JP2002334974A - Solid-state imaging device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable high image quality and reduce cost by enabling to align and fix a flare prevention plate to a solid-state imaging element accurately and rapidly. SOLUTION: A solid-state imaging apparatus is provided with a solid-state imaging element 12, having a pixel region 23 containing an effective pixel region 21, a flare prevention plate 13 for preventing an light to be a flare from being incident into the region 21, and a package body for fixing the element 12 and the plate 13. In the element 12, an alignment mark 24a is arranged for aligning the element 12 with the plate 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a solid-state imaging device provided with a flare preventing plate and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, video cameras and electronic cameras have become widespread. These cameras use a solid-state imaging device such as a CCD type or a MOS type. In this configuration, a plurality of pixels each having a light receiving section are arranged in a matrix. Light incident on each pixel is photoelectrically converted by a light receiving unit to generate signal charges. The generated signal charge is transferred to the CCD
And output to the outside via signal lines.

In a solid-state image pickup device, generally, a color filter and a micro lens are arranged on each light receiving section. Therefore, a color image can be generated with a small amount of light. The solid-state imaging device is used by being mounted on a package in order to improve durability and facilitate handling. Here, a state in which the solid-state imaging device is mounted on a package is referred to as a solid-state imaging device.

[0004] The solid-state imaging device is improved daily for the purpose of improving the image quality. Flare is one of the issues of high image quality.

[0005] In order to reduce flare, conventionally, FIG.
As shown in FIG. 1, the solid-state imaging device 1 including the flare prevention plate 3
Is provided. FIG. 13 is a schematic vertical sectional view schematically showing the conventional solid-state imaging device 1. The solid-state imaging device 2
It is fixed to the body 4 of the package, and is electrically connected to the main body 4 by a thin metal wire 5. The thin metal wire 5 is electrically connected to a terminal 6, and the solid-state imaging device 2 is electrically connected to an external device via the terminal 6.
After the solid-state imaging device 2 and the anti-flare plate 3 are fixed to the main body 4 of the package,
A glass plate 7 is attached for sealing. The anti-flare plate 3 is disposed between the solid-state imaging device 2 and the glass plate 7, and has an opening through which a light beam that is going to directly enter the effective pixel area of the solid-state imaging device 2 via the glass plate 7 passes. ing. In FIG. 13, reference numeral 3a denotes an end face of the opening of the anti-flare plate 3. The flare prevention plate 3 is configured as a light-shielding plate, and covers a thin metal wire 5 and a circuit (peripheral circuit) (not shown) provided around the solid-state imaging device 2.

[0006] As shown in FIG.
If the anti-flare plate 3 is removed from the
When the incident light 8 traveling toward the inside enters the solid-state imaging device 1, the incident light 8 is reflected by the thin metal wire 5. Even if the incident light 9 directed to the peripheral circuit of the solid-state imaging device 2 enters the solid-state imaging device 1, the incident light 9 is strongly reflected by the peripheral circuit.
The light reflected by the thin metal wires 5 and the peripheral portion is reflected by the glass plate 7 and enters the effective pixel area of the solid-state imaging device 2.
Generates unwanted charge. This phenomenon is a flare, and the unnecessary charges become noise.

On the other hand, in the conventional solid-state imaging device 1 shown in FIG.
9 is reflected outside by the anti-flare plate 3 and does not enter the effective pixel area. Therefore, flare is reduced.

[0008]

By arranging the anti-flare plate as described above, it is possible to suppress a decrease in image quality due to the occurrence of flare.

However, accurate positioning of the anti-flare plate 3 is not easy. Generally, the solid-state imaging device 2 and the anti-flare plate 3 are fixed at desired positions of the package body, however, it is difficult to accurately align the anti-flare plate 3 and the solid-state imaging device 2 with this.

If the anti-flare plate 3 is not accurately aligned with respect to the solid-state image sensor 2 in the plane direction of the substrate, the reflected light from the incident lights 8 and 9 will be incident on the effective pixel area, and the above-mentioned flare will be reduced. It cannot be effectively prevented, or the incident light to enter the effective pixels for generating an image is blocked. If the anti-flare plate 3 is not accurately aligned with the solid-state imaging device 2 in the plane direction of the substrate, a part of the end face 3a of the opening of the anti-flare plate 3 approaches the effective pixel area. When the position of the prevention plate 3 in the height direction of the substrate is shifted upward with respect to the solid-state imaging device 2, the light reflected on the end face 3a enters the effective pixel area and becomes noise to cause flare. . As described above, unless the anti-flare plate 3 is accurately aligned with the solid-state imaging device 2 in the surface direction of the substrate, the original function of the anti-flare plate 3 cannot be effectively exhibited, and high image quality cannot be achieved. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and can accurately and quickly position and fix a flare prevention plate and a solid-state image pickup device, thereby achieving high image quality and cost reduction. It is an object of the present invention to provide a solid-state imaging device and a manufacturing method thereof.

