JP2002335076A - Method and apparatus for aligning laminated position of printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for efficiently fitting a board material to a guide pin, and for carrying out lamination with a small amount of interlayer misalignment, and to provide an apparatus for performing the method. SOLUTION: In the method and apparatus, the guide pin (c) is inserted into a guide hole provided on each printed circuit board to laminate a plurality of printed circuit boards (a) for forming a plurality of layers of laminated circuit boards with a plurality of layers, thus performing alignment for temporary bonding, and aligning the laminating position of the printed circuit board for laminating by a laminating press. Then, the guide pin (h) divided in a longitudinal direction is prepared. In the guide pin (h), at least the tip can be opened and closed. The guide pin is inserted into each guide hole on the plurality of printed circuit boards while the tip of the guide pin is closed, and the guide pin is brought into contact with the guide hole while the tip of the guide pin is opened, thus aligning the plurality of printed circuit boards.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed circuit board and an apparatus therefor, and more particularly to a method for aligning each printed circuit board constituting a multilayer printed circuit board and an apparatus used for the same.

[0002]

2. Description of the Related Art Interconnection of each layer circuit constituting a multilayer printed circuit board is performed through a conductive layer provided in a through hole or a via hole. For this reason, the position of each layer circuit must match the position of the through hole and the via hole.

In recent years, circuit patterns have become finer due to the recent increase in wiring density, and the diameters of through holes and via holes have been reduced. Therefore, if the interlayer position is shifted, a connection failure state is likely to occur.

[0004] In a normal manufacturing process of a multilayer printed circuit board,
A hole processing target is simultaneously formed when the pattern of the inner layer material is formed, and a hole is drilled at this target position to be used as a laminated guide hole. That is, the positioning is performed by passing the guide pins mounted on the laminating jig through the laminating guide holes of the inner layer material, and the lamination is performed as it is.

As a method using a laminating jig, FIG.
There is a method in which a substrate material is temporarily bonded using a positioning jig as shown in FIG.
In this method, a plurality of substrate materials a are placed on a jig stand b, guide pins c are inserted into guide holes provided in the substrate materials a, the substrate materials a are aligned, and an upper holding plate d is used. Press.

[0006]

In any of the above cases,
If the substrate material is not properly mounted on the guide pins, interlayer displacement will occur.

FIG. 7 (A) shows a case where the camera is correctly mounted.
FIG. 7B shows a case where a positional shift has occurred. A guide hole is formed in the substrate material a so that a gap of about 0.005 mm to 0.02 mm is opened with respect to the outer diameter of the guide pin c provided on the jig base b1. As for this gap, no problem occurs if the substrate material a is correctly mounted as shown in FIG. 7A, but if there is a misalignment as shown in FIG. , The substrate material e, f,
In some cases, g may be displaced by about a gap.

[0008] Such deformation is more likely to occur as the thickness of the substrate material becomes thinner, and causes interlayer displacement after lamination.

The present invention has been made in view of the above points, and provides a method and an apparatus capable of efficiently mounting a substrate material on a guide pin and laminating with a small interlayer displacement. The purpose is to provide.

[0010]

In order to achieve the above object, according to the present invention, a guide pin is provided in a guide hole provided in each printed circuit board for laminating a plurality of printed circuit boards forming a plurality of laminated circuit boards. In the method of aligning the temporary bonding by inserting by inserting and then aligning the laminating position of the printed circuit board for laminating by a laminating press, prepare a guide pin that is divided in the longitudinal direction and at least the tip can be opened and closed, The guide pins are inserted into the respective guide holes of the plurality of printed circuit boards in a state in which the plurality of printed circuit boards are closed, and the ends of the guide pins are opened to make contact with the guide holes, thereby aligning the plurality of printed circuit boards. A method for aligning the lamination position of a printed circuit board, and a plurality of printed circuit boards forming a multi-layer laminated circuit board In order to perform layering, a temporary bonding is performed by inserting a guide pin into a guide hole provided in each printed circuit board to perform temporary bonding, and then, in a device for aligning a laminated position of a printed circuit board for laminating by a laminating press, The guide pin has an opening / closing pin that has a space formed in the center thereof, is divided in the longitudinal direction, and whose tip can be opened and closed, and an inner pin that opens the tip of the opening / closing pin by being inserted into the space of the opening / closing pin. And a device for aligning the lamination positions of the printed circuit boards.

