JP2002333436A - Nondestructive inspection device of sheet - Google Patents
Nondestructive inspection device of sheetInfo
- Publication number
- JP2002333436A JP2002333436A JP2001139920A JP2001139920A JP2002333436A JP 2002333436 A JP2002333436 A JP 2002333436A JP 2001139920 A JP2001139920 A JP 2001139920A JP 2001139920 A JP2001139920 A JP 2001139920A JP 2002333436 A JP2002333436 A JP 2002333436A
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- detecting means
- destructive inspection
- signal extracted
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、簡単な構造で、
かつ高精度に薄板の割れ状欠陥の有無を判定する非破壊
検査装置に関するものである。The present invention relates to a simple structure,
The present invention also relates to a non-destructive inspection device that determines the presence or absence of a crack defect in a thin plate with high accuracy.
【0002】[0002]
【従来の技術】薄板の非破壊検査を行う先行技術とし
て、例えば特開平5−312792では、超音波振動子
をアレイ状に配列して電子走査により超音波ビームを送
信し、反射信号の振幅値により、薄板の割れ状欠陥の有
無を検査している。2. Description of the Related Art As a prior art for performing nondestructive inspection of a thin plate, for example, in Japanese Patent Application Laid-Open No. 5-31792, an ultrasonic transducer is arranged in an array, an ultrasonic beam is transmitted by electronic scanning, and an amplitude value of a reflected signal is obtained. Is inspected for the presence or absence of cracks in the thin plate.
【0003】また、特開平10−82778では、送気
孔と吸気孔を備えたテーブルの上に薄板を載せて薄板の
裏面にエアを送出して割れている個所の薄板を浮上さ
せ、この状態でエアを吸気すると薄板が吸着せずに真空
度が上がらないことから、薄板に割れ有りと判定する。In Japanese Patent Application Laid-Open No. H10-82778, a thin plate is placed on a table provided with an air supply hole and an air intake hole, and air is sent out to the back surface of the thin plate to float a broken thin plate. When air is taken in, the thin plate is not adsorbed and the degree of vacuum does not increase. Therefore, it is determined that the thin plate has a crack.
【0004】[0004]
【発明が解決しようとする課題】しかしながら上記公知
例において、特開平5−312792では、超音波アレ
イの大きさよりも大きな薄板を検査対象とする場合、検
査時に超音波アレイを移動させる必要があり、複雑な構
造となる。However, in the above-mentioned known example, Japanese Patent Application Laid-Open No. 5-322792 discloses that when a thin plate larger than the size of the ultrasonic array is to be inspected, it is necessary to move the ultrasonic array during the inspection. It has a complicated structure.
【0005】また、特開平10−82778では、構造
は簡単であるが、小さな割れ状欠陥があるものの完全に
割れていないような場合には、薄板が吸着してしまうた
め、割れ状欠陥の検出が困難である。In Japanese Patent Application Laid-Open No. Hei 10-82778, the structure is simple. Is difficult.
【0006】この発明は、上記の点に鑑みてなされたも
のであり、構造が簡単で、かつ高精度に薄板の割れ状欠
陥の有無を判定する非破壊検査装置を得ることを目的と
する。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide a nondestructive inspection apparatus which has a simple structure and which accurately determines the presence or absence of a crack in a thin plate.
【0007】[0007]
【課題を解決するための手段】本発明に係わる請求項1
の薄板の非破壊検査装置は、薄板を設置する支持手段
と、薄板に外力を加える打撃手段と、薄板から発生する
打音の音圧または振動のいずれか一方または双方の信号
を取り出す検出手段と、前記検出手段により取り出され
た打音信号を解析し複数の特徴量データを求める算出手
段と、前記特徴量データにより、薄板の割れ状欠陥の有
無を判定する判定手段と、を有することを特徴とする。A first aspect of the present invention.
