JP7284852B2 - polishing unit - Google Patents

Description

The present invention is, for example, a liquid crystal panel, a glass plate, a lens, a semiconductor wafer, a copper plate, a printed circuit board, a filter, a polishing used when polishing the surface of a plate member such as a stainless steel plate and chamfering the corner edge. Regarding the unit.

Conventionally, as a polishing unit of a polishing apparatus for polishing a workpiece such as a glass plate or a semiconductor wafer, for example, a polishing tape is used, which is formed by bonding fixed abrasive grains of a predetermined grain size such as aluminum oxide to a base material such as a polyester film. A feed-out shaft and a take-up shaft are rotatably arranged on the polishing machine, a real reel around which the polishing tape is wound is attached to the feed-out shaft, an empty reel is attached to the take-up shaft, and the actual reel is The unwound abrasive tape is wound around an empty reel, a winding motor is provided for winding and rotating the winding shaft and the empty reel, an unwinding motor is provided for unwinding and rotating the delivery shaft and the actual winding reel, A structure is known in which a polishing tape is transported continuously or intermittently by mutually controlling the rotation of a winding motor and an unwinding motor.

Patent No. 6673965 JP-A-11-99458 JP-A-11-99459

However, in the case of the above-mentioned conventional polishing unit, as the tape transfer mechanism, a structure is adopted in which the polishing tape is transferred continuously or intermittently by mutually controlling the rotation of two motors, the winding motor and the unwinding motor. Therefore, for example, rotation control of two servo motors and synchronous control between these motors are required, which complicates the overall structure, reduces the weight, and becomes a bottleneck for reducing the cost of the equipment, and is difficult to polish various workpieces. It has the disadvantage that it may not be possible to ensure processing flexibility and expanded applications.

An object of the present invention is to solve such inconveniences. A tape, a tape transfer mechanism for transferring the polishing tape continuously or intermittently, and a pressure contact mechanism for pressing the polishing surface of the polishing tape against the surface to be polished of the workpiece, wherein the tape transfer mechanism is a feed-out shaft and a take-up shaft are rotatably arranged in the polishing machine, a real reel around which the polishing tape is wound is mounted on the feed-out shaft, an empty reel is mounted on the take-up shaft, and the Abrasive tape unwound from a real winding reel is wound around the empty reel, a winding motor for winding up and rotating the winding shaft and the empty reel is provided, and the delivery shaft and the real winding reel are The polishing unit is characterized in that the polishing tape is unwound and rotated through the polishing tape by the winding rotation of the winding shaft and the empty reel.

A second aspect of the invention is characterized in that it comprises an oscillating mechanism for oscillating the polishing tape in the tape width direction perpendicular to the tape transfer direction. The present invention is characterized in that the pressure contact mechanism is provided with a pressure contact member capable of guiding the polishing tape by folding.

The invention according to claim 4 is characterized in that the polishing structure of the polishing unit is a dry structure or a wet structure.

As described above, according to the first aspect of the present invention, the work piece is moved by transporting the polishing tape by the tape transport mechanism and pressing the polishing surface of the polishing tape against the surface of the work piece by the pressing mechanism. When polishing the surface of a workpiece, the polishing surface of the polishing tape is pressed against the surface to be polished of the workpiece by a pressure contact mechanism, and the polishing tape is transported, pressed, and supported. The surface to be polished of the workpiece can be polished with the polishing surface of the polishing tape by the combined motion of the moving motion of the tip of the body. A real reel with an abrasive tape wound around it is mounted rotatably on the delivery shaft, an empty reel is installed on the take-up shaft, and the abrasive tape unwound from the real reel is wound around the empty reel. A winding motor is provided for winding and rotating the winding shaft and the empty reel, and the feeding shaft and the actual winding reel are rotated to wind and unwind through the polishing tape by the winding rotation of the winding shaft and the empty reel. Therefore, it is possible to transfer the polishing tape continuously or intermittently by controlling the rotation of a single winding motor, thereby simplifying the overall structure of the tape transfer mechanism, reducing the weight, and reducing the cost of the apparatus. This makes it possible to ensure the flexibility of the polishing process for various types of workpieces and to expand the range of applications. The work piece can be polished by the pressure contact of the surfaces, and the polishing accuracy and the surface roughness of the polishing surface can be improved by the interaction of the transfer of the polishing tape and the pressure contact of the polishing tape, and good polishing can be performed. It is possible to carry out excellent polishing processing of the surfaces to be polished of various workpieces.

