JP2002362517A - Packing system, and packing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packing system and a packing method which can suppress generation of troubles attributable to presence of foreign matters, and improve the yield of products. SOLUTION: A taping packing material 10 is cleaned by spraying air from spraying nozzles 32 and 33 in a cleaning mechanism 30 when the taping packing material 10 is carried by a carrying mechanism 20, foreign matters adhered to the taping packing material 10 are removed, and a semiconductor device D is packed by using the cleaned taping packing material 10 in a packing mechanism 40. Different from a case of no cleaning, mixture of foreign matters in a pocket 10P is suppressed, and generation of defective mounting attributable to presence of foreign matters is suppressed in a mounting step of the semiconductor device D, and the yield of product is improved thereby.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a packing apparatus and a packing method for packing, for example, semiconductor devices.

[0002]

2. Description of the Related Art Conventionally, electronic components such as semiconductor devices are packaged using a packing material before being mounted on a printed circuit board, for example, in order to prevent the attachment of foreign substances such as dust and dust in the air. You. This packing operation is performed, for example, using a fully-automated packing apparatus in order to cope with a mass production system of semiconductor devices. According to this packing device, for example,
After the semiconductor device is stored in the continuously transported packing material, the stored packaging material is sealed, so that the semiconductor device is packed.

[0003]

With the recent increase in demand for semiconductor devices, there is a strong demand for improving the yield of products equipped with such semiconductor devices. However, when a conventional packing device is used, if foreign matter such as dust in the air adheres to the packing material before packing, the foreign matter adheres to the semiconductor device, resulting in a product defect and a reduction in yield. There was a problem of doing it. In particular, when a product defect cannot be found until after the product is completed, the yield is significantly reduced.

Heretofore, it has been considered that foreign matter adheres to a semiconductor device during its manufacturing process, and various measures have been taken to improve this. However, despite the fact that various measures have been taken, there is still the possibility of defective products due to the presence of foreign matter attached to the packaging material, as the mounting defects still occur, and this has been improved. There is an urgent need for measures to do this.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a packing apparatus and a packing method capable of suppressing the occurrence of a defect caused by the presence of a foreign substance and improving the yield. It is in.

[0006]

SUMMARY OF THE INVENTION A packing apparatus according to the present invention is used for packing an object to be packed by using a packing material, and a transfer mechanism for transferring the packing material, and a packing material transferred by the transfer mechanism. In this state, the apparatus has a cleaning mechanism for removing foreign matter adhering to the packing material, and a packing mechanism for packing an object to be packed using the packing material from which foreign matter has been removed by the cleaning mechanism.

A packing method according to the present invention is a packing method for packing an object to be packed by using a packing material. The packing step includes the step of transferring the packing material, and the step of transferring the packing material in the transferring step. And a packing step of packing the article to be packed using the packing material from which the foreign matter has been removed in the cleaning step.

In the packing apparatus or the packing method according to the present invention, after the packing material is cleaned and foreign substances attached to the packing material are removed, the object to be packed is packed using the cleaned packing material.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<Structure of Packing Apparatus> First, with reference to FIG. 1, the structure of a packing apparatus according to an embodiment of the present invention will be described. FIG. 1 shows a cross-sectional configuration of the packing device.
Note that the packing method of the present invention is embodied by the operation mechanism of the packing device of the present embodiment, and will be described together.

This packing apparatus is used, for example, for packing a semiconductor device D (object to be packed) using a taping packing material 10, and mainly includes a transfer mechanism 20 for transferring the taping packing material 10. A cleaning mechanism 30 that removes (cleans) foreign substances attached to the taping packaging material 10; and a packaging mechanism 40 that packages the semiconductor device D using the taping packaging material 10 cleaned by the cleaning mechanism 30.

The transport mechanism 20 includes, for example, a feed roller 21 and a tension roller 22 for transporting the taping packaging material 10. This transport mechanism 20
Transports the taping packaging material 10 by rotating the feed roller 21 and the pulling roller 22 from the right to the left in the drawing so as to pass through the respective processing areas of the cleaning mechanism 30 and the packaging mechanism 40 in this order. Let it. At this time, the transport mechanism 20 is, for example, a pocket 10P described later provided in the taping packing material 10.
Is a processing position T in the cleaning mechanism 30 described later.
The taping packaging material 10 is transported intermittently so as to be located in order from 1 to T3, respectively.