The thin sheet nondestructive inspection apparatus includes a supporting means for installing the thin sheet, a striking means for applying an external force to the thin sheet, and a detecting means for extracting one or both signals of sound pressure or vibration of a tapping sound generated from the thin sheet. Calculating means for analyzing a tapping signal extracted by the detecting means to obtain a plurality of feature data; and determining means for determining the presence or absence of a crack-like defect in a thin plate based on the feature data. And
【0008】本発明に係わる請求項2の薄板の非破壊検
査装置は、請求項1において、支持手段が、薄板の裏面
より3点または4点のいずれかで支持し、薄板に対する
支持位置を変更する機能を有するものである。前記支持
位置は、割れ状欠陥を検出しやすいように決定し、単一
または複数の組み合わせを用いる。According to a second aspect of the present invention, there is provided a non-destructive inspection apparatus for a thin plate according to the first aspect, wherein the supporting means supports the thin plate at any of three or four points from a back surface thereof and changes a supporting position with respect to the thin plate. It has a function to perform. The supporting position is determined so that the crack-like defect can be easily detected, and a single or a plurality of combinations are used.
【0009】本発明に係わる請求項3の薄板の非破壊検
査装置は、請求項1または2において、打撃手段が、薄
板の裏面または表面から外力を瞬間的に加える機能を有
するものである。前記外力の大きさは、割れ状欠陥を検
出しやすいように決定する。According to a third aspect of the present invention, in the nondestructive inspection apparatus for a thin plate according to the first or second aspect, the striking means has a function of instantly applying an external force from the back surface or the front surface of the thin plate. The magnitude of the external force is determined so that the crack-like defect can be easily detected.
【0010】本発明に係わる請求項4の薄板の非破壊検
査装置は、請求項1ないし3のいずれかにおいて、算出
手段は、検出手段より取り出した信号を時間周波数解析
して、単位時間毎の単位周波数成分の振幅にてなる特徴
量データを求めるものである。According to a fourth aspect of the present invention, there is provided a non-destructive inspection apparatus for a thin plate according to any one of the first to third aspects, wherein the calculating means performs time-frequency analysis of the signal taken out from the detecting means, and performs a This is to obtain feature amount data composed of the amplitude of the unit frequency component.
【0011】本発明に係わる請求項5の薄板の非破壊検
査装置は、請求項1ないし3のいずれかにおいて、算出
手段は、検出手段より取り出した信号を整流および包絡
線処理して、単位時間毎の振幅にてなる特徴量データを
求めるものである。According to a fifth aspect of the present invention, there is provided a nondestructive inspection apparatus for a thin plate according to any one of the first to third aspects, wherein the calculating means performs rectification and envelope processing on the signal taken out from the detecting means, and performs unit time processing. This is to obtain feature amount data having each amplitude.
【0012】本発明に係わる請求項6の薄板の非破壊検
査装置は、請求項1ないし3のいずれかにおいて、算出
手段は、検出手段より取り出した信号を周波数解析し
て、単位周波数毎の振幅にてなる特徴量データを求める
ものである。According to a sixth aspect of the present invention, in the non-destructive inspection apparatus for a thin plate according to any one of the first to third aspects, the calculating means analyzes the frequency of the signal taken out from the detecting means to obtain an amplitude for each unit frequency. Is used to obtain feature amount data.
【0013】また、本発明に係わる請求項7の薄板の非
破壊検査装置は、請求項1ないし6のいずれかにおい
て、算出手段は、検出手段より取り出した信号をフィル
タ処理して、異常信号を強調し、特徴量データを求める
ものである。According to a seventh aspect of the present invention, there is provided a thin plate nondestructive inspection apparatus according to any one of the first to sixth aspects, wherein the calculating means filters a signal taken out from the detecting means to remove an abnormal signal. The emphasis is used to obtain feature amount data.
