JP2002353298A - Placing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem such as of the sample placing table described in the examined publication H07-111994, wherein the temperature of an object to be processed cannot be changed quickly nor easily to a target temperature between a high temperature and a low temperature and that a throughput cannot be easily improved. SOLUTION: Placing equipment 1 is provided with a thermoelectric unit 5 which acquires heat and cooling abilities of a thermostat 3 in a placing body 2. In addition, the thermostat 3 has a heat controlling jacket 6 which is provided at the placing body 2, and a hot water supplying method 12 which supplies hot water to the jacket 6, and a cold water supplying method 13 which supplies cold water to the jacket 6 by switching hot water from the hot water supplying method 12 to cold water.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a mounting device,
More specifically, the present invention relates to a mounting apparatus that can mount an object to be processed such as a wafer and set a predetermined temperature.

[0002]

2. Description of the Related Art A semiconductor manufacturing apparatus or an inspection apparatus includes a mounting apparatus for mounting an object to be processed such as a wafer and performing predetermined processing. For example, in the case of an inspection device such as a probe device, the object to be processed is cooled through the mounting device to generate heat in accordance with the inspection of the object to be processed, or the mounting device is selected depending on the type of the object to be processed. Inspection may be performed by setting the object to be processed to a high temperature or a low temperature via the interface. For this purpose, the mounting device includes a temperature adjusting mechanism for cooling the object to be processed and setting the object to be processed at a predetermined temperature.

A conventional mounting apparatus includes a top plate, a cooling jacket, a heater, and a bottom plate. When cooling, the cooling plate is used to cool the top plate, and an object to be processed on the top plate is cooled to a predetermined position. In the case of cooling to a temperature and heating, a cooling jacket and a top plate are heated using a heater to heat an object to be processed on the top plate to a predetermined temperature. However, when inspecting the low-temperature characteristic and the high-temperature characteristic of the object to be processed, the object to be processed on the top plate must be quickly heated and cooled in order not to lower the throughput. To this end, it is necessary to increase the cooling capacity of the cooling jacket and the heating capacity of the heater. However, if this requirement is satisfied, the capacities of the cooling jacket and the heater are correspondingly increased, and the temperature responsiveness is deteriorated.

[0004] As a mounting device with improved temperature response, there is, for example, a sample mounting table described in Japanese Patent Publication No. 7-111994. This sample mounting table controls the temperature of the object to be processed using a heat exchange element and a heat exchange jacket that exhibit the Peltier effect, and is superior in temperature responsiveness as compared with the case where the above cooling jacket and heater are used. ing. For example, Japanese Patent Application Laid-Open No. H11-173774 discloses a temperature control device using a heat pipe.
Japanese Patent Application No. 0-172347 describes a temperature control device using a heat pipe and a thermoelectric module.

[0005]

However, in the case of the sample mounting table described in Japanese Patent Publication No. 7-111994, a heat medium (ethylene glycol aqueous solution) circulating a heat exchange jacket is used for cooling and heating. For,
It takes a certain amount of time to heat and cool the same heating medium, and it is difficult to quickly change the temperature of a single workpiece between the high and low temperatures to the target temperature, which can increase throughput. difficult. Also, JP-A-11-17377
In the case of the temperature control device described in Japanese Patent Publication No. 4 (1994), a heat pipe and a fin are used in a circular plate in which a fin is divided into upper and lower portions, and a heating fluid or a cooling fluid is passed through the fin side. Since these fluids have to be changed, organic fluids having a high boiling point and a low melting point must be used as these fluids, and disposal of the used organic fluids has a burden on the environment. Japanese Patent Application Laid-Open No. 2000-172347 discloses a structure in which a heat pipe, a fin, a thermoelectric module, and a cooling plate (jacket) are used, and heat is exchanged between the thermoelectric module, the heat pipe, and the fin, resulting in a complicated and large heat capacity. .

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to reduce the burden on the environment and to quickly raise and lower the temperature of an object to be processed, thereby enabling dynamic processing at high and low temperatures. It is an object of the present invention to provide a mounting device capable of coping with the above. Another object of the present invention is to provide a mounting device that has a simplified structure of a means for vacuum-sucking an object to be processed.

