JP2002346484A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can remove electric charge on the underside of a glass substrate supported by a supporting member made of a chemical resistant resin so that it can prevent discharge brakedown from occurring. SOLUTION: When switching valves 83b and 83c are opened, carbon dioxide is dissolved into a deionized water and a carbon acid dissolution washing liquid is prepared. And, this carbon acid dissolution washing liquid is transferred to a liquid nozzle 16 through a pipe 80, and it is supplied toward the downside center part of a substrate W from a nozzle hole 162 of a liquid nozzle 16. Thus, the downside of the substrate W is washed, and at the same time, the carbon acid dissolution washing liquid absorbs the electric charge on the downside of the substrate and remove it.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing for cleaning a glass substrate by supplying a cleaning liquid to the glass substrate such as a glass substrate for a photomask, a glass substrate for a liquid crystal display, and a glass substrate for a plasma display. It concerns the device.

[0002]

2. Description of the Related Art Conventionally, as this type of substrate processing apparatus, there is an apparatus for sequentially performing a cleaning process and a drying process on a glass substrate while rotating the glass substrate in a horizontal plane. In this substrate processing apparatus, substrate supporting means for holding a glass substrate in a horizontal posture by a supporting member is provided, and the substrate supporting means is supported by the substrate supporting means by rotating the substrate supporting means by a driving means such as a motor. The glass substrate is rotationally driven in a horizontal plane. Further, a nozzle for discharging a cleaning liquid such as pure water is provided facing the glass substrate supported by the substrate supporting means. In the cleaning process, the glass substrate is cleaned by the cleaning liquid supplied to the glass substrate while rotating the glass substrate in a horizontal plane. Further, after the cleaning process, the cleaning liquid on the glass substrate is shaken off by rotating the glass substrate in a horizontal plane to dry the substrate.

[0003]

By the way, before performing a cleaning process on a glass substrate, a chemical process is often performed on the glass substrate. Conventionally, the chemical process is performed on the substrate process. This is performed in another substrate processing apparatus different from the apparatus. However, in recent years, there has been an increasing demand for performing chemical solution processing, cleaning processing, and drying processing in the same apparatus in order to increase the efficiency of substrate processing and increase the functionality of the substrate processing apparatus.

Here, in order to satisfy such a demand, a supporting member of the substrate supporting means is made of, for example, polytetrafluoroethylene resin (PTFE), ethylene tetrafluoride-ethylene copolymer resin (ETFE), polypropylene resin, or trifluoroethylene resin. Ethylene chloride resin (PCTFE), viridene fluoride resin (PVDF), polyvinyl chloride resin (PVC),
It is necessary to use a chemical resistant resin such as a polyether-ether ketone resin (PEEK). In this case, the following problems are expected to occur.

In the above-mentioned substrate processing apparatus, the cleaning process is performed while rotating the glass substrate supported by the substrate supporting means. Therefore, the charging of the glass substrate in the cleaning process is inevitable. As a result, discharge breakdown or the like occurs, and a fusing failure or the like occurs in the fine circuit on the glass substrate, which causes a decrease in yield. In view of the above, a number of techniques for removing electric charges charged on a glass substrate have been proposed. Particularly, in order to remove electric charges charged on the lower surface side of the glass substrate, a support member for supporting the lower surface of the glass substrate is conventionally made of a conductive material. As a result, the electric charge on the lower surface side is removed from the glass substrate via the conductive support member, and the electric charge on the lower surface side has been removed.

However, when performing a chemical treatment, a cleaning treatment, and a drying treatment in the same apparatus, the glass substrate is supported by the insulating member made of an insulative and chemically resistant resin as described above. Technology cannot be applied as it is. As described above, in performing the chemical solution treatment, the cleaning treatment, and the drying treatment in the same apparatus, how to remove the electric charge from the lower surface of the glass substrate supported by the chemical-resistant resin support member is a major problem. It is becoming.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and effectively removes electric charges on the lower surface of a glass substrate supported by a support member made of a chemical-resistant resin to prevent discharge breakdown of the glass substrate. It is an object of the present invention to provide a substrate processing apparatus capable of preventing such a problem.