【0014】[0014]
【発明の実施の形態】実施の形態1.以下、本発明の実
施の形態を図により説明する。図1は本発明の実施の形
態1による薄板の非破壊検査装置の構成を示す図であ
る。図において、Wは検査対象の薄板である。1は検査
対象Wに外力を加える打撃手段であり、例えば、検査対
象の中央に設けられる。また、前記打撃手段1は、例え
ば、エアシリンダなどを駆動源として、押出しの勢いで
先端に設けたコマを飛出させて検査対象Wに裏面より衝
突させる機構などが用いられる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a configuration of a thin plate nondestructive inspection apparatus according to Embodiment 1 of the present invention. In the figure, W is a thin plate to be inspected. 1 is a striking means for applying an external force to the inspection target W, and is provided, for example, at the center of the inspection target. The hitting means 1 employs, for example, a mechanism that uses an air cylinder or the like as a driving source to cause a top provided at the tip to fly out by the force of pushing and to collide against the inspection target W from the back surface.
【0015】2は検査対象を設置する支持手段であり、
例えば、検査対象Wの端面に近いP 1〜P8の8個所に
設けられる。また、前記支持手段2は、エアシリンダな
どにより支持点を上下に駆動させることで支持位置を変
更できる機構などが用いられる。3点支持の場合の支持
位置は、例えば、P1−P3−P7、P1−P5−
P 6、P2−P6−P8、P3−P4−P8の4通りの
組み合わせから、割れ状欠陥を検出しやすいように単一
または複数の組み合わせを決定する。また、4点支持の
場合の支持位置は、例えば、P1−P3−P6−P8、
P2−P4−P5−P7の2通りの組み合わせから、割
れ状欠陥を検出しやすいように一方または双方の組み合
わせを決定する。Reference numeral 2 denotes a support means for setting an inspection object.
For example, P close to the end face of the inspection target W 1~ P8In eight places
Provided. The support means 2 is an air cylinder.
The support position can be changed by driving the support point
A mechanism that can be changed is used. Support in case of three-point support
The position is, for example, P1−P3−P7, P1−P5−
P 6, P2−P6−P8, P3−P4−P8Of the four
From the combination, it is easy to detect cracked defects
Or determine a plurality of combinations. In addition, four-point support
The supporting position in the case is, for example, P1−P3−P6−P8,
P2−P4−P5−P7From the two combinations of
One or a combination of both to make it easier to detect
To decide.
【0016】3は検査対象Wから打音信号を取り出す検
出手段であり、例えば、マイクロホンまたはレーザドッ
プラ振動計などの変換器と、この変換器に接続され、変
換器の信号を増幅するためのアンプ回路と、このアンプ
回路に接続され、アンプ回路よりの信号の雑音の除去お
よび複数の周波数成分に信号の分離を行うフィルタ回路
と、このフィルタ回路に接続され、フィルタ回路の信号
を取り込むA/D変換回路により構成される。Reference numeral 3 denotes detection means for extracting a tapping signal from the test object W. For example, a converter such as a microphone or a laser Doppler vibrometer, and an amplifier connected to the converter for amplifying the signal of the converter Circuit, a filter circuit connected to the amplifier circuit, for removing noise of the signal from the amplifier circuit and separating the signal into a plurality of frequency components, and an A / D connected to the filter circuit to capture the signal of the filter circuit It is composed of a conversion circuit.
【0017】4は検出手段3により取り出した打音信号
を解析し複数の特徴量データを求める算出手段であり、
例えば電子計算機搭載のCPUやDSPなどが用いられ
る。Numeral 4 is a calculating means for analyzing the tapping sound signal extracted by the detecting means 3 to obtain a plurality of feature data.
For example, a CPU or DSP mounted on an electronic computer is used.
【0018】5は算出手段4により求められた特徴量デ
ータの判別を行い、検査対象Wの割れ状欠陥の有無を判
定する判別手段であり、例えば、ニューラルネットワー
クなどが用いられる。Numeral 5 is a discriminating means for discriminating the characteristic amount data obtained by the calculating means 4 and for judging the presence or absence of a crack-like defect in the inspection object W. For example, a neural network or the like is used.
