JP2002326318A - Heat-resistant electronic part packaging container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-resistant carrier tape and a heat-resistant tray. SOLUTION: The heat-resistant carrier tape and the heat-resistant tray are constituted by using a conductive sheet which is obtained by laminating a conductive resin composition, which contains a polycarbonate resin and carbon black of which the content is 5-50% by weight of the polycarbonate resin, on at least the single surface of a substrate layer comprising a thermoplastic resin based on an acrylonitrile/butadiene/styrene copolymer resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive and heat-resistant electronic component packaging container suitable for packaging semiconductors such as ICs and electronic components.

[0002]

2. Description of the Related Art There are magazines, trays, embossed carrier tapes and paper adhesive tapes as packaging forms for storing semiconductors such as ICs and electronic parts such as liquid crystals. In recent years, the demand for these packages has rapidly increased due to the spread of electronic devices such as laptop computers and electronic notebooks. The size and weight of products have been remarkably reduced due to the downsizing of products. Holding a point.

For example, when a semiconductor is heated to a high temperature (200 to 260 ° C.) in a solder reflow process at the time of mounting, the used mold resin releases moisture absorbed from the air, causing swelling and cracking, thereby causing the package to expand. Since the crack may progress or the mold resin may separate from the lead frame, moisture absorption is prevented by moisture-proof packaging after the semiconductor is manufactured. Recently, the use of modified resins having improved moisture resistance has also been proposed, but is not yet sufficient.

[0004] Thick packages such as SOPs and QFPs and small chips are not problematic unless left for a long time after opening, but in particular, ultra-thin semiconductors such as TSOP and TQFP absorb moisture in a short time. Since there is a high probability that a package crack will occur during solder reflow, moisture-proof packaging is required. However, depending on the packaging material, moisture may enter and the mold resin may absorb moisture, and must be baked after long-term storage.

On the other hand, in the manufacturing process of a liquid crystal tray and the like, there is a heating process for coating and bonding.
Many improvements are desired.

[0006]

An embossed carrier tape or a conductive tray has been adopted as a packaging form for these semiconductors and electronic parts, and materials such as polystyrene and polyvinyl chloride have conventionally been used. When baking is performed using a carrier tape of a conventionally used material,
Problems such as deformation of the shape at a baking temperature of 60 ° C. occur. As a countermeasure against this, a sheet in which a conductive paint is applied to a polycarbonate resin has been proposed as a sheet having a heat resistance of 135 ° C. (JP-A-5-1627).
72), which is expensive and excessively spec.
An inexpensive packaging form having heat resistance of 30 ° C. has been desired.

[0007]

SUMMARY OF THE INVENTION The above problems are solved by the present invention. That is, the present invention relates to a conductive resin comprising a polycarbonate resin containing 5 to 50% by weight of carbon black on at least one surface of a thermoplastic resin base layer containing an acrylonitrile-butadiene-styrene copolymer resin as a main component. The present invention relates to a heat-resistant carrier tape and a heat-resistant tray using a conductive sheet on which a conductive resin composition is laminated. Hereinafter, the present invention will be described in detail. The acrylonitrile-butadiene-styrene copolymer resin (ABS copolymer resin) used in the present invention refers to a resin mainly composed of a copolymer mainly composed of acrylonitrile, butadiene and styrene. For example, a copolymer obtained by block or graft polymerization of one or more kinds of aromatic vinyl monomer and vinyl cyanide monomer on a diene rubber and a blend thereof with the copolymer are mentioned. Can be The diene rubber described here is polybutadiene, polyisoprene or acrylonitrile-butadiene copolymer, styrene-butadiene copolymer, and aromatic vinyl monomers include styrene, α-methylstyrene, various alkyl-substituted styrenes, and the like. can give. Examples of the vinyl cyanide monomer include acrylonitrile, methacrylonitrile, and various halogen-substituted acrylonitriles. Specific examples of the above-mentioned copolymer and a blend with the copolymer include acrylonitrile-butadiene-styrene terpolymer and acrylonitrile-styrene binary copolymer obtained by polymerizing polybutadiene. An acrylonitrile-styrene binary copolymer containing no rubber component also falls into this range.

[0008] As the polycarbonate resin, aromatic polycarbonate resin, aliphatic polycarbonate resin,
Examples thereof include aromatic-aliphatic polycarbonates, which are generally classified as engineering plastics, and those obtained by general polycondensation of bisphenol A with phosgene or polycondensation of bisphenol A with a carbonate ester can also be used.

