JP2002344031A - Illuminating unit - Google Patents
Illuminating unitInfo
- Publication number
- JP2002344031A JP2002344031A JP2002059119A JP2002059119A JP2002344031A JP 2002344031 A JP2002344031 A JP 2002344031A JP 2002059119 A JP2002059119 A JP 2002059119A JP 2002059119 A JP2002059119 A JP 2002059119A JP 2002344031 A JP2002344031 A JP 2002344031A
- Authority
- JP
- Japan
- Prior art keywords
- leds
- light
- led
- resin layer
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、複数個の発光ダイ
オード（以下、LEDと略記する）を備えた照明装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting device provided with a plurality of light emitting diodes (hereinafter abbreviated as LEDs).
【０００２】[0002]
【従来の技術】従来の照明用光源である白熱電球やハロ
ゲン電球と比較して、高い信頼性や長寿命といった特徴
を持つLEDは、近年の発光効率の向上に伴いこれらの光
源の代替として用いる事が考えられている。2. Description of the Related Art Compared with conventional incandescent lamps and halogen lamps, which are light sources for lighting, LEDs having higher reliability and longer life are used as substitutes for these light sources with the recent improvement in luminous efficiency. Things are being considered.
【０００３】LEDはその発光原理から、特定の発光波長
の光しか発生しないため、白色光を得るには、特開２０
００−２０８８１５号公報記載のように、青色を発する
LEDをその発光により黄緑色に発光する蛍光体と組み合
わせたもの、あるいは特開平１１−１６３４１２号公報
記載のように、赤、青、緑など複数のLEDを組み合わせ
たものを用いる必要がある。An LED emits only light having a specific emission wavelength due to its light emission principle.
Emits a blue color as described in 00-208815
It is necessary to use a combination of an LED with a phosphor that emits yellow-green light by emitting light, or a combination of a plurality of LEDs such as red, blue, and green as described in JP-A-11-163412.
【０００４】しかし、蛍光体を用いる方法では、波長変
換に伴う効率低下が必ず発生し、効率の面から好ましい
方法ではない。また、この方法では、LEDの発光波長と
蛍光体の発光波長の組み合わせによって発光色が一意に
決まってしまうため、光色の制御は不可能であり、蛍光
体の劣化などによって色調が初期段階と比較してずれた
場合でも修正は不可能である。さらに製造工程によっ
て、蛍光体膜厚やLEDの出力及び発光波長にばらつきが
生じるため、光色を統一させる事が難しいといった問題
もある。[0004] However, in the method using a phosphor, the efficiency is always reduced due to the wavelength conversion, which is not a preferable method in terms of efficiency. In addition, in this method, the emission color is uniquely determined by the combination of the emission wavelength of the LED and the emission wavelength of the phosphor, so that it is impossible to control the light color. Correction is not possible even if they are displaced in comparison. Furthermore, there is a problem that it is difficult to unify the light colors because the thickness of the phosphor and the output and emission wavelength of the LED vary depending on the manufacturing process.
【０００５】これに対し、複数の発光色を発するLEDを
用いる方式では、高い発光効率が得られ、発光色も調整
が可能になる。その半面、各色のLEDが異なる組成や材
料で作製されている事から、発光出力の温度依存性や劣
化速度が異なり、使用条件によって色調が変わってくる
といった問題がある。On the other hand, in a system using LEDs emitting a plurality of luminescent colors, high luminous efficiency is obtained and the luminescent colors can be adjusted. On the other hand, since the LEDs of each color are made of different compositions and materials, there is a problem that the temperature dependence and the deterioration rate of the light emission output are different, and the color tone changes depending on the use conditions.
【０００６】特開平１０−４９０７４号公報には、カラ
ー表示装置のバックライト用光源としてLEDを用いる方
式における、上記と同様な問題を解決するための方法が
記載されている。すなわち、各発光色のLEDの輝度レベ
ルを検出するための光センサーを用い、光センサーの検
出値に従って各発光色のLEDの輝度レベルを調整するた
めの制御を行い、一定した所定の色調を得ることを可能
とする。Japanese Patent Application Laid-Open No. 10-49074 describes a method for solving the same problem as described above in a system using an LED as a light source for a backlight of a color display device. That is, an optical sensor for detecting the luminance level of the LED of each emission color is used, and control for adjusting the luminance level of the LED of each emission color is performed according to the detection value of the optical sensor to obtain a constant predetermined color tone. To make things possible.
【０００７】[0007]
【発明が解決しようとする課題】しかしながらこの方法
は、カラー表示装置のような比較的低レベルの光量を用
いる装置には容易に適用できるが、本発明の対象とする
ような照明装置に直ちに適用することはできない。照明
装置は、カラー表示装置に比べるとより多数のLEDが用
いられ、それらのLEDの駆動を適切に制御するために
は、多数のLEDからの発光を反映した検出出力が得られ
る構造が必要だからである。However, this method can be easily applied to an apparatus using a relatively low level of light, such as a color display apparatus, but is immediately applied to an illumination apparatus as the object of the present invention. I can't. Lighting devices use more LEDs than color display devices, and a structure that can provide a detection output that reflects the light emitted from many LEDs is needed to properly control the driving of those LEDs. It is.
【０００８】各LED毎に光センサーを設ければ高い検出
精度が得られるが、多数のLEDに対してそのような構成
を用いることは、装置の規模が増大し、コストも高くな
るため実用的ではない。これに対して、上記の特開平１
０−４９０７４号公報には、１個の光センサーを各発光
色に対して共用する方法が記載されているが、照明用光
源のように多数のLEDが分散して配置された場合におい
て、全てのLEDからの発光を反映した検出出力を得るの
に適した構成については考慮されていない。If a light sensor is provided for each LED, high detection accuracy can be obtained. However, using such a configuration for a large number of LEDs increases the scale of the device and increases the cost, which is practical. is not. On the other hand, Japanese Patent Laid-Open No.
Japanese Patent Application Publication No. 0-49074 discloses a method in which one light sensor is used in common for each emission color. However, when a large number of LEDs are dispersed and arranged like a light source for illumination, No consideration is given to a configuration suitable for obtaining a detection output reflecting light emission from the LED.
【０００９】本発明は、少数の光検出素子により、複数
のLEDからの発光を反映した発光強度を検出し、その検
出信号に基づいて各LEDの駆動を制御することにより、
各LEDの発光特性が異なった条件下でも、所定の発光状
態を得ることが可能な照明装置を提供することを目的と
する。According to the present invention, by detecting a light emission intensity reflecting light emitted from a plurality of LEDs with a small number of light detection elements, and controlling the driving of each LED based on the detection signal,
It is an object of the present invention to provide a lighting device capable of obtaining a predetermined light emitting state even under the condition where the light emitting characteristics of each LED are different.
