JP2011045957A - Polishing method and device of the same - Google Patents

Polishing method and device of the same Download PDF

Info

Publication number
JP2011045957A
JP2011045957A JP2009196495A JP2009196495A JP2011045957A JP 2011045957 A JP2011045957 A JP 2011045957A JP 2009196495 A JP2009196495 A JP 2009196495A JP 2009196495 A JP2009196495 A JP 2009196495A JP 2011045957 A JP2011045957 A JP 2011045957A
Authority
JP
Japan
Prior art keywords
polishing
tape
workpiece
polished
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009196495A
Other languages
Japanese (ja)
Other versions
JP5379607B2 (en
Inventor
Nobukazu Hosogai
信和 細貝
Eiji Aiba
英司 相波
Teruo Honda
照男 本田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanshin Co Ltd
Original Assignee
Sanshin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanshin Co Ltd filed Critical Sanshin Co Ltd
Priority to JP2009196495A priority Critical patent/JP5379607B2/en
Publication of JP2011045957A publication Critical patent/JP2011045957A/en
Application granted granted Critical
Publication of JP5379607B2 publication Critical patent/JP5379607B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing method and its device with which an upper surface can pressure-contacts and by which the surface is polished by a prescribed number of times of revolutions of an object to be worked in a normal direction and the forward movement of a polishing tape and a lower surface can pressure-contact and can be polished by a prescribed number of times of revolutions of the object to be worked in an opposite direction and the return movement of the polishing tape. <P>SOLUTION: A polishing device includes a holding and rotating mechanism (A) for holding the object W to be worked and rotating R the object to be worked in the normal direction or in the opposite direction, a pressure contact mechanism B for allowing a polishing surface T<SB>1</SB>of the polishing tape T to pressure-contact with a surface W<SB>1</SB>to be polished of the work to be worked, a tape moving mechanism C for moving forward M the polishing tape to the other tape reel from one tape reel 1 and returning N the polishing tape to the one tape reel from the other tape reel, and a control means D for moving forward the polishing tape in the opposite direction with respect to the rotating direction of the object to be worked in polishing the upper surface W<SB>11</SB>of the surfaces to be polished and returning the polishing tape in the opposite direction to the rotating direction of the object to be worked in polishing the lower surface W<SB>2</SB>of the surfaces to be polished. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、被加工物の被研磨面、例えば、板カムのカム面などの表面研磨に用いられる研磨方法及びその装置に関するものである。   The present invention relates to a polishing method and apparatus used for polishing a surface of a workpiece, such as a cam surface of a plate cam.

従来、この種の研磨装置として、一対のテープリール間に研磨テープを掛架し、研磨テープを回転する被加工物の被研磨面に圧接機構により圧接して研磨する構造のものが知られている。   Conventionally, this type of polishing apparatus has a structure in which a polishing tape is hung between a pair of tape reels, and the surface to be polished of the workpiece that rotates the polishing tape is pressed against a polishing surface by a pressure contact mechanism and polished. Yes.

特開平5−8163号公報Japanese Patent Laid-Open No. 5-8163

しかしながらこれら従来構造の場合、例えば、板カムのカム面など、被研磨面が被加工物の回転に連れて回転半径が漸増する登り面及び漸減する下り面からなる被加工物においては、これら被研磨面の内、被加工物を被加工物の回転方向が被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻すことになる方向に回転させると共に研磨テープを被加工物の回転方向に対して反対向きに移送させることにより登り面の研磨は良好に行うことができるものの、この登り面の研磨における回転方向と同じ回転方向のまま被加工物を連続回転させて下り面を研磨したとき、被加工物の回転に連れて該圧接ロールが圧接力により被研磨面を押し前進することになって、上記圧接ロールのいわゆる跳躍現象などによる追従性の低下により良好な研磨面を得ることができないことがあるという不都合を有している。   However, in the case of these conventional structures, for example, in a workpiece such as a cam surface of a plate cam, a workpiece having an ascending surface whose radius of rotation gradually increases and a descending surface where the radius of rotation gradually decreases as the workpiece rotates. Of the polishing surface, the workpiece is rotated in the direction in which the rotation direction of the workpiece is gradually pushed back against the pressing force as the workpiece rotates, and the polishing tape is moved to the workpiece. Although the climbing surface can be satisfactorily polished by transporting it in the opposite direction to the rotation direction, the workpiece is continuously rotated while maintaining the same rotation direction as that for polishing the climbing surface. When the workpiece is polished, the press roll pushes the surface to be polished by the press contact force as the work piece rotates, and the follow-up performance of the press roll due to the so-called jump phenomenon is good. It has the disadvantage that it may not be possible to obtain a Do polished surface.

本発明はこのような不都合を解決することを目的とするもので、本発明のうち、請求項1記載の方法の発明は、未使用の研磨テープを巻回した一方のテープリール及び該テープリールから解かれた未使用の研磨テープを巻き取る他方のテープリールからなる一対のテープリール間に該研磨テープを移送自在に掛け渡し、回転する被加工物の被研磨面に該研磨テープを圧接ロールにより圧接して研磨するに際し、上記被加工物の被研磨面は被加工物の回転に連れて回転半径が漸増する登り面及び漸減する下り面からなり、該被研磨面の内、該登り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる正方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに行き移送させ、該被研磨面の内、該下り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる逆方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに戻り移送させることを特徴とする研磨方法にある。   SUMMARY OF THE INVENTION The present invention aims to solve such disadvantages. Among the present inventions, the invention of the method according to claim 1 is a tape reel on which an unused polishing tape is wound and the tape reel. The polishing tape is transferred between a pair of tape reels composed of the other tape reel that winds up the unused polishing tape unwound from the roll, and the polishing tape is pressed against the polishing surface of the rotating workpiece. The surface to be polished of the workpiece is composed of an ascending surface whose radius of rotation gradually increases and a descending surface that gradually decreases as the workpiece is rotated. In this polishing, the workpiece is gradually rotated in the positive direction, which is a direction in which the workpiece is pushed back against the pressure as the workpiece rotates, and the abrasive tape is moved in the direction of rotation of the workpiece. Opposite to In the polishing of the down surface of the surface to be polished, the workpiece is gradually moved back in the reverse direction against the pressing force as the workpiece rotates. In the polishing method, the polishing tape is rotated and returned and transferred in the direction opposite to the rotation direction of the workpiece.

