JP2002324990A - Relay apparatus for electric power system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a relay apparatus for electric power systems, whose cooling ability is so improved as to make suppressible the temperature rise of the inside of its housing. SOLUTION: In the relay apparatus for electric power systems, there are provided each heat transfer plate 15 for absorbing the heat generated from each electronic-appliance board 3; each guide groove 17 formed integrally with a housing 10 and for inserting thereinto, and engaging therewith the end portion of each heat transfer plate 15; and each guiding rail 16 for so supporting each heat transfer plate 15 inserted into each guiding groove 17, and engaged therewith as to conduct the heat of each heat transfer plate 15 to the housing 10. In this way, the heat generated from each electric-appliance board 3 is absorbed by each heat transfer plate 15, and the absorbed heat is so transferred via each guide rail 16 to the housing 10 as to radiate the absorbed heat to the outside atmosphere of the apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a power system relay device used for protection and control of a power system.

[0002]

2. Description of the Related Art Conventionally, in a power system, a protection relay device is provided for protection of a system, a load, and the like, and a control relay device for controlling the power system is provided.

[0003] Current and voltage signals are detected from current transformers, transformers, and the like provided on the transmission line, and the state is calculated and determined according to a predetermined algorithm, thereby monitoring the presence or absence of a system fault. .

[0004] For example, if it is determined that an accident such as a ground drop has occurred in a transmission line, the point of the accident is determined, and a circuit breaker at an optimum position is controlled to improve the reliability of the system.

[0005] As shown in FIG. 15, these protection relay device and control relay device include an input / output board 3a and a power supply board 3a.
b, a large number of substrates such as an interface substrate 3c, an arithmetic processing substrate 3d, and a mother substrate 3e, which are housed in independent housings. Hereinafter, each substrate will be referred to as an electronic device substrate 3 as appropriate.

The electronic device substrate 3 is provided with heat-generating components such as a CPU, various memories, and a power supply. If the heat from such components is not efficiently dissipated, there is a problem that, for example, the CPU may run out of heat or its life may be shortened, thereby increasing maintenance costs.

Therefore, conventionally, fins are attached to the heat-generating component, or forced air cooling is performed by a fan. In recent years, cooling may be performed by directly attaching a heat pipe to a heat-generating component.

[0008]

However, since the protection relay device and the control relay device are formed by independent housings, for example, the power supply board cannot be shared, and it is difficult to reduce the size of each device. Along with
There is a problem that a large installation space is required to install each device.

Further, as the number of electronic device substrates 3 increases, a large amount of heat is released into the housing 2 and the ambient temperature rises, so that fins and fans cannot be cooled sufficiently. In particular, in the case of being placed outdoors or the like, a closed-type housing is used to prevent the substrate or the like from being exposed to the weather and dust, and in this case, cooling can be performed with a fan or fin. There is a problem that cannot be done.

Therefore, the present invention provides a power system relay device which can be reduced in size and weight and which can sufficiently cool the heat of an electronic device substrate disposed inside even in a closed housing. The purpose is to provide.

[0011]

According to a first aspect of the present invention, there is provided a protection relay function used for protection of a system or a load in a housing or used for controlling the system. In a relay device in which at least one function of a control relay function is provided and each function is formed as a plurality of electronic device substrates, the electronic device substrate is provided to face the electronic device substrate. A heat transfer plate that absorbs heat generated from the heat transfer plate, and a guide groove that is formed integrally with the housing and into which an end of the heat transfer plate is inserted, and supports the heat transfer plate that is inserted into the guide groove. A guide rail for conducting the heat of the heat transfer plate to the housing, absorbing heat from the electronic device board by the heat transfer plate, and transmitting the heat to the housing via the guide rail to allow the heat transfer to be performed outside the machine. Radiated to the atmosphere And wherein the door.

According to a second aspect of the present invention, the housing is a box having upper, lower, left and right, or front and rear housing surfaces, wherein a guide rail and side plates forming upper and lower housing surfaces are integrally formed. .

According to a third aspect of the present invention, when the guide rails are formed integrally with the housing, they are formed by a die casting method.

