JP2002363676A - Aluminum alloy conductor - Google Patents

Aluminum alloy conductor

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Publication number
JP2002363676A
JP2002363676A JP2001168199A JP2001168199A JP2002363676A JP 2002363676 A JP2002363676 A JP 2002363676A JP 2001168199 A JP2001168199 A JP 2001168199A JP 2001168199 A JP2001168199 A JP 2001168199A JP 2002363676 A JP2002363676 A JP 2002363676A
Authority
JP
Japan
Prior art keywords
alloy
conductor
plating
plating film
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001168199A
Other languages
Japanese (ja)
Other versions
JP4593013B2 (en
Inventor
Hidemichi Fujiwara
英道 藤原
Yoshito Inabayashi
芳人 稲林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
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Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2001168199A priority Critical patent/JP4593013B2/en
Publication of JP2002363676A publication Critical patent/JP2002363676A/en
Application granted granted Critical
Publication of JP4593013B2 publication Critical patent/JP4593013B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a lightweight, inexpensive Al alloy conductor which has required strength and electrical conductivity, has good creep resistance and excellent electrical connecting characteristics and also has excellent corrosion resistance. SOLUTION: This aluminum alloy conductor is obtained by providing an Al alloy treated material obtained by subjecting an Al alloy material having a composition containing, by mass, 0.3 to 0.8% Si and 0.35 to 1.0% Mg, and further containing one or more kinds selected from 0.1 to 0.6% Fe, 0.02 to 0.1% Cu and 0.01 to 0.08% Mn, and the balance Al with inevitable impurities to T6, T8 or T5 tratment with an Ni-P alloy plating film having a thickness of 0.1 to 3 μm, or an Ni-B alloy plating film having a thickness of 0.3 to 3 μm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は自動車用導電体、特
にハイブリッドカーを含めた電気自動車用の導電体に適
した大電流通電用アルミニウム合金導電体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor for automobiles, and more particularly to an aluminum alloy conductor for high-current application suitable for conductors for electric vehicles including hybrid cars.

【0002】[0002]

【従来の技術】従来、電気自動車では、電池群と電気機
器(インバータ、モータなど)間の電気的接続、各電池
間の電気的接続、インバータ内回路などには大電流通電
に適した純銅製の導電母材(平角状、板状などの導体で
以下導電体と記す)が用いられ、また前記導電体は前記
電気機器などとボルト締めにより接続されている。しか
し、近年、燃費低減を目的に自動車の軽量化が強く求め
られ、前記の銅導電体を軽量なアルミニウム(以下適宜
Alと記す)またはAl合金に代える動きが活発であ
る。
2. Description of the Related Art Conventionally, in an electric vehicle, electric connection between a group of batteries and electric equipment (an inverter, a motor, etc.), electric connection between each battery, circuits in the inverter, etc. are made of pure copper suitable for large current application. (A conductor having a rectangular shape, a plate shape, or the like, and hereinafter referred to as a conductor) is used, and the conductor is connected to the electric device or the like by bolting. However, in recent years, there has been a strong demand for reducing the weight of automobiles for the purpose of reducing fuel consumption, and there has been an active movement to replace the copper conductor with lightweight aluminum (hereinafter appropriately referred to as Al) or Al alloy.

【0003】因みに、前記銅導電体をAlまたはAl合
金導電体(以下適宜Al導電体と記す)に代える場合、
銅の比重が8.89で、Alの比重が2.70であるこ
と、純銅の導電率100%IACSに対しAl(106
0)の導電率は61%IACSであることから、電気抵
抗を同じにした場合は、Al導電体は、断面積が銅導電
体の160%に増加するが重量は50%に減少する。通
電電流を同じにした場合は、Al導電体は、断面積が銅
導電体の125%に増加するが重量は40%に減少す
る。これらのことから、電気的使用条件が同じなら、A
l導電体は銅導電体の半分以下の重量で足りることにな
る。
When the copper conductor is replaced with an Al or Al alloy conductor (hereinafter, appropriately referred to as an Al conductor),
The specific gravity of copper is 8.89 and the specific gravity of Al is 2.70.
Since the electrical conductivity of 0) is 61% IACS, when the electrical resistance is the same, the cross section of the Al conductor increases to 160% of the copper conductor, but the weight decreases to 50%. When the current is the same, the cross section of the Al conductor increases to 125% of that of the copper conductor, but the weight decreases to 40%. From these facts, if the electrical use conditions are the same, A
The 1 conductor will weigh less than half the copper conductor.

