JP2002346904A - Method and device for polishing planar member - Google Patents

Method and device for polishing planar member

Info

Publication number
JP2002346904A
JP2002346904A JP2001153914A JP2001153914A JP2002346904A JP 2002346904 A JP2002346904 A JP 2002346904A JP 2001153914 A JP2001153914 A JP 2001153914A JP 2001153914 A JP2001153914 A JP 2001153914A JP 2002346904 A JP2002346904 A JP 2002346904A
Authority
JP
Japan
Prior art keywords
polishing
tape
plate
reel
polishing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001153914A
Other languages
Japanese (ja)
Inventor
Nobukazu Hosogai
信和 細貝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanshin Co Ltd
Original Assignee
Sanshin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanshin Co Ltd filed Critical Sanshin Co Ltd
Priority to JP2001153914A priority Critical patent/JP2002346904A/en
Publication of JP2002346904A publication Critical patent/JP2002346904A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To further simplify structure by polishing a planar member by a polishing tape extending from reels to reels. SOLUTION: This device comprises a holding base 4 capable of holding a planar member W, a reciprocating mechanism 2 for reciprocating the holding base 4, a tape transfer mechanism 7 which is arranged oppositely to the holding base 4 and transfers the polishing tape T extending from reels 15, 16 to reels 15, 16 in the reciprocating direction of the holding base 4, a pressure receiving member 20 capable of bringing the polishing tape T extending from the reels 15, 16 to the reels 15, 16 in pressure contact with the planar member W, a moving mechanism 8 for moving the tape transfer mechanism 7 in a direction opposite to the holding base 4, a feed control part 30 capable of controlling the reciprocating operation of the holding base 4 by the reciprocating mechanism 2, and a tape transfer control part 31 capable of controlling the transfer of the polishing tape T by synchronizing with the reciprocating operation of the holding base 4 by the reciprocating mechanism 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は例えばTAB(Ta
pe Automated Bonding)用テー
プ、多層プリント配線基板等の表面研磨に用いられる板
状部材研磨方法及びその装置に関するものである。
The present invention relates to, for example, TAB (Ta
The present invention relates to a method for polishing a plate-like member used for polishing a surface of a tape for pe-automated bonding, a multilayer printed wiring board, and the like, and an apparatus therefor.

【0002】[0002]

【従来の技術】この種のTAB用テープや多層プリント
配線基板等の板状部材研磨方法及びその装置として、T
ABテープ等の板状部材の表面に存在する絶縁樹脂層や
メッキ層の染み出しの発生による溢れた部分等を砥石に
よる回転モードで除去研磨する構造のものが知られてい
る。
2. Description of the Related Art As a method and an apparatus for polishing a plate-like member such as a TAB tape or a multilayer printed wiring board of this type, there are T.T.
2. Description of the Related Art There is known a structure in which an insulating resin layer or a plating layer, which is present on the surface of a plate-like member such as an AB tape and the like, which overflows due to bleeding, is removed and polished in a rotation mode using a grindstone.

【0003】[0003]

【発明が解決しようとする課題】しかしながら上記回転
モードによる構造の場合、砥石のチッピングが生じ易い
こと表面の平滑化が損なわれることがあると共に最適な
研磨条件を見いだすことが非常に困難であるという不都
合を有している。
However, in the case of the structure using the above-mentioned rotation mode, it is said that chipping of the grindstone easily occurs, the smoothing of the surface may be impaired, and it is very difficult to find optimum polishing conditions. Has inconvenience.