【００１０】[0010]
【課題を解決するための手段】本発明の照明装置は、少
なくとも２次元方向に分散配置された複数個のLEDと、
前記複数個のLEDを一体的に被覆した透明樹脂層と、前
記透明樹脂層の内部、表面上もしくは近傍に配置された
光検出素子により前記LEDの発光強度を検出する光検出
部と、前記光検出部による検出出力に基づいて前記LED
の駆動を制御する電源回路部とを備える。前記光検出素
子の個数は前記LEDよりも少く、前記光検出素子は、前
記透明樹脂層を伝搬してきた前記LEDの発光強度を検出
する。According to the present invention, there is provided a lighting device comprising: a plurality of LEDs distributed at least two-dimensionally;
A transparent resin layer integrally covering the plurality of LEDs, a light detection unit that detects the emission intensity of the LEDs by a light detection element disposed inside, on, or near the transparent resin layer; and The LED based on the detection output by the detection unit
And a power supply circuit for controlling the driving of the power supply. The number of the light detection elements is smaller than that of the LED, and the light detection element detects the light emission intensity of the LED that has propagated through the transparent resin layer.
【００１１】この構成によれば、複数のLEDの発光が透
明樹脂層を伝搬して光検出素子により検出されるので、
多数のLEDを用いた場合でも、少数の光検出素子により
多数のLEDからの発光を反映した検出が可能である。従
って、長期に渡って連続的に発光出力を一定に保つ事が
可能となる。According to this configuration, the light emitted from the plurality of LEDs propagates through the transparent resin layer and is detected by the light detecting element.
Even when a large number of LEDs are used, detection reflecting light emission from a large number of LEDs can be performed with a small number of photodetectors. Therefore, it is possible to keep the light emission output constant for a long period of time.
【００１２】上記構成において、前記LEDは基板にベア
チップ実装され、前記透明樹脂層は、前記LED及び前記
基板を被覆するように設けられた構成とすることができ
る。In the above configuration, the LED may be mounted on a substrate with a bare chip, and the transparent resin layer may be provided so as to cover the LED and the substrate.
【００１３】好ましくは、前記基板の上面と前記透明樹
脂層の表面が略平行であり、各LED相互の間隔の最大値
をｄとし、前記透明樹脂層の屈折率をｎとしたとき、前
記透明樹脂層の厚さｈが下記式の条件を満足するように
構成する。Preferably, when the upper surface of the substrate is substantially parallel to the surface of the transparent resin layer, the maximum value of the distance between the LEDs is d, and the refractive index of the transparent resin layer is n. It is configured such that the thickness h of the resin layer satisfies the condition of the following equation.
【００１４】ｈ＞ｄ／（２×tan(arcsin(1/n)） それにより、１つのLEDからの発光が他のLEDに入射して
吸収されることを防止でき、光の取り出し効率を高める
ことができるとともに、光検出素子への入射光量を増大
させることができる。H> d / (2 × tan (arcsin (1 / n)) Accordingly, it is possible to prevent the light emitted from one LED from being incident on another LED and absorbed, thereby improving the light extraction efficiency. And the amount of light incident on the photodetector can be increased.
【００１５】また、前記基板の表面部に設けられた窪み
と、前記基板の表面に設けられた金属膜とを更に備え、
前記窪みの壁面は傾斜面をなして前記金属膜により反射
面が形成され、前記窪みの底部に複数個の前記LEDが実
装され、前記窪みを含む前記基板を被覆するように前記
透明樹脂層が設けらた構成とすることができる。[0015] Further, the semiconductor device further includes a depression provided on a surface portion of the substrate, and a metal film provided on a surface of the substrate.
The wall surface of the dent forms an inclined surface, a reflection surface is formed by the metal film, a plurality of the LEDs are mounted on the bottom of the dent, and the transparent resin layer covers the substrate including the dent. The configuration provided may be provided.
【００１６】また上記の構成において、前記LEDは、複
数の各発光色についてそれぞれ複数個設けられ、前記光
検出部は、前記光検出素子により前記LEDの発光強度を
各発光色ごとに検出し、前記制御回路は、前記光検出部
からの各発光色ごとの検出出力に基づいて、各発光色ご
との前記LEDの発光強度のバランスが所定の状態になる
ように、前記LEDの駆動を制御する構成とすることがで
きる。In the above structure, a plurality of LEDs are provided for each of a plurality of emission colors, and the light detection unit detects the emission intensity of the LED for each emission color by the light detection element, The control circuit controls the driving of the LED based on a detection output for each emission color from the light detection unit so that the emission intensity balance of the LED for each emission color is in a predetermined state. It can be configured.
【００１７】この構成において、前記光検出部は、前記
LEDの各発光色ごとに、対応する各発光色の発光ピーク
波長に受光感度が一致する光検出器を備えてもよい。そ
れにより、発光色が互いに異なるLEDの発光強度を、発
光色ごとに検出することが容易となる。In this configuration, the light detecting section is
For each emission color of the LED, a photodetector whose light receiving sensitivity matches the emission peak wavelength of the corresponding emission color may be provided. Thereby, it becomes easy to detect the light emission intensity of the LEDs having different light emission colors for each light emission color.
【００１８】また、前記LEDは、各発光色ごとにパルス
電圧で順次点灯させられ、前記光検出部は、発光色数以
下の個数の前記光検出素子により、前記点灯のタイミン
グと同期して光検出を行うことにより、複数の発光色に
対して前記光検出素子を兼用して光検出を行う構成とす
ることもできる。この構成によれば、たとえば赤、緑、
青といった順でそれぞれの発光色を持つLEDを発光さ
せ、同じタイミングで光検出器からの出力電圧をモニタ
ーすることにより、それぞれの光色の出力比がわかる。
この比を、設定した所定の値になるようにLEDの駆動を
制御することにより、所望の色調を得たり、一定の発光
強度を得たりする事が可能となる。Further, the LED is sequentially turned on by a pulse voltage for each light emitting color, and the light detecting unit uses the number of light detecting elements equal to or less than the number of light emitting colors to synchronize the light with the light emitting timing. By performing the detection, it is also possible to adopt a configuration in which the light detection element is also used to perform light detection for a plurality of emission colors. According to this configuration, for example, red, green,
By illuminating LEDs having the respective emission colors in the order of blue and monitoring the output voltage from the photodetector at the same timing, the output ratio of each light color can be determined.
By controlling the driving of the LED so that the ratio becomes a set predetermined value, it is possible to obtain a desired color tone or a constant light emission intensity.
【００１９】この構成において、各発光色ごとに同時に
点灯させられる前記LEDは、相互間の距離が、前記LEDの
アレイ中で隣接する前記LED間の距離よりも大きいよう
に配置されていることが好ましい。LEDは発光している
間に熱を発生させるため、同時に熱を発生するLEDの配
置間隔を大きくすれば、相互の熱の影響を避けることが
でき、素子の高密度実装に際して発生する熱の低減を図
ることが可能となる。In this configuration, the LEDs that are simultaneously turned on for each emission color are arranged so that the distance between the LEDs is greater than the distance between adjacent LEDs in the array of LEDs. preferable. Since LEDs generate heat while emitting light, increasing the spacing of LEDs that generate heat at the same time can avoid the effects of mutual heat and reduce the heat generated during high-density mounting of elements. Can be achieved.