The base material layer of the sheet of the present invention comprises a thermoplastic resin containing an ABS copolymer as a main component, and may further contain a PC resin in a range of 1 to 50% by weight based on the thermoplastic resin. It is possible. By adding a PC resin, the mechanical strength can be further improved, but in order to obtain an inexpensive sheet, it is preferable to keep the content within 50% by weight or less.

[0010] It is possible to add a small amount of carbon black to the base material layer so as not to impair the fluidity. By adding carbon black, the mechanical strength can be further improved and the sheet can be formed into a packaging container. In this case, it is possible to solve the problem that the thickness of the sheet is reduced and the corners of the molded product are transparent.

The carbon black to be contained in the base layer is not particularly limited as long as it can be uniformly dispersed in the base layer resin. The amount added to the carbon black in the sheet base layer may be such that the fluidity is not impaired as described above, and is preferably 0.1 to 10% by weight based on the thermoplastic resin.

The base material layer may be made of polyethylene resin, polypropylene resin or a copolymer of ethylene and propylene (eg, ethylene-ethyl acrylate resin, ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer resin, etc.). Other resin components such as olefin resins and polyester resins such as polyethylene terephthalate resin can be added as modifiers, and various additives such as lubricants, plasticizers and processing aids are added as necessary. It is possible to

The carbon black to be contained in the conductive resin composition includes furnace black, channel black, acetylene black, etc., and preferably has a large specific surface area and a high conductivity can be obtained with a small amount of addition to the resin. Those such as Ketjen Black and acetylene black are desirable.

The amount of the conductive resin composition added to the carbon black is preferably 5 to 50% by weight in the conductive resin. If the amount is less than 5% by weight, a sufficient surface specific resistance value for preventing destruction of electronic components due to static electricity cannot be obtained. 50
If the content is more than 10% by weight, the fluidity of the sheet decreases, and it is difficult to laminate the sheet on the sheet substrate.

The surface resistance of the side on which the conductive resin composition is laminated is preferably from 10 ² to 10 ¹⁰ Ω. If the surface resistance is out of this range, it is difficult to suppress the destruction of electronic components due to static electricity.

In the conductive resin composition, other resin components such as an ABS copolymer resin and a polybutylene terephthalate resin can be added as a modifier, and if necessary, a lubricant, Various additives such as plasticizers and processing aids can be added.

In order to produce the conductive sheet of the present invention, first, all or a part of the raw material of the conductive resin composition is kneaded and pelletized using a known method such as an extruder, and the obtained conductive resin composition is obtained. Can be formed into a sheet by a known method such as an extruder together with a thermoplastic resin serving as a sheet base material.

In kneading the conductive resin composition, it is possible to knead the raw materials all together. Also, for example, PC
It is also possible to knead half of the system resin and carbon black and knead in stages, such as adding the remaining raw materials to the kneaded material and kneading, or adding these when further forming a sheet. It is possible.

In order to laminate the conductive resin composition on the base material layer, each is formed into a sheet or film by a separate extruder, and then stepwise by a heat laminating method, a dry laminating method, an extrusion laminating method or the like. It is possible to laminate. Alternatively, it can be laminated on a preformed sheet substrate by a method such as extrusion coating. Then, in order to manufacture at a lower cost, it is preferable to collectively obtain a laminated sheet by a multilayer extrusion method using a multi-manifold die or a feed block.

The thickness of the entire sheet of the present invention is 0.1 to 3.
It is preferably 0 mm, and the thickness of the conductive resin composition layer in the entire thickness is preferably 2% to 80%. If the total thickness is less than 0.1 mm, the strength as a packaging container obtained by molding a sheet is insufficient, and if it exceeds 3.0 mm, molding such as air pressure molding, vacuum molding, hot plate molding becomes difficult.
If the thickness of the conductive resin composition layer is less than 2%, the surface resistivity of the packaging container obtained by sheet molding becomes extremely high, and a sufficient static electricity suppressing effect cannot be obtained. Formability such as vacuum forming and hot plate forming is reduced.

The conductive sheet can be suitably used as a container for packaging electronic parts. In order to process the conductive sheet into a carrier tape or a tray, it can be obtained by a known method such as a vacuum forming method and a pressure forming method. Electronic component packaging containers such as carrier tapes and trays made of conductive sheets have excellent heat resistance and conductivity.