[0008]

In order to achieve the above-mentioned object, the present invention provides a substrate supporting means for supporting a lower surface of a glass substrate with a supporting member made of a chemical resistant resin, and supporting the lower surface of the glass substrate with the supporting member. A cleaning solution supply unit configured to supply a carbonic acid-dissolved cleaning solution obtained by dissolving carbon dioxide in the cleaning solution to the lower surface of the glass substrate to clean the lower surface of the glass substrate.

In the substrate processing apparatus configured as described above,
A carbonic acid-dissolved cleaning solution is used to clean the lower surface of the glass substrate. This carbonic acid-dissolved cleaning liquid is obtained by dissolving carbon dioxide in a cleaning liquid such as pure water or electrolytic ion water, and the specific resistance of the cleaning liquid due to the dissolution of the carbon dioxide gas is lower than that of a simple cleaning liquid (the cleaning liquid before dissolving the carbon dioxide gas). It has dropped significantly. Then, when the lower surface of the glass substrate is cleaned with the carbonic acid-dissolved cleaning solution having the lowered specific resistance, the electric charge on the lower surface of the glass substrate is absorbed and removed from the lower surface of the glass substrate through the carbonic acid-dissolved cleaning solution. Destruction is effectively prevented.

In the above invention, the lower surface of the glass substrate is neutralized by cleaning the lower surface of the glass substrate with a carbonic acid-dissolving cleaning solution. Similarly, the upper surface of the glass substrate is also neutralized by cleaning the upper surface of the glass substrate with a carbonic acid-dissolving cleaning solution. And dielectric polarization in the glass substrate can be effectively prevented. That is, even if only the lower surface is neutralized, if a large amount of electric charge remains on the upper surface of the glass substrate, dielectric polarization occurs in the glass substrate. Thus, discharge breakdown and the like can be reliably prevented.

Further, the supply location of the carbonic acid-dissolved cleaning liquid to the lower surface of the glass substrate is not limited to one, and is arbitrary. By having a first cleaning liquid discharge nozzle hole for discharging and a second cleaning liquid discharge nozzle hole for discharging the carbonic acid-dissolved cleaning liquid toward the peripheral portion of the lower surface of the glass substrate, the carbonic acid-dissolved cleaning liquid is provided on the lower surface of the glass substrate Effectively supplied. Further, since the fresh carbonic acid-dissolved cleaning liquid is directly supplied to the peripheral edge of the lower surface of the glass substrate, the degree of cleaning of the glass substrate is improved.

[0012]

FIG. 1 is a longitudinal sectional view showing one embodiment of a substrate processing apparatus according to the present invention. This substrate processing apparatus is an LCD glass substrate W (hereinafter simply referred to as “substrate W”).
), A chemical solution treatment, a cleaning treatment, and a dry operation treatment are sequentially performed in this order. As shown in FIG. 1, the apparatus includes a substrate supporting unit 1 for holding a substrate W, a driving unit 2 for driving the substrate supporting unit 1 to rotate, and a processing space S formed above the substrate supporting unit 1 for shielding. Upper shield part 3
A lifting / lowering unit 4 for vertically moving the upper shielding unit 3; a cup unit 5 for collecting the liquid shaken off from the substrate W; and a housing 6 for accommodating each unit of each device.

The substrate supporting portion 1 includes a substrate supporting plate 11 having the same plane size as the substrate W,
1 includes a peripheral support pin 12 fixed to the upper surface of the substrate W and supporting the peripheral portion of the substrate W, and a central support pin 13 fixed to the upper surface of the substrate support plate 11 and supporting the lower surface center of the substrate W. The substrate support 1 is made of a chemical-resistant resin in consideration of performing a chemical treatment.

