JP2002374052A5

JP2002374052A5 -

Info

Publication number: JP2002374052A5
Application number: JP2001178522A
Authority: JP
Filing date: 2001-06-13
Publication date: 2005-05-12
Anticipated expiration: 2021-06-13

Description

【０００６】
【課題を解決するための手段】
本発明の第１態様である電子部品実装済部品の製造方法は、電気的絶縁性を有するシート状の樹脂基材の表面である回路パターン形成面上に回路パターンを形成し、
上記樹脂基材を挟んで上記回路パターンと対向する上記樹脂基材の裏面である電子部品挿入面から電子部品を挿入して上記樹脂基材に埋設するとともに、上記回路パターンと上記電子部品の回路接続部とを接触させ、上記回路パターンと上記電子部品との電気的導通を図ることを特徴とする。 [0006]
[Means for Solving the Problems]
The method of manufacturing an electronic component-mounted component is a first aspect of the present invention forms a circuitry pattern on the circuit pattern formation surface is a surface of a sheet-like tree Aburamotozai having an electric insulating property,
Across the upper Bark Aburamotozai well as embedded in the upper Bark fat base by inserting the electronic component from the electronic component insertion surface is a rear surface of the upper Bark Aburamotozai opposed to the circuit pattern, the circuit pattern And the circuit connection portion of the electronic component to make electrical contact between the circuit pattern and the electronic component.

上記回路パターン形成面上に上記回路パターンを形成する前に、上記樹脂基材における上記電子部品の上記回路接続部が配置される位置に予め該樹脂基材の厚さ方向に該樹脂基材を貫通する回路接続部配置用スルーホールを形成し、
上記回路パターン形成面上に上記回路パターンを形成するとき、前記回路接続部配置用スルーホールの内壁面に回路接続部被覆用メッキ層を形成し、
上記樹脂基材に上記電子部品を埋設するとき、当該回路接続部被覆用メッキ層にて上記電子部品と上記回路パターンとの電気的導通を図るようにすることもできる。 Before forming the circuit pattern on the circuit pattern forming surface, in the thickness direction of advance 該樹 Aburamotozai the position where the circuit connection of the electronic component in the upper Bark Aburamotozai is arranged 該樹 Form a through hole for circuit connection placement through the grease base,
When forming the circuit pattern on the circuit pattern formed surface, to form a circuitry connecting portion covering plated layer on the inner wall surface of the through-hole circuit connector arrangement,
When burying the electronic component on Bark fat base, it is also possible to make establishing electrical conduction between the electronic component and the circuit pattern at the circuit connection portion covering plated layer.

上記樹脂基材は、上記回路パターン形成面における上記回路パターンの形成が予定される位置から当該樹脂基材の上記厚さ方向に貫通する回路パターン連絡用スルーホールを有し、上記回路パターン形成面上に上記回路パターンを形成するとき、上記回路パターン連絡用スルーホールの上記電子部品挿入面における端部に電気的に接続する挿入面側回路パターンを上記電子部品挿入面上に形成し、
更に、上記回路パターン形成面上に上記回路パターンを形成するとき、上記回路パターン連絡用スルーホールの内壁面に回路パターン間接続用メッキ層を形成し、当該回路パターン間接続用メッキ層にて上記回路パターンと上記挿入面側回路パターンとの間の電気的導通を図るようにすることもできる。 Upper Bark Aburamotozai has the circuit pattern through hole circuit pattern contacts penetrating from the position in the thickness direction of the person 該樹 Aburamotozai formation is scheduled in the circuit pattern surface, the when forming the circuit pattern on the circuit pattern formation surface, the upper Symbol electronic component insertion plane insertion side circuit pattern electrically connected to the end of the electronic component insertion face of the through-hole above the circuit pattern contact To form
Furthermore, when the circuit pattern is formed on the circuit pattern formation surface, a plating layer for connection between circuit patterns is formed on the inner wall surface of the through hole for connecting circuit patterns, and the plating layer for connection between circuit patterns is used. Electrical conduction can also be achieved between the circuit pattern and the circuit pattern on the insertion surface side.

上記樹脂基材に上記電子部品を埋設した後、上記電子部品を埋設することで上記回路パターンと上記電子部品の上記回路接続部との接触による上記回路パターンと上記電子部品との電気的導通が図られた上記樹脂基材を上記厚さ方向に複数個重ね合わせ、該重ね合わせにて上記回路パターン間接続用メッキ層を介して互いに重なり合う上記樹脂基材の各々の上記回路パターン間の電気的導通を図り、
互いに重なり合う当該樹脂基材同士を相対的に加熱加圧して密着させることにより積層構造とするようにしてもよい。 After embedding the electronic component on Bark fat base, electrically between the circuit pattern and the electronic components due to contact with the circuit connector of the circuit pattern and the electronic part by burying the electronic component the Bark Aburamotozai on conduction was achieved by superimposing a plurality of the above thickness direction at the superposition of each of the upper Bark Aburamotozai overlap each other through the plating layer for connection between the circuit pattern described above Ensure electrical continuity between circuit patterns,
It may be a laminated structure by adhesion by applying relatively heat and pressure to those 該樹 Aburamotozai each other overlap each other.