The cleaning mechanism 30 includes, for example, a processing chamber 31 and a plurality (for example, 2
Nozzles 32, 33 and a plurality (for example, 2)
) Suction nozzles 34 and 35.

The processing chamber 31 is made of, for example, metal or the like, and has, on both sides thereof, two passage openings 31K for passing the taping packing material 10 in correspondence with the transport path of the taping packing material 10. (Entrance, exit) are provided.

[0015] Passage port 31K of processing chamber 31 (entrance, exit)
In order to close this passage opening 31K, the sealing plate 3
7, a brush 38 is provided on the lower side. The sealing plate 37 is for ensuring airtightness in the processing chamber 31, and the taping packing material 1 when contacting the sealing plate 37.
For example, in order to suppress the wear of No. 0, it is composed of a polytetrafluoroethylene plate or a metal plate coated with polytetrafluoroethylene. The brush 38 is used for ensuring airtightness in the processing chamber 31 similarly to the sealing plate 37 and for sweeping off foreign substances attached to the lower surface of the taping packing material 10.
It is made of a flexible material that can bend when contacted with, for example, a resin material such as polystyrene or vinyl chloride.

The spray nozzles 32 and 33 are provided in the processing chamber 31.
Air or the like is blown onto the taping packing material 10 carried into the inside to remove foreign substances such as dust and dirt attached to the taping packing material 10. For example, the blowing nozzle 32
Is the lower surface of the processing chamber 31, and the spray nozzle 33 is the processing chamber 31.
It is installed on the upper surface of each. Spray nozzle 3
The nozzles 2 and 33 have, for example, a “T” type configuration, and a plurality (for example, 2
Nozzle openings 36A, 36B, and a plurality of (for example, two) nozzle openings 36C, 36D at the tip of the spray nozzle 33.
Are provided respectively. Nozzle ports 36A to 36D
For example, the nozzle port 36A is located in the processing chamber 31 so that the processing position T1, the nozzle ports 36B and 36C correspond to the processing position T2, and the nozzle port 36C corresponds to the processing position 36C. These spray nozzles 32 and 33 perform spraying intermittently, for example, according to the timing at which the pocket 10P of the taping packing material 10 moves between the processing positions (T1 to T3).

The suction nozzles 34 and 35 are for sucking foreign matter removed by the spray nozzles 32 and 33 and scattered in the processing chamber 31. For example, the suction nozzle 34 corresponds to the processing position T1 in the processing chamber 31. Upper surface, suction nozzle 3
Numerals 5 are respectively installed on the lower surface of the processing chamber 31 corresponding to the processing position T3.

The packing mechanism 40 includes a suction nozzle 41 capable of holding the semiconductor device D by suction or the like, a supply roller 42 for continuously supplying a taping sealing material (cover tape) 11 described later, and a taping sealing material. And a heater 43 for thermocompression-bonding 11. The suction nozzle 41 and the heater 43 are both movable in the vertical direction in the figure.

The suction nozzle 41 is provided for the cleaning mechanism 30.
When the cleaned taping packing material 10 is carried out of the processing chamber 31, the semiconductor device D is stored in the pocket 10P provided in the taping packing material 10. The heater 43 is attached to the pocket 10 by the suction nozzle 41.
When the semiconductor device D is accommodated in P, the taping sealing material 11 is thermocompression-bonded to the taping packing material 10 to form the pocket 1.
Seal 0P.

This packing apparatus is, for example, a cylinder for supplying air to the spray nozzles 32, 33, a vacuum pump connected to the suction nozzles 34, 35, and the suction nozzle 41, in addition to the above-mentioned series of components. And a driving mechanism for driving various rollers such as the feed roller 21, the tension roller 22, and the supply roller 42 and various moving bodies such as the suction nozzle 41 and the heater 43, and a power supply for operating the packing device.

<Structure of Taping Packing Material> Next, with reference to FIG. 1, the structure of a taping packing material 10 used for packing the semiconductor device D will be described. The taping packing material 10 is formed by, for example, forming a film material such as a carrier tape so as to have a plurality of pockets 10 </ b> P that can accommodate the semiconductor device D in a continuous manner. At the bottom of each pocket 10P, for example, a circular opening 10K is provided. The opening 10K is a detection port for detecting whether the semiconductor device D is stored in the pocket 10P using, for example, a sensor or the like. In a state where the semiconductor device D is housed, the pocket 10P is sealed by the taping sealing material 11, so that the semiconductor device D is packed using the taping packing material 10.