又、請求項2記載の方法の発明は、上記研磨テープを研磨テープの移送方向に対して交差する方向に揺振運動させることを特徴とするものであり、又、請求項3記載の方法の発明は、上記被加工物の下り面を研磨するに際し、予め、該下り面の研磨に必要な長さ分の上記研磨テープを他方のテープリールに巻き取っておくことを特徴とするものであり、又、請求項4記載の方法の発明は、上記一対のテープリール間における研磨テープの行き移送又は戻り移送時において、上記研磨テープにバックテンションを付与することを特徴とするものである。   The invention of the method according to claim 2 is characterized in that the polishing tape is oscillated in a direction intersecting with the transfer direction of the polishing tape. The invention is characterized in that, when polishing the down surface of the workpiece, the polishing tape of a length necessary for polishing the down surface is previously wound around the other tape reel. The invention according to claim 4 is characterized in that a back tension is applied to the polishing tape at the time of forward transfer or return transfer of the polishing tape between the pair of tape reels.

又、請求項5記載の装置の発明は、被加工物の被研磨面が被加工物の回転に連れて回転半径が漸増する登り面及び漸減する下り面からなる被加工物を保持して正方向又は逆方向に回転させる保持回転機構と、未使用の研磨テープを巻回した一方のテープリール及び該テープリールから解かれた未使用の研磨テープを巻き取る他方のテープリールからなる一対のテープリール間に移送自在に掛け渡された研磨テープの研磨面を被加工物の被研磨面に圧接させる圧接機構と、該研磨テープを一方のテープリールから他方のテープリールへと行き移送させると共に他方のテープリールから一方のテープリールへと戻り移送させるテープ移送機構と、該被研磨面の内、該登り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる正方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに行き移送させ、該被研磨面の内、該下り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる逆方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに戻り移送させる制御手段とを備えてなることを特徴とする研磨装置にある。   Further, the invention of the apparatus according to claim 5 is characterized in that the surface to be polished of the work piece holds the work piece having an ascending surface whose turning radius gradually increases and a descending surface which gradually decreases as the work piece rotates. A pair of tapes composed of a holding and rotating mechanism that rotates in a direction or reverse direction, one tape reel wound with an unused polishing tape, and the other tape reel that winds an unused polishing tape unwound from the tape reel A pressure contact mechanism that presses the polishing surface of the polishing tape that is movably transferred between the reels against the surface to be polished of the workpiece, and transfers the polishing tape from one tape reel to the other tape reel and the other. In the polishing of the rising surface of the surface to be polished, the workpiece is gradually moved in accordance with the rotation of the workpiece. The polishing tape is rotated in the positive direction, which is a direction to push back against the pressure force, and the polishing tape is moved in a direction opposite to the rotation direction of the workpiece, and the down surface of the polished surface is polished. In this case, the workpiece is gradually rotated in the opposite direction to the direction in which the workpiece is pushed back against the pressure as the workpiece rotates, and the polishing tape is rotated with respect to the direction of rotation of the workpiece. The polishing apparatus is characterized by comprising control means for returning and transporting in the opposite direction.

又、請求項6記載の装置の発明は、上記研磨テープを研磨テープの移送方向に対して交差する方向に揺振運動させるテープ揺振機構を備えてなることを特徴とするものであり、又、請求項7記載の装置の発明は、上記制御手段に上記被加工物の下り面を研磨する前に予め該下り面の研磨に必要な長さ分の研磨テープを他方のテープリールに巻き取っておく巻取制御手段を備えていることを特徴とするものであり、又、請求項8記載の装置の発明は、上記一対のテープリール間における研磨テープの行き移送又は戻り移送時において、上記研磨テープにバックテンションを付与するバックテンション機構を設けてなることを特徴とするものである。   According to a sixth aspect of the present invention, there is provided an apparatus according to a sixth aspect of the present invention, further comprising a tape vibration mechanism that causes the abrasive tape to vibrate in a direction intersecting the transfer direction of the abrasive tape. According to the seventh aspect of the present invention, before the polishing surface of the workpiece is polished by the control means, a length of polishing tape necessary for polishing the lower surface is previously wound around the other tape reel. The invention according to claim 8 is characterized in that the apparatus according to claim 8 is characterized in that the polishing tape is transferred between the pair of tape reels in the forward transfer or the return transfer. A back tension mechanism for applying a back tension to the polishing tape is provided.