The invention according to claim 4 is characterized in that any one of the following compositions A to G is used as a material for aluminum die casting. Composition A: 0.3-0.4 wt% Cu-12.0-1
2.2 wt% Si-0.08 to 0.11 wt% Mg-
0.23-0.24wt% Mn-0.64-0.74w
t% Fe-0.09 to 0.10 wt% Zn-Bal. A
1, composition B; 2.8 to 3.0 wt% Cu-8.4 to 8.6
wt% Si-0.0 ~ 0.10wt% Mg-0.32-
0.37wt% Mn-0.70 ~ 0.71wt% Fe-
0.13 to 14 wt% Zn-Bal. Al, composition C; 1.9 to 2.5 wt% Cu-9.4 to 10.
4wt% Si-0.21 ~ 25wt% Mg-0.16 ~
0.38 wt% Mn-0.72-0.93 wt% Fe-
0.42 to 0.93 wt% Zn-Bal. Al, composition D; 0.01 wt% Cu-0.1 wt% Si-
0.80wt% Mn-0.09wt% Fe-0.01w
t% Ni-0.01wt% Ti-Bal. Al, composition E; 1.0-4.3 wt% Mn-0.5-1.0
wt% Fe-Bal. Al, composition F; 0.05 wt% Cu-1.0 wt% Co-B
al. Al, composition G; 2.0 wt% Mn-3.0 wt% Zn-1.
0 wt% Fe-0.5 wt% Mg-Bal. Al, in this specification, for example, when 0.3 to 0.4 wt% Cu is described, 0.3 wt% Cu to 0.4 wt% C
It is described as meaning the range of u.

The invention according to claim 5 is characterized in that the inner wall surface of the housing or the surface of the heat transfer plate is coated with a radiant heat absorbing material for promoting absorption of radiant heat.

The invention according to claim 6 is characterized in that at least one of the housing surface of the housing or the surface of the heat transfer plate is provided with irregularities for increasing the contact area with the atmosphere.

[0017] The invention according to claim 7 is characterized in that a heat pipe is provided on at least one of the housing surface of the housing or the surface of the heat transfer plate to transfer heat of the high heat portion to the low temperature portion.

According to the present invention, the thermal expansion coefficient of the heat transfer plate is set to be larger than the thermal expansion coefficient of the guide rail. It is characterized in that thermal contact can be maintained.

According to a ninth aspect of the present invention, one of the guide groove of the guide rail and the end of the heat transfer plate is coated with a thermal contact promoting material of copper or a copper alloy material having excellent thermal conductivity. It is characterized by.

The invention according to claim 10 is characterized in that an aluminum or aluminum alloy material having a thermal conductivity of 100 to 230 W / mK is used as a material of the heat transfer plate.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating a schematic configuration of the power system relay device according to the first embodiment.

The electric power system relay device supplies a power to the protection relay unit 11 having the function of the conventional protection relay device, the control relay unit 12 having the function of the control relay device, and the control relay unit 11 and the control relay unit 12. Power supply unit 13
And the like, and these are housed in one housing 10.

The protection relay unit 11 and the control relay unit 1
2 and the power supply unit 13 are configured by a plurality of electronic device boards 3. FIG. 1 illustrates a case where the protection relay unit 11 and the control relay unit 12 are formed by two electronic device substrates 3. This figure shows a case where a single electronic device substrate 3 is formed.

As described above, the protection relay unit 11 and the control relay unit 12 having the same functions as those in the related art are housed in one housing 10 and the power supply unit 13 is shared, so that at least the shared portion is occupied. The space can be saved, the device can be reduced in size and weight, and the manufacturing cost can be reduced and the installation space can be reduced.

Of course, in FIG. 1, the power supply unit 13 is shared, but this is merely an example, and parts, input / output boards, interface boards, and arithmetic processing that are not used simultaneously in the protection relay unit 11 and the control relay unit 12 are shown. It is also possible to share a substrate and the like.

Next, a second embodiment of the present invention will be described with reference to the drawings. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted as appropriate. In addition,
The power system relay device according to the present embodiment may have one of a conventional protection relay device and a control relay device, or have both functions as in the first embodiment.

FIG. 2 is a schematic view showing the configuration of a main part of the power system relay device. FIG. 2 (a) is a front view of the electronic device substrate 3, and FIG. FIG. 2 shows a state when the camera is mounted on the housing 10.