<Packing Step by Packing Apparatus> Next, a packing step by the packing apparatus of the present embodiment will be described with reference to FIG.

Before the packing step, a semiconductor device D, a taping packing material 10 provided with a plurality of pockets 10P, and a taping sealing material 11 are prepared.
The following work is performed as preparation. That is, first, the taping packaging material 10 is transportably mounted between the feed roller 21 and the pulling roller 22 of the transport mechanism 20 such that the pocket 10P faces upward. continue,
The semiconductor device D is sucked by the suction nozzle 41 of the packing mechanism 40.
Is maintained and the heater 43 is heated to a temperature at which thermocompression bonding is possible.
Is heated. Finally, the spray nozzles 32 and 33 of the cleaning mechanism 30 operate to perform intermittent spraying, and the suction nozzles 34 and 35 operate to perform suction. The suction by the suction nozzles 34 and 35 removes foreign substances such as dust and dirt staying in the processing chamber 31 in the preparatory state of the packing process, and depressurizes the processing chamber 31.

In the packing step, first, the feed roller 21 and the pulling roller 22 of the transport mechanism 20 rotate so that the tape packing material 1 passes through the respective processing areas of the cleaning mechanism 30 and the packing mechanism 40.
0 is conveyed intermittently from the right side to the left side in the figure.

An arbitrary pocket 10P provided in the taping packing material 10 is carried into the processing chamber 21 of the cleaning mechanism 30, and when the pocket 10P reaches the processing position T1, the taping packing material 1 is blown by the blowing nozzle 32 (blowing port 36A).
Air is blown from below to zero. By this spraying, the foreign matter mainly attached to the lower surface of the taping packing material 10 is removed, and the foreign matter scattered by the spraying is mainly sucked by the suction nozzle 34.

Subsequently, when the pocket 10P reaches the processing position T2, air is blown from below onto the taping packing material 10 by the blowing nozzle 32 (blowing port 36B), and the blowing nozzle 33 (blowing port 36B).
C) blows air from above. By this spraying, foreign matter adhering to the upper surface (including the inside of the pocket 10P) and the lower surface of the taping packing material 10 is removed, and the foreign matter scattered by the spraying is mainly collected by the suction nozzles 34 and 35. It is sucked.

Subsequently, when the pocket 10P reaches the processing position T3, air is blown from above onto the taping packing material 10 by the blowing nozzle 33 (blowing port 36D). By this spraying, foreign matter which has mainly adhered to the upper surface of the taping packaging material 10 is removed, and the foreign matter scattered by the spraying is mainly sucked by the suction nozzle 35.

Subsequently, when the pocket 10P is carried out of the processing chamber 31, the suction nozzle 41 of the packing mechanism 40 is lowered, and the held semiconductor device D is stored in the pocket 10P. The suction nozzle 41 retracts after storing the semiconductor device D in the pocket 10P.

Subsequently, after the semiconductor device D is stored in the pocket 10P, the taping sealing material 11 is supplied from the supply roller 42. When the pocket 10P is covered with the taping sealing material 11, the heater 43 is lowered. Then, the taping sealing material 11 is thermocompression-bonded to the taping packing material 10. Thereby, the pocket 10 is sealed, and the semiconductor device D is packed using the taping packing material 10. The heater 43 retracts after packing the semiconductor device D.

The packing of the semiconductor device D by the packing device described above is performed sequentially for each of the pockets 10P provided for the plurality of pockets 10P provided in the taping packing material 10. The packaged semiconductor device D is put into, for example, a mounting process of the semiconductor device D.

<Operations and Effects of the Embodiment> As described above, according to the packing apparatus of the present embodiment, the cleaning mechanism 30 cleans the taping packing material 10, and the foreign matter adhered to the taping packing material 10. Then, the semiconductor device D is packed by using the cleaned taping packing material 10 in the packing mechanism 40. Therefore, for the following reasons, it is possible to suppress the occurrence of troubles due to the presence of foreign matter. Thus, the yield of products equipped with the semiconductor device D can be improved.

