JP2002368234A - Photodetector-mounting apparatus - Google Patents
Photodetector-mounting apparatusInfo
- Publication number
- JP2002368234A JP2002368234A JP2001177099A JP2001177099A JP2002368234A JP 2002368234 A JP2002368234 A JP 2002368234A JP 2001177099 A JP2001177099 A JP 2001177099A JP 2001177099 A JP2001177099 A JP 2001177099A JP 2002368234 A JP2002368234 A JP 2002368234A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- receiving element
- circuit board
- printed circuit
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Light Receiving Elements (AREA)
- Moving Of The Head For Recording And Reproducing By Optical Means (AREA)
- Optical Head (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光ピックアップの
受光素子の取付け装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting a light receiving element of an optical pickup.
【０００２】[0002]
【従来の技術】ディスク等の信号記録媒体に対して光学
的に信号の読み取りを行う受光素子の取付けにおいて、
図３及び図４にて説明する。図３は受光素子取付け装置
の従来例を示す斜視図、図４は図３に示す要部の側面図
である。2. Description of the Related Art In mounting a light receiving element for optically reading a signal from a signal recording medium such as a disk,
This will be described with reference to FIGS. FIG. 3 is a perspective view showing a conventional example of a light receiving element mounting device, and FIG. 4 is a side view of a main part shown in FIG.
【０００３】１はディスク等の信号記録媒体により反射
された光ビームを受光する受光素子、２は前記受光素子
１が固着されるとともに端子が接続されるプリント基
板、２ａは前記プリント基板２の側面を接着保持する側
面部、３は半導体レーザー等の各種光学部品が搭載され
ている記載されないハウジングに設けられる、前記プリ
ント基板２を保持する凹部、３ａは前記凹部３の内壁、
４は光ビームが通過し、受光素子１に照射する為の凹部
３に設けた貫通孔、５は前記側面部２ａと内壁３ａの間
を接着するＵＶ接着剤である。[0003] 1 is a light receiving element for receiving a light beam reflected by a signal recording medium such as a disk, 2 is a printed circuit board to which the light receiving element 1 is fixed and terminals are connected, and 2a is a side surface of the printed circuit board 2 A concave portion for holding the printed circuit board 2, 3 a being an inner wall of the concave portion 3, provided on a housing (not shown) on which various optical components such as a semiconductor laser are mounted.
Reference numeral 4 denotes a through-hole provided in the concave portion 3 through which the light beam passes and irradiates the light receiving element 1. Reference numeral 5 denotes a UV adhesive for bonding between the side surface portion 2a and the inner wall 3a.
【０００４】プリント基板２と凹部３をＵＶ接着するに
は、まず、側面部２ａと内壁３ａの間隔及びプリント基
板２の奥行きを治具により規定位置に保持した状態にお
いて、側面部２ａと内壁３ａ間にＵＶ接着剤５を塗布
し、矢印Ａ方向よりＵＶ照射することによってＵＶ接着
剤５が硬化し、側面部２ａと内壁３ａが接着されるよう
になっている。[0004] In order to bond the printed board 2 and the recess 3 with UV, first, the side face 2a and the inner wall 3a are held in a state where the distance between the side face 2a and the inner wall 3a and the depth of the printed board 2 are held at specified positions by a jig. The UV adhesive 5 is applied in between, and the UV adhesive 5 is cured by irradiating UV from the direction of arrow A, so that the side surface portion 2a and the inner wall 3a are bonded.
【０００５】[0005]
【発明が解決しようとする課題】ところで、前述したよ
うな作業工程を経て受光素子１は接着されるが、ＵＶ接
着剤５の塗布量を一定にしても、ＵＶ照射するまでに多
くの時間を経過すると側面部２ａと内壁３ａ間に塗布さ
れたＵＶ接着剤５は図４に示す通り、奥行き方向へと広
がった状態を成す場合があり、矢印Ａ方向よりＵＶ照射
することによりＵＶ接着剤５は硬化するが、このように
接着したＵＶ接着剤５は、プリント基板２の側面２ａよ
り奥行きに流れた部分はＵＶ照射において、プリント基
板２の影になる部分の接着剤は硬化しない箇所が形成さ
れる。また、ＵＶ接着剤５は水平方向へと広がり左右の
バランスが崩れた状態においてＵＶ照射した後に硬化す
る接着剤とがある。By the way, the light receiving element 1 is adhered through the above-described working process. However, even if the applied amount of the UV adhesive 5 is kept constant, much time is required until the UV irradiation. As time passes, the UV adhesive 5 applied between the side surface 2a and the inner wall 3a may be in a state of spreading in the depth direction as shown in FIG. 4, and the UV adhesive 5 is irradiated by UV irradiation in the direction of arrow A. The UV adhesive 5 thus adhered forms a portion where the adhesive flowing in the shadow of the printed circuit board 2 does not cure in a portion that has flowed deeper than the side surface 2a of the printed circuit board 2 by UV irradiation. Is done. Further, the UV adhesive 5 includes an adhesive that spreads in the horizontal direction and cures after UV irradiation in a state in which the right and left balance is lost.