【0004】[0004]

【課題を解決するための手段】本発明はこのような課題
を解決することを目的とし、本発明のうち、請求項1記
載の方法の発明は、板状部材を研磨テープにより研磨す
るに際し、上記板状部材を往復移動させると共にリール
からリールへと移送される研磨テープを板状部材に圧接
し、該板状部材の往復移動動作及び研磨テープの移送を
同期制御し、該リールからリールに至る研磨テープによ
り板状部材を研磨することを特徴とする板状部材研磨方
法にある。
SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem. Among the present invention, a method according to the first aspect of the present invention provides a method for polishing a plate-like member with a polishing tape. The plate-shaped member is reciprocated and the polishing tape transferred from the reel to the reel is pressed against the plate-shaped member, the reciprocating movement of the plate-shaped member and the transfer of the polishing tape are synchronously controlled, and the reel is transferred from the reel to the reel. A plate member polishing method characterized in that the plate member is polished with a polishing tape.

【0005】又、請求項2記載の方法の発明は、上記板
状部材を往復移動させると共にリールからリールへと行
き戻り移送される研磨テープを板状部材に圧接し、該板
状部材の往復移動動作及び研磨テープの行き戻り移送を
同期制御することを特徴とするものであり、又、請求項
3記載の方法の発明は、上記研磨テープを研磨テープの
移送方向に対して交差する研磨テープの幅方向に揺振運
動させることを特徴とするものである。
According to a second aspect of the present invention, there is provided a method for reciprocating the plate-like member and pressing the polishing tape, which is transported back and forth from reel to reel, against the plate-like member, thereby reciprocating the plate-like member. 4. The method according to claim 3, wherein the moving operation and the back-and-forth transfer of the polishing tape are synchronously controlled. Is characterized by swinging motion in the width direction.

【0006】又、請求項4記載の装置の発明は、板状部
材を保持可能な保持台と、該保持台を往復移動させる往
復動機構と、該保持台に対向配置され、リールからリー
ルに至る研磨テープを保持台の往復移動方向に移送させ
るテープ移送機構と、該リールからリールに至る研磨テ
ープを板状部材に圧接可能な受圧部材と、該テープ移送
機構を保持台に対向する方向に移動させる移動機構と、
該往復動機構による該保持台の往復移動動作を制御可能
な送り制御部と、該往復動機構による該保持台の往復移
動動作に同期して研磨テープの移送を制御可能なテープ
移送制御部とを備えてなることを特徴とする板状部材研
磨装置にある。
According to a fourth aspect of the present invention, there is provided a holding table capable of holding a plate-like member, a reciprocating mechanism for reciprocating the holding table, and disposed opposite to the holding table, and a reel to reel. A tape transfer mechanism for transferring the polishing tape to the holding table in a reciprocating direction of the holding table, a pressure receiving member capable of pressing the polishing tape from the reel to the reel against the plate-like member, and a tape transfer mechanism for moving the polishing tape in a direction facing the holding table. A moving mechanism for moving;
A feed control unit capable of controlling the reciprocating movement of the holding table by the reciprocating mechanism, and a tape transfer control unit capable of controlling the transfer of the polishing tape in synchronization with the reciprocating movement of the holding table by the reciprocating mechanism. And a plate-like member polishing apparatus characterized by comprising:

【0007】又、請求項5記載の装置の発明は、上記テ
ープ移送制御部に上記往復動機構による上記保持台の往
復移動動作に同期して研磨テープを行き戻り移送制御可
能なテープ行戻移送制御部を備えてなることを特徴とす
るものであり、又、請求項6記載の装置の発明は、上記
研磨テープを研磨テープの移送方向に対して交差する研
磨テープの幅方向に揺振運動させるテープ揺振機構を備
えてなることを特徴とするものである。
According to a fifth aspect of the present invention, there is provided a tape line return transfer capable of controlling the tape transfer control unit to return and transfer the polishing tape in synchronization with the reciprocating movement of the holding table by the reciprocating mechanism. An apparatus according to a sixth aspect of the present invention is characterized by comprising a control unit, wherein the polishing tape is oscillated in a width direction of the polishing tape which intersects with a direction of transport of the polishing tape. And a tape swinging mechanism for causing the tape to swing.