An input / output board 3a for inputting / outputting signals to / from the outside, an arithmetic processing board 3d for performing various arithmetic processing, and a mother board for these are provided in the housing 10 of the power system relay apparatus according to the present embodiment. 3e, a large number of electronic device substrates 3 such as a power supply substrate 3b for supplying power to each electronic device substrate 3 are housed.

A heat transfer plate 15 is provided on the heat-generating component side of the electronic device substrate 3 at a predetermined interval, and an end of the heat transfer plate 15 is provided on a guide rail 16 provided on the housing 10. It is adapted to be inserted into the guide groove 17.

The guide rail 16 is formed integrally with the housing 10 or is fixed so that sufficient thermal contact can be ensured even if it is formed by a separate member.

As described above, the heat transfer plate 1 faces the heat-generating component.
5, the heat of the component is transferred to the heat transfer plate 1
5, heat can be efficiently radiated from the guide rail 16 to the outside atmosphere via the housing 10 to suppress thermal runaway and life degradation of heat-generating components such as a CPU and a memory. Becomes possible.

At this time, if the guide rails 16 are integrally formed on at least two of the housing surfaces (for example, the upper surface and the rear surface) among the upper, lower, left, right, and front and rear housing surfaces of the housing 10, heat from the guide rails 16 to the housing surface can be obtained. This is preferable because transmission can be performed effectively.

Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the same components as those in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

In the above description, it is assumed that the thermal contact between the heat transfer plate 15 and the guide rail 16 is sufficiently ensured, but the thermal expansion coefficient of the guide rail 16 is smaller than the thermal expansion coefficient of the heat transfer plate 15. If it is made of a large material, the guide rail 16 and the heat transfer plate 1 will be
5 may not be able to secure sufficient thermal contact.

Therefore, when the heat transfer plate 15 and the guide rail 16 are formed using materials having different thermal expansion coefficients, the heat transfer plate 15 has a thermal expansion coefficient of the guide rail 1.
6 is preferably set to be larger than the coefficient of thermal expansion.

Thus, the heat transfer plate 15 is connected to the guide rail 1.
6 can be easily inserted, and when the temperature in the housing 10 rises, the guide rail 1 can be inserted.
Since the thermal expansion in the direction in which the thermal contact between the heat transfer plate 6 and the heat transfer plate 15 becomes larger, good heat radiation can always be performed.

By repeatedly inserting and removing the heat transfer plate 15 from the guide rail 16, the side wall of the guide groove 17 and the end of the heat transfer plate 15 inserted into the guide groove 17 may be worn, It is assumed that the heat transfer plate 15 and the guide rails 16 are rigid and it is difficult to secure the close contact between them because the members having such a thermal expansion coefficient are selected.

Accordingly, in such a case, as shown in FIG. 3, the heat contact promoting material 1 made of copper and copper alloy having excellent heat conductivity is provided in a portion fitted into the groove of the guide rail 16 or the groove of the heat transfer plate 15.
8 is preferably coated.

The copper and copper alloy are used to guide the heat transfer plate 15 to the guide groove 1.
7 has a function of preventing galling and abrasion due to sliding that may occur when the heat transfer plate 15 is inserted into the device 7, so that a good thermal contact state can always be ensured, and the heat of the heat transfer plate 15 can be quickly transmitted to the outside of the machine via the housing 10. Heat can be released to the atmosphere.

As the thermal contact promoting material 18, nickel, nickel alloy, chromium, chromium alloy and the like can be listed in addition to copper and copper alloy, and known techniques such as plating and vapor deposition can be applied as a coating method. .

Next, a fourth embodiment of the present invention will be described with reference to the drawings. In addition, about the same structure as 1st-3rd embodiment, the same code | symbol is used and description is abbreviate | omitted suitably.

In the above embodiments, the guide rail 16 has been described as being fixed or fixed to the housing 10. At this time, the guide rail 16 is
If the bolt is fastened to the housing 10, the tightness between the housing 10 and the guide rail 16 may deteriorate due to the tightening force of the bolt, and sufficient heat contact may not be ensured. It is assumed that it becomes difficult to radiate heat to the outside atmosphere through the air conditioner.