[0011]

FIG. 1 shows the structure of a first embodiment of the present invention. As shown in FIG. 1, the substrate material a is initially provided with a jig base b as shown on the left side of FIG.
2 is placed with a positional shift, and the opening / closing pin h1 of the guide pin is inserted into the guide hole. That is,
The opening / closing pin h1 is not at each center position of the guide hole provided in each substrate material a. At this time, the opening / closing pin h1
Is in a state where the upper end in the figure, that is, the tip is narrowed. The opening / closing pin h1 has its tip portion separated from each other like two or more petals, so that the tip portion can be opened.

An inside pin j can be inserted inside the opening / closing pin h1, and when the inside pin is inserted upward in the drawing inside the opening / closing pin h1, the opening / closing pin h is inserted.
The tip of 1 opens. A flange-like portion is provided at the base end of the inner pin j, and an extensible coil spring i1 is mounted between the flange-like portion and the base end of the opening / closing pin.
Due to the action of the extensible coil spring i1, the inner pin j is always given an acting force in the direction of coming out of the opening / closing pin h1, and the tip of the inner pin j is inserted into the base end of the opening / closing pin h1 as shown on the left side of FIG. Have been.

Next, as shown on the right side of FIG.
Is pushed upward in the figure against the extension force of the extensible spring i1, the inner pin j is inserted into the opening / closing pin i1 while pushing the opening / closing pin i1 from inside, and finally the state shown in the right side of FIG. Becomes

In the state shown on the right side of FIG. 1, a plurality of substrate materials a are all aligned, and a circuit, a through hole or a via hole of each substrate material a is placed at a correct position. Therefore, connection failure between the substrate materials does not occur.

FIG. 2 shows the positional relationship between the guide holes k1, k2, and k3 provided in the substrate material a in FIG. 1 and the inner pins h when viewed from above (from above in FIG. 1). The diagram on the left side of FIG. 2 corresponds to the diagram on the left side of FIG.
Guide holes k1, k2, and k3 are narrowed inner pins h
Eccentric to 2 is the same as FIG.
Corresponding to the diagram on the right, since the substrate materials are aligned with one another, the guide holes k1, k2, k3 are now located concentrically with the expanding inner pin h.

FIG. 3 shows the structure of the second embodiment of the present invention. In this embodiment, the shape of the opening / closing pin h2 is a spindle shape whose end is cut, and the jig base b4
Is provided with an upper bush l and a lower bush m.
2 is provided at the lower part of the jig base b3 and is provided with an extensible coil spring i.
2 is configured to be supported by the mounted sliding shaft n. In this embodiment, there is no member corresponding to the inner pin j in the first embodiment shown in FIGS.

In the upper part of FIG. 3, the extensible coil spring i
The opening / closing pin h2 receives the downward acting force in FIG. 3 due to the extension force of 2, and the portion having the maximum outer diameter of the opening / closing pin h2 is in contact with the lower bush m. As a result, the end of the opening / closing pin h2 is narrowed, so that the opening / closing pin h2 is easily inserted into the guide hole of the substrate material a.

After the insertion, the opening / closing pin h2 is pushed upward in the figure against the extension force of the extensible coil spring i2, and as shown in FIG.
The state is as shown in the lower figure. And the outer diameter maximum portion of the opening / closing pin h2 comes off the lower bush m and the tip is opened,
The tip is opened until the maximum outer diameter portion comes into contact with the upper bush l. At this time, the substrate material a is aligned in accordance with the opening operation of the tip of the opening / closing pin i2.

FIG. 4 shows the structure of a third embodiment of the present invention. In this embodiment, the opening / closing pin h3 is rotatably supported on the jig base b4 by a hinge o whose detailed structure is not shown. Then, the substrate material a comes into contact with the upper part of the opening / closing pin h3 to reduce the tip, and the pushing plate p as a pressing member acts on the lower part of the opening / closing pin h3 as an extension force of the extensible coil spring i3. When it is pushed up against the contact, it acts to open the tip.