The peripheral support pins 12 are arranged corresponding to the four corners of the substrate W. Each peripheral support pin 12 includes a support table 121 for supporting the outer peripheral edge of the substrate W from below, and a support table 121.
And a guide rising surface 122 that abuts on the outer peripheral end surface of the substrate W supported on the substrate W to regulate the movement of the substrate W, and supports the peripheral edge of the substrate W at four points. In FIG. 1, only two peripheral support pins 12 are shown to avoid complicating the drawing. Also, the center support pin 1
Four 3 are arranged on the substrate support plate 11 corresponding to the center of the substrate W. As described above, in this embodiment, the substrate W is supported by the support pins 12 and 13 corresponding to the “support member” of the present invention in a state of being separated from the substrate support plate 11 to the upper side. The peripheral support pin 12 and the center support pin 13 constitute the “substrate support means” of the present invention.

The cylindrical shaft 21 is formed of a hollow cylindrical member, and the liquid nozzle 16 is disposed along the center thereof.
A liquid supply pipe 161 penetrates the liquid nozzle 16, and the upper end of the liquid supply pipe 161 faces the center of the lower surface of the substrate W, and the lower surface of the substrate W is formed through a nozzle hole 162 provided at the upper end. The processing liquid (chemical solution or carbonic acid dissolving cleaning liquid) can be supplied to the vicinity of the rotation center.

Further, the cylindrical shaft 21 extends toward the opening of the substrate support plate 11, and is located above the substrate support plate 11, so that the discharge port 17 is opened. Further, the gap between the cylinder shaft 21 and the liquid nozzle 16 is configured such that the pipe 86 is opened to the atmospheric pressure atmosphere via the flow rate adjusting valve 86a. Then, at the outlet 17, the liquid nozzle 1
Air from the atmospheric pressure atmosphere is discharged from the gap between the side surface of the cylinder 6 and the inner peripheral surface of the cylinder shaft 21. The tip of the liquid nozzle 16 is formed in a T-shaped cross section, and a nozzle hole 162 for the processing liquid is opened at the center of the flat upper surface.

The liquid nozzle 16 is connected to a pipe 80. The base end of this pipe 80 is branched into three,
A chemical solution supply source 81 is communicatively connected to the first branch pipe 80a, a pure water supply source 82 is communicatively connected to the second branch pipe 80b, and a carbon dioxide gas supply source 90 is connected to the third branch pipe 80c.
Are connected. Each branch pipe 80a, 80b, 8
On / off valves 83a, 83b and 83c are provided at 0c, respectively. Therefore, the on-off valves 83b and 83c are opened,
By closing the on-off valve 83a, the branch pipes 80b, 80c
The pure water and the carbon dioxide gas are mixed at the position where the two have joined, and the carbon dioxide gas dissolves in the pure water to adjust the carbonic acid-dissolved cleaning solution. It is supplied from the hole 162 toward the lower surface of the substrate W. Further, the on-off valve 83a is opened, and the on-off valve 83b is opened.
84c, the nozzle hole 162 of the liquid nozzle 16 is closed.
Can be supplied to the lower surface of the substrate W from above.

The gas supply path 163 is connected to the liquid nozzle 16.
And the lower end thereof is provided with an on-off valve 84a.
Is connected to a gas supply source 85 via a pipe 84 provided with a gas supply path, and clean air is supplied from a discharge port at the upper end of the gas supply path 163 to a space between the substrate support plate 11 and the lower surface of the substrate W. And a clean gas such as a clean inert gas (eg, nitrogen gas).

The motor 23 and the belt mechanism 22 are accommodated in a cylindrical casing 62 provided on a base member 61 as a bottom plate of the substrate processing apparatus. The casing 62 is connected to the outer peripheral surface of the cylindrical shaft 21 via the bearing 63, and is in a state of covering the cylindrical shaft 21. That is,
The periphery of the cylindrical shaft 21 immediately before the connection from the motor 23 to the substrate support plate 11 is covered with the casing 62, and the motor 23 attached to the cylindrical shaft 21 below is also covered with the cover. Thus, in this embodiment, the “drive unit” of the present invention is constituted by the motor 23 and the belt mechanism 22.