本発明は上述の如く、請求項1又は5記載の発明にあっては、被研磨面の内、登り面の研磨においては、被加工物を被加工物の回転に連れて次第に圧接ロールを圧接力に抗して押し戻す方向となる正方向に回転させると共に研磨テープを被加工物の回転方向に対して反対向きに行き移送させ、被加工物の正方向の所定回数の回転及び研磨テープの行き移送により登り面を圧接研磨し、下り面の研磨においては、被加工物を被加工物の回転に連れて次第に圧接ロールを圧接力に抗して押し戻す方向となる逆方向に回転させると共に研磨テープを被加工物の回転方向に対して反対向きに戻り移送させ、被加工物の逆方向の所定回数の回転及び研磨テープの戻り移送により下り面を圧接研磨することができ、従って、上記登り面及び下り面のいずれの被研磨面も良好に研磨することができる。   As described above, according to the present invention, in the invention according to claim 1 or 5, in polishing the climbing surface of the surface to be polished, the pressure contact roll is gradually pressed against the workpiece as the workpiece is rotated. Rotate the abrasive tape in the positive direction, which pushes it back against the force, and moves the abrasive tape in the direction opposite to the direction of rotation of the workpiece. Ascending surface is pressure contact polished by transfer, and in descending surface polishing, the work piece is gradually rotated in the reverse direction, which is the direction of pushing back the pressure roll against the pressure force as the work piece rotates. Can be returned and transferred in a direction opposite to the rotation direction of the workpiece, and the descending surface can be pressure-polished by rotating the workpiece a predetermined number of times in the reverse direction and returning the polishing tape. Either Polished surface can be polished satisfactorily.

又、請求項2又は6記載の発明にあっては、上記研磨テープを研磨テープの移送方向に対して交差する方向に揺振運動させるテープ揺振機構を備えてなるから、被加工物の研磨を一層良好に行うことができ、又、請求項3又は7記載の発明にあっては、上記制御手段には上記被加工物の下り面を研磨する前に予め下り面の研磨に必要な長さ分の研磨テープを他方のテープリールに巻き取っておく巻取制御手段を備えているから、下り面を研磨テープの未使用部分で研磨することができ、それだけ、良好な研磨加工を行うことができ、又、請求項4又は8記載の発明にあっては、上記一対のテープリール間における研磨テープの行き移送又は戻り移送時において、上記研磨テープにバックテンションを付与するバックテンション機構を設けてなるから、研磨テープを弛み無く円滑に行き移送又は戻り移送させることができる。   The invention according to claim 2 or 6 further comprises a tape vibration mechanism for oscillating the polishing tape in a direction intersecting the transfer direction of the polishing tape. In the invention according to claim 3 or 7, the control means includes a length required for polishing the down surface in advance before polishing the down surface of the workpiece. Since it has winding control means that winds up a certain amount of polishing tape on the other tape reel, the down surface can be polished with the unused part of the polishing tape, so that good polishing processing is performed In the invention according to claim 4 or 8, there is provided a back tension mechanism for applying a back tension to the polishing tape at the time of transfer or return transfer of the polishing tape between the pair of tape reels. Tena From, it is possible to transfer or return transport to go smoothly without loosening the polishing tape.

本発明の実施の形態例の全体平面図である。1 is an overall plan view of an embodiment of the present invention. 本発明の実施の形態例の部分平面図である。It is a fragmentary top view of the example of an embodiment of the invention. 本発明の実施の形態例の部分側断面図である。It is a fragmentary sectional side view of the example of an embodiment of the invention. 本発明の実施の形態例の登り面研磨の説明側面図である。It is a description side view of the climbing surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の登り面研磨の説明側面図である。It is a description side view of the climbing surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の登り面研磨の説明側面図である。It is a description side view of the climbing surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の登り面研磨の説明側面図である。It is a description side view of the climbing surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の登り面研磨の説明側面図である。It is a description side view of the climbing surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の下り面研磨の説明側面図である。It is a description side view of the downward surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の下り面研磨の説明側面図である。It is a description side view of the downward surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の下り面研磨の説明側面図である。It is a description side view of the downward surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の下り面研磨の説明側面図である。It is a description side view of the downward surface grinding | polishing of the embodiment of this invention. 本発明の実施の形態例の下り面研磨の説明側面図である。It is a description side view of the downward surface grinding | polishing of the embodiment of this invention.

図1乃至図13は本発明を三角板カムのカム面研磨に適用した実施の形態例であって、即ち、被加工物Wの被研磨面W1が被加工物Wの回転に連れて回転半径が漸増する登り面W11及び漸減する下り面W12を三個宛有する被加工物となっており、この場合、大別して、被加工物を保持して正方向又は逆方向に回転させる保持回転機構Aと、未使用の研磨テープを巻回した一方のテープリール1及びこのテープリール1から解かれた未使用の研磨テープTを巻き取る他方のテープリール1からなる一対のテープリール1・1間に移送自在に掛け渡された研磨テープTの研磨面T1を被加工物Wの被研磨面W1に圧接させる圧接機構Bと、研磨テープTを一方のテープリール1から他方のテープリール1へと行き移送Mさせると共に他方のテープリール1から一方のテープリール1へと戻り移送Nさせるテープ移送機構Cと、被研磨面W1の内、上記登り面W11の研磨においては、図4乃至図8の如く、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる正方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに行き移送Mさせ、又、被研磨面W1の内、下り面W12の研磨においては、図9乃至図13の如く、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる逆方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに戻り移送Nさせる制御手段Dとを備えている。 1 to 13 show an embodiment in which the present invention is applied to cam surface polishing of a triangular plate cam. That is, the surface to be polished W 1 of the workpiece W has a turning radius as the workpiece W rotates. There is a workpiece having addressed three downlink surface W 12 to climb surfaces W 11 and decreasing gradually increased, in this case, roughly, holding and rotating the rotating in a forward or reverse direction while holding the workpiece A pair of tape reels 1 and 1 comprising a mechanism A, one tape reel 1 around which an unused polishing tape is wound, and the other tape reel 1 around which the unused polishing tape T unwound from the tape reel 1 is wound up. A pressure-contact mechanism B that presses the polishing surface T 1 of the polishing tape T that is movably transferred between the tape W 1 and the polishing surface W 1 of the workpiece W, and the polishing tape T from one tape reel 1 to the other tape reel. Go to 1 and move to M and the other tape A tape transport mechanism C for transferring N returns to Le 1 to one of the tape reel 1, of the polished surface W 1, in the polishing of the climbing surface W 11, as shown in FIGS. 4-8, the workpiece W As the workpiece W rotates, the pressure roll 22 is gradually rotated in the forward direction K, which is pushed back against the pressure force, and the polishing tape T is moved in the opposite direction to the rotation direction of the workpiece W. is transported M, also among the polished surface W 1, the polishing of the downlink surface W 12 is as shown in FIG. 9 to FIG. 13, gradually pressing roll 22 brought workpiece W to the rotation of the workpiece W And a control means D for rotating the polishing tape T in the opposite direction to the rotation direction of the workpiece W and for transporting the polishing tape T in the opposite direction to the direction K of pushing back against the pressing force.