Further, in the invention according to claim 2, since an oscillating mechanism is provided for oscillating the polishing tape in the tape width direction orthogonal to the tape transfer direction, the abrasive tape is oscillated in the tape width direction. The polishing accuracy and the surface roughness of the polished surface can be further improved by the interaction of the transfer of the polishing tape, the pressure contact of the polishing tape, and the oscillating motion, and good polishing can be performed. In the third aspect of the present invention, the pressure contact mechanism is provided with a pressure contact member capable of guiding the polishing tape by folding back, so that the polishing surface of the polishing tape is reliably pressed against the surface to be polished of the workpiece. It is possible to perform a smooth and excellent polishing process.

In the fourth aspect of the invention, since the polishing structure of the polishing unit is a dry structure or a wet structure, a polishing tape having a structure in which fixed abrasive grains are adhered to a base material is used, and no lubricant is used. A dry polishing structure or a wet polishing structure in which a polishing tape having a structure in which fixed abrasive grains are fixed to a substrate is used to polish while supplying a lubricant, or a woven fabric, non-woven fabric, or foam film without fixed abrasive grains. A wet polishing structure in which a flocked cloth is used as a polishing tape to supply a polishing agent containing free abrasive grains can be selected according to the material of the workpiece and the specifications of the polishing process, thereby enhancing the flexibility of the polishing process. It is possible to perform a good polishing process accordingly.

1 is an overall perspective view of an embodiment of the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is whole front sectional drawing of the example of embodiment of this invention. 1 is an overall side sectional view of an embodiment of the present invention; FIG. 1 is a partial front sectional view of an embodiment of the present invention; FIG. 1 is a partial plan cross-sectional view of an embodiment of the present invention; FIG. 1 is a partial side cross-sectional view of an embodiment of the present invention; FIG. 1 is a partial plan cross-sectional view of an embodiment of the present invention; FIG. 1 is an overall front view of a polishing apparatus to which an embodiment of the invention is applied; FIG. 1 is an overall plan view of a polishing apparatus to which an embodiment of the invention is applied; FIG. 1 is an overall side cross-sectional view of a polishing apparatus to which an embodiment of the present invention is applied; FIG. 1 is a partial side sectional view of a polishing apparatus to which an embodiment of the invention is applied; FIG. FIG. 4 is a side cross-sectional view for explaining the processing state of the embodiment of the present invention;

1 to 12 show an embodiment of the polishing unit KU of the present invention. In this case, as shown in FIGS. a polishing tape T for polishing the surface _W1 of the workpiece _W ; a tape transfer mechanism C for continuously or intermittently transferring _T2 the polishing tape T; A pressing mechanism D for pressing N against the polished surface _W1 of the workpiece W. As the tape transfer mechanism C, the feeding shaft _BK and the winding shaft _BM are rotatably disposed on the polishing body B. Then, a real reel _RK around which a polishing tape T is wound is attached to the delivery shaft _BK , an empty reel _RM is attached to the take-up shaft _BM , and the abrasive tape is unwound from the real reel _RK . T is wound around an empty reel _RM , and has a winding shaft _BM and a winding motor _M for winding and rotating the _empty reel _RM . An idle rotation preventing mechanism E is provided for unwinding and rotating through the polishing tape T by the winding rotation of the shaft _BM and the empty reel _RM , and imparting rotational resistance to the delivery shaft _BK .