【００２０】前記透明樹脂層表面には、反射防止膜コー
ティングを施すことが好ましい。透明樹脂層の表面に、
例えばＭｇＦ2などの反射防止膜を形成することによ
り、樹脂内部を伝播する光を効率的に外部に取り出すこ
とが可能となる。The surface of the transparent resin layer is preferably coated with an antireflection film. On the surface of the transparent resin layer,
For example, by forming an anti-reflection film such as MgF 2, light propagating inside the resin can be efficiently extracted to the outside.
【００２１】また好ましくは、前記透明樹脂層に一体封
入された前記光検出素子および前記LEDと、前記電源回
路部とを、同一基板に実装した構成とする。光源部と光
源部を制御する回路部分を同一基板上に実装することに
より、照明装置の一体化、小型化、薄型化を実現するこ
とが可能となる。Preferably, the photodetector and the LED, which are integrally encapsulated in the transparent resin layer, and the power supply circuit are mounted on the same substrate. By mounting the light source portion and a circuit portion for controlling the light source portion on the same substrate, it is possible to realize integration, miniaturization, and thinning of the lighting device.
【００２２】[0022]
【発明の実施の形態】以下、本発明の実施形態につい
て、図面を用いて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２３】図１に、複数のLEDと光検出素子を組み合
わせた、本発明の実施の形態における照明装置の基本的
なシステムを示す。LED光源部１は、複数のLEDを並べた
発光面２と、光検出部３とから構成される。電源回路部
４は、制御回路５と駆動回路６とから構成される。これ
らの要素は、同一基板上に作製することが可能であり、
また、それぞれ分離して離れた位置に設置し、配線によ
り接続することも可能である。光検出部３は、光検出素
子として例えばホトダイオードを用いて構成することが
できる。光検出部３は、発光面２の光出力を検出し、そ
の検出出力が制御回路５に入力される。制御回路５は、
発光面２の光出力が所定の設定値と比較して大きい場合
には駆動回路６の出力電力を絞り、その結果、発光面２
の発光出力が減じられる。発光面２の光出力が所定の設
定値と比較して小さい場合は、その逆の動作となる。FIG. 1 shows a basic system of a lighting device according to an embodiment of the present invention, in which a plurality of LEDs and photodetectors are combined. The LED light source unit 1 includes a light emitting surface 2 in which a plurality of LEDs are arranged, and a light detection unit 3. The power supply circuit section 4 includes a control circuit 5 and a drive circuit 6. These elements can be made on the same substrate,
It is also possible to separately install them at separate positions and connect them by wiring. The light detection unit 3 can be configured using, for example, a photodiode as a light detection element. The light detection unit 3 detects the light output of the light emitting surface 2, and the detected output is input to the control circuit 5. The control circuit 5
When the light output of the light emitting surface 2 is larger than a predetermined set value, the output power of the driving circuit 6 is reduced, and as a result,
The light emission output of is reduced. When the light output of the light emitting surface 2 is smaller than a predetermined set value, the operation is reversed.
【００２４】このように、LEDからの光出力を、ホトダ
イオード等を用いた光検出部３を用いて検出し、駆動回
路６の動作をフィードバック制御することにより、LED
の劣化や熱特性の相違が生じた場合においても、発光強
度の維持、あるいは複数の光色のLEDを用いた際の発光
強度比の維持や所定の光色の発生が可能になる。As described above, the light output from the LED is detected by using the light detection unit 3 using a photodiode or the like, and the operation of the drive circuit 6 is feedback-controlled, thereby obtaining the LED.
In the case where there is a deterioration in thermal characteristics or a difference in thermal characteristics, it is possible to maintain the emission intensity, maintain the emission intensity ratio when using LEDs of a plurality of light colors, and generate a predetermined light color.
【００２５】また、上記のような制御を行うことによ
り、LEDに発光色や発光強度の差があっても所定の光色
が実現可能となるため、LEDの選別を行う必要がなくな
る。In addition, by performing the above-described control, a predetermined light color can be realized even if there is a difference in light emission color or light emission intensity between the LEDs, so that it is not necessary to select LEDs.
【００２６】以下に、本発明の実施の形態について、よ
り具体的に説明する。Hereinafter, embodiments of the present invention will be described more specifically.
【００２７】（実施形態１）図２Ａは、本発明の実施形
態１におけるLED光源部の平面図を示す。同図のＡ−
Ａ′断面図を図２Ｂに示す。このLED光源部において
は、基板７上に、複数の単色のLED８と、１個の光検出
素子９が実装され、透明樹脂層１０によって覆われるこ
とにより、一体化されている。光検出素子９は、透明樹
脂層１０を伝播してくる光を検出するので、複数のLED
８に対して１個配置すれば、発光強度を適切に検出する
ことができる。(Embodiment 1) FIG. 2A is a plan view of an LED light source unit according to Embodiment 1 of the present invention. A- in FIG.
FIG. 2B shows an A ′ cross-sectional view. In this LED light source unit, a plurality of monochromatic LEDs 8 and one photodetector 9 are mounted on a substrate 7 and are integrated by being covered with a transparent resin layer 10. Since the light detecting element 9 detects light propagating through the transparent resin layer 10, a plurality of LEDs are provided.
By arranging one for eight, the emission intensity can be detected appropriately.
【００２８】基板７は、LED８の発熱を効率よく拡散し
放熱するために金属製基板が望ましいが、エポキシ樹脂
やそれにアルミナを含ませたコンポジット基板でもよ
い。基板７には窪み７ａが形成され、各LED８は窪み７
ａの底面部にベアチップ実装されている。窪み７ａの傾
斜部および底面部に金属メッキ１１を施すことにより、
LED８の発光を効率よく前面に向けて放射することがで
きる。さらに基板７の上面全面に金属メッキ１１を施す
ことにより、透明樹脂層１０により内部に反射された光
を再び外部に向けて反射させることができ、LED８の発
光の外部への取り出し効率を高めることができる。The substrate 7 is preferably a metal substrate in order to efficiently diffuse and radiate the heat generated by the LEDs 8, but may be an epoxy resin or a composite substrate containing alumina. A recess 7a is formed in the substrate 7, and each LED 8 has a recess 7a.
The bare chip is mounted on the bottom surface of a. By applying the metal plating 11 to the inclined portion and the bottom portion of the recess 7a,
The light emission of the LED 8 can be efficiently emitted toward the front. Further, by applying the metal plating 11 to the entire upper surface of the substrate 7, the light internally reflected by the transparent resin layer 10 can be reflected to the outside again, and the efficiency of extracting the light emitted from the LED 8 to the outside can be improved. Can be.