さらに、この場合、上記研磨テープTを研磨テープTの移送方向に対して交差する方向に揺振運動Sさせるテープ揺振機構Eと、上記制御手段Dに設けられて上記被加工物の下り面を研磨する前に予め該下り面の研磨に必要な長さ分の研磨テープを他方のテープリールに巻き取っておく巻取制御手段Fと、上記一対のテープリール1・1間における研磨テープTの行き移送M又は戻り移送N時において、研磨テープTにバックテンションを付与するバックテンション機構Gとを備えている。   Furthermore, in this case, a tape vibration mechanism E that causes the polishing tape T to vibrate S in a direction that intersects the transfer direction of the polishing tape T, and the down surface of the workpiece provided in the control means D. Winding control means F for winding a polishing tape of a length necessary for polishing the downward surface onto the other tape reel before polishing, and a polishing tape T between the pair of tape reels 1 and 1 A back tension mechanism G for applying a back tension to the polishing tape T at the time of forward transfer M or return transfer N is provided.

このうち、上記保持回転機構Aは、回転軸2を被加工物Wとしての三角板カムの軸穴に装着し、図外の正逆回転用モータからなる回転機構により回転軸2を正逆回転させて被加工物Wを矢印方向に正逆回転Rさせるように構成している。   Of these, the holding and rotating mechanism A has the rotating shaft 2 mounted in the shaft hole of the triangular plate cam as the workpiece W, and rotates the rotating shaft 2 forward and backward by a rotating mechanism comprising a motor for forward and reverse rotation (not shown). Thus, the workpiece W is configured to rotate forward and backward R in the direction of the arrow.

又、上記圧接機構B及び上記テープ移送機構Cは、図1の如く、機台3に一対のテープリール1・1を支持軸4・4により配設し、一方のテープリール1に巻回された未使用の研磨テープTを他方のテープリール1に巻き取ってテープリール1・1間に研磨テープTを移送自在に掛け渡し、機台3に一対の巻取軸5・5を一対のテープリール1・1毎に配設し、一対の巻取軸5・5と一対のテープリール1・1との間に伝達ベルト6・6を掛回し、一対の巻取軸5・5にそれぞれ送りロール7・7を取り付け、機台3に押圧レバー8・8を支点軸8cにより揺動自在に配設し、押圧レバー8・8の一方端部に押圧ロール8a・8aを送りロール7・7に対向して設け、押圧レバー8・8の他方端部をバネ8b・8bにより押圧して押圧ロール8a・8aを送りロール7・7に研磨テープTを介して押圧してなり、一方のテープリール1から解かれた未使用の研磨テープTを迂回ロール9、送りロール7と押圧ロール8aとの間、迂回ロール10から圧接機構Bを経て、案内ロール11・12、送りロール7と押圧ロール8aとの間、迂回ロール13より他方のテープリール1に掛回し、上記一対の巻取軸5・5毎に図示省略の巻取用モータをそれぞれ連結し、この巻取用モータに研磨テープTを行き移送M又は戻り移送Nさせる制御手段Dを接続して構成している。   Further, as shown in FIG. 1, the pressure contact mechanism B and the tape transport mechanism C have a pair of tape reels 1, 1 disposed on a machine base 3 by support shafts 4, 4 and are wound around one tape reel 1. In addition, the unused polishing tape T is wound around the other tape reel 1 and the polishing tape T is transferred between the tape reels 1 and 1 so that the polishing tape T can be freely transferred. It is arranged for each reel 1, 1, a transmission belt 6, 6 is wound between a pair of winding shafts 5, 5 and a pair of tape reels 1, 1, and sent to a pair of winding shafts 5, 5, respectively. The rolls 7 and 7 are attached, the press levers 8 and 8 are swingably disposed on the machine base 3 by the fulcrum shaft 8c, and the press rolls 8a and 8a are fed to one end of the press levers 8 and 8 and the feed rolls 7 and 7 are placed. The other end of the pressing lever 8 or 8 is pressed by a spring 8b or 8b and pressed by a pressing roll. a · 8a is pressed against the feed rolls 7 and 7 via the polishing tape T, and the unused polishing tape T unwound from one of the tape reels 1 is passed between the bypass roll 9, the feed roll 7 and the press roll 8a. In the meantime, from the detour roll 10 through the pressure contact mechanism B, between the guide rolls 11 and 12, the feed roll 7 and the pressing roll 8a, the detour roll 13 is wound around the other tape reel 1, and the pair of winding shafts 5 and A winding motor (not shown) is connected every 5 and a control means D for moving the polishing tape T to the transfer M or the return transfer N is connected to the winding motor.