【0008】[0008]

【発明の実施の形態】図1乃至図6は本発明の実施の形
態例を示し、1は機台、2は往復動機構であって、この
場合機台1上に摺動部3により左右方向に移動自在に保
持台4を配設し、この保持台4を往復移動用モータ5及
びボールネジ機構6により往復移動可能に設け、この保
持台4にTAB用テープ等の研磨すべき板状部材Wを位
置決め状態で固定載置可能な図外の吸着固定機構を配設
している。
1 to 6 show an embodiment of the present invention, wherein 1 is a machine base and 2 is a reciprocating mechanism. A holding table 4 is provided so as to be movable in the direction of the axis, and the holding table 4 is provided so as to be reciprocally movable by a reciprocating motor 5 and a ball screw mechanism 6. An unillustrated suction-fixing mechanism capable of fixing and mounting the W in a positioned state is provided.

【0009】7はテープ移送機構、8は移動機構であっ
て、この場合、機台1の側部に支持機体9を立設し、支
持機体9に上下移動台10を摺動部11により上下動作
可能に設け、この上下移動台10を上下させる上下動用
モータ12及びボールネジ機構13を設け、上下移動台
14にテープ機体14aを取付け、テープ機体14aの
左右側部にポリエステルフィルム、メタル、クロス等の
基材に酸化アルミニュウム、酸化クロム、シリコンカー
バイド、ダイヤモンド等の所定粒度の研磨粒子をコーテ
ィング又は結合してなる研磨テープTを巻き取ったリー
ル15及びリール15から解かれた研磨テープTを巻き
取るリール16を軸着し、リール15及びリール16を
制御回転させる制御用モータ17・18を設け、研磨テ
ープTをリール15からリール16へと案内ロール19
a・19b・19c、ロール状の受圧部材20、案内ロ
ール21a・21b・21cを介して移送案内するよう
に構成している。
Reference numeral 7 denotes a tape transfer mechanism, and 8 denotes a moving mechanism. In this case, a supporting body 9 is erected on the side of the machine base 1, and a vertical moving base 10 is moved up and down by the sliding portion 11 on the supporting machine 9. A vertically movable motor 12 and a ball screw mechanism 13 for operably moving the vertically movable table 10 up and down are provided. A tape body 14a is mounted on the vertically movable table 14, and a polyester film, metal, cloth, etc. is provided on the left and right sides of the tape body 14a. The reel 15 on which the polishing tape T formed by coating or bonding abrasive particles of a predetermined particle size such as aluminum oxide, chromium oxide, silicon carbide, and diamond on the base material, and the polishing tape T unwound from the reel 15 are wound. The reel 16 is mounted on the shaft, and control motors 17 and 18 for controlling and rotating the reel 15 and the reel 16 are provided. Guided from the reel 16 roll 19
a, 19b, 19c, a roll-shaped pressure-receiving member 20, and a guide roll 21a, 21b, 21c.