【００２９】透明樹脂層１０としては、アクリル樹脂や
熱膨張係数の小さなエポキシ樹脂を用いることが望まし
く、特にLED８の発熱が大きく樹脂の変質が問題となる
場合には、シリコーン樹脂を用いることが望ましい。こ
れらの透明樹脂層は、成型することによりレンズ機能な
どを持たせることが可能である。またLED８は、ベアチ
ップ実装以外にも、一般的な砲弾型や面実装タイプなど
の形態で用い、さらに透明樹脂層１０で覆ってもよい。As the transparent resin layer 10, it is preferable to use an acrylic resin or an epoxy resin having a small coefficient of thermal expansion. In particular, when the LED 8 generates a large amount of heat and deterioration of the resin is a problem, it is preferable to use a silicone resin. . These transparent resin layers can be provided with a lens function or the like by molding. In addition to the bare chip mounting, the LED 8 may be used in a form such as a general shell type or a surface mounting type, and may be further covered with the transparent resin layer 10.
【００３０】以上のように、複数のLED８を連続した同
一の透明樹脂層１０で封入することにより、全てのLED
８の発する光が樹脂中を伝播して、光検出素子９に入射
する。従って、LED８の数より少ない数の光検出素子９
により、全てのLED８の発光を反映した検出出力を得る
ことが可能となる。As described above, by enclosing a plurality of LEDs 8 with the same continuous transparent resin layer 10, all the LEDs 8
The light emitted by the light 8 propagates through the resin and enters the light detecting element 9. Therefore, the number of the light detecting elements 9 smaller than the number of the LEDs 8 is
Thereby, it is possible to obtain a detection output reflecting the light emission of all the LEDs 8.
【００３１】このような機能を十分に発揮させるため
に、透明樹脂層１０の厚さを適切に設定することが望ま
しい。例えば、基板７の上面と透明樹脂層１０の表面が
略平行である場合には、透明樹脂層１０の厚さｈ（図２
Ｂ参照）が下記式（１）の条件を満足するように設定す
ればよい。この式において、ｄは各LED８相互の間隔の
最大値（図２Ａ参照）、ｎは透明樹脂層１０の屈折率で
ある。In order to sufficiently exhibit such a function, it is desirable that the thickness of the transparent resin layer 10 be appropriately set. For example, when the upper surface of the substrate 7 and the surface of the transparent resin layer 10 are substantially parallel, the thickness h of the transparent resin layer 10 (FIG. 2)
B) may be set so as to satisfy the condition of the following equation (1). In this equation, d is the maximum value of the distance between the LEDs 8 (see FIG. 2A), and n is the refractive index of the transparent resin layer 10.
【００３２】 ｈ＞ｄ／（２×tan(arcsin(1/n)） （１） それにより、１つのLED８からの発光が他のLED８に入射
して吸収されることを防止でき、光の取り出し効率を高
めることができるとともに、光検出素子９への入射光量
を増大させることができる。H> d / (2 × tan (arcsin (1 / n)) (1) Accordingly, it is possible to prevent light emitted from one LED 8 from being incident on another LED 8 and being absorbed, and to take out light. Efficiency can be increased, and the amount of light incident on the photodetector 9 can be increased.
【００３３】また、基板７としてSi基板を用い、ベアチ
ップのLED８を実装するとともに、Si基板に、光検出素
子９としてホトダイオードを、例えばレーザーダイオー
ドユニットのように作り込むこともできる。それによ
り、モジュールの小型化、構造の簡略化、あるいは組立
工程や部品点数の削減によるコスト削減を図ることがで
きる。Further, it is also possible to use a Si substrate as the substrate 7 and mount the bare chip LED 8, and to form a photodiode as the light detecting element 9 on the Si substrate like a laser diode unit, for example. As a result, cost reduction can be achieved by downsizing the module, simplifying the structure, or reducing the number of assembly steps and parts.
【００３４】本実施の形態において、複数のLED８は、
基板７上に実装されることにより、平面上、すなわち２
次元方向に分散配置されている。この形態は薄型が得ら
れ、照明装置として最も好ましいが、本発明は、それ以
外の形態にも適用可能である。すなわち、複数のLEDが
多少３次元方向も含めて配置されていても、透明樹脂層
１０中を伝搬した光を検出することによる効果を得るこ
とは可能である。In the present embodiment, the plurality of LEDs 8
By being mounted on the substrate 7,
They are distributed in the dimension direction. Although this form is thin and is most preferable as a lighting device, the present invention can be applied to other forms. That is, even if a plurality of LEDs are arranged in a somewhat three-dimensional direction, it is possible to obtain an effect by detecting light propagated through the transparent resin layer 10.
【００３５】以上に説明した構造は、単色のLED８を用
いて、１つの発光色のモジュールを構成した例である。
すなわち、このようなモジュールを複数色について作成
し、組み合わせて、白色光の照明装置を構成することが
できる。その場合は、各モジュールの光検出素子９から
の出力を、図１に示す制御回路５にそれぞれ入力するこ
とにより制御を行う。The structure described above is an example in which a single color LED 8 is used to form a module of one emission color.
That is, such a module can be created for a plurality of colors and combined to form a white light illumination device. In that case, the control is performed by inputting the output from the light detection element 9 of each module to the control circuit 5 shown in FIG.
【００３６】また、上記の構造において複数の発光色の
LED８を用いることもできる。その場合は、後述する実
施の形態３のように制御を行えばよい。In the above structure, a plurality of emission colors
LED 8 can also be used. In that case, the control may be performed as in a third embodiment described later.
【００３７】（実施形態２）図３Ａは、本発明の実施形
態２におけるLED光源部の平面図を示す。同図のＢ−
Ｂ′断面図を図３Ｂに示す。このLED光源部において
は、基板７上に、それぞれ赤、緑、青の発光色をもつLE
D１２〜１４が実装され、透明樹脂層１０がそれらを覆
っている。透明樹脂層１０の端部には、各色用の光検出
素子１５〜１７が配置されている。(Embodiment 2) FIG. 3A is a plan view of an LED light source unit according to Embodiment 2 of the present invention. B- in FIG.
FIG. 3B is a sectional view taken along the line B ′. In this LED light source unit, LEs having red, green, and blue emission colors
D12 to D14 are mounted, and the transparent resin layer 10 covers them. At the end of the transparent resin layer 10, photodetectors 15 to 17 for each color are arranged.