【０００６】このように硬化したプリント基板２は接着
面積が不均等になるため、左右のバランスが上下または
左右方向にずれを起こすことになる。従って、受光素子
１はレーザービームを規定された位置に正確に受光出来
ずにディスクの読み取りに悪影響を与えるという問題が
あった。The cured printed circuit board 2 has an uneven bonding area, so that the left and right balance is shifted vertically or horizontally. Therefore, there is a problem that the light receiving element 1 cannot accurately receive a laser beam at a specified position, which adversely affects reading of a disk.
【０００７】[0007]
【課題を解決するための手段】本発明は、受光素子が固
着されているプリント基板が設置されるハウジングの設
置部分に、該プリント基板より少許幅の広い凹部を形成
し、凹部における前記プリント基板の両側面部とそれぞ
れ対面する位置に接着剤を塗布する接着溝を設けたもの
である。According to the present invention, there is provided a printed circuit board in which a light receiving element is fixed and a printed circuit board to which a light receiving element is fixed is formed in a recess having a width slightly smaller than the printed circuit board. Adhesive grooves for applying an adhesive are provided at positions facing the both side surfaces of the substrate.
【０００８】[0008]
【実施例】図１は本発明に係る受光素子取付け装置の一
実施例を示す斜視図、図２は図１に示す受光素子取付け
装置の側面図である。FIG. 1 is a perspective view showing one embodiment of a light receiving element mounting apparatus according to the present invention, and FIG. 2 is a side view of the light receiving element mounting apparatus shown in FIG.
【０００９】図面番号においては、従来の技術に使用し
た名称については同一番号を使用した。図１及び図２に
おいて、１はディスク等の信号記録媒体により反射され
た光ビームを受光する受光素子、２は前記受光素子１が
固着されるとともに端子が接続されているプリント基
板、２ａはプリント基板２の両側面部を接着保持する側
面部、３は半導体レーザーを含む各種光学部品が搭載さ
れる記載されないハウジングに凹型に形成して設けると
ともに、前記内径は前記プリント基板２より少許幅が広
く、前記側面部２ａの両側面を凹型内径にて保持する為
の凹部、３１は前記側面部２ａと対向する面に位置する
凹部３の中央部に矩形状に切込まれた接着溝、４はディ
スク等の信号記録媒体による光ビームの反射を受光素子
１に照射するために凹部３に設けられた光ビームが通過
する為の貫通孔、５は前記側面部２ａと接着溝３１間を
接着するＵＶ接着剤である。In the drawing numbers, the same numbers are used for the names used in the prior art. 1 and 2, reference numeral 1 denotes a light receiving element for receiving a light beam reflected by a signal recording medium such as a disk, 2 denotes a printed board to which the light receiving element 1 is fixed and terminals are connected, and 2a denotes a printed circuit board. Side surfaces 3 for bonding and holding both side surfaces of the substrate 2 are formed in a concave shape in a housing not described in which various optical components including a semiconductor laser are mounted, and the inside diameter is slightly larger than the printed substrate 2, A concave portion for holding both side surfaces of the side surface portion 2a with a concave inner diameter, 31 is an adhesive groove cut into a rectangular shape at the center of the concave portion 3 located on a surface facing the side surface portion 2a, and 4 is a disk. A through hole provided in the concave portion 3 for irradiating the light receiving element 1 with the reflection of the light beam by the signal recording medium such as a through hole through which the light beam passes. That is a UV adhesive.