[0007]

According to a first aspect of the present invention, there is provided a mounting apparatus for mounting an object to be processed and a temperature for adjusting a temperature of the object to be processed on the mounting body. A mounting mechanism for heating or cooling the object to be processed on the mounting body to a predetermined temperature through the temperature adjusting mechanism, wherein the heating of the temperature adjusting mechanism is performed in the mounting body. A thermoelectric unit for capturing a cooling capacity, and the temperature control mechanism includes a heat exchanger provided in the housing and a first heat medium supply for supplying a heat medium for heating to the heat exchanger. Means, and second heat medium supply means for switching the heat medium from the heat medium supply means to a heat medium for cooling and supplying the heat medium to the heat exchanger.

[0008] The mounting device according to a second aspect of the present invention, in the first aspect, is characterized in that the heat medium for heating and cooling is water.

According to a third aspect of the present invention, in the mounting apparatus according to the first or second aspect, the thermoelectric unit exhibits the Peltier effect arranged in the whole of the mounting body. A plurality of thermoelectric elements, and a plurality of electrodes arranged so as to alternately connect upper ends and lower ends of adjacent thermoelectric elements, and are integrated.

According to a fourth aspect of the present invention, there is provided the mounting device according to any one of the first to third aspects, wherein the mounting body is a top formed of aluminum nitride. It is characterized by having a plate.

According to a fifth aspect of the present invention, there is provided a mounting device according to any one of the first to fourth aspects, wherein the ring-shaped support is disposed on the outer periphery of the thermoelectric unit. The thermoelectric unit is sandwiched between members.

According to a sixth aspect of the present invention, there is provided a mounting apparatus comprising: a mounting body for mounting an object to be processed; and suction means for vacuum-sucking the object to be processed on the mounting body. In the mounting device, the suction means includes a sheet-like member having a radial exhaust path formed therein.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. Mounting device 1 of the present embodiment
For example, as shown in FIG. 1, a mounting body 2 on which a wafer W is mounted, and a temperature adjusting mechanism 3 for adjusting the temperature of the mounting body 2
And a lifting / lowering body 4 for raising / lowering the mounting body 2 via the base 4A. The probe device is configured to heat or cool the wafer W on the mounting body 2 to set a predetermined inspection temperature. Is arranged in a prober chamber (not shown). The mounting device 1 is configured to be movable in the X and Y directions via a drive mechanism (not shown) in the X and Y directions, and is configured to be able to move up and down in the Z direction via the elevating body 4. The mounting body 2 is configured to be rotatable forward and backward in the θ direction within a predetermined range in the θ direction. Further, a probe card (not shown) is arranged above the mounting device 1, and at the time of inspection, the mounting device 1 cooperates with an alignment mechanism (not shown) on the mounting body 2 as conventionally known. After aligning the wafer W with the probe of the probe card, the wafer W and the probe are brought into contact with each other, and the electrical characteristic inspection of the wafer W is repeatedly performed.

As shown in FIG. 1, the mounting body 2 includes a top plate 2A formed of a ceramic having high thermal conductivity and high hardness, such as aluminum nitride, and a circular top plate 2A. A bottom plate 2B formed of a material having a large diameter and having excellent heat insulating properties (for example, a heat insulating material such as Rossna board (trade name of a heat insulating material manufactured by Nikko Kasei Co., Ltd.)) and an outer peripheral edge of the bottom plate 2B. A support ring 2C made of a material having excellent heat insulation properties (for example, heat-resistant material such as Sepra (trade name of super heat-resistant polyimide molded product manufactured by Nissan Diamond Industrial Co., Ltd.))
And a support ring 2C formed to have the same inner and outer diameters as the support ring 2C and pressing the outer peripheral edge of the top plate 2A.
And a press ring 2D made of the same material as above, and is formed in a hollow disk shape as a whole. A thermoelectric unit 5 and a temperature control jacket 6 are accommodated in the mounting body 2 in an overlapping manner, and the temperature of the top plate 2A is set to a predetermined temperature via the thermoelectric unit 5 and the temperature control jacket 6. Further, between the top plate 2A and the bottom plate 2B, for example, a plurality of cylindrical members 7 are provided with a thermoelectric unit 5 and a temperature control jacket 6.
Are arranged at predetermined intervals from each other, and the top plate 2A is supported in the entire region via these cylindrical members 7. In addition, elevating pins (not shown) are built in the mounting body 2 so that the elevating pins move up and down when the wafer W is transferred. In this manner, the top plate 2A and the bottom plate 2
B, the thermoelectric unit 5 and the temperature control jacket 6 are sandwiched without restraining the thermoelectric unit 5 and the temperature control jacket 6.
Can reliably fulfill their respective functions even if they expand and contract under the influence of temperature, and the thermoelectric unit 5 and the temperature control jacket 6 can be easily stored in the mounting body 2.