【００３８】各光検出素子１５〜１７に対しては、それ
ぞれ各色のLED１２〜１４の発光波長領域のみを透過す
る分光フィルター１８〜２０が取り付けられ、各発光色
に対応した光検出器が構成されている。それにより、各
光検出素子１５〜１７は、透明樹脂層１０の中を伝播し
てくる光の波長強度分布を各色領域で測定する。分光フ
ィルター１８〜２０の特性は、各発光色の発光ピーク波
長に受光感度が一致するように構成することが望まし
い。Spectral filters 18 to 20 that transmit only the emission wavelength regions of the LEDs 12 to 14 of the respective colors are attached to the light detection elements 15 to 17, respectively, and photodetectors corresponding to the respective emission colors are configured. ing. Thereby, each of the light detection elements 15 to 17 measures the wavelength intensity distribution of the light propagating in the transparent resin layer 10 in each color region. It is desirable to configure the characteristics of the spectral filters 18 to 20 so that the light receiving sensitivity matches the emission peak wavelength of each emission color.
【００３９】各光検出素子１５〜１７から得られる各色
の発光強度、及び発光強度比を所定の設定値に保つよう
に、制御回路によりLED１２〜１４用の各駆動回路の動
作をフィードバック制御する。The operation of each drive circuit for the LEDs 12 to 14 is feedback-controlled by the control circuit so that the emission intensity and emission intensity ratio of each color obtained from each of the photodetectors 15 to 17 are maintained at predetermined set values.
【００４０】なお光検出素子１５〜１７が、図２の光検
出素子９のように、透明樹脂層中に埋め込まれた形態に
してもよい。The light detecting elements 15 to 17 may be embedded in a transparent resin layer like the light detecting element 9 in FIG.
【００４１】（実施形態３）図４Ａは、本発明の実施形
態３における照明装置のLED光源部の平面図を示す。同
図のＣ−Ｃ′断面図を図４Ｂに示す。本実施形態のLED
照明装置は、各光色のLEDをパルス電圧により順次点灯
させ、発光色の数よりも少ない光検出素子により、複数
色のLEDの発光強度を検出できるように構成されてい
る。(Embodiment 3) FIG. 4A is a plan view of an LED light source unit of a lighting device according to Embodiment 3 of the present invention. FIG. 4B is a cross-sectional view taken along the line CC ′ in FIG. LED of this embodiment
The illuminating device is configured so that LEDs of each light color are sequentially turned on by a pulse voltage, and the light emission intensity of the LEDs of a plurality of colors can be detected by light detection elements having fewer light emission colors.
【００４２】図４Ａ、Ｂに示されるように、このLED光
源部は、基板２１上に実装された各々赤、緑、青の発光
色をもつLED２２〜２４を有する。LED２２〜２４は、透
明樹脂層１０によって覆われている。透明樹脂層１０
は、基板２１の側部から背面部まで達する光ガイド部１
０ａを有する。基板２１の背面近傍に、光ガイド部１０
ａの基板２１側の端部に面して、光検出素子２５が配置
されている。LED２２〜２４からの発光は、透明樹脂層
１０を伝播し、光ガイド部１０ａを経由して光検出素子
２５に導かれる。As shown in FIGS. 4A and 4B, the LED light source unit has LEDs 22 to 24 mounted on a substrate 21 and having red, green, and blue emission colors, respectively. The LEDs 22 to 24 are covered with the transparent resin layer 10. Transparent resin layer 10
Is a light guide unit 1 extending from the side of the substrate 21 to the back.
0a. In the vicinity of the back surface of the substrate 21, the light guide unit 10
The photodetector 25 is disposed facing the end of the substrate 21a on the substrate 21 side. Light emitted from the LEDs 22 to 24 propagates through the transparent resin layer 10 and is guided to the light detection element 25 via the light guide portion 10a.
【００４３】LED２２〜２４は、発光色別に異なるタイ
ミングで発光させられる。従って光検出素子２５は、各
発光色毎に順次発光強度の検出を行うことができ、３つ
の発光色のLEDに対して共通に１個設ければよい。The LEDs 22 to 24 are made to emit light at different timings for each emission color. Therefore, the light detection element 25 can sequentially detect the light emission intensity for each light emission color, and one light detection element 25 may be provided in common for LEDs of three light emission colors.
【００４４】透明樹脂層１０の表面には、反射防止コー
ティング２６が施されている。反射防止コーティング２
６は、蒸着が容易で機械的に強く安定である、Ｍｇ
Ｆ2、ＴｉＯ2、ＳｉＯ2、ＣｅＯ2、ＣｅＦ3、ＺｎＳ、
ＺｒＯ2などが望ましい。これらを透明樹脂層１０の表
面にコーティングすることにより、内部を伝播するLED
２２〜２４からの発光が、大気との界面で再び内部に向
かって反射される割合を減少させることができる。The surface of the transparent resin layer 10 is provided with an anti-reflection coating 26. Anti-reflection coating 2
6 is Mg which is easy to deposit, mechanically strong and stable.
F 2 , TiO 2 , SiO 2 , CeO 2 , CeF 3 , ZnS,
ZrO 2 or the like is desirable. By coating these on the surface of the transparent resin layer 10, the LED propagating inside
The rate at which luminescence from 22-24 is reflected back inward again at the interface with the atmosphere can be reduced.
【００４５】図４Ｃに、LED２２〜２４に印加される駆
動用のパルス電圧のタイミングチャートを示す。パルス
電圧２７〜２９は、クロック信号３０に同期して順次赤
（Ｒ）、緑（Ｇ）、青（Ｂ）のLED２２〜２４が点灯す
るように出力される。光検出素子２５は、クロック信号
３０によって検出値をリセットする。従って、光検出素
子２５により時系列的に得られた電圧値の比は、LED２
２〜２４の各発光出力比を表している。その比を所定の
設定値に保つように、LED２２〜２４を駆動する回路の
動作を制御回路でフィードバック制御し、各色のLED２
２〜２４を発光させる。FIG. 4C shows a timing chart of the driving pulse voltage applied to the LEDs 22 to 24. The pulse voltages 27 to 29 are output so that the red (R), green (G), and blue (B) LEDs 22 to 24 are sequentially turned on in synchronization with the clock signal 30. The photodetector 25 resets the detection value by the clock signal 30. Therefore, the ratio of the voltage values obtained in time series by the light detection
Each of the light emission output ratios 2 to 24 is shown. The operation of the circuits for driving the LEDs 22 to 24 is feedback-controlled by the control circuit so that the ratio is maintained at a predetermined set value.
2 to 24 emit light.
【００４６】以上のように、発光色の異なるLEDを用い
る際に、発光色ごとに順次点灯させ、同じタイミングで
発光強度を検出しフィードバック制御することにより、
一つのホトダイオードで複数色のLEDの駆動を制御する
ことが可能となる。As described above, when LEDs having different emission colors are used, the LEDs are sequentially turned on for each emission color, the emission intensity is detected at the same timing, and feedback control is performed.
It becomes possible to control the driving of the LEDs of a plurality of colors with one photodiode.
【００４７】なお、各発光色の発光周期はできるだけ短
い方が好ましく、１０ｍｓ以下の周期のパルス電圧を用
いることが望ましい。The emission cycle of each emission color is preferably as short as possible, and it is desirable to use a pulse voltage having a cycle of 10 ms or less.