[0012]

According to a first aspect of the present invention, there is provided a solid-state imaging device having a pixel region including an effective pixel region, and a solid-state imaging device having a pixel region including an effective pixel region. An anti-flare plate for suppressing incidence on a pixel region; and a package body for fixing the solid-state imaging device and the anti-flare plate. The solid-state imaging device includes an alignment between the solid-state imaging device and the anti-flare plate. In this case, an alignment mark for performing the above operation is arranged.

According to the first aspect, since the exclusive alignment pattern arranged on the solid-state imaging device and the light shielding plate can be directly aligned, accurate and quick alignment can be performed. For this reason, high image quality can be achieved, and the manufacturing cost can be reduced.

In the solid-state imaging device according to a second aspect of the present invention, in the first aspect, the alignment mark is formed of the same material as a microlens or a color filter provided in the effective pixel area. is there.

According to the second aspect, the alignment mark can be formed at the same time as the step of forming the microlens or the color filter. Therefore, the manufacturing can be performed without inserting a new step, and the manufacturing cost can be reduced. Can be further reduced.

According to a third aspect of the present invention, in the solid-state imaging device according to the first or second aspect, the alignment mark is generally formed along substantially the entire outer edge of the pixel area outside the pixel area. Are arranged so as to form a distribution region located at a predetermined position, and there is substantially no space between an inner edge of the distribution region and an outer edge of the pixel region.

According to the third aspect, the entire distribution area formed by the plurality of alignment marks over substantially the entire periphery of the pixel area can be used as an index for alignment, and the position between the anti-flare plate and the solid-state imaging device can be determined. At the time of alignment, an alignment mark can be easily searched for, and alignment can be performed more easily. In the case of the third aspect, for example, the outer edge of the distribution area can be used as a reference for matching the end face of the opening of the anti-flare plate.

According to a fourth aspect of the present invention, in the solid-state imaging device according to the third aspect, an interval between an outer edge of the distribution area and an outer edge of the effective pixel area is 200 microns or more.

In the third aspect, when the outer edge of the distribution area is used as a reference for matching the end face of the opening of the anti-flare plate, the interval is set to 200 μm or more (300 μm) as in the fourth aspect. If it is set to be equal to or more than micron, the opening of the anti-flare plate 3 is taken into consideration even if the positional error of the anti-flare plate 3 with respect to the solid-state imaging device 2 in the surface direction and the amount of positional deviation in the height direction are taken into consideration. The light reflected on the end surface of the pixel and entering the effective pixel region is eliminated or reduced, and the image quality can be further improved.

According to a fifth aspect of the present invention, in the solid-state imaging device according to the first or second aspect, the alignment mark is generally formed along substantially the entire outer edge of the pixel area outside the pixel area. A plurality is arranged so as to form a distribution region positioned at a predetermined distance, and an interval is provided between an inner edge of the distribution region and an outer edge of the pixel region so that the distribution region and the pixel region can be identified. is there.

[0021] Even if the interval is provided as in the fifth aspect, the same advantages as in the third aspect can be obtained. Further, in the fifth aspect, by providing the interval, the alignment mark can be easily identified. In the fifth aspect, for example, the inner or outer edge of the distribution area or the entire width of the distribution area can be used as a reference for matching the end face of the opening of the anti-flare plate. For example, if the width of the distribution area is set to an allowable value of the displacement error, the entire width of the distribution area is used as a reference (that is, the end face of the opening of the anti-flare plate is aligned with the distribution area). Thus, the alignment can be easily performed so that the positional deviation error is reliably suppressed to the allowable value or less.

According to a sixth aspect of the present invention, in the solid-state imaging device according to the fifth aspect, a distance between an inner edge of the distribution area and an outer edge of the effective pixel area is 200 microns or more.

As in the sixth embodiment, the interval is set to 200
Microns or more (more preferably 300 microns or more)
In this case, even if an alignment error of the anti-flare plate 3 with respect to the solid-state imaging device 2 in the plane direction and a positional shift amount in the height direction are considered, the anti-flare plate 3 is effectively reflected by the end face of the opening of the anti-flare plate. Light incident on the pixel region is eliminated or reduced, and the image quality can be further improved.

