JP2002340816A - Wiring pattern correction instruction device and wiring pattern correction instruction method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly correct a wiring pattern. SOLUTION: This wiring pattern correction instruction device 10 for giving a correction instruction to a correction device 30 for correcting the wiring pattern generated on a board is equipped with a data conversion circuit 13 for converting RGB image data 31 transmitted from the correction device 30 into HCV image data, a wiring pattern region extraction circuit 15 for extracting a normal wiring pattern region from the HCV image data, a defect region detection circuit 17 for detecting a defect region by comparing with hue data on the normal wiring pattern region, and a correction region designation circuit 20 for designating the defect region to the correction device 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a correction device for correcting a wiring pattern formed on a substrate of a semiconductor display device, and issues an instruction to correct the wiring pattern to enable automatic correction of the wiring pattern. The present invention relates to a wiring pattern correction instruction device and a wiring pattern correction instruction method.

[0002]

2. Description of the Related Art Conventionally, detection of a defect in a wiring pattern on a glass substrate used for a semiconductor display device has been performed through an automated apparatus.

For example, there is known an apparatus for inspecting a wiring pattern by comparing an image picked up by a monochrome line sensor with a design value image or an image of a non-defective sample.

[0004] In addition, R imaged by a color area sensor
There is also known an apparatus that converts an image of a value, a G value, and a B value into a hue value and compares the converted value with a hue value of a good sample.

[0005]

However, although the above-described conventional inspection apparatus can automate the detection of a defect in a wiring pattern, repair (repair) work is still performed manually by an operator. Was.

[0006] The actual repair work is performed by a correction device. The repairing apparatus is equipped with a repairing camera, and the repairing camera displays an automatically detected defective portion of the wiring pattern on a repairing monitor.

In the repair work of the wiring pattern, an operator designates a repair method and a repair position by looking at a defective portion displayed on a monitor for repair work. For this reason, when a different operator performs the correction work, the state of the correction varies.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a wiring pattern correction instruction apparatus and a wiring pattern correction instruction method that enable uniform correction of a wiring pattern. Aim.

[0009]

SUMMARY OF THE INVENTION In order to achieve this object, the present invention detects a defect position of a wiring pattern formed on a glass substrate with high accuracy and at high speed, and generates an area for correction, and corrects the area. Provided are a device and a method for determining a construction method, outputting correction contents to a correction device, and performing correction confirmation after the correction device has completed the correction.

[0010] More specifically, the present invention relates to a wiring pattern correction instruction device for issuing a correction instruction to a correction device for correcting a wiring pattern generated on a substrate, wherein the RGB image data transmitted from the correction device is provided. A data conversion circuit for converting the data into HCV image data, a wiring pattern area extracting circuit for extracting a normal wiring pattern area from the HCV image data,
Provided is a wiring pattern correction instruction device including a defective region detection circuit for detecting a defective region by comparing with hue data of a normal wiring pattern region, and a correction region specifying circuit for specifying a defective region to a correction device.

It is preferable that the wiring pattern correction instruction device further includes a command determination circuit for determining a command sent from the correction device.

When the command is a repair command, the wiring pattern repair instructing device outputs data relating to the repair instruction to the repair device, and when the command is a repair check command, the repair device determines whether or not the repair state is possible. It is preferable to further include a repair information output circuit that outputs the information to the device.

The wiring pattern correction instructing apparatus generates a correction position and a correction method before the wiring pattern is corrected, and after the wiring pattern is corrected, a correction determining circuit for checking the repair state of the corrected portion. It is preferable to further provide.

Further, the present invention relates to a wiring pattern correction instruction method for issuing a correction instruction to a correction device for correcting a wiring pattern generated on a substrate, the method comprising the steps of: converting an RGB image data sent from the correction device into an HCV image; The first step of extracting data, the second step of extracting a normal wiring pattern based on the HCV image data, and the position of the defective area are detected by comparing the data with the hue data of the normal wiring pattern. A wiring comprising: a third step; and a fourth step of separating the wiring pattern region and the other region and performing processing on the wiring pattern region and processing on the region other than the wiring pattern region separately. Provide a pattern correction instruction method.