As shown in FIG. 1, for example, the thermoelectric unit 5 includes a plurality of pairs of thermoelectric elements 5A and 5B that exhibit the Peltier effect and are arranged so as to be uniformly distributed throughout the mounting body 2.
And a plurality of electrodes 5C and 5C that connect the upper ends and the lower ends of the adjacent thermoelectric elements 5A and 5B alternately.
The thermoelectric element 5A is formed in a columnar shape and functions as a Peltier element itself and also has a heat transfer function of the temperature control jacket 6. All thermoelectric elements 5A, 5B are electrodes 5
Conduction is conducted through C and 5C, and the termination is formed as a pair of connection terminals (not shown). The pair of terminal connection terminals are connected to a DC power supply having variable polarity, and alternately change to a plus terminal and a minus terminal depending on the direction of application of the DC voltage. The thermoelectric elements 5A and 5B change such that the lower end absorbs heat when the upper end generates heat and the lower end generates heat when the upper end absorbs heat in accordance with the positive and negative polarity changes of these terminal connection terminals.
Conventionally known thermoelectric elements can be used as the thermoelectric elements 5A and 5B.

In the present embodiment, since the thermoelectric elements 5A and 5B have a function of supplementing the heating and cooling capabilities of the temperature control jacket 6, water is not used as a heat medium of the temperature control mechanism 3 but an organic solvent. Can be used. For example, the heating and cooling ability of the temperature control jacket 6 can be supplemented by about ± 50 ° C. by the thermoelectric elements 5A and 5B. The temperature can be further increased by 50 ° C. and heated to 130 ° C. by the heat generated by the elements 5A and 5B. Conversely, if cooling water, for example, water cooled to 0 ° C. in the temperature control jacket 6 is used, the temperature can be further reduced by 50 ° C. by the endothermic heat of the thermoelectric elements 5A and 5B to be cooled to −50 ° C. As described above, even if water is used as the heat medium, even if the test temperature cannot be achieved only with water, the test temperature can be supplemented by the operation of the thermoelectric unit 5. Further, the temperature control jacket 6 is formed in a thin hollow shape, and heats or cools by circulating warm water or cooling water therein as described later. Further, the electrode 5C is integrated as an electrode substrate, and the thermoelectric element 5 is formed by upper and lower electrode substrates.
By integrating A and 5B as the thermoelectric unit 5, the thermoelectric unit 5 is formed into a single thin plate having a small heat capacity, and the convenience of handling the thermoelectric unit 5 is improved.

The top plate 2A and the upper electrode 5C
An insulating sheet 8 made of an insulating material (for example, polyimide) is interposed therebetween, and the same insulating sheet 8 is interposed between the temperature control jacket 6 and the lower electrode 5C. , 8 via the top plate 2A and the electrode 5
C and between the temperature control jacket 6 and the electrode 5C are electrically insulated from each other. The electrodes 5C of the thermoelectric elements 5A and 5B are arranged and integrated on these insulating sheets 8, and the thermoelectric units 5 are integrated with the insulating sheets 8 and 8 by sandwiching the thermoelectric units 5 between the upper and lower insulating sheets 8 and 8. Accordingly, the thermoelectric unit 5 and the insulating sheets 8 are formed in a single thin plate shape, and the convenience of handling the thermoelectric unit 5 is improved. Further, between the top plate 2A and the insulating sheet 8 and between the temperature control jacket 6 and the insulating sheet 8, a heat conductive substance (for example, heat conductive grease) 9,
The heat conductive grease 9 fills each minute concave and convex space to enhance heat transfer. Thus, the thermoelectric unit 5 is sandwiched between the insulating sheets 8 and 8 and is formed in a thin disk shape as a whole.