In this case, as shown in FIG. 3, an oscillating mechanism F is provided for oscillating the polishing tape T in the tape width direction perpendicular to the tape transfer _T2 direction. As shown in FIG. 3, the pressure contact mechanism D is provided with a pressure contact member _D1 capable of guiding the polishing tape T by folding.

In this case, in the polishing apparatus to which the polishing unit KU is applied, the support body A is provided with a front-rear movable table 2 on a machine base 1, a sliding portion 2a and a guide portion, as shown in FIGS. The front-rear movable table 2 is moved back and forth by a moving mechanism 2f consisting of a moving motor 2d and a ball screw mechanism 2e, and the front-rear movable table 2 is moved back and forth by a sliding portion 3a. and a guide mechanism 3c composed of a guide portion 3b, the vertically movable table 3 is vertically moved by a moving mechanism 3f composed of a moving motor 3d and a ball screw mechanism 3e, and the horizontally movable table 4 is slid on the vertically movable table 2. A guide mechanism 4c consisting of a moving part 4a and a guide part 4b is provided so as to be vertically movable. A connecting member _A1 for connecting the polishing unit KU with the polishing body B of the polishing unit KU is attached, and the polishing unit KU can be moved in the three directions of X, Y, and Z in the front-rear direction, the vertical direction, and the horizontal direction. Cartesian coordinate type structure is adopted. The support body A is composed of a serial type, for example, a cylindrical coordinate type, a polar coordinate type, a horizontal multi-joint type, a vertical multi-joint type, a parallel link type, and a support body A having other structures.

In this case, the polishing tape T is, for example, a base material such as a polyester film, metal, cloth, foam film, flocked blanket, etc. coated or coated with fixed abrasive grains of a predetermined grain size such as aluminum oxide, chromium oxide, silicon carbide, diamond, etc. A combined one is used. A dry polishing structure that does not use lubricant by using a polishing tape having a structure in which fixed abrasive grains are fixed to a base material, or a polishing tape having a structure in which fixed abrasive grains are fixed to a base material is used to supply a lubricant. A wet polishing structure that polishes while polishing, or a wet polishing structure that supplies a polishing agent containing free abrasive grains by using a woven cloth, nonwoven fabric, foam film, or flocked cloth to which fixed abrasive grains are not fixed as a polishing tape. Therefore, the polishing tape T referred to here includes a polishing tape having a structure in which fixed abrasive grains are adhered and a polishing tape having a structure in which no fixed abrasive grains are adhered.

In this case, as the tape transfer mechanism C, the grinding body B is attached to the connection member _A1 of the support body A, and the mounting plate _B1 is attached to the grinding body B, as shown in FIGS. A winding motor M for winding and rotating the winding shaft _BM and the empty reel _RM is disposed on the mounting plate _B1 , and the winding motor M rotates and winds through the gear mechanism 5, and polishes. A cover 5a for a gear mechanism 5 is provided on the body B, and the gear mechanism 5 consists of a gear 5b and a gear _5c that mesh with each other _. , the feed-out shaft _BK and the actual winding reel _RK are unwound and rotated through the polishing tape T by the winding rotation of the winding shaft _BM and the empty reel _RM , and polished by the rotation of the winding motor M. _The tape T is configured to be continuously or intermittently transported T2 from the full reel _RK to the empty reel _RM in the tape transport _T2 direction indicated by the arrow in FIG.

In this case, as the idle rotation preventing mechanism E, a friction member _E1 is attached to the delivery shaft _BK , and a cylindrical member 6 is attached to the grinding body B, as shown in FIGS. A spherical friction body 7, a spring 8, and a set screw 9 are installed in the body, and the spring 8 presses the friction body 7 against the surface of the friction member _E1 to impart rotational resistance to the friction member _E1 . This prevents the loosening of the tape T due to unexpected rotation of the tape T, and imparts an appropriate tension to the polishing tape T to make the transfer _T2 of the polishing tape T smoother and to increase the stability of the transfer _T2 .