The solid-state imaging device according to a seventh aspect of the present invention is the solid-state imaging device according to any one of the first to sixth aspects, wherein the shape and size of the alignment mark are the same as those of the microlens or the color provided in the effective pixel area. The shape and size of the filter are almost the same.

By setting the shape and size of the alignment mark as in the seventh aspect, it is easy to design the alignment mark.

The solid-state imaging device according to an eighth aspect of the present invention is the solid-state imaging device according to any one of the first to sixth aspects, wherein the size of the alignment mark is a micro lens or a color filter provided in the effective pixel region. It is larger than the size of. According to the eighth aspect, it is clear that the mark is an alignment mark, and the alignment is further facilitated.

According to a ninth aspect of the present invention, in the solid-state imaging device according to the eighth aspect, the alignment mark has a substantially square shape having a side length of about 0.1 mm.

The ninth aspect is an example of the shape and size of the alignment mark in the eighth aspect. As described above, it is preferable that the misalignment between the flare prevention plate and the solid-state imaging device in the direction of the substrate be as small as possible. In the ninth aspect, for example, the alignment marks are arranged in a line around the pixel area in the distribution area, and the entire width of the distribution area is used as a reference (ie, the end face of the opening of the anti-flare plate is aligned). (Alignment on the mark), the displacement error can be reliably suppressed to within 0.05 mm.

[0029] In a solid-state imaging device according to a tenth aspect of the present invention, in the first or second aspect, the alignment marks are respectively arranged near a plurality of spots on the solid-state imaging device which are scattered. Things. If necessary, a plurality of alignment marks may be arranged in the vicinity of each of the locations.

When a plurality of alignment marks are arranged so as to form the distribution area as in the third to ninth aspects, the alignment marks can be easily searched for. The deviation will be confirmed. On the other hand, in the tenth aspect, since the alignment marks are respectively arranged in the vicinity of a plurality of scattered points, the alignment may be performed using at least two of the alignment marks.

[0031] In a solid-state imaging device according to an eleventh aspect of the present invention, in the tenth aspect, the alignment marks are respectively arranged near at least two corners of the pixel region.

In a twelfth aspect of the present invention, in the solid-state imaging device according to the tenth aspect, the alignment marks are respectively arranged near two mutually orthogonal sides of the pixel region.

In the eleventh and twelfth aspects, examples of the location of the alignment mark are given. With such an arrangement, accurate positioning can be achieved.

According to a thirteenth aspect of the present invention, in the solid-state imaging device according to any one of the first to twelfth aspects, the alignment mark also serves as a measurement pattern for measuring the amount of displacement. .

According to the thirteenth aspect, since the amount of displacement can be known at the time of positioning, the positioning can be performed more easily and quickly.

A method for manufacturing a solid-state imaging device according to a fourteenth aspect of the present invention is directed to a solid-state imaging device having a pixel region including an effective pixel region, and a flare prevention plate for suppressing the incidence of flare light on the effective pixel region. And a package body, and an alignment mark for aligning the solid-state image sensor and the anti-flare plate is previously arranged on the solid-state image sensor, and the solid-state image sensor is mounted on the package body. After fixing, the flare prevention plate is aligned with the alignment mark and fixed to the package body.

According to the fourteenth aspect, since the dedicated alignment pattern arranged on the solid-state imaging device and the light shielding plate are directly aligned, accurate and quick alignment is possible, and the manufacturing is facilitated. At the same time, it is possible to obtain a solid-state imaging device with high image quality.

[0038]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a solid-state imaging device according to the present invention and a method for manufacturing the same will be described with reference to the drawings.

[First Embodiment]

FIG. 1 is a schematic longitudinal sectional view schematically showing a solid-state imaging device according to a first embodiment of the present invention. FIG.
1 is a schematic plan view schematically showing a solid-state imaging device according to the present embodiment. FIG. 3 is an enlarged view of a portion B in FIG.
FIG. 4 is a diagram schematically showing an enlarged portion A in FIG. 2 and 3, the glass plate 17 is omitted. This is the same for FIGS. 5 to 10 and FIG. 12 described later.

The solid-state imaging device 11 according to the present embodiment is
As shown in FIGS. 1 and 2, a solid-state imaging device 12 having a pixel region 23 including an effective pixel region 21, a flare prevention plate 13 for suppressing the incidence of flare light on the effective pixel region 21, and a package body 14 is provided.

As shown in FIGS. 2 and 3, the solid-state imaging device 12 includes an effective pixel area 21 formed substantially in the center and generating an original image signal, and an invalid pixel area 22 formed therearound. , And an alignment mark area 24 formed therearound. The effective pixel area 21 and the invalid pixel area 22 form a pixel area 23.