The upper shield 3 is provided with an upper rotating plate 31 so as to face the substrate support plate 11 with the substrate W interposed therebetween, and is moved up and down by a rotating plate lifting mechanism 41 of the lifting unit 4. The upper rotating plate 31 has a ring shape that covers the peripheral region of the substrate W, and has a large opening 31a in the center. A partition wall 31b is provided upright around the opening 31a in a cylindrical shape, and an auxiliary shielding mechanism 32 is provided in the partition wall 31b so as to cover the opening 31a. The supply liquid nozzle 33 is provided to be vertically movable. Then, the auxiliary shield mechanism 32 and the liquid nozzle 33 are vertically moved independently by the auxiliary shield lift mechanism 42 of the lift unit 4. For this reason, the upper rotating plate 31 is lowered to the substrate support plate 11 side by the rotating plate lifting / lowering mechanism 41 to support the upper rotating plate 31 by the peripheral support pins 12, and the auxiliary shielding mechanism 32 and the liquid nozzle are supported by the auxiliary shielding / elevating mechanism 42. When 33 is lowered to the substrate support plate 11 side to close the opening 31a, a processing space S sandwiched between the substrate support plate 11 is formed. If necessary, only the liquid nozzle 33 is moved to a position immediately above the substrate W so that the processing liquid can be supplied to the substrate W from a short distance.

A nozzle hole 334 is provided in the liquid nozzle 33 toward the processing space S. Then, the liquid nozzle 16
The chemical solution and the carbonic acid-dissolved cleaning solution can be selectively switched and supplied to the center of the upper surface of the substrate W in the same manner as the side. That is, the liquid supply pipe 3 is provided in the hollow portion of the liquid nozzle 33.
The substrate 32 is penetrated so that a processing liquid (chemical solution or carbonic acid-dissolved cleaning liquid) can be supplied from the lower end to the vicinity of the center of rotation of the upper surface of the substrate W held by the substrate support plate 11. The liquid supply pipe 332 is connected to a pipe 87. And the base end of this pipe 87 is branched into three,
A chemical liquid supply source 81 is connected to the first branch pipe 87a, a pure water supply source 82 is connected to the second branch pipe 87b, and a carbon dioxide gas supply source 90 is connected to the third branch pipe 87c.
Are connected. Branch pipes 87a, 87b, 87
Opening / closing valves 88a, 88b, 88c are provided in c, respectively. Then, the on-off valves 88b and 88c are opened, and the on-off valve 88a is closed, whereby the carbonic acid-dissolved cleaning liquid is supplied to the liquid nozzle 33.
Is supplied toward the upper surface of the substrate W from the nozzle hole 334. Also, the on-off valve 88a is opened, and the on-off valves 88b and 88c are opened.
Is closed, a chemical solution can be supplied from the nozzle hole 334 of the liquid nozzle 33 toward the upper surface of the substrate W.

The inner peripheral surface of the liquid nozzle 33 and the liquid supply pipe 3
A gap between the outer peripheral surface of the gas turbine 32 and the outer peripheral surface of the gas turbine 32 serves as a gas supply passage 333. The gas supply path 333 is connected to a gas supply source 85 via a pipe 89 provided with an opening / closing valve 89a.
It is configured such that clean gas can be supplied to the space between the substrate and the upper surface of the substrate W. As described above, in this embodiment, the liquid nozzle 16, the liquid supply pipe 161, the nozzle hole 162,
The liquid nozzle 33, the liquid supply pipe 332, and the nozzle hole 334 constitute a "cleaning liquid supply unit" of the present invention.

Next, the operation of the substrate processing apparatus configured as described above will be described.

In this substrate processing apparatus, a substrate W is loaded into the housing 6 by a substrate transfer device (not shown).
It is placed on the substrate support 1. At this time, the upper rotating plate 3
1. The auxiliary shielding mechanism 32 and the liquid nozzle 33 are retracted upward.

When the loading of the substrate W is completed, the components of the apparatus operate as follows according to a predetermined operation program based on a control signal given from a control means (not shown) to perform the chemical processing, the cleaning processing and the entire processing. Execute the drying process.