【0004】ところで、地上の配電設備などのAl導電
体には、1060(Al99.60%以上の純Al)、
6101(Al−0.5%Si−0.5%Mg合金)、
6063(Al−0.4%Si−0.7%Mg合金)、
6061(Al−0.6%Si−1.0%Mg−0.3
%Cu−0.2%Cr合金)などのAlまたはAl合金
が用いられている(JIS H 4180)。前記Al
またはAl合金の成分(組成)および導電率を表1に、
前記1060、6101および銅の室温における機械的
性質を表2に示す。
Incidentally, Al conductors such as power distribution facilities on the ground include 1060 (pure Al of 99.60% or more Al),
6101 (Al-0.5% Si-0.5% Mg alloy),
6063 (Al-0.4% Si-0.7% Mg alloy),
6061 (Al-0.6% Si-1.0% Mg-0.3
% Cu-0.2% Cr alloy) or an Al alloy is used (JIS H 4180). The Al
Table 1 shows the component (composition) and conductivity of the Al alloy.
Table 2 shows the mechanical properties of the 1060, 6101 and copper at room temperature.

【0005】[0005]

【表1】 [Table 1]

【0006】[0006]

【表2】 [Table 2]

【0007】表1および表2から分かるように、純Al
の1060硬材は導電率は高いが強度が低い。Al−S
i−Mg系合金の6101−T6処理材は強度が銅の半
硬材(1/2H)と同等で、導電率も55%IACS以
上あり、Al合金の中では最も高い。従って銅導電体に
代わるAl導電体としては6101合金相当材が最適と
考えられる。しかし電気自動車用導電体に用いるには次
の課題をクリヤーする必要がある。
As can be seen from Tables 1 and 2, pure Al
No. 1060 hardwood has high conductivity but low strength. Al-S
The 6101-T6 treated material of the i-Mg alloy has the same strength as the semi-hard material (1 / 2H) of copper, has a conductivity of 55% IACS or more, and is the highest among Al alloys. Therefore, it is considered that a material equivalent to the 6101 alloy is optimal as the Al conductor instead of the copper conductor. However, the following problems need to be cleared in order to use the conductor for electric vehicles.

【0008】即ち、自動車用導電体は使用時の温度上昇
(100℃前後)に伴う熱サイクルが長期間繰り返され
ることから、Al導電体には(1)耐クリープ特性に優
れ、使用中にボルト締め付け部に緩みが生じず良好な電
気接続特性が安定して得られること、(2)特に接続部
での耐食性に優れることが要求される。
That is, since a heat cycle of an automotive conductor is repeated for a long period of time with a temperature rise (around 100 ° C.) during use, the Al conductor has (1) excellent creep resistance and bolts during use. It is required that good electrical connection characteristics can be stably obtained without loosening of the fastening portion, and (2) excellent corrosion resistance especially at the connection portion.

【0009】ところで、地上の配電設備ではAl導電体
は、通常、表面処理なしで裸で使用されるが、腐食環境
が厳しく耐食性が要求される電気機器はCuとAgの2
層メッキやSn−Zn合金半田(摩擦半田)メッキを施
して使用される場合がある。このため、本発明者らは、
Al合金表面にNiとSnを2層にメッキし、Niメッ
キにより耐熱性を向上させ、2層メッキとすることによ
り電気接続性を向上させた自動車用Al合金導電体を提
案した(特願平11−9136)。しかし2層メッキは
コスト高となるうえ、メッキ作業に手間が掛かるため、
メッキ層は単層が好ましく、その場合、耐食性が良好な
Niメッキが推奨される。しかし従来のNiメッキでは
ボルトで強く締め付けるとメッキ皮膜が剥離し、その部
分の耐食性や耐酸化性が低下して導電体に必要な電気接
続特性が得られなくなるという問題があった。
[0009] By the way, in the distribution equipment on the ground, the Al conductor is usually used without any surface treatment, but the electric equipment which has a severe corrosive environment and requires corrosion resistance is made of Cu and Ag.
It may be used after being subjected to layer plating or Sn-Zn alloy solder (friction solder) plating. For this reason, the present inventors
We have proposed an Al alloy conductor for automobiles in which Ni and Sn are plated in two layers on the surface of the Al alloy, the heat resistance is improved by Ni plating, and the electrical connectivity is improved by forming a two-layer plating (Japanese Patent Application No. Hei 10-26370). 11-9136). However, two-layer plating is costly and requires a lot of work for plating.
The plating layer is preferably a single layer, in which case Ni plating with good corrosion resistance is recommended. However, the conventional Ni plating has a problem in that when it is strongly tightened with a bolt, the plating film is peeled off, and the corrosion resistance and oxidation resistance of that portion are reduced, and the electrical connection characteristics required for the conductor cannot be obtained.

【0010】[0010]

【発明が解決しようとする課題】本発明の目的は、軽量
で、所要の強度および導電性を有し、耐クリープ特性が
良好で電気接続特性に優れ、耐食性にも優れ、かつ安価
なAl合金導電体を提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide an aluminum alloy which is lightweight, has the required strength and conductivity, has good creep resistance, has excellent electrical connection characteristics, has excellent corrosion resistance, and is inexpensive. It is to provide a conductor.