In this case, as shown in FIGS. 2, 3, 4 and 5, the rocking mechanism F has a mounting member _B2 attached to the grinding body B and a rocking member 10 attached to the mounting member _B2 . is provided by a slide table 11 and a guide 12 so as to freely oscillate H in the tape width direction perpendicular to the tape transfer _T2 direction, and an oscillating motor 13 is attached to the upper part of the mounting member _B2 , and a drive shaft 14 is rotated. The main shaft of the oscillating motor 13 and the drive shaft 14 are connected by a joint 15, and an eccentric wheel mechanism 16 is interposed between the drive shaft 14 and the oscillating member 10. In this case, the drive shaft 14 An eccentric shaft portion 14a having a rotation axis _O1 with an eccentricity ε with respect to the rotation axis O of the drive shaft 14 is formed on the eccentric shaft portion 14a. A mating recess 10a is formed, and a pair of opposing contact surfaces 10b, 10b in contact with the peripheral surface of the eccentric ring 17 is formed in the fitting recess 10a. It is configured to perform a swinging motion H in the width direction.

Further, in this case, as the pressure contact mechanism D, as shown in FIGS. An advancing/retracting member 19 is installed on the lower end portion of 18a, and a pressing member _D1 capable of guiding the polishing tape T by folding back is provided on the advancing/retreating member 19 so as to be rotatable about the rotation axis P. A pair of front and rear tape guides 20, 20 for guiding the end faces are attached to the left and right, and the plungers 18a, 18a of the cylinder portions 18, 18 move the polishing surface _T1 of the polishing tape T through the pressure contact member _D1 to the workpiece W. is configured to be brought into pressure contact N with the surface _W1 to be polished.

In this case, as a holding mechanism G for holding the workpiece W, as shown in FIGS. In this case, a negative pressure suction mechanism 22 is used as the holding mechanism G, the holding member 21 is provided to be horizontally rotatable, and the upper surface of the holding member 21 is a mounting surface on which the workpiece W can be mounted. 21a is provided, and a horizontal turning mechanism 23 for turning the holding member 21 continuously or intermittently is provided. A holding mounting base 24 is attached to the holding mounting base 24, a rotating shaft 25 is rotatably provided to the holding mounting base 24 by a bearing portion 26, a driven pulley 27 is provided under the rotating shaft 25, a turning motor 28 is attached to the holding mounting base 24, A drive pulley (not shown) is attached to the main shaft of a swing motor 28, a drive belt 29 is wound between the drive pulley and the driven pulley 27, the holding member 21 is attached to the rotating shaft 25, and the drive belt is rotated by the swing motor 28. 29 to rotate the holding member 21 continuously or intermittently.

Further, in this case, as the negative pressure adsorption mechanism 22, as shown in FIGS. A suction port 30a connected to a pressure source is provided, the suction port 30a of the annular member 30 communicates with the suction path 21b of the holding member 21, and the work piece placed on the placement surface 21a of the holding member 21 is provided. The object W is provided so as to be held and released by adsorption or release of the negative pressure. In the above-described embodiment, the holding mechanism G employs the negative pressure adsorption mechanism 22 that utilizes negative pressure. A mechanical holding mechanism may be employed.

In this case, the support body A, the polishing unit KU and the holding mechanism G are synchronously controlled. This synchronous control includes, for example, a control circuit for synchronizing the operation control and feedback control of the movement mechanism of the support body A, the polishing unit KU, and the holding mechanism G, and includes, for example, CPU, ROM, RAM, HDD, input/output It is composed of a computer having a port and various circuits, and controls the time of continuous or intermittent transfer _T2 of the polishing tape T of the polishing unit KU, the transfer _T2 speed of the polishing tape T, and the workpiece of the holding mechanism G. The moving time of W, moving speed, intermittent rotation interval time between rotation and rotation stop, rotation speed of workpiece W, etc. are controlled by synchronizing programs.