A pressing claw 2E is formed on the inner peripheral edge of the upper end of the pressing member 2D, and a step 2F is formed on the outer peripheral edge of the upper surface of the top plate 2A.
The step 2F of the top plate 2A is pressed by the pressing claw 2E of D. Further, through holes are formed in the outer peripheral edge portion of the bottom plate 2A, the support ring 2C, and the press ring 2D at regular intervals in the circumferential direction, and the bottom plate 2B and the support member 10 are supported by the fastening members 10 mounted in these through holes. Tighten the ring 2C and the holding ring 2D, and press the holding claw 2E.
, The top plate 2A is pressed toward the bottom plate 2B. As a result, the thermoelectric unit 5 and the temperature control jacket 6 are sandwiched between the top plate 2A and the bottom plate 2B. Therefore, since the top plate 2A and the bottom plate 2B have a structure simply sandwiching the thermoelectric unit 5 and the temperature control jacket 6, even if the thermoelectric unit 5 and the temperature control jacket 6 are thermally deformed, they remain on the top plate 2A and the bottom plate 2B. They are not bound and their functions are not impaired.

Further, as shown in FIG. 1, rod-shaped temperature sensors 11 are mounted on the top plate 2A, for example, at two places, and the temperature of the top plate 2A is detected via these temperature sensors 11. The temperature sensor 11 penetrates the bottom plate 2B, the temperature control jacket 6 and the thermoelectric unit 5 as shown in FIG.
Is in contact with the top plate 2A in a hole formed on the lower surface of the substrate and its temperature is measured. Even if one of the temperature sensors 11 fails, the temperature of the top plate 2A can be reliably measured via the other temperature sensor 11.

As shown in FIG. 2, the temperature control mechanism 3 has a temperature control jacket 6 as described above, and a heat source for heating therein through the inlet pipe 6A and the outlet pipe 6B of the temperature control jacket 6. When a wafer W is heated in accordance with a program pre-registered in a controller (not shown), a hot water supply unit 12 and a cooling water supply unit 13 for supplying hot water as a medium or cooling water as a heat medium for cooling are provided. When the hot water supply means 12 is driven to cool the wafer W, the cooling water supply means 13 is driven. The inlet pipe 6A and the outlet pipe 6B are provided with valves 6C and 6D, respectively.

As shown in FIG. 2, the hot water supply means 12 connects a hot water tank 12A for producing hot water at a predetermined temperature (for example, 80 to 90 ° C.), and connects the hot water tank 12A and the inlet pipe 6A of the temperature control jacket 6. And a return pipe 12C connecting the hot water tank 12A and the outlet pipe 6B of the temperature control jacket 6. The upstream pipe 12B has a valve 1 from the upstream side to the downstream side.
2D, a pump 12E, a check valve 12F, and a solenoid valve 12G are sequentially provided. An electromagnetic valve 12H, a check valve 12I, and a valve 12J are sequentially provided on the return pipe 12C from the upstream side to the downstream side. Furthermore, between the pump 12E of the forward pipe 12A and the check valve 12F, and between the check valve 12I and the check valve 12I of the return pipe 12C.
2J are connected by a short-circuit tube 12K.
K is provided with a solenoid valve 12L. In FIG. 2, reference numeral 12M denotes a variable throttle, which appropriately controls the flow rate of hot water through the variable throttle 12M. Then, for example, when hot water of about 80 ° C. is produced in the hot water tank 12A and the hot water in the hot water tank 12A is supplied via the pump 12E, the hot water flows into the temperature control jacket 6 via the outward pipe 12B and the inlet pipe 6A. Then, the mounting body 2 is heated. The hot water whose temperature has dropped in the mounting body 2 passes through the outlet pipe 6B and the return pipe 12C, and is then supplied to the hot water tank 12A.
And the temperature is adjusted to a predetermined value. When the supply of hot water is stopped, the solenoid valve 12G of the forward pipe 12B and the return pipe 12C
And the solenoid valve 12L of the short-circuit pipe 12K is deenergized, and the circulation path of the hot water is short-circuited via the short-circuit pipe 12K, and the forward pipe 12B, the short-circuit pipe 12K, and the return pipe 1
2C is circulated and does not reach the temperature control jacket 6. During this time, the cooling water supply means 13 is driven to cool the mounting body 2.