【0010】22はテープ揺振機構であって、この場
合、上記テープ機体14aに揺振台23を摺動部24に
より研磨テープTの幅方向に揺振運動自在に軸受すると
共にテープ機体14aに揺振用モータ25を取付け、揺
振用モータ25の主軸に偏心カム26を取付け、揺振台
23の側部に偏心カム25に摺動係合なコ状の摺接嵌合
部27を形成し、揺振台23に受け台28を摺動部28
aにより上下摺動自在に軸受すると共に揺振台23に圧
接用シリンダ29を縦設し、圧接用シリンダ29のロッ
ド29aを受け台28に連結し、受け台28にロール状
の受圧部材20を回転自在に軸架し、しかして、揺振用
モータ25により揺振台23を揺振運動させると共に受
圧部材20を圧接用シリンダ29により押下圧接し、研
磨テープTを研磨テープTの移送方向Dに対して交差す
る研磨テープTの幅方向に揺振運動Nさせるように構成
している。尚、固定的な受圧部材とすることもある。
Reference numeral 22 denotes a tape swinging mechanism. In this case, a swinging table 23 is supported on the tape body 14a by a sliding portion 24 so as to freely swing in the width direction of the polishing tape T, and the tape body 14a is mounted on the tape body 14a. The oscillating motor 25 is attached, the eccentric cam 26 is attached to the main shaft of the oscillating motor 25, and a U-shaped sliding contact fitting portion 27 is formed on the side of the oscillating table 23 so as to slidably engage the eccentric cam 25. Then, the cradle 28 is attached to the shaking table 23 by the sliding portion 28.
a, the pressure contact cylinder 29 is installed vertically on the shaking table 23, the rod 29a of the pressure contact cylinder 29 is connected to the receiving table 28, and the roll-shaped pressure receiving member 20 is mounted on the receiving table 28. The shaft is rotatably supported, and the shaking table 23 is oscillated by the shaking motor 25, and the pressure receiving member 20 is pressed down and pressed by the pressing cylinder 29 to move the polishing tape T in the transport direction D of the polishing tape T. Is made to oscillate in the width direction of the polishing tape T that intersects. Note that a fixed pressure receiving member may be used.

【0011】30は送り制御部であって、マイクロコン
ピュータ等により構成され、上記往復動機構2の往復移
動用モータ5に電気的接続され、図4及び図5の如く、
図中右方向への移動G及び保持台4の図中左方向への移
動Fの往復移動動作、例えば保持台4の移動速度、往復
移動ストローク、往復移動回数等を制御するように構成
している。
Reference numeral 30 denotes a feed control unit, which is constituted by a microcomputer or the like, and is electrically connected to the reciprocating motor 5 of the reciprocating mechanism 2, as shown in FIGS.
The reciprocating movement of the movement G to the right in the drawing and the movement F of the holding base 4 to the left in the drawing, for example, the moving speed, the reciprocating stroke, and the number of reciprocating movements of the holding base 4 are controlled. I have.

【0012】31はテープ移送制御部であって、この場
合、テープ行戻移送制御部32が組み込まれ、マイクロ
コンピュータ等により構成され、上記制御用モータ17
・18に電気的接続され、往復動機構2による保持台4
の往復移動動作に同期して、図4及び図5の如く、研磨
テープTの図中左方向の行き移送Q及び図中右方向への
戻り移送Rの両移送の制御や、戻り移送Rをさせない行
き移送Qのみの制御、或いは停止を含む移送の制御、テ
ープ移送速度、行き戻りの回数等の制御を行うように構
成している。
Reference numeral 31 denotes a tape transfer control unit. In this case, a tape rewind transfer control unit 32 is incorporated and is constituted by a microcomputer or the like.
· Holder 4 electrically connected to 18 and reciprocating mechanism 2
4 and 5, in synchronization with the reciprocating movement of the polishing tape T, the control of both of the forward transfer Q of the polishing tape T in the left direction in the figure and the return transfer R of the right direction in the figure, and the return transfer R The system is configured to control only the outgoing transfer Q that is not to be performed, control the transfer including stopping, control the tape transfer speed, the number of back and forth movements, and the like.

