JP2002502714A - 層を有する研磨表面を備えた砥石車 - Google Patents
層を有する研磨表面を備えた砥石車Info
- Publication number
- JP2002502714A JP2002502714A JP2000530344A JP2000530344A JP2002502714A JP 2002502714 A JP2002502714 A JP 2002502714A JP 2000530344 A JP2000530344 A JP 2000530344A JP 2000530344 A JP2000530344 A JP 2000530344A JP 2002502714 A JP2002502714 A JP 2002502714A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- grinding wheel
- abrasive
- channel
- abrasive particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 231
- 238000005498 polishing Methods 0.000 title claims abstract description 157
- 239000002245 particle Substances 0.000 claims abstract description 231
- 239000011230 binding agent Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 27
- 238000005245 sintering Methods 0.000 claims description 21
- 125000006850 spacer group Chemical group 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000003082 abrasive agent Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 14
- 239000000314 lubricant Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims 3
- 239000006061 abrasive grain Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 197
- 238000009826 distribution Methods 0.000 description 39
- 229910003460 diamond Inorganic materials 0.000 description 13
- 239000010432 diamond Substances 0.000 description 13
- 239000011148 porous material Substances 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910000906 Bronze Inorganic materials 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000010974 bronze Substances 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052580 B4C Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 3
- 229910000419 boron suboxide Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000010687 lubricating oil Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 244000145845 chattering Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002285 corn oil Substances 0.000 description 1
- 230000000368 destabilizing effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D5/066—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments mounted axially one against the other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with cooling provisions, e.g. with radial slots
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1965798A | 1998-02-06 | 1998-02-06 | |
| US09/019,657 | 1998-02-06 | ||
| PCT/US1998/027756 WO1999039876A1 (en) | 1998-02-06 | 1998-12-28 | Grinding wheel with layered abrasive surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002502714A true JP2002502714A (ja) | 2002-01-29 |
| JP2002502714A5 JP2002502714A5 (enExample) | 2006-01-19 |
Family
ID=21794353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000530344A Pending JP2002502714A (ja) | 1998-02-06 | 1998-12-28 | 層を有する研磨表面を備えた砥石車 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1053078B2 (enExample) |
| JP (1) | JP2002502714A (enExample) |
| KR (1) | KR100542160B1 (enExample) |
| AU (1) | AU2019999A (enExample) |
| DE (1) | DE69826324T3 (enExample) |
| WO (1) | WO1999039876A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101342744B1 (ko) | 2012-06-07 | 2013-12-19 | 이화다이아몬드공업 주식회사 | 유리 기판의 에지를 가공하기 위한 에지 휠 및 그 제조방법 |
| JP2015503466A (ja) * | 2012-01-17 | 2015-02-02 | 桂林▲創▼源金▲剛▼石有限公司 | 耐ひずみの高効率の切断ホイール |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6482244B2 (en) | 1995-06-07 | 2002-11-19 | Ultimate Abrasive Systems, L.L.C. | Process for making an abrasive sintered product |
| US6478831B2 (en) | 1995-06-07 | 2002-11-12 | Ultimate Abrasive Systems, L.L.C. | Abrasive surface and article and methods for making them |
| US6358133B1 (en) * | 1998-02-06 | 2002-03-19 | 3M Innovative Properties Company | Grinding wheel |
| KR100428947B1 (ko) * | 2001-09-28 | 2004-04-29 | 이화다이아몬드공업 주식회사 | 다이아몬드 공구 |
| KR100531499B1 (ko) * | 2002-02-08 | 2005-11-28 | 이화다이아몬드공업 주식회사 | 다이아몬드 공구용 절삭팁 및 다이아몬드 공구 |
| ITPD20080237A1 (it) * | 2008-07-31 | 2010-02-01 | Adi S P A | Mola, particolarmente per lavorazioni di molatura ad elevata velocit@ di avanzamento |
| DE102012223029B4 (de) | 2012-12-13 | 2025-11-20 | Lufthansa Technik Aktiengesellschaft | Schleifscheibe für eine Werkzeugmaschine |
| US9937604B2 (en) | 2013-06-26 | 2018-04-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of making same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3127715A (en) * | 1960-04-27 | 1964-04-07 | Christensen Diamond Prod Co | Diamond cutting devices |
| US4208843A (en) * | 1977-08-27 | 1980-06-24 | Ngk Insulators, Ltd. | Grinding attachment for porcelain bodies |
| US4275528A (en) * | 1979-09-10 | 1981-06-30 | Christensen, Inc. | Electroplated diamond milling cutter |
| AU1098983A (en) * | 1982-02-05 | 1983-08-11 | Boart International Limited | Cutting device |
| US5423717A (en) * | 1993-10-04 | 1995-06-13 | Ford Motor Company | Grinding wheel assembly |
-
1998
- 1998-12-28 JP JP2000530344A patent/JP2002502714A/ja active Pending
- 1998-12-28 WO PCT/US1998/027756 patent/WO1999039876A1/en not_active Ceased
- 1998-12-28 EP EP98964998A patent/EP1053078B2/en not_active Expired - Lifetime
- 1998-12-28 AU AU20199/99A patent/AU2019999A/en not_active Abandoned
- 1998-12-28 DE DE69826324T patent/DE69826324T3/de not_active Expired - Fee Related
- 1998-12-28 KR KR1020007008601A patent/KR100542160B1/ko not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015503466A (ja) * | 2012-01-17 | 2015-02-02 | 桂林▲創▼源金▲剛▼石有限公司 | 耐ひずみの高効率の切断ホイール |
| KR101342744B1 (ko) | 2012-06-07 | 2013-12-19 | 이화다이아몬드공업 주식회사 | 유리 기판의 에지를 가공하기 위한 에지 휠 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1053078B2 (en) | 2008-01-02 |
| KR100542160B1 (ko) | 2006-01-16 |
| WO1999039876A1 (en) | 1999-08-12 |
| AU2019999A (en) | 1999-08-23 |
| EP1053078B1 (en) | 2004-09-15 |
| DE69826324D1 (de) | 2004-10-21 |
| KR20010040719A (ko) | 2001-05-15 |
| DE69826324T2 (de) | 2005-10-20 |
| DE69826324T3 (de) | 2008-07-17 |
| EP1053078A1 (en) | 2000-11-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051116 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051116 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080610 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090106 |