The cooling water supply means 13 includes a chiller 13A for producing cooling water of a predetermined temperature, an outward pipe 13B connecting the chiller 13A and the inlet pipe 6A of the temperature control jacket 6, a hot water tank 13A and the temperature control jacket 6. And a return pipe 13C for connecting the outlet pipe 6B. A valve 13D, a check valve 13E, and a solenoid valve 13F are sequentially provided from the upstream side to the downstream side on the outward pipe 13B. The return pipe 13C is provided with a solenoid valve 13G, a check valve 13H, and a valve 13I sequentially from the upstream side to the downstream side. Further, between the valve 13D and the check valve 13E of the forward pipe 13A, and between the check valve 13H and the valve 13I of the return pipe 13C.
Is connected by a short-circuit tube 13J, and the short-circuit tube 13J is provided with a solenoid valve 13K. Therefore, the forward pipe 12B and the return pipe 12C of the hot water supply means 12 and the forward pipe 13B and the return pipe 13C of the cooling water supply means 13 join at the inlet pipe 6A and the outlet pipe 6B of the temperature control jacket 6, respectively. Then, for example, when cooling water of 0 ° C. is produced in the chiller 13A and the cooling water of the chiller 13A is supplied, the cooling water flows into the temperature control jacket 6 via the outward pipe 13B and the inlet pipe 6A, and is placed on the mounting body. 2 for cooling. The cooling water whose temperature has risen in the mounting body 2 is supplied to the outlet pipe 6B and the return pipe 13
It returns to the chiller 13A via C and is adjusted to a predetermined temperature. When the supply of the cooling water is stopped, the solenoid valve 13F of the forward pipe 13B and the solenoid valve 13G of the return pipe 13C are energized, and the solenoid valve 12K of the short-circuit pipe 13J is deenergized. Then, it circulates through the forward pipe 13B, the short-circuit pipe 13J, and the return pipe 13C. During this time, the hot water supply means 12 is driven to heat the mounting body 2.

Further, in the mounting apparatus 1 of the present embodiment, a special device is applied to the suction means 14 for vacuum-sucking the wafer W. That is, as shown in FIGS. 1 and 3A and FIG. 3B, the suction means 14 includes a plurality of first exhaust passages 14A formed in the top plate 2A and a plurality of first exhaust passages 14A. Corresponding second exhaust passages 14B formed in the cylindrical member 7 and a plurality of (for example, four) third exhaust passages 14C communicating with the second exhaust passages 14B are formed in a sheet-like shape in the radial direction. The member 14D and the sheet-like member 1
It has a manifold 14E (omitted in FIG. 1) communicating with the plurality of 4D third exhaust passages 14C. The sheet-like member 14E is formed of a synthetic rubber used as a sealing member such as silicon rubber, is interposed between the bottom plate 1B and the temperature control jacket 6, and is adhered to both of the members 1B and 6 via an adhesive. ing. As shown in FIG. 3A, the four third exhaust passages 14C are formed into sheet-like members 14D.
Are formed with different lengths on the surface. Since the third exhaust path 14C is provided in the sheet-like member 14D in this manner, even if the gap between the bottom plate 2B and the temperature control jacket 6 is narrow, the sheet-like member 14D can be mounted,
The third exhaust path 14C can be reliably formed. Moreover, since the sheet-like member 14D is adhered to the bottom plate 2B and the temperature control jacket 6, even if the pressure inside the third exhaust passage 14C is reduced, the sheet-like member 14D does not elastically deform, so that the third exhaust passage 14C is not deformed. It can be ensured reliably.

Next, the operation will be described. In the probe device, first, when the wafer W is mounted on the top plate 2A of the mounting body 2 via a transfer mechanism (not shown), the suction unit 14 operates to suction and fix the wafer W on the top plate 2A. The mounting apparatus 1 that has received the wafer W performs alignment between the wafer W and the probe in cooperation with the alignment mechanism. For example, when performing a high-temperature inspection of the wafer W, the hot water supply unit 1 of the temperature adjustment mechanism 3 during the alignment.
2 is selected and driven, and generates heat at the upper ends of the thermoelectric elements 5A and 5B of the thermoelectric unit 5 and absorbs heat at the lower ends.