【0011】[0011]

【課題を解決するための手段】請求項1記載の発明は、
Si0.3〜0.8mass%(以下適宜%と略記する)、
Mg0.35〜1.0%を含有し、さらにFe0.1〜
0.6%、Cu0.02〜0.1%、Mn0.01〜
0.08%のうちの1種または2種以上を含有し残部が
Alおよび不可避不純物からなるAl合金材にT6、T
8またはT5処理を施したAl合金処理材に厚さ0.1
〜3μmのNi−P合金メッキ皮膜または厚さ0.3〜
3μmのNi−B合金メッキ皮膜が設けられていること
を特徴とするアルミニウム合金導電体である。
According to the first aspect of the present invention,
Si 0.3 to 0.8 mass% (hereinafter abbreviated as% as appropriate),
Contains 0.35 to 1.0% of Mg, and further contains 0.1 to 0.1% of Fe
0.6%, Cu 0.02-0.1%, Mn 0.01-
An Al alloy material containing one or more of 0.08% and the balance consisting of Al and inevitable impurities is T6, T
8 or T5 treated Al alloy treated material with a thickness of 0.1
~ 3μm Ni-P alloy plating film or thickness 0.3 ~
An aluminum alloy conductor provided with a 3 μm Ni—B alloy plating film.

【0012】請求項2記載の発明は、前記Ni−P合金
メッキ皮膜またはNi−B合金メッキ皮膜のビッカース
硬さが500〜1200Hvであることを特徴とする請
求項1記載のアルミニウム合金導電体である。
According to a second aspect of the present invention, there is provided the aluminum alloy conductor according to the first aspect, wherein the Ni-P alloy plating film or the Ni-B alloy plating film has a Vickers hardness of 500 to 1200 Hv. is there.

【0013】[0013]

【発明の実施の形態】以下に本発明の構成、作用、効果
および実施形態について詳細に説明する。本発明で用い
るAl合金はSiおよびMgを主要合金元素とする。こ
れら元素はAlマトリックス中に固溶して或いはMg2
Si粒子として微細に析出して強度を高め、導電体の変
形を防止する。SiまたはMgのいずれが本発明規定値
の下限未満でも、その固溶量或いはMg2 Si粒子量が
減少して十分な強度が得られず、いずれが本発明規定値
の上限を上回ってもその固溶量が増加して導電率が低下
し、またMg2 Si粒子が粗大化して成形性が低下す
る。
BEST MODE FOR CARRYING OUT THE INVENTION The structure, operation, effects and embodiments of the present invention will be described in detail below. The Al alloy used in the present invention has Si and Mg as main alloy elements. These elements are dissolved in Al matrix or Mg 2
It precipitates finely as Si particles to increase the strength and prevent deformation of the conductor. Even if any of Si or Mg is less than the lower limit of the specified value of the present invention, the amount of solid solution or the amount of Mg 2 Si particles is reduced and sufficient strength cannot be obtained. The amount of solid solution increases and the electrical conductivity decreases, and the Mg 2 Si particles become coarse and the formability decreases.

【0014】副成分のFe、Mn、Cuは導電体の強度
および耐クリープ特性を高める。このうち、Fe、Mn
は、Alと金属間化合物を形成し、分散強化により強度
を向上させる。また前記金属間化合物が微細に析出して
亜結晶粒組織や再結晶粒組織を安定させ、通電時の発熱
により組織内に生じる歪みの回復を阻止して耐クリープ
特性を向上させる。Cuは固溶して導電体の強度および
耐クリープ特性を向上させる。副成分のいずれが本発明
規定値の下限未満でも、その効果が十分に得られず、上
限を超えると成形性が低下する。
The subcomponents Fe, Mn and Cu enhance the strength and creep resistance of the conductor. Of these, Fe, Mn
Forms an intermetallic compound with Al and improves strength by dispersion strengthening. Further, the intermetallic compound is finely precipitated to stabilize the sub-crystal grain structure and the recrystallized grain structure, and prevents the recovery of the strain generated in the structure due to the heat generated during energization, thereby improving the creep resistance. Cu forms a solid solution to improve the strength and creep resistance of the conductor. If any of the subcomponents is less than the lower limit of the present invention, the effect cannot be sufficiently obtained, and if it exceeds the upper limit, the moldability decreases.

【0015】前記本発明で用いるAl合金は導電体形状
に加工されたあと、T6、T8またはT5のいずれかの
処理が施されて強度や耐クリープ特性が調整される。前
記T6、T8またはT5処理後のAl合金処理材の室温
における機械的性質は表3に示す通りである。
After the Al alloy used in the present invention is processed into a conductor shape, any one of T6, T8 and T5 is applied to adjust the strength and creep resistance. The mechanical properties at room temperature of the Al alloy treated material after the T6, T8 or T5 treatment are as shown in Table 3.