【００４８】（実施形態４）図５Ａは、本発明の実施形
態４におけるLED光源部の平面図を示す。このLED光源部
においては、LEDの駆動は実施の形態３と同様に行われ
る。ただしLEDアレイ中、相互間の距離が遠い複数のLED
が同時に点灯するように、各LEDの配置及び各LEDの発光
タイミングが設定されている。(Embodiment 4) FIG. 5A is a plan view of an LED light source section according to Embodiment 4 of the present invention. In this LED light source unit, driving of the LED is performed in the same manner as in the third embodiment. However, in the LED array, multiple LEDs that are far apart from each other
Are arranged and the light emission timing of each LED is set so that.
【００４９】基板３１に実装されたLED３２〜３４は、
発光色に応じて、それぞれａ系列、ｂ系列、ｃ系列にグ
ループ分けされて配線されている。それにより、LED３
２〜３４は、各系列別に点灯する。同時に点灯する各LE
Dは、相互間の距離が大きくなるように、LED３２〜３４
が配置されている。使用されるLEDの個数によって必ず
しも条件を充足できない場合もあるが、例えば、同時に
発光するLEDは、相互に隣接していないLEDのみとなるよ
うに設定される。言い換えれば、各発光色ごとに同時に
点灯させられるLEDは、相互間の距離が、LEDのアレイ中
で隣接するLED間の距離よりも大きいことが望ましい。The LEDs 32 to 34 mounted on the board 31
The wirings are grouped into a series, b series, and c series according to the emission color. Therefore, LED3
2 to 34 are lit for each series. Each LE lit at the same time
D represents the LEDs 32 to 34 so that the distance between them is large.
Is arranged. In some cases, the condition may not be satisfied depending on the number of LEDs used. For example, the LEDs that emit light at the same time are set so as to be only LEDs that are not adjacent to each other. In other words, it is desirable that the LEDs that are simultaneously turned on for each emission color have a distance between each other greater than the distance between adjacent LEDs in the LED array.
【００５０】LED３２〜３４には、図５Ｂに示すよう
に、ａ系列にはパルス電圧３５が、ｂ系列にはパルス電
圧３６が、ｃ系列にはパルス電圧３７が、それぞれクロ
ック信号３８に同期して印加され、それぞれが順次点灯
する。従って、同時に点灯するLEDは、相互に距離の遠
い同じ系列のLEDのみとなる。それにより、LEDから発生
する熱の分布を拡散させることが可能となり、LEDを集
積して実装した際の、温度上昇によるLEDの素子寿命や
発光効率の低下を緩和することができる。As shown in FIG. 5B, a pulse voltage 35 is applied to the LEDs 32 to 34 in the a series, a pulse voltage 36 is applied to the b series, and a pulse voltage 37 is applied to the c series in synchronization with the clock signal 38. And each of them is sequentially turned on. Therefore, the only LEDs that are turned on at the same time are the same series of LEDs that are far from each other. As a result, the distribution of heat generated from the LED can be diffused, and when the LEDs are integrated and mounted, the reduction in the element life and the luminous efficiency of the LED due to a rise in temperature can be mitigated.
【００５１】（実施形態５）図６Ａは、本発明の実施形
態５における照明装置の平面図示す。同図のＤ−Ｄ′断
面図を図６Ｂに示す。この照明装置は、複数のLEDを透
明樹脂層中に実装した照明装置を複数組み合わせた構成
を有する。(Embodiment 5) FIG. 6A is a plan view of a lighting device according to Embodiment 5 of the present invention. FIG. 6B is a sectional view taken along the line DD ′ of FIG. This lighting device has a configuration in which a plurality of lighting devices in which a plurality of LEDs are mounted in a transparent resin layer are combined.
【００５２】図６Ａに示すように、４個のLED光源部３
９が、照明器具４０に固定されている。照明器具４０の
内部には、光検出素子４１と、LEDを制御及び駆動する
電源回路４２が配置されている。各LED光源部３９は、L
ED４３を透明樹脂層４４により基板４５と一体化して構
成されている。LED光源部３９は、照明器具４０に嵌め
込んで取り付けることができ、また取り外すことも可能
で着脱自在となっており、従って交換可能である。光検
出素子４１は、嵌め込まれたLED光源部３９における透
明樹脂層４４の端部に面するように配置され、上記の実
施形態と同様に、透明樹脂層４４中を各LED４３から伝
搬してくる光を好適に検出することができる。As shown in FIG. 6A, four LED light sources 3
9 is fixed to the lighting fixture 40. Inside the luminaire 40, a light detection element 41 and a power supply circuit 42 for controlling and driving an LED are arranged. Each LED light source section 39 is L
The ED 43 is integrated with a substrate 45 by a transparent resin layer 44. The LED light source section 39 can be fitted and attached to the lighting fixture 40, can be detached and is detachable, and is therefore replaceable. The light detection element 41 is arranged so as to face the end of the transparent resin layer 44 in the fitted LED light source section 39, and propagates from the respective LEDs 43 in the transparent resin layer 44 as in the above embodiment. Light can be suitably detected.
【００５３】各LED光源部３９は、実施の形態２〜４の
ように、発光色の異なるLED４３を組み合わせて用いた
構成としても良いし、あるいは実施の形態１のように単
一発光色のLED４３を用い、異なる発光色のLED光源部３
９を組合せて本実施形態の照明装置を構成することもで
きる。但しそれに応じて、光検出素子４１および電源回
路４２の構成を適切に選択する必要がある。Each of the LED light sources 39 may be configured to use a combination of LEDs 43 having different emission colors as in the second to fourth embodiments, or may be configured to use a single emission LED 43 as in the first embodiment. LED light source unit 3 with different emission colors
9 can be combined to form the lighting device of the present embodiment. However, it is necessary to appropriately select the configurations of the photodetector 41 and the power supply circuit 42 in accordance with the above.
【００５４】本実施形態のように、複数のLEDを基板上
に実装し、透明樹脂層で封入したものをユニット化し、
複数のユニットを同一平面状で点灯させることにより、
広い面積を照明することが可能となる。またユニット化
することにより、素子不良等で一部のLEDが不点灯にな
った場合も、その部分のみを容易に交換することが可能
となる。その上、将来効率の高いLEDが開発されても、
上記の制御方式を用いることにより、LEDの大きさや形
状、駆動電圧に依らず、同じ駆動回路と制御回路を用い
て点灯させることができる。As in the present embodiment, a plurality of LEDs are mounted on a substrate and sealed with a transparent resin layer to form a unit.
By lighting multiple units on the same plane,
A large area can be illuminated. Also, by unitizing, even when some LEDs are turned off due to element failure or the like, it is possible to easily replace only those portions. Moreover, even if highly efficient LEDs are developed in the future,
By using the above control method, it is possible to light up the same driving circuit and control circuit regardless of the size, shape, and driving voltage of the LED.