FIG. 4 shows a state in which an extensible coil spring i3 is shown.
Since the push plate p is pushed down by the extension force of FIG. 3, the opening / closing pin h3 is in a freely rotatable state. Inserted into the guide hole a. Thereafter, when the push plate p is pushed upward in the figure against the extension force of the extensible coil spring h3, the push plate p is attached to the lower end of the open / close pin h3 in the figure.
The illustrated upper surface of FIG. 7 abuts to give an action force in the direction of closing the opening / closing pin h3. The opening of the opening / closing pin h3 aligns the guide hole of each substrate material a, and as a result, aligns each substrate material a.

FIG. 5 is an enlarged view of a portion around the hinge of the opening / closing pin h3 in FIG. As shown in FIG. 5, the opening / closing pin h3 rotates until it contacts one of the edges q and r of the jig base b4. When contacting the edge r,
The tip of the opening / closing pin h3 is narrowed, and when the abutment with the edge q is made, the tip of the opening / closing pin h3 is open.

(Modifications) In the above embodiment, three examples in which the tip is opened and closed have been described. However, the opening and closing pins in those embodiments can be made of a material having a moderate elasticity to have an elastic action. .

[0023]

According to the present invention, as described above, for positioning by inserting a guide pin into a guide hole provided in each printed circuit board, a guide pin which is divided in the longitudinal direction and whose at least the tip can be opened and closed is prepared. Then, the guide pins are inserted into the respective guide holes of the plurality of printed circuit boards in a state where the tips are closed, and the tips of the guide pins are opened to align the plurality of printed boards.
The mounting of the substrate material on the guide pins can be efficiently performed, and the lamination can be performed with a small interlayer displacement.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a first example of the present invention.

FIG. 2 is a top view showing an operation state of the embodiment shown in FIG. 1;

FIG. 3 is an explanatory diagram showing a configuration of a second example of the present invention.

FIG. 4 is an explanatory diagram showing a configuration of a third embodiment of the present invention.

FIG. 5 is an enlarged explanatory view of a main part of the embodiment shown in FIG. 4;

FIG. 6 is an explanatory view showing a conventional substrate material alignment structure.

FIG. 7 is a partially enlarged view when a conventional guide substrate is mounted on a guide pin.

[Explanation of symbols]

 a board material b, b1, b2, b3 jig stand c guide pin d upper holding plate e, f, g board material h opening / closing pin i extensible coil spring j inner pin k guide hole l upper bush m lower bush n sliding shaft o Hinge p Push plate q, r Jig stand edge

Claims (5)

[Claims] 1. A method for laminating a plurality of printed circuit boards forming a plurality of laminated circuit boards, inserting a guide pin into a guide hole provided in each printed circuit board to perform positioning and temporary bonding. Then, in a method of aligning the lamination positions of the printed circuit boards for lamination by a laminating press, a guide pin which is divided in a longitudinal direction and at least a tip of which can be opened and closed is prepared, and the guide pins are closed with the tips closed to the plurality of printed circuit boards. The plurality of printed circuit boards are aligned by opening the tip of the guide pin and making contact with the guide holes. Method. 2. A method for laminating a plurality of printed circuit boards forming a plurality of laminated circuit boards, inserting a guide pin into a guide hole provided in each printed circuit board to perform positioning and temporary bonding. Next, in an apparatus for adjusting a lamination position of a printed circuit board for lamination by a lamination press, the guide pin has a space formed in a center portion, is divided in a longitudinal direction, and can be opened and closed at an end thereof. And an inner pin for opening a tip of the open / close pin by being inserted into a space. 3. The apparatus according to claim 2, wherein a spring is provided to release said inner pin from said opening / closing pin. 4. A method for laminating a plurality of printed circuit boards forming a plurality of laminated circuit boards, performing positioning and temporary bonding by inserting guide pins into guide holes provided in each printed circuit board. Next, in a device for aligning the lamination positions of the printed circuit boards that are to be laminated by a lamination press, the guide pin includes a plurality of opening and closing members supported by hinges so that the tips can be opened and closed, and sandwiches the hinge of the opening and closing members. And a pressing member for applying an acting force to the opposite end to open the front end. 5. The printing apparatus according to claim 4, wherein the guide pin has an extensible spring that separates the pressing member so that the plurality of opening / closing members can be freely rotated. A device that adjusts the stacking position of substrates.