【0019】上記のように構成された実施の形態1によ
る薄板の非破壊検査装置の動作を図2のフローチャート
により説明する。先ず、検査対象Wを支持手段2の上に
準備する(ステップS1)。次に、検査対象Wに対する支
持位置を変更するかを判断する(ステップS2)。次に、
打撃手段1により、検査対象Wに力を加える(ステップ
S3)。The operation of the thin plate nondestructive inspection apparatus according to the first embodiment configured as described above will be described with reference to the flowchart of FIG. First, an inspection target W is prepared on the support means 2 (step S1). Next, it is determined whether to change the support position for the inspection target W (step S2). next,
A force is applied to the inspection target W by the striking means 1 (step S3).
【0020】次に、検出手段3により検査対象の打音信
号を取り出し、算出手段4に打音信号を取り込む(ステ
ップS4)。次に算出手段4に取り込んだ打音信号を解
析し複数の特徴量データを求める(ステップS5)。次
に、検査対象Wに対する支持位置を変更するかを判断す
る(ステップS6)。支持位置を変更する場合、図2のス
テップS2に戻り、支持手段2の支持位置を変更する。
支持位置を変更しない場合は、判別手段5において特徴
量データの判別を行い、検査対象Wの割れ状欠陥の有無
を判定する(ステップS7)。Next, the tapping signal to be inspected is extracted by the detecting means 3, and the tapping signal is input to the calculating means 4 (step S4). Next, the hammering signal taken into the calculating means 4 is analyzed to obtain a plurality of feature data (step S5). Next, it is determined whether to change the support position for the inspection target W (step S6). When changing the support position, the process returns to step S2 in FIG. 2 to change the support position of the support means 2.
If the support position is not changed, the determination means 5 determines the characteristic amount data, and determines whether or not the inspection target W has a crack defect (step S7).
【0021】ここで、実際の検査対象Wに外力を加えて
発生した打音の検出手段3による信号およびこの信号の
特徴量データの解析について説明する。まず、ここで
は、特徴量データを時間周波数解析の一手法としての短
時間高速フーリエ変換により得ることとする。図3には
割れ状欠陥の無い薄板のデータ、また、図4には割れ状
欠陥の有る薄板のデータを示す。図3(a)および図4
(a)に検出手段3の信号を、そしてこれら各信号を短時
間高速フーリエ変換し、各特徴量データとしたものを図
3(b)および図4(b)にそれぞれ示す。また、検出手段
3の信号をフイルタ処理して異常信号を強調したものを
図3(c)および図4(c)にそれぞれ示す。Here, the analysis of the signal by the tapping sound detecting means 3 generated by applying an external force to the actual test object W and the characteristic amount data of the signal will be described. First, here, it is assumed that feature amount data is obtained by short-time fast Fourier transform as one method of time-frequency analysis. FIG. 3 shows data of a thin plate having no crack-like defect, and FIG. 4 shows data of a thin plate having a crack-like defect. FIG. 3 (a) and FIG.
FIGS. 3A and 4B show the signals of the detecting means 3 in FIG. 3A, and short-time Fourier transform of these signals to obtain respective feature data. FIGS. 3 (c) and 4 (c) show an example in which the signal of the detection means 3 is filtered to emphasize the abnormal signal.
【0022】図3(a)および図4(a)のグラフは、横軸
に時間、縦軸に電圧を示している。また、図3(b)およ
び図4(b)のグラフは、横軸に時間、縦軸に周波数を示
しており、短時間高速フーリェ変換によるデータがマト
リックス状に得られていることが確認できる。そして、
このマトリックス状に得られている単位時間毎の単位周
波数成分の振幅のレベルは色の濃淡で示され、白い色ほ
どレベルが高く、黒い色ほどレベルが低いものとしてい
る。図3(c)および図4(c)のグラフは、横軸に時間、
縦軸に電圧を示している。In the graphs of FIGS. 3A and 4A, the horizontal axis represents time, and the vertical axis represents voltage. The graphs of FIG. 3B and FIG. 4B show time on the horizontal axis and frequency on the vertical axis, and it can be confirmed that data by short-time fast Fourier transform is obtained in a matrix. . And
The level of the amplitude of the unit frequency component for each unit time obtained in the form of a matrix is represented by the shading of the color. The level is higher for a white color and lower for a black color. The graphs of FIG. 3 (c) and FIG. 4 (c) show time on the horizontal axis,
The vertical axis shows the voltage.