【００１０】プリント基板２と凹部３をＵＶ接着するに
は、まず、図１及び図２に示す通り受光素子１が固着さ
れたプリント基板２を治具により規定位置に保持した状
態において、側面部２ａと接着溝３１間にＵＶ接着剤５
を塗布するが、このように塗布したＵＶ接着剤５は側面
部２ａと接着溝３１に接着したＵＶ接着剤５と接着溝３
１に溜まるＵＶ接着剤５がある。In order to bond the printed circuit board 2 and the concave portion 3 by UV, first, as shown in FIGS. 1 and 2, the printed circuit board 2 to which the light receiving element 1 is fixed is held in a specified position by a jig. UV adhesive 5 between 2a and adhesive groove 31
Is applied, the UV adhesive 5 applied in this manner is the UV adhesive 5 adhered to the side surface portion 2a and the adhesive groove 31 and the adhesive groove 3
There is a UV adhesive 5 that collects in one.
【００１１】前記接着溝３１に溜まったＵＶ接着剤５は
表面張力が働き、時間が経過しても図２に示す通り矢印
Ａ方向であるプリント基板２ａの奥行きに流れ出すこと
なく左右対称な接着面積となる。The UV adhesive 5 accumulated in the adhesive groove 31 is subjected to surface tension, and does not flow to the depth of the printed circuit board 2a in the direction of arrow A as shown in FIG. Becomes
【００１２】このようにＵＶ接着剤が安定した状態にお
いて、矢印Ａ方向からＵＶ照射することによってＵＶ接
着材５は硬化し、側面部２ａのＵＶ接着剤５はＸ軸方向
やＹ軸方向ならびにＺ軸方向に対し均一状態に硬化する
ので受光素子１はＵＶ接着直後の設定位置よりずれが生
じない。従って、光ビームは貫通孔４を通過し受光素子
１により正確に受光されることになる。When the UV adhesive is stable in this way, the UV adhesive 5 is cured by irradiating UV in the direction of arrow A, and the UV adhesive 5 on the side surface 2a is moved in the X-axis direction, the Y-axis direction and the Z-axis direction. Since the light-receiving element 1 cures uniformly in the axial direction, the light-receiving element 1 does not deviate from the set position immediately after the UV bonding. Therefore, the light beam passes through the through hole 4 and is accurately received by the light receiving element 1.
【００１３】そして、本実施例では、接着溝の形状とし
て矩形状として説明したが、半円柱状や半球状にしても
同様な効果を得ることができる。In this embodiment, the shape of the adhesive groove is rectangular, but the same effect can be obtained by using a semi-cylindrical or hemispherical shape.
【００１４】また、本実施例では接着箇所をプリント基
板の中央部に設けたが、プリント基板の各コーナーに設
けることにより、同様な効果を得ることができる。In this embodiment, the bonding portion is provided at the center of the printed circuit board. However, similar effects can be obtained by providing the bonding portion at each corner of the printed circuit board.
【００１５】[0015]
【発明の効果】以上に述べた通り、本発明に依れば、受
光素子が固着されているプリント基板が設置されるハウ
ジングの設置部分に、該プリント基板より少許幅の広い
凹部を形成し、凹部における前記プリント基板の両側面
部とそれぞれ対面する位置に接着剤を塗布する接着溝を
設けたので接着剤が奥行に流れ出すことなく接着剤が左
右均一状態で硬化するので受光部の位置がずれることが
ない。従ってレーザービームは受光素子に正確に照射す
ることができるので、ディスクの読み取りエラーが発生
しないという効果を有している。As described above, according to the present invention, a recess having a width slightly smaller than that of the printed board is formed in the installation portion of the housing where the printed board to which the light receiving element is fixed is installed. An adhesive groove for applying an adhesive is provided at a position facing each side of the printed circuit board in the concave portion, so that the adhesive hardens in a uniform left and right state without flowing out into the depth, so that the position of the light receiving unit is shifted. There is no. Therefore, since the laser beam can be accurately applied to the light receiving element, there is an effect that a reading error of the disk does not occur.
【図１】本発明に係る受光素子取付け装置の一実施例を
示す斜視図である。FIG. 1 is a perspective view showing one embodiment of a light receiving element mounting device according to the present invention.
【図２】図１に示す受光素子取付け装置の側面図であ
る。FIG. 2 is a side view of the light receiving element mounting device shown in FIG.
【図３】従来の受光素子取付け装置の一実施例を示す斜
視図である。FIG. 3 is a perspective view showing one embodiment of a conventional light receiving element mounting device.