First, after the liquid nozzle 33 is lowered to a position near the upper surface of the substrate W, the chemical liquid processing is started. That is, only the on-off valves 88a and 83a of all the on-off valves that are closed are opened, and the chemical liquid is supplied from the liquid nozzles 16 and 33 to the central portions of the upper surface and the lower surface of the substrate W, respectively. At this time, by retreating the upper rotating plate 31 and the auxiliary shielding mechanism 32 upward, the chemical solution is supplied to the upper rotating plate 31 and the auxiliary shielding mechanism 32.
To prevent it from adhering to Further, the motor 23 is started to rotate the substrate support plate 11 so that the substrate support plate 11
Is rotated in a horizontal state. As a result, the chemical solution supplied to the substrate W as described above is guided in the radial direction by the centrifugal force accompanying the rotation of the substrate W, and the chemical solution spreads over the entire upper and lower surfaces of the substrate W, and the chemical solution processing is performed.

When the chemical treatment is completed, the upper rotating plate 31 and the auxiliary shielding mechanism 32 which have been retracted upward are moved downward. As a result, the holding pins of the upper rotating plate 31 are connected to the peripheral edge supporting pins 12 fixed to the upper surface of the substrate supporting plate 11, thereby forming a closed processing space S. In this state, the on-off valves 83a and 88a are closed to stop the supply of the chemical from the liquid nozzles 16 and 33. By opening the on-off valves 83b and 83c, the carbonic acid-dissolved cleaning liquid is supplied to the center of the lower surface of the substrate W via the liquid nozzle 16, and
By opening the on-off valves 88b and 88c, the carbonic acid-dissolved cleaning liquid is supplied to the center of the upper surface of the substrate W via the liquid nozzle 33 to perform the cleaning processing on the substrate W.

When the cleaning process is completed, the on-off valve 83
b, 83c, 88b, 88c are closed and the liquid nozzle 16,
The supply of the cleaning liquid from 33 to the substrate W is stopped, and the process proceeds to the drying process. In this drying process, the rotation speed of the motor 23 is further increased to rotate the substrate W at high speed, and the cleaning liquid remaining on the substrate W is shaken off by centrifugal force.

Subsequently, the open / close valves 84a and 89a are opened, and an inert gas such as a nitrogen gas is supplied to the upper and lower surfaces of the substrate W from the gas supply paths 163 and 333, thereby replacing the processing space S with the inert gas. . Thus, it is possible to effectively prevent an oxide film from being formed on the upper and lower surfaces of the substrate W after the cleaning process.

When the drying operation is completed, the motor 2
3 is stopped, and the upper rotating plate 31, the auxiliary shielding mechanism 32, and the liquid nozzle 33 are returned to the retracted position. Then, the processed substrate W is carried out of the apparatus by the substrate transport apparatus. After that, the above-described series of processing is repeated and executed until the next substrate W is transferred by the substrate transfer device.

As described above, according to this embodiment, since the carbonic acid-dissolved cleaning liquid is used as the cleaning liquid and the cleaning liquid is supplied from the upper surface and the lower surface of the substrate W, the following operation and effect can be obtained. That is, when performing the chemical solution treatment in the same apparatus prior to the cleaning process, the support members for supporting the substrate W, that is, the support pins 12 and 13 need to be formed of a chemical-resistant resin. The electric charge charged on the lower surface of W is compared with the conventional technology (substrate W by conductive support member).
However, according to this embodiment, the cleaning treatment is performed by supplying the carbonic acid-dissolved cleaning solution in which the carbon dioxide gas is dissolved to the lower surface of the substrate W following the chemical treatment. Therefore, not only the lower surface of the substrate W is cleaned, but also the electric charge on the lower surface of the substrate can be absorbed and disappeared through the cleaning liquid having the reduced specific resistance due to the dissolution of carbon dioxide gas. Therefore, the problem most worried when the chemical treatment and the cleaning treatment are performed in the same apparatus, that is, the charging of the lower surface of the substrate is solved at once, and the chemical treatment, the cleaning treatment, and the drying treatment are performed on the glass substrate in the same apparatus. It has become possible to provide a substrate processing apparatus that can be performed by the above-described method.