この場合、上記研磨テープTは、ポリエステルフィルム、メタル、クロス等の基材に酸化アルミニュウム、酸化クロム、シリコンカーバイド、ダイヤモンド等の所定粒度の研磨粒子をコーティング又は結合してなる構造となっている。   In this case, the polishing tape T has a structure in which a base material such as a polyester film, metal, cloth, or the like is coated or bonded with a predetermined particle size of abrasive particles such as aluminum oxide, chromium oxide, silicon carbide, and diamond.

この場合、上記圧接機構B及びテープ揺振機構Eは、図2、図3の如く、機台3に圧接機体14を取付け、圧接機体14に一対の摺動部15・15により取付アーム16を研磨テープTの移送方向に対して交差する方向に揺振運動自在に設け、圧接機体14に偏心軸17及び揺振用モータ18を取付け、偏心軸17と揺振用モータ18の主軸とを継手で連結すると共に偏心軸17にカムフォロワー19を取付け、取付アーム16にカムフォロワー19が嵌合する溝状の嵌合部16aを形成し、取付アーム16に一対のガイドロール20・20を配設し、取付アーム16に一対のシリンダ部21・21を配設し、一対のシリンダ部21・21のプランジャ21a・21a間に取付片21bを架設すると共に取付アーム16と取付片21bとの間に一対のガイド軸21c・21cを摺動自在に架設し、取付片21bに圧接ロール22のロール軸22aを上記一対のガイドロール20・20の中間位置にして取り付けて構成している。   In this case, as shown in FIG. 2 and FIG. 3, the pressure contact mechanism B and the tape vibration mechanism E attach the pressure contact machine body 14 to the machine base 3, and attach the mounting arm 16 to the pressure contact machine body 14 by a pair of sliding portions 15 and 15. An oscillating motion is provided in a direction intersecting the transfer direction of the polishing tape T, and an eccentric shaft 17 and an oscillating motor 18 are attached to the pressure welding machine body 14, and the eccentric shaft 17 and the main shaft of the oscillating motor 18 are jointed. And a cam follower 19 is attached to the eccentric shaft 17, a groove-like fitting portion 16 a for fitting the cam follower 19 is formed on the mounting arm 16, and a pair of guide rolls 20, 20 are disposed on the mounting arm 16. Then, a pair of cylinder portions 21 and 21 are disposed on the mounting arm 16, and a mounting piece 21b is installed between the plungers 21a and 21a of the pair of cylinder portions 21 and 21, and between the mounting arm 16 and the mounting piece 21b. Bridged pair of guide shafts 21c, 21c slidably, a roll shaft 22a of the pressure roll 22 is constituted by attaching to the intermediate position of the pair of guide rolls 20, 20 to the mounting piece 21b.

又、上記制御手段Dは、パソコンなどの制御回路が組み込まれ、上記図示省略の巻取用モータ及び上記保持回転機構Aの正逆回転用モータに接続され、上記登り面W11の研磨においては、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる正方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに行き移送Mさせたり、又、被研磨面W1の内、下り面W12の研磨においては、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる逆方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに戻り移送Nさせたりする構成のプログラムが組み込まれている。 The control means D incorporates a control circuit such as a personal computer, and is connected to the winding motor (not shown) and the forward / reverse rotating motor of the holding and rotating mechanism A. In polishing the climbing surface W 11 As the workpiece W rotates, the workpiece W is gradually rotated in the positive direction K, which pushes the pressing roll 22 against the pressing force, and the polishing tape T is rotated with respect to the rotation direction of the workpiece W. or is transported M go to opposite Te, also of the polished surface W 1, the polishing of the downlink surface W 12 is pressure contact force progressively pressing roll 22 brought workpiece W to the rotation of the workpiece W A program having a configuration for rotating the polishing tape T in the opposite direction to the direction of rotation of the workpiece W and for transferring the polishing tape T in the opposite direction to the pushing direction K against the rotation is incorporated.

又、上記巻取制御手段Fは、この場合、上記制御手段Dに上記被加工物Wの下り面W12を研磨する前に予め次に加工する下り面W12の研磨に必要な長さ分の研磨テープTを他方のテープリール1に連結された上記巻取用モータの巻取回転により巻き取っておく構成のプログラムが上記制御手段Dに組み込まれて構成されている。 Further, the take-up control unit F, in this case, the length component required for polishing down surface W 12 in advance and then processed prior to polishing the downstream surface W 12 of the workpiece W to the control unit D The control means D is configured to incorporate a program for winding the polishing tape T by winding rotation of the winding motor connected to the other tape reel 1.

又、上記バックテンション機構Gは、この場合、上記一対のテープリール1・1を巻取回転させる図示省略の各巻取用モータの正回転又は逆回転、若しくは、他の回転駆動手段により研磨テープTの行き移送M又は戻り移送N時において、研磨テープTに巻き解き方向と反対方向にバックテンションを付与する構造となっている。   Further, in this case, the back tension mechanism G is configured such that each of the winding motors (not shown) that winds and rotates the pair of tape reels 1 and 1 is rotated forward or backward, or other rotational drive means is used to polish the polishing tape T. At the time of forward transfer M or return transfer N, a back tension is applied to the polishing tape T in the direction opposite to the unwinding direction.