Each effective pixel 21a of the effective pixel area 21 is
An image signal corresponding to the incident signal light is generated. The pixel 22a of the invalid pixel region 22 is, for example, an optical black pixel that generates a black reference signal without any perceived light, or this signal is used as an image signal even if a signal is output regardless of the presence or absence of perceived light. Pixels that cannot be used. In the present embodiment, the invalid pixel region 22 is formed over the entire circumference of the effective pixel region 21. However, for example, the invalid pixel region 22 may be formed along only two opposing sides of the effective pixel region 21. . The alignment mark area 24 is the solid-state imaging device 1
This is a distribution area in which a plurality of alignment marks 24a for aligning the position 2 with the anti-flare plate 13 are distributed, which will be described later in detail.

As shown in FIG. 1, the solid-state imaging device 12 and the anti-flare plate 13 are fixed to a package main body 14. The solid-state imaging device 12 and the package body 14
They are electrically connected by thin metal wires 15. The thin metal wire 15 is electrically connected to a terminal 16, and the solid-state imaging device 12 is electrically connected to an external device via the terminal 16.

The anti-flare plate 13 is disposed between the solid-state imaging device 12 and the glass plate 17 as shown in FIGS. 1 to 3, and is disposed on the effective pixel area 21 of the solid-state imaging device 12 via the glass plate 17. It has an opening for passing a light beam that is going to be directly incident. In FIGS. 1 to 3, reference numeral 13 a denotes an end face of an opening of the anti-flare plate 3. Flare prevention plate 13
Are configured as light shielding plates. After the solid-state imaging device 12 is fixed to the main body 14 of the package,
Are aligned with the alignment marks 24a of the solid-state imaging device 12 so as to cover the thin metal wires 15 and circuits (not shown) provided around the solid-state imaging device 12, and are fixed to the package body 14. You. Light shield 15
After the is fixed, the top of the package body 14
A glass plate 17 is attached for sealing.

In the present embodiment, as shown in FIGS. 1 and 3, the alignment mark 24a is formed as a whole in a distribution area (alignment mark) located outside the pixel area 23 and along the entire outer edge of the pixel area 23. (Area 24)
Are arranged so that Further, there is substantially no space between the inner edge of the alignment mark area 24 and the outer edge of the pixel area 23.

In this embodiment, the alignment mark 2
Reference numeral 4a denotes a step of forming a microlens of each of the pixels 21a and 22a in the pixel region 23, which is simultaneously formed using a microlens material. Alignment mark 24a
Are arranged so as to be continuously distributed with a width of 20 pixels at the same size as the valid pixels 21a and the invalid pixels 22a (here, the pixel size is 10 μm square). As a result,
The alignment mark area 24 is arranged over the entire circumference of the pixel area 23 with a width L1 of 0.2 mm. Therefore, even if the alignment between the anti-flare plate 13 and the solid-state imaging device 12 is displaced by ± 0.1 mm in the direction of the substrate (the direction in the plane of the paper in FIGS. 2 and 3), the anti-flare plate 13 can be used. It does not reach the invalid pixel area 22. For this reason, there is no possibility that light is shielded from unnecessary portions. Further, by setting the width L1 of the alignment mark area 24 to 0.2 mm (preferably 0.3 mm), the distance L2 between the outer edge of the alignment mark area 24 and the outer edge of the effective pixel area 21 (see FIG. 3 and FIG. 3). (See Fig. 4)
Is set to be 200 microns or more.

In the present embodiment, as shown in FIG. 3, the end face 13a of the opening of the anti-flare plate 13 (the corner 13
b) is located at a position L3 = 0.02 mm outside the outer circumference (outer edge) of the alignment mark area 24, and the corner 13b of the end face 13a is just in contact with the corner of the alignment mark area 24. The dimensions and the like of each part are set such that the position of the anti-flare plate 13 with respect to the alignment mark area 24 becomes the optimum alignment position. In addition,
The radius of curvature of the corner portion 13b of the anti-flare plate 13 is 0.1 mm.
05 millimeters. In FIG. 4, the flare prevention plate 13 located at the optimal alignment position is shown by a solid line.