Of course, it is possible to secure sufficient thermal contact between the guide rail 16 and the housing 10 by firmly tightening the bolts. However, the housing 10 is made of an aluminum-based material having high thermal conductivity. In this case, if the bolt is tightened firmly, the thread groove may be damaged.

Therefore, in the present embodiment, as shown in FIG. 4, the guide rail 16 is formed integrally with the housing 10 to cope with such inconvenience.

This eliminates the need to fasten the casing 10 and the guide rail 16, thereby reducing the cost of the fastening work and maintaining the best thermal contact state at all times. Heat can be released to the outside atmosphere.

Next, a fifth embodiment of the present invention will be described with reference to the drawings. In addition, about the same structure as 1st-4th embodiment, the same code | symbol is used and description is abbreviate | omitted suitably.

In the above description, the heat transfer plate 15
No particular reference has been made to the material of the above or the material for forming the housing 10 and the guide rail 16 integrally. The present embodiment relates to these materials.

FIG. 5 shows the heat transfer plate 15 as 50 to 230.
The result of having measured the internal temperature of the housing | casing 10 at the time of using aluminum or an aluminum alloy which has a thermal conductivity of W / mK is shown.

As a result, it can be seen that when aluminum or an aluminum alloy having a thermal conductivity of 100 to 230 W / mK is used, the internal temperature of the casing 10 can be lowered by 2 to 3 ° C.

Of course, in the present invention, the material of the heat transfer plate 15 is not limited to aluminum or an aluminum alloy, and the heat absorbed by the heat transfer plate
Any material can be used as long as it moves to zero and radiates heat to the atmosphere outside the machine, and satisfies the demand for weight reduction and size reduction.

For example, in addition to aluminum and aluminum alloy, copper, copper alloy, titanium and titanium alloy can be exemplified.
Further, an alloy based on iron, Co, Ni or the like can be used.

The die casting method mentioned here includes a vacuum die casting method, an oxygen atmosphere die casting method, an atmosphere flow die casting method, a rheocasting method, an acurad method, and the like.
Low-speed filling die casting, high pressure casting, balance type fluid die casting, car process, and parashot method are included.

In the die-casting method, since an aluminum material having excellent heat conductivity can be used, the housing 10 and the guide rail 16 having high heat conductivity can be manufactured, and aluminum is used as the material. Because it can be recycled.

In the die used in the die casting method, the core can be used as a spacer for adjusting the dimensions of the adjacent guide rails 16, so that it is possible to quickly respond to a design change or an increase in the number of electronic device substrates 3. This is because the productivity of the housing 10 can be improved.

FIG. 6 shows such a casting structure by the die casting method, in which the electric furnace 50 and the molten metal pumping mechanism 5 are used.
1. An injection mechanism 52, a mold 53, a controller 54, a vacuum device 55, a press device 56, and the like are main components.

Then, a material such as aluminum is placed in the electric furnace 5.
0, and the molten metal is pumped up by a melt pumping mechanism 51 and the injection mechanism 5
2 is pressed into the mold 53 at high speed and high pressure. The material pressed into the mold 53 is rapidly solidified, whereby desired casting is performed.

In the vacuum die casting method, since the casting can be performed while discharging air bubbles and gas components existing in the molten metal to the outside, the casing 10 having a uniform structure with few casting defects can be manufactured. There are features.

As described above, since the material is press-fitted at a high speed and a high pressure and rapidly solidified, the filling time of the material into the mold 53 is short, and high dimensional accuracy can be easily obtained because of the rapid solidification. It has the feature that it can be formed into a thin wall, and in addition, the casting surface is smooth and requires little post-processing.

Therefore, the productivity of a high-quality housing is improved, and the manufacturing cost can be reduced.

In the die casting method, since the material composition affects the fluidity of the molten metal, casting defects are likely to occur frequently with a composition having a low fluidity. Therefore, the composition of the aluminum alloy material as shown in FIG. A test was conducted to examine the occurrence of casting defects with respect to the composition.

Die casting conditions are up to 2450M
Using a die casting apparatus having a filling pressure of Pa, an injection speed of 60 m / s, an injection pressure of 1176 MPa, and a filling time of 0.1 Pa.
The test was performed under the condition of 3 seconds.