FIGS. 2 and 3 illustrate a problem caused by the presence of a foreign substance when a conventional packing device without the cleaning mechanism 30 is used. FIG. 2 shows the semiconductor device D in a packed state. FIG. 3 shows a cross-sectional configuration around the semiconductor device D during mounting. In this packing apparatus, since the semiconductor device D is packed using the taping packing material 10 exposed to the air, as shown in FIG. 2, for example, foreign matter such as dust or dust in the air before packing. If U enters the pocket 10P, the semiconductor device D is packed with the foreign matter U mixed therein, and the foreign matter may adhere to the semiconductor device D. When the foreign matter U adheres to the semiconductor device D, for example, as shown in FIG.
Is mounted on the printed circuit board 50.
Of the printed circuit board 50 due to the presence of
And the mounting failure occurs, and the product yield is reduced.

On the other hand, in the present embodiment, the taping packing material 10 is
Before packing, the pocket 10 is cleaned.
Even if the foreign matter U is mixed in P, the foreign matter U is mainly removed by spraying by the spray nozzles 32 and 33. In such a case, unlike the conventional case in which cleaning is not performed, the foreign matter U
Is suppressed, the occurrence of mounting defects due to the presence of the foreign matter U is suppressed, and the yield of products is improved.

In the present embodiment, in the cleaning mechanism 30, the spraying nozzle 32 sprays from above the taping packing material 10 and the spraying nozzle 33 sprays from below. Almost the whole is sprayed,
The ability to remove foreign matter U attached to taping packaging material 10 can be improved.

Further, in the present embodiment, in the cleaning mechanism 30, the suction nozzles 34 and 35 suck the foreign matter scattered by the spraying by the spray nozzles 32 and 33.
1 and can be prevented from re-adhering to the taping packaging material 10.

Further, in this embodiment, in order to remove foreign matter in the cleaning mechanism 30, the structure of the spray nozzles 32 and 33 is relatively simple and only inexpensive components are required. When manufacturing, the packing device can be manufactured at a relatively low manufacturing cost without complicating the device configuration.

Further, since the packing apparatus of the present embodiment can be configured by attaching a cleaning mechanism 30 to an existing packing apparatus, the cleaning mechanism 30 (mainly the processing chamber 3) is provided.
As long as the arrangement space of 1) can be secured, the existing packing device can be easily improved to the packing device of the present embodiment.

<Modification of Embodiment> In the present embodiment, the foreign matter U attached to the taping packaging material 10 is removed by spraying with the spray nozzles 32 and 33, but this is not necessarily limited to this. Not a thing,
For example, only the suction nozzles 34 and 35 are provided in the processing chamber 31,
The foreign substances U are sucked by the suction nozzles 34 and 35.
May be removed. Needless to say, the suction nozzles 34 and 35 in this case have a function of removing the foreign matter U and suctioning the scattered foreign matter U. In such a case, substantially the same effects as in the above embodiment can be obtained.

In the present embodiment, spray nozzles 32, 33 are provided on the upper and lower surfaces of the processing chamber 31, respectively, and the spray nozzles 32, 33 spray the taping packing material 10 from above and below. However, the present invention is not limited to this. A spray nozzle is installed only on one of the upper surface and the lower surface of the processing chamber 31, and the spray nozzle performs the spray from above or below. Is also good. However, if it is desired to ensure a sufficient improvement in the yield, it is preferable to spray the taping packaging material 10 from above and below by the spray nozzles 32 and 33 as described in the above embodiment.

In the packing device of the present embodiment,
The number and positions of the spray nozzles (including the spray ports) and the suction nozzles of the cleaning mechanism 30 are not necessarily limited to those described in the above embodiment. It can be freely changed according to the conditions.

As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the above embodiment, and can be variously modified. For example, the configuration and operation mechanism of the packing device are not necessarily limited to those described in the above embodiment. After removing foreign matter U attached to the taping packing material 10 by spraying or suctioning, the cleaned taping packing material 10 is removed. Can be freely changed as long as the semiconductor device D can be packed by using the. Specifically, for example, the size of the processing chamber 31 of the cleaning mechanism 30 and the sprayable range of the spray ports 36A to 36D can be set according to the size of the pocket 10P provided in the taping packing material 10. It is.

In the above-described embodiment, the case where the present invention is applied to a packing apparatus for packing semiconductor devices D has been described. However, the present invention is not limited to this, and various other devices than semiconductor devices D may be used. The present invention is also applicable to a packing device for packing an object to be packed.

