of strengthened glass
|
|
US10086597B2
(en)
|
2014-01-21 |
2018-10-02 |
General Lasertronics Corporation |
Laser film debonding method
|
|
KR101771885B1
(ko)
*
|
2014-11-06 |
2017-08-25 |
미쓰비시덴키 가부시키가이샤 |
레이저 가공 방법 및 장치
|
|
US20160184926A1
(en)
*
|
2014-12-30 |
2016-06-30 |
Suss Microtec Photonic Systems Inc. |
Laser ablation system including variable energy beam to minimize etch-stop material damage
|
|
CN105345260A
(zh)
*
|
2015-12-08 |
2016-02-24 |
重庆镭宝激光智能机器人制造有限公司 |
激光头运动轨迹的简易表达装置
|
|
CN107442934A
(zh)
*
|
2017-07-14 |
2017-12-08 |
华中科技大学 |
一种基于能量带拼接的激光焊接设备
|
|
FR3098137B1
(fr)
*
|
2019-07-02 |
2022-07-15 |
Aptar France Sas |
Procédé de fabrication d’une paroi de distribution
|