From FIG. 7, 0.3 to 0.4 wt% Cu-1
2.0 to 12.2 wt% Si-0.08 to 0.11 wt
% Mg-0.23-0.24 wt% Mn-0.64-
0.74wt% Fe-0.09 ~ 0.10wt% Zn-
Bal. Al, 2.8 to 3.0 wt% Cu-8.4 to
8.6wt% Si-0.08 ~ 0.10wt% Mg-
0.32-0.37wt% Mn-0.70-0.71w
t% Fe-0.13 to 0.14 wt% Zn-Bal. A
l, 1.9 to 2.5 wt% Cu-9.4 to 10.4 wt%
% Si-0.21-0.25 wt% Mg-0.16-
0.38 wt% Mn-0.72-0.93 wt% Fe-
0.42 to 0.93 wt% Zn-Bal. Al, 0.0
1wt% Cu-0.1wt% Si-0.80wt% Mn
-0.09 wt% Fe-0.01 wt% Ni-0.01
wt% Ti-Bal. Al, 1.0 to 4.3 wt% Mn
-0.5 to 1.0 wt% Fe-Bal. Al, 0.05
wt% Cu-1.0 wt% Co-Bal. Al, 2.0
wt% Mn-3.0 wt% Zn-1.0 wt% Fe-
0.5 wt% Mg-Bal. It turns out that it is optimal to use an aluminum or aluminum alloy material having any composition of Al.

As a result, it is possible to manufacture a highly reliable housing 10 with good fluidity of the hot water at the time of aluminum die casting, with few casting defects.

Next, a sixth embodiment of the present invention will be described with reference to the drawings. In addition, about the same structure as 1st-5th embodiment, the same code | symbol is used and description is abbreviate | omitted suitably.

Up to now, the heat received by the heat transfer plate 15 is
Although the case where heat is radiated from the casing 10 to the outside atmosphere or the like via the guide rail 16 has been described,
The heat is also radiated to the inside atmosphere, and the heat is radiated to the outside atmosphere via the housing 10 or is carried out of the housing 10 by the atmosphere flowing into the housing 10.

Therefore, it is preferable to quickly radiate the heat received by the heat transfer plate 15 to the atmosphere in the housing 10 in order to suppress a rise in the temperature of the heat-generating component.

From such a viewpoint, various shapes of irregularities 19 may be provided on the surface of the heat transfer plate 15 as shown in FIG. 8 to increase the area of contact with the atmosphere in the housing 10. As the shape of the irregularities 19, spherical irregularities, scale-like irregularities 19
b and the like, and FIG. 8 illustrates the scale-like unevenness 19b. In addition, various irregularities 19 are possible. For example, a pin-shaped heat radiating rod may be provided on the housing surface, or irregularities 19 having a large mass may be provided.

By providing the irregularities 19 in this manner,
Since the contact area where the heat transfer plate 15 contacts the atmosphere increases, the heat radiation efficiency increases.

Of course, when heat is released to the atmosphere near the heat-generating component, the ambient temperature of the component increases, and the purpose of suppressing the temperature rise of the component may not be achieved.

In such a case, as shown in FIG. 9, unevenness 19 such as fins 19c is provided at the end of the heat transfer plate 15, and a large amount of heat is released from the end to the atmosphere in the housing 10. It may be made to be performed.

Further, as shown in FIG.
The heat pipe 20 may be fixed to the heat transfer plate 15 to transfer the heat absorbed by the heat transfer plate 15 to a region near the guide rail 16.

The heat pipe 20 is a sealed pipe in which a working fluid is sealed. The working fluid absorbs heat and evaporates (in the present invention, one end of the heat pipe is installed near a heat-generating component). The heat transfer is performed by repeating a cycle of cooling and condensing at a portion (the other end of the heat pipe is provided near the guide rail).

At this time, by joining the heat pipe 20 to the surface of the heat transfer plate 15 on the side opposite to the heat-generating component by soldering or the like, the surface area in contact with the atmosphere in the housing 10 increases, so that the heat radiation effect and the heat transfer effect are achieved. Work together to allow more efficient heat dissipation.

Further, the surface of the heat transfer plate 15 (particularly, the surface on the side of the heat generating component) may be coated with a radiant heat absorbing material. Such a radiant heat absorbing material is, for example, a black material, and a resin coating or a plating material can be used.

