JP2002334911A5 - - Google Patents
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- Publication number
- JP2002334911A5 JP2002334911A5 JP2002031015A JP2002031015A JP2002334911A5 JP 2002334911 A5 JP2002334911 A5 JP 2002334911A5 JP 2002031015 A JP2002031015 A JP 2002031015A JP 2002031015 A JP2002031015 A JP 2002031015A JP 2002334911 A5 JP2002334911 A5 JP 2002334911A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002031015A JP3990575B2 (ja) | 2001-03-05 | 2002-02-07 | 膜厚測定用モニタウェハ |
| TW091103444A TW522451B (en) | 2001-03-05 | 2002-02-26 | Monitoring wafer for measuring film thickness |
| PCT/JP2002/001956 WO2002071473A1 (en) | 2001-03-05 | 2002-03-04 | Film thichness measuring monitor wafer |
| KR1020037011256A KR100607890B1 (ko) | 2001-03-05 | 2002-03-04 | 막두께 측정용 모니터 웨이퍼 |
| US10/468,899 US7087980B2 (en) | 2001-03-05 | 2002-03-04 | Film thickness measuring monitor wafer |
| EP02701695A EP1408544B1 (en) | 2001-03-05 | 2002-03-04 | Film thichness measuring monitor wafer |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-60367 | 2001-03-05 | ||
| JP2001060367 | 2001-03-05 | ||
| JP2002031015A JP3990575B2 (ja) | 2001-03-05 | 2002-02-07 | 膜厚測定用モニタウェハ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002334911A JP2002334911A (ja) | 2002-11-22 |
| JP2002334911A5 true JP2002334911A5 (enExample) | 2005-08-18 |
| JP3990575B2 JP3990575B2 (ja) | 2007-10-17 |
Family
ID=26610632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002031015A Expired - Fee Related JP3990575B2 (ja) | 2001-03-05 | 2002-02-07 | 膜厚測定用モニタウェハ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7087980B2 (enExample) |
| EP (1) | EP1408544B1 (enExample) |
| JP (1) | JP3990575B2 (enExample) |
| KR (1) | KR100607890B1 (enExample) |
| TW (1) | TW522451B (enExample) |
| WO (1) | WO2002071473A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006090432A1 (ja) * | 2005-02-22 | 2006-08-31 | Neomax Co., Ltd. | ＳｉＣ単結晶基板の製造方法 |
| DE102010006725B4 (de) | 2010-02-03 | 2016-03-03 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe aus Silizium mit einer epitaktisch abgeschiedenen Schicht |
| US8298609B1 (en) * | 2010-06-14 | 2012-10-30 | Wd Media, Inc. | Method and system for interrogating the thickness of a carbon layer |
| DE112016007041B4 (de) * | 2016-07-04 | 2022-09-29 | Mitsubishi Electric Corporation | Herstellungsverfahren für eine halbleitervorrichtung |
| WO2018159754A1 (ja) * | 2017-03-02 | 2018-09-07 | 信越化学工業株式会社 | 炭化珪素基板の製造方法及び炭化珪素基板 |
| US11043437B2 (en) * | 2019-01-07 | 2021-06-22 | Applied Materials, Inc. | Transparent substrate with light blocking edge exclusion zone |
| US12077880B2 (en) * | 2021-04-28 | 2024-09-03 | Applied Materials, Inc. | In-situ film growth rate monitoring apparatus, systems, and methods for substrate processing |
| FR3148671A1 (fr) * | 2023-05-12 | 2024-11-15 | Soitec | Procédé de fabrication d’une pluralité de substrats de carbure de silicium polycristallin |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316283A (ja) * | 1995-05-19 | 1996-11-29 | Kobe Steel Ltd | ダミーウエハー |
| SG71903A1 (en) * | 1998-01-30 | 2000-04-18 | Canon Kk | Process of reclamation of soi substrate and reproduced substrate |
| JP2000349264A (ja) * | 1998-12-04 | 2000-12-15 | Canon Inc | 半導体ウエハの製造方法、使用方法および利用方法 |
| JP2000349266A (ja) * | 1999-03-26 | 2000-12-15 | Canon Inc | 半導体部材の製造方法、半導体基体の利用方法、半導体部材の製造システム、半導体部材の生産管理方法及び堆積膜形成装置の利用方法 |
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2002
- 2002-02-07 JP JP2002031015A patent/JP3990575B2/ja not_active Expired - Fee Related
- 2002-02-26 TW TW091103444A patent/TW522451B/zh not_active IP Right Cessation
- 2002-03-04 WO PCT/JP2002/001956 patent/WO2002071473A1/ja not_active Ceased
- 2002-03-04 US US10/468,899 patent/US7087980B2/en not_active Expired - Lifetime
- 2002-03-04 EP EP02701695A patent/EP1408544B1/en not_active Expired - Lifetime
- 2002-03-04 KR KR1020037011256A patent/KR100607890B1/ko not_active Expired - Fee Related