本発明の第３態様である電子部品実装済完成品の製造方法は、本発明の第２態様である電子部品実装済部品を電気的絶縁性を有する樹脂シートにて上記厚さ方向両面から挟み込み、
該樹脂シートを上記電子部品実装済部品へ加熱加圧して密着させ、上記電子部品実装済部品の封止を行うことを特徴とする。

The third method of manufacturing an electronic component-mounted completed product is an aspect of the present invention, the thickness direction in the electronic component-mounted components in the tree butter sheets that have a electrical insulation is a second aspect of the present invention Sandwich from both sides,
The RESIN sheet is adhered under pressure heating to the electronic component-mounted components, and carrying out sealing of the electronic component-mounted components.

Claims

Forming a circuitry pattern on the circuit pattern formation surface is the surface of the sheet-like tree Aburamoto material having an electrical insulating property,
Across the upper Bark Aburamotozai well as embedded in the upper Bark fat base by inserting the electronic component insertion face or et electronic component is a back surface of the upper Bark Aburamotozai opposed to the circuit pattern, the A method of manufacturing an electronic component mounted part, wherein a circuit pattern and a circuit connection portion of the electronic component are brought into contact with each other to electrically connect the circuit pattern and the electronic component.

Before forming the circuit pattern on the circuit pattern forming surface, in the thickness direction of advance 該樹 Aburamotozai the position where the circuit connection of the electronic component in the upper Bark Aburamotozai is arranged 該樹 forming a Suruho Le circuit connection portion arranged to penetrate the Aburamotozai,
When forming the circuit pattern on the circuit pattern formed surface, to form a circuitry connecting portion covering plated layer on the inner wall surface of the through-hole circuit connector arrangement,
When burying the electronic component on Bark fat base, establishing electrical continuity between the electronic component and the circuit pattern at the circuit connection portion covering plated layer, the electronic component-mounted component according to claim 1, wherein Manufacturing method.

Upper Bark Aburamotozai has the circuit pattern Suruho Le circuit pattern contacts penetrating in the thickness direction of the person 該樹 Aburamotozai from the position forming is scheduled in the circuit pattern surface, the when forming the circuit pattern on the circuit pattern formation surface, the upper Symbol electronic component insertion plane insertion side circuit pattern electrically connected to the end of the electronic component insertion face of the through-hole above the circuit pattern contact To form
Furthermore, when forming the circuit pattern on the circuit pattern surface on the inner wall of the through-hole the circuit pattern contacts to form a circuitry pattern connections plated layer at the circuit pattern between connecting plated layer The manufacturing method of the electronic component mounted part of Claim 1 or 2 which aims at electrical conduction between the said circuit pattern and the said insertion surface side circuit pattern.

After embedding the electronic component on Bark fat base, electrically between the circuit pattern and the electronic components due to contact with the circuit connector of the circuit pattern and the electronic part by burying the electronic component the Bark Aburamotozai on conduction was achieved by superimposing a plurality of the above thickness direction at the superposition of each of the upper Bark Aburamotozai overlap each other through the plating layer for connection between the circuit pattern described above Ensure electrical continuity between circuit patterns,
Those 該樹 Aburamotozai between pressure relatively heating the a stacked structure by close contact with, claim 3 electronic component-mounted component manufacturing method according to overlap each other.

The electronic component is a semiconductor element, a portion of the circuit pattern, by being connected to the semiconductor element, an antenna coil for transmitting and receiving information wirelessly, to any one of claims 1 to 4 The manufacturing method of the electronic component mounted components as described.

The method of manufacturing an electronic component-mounted component according to any one of claims 1 to 5, wherein a plurality of the electronic components exist, and a part or all of the electronic components are semiconductor elements.

An electronic component mounted part manufactured by the method of manufacturing an electronic component mounted part according to any one of claims 1 to 6.

Sandwiched from the thickness direction both sides above the claim 7 the electronic component-mounted unit article according Te in tree butter sheet that have a electrical insulation,
該樹 fat sheet is adhered under pressure heating to the electronic component-mounted components, a method of manufacturing an electronic component-mounted completed product which is characterized in that the sealing of the electronic component-mounted components.

An electronic component mounted completed product manufactured by the method of manufacturing an electronic component mounted completed product according to claim 8.

The electronic component having the above-described electronic component-mounted component is a semiconductor element,
Some of the circuit pattern having the above-described electronic component-mounted components, the semiconductor element and the electronic component-mounted completed product is an antenna coil for transmitting and receiving information wirelessly by connecting the non-contact IC card The electronic component-mounted finished product according to claim 9, which is