As a result, the heat from the heat-generating component is efficiently absorbed by the heat transfer plate 15 and can be radiated to the outside atmosphere via the housing 10 and the like, so that the temperature rise of the heat-generating component is suppressed. It becomes possible.

Of course, it is clear that such irregularities 19 and the heat pipe 20 may be provided on the housing 10 or on either one of them.

FIG. 11 shows a case in which fins 19c are provided as unevenness 19 on the housing surface of the housing 10, and FIG. 12 shows a case in which scaly unevenness 19b is provided on the housing surface. Also,
FIG. 13 shows a case where spherical unevenness 19a is provided on the housing surface.
FIG. 14 shows a case where the heat pipe 20 is provided on the housing surface. In this case, one end of the heat pipe 20 is provided close to the guide rail 16 and the other end is provided so as to be located away from the guide rail 16.

In this case, the heat pipe 20 may be soldered to the housing surface or may be formed by being embedded. If the heat pipe 20 is provided on one of the upper surface and the lower surface of the housing 10, a large temperature gradient is generated inside the housing 10, so that convection is promoted and the atmosphere near the heat-generating component is stirred. Therefore, the heat-generating component can be cooled more efficiently.

Although FIGS. 11 to 14 show the case where the unevenness 19 and the heat pipe 20 are provided on the upper housing surface facing outward, this is merely an example and is provided on other housing surfaces. Needless to say, they may also be provided inside.

By providing the irregularities 19 and the heat pipes 20 as described above, the heat from the heat generating member absorbed by the heat transfer plate 15 can be efficiently radiated to the outside atmosphere of the power system. Is improved, and a reduction in life can be suppressed.

[0081]

According to the present invention, since the housing and the guide rail are integrally formed, the heat of the heat transfer plate can be efficiently transmitted to the housing, and thermal runaway of the heat-generating parts and the like and shortening of the service life can be achieved. Can be suppressed and reliability can be improved and maintenance costs can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating a main part of a power system relay device applied to the description of a first embodiment.

FIG. 2 is a schematic configuration diagram illustrating a main part of a power system relay device applied to the description of a second embodiment.

FIG. 3 is a schematic configuration diagram illustrating a main part of a power system relay device applied to the description of a third embodiment.

FIG. 4 is a schematic configuration diagram illustrating a main part of a power system relay device applied to the description of a fourth embodiment;

FIG. 5 is a diagram showing test results of a heat transfer plate applied to the description of a fifth embodiment.

FIG. 6 is a schematic configuration diagram of a casting device by a die casting method.

FIG. 7 shows test results of various composition materials when the housing and the guide rail are integrally formed.

FIG. 8 is a schematic configuration diagram illustrating a main part of a power system relay device applied to the description of a fourth embodiment, in which scale-like irregularities are provided on the surface of a heat transfer plate.

FIG. 9 is a view showing a configuration alternative to FIG. 8, and is a view showing a case where fins are provided at the end of the heat transfer plate.

FIG. 10 is a view showing a configuration alternative to FIG. 8, and is a view showing a case where a heat pipe is provided on a surface of a heat transfer plate.

FIG. 11 is a view showing a configuration alternative to FIG. 8, in which fins are provided on the housing surface.

FIG. 12 is a view showing a configuration alternative to FIG. 8, and is a view showing a case where scale-like irregularities are provided on a housing surface.

FIG. 13 is a view showing a configuration instead of FIG. 8, and is a view showing a case where hemispherical irregularities are provided on a housing surface.

FIG. 14 is a diagram showing a configuration alternative to FIG. 8, in which a heat pipe is provided on a housing surface.