It is preferable that the method further includes a step of detecting the area of the wiring pattern and the other area after correcting the area of the wiring pattern, and verifying a repair state.

Also, the present invention is a wiring pattern correction instruction method for issuing a correction instruction to a correction device for correcting a wiring pattern generated on a substrate, the method comprising extracting hue data from RGB image data of the wiring pattern. Step 1, a second step of setting at least two regions including a wiring pattern, and determining a first region including a defect region to be extracted in each of these two regions, and combining the first region A third step of setting a gap area, a fourth step of extracting hue data of the gap area, and a fifth step of extracting a hue area different from the hue data as a defective area in the gap area. A sixth step of extracting coordinate data indicating a defective area, a seventh step of specifying a second area adjacent to the area to be corrected, and an eighth step of determining a repair method for the second area. Provides a degree, and a ninth step of outputting the coordinate data and the correction method of the second region to the correction device, the wiring pattern correction instruction method characterized by comprising a.

[0017]

FIG. 1 is a block diagram showing the structure of a wiring pattern correction instruction device 10 according to one embodiment of the present invention.

The wiring pattern correction instructing device 10 provides a semi-automatic repair device 30 as a correcting device for correcting a wiring pattern formed on a substrate by issuing a correction location, a correction method, and other correction-related instructions. The repair device 30 can correct the wiring pattern.

The semi-automatic repair device 30 includes a color camera (not shown), and RGB image data 31 of the wiring pattern captured by the color camera is sent to the wiring pattern correction instruction device 10.

Further, the semi-automatic repair device 30 transmits a repair command, a repair check command, or a busy check command to the wiring pattern correction instruction device 10.

The repair command is a command for requesting the wiring pattern correction instruction device 10 to output data of a wiring pattern correction process. The repair check command is a command for confirming the repair state after the correction of the wiring pattern. Also, the busy check command is
Whether the wiring pattern correction instruction device 10 is busy or ready
That is, it is a command for confirming whether the device is already operating or not operating.

As shown in FIG. 1, the wiring pattern correction instructing device 10 is installed in the command judging circuit 11 for judging a command (repair, repair check, busy check) from the semi-automatic repair device 30, and in the semi-automatic repair device 30. Image data 3 sent from a color camera
1, the first image memory 12a storing the RGB image data 31 captured by the image capturing circuit 12, and the RGB image data 31 stored in the first image memory 12a are converted into HCV image data (H: An RGB → HCV conversion circuit 13 for converting hue, C: saturation, and V: lightness); a second image memory 13 a for storing HCV image data converted by the RGB → HCV conversion circuit 13;
A target pattern determination circuit 14 for determining the type of wiring pattern to be repaired from the HCV image data stored in the second image memory 13a, and a normal wiring pattern area based on the HCV image data stored in the second image memory 13a , A third image memory 15a for storing data of a normal wiring pattern area extracted by the wiring pattern area extraction circuit 15, and a wiring pattern area stored in the third image memory 15a. Region extraction circuit 16 for generating a region in which the data is inverted and a background region, and a fourth image memory 1 for storing wiring pattern region data generated by the background region extraction circuit 16
6a and the disconnection portion occurring in the wiring pattern limited to the data of the wiring pattern area stored in the third image memory 15a, and further, the wiring stored in the fourth image memory 16a is detected. A defect area extraction circuit 17 for detecting a short or protruding portion occurring in the background area limited to the data of the pattern area, and stores data of a disconnected portion, short circuit and protruding portion detected by the defect area extracting circuit 17. A fifth memory 17a, a repair area generating circuit 18 for generating an area for correcting (coating or deleting) the wiring pattern based on the shape of the wiring pattern area stored in the third image memory 15a, and correcting the wiring pattern Before, data indicating the correction position (two or three points specified) and the correction method (coating or deletion) is generated, and the wiring pattern Or, after the positive, a repair method and repair decision circuit 19 to check the repair status correcting portion,
When a repair command is received from the semi-automatic repair device 30, repair instruction data (coordinates of a repair work area and a repair method) is output. When a repair check command is received from the semi-automatic repair device 30, OK or NG in a repair state is output.
(Repair, correction work area coordinates, repair method) and a repair information / confirmation output circuit 20.