【0013】この実施の形態例は上記構成であるから、
研磨すべき板状部材Wを保持台4に保持し、保持台4を
往復動機構2により往復移動させると共にテープ移送機
構7によりリール15からリール16又は、リール16
からリール15へと研磨テープTを移送させ、この移送
される研磨テープTを移動機構8及び受圧部材20によ
り板状部材Wに圧接し、送り制御部30により保持台4
の往復移動動作を制御すると共にこの保持台4の往復移
動動作に同期してテープ移送制御部31により研磨テー
プTの移送を制御することにより板状部材Wを研磨する
ことになり、従って、研磨テープTにより研磨すること
から、表面の平滑化及び表面粗さを容易に高めることが
できると共に構造を簡素化することができ、かつ、リー
ル15からリール16、又は、リール16からリール1
5に至る間の研磨テープTにより研磨することにより、
一層簡素な構造とすることができ、更に、送り制御部3
0により保持台4の往復移動動作を制御すると共にこの
保持台4の往復移動動作に同期してテープ移送制御部3
1により研磨テープTの移送を制御するので、最適な研
磨条件を容易に見付け出すことができ、良好な研磨を行
うことができる。
Since this embodiment has the above configuration,
The plate member W to be polished is held on the holding table 4, the holding table 4 is reciprocated by the reciprocating mechanism 2, and the tape transfer mechanism 7 transfers the reel 15 to the reel 16 or the reel 16.
The polishing tape T is transferred from the polishing tape T to the reel 15, and the transferred polishing tape T is pressed against the plate-shaped member W by the moving mechanism 8 and the pressure receiving member 20.
The plate-like member W is polished by controlling the reciprocating movement of the holding table 4 and controlling the transfer of the polishing tape T by the tape transfer control unit 31 in synchronization with the reciprocating movement of the holding table 4. Since the polishing is performed by the tape T, the surface can be easily smoothed and the surface roughness can be easily increased, the structure can be simplified, and the reel 15 to the reel 16 or the reel 16 to the reel 1
By polishing with the polishing tape T until reaching 5,
The structure can be made simpler, and the feed controller 3
0 controls the reciprocating movement of the holding table 4 and the tape transfer control unit 3 in synchronization with the reciprocating movement of the holding table 4.
Since the transfer of the polishing tape T is controlled by the method 1, optimum polishing conditions can be easily found, and good polishing can be performed.

【0014】又、この場合、上記テープ移送制御部31
に往復動機構2による保持台4の往復移動動作に同期し
て研磨テープTを行き戻り移送制御可能なテープ行戻移
送制御部32を設け、板状部材Wを往復移動させると共
にリール15からリール16、又はリール16からリー
ル15へと行き戻り移送される研磨テープTを板状部材
Wに圧接し、板状部材Wの往復移動動作及び研磨テープ
Tの行き戻り移送を同期制御するので、例えば、図4の
如く、研磨テープTを行き移送Qさせると共に保持台4
を右方向に移動Gさせて研磨することができると共に図
5の如く、研磨テープTを戻り移送Rさせると共に保持
台4を左方向に移動Fさせて研磨することができ、往復
の研磨により研磨効率を高めることができ、研磨の作業
性を高めることができると共に研磨精度を高めることが
でき、しかも、研磨テープTの戻り移送Rにより研磨テ
ープTの節約を図ることができ、経済性を高めることが
でき、又、この場合、テープ揺振機構22により研磨テ
ープTを研磨テープTの移送方向に対して交差する研磨
テープTの幅方向に揺振運動させることができ、板状部
材Wの研磨を一層良好に行うことができる。
In this case, the tape transfer control unit 31
A tape rewinding transfer control unit 32 capable of controlling the back and forth movement of the polishing tape T in synchronization with the reciprocating movement of the holding table 4 by the reciprocating mechanism 2 to reciprocate the plate-shaped member W and to move the reel 15 from the reel 15 16 or the polishing tape T transported back and forth from the reel 16 to the reel 15 is pressed against the plate-shaped member W, and the reciprocating movement of the plate-shaped member W and the back-and-forth transport of the polishing tape T are synchronously controlled. As shown in FIG.
5, the polishing tape T can be returned and transported R, and the holding table 4 can be moved to the left F, as shown in FIG. 5, for polishing. The efficiency can be improved, the workability of the polishing can be improved, and the polishing accuracy can be improved. In addition, the return transfer R of the polishing tape T can save the polishing tape T, thereby increasing the economy. Further, in this case, the polishing tape T can be oscillated by the tape oscillating mechanism 22 in the width direction of the polishing tape T crossing the transport direction of the polishing tape T, and Polishing can be performed more favorably.