In the above embodiment, since the carbonic acid-dissolved cleaning solution is supplied not only to the lower surface of the substrate W but also to the upper surface, the electric charge charged on the upper surface of the substrate W can be removed similarly to the lower surface side. The following operation and effect can be obtained. That is, if only the charge is removed from the lower surface of the substrate, electric charges may remain on the upper surface of the substrate and dielectric polarization may occur. In contrast, by discharging both the upper and lower surfaces of the substrate W,
Dielectric polarization can be eliminated, and discharge breakdown of the substrate W can be more effectively prevented.

Further, when the cleaning process is performed, the carbonic acid-dissolved cleaning liquid is shaken off the substrate W and scattered into the processing space S. In this embodiment, the carbonic acid-dissolved cleaning liquid is processed from the upper surface side and the lower surface side of the substrate W. Since the particles are scattered to each part constituting the space S, there is also an operational effect that the entire processing space S can be neutralized.

FIG. 2 is a partially enlarged view showing another embodiment of the substrate processing apparatus according to the present invention. FIG. 2 (a) is an enlarged sectional view of a liquid nozzle arranged to face the lower surface of the substrate. FIG. 2B is a plan view of the liquid nozzle.

This embodiment is largely different from the previously described embodiment only in the structure of the tip of the liquid nozzle, and the other structures are the same. Therefore, here, the features of this embodiment will be described in detail below in comparison with the above embodiment.

The only way to supply the processing liquid to the lower surface of the substrate W and to spread the processing liquid over the entire lower surface of the substrate is to use centrifugal force due to rotation. In particular, in the above-described embodiment, the nozzle hole 162 is provided at the upper end of the liquid supply pipe 161 of the liquid nozzle 16, and the processing liquid (chemical solution or the like) is provided only from the vicinity of the rotation center of the lower surface of the substrate W from the nozzle hole 162. Since the carbonic acid-dissolved cleaning liquid) is supplied, in order to guide the processing liquid supplied from the nozzle holes 162 to the periphery of the substrate W,
It is necessary to increase the number of rotations of the substrate W.

In general, when performing a chemical treatment, the number of rotations of the substrate W tends to be kept low. This is because, when rotated at a high speed, the scattering of the chemical solution and the rebound at the cup portion 5 become large, thereby deteriorating the cleaning property of the substrate W and causing contamination by the chemical solution.
Also, the increase in the number of revolutions increases the amount of charge on the substrate due to friction with the atmosphere in the processing space S.

Therefore, in view of such technical background, it is desirable to configure the liquid nozzle as shown in FIG. That is, in this embodiment, the liquid supply pipe 161 of the liquid nozzle 16 is branched into two at the upper end side, and the first branch pipe 164 extending straight upward from the branch position.
The upper end faces the center of the lower surface of the substrate W as in the previous embodiment, and a processing liquid (chemical solution or carbonic acid-dissolved cleaning liquid) is provided near the rotation center of the lower surface of the substrate W from the nozzle hole 165 provided at the upper end. Is configured to be supplied. On the other hand, the second bends from the branch position and extends toward the periphery of the substrate.
The upper end of the branch pipe 166 faces the peripheral edge of the lower surface of the substrate W, and the nozzle hole 167 provided at the upper end thereof allows the substrate W to pass through.
Processing solution (chemical solution or carbonic acid dissolving cleaning solution)
Is configured to be supplied.

The embodiment configured as described above has not only the same operation and effect as the previous embodiment but also the following specific operation and effect. In this embodiment,
When the chemical is fed into the liquid nozzle 16 by opening the on-off valve 83a, the chemical is simultaneously supplied to the lower central portion and the lower peripheral edge of the substrate W. Can be spread. Of course, in order to perform the cleaning process, the cleaning liquid is applied to the substrate W.
The same applies to the case of supplying to

In the previous embodiment, the carbonic acid-dissolved cleaning solution supplied to the center of the lower surface is guided to the outside in the radial direction to clean the peripheral portion. In this embodiment, a fresh carbonic acid-dissolved cleaning solution is directly applied. Since it is supplied to the peripheral portion, the substrate W
Can be improved.