【0023】このようにして得られたデータから良否の
差が大きい範囲を抽出し、例えば、ニューラルネットワ
ークに入力する。ニユーラルネットワークで良否のパタ
ーンを学習していくことにより、検査対象Wの割れ状欠
陥の有無を判定する。A range in which the difference between good and bad is large is extracted from the data obtained in this way, and input to, for example, a neural network. The presence / absence of a crack defect in the inspection target W is determined by learning the pass / fail pattern using the neural network.
【0024】実施の形態2.また、上記実施の形態1に
おいては、検査対象Wは矩形の薄板で示したが、これに
限られることはなく、例えば、円形の薄板でもよい。こ
の場合、支持手段2は薄板の周縁近傍に配置することに
より、上記実施の形態1と同様の効果を奏することは言
うまでもない。Embodiment 2 FIG. In the first embodiment, the inspection target W is shown as a rectangular thin plate. However, the present invention is not limited to this. For example, a circular thin plate may be used. In this case, it is needless to say that the same effect as in the first embodiment can be obtained by disposing the support means 2 near the peripheral edge of the thin plate.
【0025】実施の形態3.また、上記実施の形態1に
おいては、打撃手段1は検査対象Wの中央Iに位置させ
たが、これに限られることはなく、いずれの場所でもよ
い。Embodiment 3 Further, in the first embodiment, the hitting means 1 is located at the center I of the inspection target W. However, the present invention is not limited to this, and may be at any place.
【0026】実施の形態4.また、上記実施の形態1に
おいては、打撃手段1はエアシリンダなどを駆動源とし
て、押出しの勢いで先端に設けたコマを飛出させて検査
対象Wに裏面より衝突させる機構で示したが、これに限
られることはなく、例えば、棒の先にシリコンゴムを取
り付けたハンマーにより、検査対象Wの表面に対して叩
きつける機構を用いてもよい。Embodiment 4 Further, in the first embodiment, the hitting means 1 is described as a mechanism in which an air cylinder or the like is used as a driving source to cause the top provided at the tip to fly out by the force of the pushing and collide against the inspection target W from the back surface. The present invention is not limited to this. For example, a mechanism that strikes the surface of the inspection target W with a hammer in which silicon rubber is attached to the tip of a rod may be used.
【0027】実施の形態5.また、上記実施の形態1に
おいては、支持手段2はエアシリンダなどにより支持点
を上下に駆動させることで支持位置を変更できる機構で
示したが、これに限られることはなく、例えば、支持手
段2を3箇所または4箇所のいずれかに固定し、検査対
象Wを回転移動させることで検査対象Wに対する支持位
置を変更する機構を用いてもよい。Embodiment 5 FIG. In the first embodiment, the support means 2 is described as a mechanism capable of changing the support position by driving the support point up and down by an air cylinder or the like. However, the present invention is not limited to this. 2 may be fixed to any of three or four locations, and a mechanism for changing the support position of the inspection target W by rotating the inspection target W may be used.
【0028】実施の形態6.また、上記実施の形態1に
おいては、時間周波数解析によるデータを特徴量データ
として示したが、これに限られることはなく、例えば、
整流および包絡線処理による単位時間毎の振幅データや
周波数解析による単位周波数毎の振幅データを特徴量デ
ータとしてもよい。Embodiment 6 FIG. Further, in the first embodiment, the data based on the time-frequency analysis is shown as the feature amount data. However, the present invention is not limited to this.
The amplitude data per unit time by the rectification and the envelope processing or the amplitude data per unit frequency by the frequency analysis may be used as the feature amount data.