【0016】[0016]

【表3】 [Table 3]

【0017】前記Al合金処理材は、その表面にNi−
P合金メッキ皮膜またはNi−B合金メッキ皮膜を設け
て耐食性と電気特性(接続部の電気の接触抵抗)が高め
られる。本発明において、Ni−P合金メッキ皮膜の厚
さを0.1〜3μmに、Ni−B合金メッキ皮膜の厚さ
を0.3〜3μmにそれぞれ規定するのは、前記下限値
未満ではメッキによる前記効果が十分に得られず、上限
値(3μm)を超えるとメッキ皮膜が剥離し易くなるう
え、メッキコストが高くなるためである。前記皮膜の厚
さは、特性およびコスト面から1〜3μmがより好まし
い。
The Al alloy-treated material has a Ni—
By providing a P alloy plating film or a Ni-B alloy plating film, corrosion resistance and electric characteristics (electrical contact resistance of the connection portion) are improved. In the present invention, the thickness of the Ni—P alloy plating film is set to 0.1 to 3 μm, and the thickness of the Ni—B alloy plating film is set to 0.3 to 3 μm. This is because the effect cannot be sufficiently obtained, and if it exceeds the upper limit (3 μm), the plating film is easily peeled off and the plating cost becomes high. The thickness of the film is more preferably from 1 to 3 μm in view of characteristics and cost.

【0018】前記Ni−P合金メッキ皮膜またはNi−
B合金メッキ皮膜のビッカース硬さ(以下硬さと略記す
る)は500〜1200Hvが好ましい。前記硬さが5
00Hvより低いと、導電体を電気接続する際などに表
面に傷がつき、外観不良や電気接続特性の低下を招き、
さらに傷の部分から腐食が進行する。一方、硬さが12
00Hvより高いと、ボルト締め付け時に割れが発生
し、耐食性および電気接続特性が低下する。前記硬さ
は、主に合金元素濃度により制御し、メッキ浴のpH、
電流密度、スルファミン酸の添加量などにより微調整す
る。Ni−P合金メッキおよびNi−B合金メッキと
も、合金濃度は3〜8mass%が適当である。
The Ni-P alloy plating film or Ni-
The Vickers hardness (hereinafter abbreviated as hardness) of the B alloy plating film is preferably from 500 to 1200 Hv. The hardness is 5
If it is lower than 00Hv, the surface is damaged when the conductor is electrically connected and the like, resulting in poor appearance and deterioration of the electrical connection characteristics,
Further, corrosion progresses from the wound. On the other hand, hardness is 12
If it is higher than 00 Hv, cracks occur at the time of bolt tightening, and the corrosion resistance and the electrical connection characteristics decrease. The hardness is controlled mainly by the alloy element concentration, the pH of the plating bath,
Fine adjustment is made according to the current density and the amount of sulfamic acid added. For both Ni-P alloy plating and Ni-B alloy plating, an alloy concentration of 3 to 8 mass% is appropriate.

【0019】本発明のAl合金導電体は、Al圧延材や
Al押出材を切断、打抜き、曲げ加工などにより所定形
状の平角材(例えば2×20×200mm)や板材(例
えば2×200×200mm)に加工し、前記平角材ま
たは板材にボルト穴を開け、次いでNi−P合金メッキ
またはNi−B合金メッキを施して製造される。
The Al alloy conductor of the present invention can be formed by cutting, punching, or bending an Al rolled material or an Al extruded material into a flat rectangular material (for example, 2 × 20 × 200 mm) or a plate material (for example, 2 × 200 × 200 mm). ), A bolt hole is formed in the rectangular material or the plate material, and then Ni-P alloy plating or Ni-B alloy plating is performed.

【0020】以下に、本発明のAl合金導電体を熱間圧
延により製造する場合と、熱間押出しにより製造する場
合に分けて具体的に説明する。熱間圧延により製造する
場合は、本発明で規定する成分のAl合金を半連続鋳造
法などの常法により鋳塊とし、この鋳塊を500〜54
0℃の温度で均質化処理(ソーキング)後、熱間圧延と
冷間圧延をこの順に施して所定板厚とする。この冷間圧
延の前後または途中に500℃以上の温度に保持したの
ち、冷却(200℃までは1℃/sec以上の冷却速度
で冷却)する溶体化処理を施し、続いて必要に応じて最
終冷間圧延を行い、最後に150〜250℃の温度で時
効硬化処理を施す。なお、前記冷間圧延の前または途中
に溶体化処理を施すのがT8処理であり、前記冷間圧延
後に溶体化処理を施すのがT6処理である。
The case where the Al alloy conductor of the present invention is manufactured by hot rolling and the case where it is manufactured by hot extrusion will be specifically described below. In the case of manufacturing by hot rolling, the Al alloy of the component specified in the present invention is formed into an ingot by a normal method such as a semi-continuous casting method, and the ingot is formed into a 500 to 54
After homogenization (soaking) at a temperature of 0 ° C., hot rolling and cold rolling are performed in this order to obtain a predetermined thickness. After maintaining at a temperature of 500 ° C. or more before, during or after this cold rolling, a solution treatment for cooling (cooling at a cooling rate of 1 ° C./sec or more up to 200 ° C.) is performed. Cold rolling is performed, and finally, an age hardening treatment is performed at a temperature of 150 to 250 ° C. The T8 treatment is to perform the solution treatment before or during the cold rolling, and the T6 treatment is to perform the solution treatment after the cold rolling.