【００５５】なお、図２Ａ及び図２Ｂに示した１個のLE
D８を実装した構造を、図７Ａ、Ｂに示すように、複数
のLED５３を実装した構造に置き換えた場合でも、上記
と同様な効果を得ることができる。図７Ａは、LED光源
部の一部の平面図を示す。同図のＥ−Ｅ′断面図を図７
Ｂに示す。これらの図は、図２Ａの窪み７ａの１個に相
当する部分を示したものである。Note that one LE shown in FIGS. 2A and 2B is used.
Even when the structure mounting D8 is replaced with a structure mounting a plurality of LEDs 53 as shown in FIGS. 7A and 7B, the same effect as described above can be obtained. FIG. 7A is a plan view of a part of the LED light source unit. FIG. 7 is a sectional view taken along the line EE ′ of FIG.
B. These figures show a portion corresponding to one of the depressions 7a in FIG. 2A.
【００５６】このLED光源部においては、基板５１に設
けられた窪み５２の底部に、複数個（図では９個）のLE
D５３がベアチップ実装され、透明樹脂層５４によって
覆われることにより、一体化されている。窪み５２の壁
面は緩やかな傾斜部を形成し、基板５１の表面に金属メ
ッキ５５を施すことにより、窪み５２の壁面により大き
な反射板が形成されている。図示は省略したが、光検出
素子が、透明樹脂層５４の内部、表面上もしくは近傍に
配置されている。In this LED light source section, a plurality of (9 in the figure) LEs are provided at the bottom of the depression 52 provided in the substrate 51.
D53 is mounted as a bare chip and covered with a transparent resin layer 54 to be integrated. The wall surface of the depression 52 forms a gentle slope, and a metal plate 55 is applied to the surface of the substrate 51, so that a large reflection plate is formed on the wall surface of the depression 52. Although not shown, the photodetector is disposed inside, on, or near the transparent resin layer 54.
【００５７】このように、１個の窪み５２に複数のLED
５３を実装した構造とすることにより、指向性を持たせ
たLED光源の大幅な薄型化が可能になる。また、このよ
うな構造においては、光検出素子により透明樹脂層５４
内を伝搬する発光を検出する方法が、検出精度の向上に
特に有利である。As described above, a plurality of LEDs are provided in one recess 52.
By adopting the structure in which the LED 53 is mounted, it is possible to significantly reduce the thickness of the LED light source having directivity. Moreover, in such a structure, the transparent resin layer 54
The method of detecting the light emission propagating through the inside is particularly advantageous for improving the detection accuracy.
【００５８】この構造を、図３Ａ及び図３Ｂに示した
Ｒ、Ｇ、Ｂ各色のLED１２、１３、１４について、それ
ぞれ適用してもよい。すなわち、各色について、１つの
窪み５２に複数個のLEDを実装した構造とする。This structure may be applied to the R, G, and B LEDs 12, 13, and 14 shown in FIGS. 3A and 3B, respectively. That is, a structure in which a plurality of LEDs are mounted in one recess 52 for each color.
【００５９】[0059]
【発明の効果】本発明によれば、複数のLEDの発光が透
明樹脂層を伝搬して光検出素子により検出されるので、
多数のLEDを用いた場合でも、少数の光検出素子により
多数のLEDからの発光を反映した検出が可能であり、各L
EDの発光特性が異なった条件下でも、所定の発光状態を
得ることができる。According to the present invention, light emitted from a plurality of LEDs propagates through the transparent resin layer and is detected by the photodetector.
Even when a large number of LEDs are used, detection reflecting light emission from a large number of LEDs is possible with a small number of photodetectors, and each L
A predetermined light emitting state can be obtained even under conditions where the light emitting characteristics of the ED are different.
【図１】 本発明の照明装置の概略構造を示すブロック
図FIG. 1 is a block diagram showing a schematic structure of a lighting device of the present invention.
【図２Ａ】 実施形態１における照明装置のLED光源部
を示す平面図FIG. 2A is a plan view showing an LED light source unit of the lighting device according to the first embodiment.
【図２Ｂ】 同LED光源部の断面図FIG. 2B is a sectional view of the LED light source unit.
【図３Ａ】 実施形態２における照明装置のLED光源部
を示す平面図FIG. 3A is a plan view showing an LED light source unit of a lighting device according to a second embodiment.
【図３Ｂ】 同LED光源部の断面図FIG. 3B is a sectional view of the LED light source unit.
【図４Ａ】 実施形態３における照明装置のLED光源部
を示す平面図FIG. 4A is a plan view showing an LED light source unit of a lighting device according to a third embodiment.
【図４Ｂ】 同LED光源部の断面図FIG. 4B is a sectional view of the LED light source unit.
【図４Ｃ】 同LED光源部を駆動する電源波形を示す波
形図FIG. 4C is a waveform diagram showing a power supply waveform for driving the LED light source unit.
【図５Ａ】 実施形態４における照明装置のLED光源部
を示す平面図FIG. 5A is a plan view showing an LED light source unit of a lighting device according to a fourth embodiment.
【図５Ｂ】 同LED光源部を駆動する電源波形を示す波
形図FIG. 5B is a waveform diagram showing a power supply waveform for driving the LED light source unit.
【図６Ａ】 実施形態５における照明装置の平面図FIG. 6A is a plan view of a lighting device according to a fifth embodiment.
【図６Ｂ】 同装置の断面図FIG. 6B is a sectional view of the same device.
【図７Ａ】 変更したLED配置を用いたLED光源部の一部
を示す平面図FIG. 7A is a plan view showing a part of an LED light source unit using a changed LED arrangement.
【図７Ｂ】 同LED光源部の断面図FIG. 7B is a sectional view of the LED light source unit.
