JP2002509808A - 集積大面積ミクロ構造体およびミクロメカニカルデバイス - Google Patents

集積大面積ミクロ構造体およびミクロメカニカルデバイス

Info

Publication number
JP2002509808A
JP2002509808A JP2000540567A JP2000540567A JP2002509808A JP 2002509808 A JP2002509808 A JP 2002509808A JP 2000540567 A JP2000540567 A JP 2000540567A JP 2000540567 A JP2000540567 A JP 2000540567A JP 2002509808 A JP2002509808 A JP 2002509808A
Authority
JP
Japan
Prior art keywords
wafer
trench
platform
pattern
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000540567A
Other languages
English (en)
Japanese (ja)
Inventor
ティモシー・ジェイ・デイビス
スコット・ジー・アダムズ
Original Assignee
キオニックス・インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キオニックス・インコーポレイテッド filed Critical キオニックス・インコーポレイテッド
Publication of JP2002509808A publication Critical patent/JP2002509808A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00484—Processes for releasing structures not provided for in group B81C1/00476
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Drying Of Semiconductors (AREA)
JP2000540567A 1998-01-15 1999-01-14 集積大面積ミクロ構造体およびミクロメカニカルデバイス Pending JP2002509808A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7156998P 1998-01-15 1998-01-15
US60/071,569 1998-01-15
PCT/US1999/000783 WO1999036948A1 (en) 1998-01-15 1999-01-14 Integrated large area microstructures and micromechanical devices

Publications (1)

Publication Number Publication Date
JP2002509808A true JP2002509808A (ja) 2002-04-02

Family

ID=22102170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000540567A Pending JP2002509808A (ja) 1998-01-15 1999-01-14 集積大面積ミクロ構造体およびミクロメカニカルデバイス

Country Status (3)

Country Link
EP (1) EP1062685A1 (de)
JP (1) JP2002509808A (de)
WO (1) WO1999036948A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006255879A (ja) * 2005-02-16 2006-09-28 Seiko Epson Corp Ｍｅｍｓ素子およびｍｅｍｓ素子の製造方法
JP2007294612A (ja) * 2006-04-24 2007-11-08 Oki Data Corp 半導体装置、半導体装置の製造方法、半導体製造装置、ｌｅｄヘッド、および画像形成装置
JP2008300870A (ja) * 2008-08-18 2008-12-11 Oki Data Corp 半導体装置の製造方法、および半導体製造装置
JP2009505381A (ja) * 2005-08-08 2009-02-05 シルバーブルック リサーチ ピーティワイ リミテッド 基板に親水性トレンチをエッチングするのに適した方法
JP2011506119A (ja) * 2007-12-21 2011-03-03 ゾルファイ フルーオル ゲゼルシャフト ミット ベシュレンクテル ハフツング 微小電気機械システムの生産方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316282B1 (en) 1999-08-11 2001-11-13 Adc Telecommunications, Inc. Method of etching a wafer layer using multiple layers of the same photoresistant material
US6229640B1 (en) 1999-08-11 2001-05-08 Adc Telecommunications, Inc. Microelectromechanical optical switch and method of manufacture thereof
US6753638B2 (en) * 2000-02-03 2004-06-22 Calient Networks, Inc. Electrostatic actuator for micromechanical systems
US6628041B2 (en) 2000-05-16 2003-09-30 Calient Networks, Inc. Micro-electro-mechanical-system (MEMS) mirror device having large angle out of plane motion using shaped combed finger actuators and method for fabricating the same
US6585383B2 (en) 2000-05-18 2003-07-01 Calient Networks, Inc. Micromachined apparatus for improved reflection of light
US6819520B2 (en) * 2000-12-22 2004-11-16 Ic Mechanics, Inc. Use of momentum transfer actuators for motion control of flexible mechanical structures
EP1383708A1 (de) 2001-04-17 2004-01-28 Telefonaktiebolaget LM Ericsson (publ) Leiterplatte mit integriertem schalter
US6887732B2 (en) * 2001-05-07 2005-05-03 Applied Materials, Inc. Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device
US6801682B2 (en) 2001-05-18 2004-10-05 Adc Telecommunications, Inc. Latching apparatus for a MEMS optical switch
US6768331B2 (en) * 2002-04-16 2004-07-27 Teradyne, Inc. Wafer-level contactor
US6554403B1 (en) * 2002-04-30 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate for fluid ejection device
US7728339B1 (en) 2002-05-03 2010-06-01 Calient Networks, Inc. Boundary isolation for microelectromechanical devices
WO2006060937A1 (en) * 2004-12-10 2006-06-15 Shanghai Institute Of Microsystem And Information Technology, Chinese Academy Of Sciences A mems device including a laterally movable portion wiht piezo-resistive sensing elements and electrostatic actuating elements on trench side walls and methods for producing the same
TWI636949B (zh) 2015-05-15 2018-10-01 村田製作所股份有限公司 多層微機械結構
FI126508B (en) 2015-05-15 2017-01-13 Murata Manufacturing Co Method for manufacturing a multilevel micromechanical structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610335A (en) * 1993-05-26 1997-03-11 Cornell Research Foundation Microelectromechanical lateral accelerometer
US5645684A (en) * 1994-03-07 1997-07-08 The Regents Of The University Of California Multilayer high vertical aspect ratio thin film structures
US5637189A (en) * 1996-06-25 1997-06-10 Xerox Corporation Dry etch process control using electrically biased stop junctions

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006255879A (ja) * 2005-02-16 2006-09-28 Seiko Epson Corp Ｍｅｍｓ素子およびｍｅｍｓ素子の製造方法
JP4544140B2 (ja) * 2005-02-16 2010-09-15 セイコーエプソン株式会社 Ｍｅｍｓ素子
JP2009505381A (ja) * 2005-08-08 2009-02-05 シルバーブルック リサーチ ピーティワイ リミテッド 基板に親水性トレンチをエッチングするのに適した方法
JP2007294612A (ja) * 2006-04-24 2007-11-08 Oki Data Corp 半導体装置、半導体装置の製造方法、半導体製造装置、ｌｅｄヘッド、および画像形成装置
JP2011506119A (ja) * 2007-12-21 2011-03-03 ゾルファイ フルーオル ゲゼルシャフト ミット ベシュレンクテル ハフツング 微小電気機械システムの生産方法
JP2008300870A (ja) * 2008-08-18 2008-12-11 Oki Data Corp 半導体装置の製造方法、および半導体製造装置

Also Published As

Publication number Publication date
EP1062685A1 (de) 2000-12-27
WO1999036948A1 (en) 1999-07-22

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