【0021】前記鋳塊の均質化処理を500〜540℃
の温度で施すのは、合金元素の固溶量を増やすためで、
500℃未満では合金元素が十分に固溶せず、540℃
を超えると鋳塊が部分的に溶融する恐れがあるからであ
る。
The ingot is homogenized at 500 to 540 ° C.
The temperature is adjusted to increase the amount of solid solution of alloying elements.
If the temperature is lower than 500 ° C., the alloy element does not form a solid solution, and the
This is because if it exceeds 300 mm, the ingot may be partially melted.

【0022】前記溶体化処理を、500℃以上の温度に
保持した後冷却(200℃または1℃/sec以上の冷
却速度で冷却)して施すのは、保持温度が500℃未満
でも冷却速度が1℃/sec未満でも合金元素が十分に
固溶しないからである。
The solution treatment is carried out at a temperature of 500 ° C. or more and then cooling (cooling at a cooling rate of 200 ° C. or 1 ° C./sec or more). This is because the alloying element does not sufficiently form a solid solution even at less than 1 ° C./sec.

【0023】前記時効処理は、過剰に固溶したMg、S
i、Cu元素をMg2 SiやCu化合物として析出させ
て導電体の強度をより向上させるために施す。その処理
温度を150〜250℃にするのは、150℃未満では
析出量が不足し、250℃を超えると析出物が粗大化し
ていずれも十分な強度が得られないためである。
The above-mentioned aging treatment is carried out by using Mg, S
i, Cu element is deposited in order to further enhance the strength of the conductor by precipitating it as Mg 2 Si or a Cu compound. The reason for setting the treatment temperature to 150 to 250 ° C. is that if the temperature is lower than 150 ° C., the amount of precipitation is insufficient, and if the temperature exceeds 250 ° C., the precipitates are coarsened, and any of them cannot obtain sufficient strength.

【0024】本発明のAl合金導電体を熱間押出しによ
り製造する場合は、前記熱間圧延の場合と同様にして得
た鋳塊を500〜540℃の温度で均質化処理した後、
熱間押出し、次いで冷間引抜きする。前記冷間引抜の前
後または途中に500℃以上の温度で保持後冷却(20
0℃までは1℃/sec以上の冷却速度で冷却)する溶
体化処理を施し、続いて必要に応じて所定の冷間引抜を
行い、最後に150〜250℃の温度で時効硬化処理を
施す。
When the Al alloy conductor of the present invention is manufactured by hot extrusion, the ingot obtained in the same manner as in the hot rolling is homogenized at a temperature of 500 to 540 ° C.
Hot extrusion followed by cold drawing. After holding at a temperature of 500 ° C. or more before or after or during the cold drawing, cooling (20
(Cooling at a cooling rate of 1 ° C./sec or more to 0 ° C.), followed by predetermined cold drawing if necessary, and finally, age hardening at 150 to 250 ° C. .

【0025】前記冷間引抜の前または途中に溶体化処理
を施すのがT8処理であり、前記冷間引抜後に溶体化処
理を施すのがT6処理である。熱間押出し時の製出材を
そのまま焼入れ、次いで時効硬化処理を施すのがT5処
理である。このT5処理では溶体化処理を省略できる。
The T8 treatment is to perform the solution treatment before or during the cold drawing, and the T6 treatment is to perform the solution treatment after the cold drawing. T5 treatment is to harden the material produced during hot extrusion as it is and then to perform age hardening treatment. In the T5 treatment, the solution treatment can be omitted.

【0026】前記均質化処理、溶体化処理(焼入れ)、
時効硬化処理の条件は、熱間圧延の場合と同じ理由で設
定される。
The above homogenization treatment, solution treatment (quenching),
The conditions of the age hardening treatment are set for the same reason as in the case of hot rolling.