１ LED光源部 ２ 発光面 ３ 光検出部 ４ 電源回路部 ５ 制御回路 ６ 駆動回路 ７、２１、３１、５１ 基板 ７ａ、５２ 窪み ８、１２〜１４、２２〜２４、３２〜３４、４３、５３
LED ９、１５〜１７、２５、４１ 光検出素子 １０、４４、５４ 透明樹脂層 １０ａ 光ガイド部 １１、５５ 金属メッキ １８〜２０ 分光フィルター ２６ 反射防止コーティング ２７〜２９、３５〜３７ パルス電圧 ３０、８ クロック信号 ３９ LED光源部 ４０ 照明器具 ４２ 電源回路DESCRIPTION OF SYMBOLS 1 LED light source part 2 Light emission surface 3 Light detection part 4 Power supply circuit part 5 Control circuit 6 Drive circuit 7, 21, 31, 51 Substrate 7a, 52 Depression 8, 12-14, 22-24, 32-34, 43, 53
LED 9, 15-17, 25, 41 Photodetector 10, 44, 54 Transparent resin layer 10a Light guide 11, 55 Metal plating 18-20 Spectral filter 26 Anti-reflection coating 27-29, 35-37 Pulse voltage 30, 8 Clock signal 39 LED light source 40 Lighting equipment 42 Power supply circuit
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松井 伸幸 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 清水 正則 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 3K073 AA43 AA48 AA52 AA63 AB02 AB04 BA26 BA29 BA32 CF13 CG01 CG04 CG12 CG22 CG41 CJ17 CJ22 CJ24 CL01 CM07 5F041 AA11 BB32 BB33 DA13 DA14 DA19 DA33 DA34 DA36 DA44 DA46 DA56 DA82 DA83 DB08 EE22 FF11 5F089 AA10 AB01 AB03 AB17 AC10 AC14 AC16 CA15 CA16 DA02 DA06 FA03 FA06 FA10 GA01 GA07 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Nobuyuki Matsui 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Term (reference) 3K073 AA43 AA48 AA52 AA63 AB02 AB04 BA26 BA29 BA32 CF13 CG01 CG04 CG12 CG22 CG41 CJ17 CJ22 CJ24 CL01 CM07 5F041 AA11 BB32 BB33 DA13 DA14 DA19 DA33 DA34 DA36 DA44 DA46 DA56 DA82 AC10 AC16 CA15 CA16 DA02 DA06 FA03 FA06 FA10 GA01 GA07
Claims (10)
複数個のLEDと、前記複数個のLEDを一体的に被覆した透
明樹脂層と、前記透明樹脂層の内部、表面上もしくは近
傍に配置された光検出素子により前記LEDの発光強度を
検出する光検出部と、前記光検出部による検出出力に基
づいて前記LEDの駆動を制御する電源回路部とを備え、 前記光検出素子の個数は前記LEDよりも少く、前記光検
出素子は、前記透明樹脂層を伝搬してきた前記LEDの発
光強度を検出することを特徴とする照明装置。1. A plurality of LEDs dispersedly arranged in at least a two-dimensional direction, a transparent resin layer integrally covering the plurality of LEDs, and a plurality of LEDs arranged inside, on, or near the transparent resin layer. A light detection unit that detects the light emission intensity of the LED by the light detection element, and a power supply circuit unit that controls the driving of the LED based on a detection output by the light detection unit, wherein the number of the light detection elements is An illumination device, wherein the number of light detection elements is smaller than that of an LED, and the light detection element detects a light emission intensity of the LED that has propagated through the transparent resin layer.
前記透明樹脂層は、前記LED及び前記基板を被覆するよ
うに設けられている請求項１に記載の照明装置。2. The LED is bare-chip mounted on a substrate,
The lighting device according to claim 1, wherein the transparent resin layer is provided so as to cover the LED and the substrate.
が略平行であり、各LED相互の間隔の最大値をｄとし、
前記透明樹脂層の屈折率をｎとしたとき、前記透明樹脂
層の厚さｈが下記式の条件を満足することを特徴とする
請求項２に記載の照明装置。 ｈ＞ｄ／（２×tan(arcsin(1/n)）3. An upper surface of the substrate and a surface of the transparent resin layer are substantially parallel to each other, and a maximum value of a distance between the LEDs is d.
The lighting device according to claim 2, wherein the thickness h of the transparent resin layer satisfies the following expression, where n is the refractive index of the transparent resin layer. h> d / (2 × tan (arcsin (1 / n))
前記基板の表面に設けられた金属膜とを更に備え、前記
窪みの壁面は傾斜面をなして前記金属膜により反射面が
形成され、前記窪みの底部に複数個の前記LEDが実装さ
れ、前記窪みを含む前記基板を被覆するように前記透明
樹脂層が設けられている請求項２に記載の照明装置。4. A dent provided on a surface portion of the substrate,
And a metal film provided on the surface of the substrate, wherein the wall surface of the depression forms an inclined surface, a reflection surface is formed by the metal film, and a plurality of the LEDs are mounted on the bottom of the depression, The lighting device according to claim 2, wherein the transparent resin layer is provided so as to cover the substrate including the depression.
れぞれ複数個設けられ、前記光検出部は、前記光検出素
子により前記LEDの発光強度を各発光色ごとに検出し、
前記制御回路は、前記光検出部からの各発光色ごとの検
出出力に基づいて、各発光色ごとの前記LEDの発光強度
のバランスが所定の状態になるように、前記LEDの駆動
を制御することを特徴とする請求項１に記載の照明装
置。5. The LED, a plurality of LEDs are provided for each of a plurality of emission colors, the light detection unit detects the emission intensity of the LED for each emission color by the light detection element,
The control circuit controls the driving of the LED based on a detection output for each emission color from the light detection unit so that the emission intensity balance of the LED for each emission color is in a predetermined state. The lighting device according to claim 1, wherein:
とに、対応する各発光色の発光ピーク波長に受光感度が
一致する光検出器を備えたことを特徴とする請求項５に
記載の照明装置。6. The light detection unit according to claim 5, wherein the light detection unit includes, for each light emission color of the LED, a light detector whose light receiving sensitivity matches a light emission peak wavelength of the corresponding light emission color. The lighting device according to the above.
で順次点灯させられ、前記光検出部は、発光色数以下の
個数の前記光検出素子により、前記点灯のタイミングと
同期して光検出を行うことにより、複数の発光色に対し
て前記光検出素子を兼用して光検出を行う請求項５に記
載の照明装置。7. The LED is sequentially turned on by a pulse voltage for each light emission color, and the light detection unit controls the light in synchronization with the lighting timing by the light detection elements of the number of light emission colors or less. The lighting device according to claim 5, wherein by performing detection, light detection is performed for a plurality of emission colors by also using the light detection element.
記LEDは、相互間の距離が、前記LEDのアレイ中で隣接す
る前記LED間の距離よりも大きくなるように配置されて
いる請求項５に記載の照明装置。8. The LED, which is lit simultaneously for each emission color, is arranged such that the distance between the LEDs is greater than the distance between adjacent LEDs in the array of LEDs. The lighting device according to claim 1.
ィングを施した請求項１に記載の照明装置。9. The lighting device according to claim 1, wherein an antireflection film coating is applied to a surface of the transparent resin layer.
光検出素子および前記LEDと、前記電源回路部とを、同
一基板に実装した請求項１に記載の照明装置。10. The lighting device according to claim 1, wherein the photodetector and the LED, which are integrally encapsulated in the transparent resin layer, and the power supply circuit are mounted on the same substrate.
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| JP2002059119A JP3696839B2 (en) | 2001-03-14 | 2002-03-05 | Lighting device |
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|---|---|---|---|
| JP2001-72694 | 2001-03-14 | ||
| JP2001072694 | 2001-03-14 | ||
| JP2002059119A JP3696839B2 (en) | 2001-03-14 | 2002-03-05 | Lighting device |
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| JP3696839B2 JP3696839B2 (en) | 2005-09-21 |
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