FIG. 15 is a schematic configuration diagram showing a main part of a power system relay device applied to the description of the conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 3 ... Board | substrate, 10 ... Housing | casing, 11 ... Protection relay part, 12 ... Control relay part, 13 ... Power supply part, 15 ... Heat transfer plate, 16 ... Guide rail, 17 ... Guide groove, 18 ... Thermal contact promotion material, 1
9: unevenness, 20: heat pipe

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court ゛ (Reference) H01H 45/12 H01H 45/12 (72) Inventor Masayuki Ishikawa 2--4 Suehirocho, Tsurumi-ku, Yokohama-shi, Kanagawa Inside Toshiba Keihin Works (72) Inventor Hiroaki Yoshioka 2-4, Suehirocho, Tsurumi-ku, Yokohama, Kanagawa Prefecture Inside Toshiba Keihin Works (72) Mitsuo Motoki 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation Inside the Fuchu Office (72) Inventor Yuji Minami 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation Fuchu Office, Inc. (72) Inventor Norikazu Yamamoto 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation Fuchu Office F-term (reference ) 5E322 AA01 DB10 EA05 FA04

Claims (10)

[Claims] At least one function of a protection relay function used for protection of a system, a load, or the like or a control relay function used for controlling the system is provided in a housing, and each of the functions is provided. Is a relay device in which a plurality of electronic device substrates are formed as a unit, wherein the heat transfer plate is provided to face the electronic device substrate and absorbs heat generated from the electronic device substrate; and And a guide groove into which an end of the heat transfer plate is inserted to support the heat transfer plate inserted in the guide groove and conduct heat of the heat transfer plate to the housing. A power system relay device, comprising: a guide rail for causing the power system to relay. 2. The housing according to claim 1, wherein the housing is a box having upper, lower, left and right or front and rear housing surfaces, and the guide rail and a side plate of the upper and lower housing surfaces are integrally formed. Power system relay device. 3. The power system relay device according to claim 1, wherein when the guide rails are formed integrally with the housing, they are formed by a die casting method. 4. The power system relay device according to claim 3, wherein any one of the following compositions A to G is used as a material used for the aluminum die casting. Composition A: 0.3-0.4 wt% Cu-12.0-1
2.2 wt% Si-0.08 to 0.11 wt% Mg-
0.23-0.24wt% Mn-0.64-0.74w
t% Fe-0.09 to 0.10 wt% Zn-Bal. A
1, composition B; 2.8 to 3.0 wt% Cu-8.4 to 8.6
wt% Si-0.0 ~ 0.10wt% Mg-0.32-
0.37wt% Mn-0.70 ~ 0.71wt% Fe-
0.13 to 14 wt% Zn-Bal. Al, composition C; 1.9 to 2.5 wt% Cu-9.4 to 10.
4wt% Si-0.21 ~ 25wt% Mg-0.16 ~
0.38 wt% Mn-0.72-0.93 wt% Fe-
0.42 to 0.93 wt% Zn-Bal. Al, composition D; 0.01 wt% Cu-0.1 wt% Si-
0.80wt% Mn-0.09wt% Fe-0.01w
t% Ni-0.01wt% Ti-Bal. Al, composition E; 1.0-4.3 wt% Mn-0.5-1.0
wt% Fe-Bal. Al, composition F; 0.05 wt% Cu-1.0 wt% Co-B
al. Al, composition G; 2.0 wt% Mn-3.0 wt% Zn-1.
0 wt% Fe-0.5 wt% Mg-Bal. Al, 5. The power system relay according to claim 1, wherein an inner wall surface of the housing or a surface of the heat transfer plate is coated with a radiant heat absorbing material for promoting absorption of radiant heat. apparatus. 6. The method according to claim 1, wherein at least one of a housing surface of the housing or a surface of the heat transfer plate is provided with irregularities for increasing a contact area with an atmosphere.
The power system relay device according to the item. 7. A heat pipe for transferring heat from a high-temperature portion to a low-temperature portion on at least one of the housing surface of the housing and the surface of the heat transfer plate. The power system relay device according to claim 1. 8. The thermal expansion coefficient of the heat transfer plate is set to be larger than the thermal expansion coefficient of the guide rail, and the thermal contact between the heat transfer plate and the guide rail is maintained even when the temperature rises. The power system relay device according to any one of claims 1 to 7, wherein 9. A heat contact promoting material made of a copper or copper alloy material having excellent heat conductivity is coated on one of the guide groove of the guide rail and an end of the heat transfer plate. The power system relay device according to claim 1. 10. The material of the heat transfer plate is 100 to 2
The power system relay device according to any one of claims 1 to 9, wherein aluminum or an aluminum alloy material having a thermal conductivity of 30 W / mK is used.