When the hot water supply means 12 is driven, the solenoid valve 1
2G and 12H open the forward pipe 12B and the return pipe 12C in the state shown in FIG. 2, and the solenoid valve 12L is energized to close the short-circuit pipe 12K. At this time, the valves 6C and 6D and the valves 12D and 12J of the temperature control jacket 6 are open. When the pump 12E of the hot water supply means 12 is driven, for example,
The hot water heated to 80 ° C. in the hot water tank 12A
It flows into the temperature control jacket 6 in the mounting device 1 via B and the inlet pipe 6A. Thereby, the temperature control jacket 6 heats the top plate 2A of the mounting body 2 via the thermoelectric unit 5, and the thermoelectric unit 5 supplements the heating capability of the temperature control jacket 6 in combination with the cooling action of the temperature control jacket 6. The top plate 2A is heated to about 130 ° C., for example.
At this time, the thermoelectric unit 5 and the temperature control jacket 6 have a small heat capacity, and the top plate 2A is made of a material having excellent thermal conductivity.
The temperature is raised at a rate of 2.5 ° C./min at a temperature increasing rate, and reaches the target temperature (130 ° C.) in a short time. Thereby, the top plate 2A
The upper wafer W is heated to 130 ° C. to perform a high-temperature inspection.
Whether the temperature has reached 130 ° C. can be surely known via the two temperature sensors 11. At the time of inspection, the mounting body 2 is overdriven via the elevating body 4 and the wafer W comes into contact with the probe with a predetermined stylus force. In this case, even if the stylus force of the probe acts on any part of the wafer W The top plate 2A of the mounting body 2 has a high hardness itself,
Since the top plate 2A is supported by A and 5B, the top plate 2A is not elastically deformed by the needle pressure, and there is no possibility that the probe is displaced from the inspection position.

When the low-temperature inspection of the wafer W is to be performed after the completion of the high-temperature inspection of the wafer W, the cooling water supply means 13 is automatically switched from the hot water supply means 12 and driven. That is, when the supply of hot water is stopped,
G and 12H are energized to switch from the state shown in FIG. 2 to close the forward pipe 12B and the return pipe 12C, deactivate the solenoid valve 12L, open the short-circuit pipe 12K, and pass hot water through the short-circuit pipe 12K. And circulate through the hot water tank 13A. On the other hand, as shown in FIG.
3G is deenergized to open the forward pipe 13B and the return pipe 13C, and the solenoid valve 13K is energized to close the short-circuit pipe 13J. Thereby, the cooling water is supplied to the forward pipe 13B and the inlet pipe 6A.
Flows into the temperature control jacket 6 via the As a result, the temperature control jacket 6 is automatically switched from hot water to cooling water, and the thermoelectric unit 5 is also switched to the cooling side to cool the top plate 2A of the mounting body 2 and to combine the cooling action of the temperature control jacket 6. The thermoelectric unit 5 supplements the cooling capacity of the temperature control jacket 6 to cool the top plate 2A from, for example, 130 ° C. to about −55 ° C. At this time, the temperature of the top plate 2A drops at a rate of, for example, −20.56 ° C./minute, reaches the target temperature (−55 ° C.) in a short time, and can quickly switch from the high-temperature inspection to the low-temperature inspection.

As described above, according to the present embodiment,
Since the thermoelectric unit 5 is provided in the mounting body 2 and the thermoelectric unit 5 and the temperature control jacket 6 are sandwiched via the support ring 2C and the holding ring 2D arranged on the respective outer circumferences, the thermoelectric unit 5 Temperature control jacket 6
Even if there is temperature deformation (expansion, shrinkage),
Plays each role reliably, and the temperature control jacket 3
The heating and cooling ability by the thermoelectric unit 5 can be captured.

Further, according to the present embodiment, the thermoelectric unit 5 includes a plurality of pairs of thermoelectric elements 5A and 5B exhibiting the Peltier effect arranged on the entire mounting body 2 and the adjacent thermoelectric elements 5A and 5B.
A and 5B have a plurality of electrodes 5C arranged by alternately connecting the upper ends thereof and the lower ends thereof.
The convenience of handling C is improved, the thermoelectric unit 5 can be incorporated reliably and quickly, and the heat capacity of the thermoelectric unit 5 is small, and the heating and cooling ability by the temperature control mechanism 3 is reliably achieved by the thermoelectric unit 5. The wafer W can be captured, the temperature of the wafer W can be raised and lowered to the target temperature in a short time, and quick switching between high-temperature inspection and low-temperature inspection can be performed.

Further, according to the present embodiment, the temperature control mechanism 3 supplies the hot water to the temperature control jacket 6 provided below the thermoelectric unit 5 in the mounting body 2. Since it has the hot water supply means 12 and the cooling water supply means 13 for switching the hot water from the hot water supply means 12 to the cooling water and supplying the cooling water to the temperature regulation jacket 6, the organic solvent is not used as the heat medium as in the conventional case. In addition, there is no load on the environment, the environment is gentle, and the temperature of the wafer W can be quickly raised and lowered to the target temperature by quickly switching between the hot water and the cooling water of the temperature control jacket 6.