【図４】図３に示す受光素子取付け装置の側面図であ
る。FIG. 4 is a side view of the light receiving element mounting device shown in FIG. 3;
１ 受光素子 ２ プリント基板 ２ａ 側面部 ５ ＵＶ接着剤 ３ 凹部 ３１ 接着溝 DESCRIPTION OF SYMBOLS 1 Light-receiving element 2 Printed circuit board 2a Side surface part 5 UV adhesive 3 Depression 31 Adhesion groove
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5D117 AA02 HH10 HH12 KK23 5D119 AA32 AA36 BA01 KA01 KA40 KA41 NA06 5F088 AA01 BA16 BB10 JA03 JA20 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5D117 AA02 HH10 HH12 KK23 5D119 AA32 AA36 BA01 KA01 KA40 KA41 NA06 5F088 AA01 BA16 BB10 JA03 JA20
Claims (1)
させる光源として半導体レーザーを使用し、該半導体レ
ーザーを含む各種光学部品がハウジングに組込まれる光
ピックアップの受光素子取付け装置において、受光素子
が固着されているプリント基板が設置されるハウジング
の設置部分に、該プリント基板より少許幅の広い凹部を
形成し、凹部における前記プリント基板の両側面部とそ
れぞれ対面する位置に接着剤を塗布する接着溝を設けた
ことを特徴とする受光素子取付け装置。1. A light-receiving element mounting device for an optical pickup in which a semiconductor laser is used as a light source for generating a light beam for irradiating a signal recording medium and various optical parts including the semiconductor laser are incorporated in a housing. In the installation portion of the housing in which the printed circuit board is installed, a recess having a width slightly smaller than the printed circuit board is formed, and an adhesive groove for applying an adhesive is applied to a position in the recess that faces each of both side surfaces of the printed circuit board. A light receiving element mounting device, characterized in that it is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001177099A JP3920595B2 (en) | 2001-06-12 | 2001-06-12 | Light receiving element mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001177099A JP3920595B2 (en) | 2001-06-12 | 2001-06-12 | Light receiving element mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002368234A true JP2002368234A (en) | 2002-12-20 |
| JP3920595B2 JP3920595B2 (en) | 2007-05-30 |
Family
ID=19017995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001177099A Expired - Fee Related JP3920595B2 (en) | 2001-06-12 | 2001-06-12 | Light receiving element mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3920595B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008065948A (en) * | 2006-09-11 | 2008-03-21 | Sanyo Electric Co Ltd | Optical pickup device |
| JP2008293546A (en) * | 2007-05-22 | 2008-12-04 | Funai Electric Co Ltd | Optical pickup |
| US7665101B2 (en) * | 2005-06-20 | 2010-02-16 | Sanyo Electric Co., Ltd. | Optical pickup apparatus |
| JP2010097666A (en) * | 2008-10-17 | 2010-04-30 | Panasonic Corp | Optical pickup |
| JP2016001300A (en) * | 2014-05-20 | 2016-01-07 | キヤノン株式会社 | Image heating device |
-
2001
- 2001-06-12 JP JP2001177099A patent/JP3920595B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7665101B2 (en) * | 2005-06-20 | 2010-02-16 | Sanyo Electric Co., Ltd. | Optical pickup apparatus |
| US7934226B2 (en) | 2005-06-20 | 2011-04-26 | Sanyo Electric Co., Ltd. | Optical pickup apparatus |
| JP2008065948A (en) * | 2006-09-11 | 2008-03-21 | Sanyo Electric Co Ltd | Optical pickup device |
| JP2008293546A (en) * | 2007-05-22 | 2008-12-04 | Funai Electric Co Ltd | Optical pickup |
| JP2010097666A (en) * | 2008-10-17 | 2010-04-30 | Panasonic Corp | Optical pickup |
| JP4637225B2 (en) * | 2008-10-17 | 2011-02-23 | パナソニック株式会社 | Optical pickup |
| JP2016001300A (en) * | 2014-05-20 | 2016-01-07 | キヤノン株式会社 | Image heating device |
| US10303097B2 (en) | 2014-05-20 | 2019-05-28 | Canon Kabushiki Kaisha | Image heating apparatus having a heater and a supporting member that are bonded together at lateral surfaces thereof using an adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3920595B2 (en) | 2007-05-30 |
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