FIG. 13 is a flowchart showing the operation of the wiring pattern correction instructing apparatus 10 according to the present embodiment having the above configuration. Hereinafter, the operation of the wiring pattern correction instruction device 10 according to the present embodiment will be described with reference to FIG.

FIG. 2 and FIG. 3 are images of the wiring pattern taken by the color camera mounted on the semi-automatic repair device 30.

There are three different colors C in the image shown in FIG.
1, C2 and C3 are present, and two different colors C4 and C5 are present in the image shown in FIG.

Each of the wiring patterns shown in FIGS. 2 and 3 includes a portion to be corrected. In the wiring pattern shown in FIG. 2, a semicircular defective area 41 to be deleted exists between two electrode patterns 42. Further, in the wiring pattern shown in FIG. 3, a defective region 43 to be applied exists in one electrode pattern 42a, and a defective region 44 as a protruding portion to be deleted protrudes from the other electrode pattern 42b. ing.

First, when the wiring pattern correction instruction device 10 receives a command from the semi-automatic repair device 30 (step S1), the command determination circuit 11 determines the type of the command (step S2).

If the command is a busy check command (YES in step S2), the command determination circuit 11 outputs to the semi-automatic repair device 30 whether the wiring pattern correction instruction device 10 is busy or ready (step S3). . When the wiring pattern correction instruction device 10 is busy (YES in step S3), the semi-automatic repair device 30 issues a busy check command to the wiring pattern correction instruction device 10 again after a predetermined time (for example, after 5 minutes).

If the command is not a busy check command (NO in step S2) or if the wiring pattern correction instructing device 10 is ready (NO in step S3), the semi-automatic repair device 30 uses the wiring pattern correction instructing device. 10 issues a repair command (step S
4) Then, an image as shown in FIG. 2 or FIG. 3 is transmitted to the wiring pattern correction instruction device 10 (step S).
5).

The image capturing circuit 12 of the wiring pattern correction instruction device 10 stores the color image sent from the semi-automatic repair device 30 as shown in FIG. 2 or 3 in the first image memory 12a. The image data stored in the first image memory 12a is RGB data.

Next, the RGB → HCV conversion circuit 13 converts the RGB data stored in the first image memory 12a to H
The data is converted into CV (H: hue, C: saturation, V: lightness) data (step S6), and the HCV data is stored in the second image memory 13a.

The conversion method from RGB data to HCV data is performed by a standard conversion formula or a table lookup method.

Next, the target pattern determination circuit 14
As shown in (1), the first and second rectangular areas 45 and 46 are set (step S7). First and second rectangular areas 45, 4
Reference numeral 6 extends in a direction orthogonal to the direction in which the electrode pattern 42 extends, and is set so as to intersect the electrode pattern 42.

Next, the target pattern determination circuit 14 generates a histogram of the hue data in the first and second rectangular areas 45 and 46 (step S7), and determines the type of the wiring pattern from the result of the histogram (step S8). ).

That is, if the hue is separated into three or more, the image shown in FIG. 2 is a correction target, and if the hue is two or less, the image shown in FIG. 3 is a correction target.

Hereinafter, a correction procedure when the image shown in FIG. 2 is a correction target will be described.