The anti-flare plate 13 has a thickness d of 0.15 mm and a height h 1 from the surface of the solid-state image sensor 12.
(See FIG. 4) = placed 0.1 mm apart.
This is because the flare prevention plate 13 may be shifted by ± 0.1 mm at the maximum when the tolerance of the thickness and the warpage of the package and the wafer of the solid-state imaging device 12 and the tolerance of the warpage of the flare prevention plate 13 are considered. . If this tolerance becomes smaller, the anti-flare plate 13 is accordingly moved to the solid-state imaging device 1.
2 can be placed even closer. As shown in FIG. 4, the light beam incident on the end face 13 a of the opening of the anti-flare plate 13 is reflected on the end face 13 a and is incident on the solid-state imaging device 12. However, as described above, since the distance L2 between the outer edge of the alignment mark area 24 and the outer edge of the effective pixel area 21 is set to be 200 μm or more (more preferably 300 μm or more), the reflected light is effective. It hardly reaches or hardly reaches the pixel area 21.

This point will be described in detail with reference to FIG. 4 using numerical examples. End face 13 of opening of flare prevention plate 13
The position where the light ray incident on the solid-state image pickup device 12 at an angle θ and reflected by the end face 13a is incident on the solid-state imaging device 12 (hereinafter, simply referred to as a “reflected light incident position”) is shifted in the left-right direction in FIG. It varies depending on the amount L4, the amount of deviation h2 in the vertical direction, and the angle θ. The maximum values of the shift amounts L4 and h2 are determined by manufacturing tolerances. For example, the deviation L4 has a tolerance of ± 0.1 mm, and the deviation h2 has a tolerance of ± 0.1.
Millimeters. When a general lens other than a special lens such as a fisheye lens is used, the angle θ is about 22 ° at the maximum.

Since the deviation h2 has a tolerance of ± 0.1 mm and the angle θ is about 22 ° at the maximum,
The distance L5 in the left-right direction in FIG. 4 between the reflected light incident position and the end face 13a of the flare prevention plate 13 is about 0.15 mm at the maximum. As is clear from FIG. 4, L2 + L
If 3-L4 ≧ L5, the light reflected on the end face 13a does not reach the effective pixel area 21. Therefore, as described above, L3 = 0.02 mm and L5
Is 0.15 mm at the maximum, so L2-
If L4 ≧ 0.13 mm, the light reflected on the end face 13a does not reach the effective pixel area 21.

Therefore, if L2 is set to 300 μm or more, the flare prevention plate 13 shifts in the uppermost direction in FIG. 4 according to the tolerance ± 0.1 mm of the displacement h2, and the tolerance ± 0 of the displacement L4. Even if the anti-flare plate 13 is shifted to the rightmost in FIG. 4 according to 0.1 mm, the light reflected on the end face 13 a does not reach the effective pixel area 21. Further, if L2 is set to 200 microns, even if the anti-flare plate 13 shifts in the uppermost direction in FIG.
The shift amount L4 of the anti-flare plate 13 to the right in the middle is 0.0
If it is 7 mm or less, the reflected light on the end face 13 a does not reach the effective pixel area 21. L2 is 200
When set to microns, the anti-flare plate 13 shifts in the uppermost direction in FIG. 4 according to the tolerance of the deviation amount h2 ± 0.1 mm, and the flare prevention plate 13 moves according to the tolerance of the deviation amount L4 ± 0.1 mm. 4, the light reflected on the end face 13 a is reflected in the effective pixel area 2.
1 will be reached. However, it is practically almost impossible for both the shift amounts h2 and L4 to take the worst value within the tolerance or a value close to the worst value. Therefore, if L2 is set to 200 μm or more, the reflected light at the end face 13a becomes It can be said that it hardly reaches the effective pixel area 21.

The solid-state imaging device 11 according to the present embodiment is
For example, it can be manufactured by the following method. First, the solid-state imaging device 12, the flare prevention plate 13, and the package body 14 are prepared. The alignment mark 24a is previously arranged on the solid-state imaging device 12, as described above.
Next, the solid-state imaging device 12 is fixed to the package body 14, and the thin metal wires 15 are connected. Next, the position of the light shielding plate 13 and the position of the solid-state imaging device 12 are adjusted so that the alignment mark region 24 can be viewed from above. Then, the anti-flare plate 13 is positioned with respect to the solid-state imaging device 12 and fixed to the package body 14 so as to be at or near the above-described optimum position. afterwards,
A glass plate 17 is attached to the top of the package body 14. Thereby, the solid-state imaging device 11 according to the present embodiment
Is completed.

According to the present embodiment, since the alignment between the flare prevention plate 13 and the solid-state imaging device 12 is performed using the alignment mark area 24, the alignment can be performed easily, accurately, and quickly. . Therefore, according to the present embodiment, it is possible to reduce the manufacturing cost and improve the image quality.