【0029】実施の形態7.また、上記実施の形態1に
おいては、検出手段3による信号を直接解析する方法で
示したが、これに限られることはなく、例えば、図3
(c)および図4(c)のように、フィルタ処理をして異常
信号を強調した信号を解析して特徴量データを得る方法
にしてもよい。Embodiment 7 Further, in the first embodiment, the method of directly analyzing the signal by the detecting means 3 has been described. However, the present invention is not limited to this.
As shown in (c) and FIG. 4 (c), a method may be used in which a signal obtained by performing a filtering process and emphasizing an abnormal signal is analyzed to obtain feature amount data.
【0030】[0030]
【発明の効果】以上のように、本発明の請求項1によれ
ば、薄板を設置する支持手段と、薄板に外力を加える打
撃手段と、薄板から発生する打音の音圧または振動のい
ずれか一方または双方の信号を取り出す検出手段と、前
記検出手段により取り出された打音信号を解析し複数の
特徴量データを求める算出手段と、前記特徴量データに
より、薄板の割れ状欠陥の有無を判定する判定手段を備
えたので、構造が簡単で、かつ高精度に薄板の割れ状欠
陥の有無を判定する非破壊検査装置を得ることが可能と
なる。As described above, according to the first aspect of the present invention, any one of the supporting means for installing the thin plate, the striking means for applying an external force to the thin plate, and the sound pressure or vibration of the striking sound generated from the thin plate. Detecting means for extracting one or both of the signals, calculating means for analyzing a hammering signal extracted by the detecting means to obtain a plurality of feature data, and determining whether or not there is a crack-like defect in the thin plate by the feature data. Since the determination means is provided, it is possible to obtain a non-destructive inspection apparatus which has a simple structure and determines the presence or absence of a crack-like defect in a thin plate with high accuracy.
【0031】また、本発明に係わる請求項2の薄板の非
破壊検査装置は、請求項1において、支持手段が、薄板
の裏面より3点または4点のいずれかで支持し、薄板に
対する支持位置を変更する機能を有するので、構造が簡
単な薄板の割れ状欠陥の有無を判定する非破壊検査装置
を得ることが可能となる。According to a second aspect of the present invention, there is provided a non-destructive inspection apparatus for a thin plate according to the first aspect, wherein the supporting means supports at any one of three or four points from the back surface of the thin plate, and a supporting position for the thin plate. Therefore, it is possible to obtain a nondestructive inspection device that determines the presence or absence of a crack-like defect in a thin plate having a simple structure.
【0032】また、本発明に係わる請求項3の薄板の非
破壊検査装置は、請求項1または2において、打撃手段
が、薄板の裏面または表面から外力を瞬間的に加える機
能を有するので、構造が簡単な薄板の割れ状欠陥の有無
を判定する非破壊検査装置を得ることが可能となる。Further, in the nondestructive inspection apparatus for a thin plate according to the third aspect of the present invention, the hitting means has a function of instantly applying an external force from the back surface or the front surface of the thin plate. However, it is possible to obtain a nondestructive inspection device that simply determines the presence or absence of a crack-like defect in a thin plate.
【0033】また、本発明に係わる請求項4の薄板の非
破壊検査装置は、請求項1ないし3のいずれかにおい
て、算出手段は、検出手段より取り出した信号を時間周
波数解析して、単位時間毎の単位周波数成分の振幅にて
なる特徴量データを求めるので、高精度に薄板の割れ状
欠陥の有無を判定する非破壊検査装置を得ることが可能
となる。According to a fourth aspect of the present invention, there is provided a non-destructive inspection apparatus for a thin plate according to any one of the first to third aspects, wherein the calculating means performs time-frequency analysis on the signal taken out from the detecting means, and performs a unit time analysis. Since the characteristic amount data including the amplitude of each unit frequency component is obtained, it is possible to obtain a non-destructive inspection device that determines the presence or absence of a crack defect in a thin plate with high accuracy.