When the correction target is the wiring pattern shown in FIG. 2, the wiring pattern area extracting circuit 15 generates a line including the defective area 41 to be extracted in the first rectangular area 45 as shown in FIG. Two points UL, UR having a distance equal to the width Wp are determined. Similarly, the wiring pattern area extraction circuit 15 determines that the second rectangular area 46 has a line width Wp
Are determined with two points DL, DR having a distance equal to.
The two points DL and DR are selected so as to be located immediately below the two points UL and UR.

Next, the wiring pattern area extracting circuit 15
Are the four points UL, UR, D
By connecting L and DR, an electrode gap region Rg is generated between the two electrode patterns 42 as shown in FIG. 6 (step S9).

Next, the wiring pattern area extracting circuit 15
Stores the data of the hue, lightness and saturation of the electrode gap region Rg in the third image memory 15a.

Next, as shown in FIG. 9, the defect area extracting circuit 17 converts an area having hue data different from the hue data of the electrode gap Rg within the electrode gap Rg generated by the wiring pattern area extracting circuit 15 into a defective area. 41
(Step S10).

The data of the defective area 41 thus extracted is stored in the fifth memory 17a.

Next, the repair area generating circuit 18
As shown in (5), a rectangular area Rpi circumscribing the defective area 41 is determined by labeling the contents of the fifth image memory 17a within the electrode gap Rg and designating three points (step S11).

Next, the repair method / repair determination circuit 19 checks whether the rectangular area Rpi determined by the repair area generation circuit 18 is located inside the electrode gap Rg or the background area (described later). The correction method Dm (deletion or application) is determined (step S12).

Since the defect region 41 shown in FIG. 2 is located inside the region of the electrode gap Rg, in this case,
The repair method / repair determination circuit 19 selects deletion as the repair method Dm (step S12).

Next, the repair information / confirmation output circuit 20 outputs the repair method Dm and the coordinate data of the rectangular area Rpi to the semi-automatic repair device 30 (step S13).

The semi-automatic repair apparatus 30 corrects the wiring pattern, that is, deletes the defective area 41 according to the repair method Dm and the coordinate data of the rectangular area Rpi (step S14).

After performing the specified repair, the semi-automatic repair device 30 issues a repair check command to the wiring pattern correction instruction device 10 (step S15).

The repair information / confirmation output circuit 20, which has received the repair check command, checks whether or not the defective area 41 exists (step S16).

When the defective area 41 is detected (YES in step S16), data for causing the semi-automatic repair device 30 to perform another correction is output, and the semi-automatic repair device 30 performs another correction (step S16). Step S17).

If the defective area 41 is not detected, it is determined as a normal end and the process proceeds to the next defect repair (step S1).
8).

Thus, the correction of the defective area 41 of the wiring pattern shown in FIG. 2 is completed.

When the target pattern determination circuit 14 determines that the type of the wiring pattern is the image shown in FIG. 3 based on the hue data histograms in the first and second rectangular areas 45 and 46 (step S8). The correction procedure of ()) will be described below.

First, the wiring pattern area extraction circuit 15
As shown in FIG. 7, the electrode patterns 42a and 42b and all other electrode patterns are generated as electrode regions Rd1 to Rd4 (step S19).

Next, as shown in FIG. 8, the background area extraction circuit 16 determines whether or not there are defective areas 43 and 44 to be deleted as shown in FIG. A region excluding the regions Rd1 to Rd4 is defined as a background region Rb.
(Step S20).

Next, the background area extracting circuit 16 stores the hue, lightness and saturation data of the background area Rb in the fourth image memory 16a.

Next, the defective area extraction circuit 17
As shown in (2), in the electrode regions Rd1 to Rd4 and the background region Rb, regions having hue data different from the hue data of the electrode regions Rd1 to Rd4 and the background region Rb are extracted as defect regions 43 and 44 (step S2).
1).

The coordinate data of the extracted defective areas 43 and 44 is stored in the fifth image memory 17a.