[0043]

As described above, the packing device according to any one of claims 1 to 5 or the packing device according to claim 6.
According to the packing method of any one of claims 10 to 10, after cleaning is performed to remove foreign substances attached to the packaging material, the object to be packed is packed using the packaging material from which the foreign substances have been removed. Therefore, unlike the conventional case where cleaning is not performed, adhesion of foreign matter to the packing material is suppressed. For this reason, it is possible to suppress the occurrence of a defect due to the presence of the foreign matter, and to improve the yield of the product.

In particular, according to the packing apparatus according to the second aspect or the packing method according to the seventh aspect, the foreign matter is removed by spraying with one or more spray nozzles, so that the foreign matter is removed. Therefore, only a relatively simple and inexpensive component (spray nozzle) is required. Therefore, when manufacturing the packing device, the packing device can be manufactured at a relatively low manufacturing cost without complicating the device configuration.

Further, according to the packing apparatus of the third aspect or the packing method of the eighth aspect, the spraying nozzle provides
Since the spraying is performed from at least one of the one side of the packing material or the opposite side, particularly when performing the spraying from both the one side of the packing material and the opposite side,
Almost the entire packaging material is sprayed, and the ability to remove foreign substances attached to the packaging material can be improved.

According to the packing apparatus of the fourth aspect or the packing method of the ninth aspect, the foreign matter removed by the spray nozzle is suctioned by one or more suction nozzles. The foreign matter scattered by the spraying by the stagnation can be prevented from staying around the packing material and re-adhering to the packing material.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a cross-sectional configuration of a packing device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a problem that occurs when a conventional packing device is used, and is a cross-sectional configuration around a semiconductor device in a packed state.

FIG. 3 is a cross-sectional view for explaining a problem that occurs when a conventional packing device is used, and is a cross-sectional configuration around a semiconductor device during mounting.

[Explanation of symbols]

Reference Signs List 10: Taping packing material, 10K: Opening, 10P: Pocket, 11: Taping sealing material, 20: Transport mechanism, 21
... Sending roller, 22 ... Tension roller, 30 ... Cleaning mechanism, 31 ... Processing chamber, 31K ... Transmission port, 32,33 ... Blowing nozzle, 34,35 ... Suction nozzle, 36A, 36
B, 36C, 36D: nozzle opening, 37: sealing plate, 38:
Brushes, 40: packing mechanism, 41: suction nozzle, 42: supply roller, 43: heater, 50: printed circuit board, D: semiconductor device, T1, T2, T3: processing position, U: foreign matter.

Claims (10)

[Claims] 1. A packing device for packing an object to be packed by using a packing material, comprising: a transfer mechanism for transferring the packing material; and a packing device in which the packing material is transferred by the transfer mechanism. A packing apparatus, comprising: a cleaning mechanism for removing foreign matter adhering to a material; and a packing mechanism for packing the object to be packed using the packing material from which foreign matter has been removed by the cleaning mechanism. 2. The cleaning mechanism includes a processing chamber through which the packing material can pass, and one or more spray nozzles disposed in the processing chamber and configured to remove foreign matter by spraying. The packing device according to claim 1. 3. The packing apparatus according to claim 2, wherein the spray nozzle sprays from one side of the packing material or at least one side thereof. 4. The cleaning mechanism according to claim 2, wherein the cleaning mechanism further includes one or two or more suction nozzles disposed in the processing chamber and suctioning foreign matter removed by the spray nozzle. Packing equipment. 5. The packing apparatus according to claim 1, wherein the object to be packed is made of a semiconductor device. 6. A packing method for packing an object to be packed by using a packing material, the method comprising the steps of: transferring the packing material; and transferring the packing material in the transferring step in the packing process. A packing method, comprising: a cleaning step of removing adhering foreign matter; and a packing step of packing the article to be packed using the packing material from which the foreign matter has been removed in the cleaning step. 7. The cleaning step, wherein the foreign material is removed by passing the packing material through a processing chamber and spraying the packaging material with one or more spray nozzles in the processing chamber. Packing method. 8. The packing method according to claim 7, wherein, in the cleaning step, the spraying nozzle sprays from at least one of one side and the other side of the packing material. 9. The packing method according to claim 7, wherein in the cleaning step, the foreign matter removed by the spray nozzle is suctioned by one or more suction nozzles. 10. The packing method according to claim 6, wherein a semiconductor device is used as the object to be packed.