【0034】また、本発明に係わる請求項5の薄板の非
破壊検査装置は、請求項1ないし3のいずれかにおい
て、算出手段は、検出手段より取り出した信号を整流お
よび包絡線処理して、単位時間毎の振幅にてなる特徴量
データを求めるので、高精度に薄板の割れ状欠陥の有無
を判定する非破壊検査装置を得ることが可能となる。According to a fifth aspect of the present invention, there is provided a non-destructive inspection apparatus for a thin plate according to any one of the first to third aspects, wherein the calculating means performs rectification and envelope processing on the signal taken out from the detecting means. Since the feature amount data having the amplitude per unit time is obtained, it is possible to obtain a non-destructive inspection apparatus that determines the presence or absence of a crack-like defect in a thin plate with high accuracy.
【0035】本発明に係わる請求項6の薄板の非破壊検
査装置は、請求項1ないし3のいずれかにおいて、算出
手段は、検出手段より取り出した信号を周波数解析し
て、単位周波数毎の振幅にてなる特徴量データを求める
ので、高精度に薄板の割れ状欠陥の有無を判定する非破
壊検査装置を得ることが可能となる。According to a sixth aspect of the present invention, in the non-destructive inspection apparatus for a thin plate according to any one of the first to third aspects, the calculating means analyzes the frequency of the signal taken out from the detecting means to obtain an amplitude for each unit frequency. Since the feature amount data is obtained, it is possible to obtain a non-destructive inspection device that determines the presence or absence of a crack-like defect in a thin plate with high accuracy.
【0036】また、本発明に係わる請求項7の薄板の非
破壊検査装置は、請求項1ないし6のいずれかにおい
て、算出手段は、検出手段より取り出した信号をフィル
タ処理して、異常信号を強調し、特徴量データを求める
ので、高精度に薄板の割れ状欠陥の有無を判定する非破
壊検査装置を得ることが可能となる。According to a seventh aspect of the present invention, there is provided a non-destructive inspection apparatus for a thin plate according to any one of the first to sixth aspects, wherein the calculating means filters a signal taken out from the detecting means to filter an abnormal signal. Since the emphasis and the characteristic amount data are obtained, it is possible to obtain a nondestructive inspection apparatus that determines the presence or absence of a crack-like defect in a thin plate with high accuracy.
【図1】 本発明の実施の形態1による薄板の非破壊検
査装置の構成を示した図である。FIG. 1 is a diagram showing a configuration of a thin plate nondestructive inspection device according to a first embodiment of the present invention.
【図2】 図1に示した薄板の非破壊検査装置の動作の
フローチャートを示した図である。FIG. 2 is a view showing a flowchart of an operation of the thin plate nondestructive inspection apparatus shown in FIG. 1;
【図3】 本発明の実施の形態1による割れ状欠陥の無
い薄板のデータを示した図である。FIG. 3 is a diagram showing data of a thin plate having no crack-like defect according to the first embodiment of the present invention.
【図4】 本発明の実施の形態1による割れ状欠陥の有
る薄板のデータを示した図である。FIG. 4 is a diagram showing data of a thin plate having a crack defect according to the first embodiment of the present invention.
1 打撃手段、2 支持手段、3 検出手段、4 算出
手段、5 判別手段、W薄板、I 打撃点、P1〜P8
支持点1 hitting means, 2 supporting means, 3 detecting means, 4 calculating means, 5 discriminating means, W thin plate, I hitting point, P1 to P8
Support point
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2G047 AA06 AB04 BC04 BC07 CA03 CA07 EA10 GF10 GG12 GG17 GG19 GG25 GG37 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G047 AA06 AB04 BC04 BC07 CA03 CA07 EA10 GF10 GG12 GG17 GG19 GG25 GG37
Claims (7)
を加える打撃手段と、薄板から発生する打音の音圧また
は振動のいずれか一方または双方の信号を取り出す検出
手段と、前記検出手段により取り出された打音信号を解
析し複数の特徴量データを求める算出手段と、前記特徴
量データにより、薄板の割れ状欠陥の有無を判定する判
定手段と、を有すること特徴とする薄板の非破壊検査装
置。1. A supporting means for installing a thin plate, a hitting means for applying an external force to the thin plate, a detecting means for extracting one or both of a sound pressure and a vibration of a hitting sound generated from the thin plate, and the detecting means Calculating means for analyzing a tap sound signal extracted by the method to obtain a plurality of feature data; and determining means for determining the presence or absence of a crack defect in the thin sheet based on the feature data. Destructive inspection equipment.