すなわち、図4乃至図13において、被加工物Wの回転軸線O、上記圧接ロール22の回転軸線P、回転軸線Oと回転軸線Pとを結ぶ共通軸線Qとし、被研磨面W1の内、上記登り面W11の研磨においては、図4乃至図8の如く、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる正方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに行き移送Mさせ、このとき、図7の如く、被加工物Wの回転に連れて下り面W12にも該圧接ロール22が圧接力により押し前進Hしつつ研磨テープTが線接触することになるが実質的な研磨は行われず、この被加工物Wの正方向の所定回数の回転及び研磨テープの行き移送Mによりこの場合3個の登り面W11を圧接研磨し、次いで、下り面W12の研磨においては、図9乃至図13の如く、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる逆方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに戻り移送Nさせ、このとき、同じく、図10の如く、被加工物Wの回転に連れて上り面W11にも該圧接ロール22が圧接力により押し前進Hしつつ研磨テープTが線接触することになるが実質的な研磨は行われず、この被加工物Wの逆方向の所定回数の回転及び研磨テープの戻り移送Mにより、この場合3個の下り面W12を圧接研磨することになる。 That is, in FIGS. 4 to 13, the rotation axis O of the workpiece W, the rotation axis P of the pressure contact roll 22, the common axis Q connecting the rotation axis O and the rotation axis P, and the polished surface W 1 , In the polishing of the climbing surface W 11 , as shown in FIGS. 4 to 8, as the workpiece W rotates, the press roll 22 is gradually pushed back against the press force as the workpiece W rotates. is transported M go opposite the abrasive tape T is rotated with respect to the direction of rotation of the workpiece W in this time, as shown in FIG. 7, the even downstream surface W 12 as the rotation of the workpiece W The polishing tape T is linearly contacted while the pressing roll 22 is pushed forward by the pressing force, but the polishing tape T does not perform substantial polishing. The workpiece W is rotated a predetermined number of times in the forward direction and transferred to the polishing tape. three climbing surface W 11 in this case pressed against the polishing by M, the following In a polishing downlink surface W 12 is as shown in FIG. 9 to FIG. 13, opposite to the direction K to push back against the workpiece W to gradually contact force the press roll 22 with the rotation of the workpiece W the abrasive tape T is rotated in a direction to transfer N back in the opposite direction to the rotational direction of the workpiece W, at this time, also, as shown in FIG. 10, the workpiece W up surface W 11 brought by the rotation of the In addition, the pressing tape 22 is pushed forward by the pressing force, and the polishing tape T comes into line contact while being pressed forward. However, substantial polishing is not performed, and the workpiece W is rotated a predetermined number of times in the reverse direction and the polishing tape. In this case, the three downward surfaces W 12 are pressure-polished by the return transfer M.

この実施の形態例は上記構成であるから、被研磨面W1の内、上記登り面W11の研磨においては、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる正方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに行き移送Mさせ、この被加工物Wの正方向の所定回数の回転及び研磨テープの行き移送Mにより登り面W11を圧接研磨し、次いで、下り面W12の研磨においては、被加工物Wを被加工物Wの回転に連れて次第に圧接ロール22を圧接力に抗して押し戻す方向Kとなる逆方向に回転させると共に研磨テープTを被加工物Wの回転方向に対して反対向きに戻り移送Nさせ、この被加工物Wの逆方向の所定回数の回転及び研磨テープの戻り移送Mにより下り面W12を圧接研磨することができ、従って、上記登り面W11及び下り面W12のいずれの被研磨面W1も良好に研磨することができる。 Since this embodiment has the above-described configuration, in the polishing of the climbing surface W 11 out of the surface to be polished W 1 , the workpiece W is gradually brought into pressure contact with the rotation of the workpiece W. The polishing tape T is rotated in the positive direction, which is the direction K to be pushed back against the force, and the polishing tape T is moved in the opposite direction to the rotation direction of the workpiece W to be transferred M, and the workpiece W is rotated a predetermined number of times in the positive direction. rotation and climbing surface W 11 by going transport M of the polishing tape is pressed against the polishing, then the polishing of the downlink surface W 12 is pressure contact force progressively pressing roll 22 brought workpiece W to the rotation of the workpiece W The polishing tape T is rotated in the opposite direction to the direction K to be pushed back against the rotation, and the polishing tape T is transferred N in the opposite direction to the rotation direction of the workpiece W, and the workpiece W is rotated a predetermined number of times in the opposite direction. and downstream surface W 12 by the polishing tape return transport M It can be pressed against the polishing, therefore, one of the polished surface W 1 of the climbing surface W 11 and downstream surface W 12 can also be polished well.

この場合、上記研磨テープTを研磨テープTの移送方向に対して交差する方向に揺振運動Sさせるテープ揺振機構Eを備えてなるから、被加工物Wの研磨を一層良好に行うことができ、又、この場合、上記制御手段Dには上記被加工物Wの下り面W12を研磨する前に予め下り面12の研磨に必要な長さ分の研磨テープTを他方のテープリール1に巻き取っておく巻取制御手段Fを備えているから、下り面W12を研磨テープTの未使用部分で研磨することができ、それだけ、良好な研磨加工を行うことができ、又、この場合、上記一対のテープリール間における研磨テープTの行き移送M又は戻り移送N時において、上記研磨テープTにバックテンションを付与するバックテンション機構Gを設けてなるから、研磨テープTを弛み無く円滑に行き移送M又は戻り移送Nさせることができる。 In this case, since the polishing tape T is provided with a tape vibration mechanism E that swings the polishing tape T in a direction intersecting the transfer direction of the polishing tape T, the workpiece W can be polished more satisfactorily. Further, in this case, the control means D is supplied with the polishing tape T of a length necessary for polishing the lower surface 12 in advance before the lower surface W 12 of the workpiece W is polished. Since the winding control means F is wound around the lower surface W 12 , the lower surface W 12 can be polished by an unused portion of the polishing tape T, and a good polishing process can be performed accordingly. In this case, a back tension mechanism G for applying a back tension to the polishing tape T is provided at the time of forward transfer M or return transfer N of the polishing tape T between the pair of tape reels. Going to It can be fed M or return transport N.