【0015】尚、本発明は上記実施の形態例に限られる
ものではなく、往復移動機構4、保持台4、テープ移送
機構7、移動機構8、受圧部材20、テープ揺振機構2
2の構造や送り機構30、テープ移送制御部31、テー
プ行戻移送制御部32の回路構成等は適宜変更して設計
される。
The present invention is not limited to the above-described embodiment, but includes a reciprocating mechanism 4, a holding table 4, a tape transfer mechanism 7, a movement mechanism 8, a pressure receiving member 20, and a tape swing mechanism 2.
2 and the circuit configurations of the feed mechanism 30, the tape transfer control unit 31, and the tape line return transfer control unit 32 are designed by appropriately changing.

【0016】又、本発明は上記実施の形態例に限られる
ものではなく、例えば、上記実施の形態例においては、
乾式研磨構造となっているが、板状部材Wと研磨テープ
Tとの間に各種材質の遊離砥粒や化学剤を含む加工液体
や潤滑剤を供給する所謂湿式研磨構造とすることもあ
り、板状部材Wの種類や研磨条件により選択して設計さ
れる。
Further, the present invention is not limited to the above embodiment, and for example, in the above embodiment,
Although it has a dry polishing structure, there may be a so-called wet polishing structure for supplying a processing liquid or lubricant containing free abrasive grains or chemical agents of various materials between the plate-shaped member W and the polishing tape T, It is selected and designed depending on the type of the plate member W and the polishing conditions.

【0017】[0017]

【発明の効果】本発明は上述の如く、請求項1又は4記
載の発明にあっては、研磨すべき板状部材を保持台に保
持し、保持台を往復動機構により往復移動させると共に
テープ移送機構によりリールからリールへと研磨テープ
を移送させ、この移送される研磨テープを移動機構及び
受圧部材により板状部材に圧接し、送り制御部により保
持台の往復移動動作を制御すると共にこの保持台の往復
移動動作に同期してテープ移送制御部により研磨テープ
の移送を制御することにより板状部材を研磨することに
なり、従って、研磨テープにより研磨することから、表
面の平滑化及び表面粗さを容易に高めることができると
共に構造を簡素化することができ、かつ、リールからリ
ールに至る間の研磨テープにより研磨することにより、
一層簡素な構造とすることができ、更に、送り制御部に
より保持台の往復移動動作を制御すると共にこの保持台
の往復移動動作に同期してテープ移送制御部により研磨
テープの移送を制御するので、最適な研磨条件を容易に
見付け出すことができ、良好な研磨を行うことができ
る。
As described above, according to the present invention, the plate member to be polished is held on the holding table, the holding table is reciprocated by the reciprocating mechanism, and the tape is moved. The polishing tape is transferred from reel to reel by the transfer mechanism, the transferred polishing tape is pressed against the plate-like member by the moving mechanism and the pressure receiving member, and the reciprocating movement of the holding table is controlled by the feed control unit and the holding is performed. By controlling the transfer of the polishing tape by the tape transfer control unit in synchronization with the reciprocating movement of the table, the plate-like member is polished. Therefore, since the polishing is performed by the polishing tape, the surface is smoothed and the surface is roughened. And the structure can be simplified, and by polishing with a polishing tape from reel to reel,
Since the structure can be made simpler and the reciprocating movement of the holding table is controlled by the feed control unit, and the transfer of the polishing tape is controlled by the tape transfer control unit in synchronization with the reciprocating movement of the holding table. Optimum polishing conditions can be easily found, and good polishing can be performed.