【0027】[0027]

【実施例】以下に本発明を実施例により詳細に説明す
る。 (実施例1)表4に示す本発明規定組成のAl合金(N
o.1、3、4)を溶解鋳造し、得られた鋳塊を540
℃で均質化処理後、熱間圧延し、次いで厚さ5mmに冷
間圧延し、この冷間圧延材に540℃で溶体化処理後2
00℃まで20℃/secの冷却速度で冷却し、次いで
200℃で2時間時効硬化処理を施して(T6処理)A
l合金処理材を製造した。
The present invention will be described below in detail with reference to examples. (Example 1) An Al alloy (N
o. 1, 3, 4) is melt-cast and the obtained ingot is 540
After hot-rolled at 540 ° C., then cold-rolled to a thickness of 5 mm, and the cold-rolled material was subjected to solution treatment at 540 ° C.
It is cooled at a cooling rate of 20 ° C./sec to 00 ° C., and then subjected to an age hardening treatment at 200 ° C. for 2 hours (T6 treatment).
An alloy treated material was manufactured.

【0028】(実施例2)表4に示す本発明規定組成の
Al合金(No.2)を溶解鋳造し、得られた鋳塊に5
40℃で均質化処理後、熱間圧延し、次いで厚さ7mm
に冷間圧延材し、前記冷間圧延材に540℃で溶体化処
理後、厚さ5mmに再び冷間圧延し、この冷間圧延材に
200℃で2時間の時効硬化処理を施して(T8処理)
Al合金処理材を製造した。
(Example 2) An aluminum alloy (No. 2) having the composition specified in the present invention shown in Table 4 was melt-cast, and 5
After homogenization at 40 ° C, hot rolling, then 7mm thick
After cold-rolled, the cold-rolled material is solution-treated at 540 ° C., cold-rolled again to a thickness of 5 mm, and the cold-rolled material is subjected to age hardening at 200 ° C. for 2 hours ( T8 processing)
An Al alloy treated material was manufactured.

【0029】(比較例1)表4に示す本発明規定組成外
のAl合金(No.5〜12)を用いた他は、実施例1
と同じ方法によりAl合金処理材を製造した。
Comparative Example 1 Example 1 was repeated except that an Al alloy (Nos. 5 to 12) not shown in Table 4 was used.
An Al alloy treated material was manufactured in the same manner as in the above.

【0030】実施例1、2および比較例1で製造した各
々のAl合金処理材について、室温での導電率および耐
クリープ特性(高温状態におけるボルト締め接続部の耐
クリープ特性)を測定した。前記耐クリープ特性は、板
材サンプル(5mm×20mm×20mm)の表面に定
圧荷重(1.2ton/cm2 )を負荷し、この状態で
120℃に3時間保持後室温まで冷却して板厚tを測定
し、元の板厚(5mm)Tに対する板厚減少比率
((〔T−t〕/T)×100%)を求めて評価した。
なお、参考のため、従来の銅板材(半硬)および純Al
板材(1060半硬)についても、同様に試験して、導
電率と耐クリープ特性を評価した。結果を表4に併記し
た。
With respect to each of the Al alloy-treated materials produced in Examples 1 and 2 and Comparative Example 1, the electrical conductivity at room temperature and the creep resistance (the creep resistance of the bolted connection in a high temperature state) were measured. The creep resistance characteristics were determined by applying a constant pressure load (1.2 ton / cm 2 ) to the surface of a sheet material sample (5 mm × 20 mm × 20 mm), maintaining at 120 ° C. for 3 hours in this state, and cooling to room temperature to obtain a sheet thickness t. Was measured, and a thickness reduction ratio (([Tt] / T) × 100%) with respect to the original thickness (5 mm) T was obtained and evaluated.
For reference, conventional copper plate material (semi-hard) and pure Al
The plate (1060 semi-hard) was also tested in the same manner to evaluate the conductivity and the creep resistance. The results are shown in Table 4.

【0031】[0031]

【表4】 [Table 4]

【0032】表4から明らかなように、本発明のAl合
金処理材(No.1〜4)はいずれも導電率が55%I
ACS以上であり、従来の純銅材と同等の優れた耐クリ
ープ特性を示した。これに対し、比較例の(No.5〜
12)は、いずれも導電率が55%IACS未満か、耐
クリープ特性が劣った。
As is clear from Table 4, the aluminum alloy treated materials (Nos. 1 to 4) of the present invention all have a conductivity of 55% I.
ACS or higher, and exhibited excellent creep resistance equivalent to that of a conventional pure copper material. On the other hand, (No.
12) had an electrical conductivity of less than 55% IACS or was inferior in creep resistance.

【0033】(実施例3)実施例1で製造したNo.1
(表4参照)のAl合金処理材(5×30×100m
m)に8mm径のボルト穴を開けたのち、常法により、
種々組成のNi−P合金またはNi−B合金をメッキし
てAl合金導電体を製造した。メッキ皮膜厚さは本発明
規定値内で種々に変化させた。
(Embodiment 3) 1
(See Table 4) Al alloy treated material (5 × 30 × 100 m)
m), after drilling an 8mm diameter bolt hole,
An Al alloy conductor was manufactured by plating Ni-P alloys or Ni-B alloys of various compositions. The plating film thickness was variously changed within the specified value of the present invention.