Next, the repair area generation circuit 18
As shown in (5), by labeling the contents of the fifth image memory 17a and designating three points, defective areas 43 and 44 are designated.
Is determined (step S1).
1).

Next, the repair method / repair determination circuit 19 determines whether the rectangular area Rpi formulated by the repair area generation circuit 18 is located inside the electrode gap Rg, the electrode areas Rd1 to Rd4, or the background area Rb. Is checked, and the correction method Dm (deletion or application) is determined (step S1).
2).

The defect region 43 shown in FIG.
The repair method / repair determination circuit 19 selects the application as the repair method Dm because it exists in the range from 1 to Rd4 (step S12).

Since the defective area 44 shown in FIG. 3 exists inside the background area Rb, the repair method / repair determination circuit 19 selects deletion as the repair method Dm (step S12).

Next, the repair information / confirmation output circuit 20 outputs the repair method Dm and the coordinate data of the rectangular area Rpi to the semi-automatic repair device 30 (step S13).

The semi-automatic repair device 30 corrects the wiring pattern according to the repair method Dm and the coordinate data of the rectangular area Rpi (step S14).

After performing the specified repair, the semi-automatic repair device 30 issues a repair check command to the wiring pattern correction instruction device 10 (step S15).

Upon receiving the repair check command, the repair information / confirmation output circuit 20 checks whether or not the defective areas 43 and 44 exist (step S16).

If the defective areas 43 and 44 are detected (YES in step S16), data for causing the semi-automatic repair device 30 to perform another correction is output, and the semi-automatic repair device 30 is corrected again. (Step S1
7).

If the defective areas 43 and 44 are not detected, the process is terminated normally and the process proceeds to the next defect repair (step S18).

Thus, the correction of the defective areas 43 and 44 of the wiring pattern shown in FIG. 3 is completed.

As described above, according to the wiring pattern correction instructing apparatus 10 according to the present embodiment, the shape defect and the hue defect of the wiring pattern can be reliably detected.

Further, since the correction instruction can be automatically output to the semi-automatic repair device 30, the correction work can be automated, and the production efficiency can be improved and the manufacturing cost can be reduced.

Further, since no operator is required to correct the wiring pattern, it is possible to save labor.

In the above embodiment, the RGB → HCV conversion circuit 13 for converting RGB image data into HCV image data is used. However, instead of the RGB → HCV conversion circuit 13, a circuit for calculating a color difference from RGB image data is used. Can also be used. In this case, the color difference data is input to the target pattern determination circuit 14, which is the next circuit.

The color system to be converted from the RGB image data is H
It is not limited to CV image data. Other color systems are possible.

It is also possible to execute from the image capture to the conversion to the HCV image data by one circuit.

When the RGB image data is fetched without storing the RGB image data in the first image memory 12a, RGB → HCV conversion is performed, and the converted HCV image data is stored in the first image memory 12a. Is also possible.

[0076]

As described above, according to the wiring pattern correction instruction apparatus and the wiring pattern correction instruction method according to the present invention, it is possible to reliably detect the shape defect and the hue defect of the wiring pattern.

Further, since a correction instruction can be automatically output to the wiring pattern correction device, the correction work can be automated, and the production efficiency can be improved and the manufacturing cost can be reduced.

Further, since no operator is required to correct the wiring pattern, it is possible to save labor.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a structure of a wiring pattern correction instruction device according to an embodiment of the present invention.

FIG. 2 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG.

FIG. 3 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG.

FIG. 4 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 5 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 6 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 7 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 8 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 9 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 10 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 11 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

FIG. 12 is a plan view showing how an image of a wiring pattern changes with the operation of the wiring pattern correction instruction device shown in FIG. 1;

13 is a flowchart showing the operation of the wiring pattern correction instruction device shown in FIG.