Here, the alignment mark 24a is formed of a microlens material, but is not limited to this, and may be formed of, for example, a color filter material.

[Second Embodiment]

FIG. 5 is a schematic plan view schematically showing a solid-state imaging device according to the second embodiment of the present invention, and corresponds to FIG. FIG. 6 is an enlarged view of a portion C in FIG. 5 and 6, the same or corresponding elements as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof will not be repeated.

This embodiment is different from the first embodiment in that the alignment mark 24a in the alignment mark area 24 is 0.1 mm square, which is ten times the pixel size, and the alignment mark 24a is arranged around the pixel area 23 in one line.

In this embodiment, the end face 13a of the opening of the anti-flare plate 13 is positioned so as to overlap the alignment mark 24a as shown in FIG. In this alignment, the alignment mark 24a is not observed at all, or the alignment mark 2
If the entirety of 4a is exposed, it can be easily found that the alignment is largely shifted. Therefore, according to the present embodiment, the size of the alignment mark 24a (here,
It is possible to reduce the alignment error to about 0.1 mm). Also, the alignment mark 24a
Is larger than the pixels 21a and 22a, the alignment mark 24a can be easily identified.

Except for this point, the present embodiment also provides the same advantages as the first embodiment.

[Third Embodiment]

FIG. 7 is a partially enlarged schematic plan view schematically showing a solid-state imaging device according to a third embodiment of the present invention, and corresponds to FIG. In FIG. 7, FIGS.
The same reference numerals are given to the same or corresponding elements as the elements in and, and the overlapping description will be omitted.

In this embodiment, as in the second embodiment, in the alignment mark area 24a, the alignment marks 24a larger than the pixels 21a and 22a are formed.
Are distributed. However, unlike the second embodiment, the position where the end face 13a of the opening of the anti-flare plate 13 is located with respect to the alignment mark area 24 in the same manner as in the first embodiment is the optimum alignment position. The dimensions and the like of each part are set so as to be as follows.

According to the present embodiment, it is possible to obtain an advantage that the alignment mark 24a can be easily identified while obtaining the same advantage as the first. Note that also in the present embodiment, the distance L2 between the outer edge of the alignment mark area 24 and the outer edge of the effective pixel area 21 is
It is 200 microns or more.

[Fourth Embodiment]

FIG. 8 is a schematic plan view schematically showing a solid-state imaging device according to a fourth embodiment of the present invention, and corresponds to FIG. FIG. 9 is an enlarged view of a portion D in FIG. 8 and 9, the same or corresponding elements as those in FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description will be omitted.

This embodiment is different from the first embodiment in that the alignment marks 24a are arranged in one row (or two or more rows) around the pixel area 23 in the alignment mark area 24, and alignment is performed. Mark area 2
This is a point where an interval L5 is provided between the inner periphery (inner edge) of the alignment mark region 24 and the outer periphery (outer edge) of the pixel region 23 so that the pixel region 23 and the pixel region 23 can be distinguished.

In the present embodiment, as shown in FIG. 9, the end face 13a of the opening of the flare prevention plate 13 (the corner 13
b) is set so that the position of the anti-flare plate 13 with respect to the alignment mark area 24 is substantially the same as the inner circumference (inner edge) of the alignment mark area 24 and the optimal alignment position. Have been. In the present embodiment, the distance L6 between the inner edge of the alignment mark area 24 and the outer edge of the effective pixel area 21 is
It is set to 200 microns or more.

According to this embodiment, advantages similar to those of the first embodiment can be obtained. Further, according to the present embodiment, while the size of the alignment mark 24a in the alignment mark area 24 is the same as that of the pixels 21a and 22a, the alignment mark area 2
4 can be easily identified.

This embodiment may be modified as follows, for example. The position of the alignment mark region 24 may be set such that the end surface 13 a of the opening of the flare prevention plate 13 is positioned so as to overlap the alignment mark region 24. Further, the alignment mark 24a in the alignment mark area 24 may be larger than the pixels 21a and 22a. Further, the position of the anti-flare plate 13 with respect to the alignment mark area 24 is such that the end face 13a (excluding the corner 13b) of the opening of the anti-flare plate 13 substantially matches the outer periphery (outer edge) of the alignment mark area 24. The dimensions and the like of each part may be set so as to provide a proper alignment position. In this case, the distance between the outer edge of the alignment mark 24a and the outer edge of the effective pixel area 21 is
It may be set to 200 microns or more. Even in these cases, advantages similar to those of the present embodiment can be obtained.