[0022]

The present invention will be described in more detail with reference to the following examples. Example 1 As a conductive resin composition, a PC resin (Panlite L-
1225, Teijin Chemicals) and Ketjen Black EC
(Lion AKZO Co., Ltd.) was previously kneaded with 12% by weight of PC resin by a φ50 mm vent type twin screw extruder.
Pelletized to obtain a conductive resin compound. An ABS copolymer resin (Techno ABSYT-346, Techno Polymer Co.) was used as the conductive resin compound and the thermoplastic resin for the sheet base layer, and a 65 mm extruder (L / D =
28), φ40 mm extruder (L / D = 26) and 500
mm was obtained by a feed block method using a field T die to obtain a three-layer sheet having a total thickness of 300 μm and a thickness of the conductive resin composition layer of 30 μm on both sides. This sheet was slit to a width of 27 mm. Using a carrier tape molding machine (EDG), an embossed carrier tape having a tape width of 24 mm, a pocket size of 16 mm in width and a length of 12 mm was prepared, and the inner diameter was 100 mm and the outer diameter was 280 mm.
1000 pockets wound on an aluminum reel, temperature 1
It was left for 30 seconds in a dry environment of 00 ° C. and 24 hours in a dry environment of 80 ° C. After a lapse of a predetermined time, the shrinkage was measured. As a result, the dimensions were almost the same as those before heating. Table 1 shows the results.

Example 2 A three-layer sheet was obtained in the same manner as in Example 1. Using a vacuum press forming machine (manufactured by Asano), this is 24 cm long and 16 cm wide.
cm tray, dry environment at 100 ℃ 3
It was left for 24 hours in a dry environment of 0 seconds and 80 ° C. After a lapse of a predetermined time, the shrinkage rate was measured. As a result, the dimensions were almost equal to those before heating. Table 1 shows the results.

Comparative Example 1 An embossed carrier tape was prepared in the same manner as in Example 1 except that a PS-based resin (Toyostyrol E640N, Toyo Styrene Co.) was used as the resin for the sheet base layer. When 1,000 pockets were wound around a 280 mm aluminum reel and left for 30 seconds in a dry environment at a temperature of 100 ° C. and 24 hours in a dry environment at a temperature of 80 ° C., the shape of each was significantly changed, and the dimensions could not be measured. .

Comparative Example 2 A tray was prepared in the same manner as in Example 2 except that a PS resin (Toyostyrol E640N, Toyo Styrene Co., Ltd.) was used as the resin for the sheet base layer, and a tray was prepared in a dry environment at a temperature of 100 ° C. When left in a dry environment of 30 seconds and 80 ° C. for 24 hours, the shape of each of them was remarkably changed, and the dimensions could not be measured.

[0026]

[Table 1]

[0027]

The carrier tape and tray of the present invention have excellent heat resistance and conductivity. It can be suitably used as a container for baking electronic components such as ICs.

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Claims (6)

[Claims] 1. A conductive material comprising a polycarbonate resin containing 5 to 50% by weight of carbon black on at least one surface of a thermoplastic resin base layer containing an acrylonitrile-butadiene-styrene copolymer resin as a main component. A heat-resistant carrier tape using a conductive sheet laminated with a resin composition. 2. A conductive material comprising a polycarbonate resin containing 5 to 50% by weight of carbon black on at least one surface of a thermoplastic resin base layer containing an acrylonitrile-butadiene-styrene copolymer resin as a main component. A heat-resistant tray using a conductive sheet laminated with a resin composition. 3. The heat-resistant carrier tape according to claim 1, wherein the base material layer further contains 1 to 50% by weight of a polycarbonate resin based on the thermoplastic resin. 4. The heat-resistant tray according to claim 1, wherein the base layer further contains a polycarbonate resin in an amount of 1 to 50% by weight based on the thermoplastic resin. 5. The base material layer has a thickness of 0.1 to 1 with respect to the thermoplastic resin.
The heat-resistant carrier tape according to any one of claims 1 to 4, comprising 0% by weight of carbon black. 6. The base material layer has a thermoplastic resin content of 0.1 to 1%.
The heat-resistant tray according to any one of claims 1 to 4, comprising 0% by weight of carbon black.