Although two nozzle holes 165 and 167 are provided in this embodiment, the number of nozzle holes is not limited to this, and three or more nozzle holes may be provided.

The present invention is not limited to the above-described embodiment, and various changes other than those described above can be made without departing from the gist of the present invention. For example, in the above-described embodiment, a carbonic acid gas is dissolved in pure water to prepare a carbonic acid-dissolved cleaning solution, and the cleaning process is performed by using the cleaning solution. Carbon dioxide gas may be dissolved in ion water, ozone water, or the like to prepare a carbonic acid-dissolved cleaning solution.

In the above embodiment, the glass substrate to be processed is not limited to a glass substrate for a liquid crystal display device, and includes a glass substrate for a photomask, a glass substrate for a plasma display, and the like.

Further, in the above embodiment, four peripheral support pins 12 and four central support pins 13 are provided, but the number, arrangement, shape, and the like of these pins are not limited to these.

[0045]

As described above, according to the present invention, the lower surface of the substrate is cleaned by using the carbonic acid-dissolved cleaning solution obtained by dissolving carbon dioxide in the cleaning solution. Can be absorbed and removed, and as a result, discharge breakdown of the substrate can be effectively prevented.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a diagram showing another embodiment of the substrate processing apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate support part 2 Drive part 11 Substrate support plate 12 Peripheral support pin (support member) 13 Center support pin (support member) 16 Liquid nozzle 33 Liquid nozzle W Substrate

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01L 21/304 647 H01L 21/304 647Z (72) Inventor Hiroyuki Kitazawa 4 (1) Daiichi Screen Manufacturing Co., Ltd. (72) Inventor Koichi Ueno 4-chome, Horikawa-dori Terauchi, Kamigyo-ku, Kyoto-shi, Kyoto (72) Inventor Satoshi Suzuki 4-chome Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto-shi, Kyoto, Japan 1-Fukushima Tenjin Kita-cho 1 Dainippon Screen Mfg. Co., Ltd. F term (reference) 2H088 FA17 FA21 FA24 FA30 2H090 JB02 JC19 3B201 AA02 AB08 AB34 AB42 BB22 BB88 BB93 CC13 4G059 AA08 AB09 AB19 AC30

Claims (5)

[Claims] 1. A substrate supporting means for supporting a lower surface of a glass substrate with a support member made of a chemical-resistant resin, and dissolving carbon dioxide in a cleaning liquid with respect to the lower surface of the glass substrate supported by the support member. A substrate processing apparatus comprising: a cleaning liquid supply unit configured to supply a cleaning liquid to clean a lower surface of the glass substrate. 2. The cleaning liquid supply unit according to claim 1, wherein the cleaning liquid supply unit supplies a carbonic acid-dissolved cleaning liquid to an upper surface of the glass substrate as well as a lower surface of the glass substrate to wash the upper surface of the glass substrate. Substrate processing equipment. 3. The cleaning liquid supply means includes: a first cleaning liquid discharge nozzle hole for discharging a carbonic acid-dissolving cleaning liquid toward a substantially central portion of a lower surface of the glass substrate; and a carbonic acid dissolving nozzle toward a peripheral portion of the lower surface of the glass substrate. 3. The substrate processing apparatus according to claim 1, further comprising a second cleaning liquid discharge nozzle hole for discharging a cleaning liquid. 4. A driving device for rotating a glass substrate supported by the substrate supporting device, wherein the cleaning solution is supplied to the lower surface of the glass substrate while the glass substrate is rotated by the driving device. The substrate processing apparatus according to claim 1, 2 or 3, wherein 5. The substrate supporting means includes a substrate supporting plate having a plane size substantially equal to that of the glass substrate, and the glass substrate is supported by the supporting member provided on an upper surface of the substrate supporting plate. The substrate processing apparatus according to any one of claims 1 to 4, wherein the substrate processing apparatus is supported in a state of being separated upward from the plate.