[Explanation of symbols]

Reference Signs List 10 Wiring pattern correction instruction device according to one embodiment of the present invention 11 Command determination circuit 12 Image capture circuit 12a First image memory 13 RGB → HCV conversion circuit 13a Second image memory 14 Target pattern determination circuit 15 Wiring pattern area extraction circuit 15a Third image memory 16 Background area extraction circuit 16a Fourth image memory 17 Defect area extraction circuit 17a Fifth image memory 18 Repair area generation circuit 19 Repair method / repair determination circuit 20 Repair information / confirmation output circuit 41, 43, 44 Defect area 42, 42a, 42b Electrode pattern 45 First rectangular area 46 Second rectangular area

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/82 H01L 21/82 C 5F064 (72) Inventor An Tomita An 7-5-1, Shiba 5-chome, Minato-ku, Tokyo No. NEC F Company F-term (reference) 2F065 AA49 AA56 BB02 CC19 FF04 FF61 QQ21 QQ24 QQ25 QQ28 QQ31 QQ43 RR09 TT08 UU05 2G051 AA51 AA65 AB02 CA03 CA04 EA14 EA17 EB01 EC02 4M106 DJ04 DJ01 CA01 CA08 CA12 CA16 CA19 CE16 CH01 CH11 DA08 DB02 DB06 DB09 DC16 DC25 5F033 VV15 XX36 5F064 EE60 HH06 HH10 HH15

Claims (7)

[Claims] 1. A wiring pattern correction instruction device for issuing a correction instruction to a correction device that corrects a wiring pattern generated on a substrate, wherein the RGB image data sent from the correction device is subjected to HC
A data conversion circuit for converting the image data into V image data; a wiring pattern area extraction circuit for extracting a normal wiring pattern area from the HCV image data; and a defect area detected by comparing the hue data of the normal wiring pattern area. A wiring pattern correction instructing device, comprising: a defective region detecting circuit that performs the correction; 2. The wiring pattern correction instruction device according to claim 1, further comprising a command determination circuit for determining a command sent from the correction device. 3. When the command is a repair command, data relating to a repair instruction is output to the repair device, and when the command is a repair check command, whether or not a repair state is possible is output to the repair device. 3. The wiring pattern correction instruction device according to claim 2, further comprising a repair information output circuit that performs the repair information. 4. The method according to claim 1, wherein before the wiring pattern is modified,
4. The apparatus according to claim 1, further comprising a correction determination circuit configured to generate data of a correction position and a correction method, and to check a repair state of the correction portion after correcting the wiring pattern. 5. Wiring pattern correction instruction device. 5. A wiring pattern correction instruction method for issuing a correction instruction to a correction device that corrects a wiring pattern generated on a substrate, comprising:
A first step of extracting CV image data; a second step of extracting a normal wiring pattern based on the HCV image data; and a comparison with the hue data of the normal wiring pattern. A third step of detecting a position, separating the area into the area of the wiring pattern and the other area,
A fourth process that distinguishes between the processing on the wiring pattern area and the processing on an area other than the wiring pattern area;
And a wiring pattern correction instruction method comprising: 6. The method according to claim 5, further comprising, after correcting the wiring pattern area, detecting the wiring pattern area and other areas to verify a repair state. Wiring pattern correction instruction method. 7. A wiring pattern correction instruction method for issuing a correction instruction to a correction device for correcting a wiring pattern generated on a substrate, wherein a first step of extracting hue data from RGB image data of the wiring pattern. A second step of setting at least two regions including the wiring pattern, and determining a first region including a defect region to be extracted in each of the two regions; A third step of setting a gap area; a fourth step of extracting hue data of the gap area; and a fifth step of extracting an area having a hue different from the hue data as a defect area in the gap area. A sixth step of extracting coordinate data indicating the defective area; a seventh step of specifying a second area adjacent to the area to be corrected; and a repair of the second area. 8 the steps of the second ninth step and the wiring pattern correction instruction method characterized by comprising the outputting the coordinate data and the correction method of region in the modified device for determining the construction method.