【0034】(比較例2)メッキ厚さを3μmを超える
厚さとした他は、実施例3と同じ方法によりAl合金導
電体を製造した。
Comparative Example 2 An Al alloy conductor was manufactured in the same manner as in Example 3, except that the plating thickness was more than 3 μm.

【0035】(比較例3)Ni−P合金メッキまたはN
i−B合金メッキに代え、NiとSnの2層メッキとし
た他は、実施例3と同じ方法によりAl合金導電体を製
造した。
(Comparative Example 3) Ni-P alloy plating or N
An Al alloy conductor was manufactured in the same manner as in Example 3, except that two layers of Ni and Sn were used instead of the iB alloy plating.

【0036】実施例3および比較例2、3で製造した各
々のAl合金導電体について、耐クリープ特性および耐
食性を調査した。また処理コストを比較した。比較のた
め、従来のCuとAgの2層メッキまたは摩擦半田メッ
キしたAl合金導電体についても同様の試験を行い評価
を行った。
The Al alloy conductors produced in Example 3 and Comparative Examples 2 and 3 were examined for creep resistance and corrosion resistance. The processing costs were compared. For comparison, a similar test was performed on a conventional Al alloy conductor plated with two layers of Cu and Ag or subjected to friction solder plating, and evaluated.

【0037】耐クリープ特性は、前記各々のAl合金導
電体を所定寸法に切り出して供試材とし、この供試材を
各2枚づつ重ね合わせ(合わせ部の長さ10mm)、こ
の重ね合わせ材をフランジ付きボルト・ナットで定圧荷
重1.2ton/cm2 で締め付け(ボルトの締め付け
トルク1.2kg・m)、この締め付け体に、120℃
と室温で各12時間保持する工程を1サイクルとする熱
サイクル試験を240時間(10サイクル、10日間)
施し、試験前後の電気的接触抵抗を測定して評価した。
前記フランジ付きボルト・ナットには、フランジ部の径
が12mm、ボルト径が6mmのCrメッキしたステン
レス製のものを用いた。
The creep resistance characteristics were determined by cutting each of the Al alloy conductors to a predetermined size to obtain a test material, and laminating two test materials each (a length of a joining portion of 10 mm). With a flanged bolt / nut at a constant pressure load of 1.2 ton / cm 2 (bolt tightening torque: 1.2 kg · m).
And a heat cycle test for 240 hours (10 cycles, 10 days), in which each cycle is a step of holding at room temperature for 12 hours.
And the electrical contact resistance before and after the test was measured and evaluated.
The flanged bolt / nut used was a Cr-plated stainless steel having a flange diameter of 12 mm and a bolt diameter of 6 mm.

【0038】耐食性は、前記熱サイクル試験で用いた締
め付け体に塩水噴霧試験を96時間(4日)施し、試験
後の合わせ材のボルト締め付け部とそれ以外の部分(他
部)の腐食状況を観察し評価した。結果を表5に示す。
The corrosion resistance was evaluated by subjecting the tightened body used in the heat cycle test to a salt spray test for 96 hours (4 days), and examining the corrosion state of the bolted portion of the bonded material after the test and other portions (other portions). Observed and evaluated. Table 5 shows the results.

【0039】[0039]

【表5】 [Table 5]

【0040】表5から明らかなように、本発明例のN
o.15〜22はいずれも、耐クリープ特性および耐食
性に優れ、処理コストも安価であった。特にNo.16
〜21はメッキ皮膜の硬さが適正であり接触抵抗がより
安定して低い値を示した。これに対し、比較例のNo.
23、24はNiメッキ層が厚かったため、ボルト締め
付け時にNiメッキ層に割れが入り耐食性が劣った。N
o.25は2層メッキのため表面処理に手間が掛かり、
コスト高になった。また従来のCuとAgの2層メッキ
材(No.26)および摩擦半田材(No.27)はい
ずれも処理コストが高くなり、また後者は耐食性が劣っ
た。このように、本発明の導電体は、接触抵抗が安定し
て低く、耐食性に優れ、かつ処理コストが安く、従って
製品としての総合評価が非常に良好または良好である。
As is apparent from Table 5, the N of the present invention example
o. All of Nos. 15 to 22 were excellent in creep resistance and corrosion resistance, and the processing cost was low. In particular, no. 16
Nos. 21 to 21 showed that the hardness of the plating film was appropriate and the contact resistance was more stable and lower. On the other hand, in Comparative Example No.
In Nos. 23 and 24, since the Ni plating layer was thick, the Ni plating layer was cracked at the time of bolt tightening, resulting in poor corrosion resistance. N
o. 25 is a two-layer plating, which requires time-consuming surface treatment.
The cost was high. In addition, the conventional two-layer plating material of Cu and Ag (No. 26) and the friction solder material (No. 27) all have high processing costs, and the latter has poor corrosion resistance. As described above, the conductor of the present invention has a stable and low contact resistance, is excellent in corrosion resistance, and has a low processing cost. Therefore, the overall evaluation as a product is very good or good.