【0018】又、請求項2又は5記載の発明にあって
は、上記テープ移送制御部に往復動機構による保持台の
往復移動動作に同期して研磨テープを行き戻り移送制御
可能なテープ行戻移送制御部を設け、板状部材を往復移
動させると共にリールからリールへと行き戻り移送され
る研磨テープを板状部材に圧接し、板状部材の往復移動
動作及び研磨テープの行き戻り移送を同期制御するの
で、往復の研磨により研磨効率を高めることができ、研
磨の作業性を高めることができると共に研磨精度を高め
ることができ、しかも、研磨テープの戻り移送により研
磨テープの節約を図ることができ、経済性を高めること
ができ、又、請求項3又は6記載の発明にあっては、テ
ープ揺振機構により研磨テープを研磨テープの移送方向
に対して交差する研磨テープの幅方向に揺振運動させる
ことができ、板状部材の研磨を一層良好に行うことがで
きる。
According to the second or fifth aspect of the present invention, the polishing tape can be moved back and forth by the tape transfer controller in synchronization with the reciprocating movement of the holding table by the reciprocating mechanism. A transfer control unit is provided to reciprocate the plate-like member and press the polishing tape that is transported back and forth from reel to reel against the plate-like member, synchronizing the reciprocating movement of the plate-like member and the back-and-forth transfer of the polishing tape. Since control is performed, polishing efficiency can be increased by reciprocating polishing, polishing workability can be improved, and polishing accuracy can be increased. Further, polishing tape can be saved by returning and transferring the polishing tape. According to the third or sixth aspect of the present invention, the polishing tape can be polished by a tape swinging mechanism so as to intersect the polishing tape in the direction in which the polishing tape is transported. In the width direction of the-loop can be Yurafu movement, it is possible to perform polishing of the plate-shaped member more satisfactorily.

【0019】以上、所期の目的を充分達成することがで
きる。
As described above, the intended purpose can be sufficiently achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態例の全体正面図である。FIG. 1 is an overall front view of an embodiment of the present invention.

【図2】本発明の実施の形態例の部分正断面図である。FIG. 2 is a partial front sectional view of the embodiment of the present invention.

【図3】本発明の実施の形態例の部分側断面図である。FIG. 3 is a partial side sectional view of an embodiment of the present invention.

【図4】本発明の実施の形態例の部分正面説明図であ
る。
FIG. 4 is an explanatory partial front view of the embodiment of the present invention.

【図5】本発明の実施の形態例の部分正面説明図であ
る。
FIG. 5 is an explanatory partial front view of the embodiment of the present invention.

【図6】本発明の実施の形態例の構成系統図である。FIG. 6 is a configuration system diagram of an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

W フィルタ基板 T 研磨テープ 4 往復移動機構 7 テープ移送機構 8 移動機構 20 受圧部材 22 テープ揺振機構 30 送り機構30 31 テープ移送制御部 32 テープ行戻移送制御部 W Filter substrate T Polishing tape 4 Reciprocating movement mechanism 7 Tape transfer mechanism 8 Moving mechanism 20 Pressure receiving member 22 Tape swing mechanism 30 Feed mechanism 30 31 Tape transfer control unit 32 Tape line return transfer control unit