尚、本発明は上記実施の形態例に限られるものではなく、保持回転機構A、圧接機構B、テープ移送機構C、テープ揺振機構E、バックテンション機構Gの構造や制御手段D、巻取制御手段Fの回路構成等は適宜変更して設計される。   It should be noted that the present invention is not limited to the above embodiment, and the structure and control means D of the holding and rotating mechanism A, the pressure contact mechanism B, the tape transfer mechanism C, the tape vibration mechanism E, the back tension mechanism G, the winding The circuit configuration and the like of the control means F are designed with appropriate changes.

又、例えば、上記実施の形態例においては、乾式研磨構造となっているが、板状部材Wと研磨テープTとの間に各種材質の遊離砥粒や化学剤を含む加工液体や潤滑剤を供給する所謂湿式研磨構造とすることもあり、被加工物Wの種類や研磨条件により選択して設計される。   Further, for example, in the above-described embodiment, a dry polishing structure is used, but a processing liquid or a lubricant containing free abrasive grains or chemical agents of various materials is provided between the plate-like member W and the polishing tape T. There may be a so-called wet polishing structure to be supplied, which is selected and designed according to the type of workpiece W and polishing conditions.

以上、所期の目的を充分達成することができる。   As described above, the intended purpose can be sufficiently achieved.

W 被加工物
1 被研磨面
11 登り面
12 下り面
T 研磨テープ
1 研磨面
A 保持回転機構
B 圧接機構
K 押し戻す方向
M 行き移送
N 戻り移送
C テープ移送機構
D 制御手段
E テープ揺振機構
F 巻取制御手段
G バックテンション機構
1 テープリール
W Workpiece W 1 Surface to be polished W 11 Climbing surface W 12 Down surface T Polishing tape T 1 Polishing surface A Holding and rotating mechanism B Pressing mechanism K Pushing direction M Forward transfer N Return transfer C Tape transfer mechanism D Control means E Tape swing Vibration mechanism F Winding control means G Back tension mechanism 1 Tape reel

Claims (8)

未使用の研磨テープを巻回した一方のテープリール及び該テープリールから解かれた未使用の研磨テープを巻き取る他方のテープリールからなる一対のテープリール間に該研磨テープを移送自在に掛け渡し、回転する被加工物の被研磨面に該研磨テープを圧接ロールにより圧接して研磨するに際し、上記被加工物の被研磨面は被加工物の回転に連れて回転半径が漸増する登り面及び漸減する下り面からなり、該被研磨面の内、該登り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる正方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに行き移送させ、該被研磨面の内、該下り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる逆方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに戻り移送させることを特徴とする研磨方法。   The polishing tape is transferred between a pair of tape reels including one tape reel wound with an unused polishing tape and the other tape reel winding up the unused polishing tape unwound from the tape reel. The polishing surface of the workpiece to be polished is pressed against the polishing surface of the rotating workpiece by a pressure roll, and the polishing surface of the workpiece has an ascending surface whose rotation radius gradually increases as the workpiece rotates. It consists of a descending surface that gradually decreases, and in the polishing of the rising surface of the surface to be polished, the workpiece is gradually pushed back against the pressing force as the workpiece rotates. The polishing tape is rotated in the forward direction and transferred in the direction opposite to the rotation direction of the workpiece, and in the polishing of the down surface of the polished surface, the workpiece is moved to the workpiece. Gradually with the rotation Polishing method for causing transferred back in the opposite direction of the polishing tape against the rotating direction of the workpiece is rotated in the opposite direction as the direction to push back the contact roll against the pressing force. 上記研磨テープを研磨テープの移送方向に対して交差する方向に揺振運動させることを特徴とする請求項1記載の研磨方法。   2. The polishing method according to claim 1, wherein the polishing tape is oscillated in a direction intersecting with a transfer direction of the polishing tape. 上記被加工物の下り面を研磨するに際し、予め、該下り面の研磨に必要な長さ分の上記研磨テープを他方のテープリールに巻き取っておくことを特徴とする請求項1又は2記載の研磨方法。   3. The polishing tape according to claim 1, wherein the polishing tape is wound up on the other tape reel in advance when polishing the down surface of the workpiece. Polishing method. 上記一対のテープリール間における研磨テープの行き移送又は戻り移送時において、上記研磨テープにバックテンションを付与することを特徴とする請求項1〜3のいずれか1項に記載の研磨方法。   The polishing method according to any one of claims 1 to 3, wherein a back tension is applied to the polishing tape when the polishing tape is transferred or returned between the pair of tape reels. 被加工物の被研磨面が被加工物の回転に連れて回転半径が漸増する登り面及び漸減する下り面からなる被加工物を保持して正方向又は逆方向に回転させる保持回転機構と、未使用の研磨テープを巻回した一方のテープリール及び該テープリールから解かれた未使用の研磨テープを巻き取る他方のテープリールからなる一対のテープリール間に移送自在に掛け渡された研磨テープの研磨面を被加工物の被研磨面に圧接させる圧接機構と、該研磨テープを一方のテープリールから他方のテープリールへと行き移送させると共に他方のテープリールから一方のテープリールへと戻り移送させるテープ移送機構と、該被研磨面の内、該登り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる正方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに行き移送させ、該被研磨面の内、該下り面の研磨においては、該被加工物を被加工物の回転に連れて次第に該圧接ロールを圧接力に抗して押し戻す方向となる逆方向に回転させると共に該研磨テープを被加工物の回転方向に対して反対向きに戻り移送させる制御手段とを備えてなることを特徴とする研磨装置。   A holding and rotating mechanism for holding a work piece consisting of an ascending surface whose rotation radius gradually increases as the work piece rotates and a descending surface where the work surface rotates gradually in a forward direction or a reverse direction; An abrasive tape that is movably stretched between a pair of tape reels, each of which is composed of one tape reel wound with an unused abrasive tape and the other tape reel that winds an unused abrasive tape unwound from the tape reel. A pressure contact mechanism that presses the polishing surface of the workpiece against the polishing surface of the workpiece, and transfers the polishing tape from one tape reel to the other tape reel and from the other tape reel to the other tape reel. In the polishing of the tape transfer mechanism and the surface to be polished, the direction in which the workpiece is gradually pushed back against the pressing force as the workpiece rotates. And rotating the polishing tape in a direction opposite to the rotation direction of the work piece, and transferring the work piece in the polishing of the down surface of the work surface. And a control means for rotating the pressure contact roll in a reverse direction, which is a direction to push back against the pressure force, and returning the polishing tape in the direction opposite to the rotation direction of the workpiece. A polishing apparatus characterized by comprising: 上記研磨テープを研磨テープの移送方向に対して交差する方向に揺振運動させるテープ揺振機構を備えてなることを特徴とする請求項5記載の研磨装置。   6. The polishing apparatus according to claim 5, further comprising a tape vibration mechanism that swings the polishing tape in a direction that intersects a direction in which the polishing tape is transferred. 上記制御手段に上記被加工物の下り面を研磨する前に予め該下り面の研磨に必要な長さ分の研磨テープを他方のテープリールに巻き取っておく巻取制御手段を備えていることを特徴とする請求項5又は6記載の研磨装置。   The control means is provided with a winding control means for winding a polishing tape of a length necessary for polishing the down surface in advance on the other tape reel before polishing the down surface of the workpiece. The polishing apparatus according to claim 5 or 6. 上記一対のテープリール間における研磨テープの行き移送又は戻り移送時において、上記研磨テープにバックテンションを付与するバックテンション機構を設けてなることを特徴とする請求項5〜7のいずれか1項に記載の研磨装置。
8. The back tension mechanism for applying a back tension to the polishing tape at the time of transfer or return transfer of the polishing tape between the pair of tape reels. The polishing apparatus as described.
JP2009196495A 2009-08-27 2009-08-27 Polishing method and apparatus Active JP5379607B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009196495A JP5379607B2 (en) 2009-08-27 2009-08-27 Polishing method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009196495A JP5379607B2 (en) 2009-08-27 2009-08-27 Polishing method and apparatus

