JP2002511586A5 - - Google Patents

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Publication number
JP2002511586A5
JP2002511586A5 JP2000543830A JP2000543830A JP2002511586A5 JP 2002511586 A5 JP2002511586 A5 JP 2002511586A5 JP 2000543830 A JP2000543830 A JP 2000543830A JP 2000543830 A JP2000543830 A JP 2000543830A JP 2002511586 A5 JP2002511586 A5 JP 2002511586A5
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Japan
Prior art keywords
surface area
substrate
array
coating
polymer substrate
Prior art date
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Withdrawn
Application number
JP2000543830A
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English (en)
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JP2002511586A (ja
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Priority claimed from US09/287,379 external-priority patent/US6376619B1/en
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Publication of JP2002511586A publication Critical patent/JP2002511586A/ja
Publication of JP2002511586A5 publication Critical patent/JP2002511586A5/ja
Withdrawn legal-status Critical Current

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【特許請求の範囲】
【請求項１】 ポリマー基材と、
該基材に少なくとも部分的に接着された架橋剤含有コーティングと、
該架橋剤に固定されて結合領域を形成する反応体と、
を含み、該架橋剤を含む前記コーティングが突出表面積と該突出表面積より広い位相表面積とを有するアレイ。
【請求項２】 前記架橋剤含有コーティングが起伏面を含む請求項１に記載のアレイ。
【請求項３】 前記位相表面積が、前記突出表面積の少なくとも２倍を超える請求項１および２に記載のアレイ。
【請求項４】 前記アレイが、２０００箇所／１ｃｍ２を超える結合領域密度を具備する請求項１〜３に記載のアレイ。
【請求項５】 配向されたポリマー基材とそこに少なくとも部分的に接着された架橋剤のコーティングとを含む、請求項１に記載のアレイ製造に使用する材料。
【請求項６】 配向されたポリマー基材を提供するステップと、
架橋剤含有コーティングを該ポリマー基材上に適用するステップと、
そこに反応体を固定して結合領域を形成するステップと、
該基材を弛緩して、該コーティングに、突出表面積と該突出表面積より広い位相表面積とを持たせるステップと、
を含む請求項１に記載のアレイの製造方法。
【請求項７】 該コーティングが起伏面を形成する請求項６に記載の方法。
【請求項８】 ａ．反応体を、ある面積を有する主面を含む配向されたポリマー基材に固定して、該基材上に結合領域を形成するステップと、
b. 該ポリマー基材を加熱して該主面の表面積を縮小することにより、該基材上の前記結合領域密度を上昇させるステップと、
を含む請求項１に記載のアレイの製造方法。
JP2000543830A 1998-04-13 1999-04-09 高密度小型化アレイおよびその製造方法 Withdrawn JP2002511586A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5942798A 1998-04-13 1998-04-13
US09/059,427 1998-04-13
US09/287,379 US6376619B1 (en) 1998-04-13 1999-04-07 High density, miniaturized arrays and methods of manufacturing same
US09/287,379 1999-04-07
PCT/US1999/007799 WO1999053319A2 (en) 1998-04-13 1999-04-09 High-density, miniaturized arrays and methods of manufacturing same

Publications (2)

Publication Number Publication Date
JP2002511586A JP2002511586A (ja) 2002-04-16
JP2002511586A5 true JP2002511586A5 (ja) 2006-06-15

Family

ID=26738736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000543830A Withdrawn JP2002511586A (ja) 1998-04-13 1999-04-09 高密度小型化アレイおよびその製造方法

Country Status (6)

Country Link
US (5) US6376619B1 (ja)
EP (1) EP1073904B1 (ja)
JP (1) JP2002511586A (ja)
AU (1) AU3744199A (ja)
DE (1) DE69927579T2 (ja)
WO (1) WO1999053319A2 (ja)

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