1, 2, and 3, the polishing unit KU is supported by the supporting body A, and the polishing tape T is continuously or intermittently transferred to the polishing unit KU. ₂ , and a pressing mechanism D that presses N the polishing surface _T1 of the polishing tape T against the polished surface _W1 of the workpiece W. The tape transfer mechanism C transfers the polishing tape T ₂ and The work W can be polished by pressing the polishing surface _T1 of the polishing tape T against the surface _W1 of the work W by the pressure contact mechanism D. For example, as shown in FIG. , the polishing surface T1 of the polishing tape T is pressed N against _the surface _W1 of the workpiece W by the pressure contact mechanism D, and the transfer _T2 of the polishing tape T and the pressure contact of the polishing tape T are performed. The surface W1 of the workpiece W to be polished can be polished with the polishing surface _T1 of the polishing tape T by the combined motion of the _moving motion of N and the connecting member _A1 at the tip of the support body A. At this time, the tape As the transfer mechanism C, a payout shaft _BK and a take-up shaft _BM are rotatably arranged in the polishing body B, and a real reel RK around which the polishing tape _T is wound is attached to the payout shaft _BK , An empty reel _RM is attached to the take-up shaft _BM , and the polishing tape T unwound from the actual reel _RK is wound around the empty reel _RM , and the take-up shaft _BM and the empty reel _RM are taken up. A winding motor M for rotation is provided, and the delivery shaft _BK and the actual winding reel _RK are wound and unwound and rotated through the polishing tape _T by the winding rotation of the winding shaft _BM and the empty reel RM. , the idle rotation prevention mechanism E for imparting rotational resistance to the feeding shaft _BK is provided, so that the polishing tape T can be continuously or intermittently transferred T by controlling the rotation of the single winding motor M. ₂ , the overall structure of the tape transfer mechanism C can be simplified, the weight can be reduced, and the device cost can be reduced. In addition, since the pressure contact mechanism D is provided, the work W can be polished by the pressure contact N of the polishing surface _T1 of the polishing tape T against the surface _W1 of the work W to be polished. The polishing accuracy and the surface roughness of the polishing surface _T1 can be improved by the interaction of the transfer _T2 of the polishing tape T and the pressure contact N of the polishing tape T, and good polishing can be performed. Since the feeding shaft _BK is provided with the idling prevention mechanism E that imparts rotational resistance, it is possible to impart an appropriate tension to the polishing tape T, thereby preventing slackening of the polishing tape T due to unforeseen feeding rotation. The phenomenon can be prevented, the transfer _T2 of the polishing tape T can be smoothed and the stability of the transfer _T2 can be improved, and the polished surface _W1 of various workpieces W can be polished satisfactorily. can be done.

In this case, as shown in FIGS. 1 and 2, the oscillating mechanism F is provided for oscillating the polishing tape T in the tape width direction perpendicular to the tape transfer _T2 direction. As _shown in 12, the polishing tape T can be oscillated in the tape width direction. It is possible to further improve the surface roughness of _T1 and perform a good polishing process. In this case, as shown in FIG. Since the _D1 is provided, the polishing surface _T1 of the polishing tape T can be reliably brought into pressure contact N with the surface _W1 of the workpiece W to be polished, and smooth and excellent polishing can be performed.

