JP2002261421A5 - - Google Patents

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Publication number
JP2002261421A5
JP2002261421A5 JP2001061797A JP2001061797A JP2002261421A5 JP 2002261421 A5 JP2002261421 A5 JP 2002261421A5 JP 2001061797 A JP2001061797 A JP 2001061797A JP 2001061797 A JP2001061797 A JP 2001061797A JP 2002261421 A5 JP2002261421 A5 JP 2002261421A5
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JP
Japan
Prior art keywords
electronic component
manufacturing
circuit pattern
component mounted
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001061797A
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Japanese (ja)
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JP3916405B2 (en
JP2002261421A (en
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Publication date
Application filed filed Critical
Priority to JP2001061797A priority Critical patent/JP3916405B2/en
Priority claimed from JP2001061797A external-priority patent/JP3916405B2/en
Publication of JP2002261421A publication Critical patent/JP2002261421A/en
Publication of JP2002261421A5 publication Critical patent/JP2002261421A5/ja
Application granted granted Critical
Publication of JP3916405B2 publication Critical patent/JP3916405B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (7)

第１基材内へ電子部品を埋設し、
埋設された上記電子部品の電極と電気的に接続する回路パターンを上記第１基材の回路形成面に形成して上記電極と上記回路パターンとの電気的接続を図る、
ことを特徴とする電子部品実装済部品の製造方法。To the first base in the buried electronic components,
Establishing electrical connection between the electrode and the circuit pattern buried the electronic component circuit patterns for connecting electrodes electrically in the form on the circuit formation surface of the first substrate,
A method of manufacturing an electronic component mounted component. 上記第１基材内への上記電子部品の埋設後、上記回路パターン形成前に、埋設された上記電子部品の上記電極を上記回路形成面に露出させ、該露出後に上記回路パターンを形成する、請求項１記載の電子部品実装済部品の製造方法。  After embedding the electronic component in the first base material and before forming the circuit pattern, the electrode of the embedded electronic component is exposed on the circuit forming surface, and the circuit pattern is formed after the exposure. The manufacturing method of the electronic component mounted component of Claim 1. 上記回路パターン形成後、該回路パターンを上記第１基材内へ押し込んで上記電気的接続を図るとともに上記回路形成面を平坦化する、請求項１記載の電子部品実装済部品の製造方法。  2. The method of manufacturing an electronic component mounted component according to claim 1, wherein after the circuit pattern is formed, the circuit pattern is pushed into the first base material to achieve the electrical connection and flatten the circuit forming surface. 樹脂材にてなる上記第１基材と、加熱された上記電子部品とを相対的に押圧することで上記第１基材内への上記電子部品の埋設を行ない上記回路パターンを形成する、請求項１から３のいずれかに記載の電子部品実装済部品の製造方法。And the first base material formed by trees fat material, a row gastric upper Symbol circuit pattern embedded in the electronic component to the first base in by relatively pressing the heated the electronic component The manufacturing method of the electronic component mounted component in any one of Claim 1 to 3 formed. 請求項１から４のいずれかに記載の電子部品実装済部品の製造方法を用いて電子部品実装済部品を製造した後、
上記電極と上記回路パターンとの上記電気的接続後、上記第１基材の厚み方向から第２基材及び第３基材にて上記第１基材のラミネート処理を行なうことを特徴とする電子部品実装済完成品の製造方法。After manufacturing an electronic component mounted component using the method for manufacturing an electronic component mounted component according to any one of claims 1 to 4,
And performing after the electrical connection between the electrode and the circuit pattern, the thickness direction of the first substrate Te in the second group Zai及 Beauty third base material laminate treatment of the first substrate A manufacturing method for finished electronic components. 請求項５記載の、電子部品実装済完成品の製造方法にて製造されたことを特徴とする電子部品実装済完成品。  An electronic component mounted finished product manufactured by the method for manufacturing an electronic component mounted finished product according to claim 5. 非接触ＩＣカードを構成するため、上記回路パターンは、無線にて情報の送受信を行なうアンテナコイル形状にてなる、請求項６記載の電子部品実装済完成品。  7. The electronic component mounted finished product according to claim 6, wherein the circuit pattern has an antenna coil shape for wirelessly transmitting and receiving information in order to constitute a non-contact IC card.
JP2001061797A 2001-03-06 2001-03-06 Electronic component mounted component manufacturing method, electronic component mounted finished product manufacturing method, and semiconductor component mounted finished product Expired - Fee Related JP3916405B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001061797A JP3916405B2 (en) 2001-03-06 2001-03-06 Electronic component mounted component manufacturing method, electronic component mounted finished product manufacturing method, and semiconductor component mounted finished product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001061797A JP3916405B2 (en) 2001-03-06 2001-03-06 Electronic component mounted component manufacturing method, electronic component mounted finished product manufacturing method, and semiconductor component mounted finished product

Publications (3)

Publication Number Publication Date
JP2002261421A JP2002261421A (en) 2002-09-13
JP2002261421A5 true JP2002261421A5 (en) 2005-05-19
JP3916405B2 JP3916405B2 (en) 2007-05-16

Family

ID=18921029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001061797A Expired - Fee Related JP3916405B2 (en) 2001-03-06 2001-03-06 Electronic component mounted component manufacturing method, electronic component mounted finished product manufacturing method, and semiconductor component mounted finished product

Country Status (1)

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JP (1) JP3916405B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11853824B2 (en) 2018-03-07 2023-12-26 X-Card Holdings, Llc Metal card

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916087B2 (en) * 2002-12-05 2012-04-11 ミッドトロニクス インコーポレイテッド Storage battery with integrated battery tester
JP4228677B2 (en) 2002-12-06 2009-02-25 パナソニック株式会社 Circuit board
JP4200285B2 (en) 2003-04-02 2008-12-24 パナソニック株式会社 Circuit board manufacturing method
JP4602208B2 (en) * 2004-12-15 2010-12-22 新光電気工業株式会社 Electronic component mounting structure and manufacturing method thereof
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
EP2973238B1 (en) * 2013-03-14 2019-08-07 X-Card Holdings, LLC Information carrying card for displaying one time passcodes, and method of making the same
US10906287B2 (en) 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
KR102281468B1 (en) * 2014-07-16 2021-07-27 삼성전기주식회사 Chip embedded substrate and method of manufacturing the same
JP6380717B2 (en) 2016-08-12 2018-08-29 株式会社村田製作所 LC filter and method of manufacturing LC filter
JP6658607B2 (en) 2017-02-22 2020-03-04 オムロン株式会社 Product manufacturing method, exterior parts and antenna pattern selection device
CN112969284B (en) * 2021-02-19 2022-06-24 深圳市众芯诺科技有限公司 Embedded optical character intelligent recognition chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11853824B2 (en) 2018-03-07 2023-12-26 X-Card Holdings, Llc Metal card

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