4点のいずれかで支持し、薄板に対する支持位置を変更
する機能を有すること特徴とする請求項1に記載の薄板
の非破壊検査装置。2. The nondestructive inspection of a thin plate according to claim 1, wherein the support means has a function of supporting the thin plate at three or four points from the back surface thereof and changing a supporting position with respect to the thin plate. apparatus.
外力を瞬間的に加える機能を有すること特徴とする請求
項1または2に記載の薄板の非破壊検査装置。3. The non-destructive inspection apparatus for a thin plate according to claim 1, wherein the hitting means has a function of instantly applying an external force from the back surface or the front surface of the thin plate.
号を時間周波数解析して、単位時間毎の単位周波数成分
の振幅にてなる特徴量データを求めること特徴とする請
求項1ないし3のいずれかに記載の薄板の非破壊検査装
置。4. The apparatus according to claim 1, wherein said calculating means performs time-frequency analysis on the signal extracted from said detecting means, and obtains characteristic amount data comprising an amplitude of a unit frequency component per unit time. Non-destructive inspection equipment for thin plates as described in Crab.
号を整流および包絡線処理して、単位時間毎の振幅にて
なる特徴量データを求めること特徴とする請求項1ない
し3のいずれかに記載の薄板の非破壊検査装置。5. The method according to claim 1, wherein the calculating means performs rectification and envelope processing on the signal extracted from the detecting means to obtain feature amount data having an amplitude per unit time. Non-destructive inspection equipment for thin plates as described.
号を周波数解析して、単位周波数毎の振幅にてなる特徴
量データを求めること特徴とする請求項1ないし3のい
ずれかに記載の薄板の非破壊検査装置。6. The thin plate according to claim 1, wherein the calculating means performs frequency analysis on the signal extracted from the detecting means to obtain feature amount data having an amplitude for each unit frequency. Non-destructive inspection equipment.
号をフィルタ処理して、異常信号を強調すること特徴と
する請求項1ないし6のいずれかに記載の薄板の非破壊
検査装置。7. The non-destructive thin plate inspection apparatus according to claim 1, wherein the calculation unit filters the signal extracted from the detection unit to emphasize an abnormal signal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001139920A JP2002333436A (en) | 2001-05-10 | 2001-05-10 | Nondestructive inspection device of sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001139920A JP2002333436A (en) | 2001-05-10 | 2001-05-10 | Nondestructive inspection device of sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002333436A true JP2002333436A (en) | 2002-11-22 |
Family
ID=18986617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001139920A Pending JP2002333436A (en) | 2001-05-10 | 2001-05-10 | Nondestructive inspection device of sheet |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007147512A (en) * | 2005-11-29 | 2007-06-14 | Mitsubishi Motors Corp | Quality inspection device |
JP2017044687A (en) * | 2015-08-28 | 2017-03-02 | 日立オートモティブシステムズ株式会社 | Hammering test device |
-
2001
- 2001-05-10 JP JP2001139920A patent/JP2002333436A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007147512A (en) * | 2005-11-29 | 2007-06-14 | Mitsubishi Motors Corp | Quality inspection device |
JP4512548B2 (en) * | 2005-11-29 | 2010-07-28 | 三菱自動車工業株式会社 | Quality inspection equipment |
JP2017044687A (en) * | 2015-08-28 | 2017-03-02 | 日立オートモティブシステムズ株式会社 | Hammering test device |
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