In this case, as shown in FIGS. 2 and 7, the anti-idling mechanism E is a friction member _E1 attached to the delivery shaft _BK , and the surface of the friction member _E1 is pressed by a spring 8 to the friction member. Since the _E1 is composed of the friction member 7 that imparts rotational resistance, the structure of the anti-rotation mechanism E can be simplified, and the transfer _T2 of the polishing tape T can be made smoother and the stability of the transfer _T2 improved. In this case, since the polishing structure of the polishing unit KU is a dry structure or a wet structure, a dry polishing structure that does not use a lubricant is used using a polishing tape T having a structure in which fixed abrasive grains are fixed to the substrate. or a wet polishing structure that polishes while supplying a lubricant using a polishing tape T having a structure in which fixed abrasive grains are fixed to the base material, or a woven fabric, non-woven fabric, foam film, or planting material that does not adhere fixed abrasive grains. A wet polishing structure in which a blanket is used as a polishing tape T to supply a polishing agent containing free abrasive grains can be selected according to the material of the workpiece W and the specifications of the polishing process, thereby enhancing the flexibility of the polishing process. It is possible to perform a good polishing process accordingly.

In this case, as the holding mechanism G of the polishing apparatus for holding the workpiece W, a holding member 21 capable of holding the workpiece W is provided as shown in FIGS. The workpiece W can be reliably held by the holding mechanism G, and the workpiece W can be reliably held and released from the holding member 21 by the holding mechanism G, and excellent polishing can be performed. 11, since the negative pressure adsorption mechanism 22 is used as the holding mechanism G, the workpiece W can be reliably held by the holding member 21 and the structure of the holding mechanism G can be simplified. In this case, as shown in FIG. 11, the holding member 21 is provided to be horizontally rotatable, and a mounting surface 21a on which the workpiece W can be placed is provided on the upper surface of the holding member 21, Since the horizontal turning mechanism 23 for turning the holding member 21 continuously or intermittently is provided, the continuous or intermittent turning operation of the holding member 21 by the horizontal turning mechanism 23 makes polishing of the workpiece W flexible. can be flexibly adapted to various types of workpieces W and various specifications. can do.

In addition, the present invention is not limited to the above-described embodiments, and includes support body A, polishing body B, tape transfer mechanism C, pressure contact mechanism D, pressure contact member D ₁ , anti-rotation mechanism E, friction member E ₁ , Structures such as the swinging mechanism F, the actual winding reel R _K , the empty reel R _M , the winding motor M, the friction body 7, the spring 8, etc., and the material and structure of the polishing tape T are designed by appropriately changing them. be.

As described above, the intended purpose can be sufficiently achieved.

KU Polishing unit W Work piece W ₁ Surface to be polished T Polishing tape T ₁ Polishing surface T ₂ Tape transport A Support body B Polishing body B _K feeding shaft B _M winding shaft C Tape transport mechanism D Pressing mechanism D ₁ Pressing member F Oscillating mechanism H Oscillating motion N Pressure contact R _K actual reel _RM Empty reel M Winding motor

Claims (4)

A polishing machine supported by a supporting machine, a polishing tape for polishing a surface to be polished of a workpiece, a tape transfer mechanism for continuously or intermittently transferring the polishing tape, and a polishing surface of the polishing tape to be processed. a pressing mechanism for pressing against the surface of the object to be polished, and as the tape transfer mechanism, a feeding shaft and a winding shaft are rotatably arranged on the polishing body, and the polishing tape is wound around the feeding shaft. An empty reel is attached to the take-up shaft, the abrasive tape unwound from the actual reel is wound around the empty reel, and the take-up shaft and the empty reel are wound. A take-up motor is provided for take-up rotation, and the delivery shaft and the actual take-up reel are unwound and rotated through the abrasive tape by the take-up rotation of the take-up shaft and the empty reel. polishing unit. 2. A polishing unit according to claim 1, further comprising an oscillating mechanism for oscillating said polishing tape in a tape width direction orthogonal to a tape transfer direction. 3. A polishing unit according to claim 1, wherein said pressure contact mechanism is provided with a pressure contact member capable of folding and guiding said polishing tape. 3. The polishing unit according to claim 1, wherein the polishing structure of said polishing unit is a dry structure or a wet structure.

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