【0041】[0041]

【発明の効果】以上に述べたように、本発明のAl合金
導電体は、従来の銅導電体に較べて軽量であり、所要の
強度および導電性を有し、耐クリープ特性が良好で電気
接続特性に優れ、耐食性にも優れ、またメッキ処理コス
トも安い。依って、工業上顕著な効果を奏する。
As described above, the Al alloy conductor of the present invention is lighter than conventional copper conductors, has the required strength and conductivity, has good creep resistance, and has good electrical properties. Excellent connection characteristics, excellent corrosion resistance, and low plating cost. Therefore, an industrially significant effect is achieved.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // B21B 3/00 B21B 3/00 J ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (reference) // B21B 3/00 B21B 3/00 J

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 Si0.3〜0.8mass%(以下適宜%
と略記する)、Mg0.35〜1.0%を含有し、さら
にFe0.1〜0.6%、Cu0.02〜0.1%、M
n0.01〜0.08%のうちの1種または2種以上を
含有し残部がAlおよび不可避不純物からなるAl合金
材にT6、T8またはT5処理を施したAl合金処理材
に厚さ0.1〜3μmのNi−P合金メッキ皮膜または
厚さ0.3〜3μmのNi−B合金メッキ皮膜が設けら
れていることを特徴とするアルミニウム合金導電体。
1. Si 0.3 to 0.8 mass% (hereinafter referred to as%
Abbreviated as Mg), Mg 0.35 to 1.0%, Fe 0.1 to 0.6%, Cu 0.02 to 0.1%, M
n of an Al alloy material containing one or more of 0.01 to 0.08% and the balance consisting of Al and unavoidable impurities is subjected to T6, T8, or T5 treatment, and the thickness of the Al alloy material is set to 0.1 mm. An aluminum alloy conductor provided with a Ni-P alloy plating film having a thickness of 1 to 3 m or a Ni-B alloy plating film having a thickness of 0.3 to 3 m.
【請求項2】 前記Ni−P合金メッキ皮膜またはNi
−B合金メッキ皮膜のビッカース硬さが500〜120
0Hvであることを特徴とする請求項1記載のアルミニ
ウム合金導電体。
2. The Ni-P alloy plating film or Ni
Vickers hardness of -B alloy plating film is 500 to 120
2. The aluminum alloy conductor according to claim 1, wherein the aluminum alloy conductor is 0 Hv.
JP2001168199A 2001-06-04 2001-06-04 Aluminum alloy conductor Expired - Fee Related JP4593013B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015014027A (en) * 2013-07-05 2015-01-22 三菱アルミニウム株式会社 Aluminum alloy sheet for electrification part and production method thereof
CN105703096A (en) * 2016-04-15 2016-06-22 河北欣意电缆有限公司 Copper-aluminum transition terminal of Al-Fe-Mn-RE aluminum alloy cable and preparation method thereof
CN114737089A (en) * 2022-05-24 2022-07-12 国网智能电网研究院有限公司 Aluminum alloy material and preparation method and application thereof

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Publication number Priority date Publication date Assignee Title
JPS5358689A (en) * 1976-11-08 1978-05-26 Sumitomo Electric Ind Ltd Improved aluminium busbar
JPS5510789A (en) * 1978-03-31 1980-01-25 Pechiney Aluminium Methdo of manufacturing electric contact
JPH02213004A (en) * 1989-02-10 1990-08-24 Sky Alum Co Ltd Conductive component of aluminium alloy for electronic equipment
JP2000207940A (en) * 1999-01-18 2000-07-28 Furukawa Electric Co Ltd:The Conductor of al alloy for automobile

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Publication number Priority date Publication date Assignee Title
JPS5358689A (en) * 1976-11-08 1978-05-26 Sumitomo Electric Ind Ltd Improved aluminium busbar
JPS5510789A (en) * 1978-03-31 1980-01-25 Pechiney Aluminium Methdo of manufacturing electric contact
JPH02213004A (en) * 1989-02-10 1990-08-24 Sky Alum Co Ltd Conductive component of aluminium alloy for electronic equipment
JP2000207940A (en) * 1999-01-18 2000-07-28 Furukawa Electric Co Ltd:The Conductor of al alloy for automobile

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015014027A (en) * 2013-07-05 2015-01-22 三菱アルミニウム株式会社 Aluminum alloy sheet for electrification part and production method thereof
CN105703096A (en) * 2016-04-15 2016-06-22 河北欣意电缆有限公司 Copper-aluminum transition terminal of Al-Fe-Mn-RE aluminum alloy cable and preparation method thereof
CN114737089A (en) * 2022-05-24 2022-07-12 国网智能电网研究院有限公司 Aluminum alloy material and preparation method and application thereof

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