[Fifth Embodiment]

FIG. 10 is a schematic plan view schematically showing a solid-state imaging device according to a fifth embodiment of the present invention.
It corresponds to. FIG. 11 is a diagram showing examples of various patterns of the alignment mark. In FIG. 10, FIG.
Elements that are the same as or correspond to the elements in FIG. 4 to FIG. 4 are denoted by the same reference numerals, and redundant description is omitted.

This embodiment is different from the first embodiment only in the arrangement of the alignment marks 31 to 37.

In the first embodiment, a plurality of alignment marks 24a are arranged so as to form a distribution area (alignment mark area 24) which is located over the entire outer periphery of the pixel area 23. Was. On the other hand, in the present embodiment, the seven alignment marks 31
37 are respectively arranged in the vicinity of seven locations on the solid-state imaging device 12 which are scattered.

The alignment marks 31 to 35 are arranged near each side of the pixel area 23, respectively. The alignment marks 36 and 37 are arranged near each corner of the pixel region 23, respectively. The alignment marks 31 and 32 have a cross-shaped pattern shown in FIG. The alignment marks 33 to 35 are shown in FIG.
It has a pattern of the shape of "one" shown in FIG. The alignment marks 36 and 37 have a circular pattern shown in FIG. For example, instead of the alignment marks 36 and 37, an alignment mark having an arc-shaped pattern shown in FIG. Also, for example, instead of the alignment marks 31 to 35,
An alignment mark having a substantially rhombic pattern having steps on each side shown in FIG. 11E may be arranged.

The patterns shown in FIGS. 11C and 11D are suitable for aligning the corners 13 b of the opening of the anti-flare plate 13. It is more preferable to make the curvature of the alignment mark coincide with the curvature of the corner portion 13b of the flare prevention plate 13 because the alignment can be performed accurately. In the patterns shown in FIGS. 11B and 11C, since the length of the pattern is known, the amount of misalignment can be roughly determined. Furthermore, if the pattern of FIG. 11E is used, since the dimensions of the step portion are known,
It can be used as a measurement pattern for measuring the amount of misalignment, thereby making it possible to measure the amount of misalignment.

In the present embodiment, the end face 13a and the corner 13b of the anti-flare plate 13 are formed as shown in FIG.
By aligning the anti-flare plate 13 with the solid-state imaging device 12 accurately and promptly, the alignment marks 31 to 37 can be aligned with predetermined positions.

Of course, the alignment marks 31 to 37
Need not be arranged on the solid-state imaging device 12, and at least two marks may be arranged on the solid-state imaging device 12. For example, two alignment marks 36, 3
Only 7 may be arranged near each of the two corners of the pixel region 23. Alternatively, for example, only the two alignment marks 33 and 35 may be arranged near two mutually orthogonal sides of the pixel region 23. Even in these cases, accurate positioning can be performed.

According to this embodiment, basically, the same advantages as those of the first embodiment can be obtained.

[Sixth Embodiment]

FIG. 12 is a schematic plan view schematically showing a solid-state imaging device according to the sixth embodiment of the present invention. FIG.
FIG. 2 also shows enlarged views of portions E to I in the plan view. 12, the same or corresponding elements as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof will not be repeated.

In FIG. 12, for simplification of the drawing, the end face 13a of the opening of the anti-flare plate 13 is shown only in an enlarged view of each part. FIG. 12 shows a region 41 of a light-shielding film such as an Al film formed in a peripheral portion of a peripheral circuit and the like and the optical black region in the invalid pixel region 22 in the solid-state imaging device 12. Such a light-shielding film similarly exists in each of the above-described embodiments, but is omitted in each of the above-described drawings. In FIG. 12, this light shielding film region 4
The position of the end face 13a of the opening of the anti-flare plate 13 is shown with reference to the inner peripheral edge 41a of FIG. In FIG. 12, the invalid pixel region 22 is omitted. In FIG. 12, O indicates the center of the effective pixel area 21 and defines an X axis and a Y axis which pass through the center and are orthogonal to each other.

This embodiment is basically different from the first embodiment only in the arrangement of the alignment marks. In the present embodiment, the alignment mark 42 of a relatively narrow rectangular pattern and the alignment mark 43 of a relatively wide rectangular pattern partially provided with a step form a pair, A pair of alignment marks 42 and 43 are arranged near each of the five spots (E to I). Each of the portions E to I is located near each side of the inner peripheral edge 41a of the light-shielding film region 41, and is therefore located near each side of the pixel region 23 not shown in FIG. .

