EP1062685A1 - Integrierte gro flächige mikrostrukturen und micromechanische anordnungen - Google Patents

Integrierte gro flächige mikrostrukturen und micromechanische anordnungen

Info

Publication number
EP1062685A1
EP1062685A1 EP99905434A EP99905434A EP1062685A1 EP 1062685 A1 EP1062685 A1 EP 1062685A1 EP 99905434 A EP99905434 A EP 99905434A EP 99905434 A EP99905434 A EP 99905434A EP 1062685 A1 EP1062685 A1 EP 1062685A1
Authority
EP
European Patent Office
Prior art keywords
wafer
platform
pattern
large area
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99905434A
Other languages
English (en)
French (fr)
Inventor
Timothy J. Davis
Scott G. Adams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kionix Inc
Original Assignee
Kionix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kionix Inc filed Critical Kionix Inc
Publication of EP1062685A1 publication Critical patent/EP1062685A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00484—Processes for releasing structures not provided for in group B81C1/00476
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures
EP99905434A 1998-01-15 1999-01-14 Integrierte gro flächige mikrostrukturen und micromechanische anordnungen Withdrawn EP1062685A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7156998P 1998-01-15 1998-01-15
US71569P 1998-01-15
PCT/US1999/000783 WO1999036948A1 (en) 1998-01-15 1999-01-14 Integrated large area microstructures and micromechanical devices

Publications (1)

Publication Number Publication Date
EP1062685A1 true EP1062685A1 (de) 2000-12-27

Family

ID=22102170

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99905434A Withdrawn EP1062685A1 (de) 1998-01-15 1999-01-14 Integrierte gro flächige mikrostrukturen und micromechanische anordnungen

Country Status (3)

Country Link
EP (1) EP1062685A1 (de)
JP (1) JP2002509808A (de)
WO (1) WO1999036948A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316282B1 (en) 1999-08-11 2001-11-13 Adc Telecommunications, Inc. Method of etching a wafer layer using multiple layers of the same photoresistant material
US6229640B1 (en) 1999-08-11 2001-05-08 Adc Telecommunications, Inc. Microelectromechanical optical switch and method of manufacture thereof
US6753638B2 (en) * 2000-02-03 2004-06-22 Calient Networks, Inc. Electrostatic actuator for micromechanical systems
US6628041B2 (en) 2000-05-16 2003-09-30 Calient Networks, Inc. Micro-electro-mechanical-system (MEMS) mirror device having large angle out of plane motion using shaped combed finger actuators and method for fabricating the same
US6585383B2 (en) 2000-05-18 2003-07-01 Calient Networks, Inc. Micromachined apparatus for improved reflection of light
US6819520B2 (en) * 2000-12-22 2004-11-16 Ic Mechanics, Inc. Use of momentum transfer actuators for motion control of flexible mechanical structures
WO2002083549A1 (en) 2001-04-17 2002-10-24 Telefonaktiebolaget Lm Ericsson (Publ) Printed circuit board integrated switch
US6887732B2 (en) 2001-05-07 2005-05-03 Applied Materials, Inc. Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device
US6801682B2 (en) 2001-05-18 2004-10-05 Adc Telecommunications, Inc. Latching apparatus for a MEMS optical switch
US6768331B2 (en) * 2002-04-16 2004-07-27 Teradyne, Inc. Wafer-level contactor
US6554403B1 (en) * 2002-04-30 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate for fluid ejection device
US7728339B1 (en) 2002-05-03 2010-06-01 Calient Networks, Inc. Boundary isolation for microelectromechanical devices
WO2006060937A1 (en) * 2004-12-10 2006-06-15 Shanghai Institute Of Microsystem And Information Technology, Chinese Academy Of Sciences A mems device including a laterally movable portion wiht piezo-resistive sensing elements and electrostatic actuating elements on trench side walls and methods for producing the same
JP4544140B2 (ja) * 2005-02-16 2010-09-15 セイコーエプソン株式会社 Ｍｅｍｓ素子
US7481943B2 (en) * 2005-08-08 2009-01-27 Silverbrook Research Pty Ltd Method suitable for etching hydrophillic trenches in a substrate
JP2007294612A (ja) * 2006-04-24 2007-11-08 Oki Data Corp 半導体装置、半導体装置の製造方法、半導体製造装置、ｌｅｄヘッド、および画像形成装置
TWI558655B (zh) * 2007-12-21 2016-11-21 首威氟化物有限公司 微機電系統之製造方法
JP5033737B2 (ja) * 2008-08-18 2012-09-26 株式会社沖データ 半導体装置の製造方法、および半導体製造装置
US9764942B2 (en) 2015-05-15 2017-09-19 Murata Manufacturing Co., Ltd. Multi-level micromechanical structure
FI126508B (en) 2015-05-15 2017-01-13 Murata Manufacturing Co Method for manufacturing a multilevel micromechanical structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610335A (en) * 1993-05-26 1997-03-11 Cornell Research Foundation Microelectromechanical lateral accelerometer
US5645684A (en) * 1994-03-07 1997-07-08 The Regents Of The University Of California Multilayer high vertical aspect ratio thin film structures
US5637189A (en) * 1996-06-25 1997-06-10 Xerox Corporation Dry etch process control using electrically biased stop junctions

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9936948A1 *

Also Published As

Publication number Publication date
JP2002509808A (ja) 2002-04-02
WO1999036948A1 (en) 1999-07-22

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