Further, according to the present embodiment, the suction means 14
Has a sheet-like member 14D in which a third radial exhaust path 14C is formed, so that the exhaust path 14C can be formed only by mounting the sheet-like member 14D in a narrow gap in the mounting body 2.

It should be noted that the present invention is not limited to the above-described embodiment at all, and the design of each component of the present invention can be changed as needed, and the materials used can be selected as appropriate. For example, in the above embodiment, since the thermoelectric element 5A can support the top plate 2A, it is not necessary to provide the columnar member 7 that supports the top plate 2A.
In the above embodiment, water is used as the heat medium of the temperature control mechanism. However, by using an organic solvent or the like as the heat medium instead of water, the temperature can be raised and lowered quickly.

[0032]

According to the first to fifth aspects of the present invention, the burden on the environment can be reduced, and the temperature of the object to be processed can be quickly raised and lowered to achieve high and low temperatures. Can be provided dynamically.

According to the sixth aspect of the present invention, there is provided a mounting apparatus capable of simplifying the structure of a means for vacuum-sucking an object to be processed and forming a flow path in a narrow gap. be able to.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a main part of an embodiment of a mounting device according to the present invention.

FIG. 2 is a configuration diagram showing a means for supplying warm water or cooling water to the temperature control jacket shown in FIG. 1;

FIGS. 3A and 3B are diagrams showing suction means used in the mounting device of the present invention, wherein FIG. 3A is a plan view showing a main part thereof, and FIG. 3B is a sectional view thereof.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting device 2 mounting body 2A top plate 2C support ring (ring-shaped support member) 2D press ring (ring-shaped support member) 3 temperature control mechanism 5 thermoelectric unit 5A thermoelectric element 5B thermoelectric element 5C electrode 6 temperature control jacket (Heat exchanger) 12 Hot water supply means (first heat medium supply means) 13 Cooling water supply means (second heat medium supply means) 14 Adsorption means 14C Third exhaust path (exhaust path) 14D Sheet member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hironaga Akiba 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Komatsu Seisakusho Central Research Laboratory (72) Inventor Mikio Minishi 1200 Manda, Hiratsuka-shi, Kanagawa Komatsu Seisakusho Central Research Laboratory F term (reference) 3L044 AA03 CA14 DB01 DD01 DD07 5F031 CA02 HA02 HA14 HA37 HA38 HA50 HA58 JA01 JA17 JA46 MA33 PA11

Claims (6)

[Claims] 1. A mounting body for mounting an object to be processed, and a temperature adjusting mechanism for adjusting the temperature of the object to be processed on the mounting body, wherein the temperature adjusting mechanism is provided via the temperature adjusting mechanism. In a mounting device for heating or cooling the object to be processed to set a predetermined temperature, a thermoelectric unit for capturing the heating and cooling ability of the temperature adjusting mechanism is provided in the mounting body, and the temperature adjusting mechanism is A heat exchanger provided in the housing, first heat medium supply means for supplying a heat medium for heating to the heat exchanger, and a heat medium for cooling the heat medium from the heat medium supply means And a second heat medium supply means for supplying the heat medium to the heat exchanger by switching to the mounting means. 2. The mounting apparatus according to claim 1, wherein the heating medium for heating and cooling is water. 3. The thermoelectric unit is arranged so as to alternately connect a plurality of pairs of thermoelectric elements exhibiting the Peltier effect arranged on the whole of the mounting body, and the upper ends and the lower ends of adjacent thermoelectric elements alternately. The mounting device according to claim 1, wherein the mounting device has a plurality of electrodes and is integrated. 4. The mounting apparatus according to claim 1, wherein the mounting body has a top plate formed of aluminum nitride. 5. The mounting according to claim 1, wherein the thermoelectric unit is sandwiched via a ring-shaped support member disposed on an outer periphery of the thermoelectric unit. apparatus. 6. A mounting apparatus comprising: a mounting member on which an object to be processed is mounted; and suction means for vacuum-sucking the object to be processed on the mounting object, wherein the suction means includes a radial exhaust. A mounting device comprising a sheet-like member having a path formed thereon.