At least two pairs of marks 42 and 43 arranged on two sides are used for alignment among the alignment marks 42 and 43 of each part (E part to I part). The remaining pair of marks 42 and 43 are used for measuring a deviation from the flare prevention plate 13. Even if the two pairs of marks 42 and 43 allow accurate alignment, the position of the flare prevention plate 13 on the remaining side may be shifted due to a manufacturing error of the flare prevention plate 13. The pattern of the present embodiment is suitable for confirming such a situation.

The alignment of the flare prevention plate 13 is performed by aligning the side of the alignment mark 43 facing the alignment mark 42 with the end face 13 a of the opening of the flare prevention plate 13. Alignment mark 4
Since the dimensions of the sides 2 and 43 are known, the shift amount can be confirmed by observing where the end face 13a of the opening of the flare prevention plate 13 crosses.

In the present embodiment, the dimension L7 in FIG. 12 is set to, for example, 320 μm, and the distance between the side of the alignment mark 43 for positioning which is opposite to the mark 42 and the outer edge of the effective pixel area 21 is set. , 300 microns or more.

Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments. For example, the present invention is not limited to the numerical examples described in the embodiments.

[0088]

As described above, in the solid-state imaging device according to the present invention, the exclusive alignment mark for aligning the position with the anti-flare plate is arranged on the solid-state imaging device.
Accurate and quick alignment becomes possible. For this reason, there is an effect that the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic vertical sectional view schematically showing a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view schematically showing the solid-state imaging device shown in FIG.

FIG. 3 is an enlarged view of a portion B in FIG. 2;

FIG. 4 is an enlarged view schematically showing a portion A in FIG. 1;

FIG. 5 is a schematic plan view schematically showing a solid-state imaging device according to a second embodiment of the present invention.

FIG. 6 is an enlarged view of a portion C in FIG. 5;

FIG. 7 is a partially enlarged schematic plan view schematically showing a solid-state imaging device according to a third embodiment of the present invention.

FIG. 8 is a schematic plan view schematically showing a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 9 is an enlarged view of a D part in FIG. 8;

FIG. 10 is a schematic plan view schematically showing a solid-state imaging device according to a fifth embodiment of the present invention.

FIG. 11 is a diagram showing examples of various patterns of an alignment mark.

FIG. 12 is a schematic plan view schematically showing a solid-state imaging device according to a sixth embodiment of the present invention.

FIG. 13 is a schematic vertical sectional view schematically showing a conventional solid-state imaging device.

14 is a schematic longitudinal sectional view schematically showing a state in which a flare prevention plate has been removed from the solid-state imaging device shown in FIG. 13;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Solid-state imaging device 12 Solid-state image sensor 13 Flare prevention plate 13a End face of opening 14 Package body 15 Thin metal wire 16 Terminal 21 Effective pixel area 22 Invalid pixel area 23 Pixel area 24 Alignment mark area 24 24a, 31-37, 42, 43 Alignment mark

Claims (6)

[Claims] 1. A solid-state imaging device having a pixel region including an effective pixel region, a flare preventing plate for suppressing incidence of flare light on the effective pixel region, and the solid-state imaging device and the flare preventing plate are fixed. A solid-state imaging device, comprising: a package body; and an alignment mark for aligning the solid-state imaging element and the flare prevention plate is arranged on the solid-state imaging element. 2. A plurality of the alignment marks are arranged as a whole so as to form a distribution area located along substantially the entire outer edge of the pixel area outside the pixel area. 2. The solid-state imaging device according to claim 1, wherein substantially no space is left between the pixel region and an outer edge of the pixel region. 3. A plurality of the alignment marks are arranged so as to form a distribution area located along substantially the entire outer edge of the pixel area outside the pixel area as a whole, wherein the distribution area and the pixel area 2. The solid-state imaging device according to claim 1, wherein an interval is provided between an inner edge of the distribution area and an outer edge of the pixel area so as to be able to discriminate. 4. The solid-state imaging device according to claim 1, wherein the alignment marks are arranged near a plurality of spots on the solid-state imaging device that are scattered. 5. The solid-state imaging device according to claim 1, wherein the alignment mark also serves as a measurement pattern for measuring a displacement amount. 6. A solid-state imaging device having a pixel region including an effective pixel region, a flare prevention plate for suppressing light that becomes flare from entering the effective pixel region, and a package body are prepared. An alignment mark for aligning the solid-state imaging device and the anti-flare plate is arranged in advance, and after fixing the solid-state imaging device to the package body, the anti-flare plate is attached to the alignment mark. A method of manufacturing the solid-state imaging device, wherein the solid-state imaging device is aligned and fixed to the package body.