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 板状部材を研磨テープにより研磨するに
際し、上記板状部材を往復移動させると共にリールから
リールへと移送される研磨テープを板状部材に圧接し、
該板状部材の往復移動動作及び研磨テープの移送を同期
制御し、該リールからリールに至る研磨テープにより板
状部材を研磨することを特徴とする板状部材研磨方法。
When polishing a plate-like member with a polishing tape, the plate-like member is reciprocated and a polishing tape transferred from a reel to a reel is pressed against the plate-like member,
A polishing method for a plate-shaped member, comprising synchronously controlling the reciprocating movement of the plate-shaped member and the transfer of the polishing tape, and polishing the plate-shaped member with the polishing tape from the reel to the reel.
【請求項2】 上記板状部材を往復移動させると共にリ
ールからリールへと行き戻り移送される研磨テープを板
状部材に圧接し、該板状部材の往復移動動作及び研磨テ
ープの行き戻り移送を同期制御することを特徴とする請
求項1記載の板状部材研磨方法。
2. The reciprocating movement of the plate member and the pressing of the polishing tape back and forth from reel to reel to the plate member, and the reciprocating movement of the plate member and the back and forth transfer of the polishing tape. 2. The method for polishing a plate-like member according to claim 1, wherein synchronous control is performed.
【請求項3】 上記研磨テープを研磨テープの移送方向
に対して交差する研磨テープの幅方向に揺振運動させる
ことを特徴とする請求項1又は2記載の板状部材研磨方
法。
3. The method for polishing a plate-like member according to claim 1, wherein the polishing tape is oscillated in a width direction of the polishing tape which intersects with a direction in which the polishing tape is transported.
【請求項4】 板状部材を保持可能な保持台と、該保持
台を往復移動させる往復動機構と、該保持台に対向配置
され、リールからリールに至る研磨テープを保持台の往
復移動方向に移送させるテープ移送機構と、該リールか
らリールに至る研磨テープを板状部材に圧接可能な受圧
部材と、該テープ移送機構を保持台に対向する方向に移
動させる移動機構と、該往復動機構による該保持台の往
復移動動作を制御可能な送り制御部と、該往復動機構に
よる該保持台の往復移動動作に同期して研磨テープの移
送を制御可能なテープ移送制御部とを備えてなることを
特徴とする板状部材研磨装置。
4. A holding table capable of holding a plate-like member, a reciprocating mechanism for reciprocating the holding table, and a reciprocating direction of the holding table which is disposed to face the holding table and moves polishing tape from a reel to a reel. Transfer mechanism for transferring the polishing tape from the reel to the reel, a pressure receiving member capable of pressing the polishing tape against the plate-like member, a moving mechanism for moving the tape transfer mechanism in a direction facing the holding table, and the reciprocating mechanism And a tape transfer controller capable of controlling the transfer of the polishing tape in synchronization with the reciprocating movement of the holder by the reciprocating mechanism. A plate-like member polishing apparatus characterized by the above-mentioned.
【請求項5】 上記テープ移送制御部に上記往復動機構
による上記保持台の往復移動動作に同期して研磨テープ
を行き戻り移送制御可能なテープ行戻移送制御部を備え
てなることを特徴とする請求項4記載の板状部材研磨装
置。
5. The tape transfer control unit further comprises a tape rewinding transfer control unit capable of controlling the back and forth transfer of the polishing tape in synchronization with the reciprocating movement of the holding table by the reciprocating mechanism. The plate-like member polishing apparatus according to claim 4, wherein
【請求項6】 上記研磨テープを研磨テープの移送方向
に対して交差する研磨テープの幅方向に揺振運動させる
テープ揺振機構を備えてなることを特徴とする請求項4
又は5記載の板状部材研磨装置。
6. A polishing apparatus according to claim 4, further comprising a tape oscillating mechanism for oscillating the polishing tape in a width direction of the polishing tape which intersects a direction in which the polishing tape is transported.
Or a plate-like member polishing apparatus according to 5.
JP2001153914A 2001-05-23 2001-05-23 Method and device for polishing planar member Pending JP2002346904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001153914A JP2002346904A (en) 2001-05-23 2001-05-23 Method and device for polishing planar member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001153914A JP2002346904A (en) 2001-05-23 2001-05-23 Method and device for polishing planar member

Publications (1)

Publication Number Publication Date
JP2002346904A true JP2002346904A (en) 2002-12-04

Family

ID=18998349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001153914A Pending JP2002346904A (en) 2001-05-23 2001-05-23 Method and device for polishing planar member

Country Status (1)

Country Link
JP (1) JP2002346904A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110625490A (en) * 2019-09-17 2019-12-31 东莞市国瓷新材料科技有限公司 Adjustable ceramic polishing grinder and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110625490A (en) * 2019-09-17 2019-12-31 东莞市国瓷新材料科技有限公司 Adjustable ceramic polishing grinder and method

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