Publications (2)

Publication Number Publication Date
JP2011045957A true JP2011045957A (en) 2011-03-10
JP5379607B2 JP5379607B2 (en) 2013-12-25

Family

ID=43832792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009196495A Active JP5379607B2 (en) 2009-08-27 2009-08-27 Polishing method and apparatus

Country Status (1)

Country Link
JP (1) JP5379607B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094867A (en) * 2011-10-31 2013-05-20 Sanshin Co Ltd Tape polishing device
CN106514465A (en) * 2016-12-30 2017-03-22 天津石泰集团有限公司 T-shaped ring edge belt sander
KR20170084704A (en) 2016-01-12 2017-07-20 나카무라 토메 세이미쓰고교 가부시키가이샤 Grinding·polishing combined apparatus, and polishing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119824A (en) * 2006-11-09 2008-05-29 Thielenhaus Technologies Gmbh Finishing method by belt of workpiece outer periphery

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119824A (en) * 2006-11-09 2008-05-29 Thielenhaus Technologies Gmbh Finishing method by belt of workpiece outer periphery

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094867A (en) * 2011-10-31 2013-05-20 Sanshin Co Ltd Tape polishing device
KR20170084704A (en) 2016-01-12 2017-07-20 나카무라 토메 세이미쓰고교 가부시키가이샤 Grinding·polishing combined apparatus, and polishing apparatus
CN106514465A (en) * 2016-12-30 2017-03-22 天津石泰集团有限公司 T-shaped ring edge belt sander

Also Published As

Publication number Publication date
JP5379607B2 (en) 2013-12-25

Similar Documents

Publication Publication Date Title
TW458851B (en) System for chemical mechanical planarization
JP6408526B2 (en) Ball screw polishing method and apparatus
US9162300B2 (en) Method for polishing ball screw and ball screw polishing apparatus
KR20140099191A (en) Method of polishing back surface of substrate and substrate processing apparatus
JP5678382B2 (en) Tape polishing equipment
JP5379607B2 (en) Polishing method and apparatus
US6557608B2 (en) Method for attaching web based polishing materials together on a polishing tool
TW200905741A (en) Methods and apparatus for polishing a notch of a substrate by substrate vibration
US8814635B2 (en) Substrate polishing method and device
JP2857816B2 (en) Wafer edge polishing machine
JP7284852B2 (en) polishing unit
JP2023073493A (en) Plate-like member polishing method and apparatus for the same
US5951384A (en) Polishing apparatus which causes a polishing tape to advance and rotate
JP6518206B2 (en) Inner surface polishing machine
JP5364683B2 (en) Strip plate polishing machine
CN114178949B (en) Grinding robot device
JP2005066783A (en) Method and device for polishing plate-like member
JP3966030B2 (en) Plate member polishing equipment
JP3764979B2 (en) Polishing method and apparatus
JP5360726B2 (en) Plate member polishing equipment
CN109834346B (en) Ball screw grinding method and device
JP2016074058A (en) Ball screw polishing method and device thereof
JP7066805B1 (en) Polishing unit
JP2014018921A (en) Tape polishing apparatus
JP7351871B2 (en) polishing equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111104

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130528

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130725

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130927

R150 Certificate of patent or registration of utility model

Ref document number: 5379607

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250