JP2002324432A - Anisotropic conductive tape - Google Patents
Anisotropic conductive tapeInfo
- Publication number
- JP2002324432A JP2002324432A JP2001129580A JP2001129580A JP2002324432A JP 2002324432 A JP2002324432 A JP 2002324432A JP 2001129580 A JP2001129580 A JP 2001129580A JP 2001129580 A JP2001129580 A JP 2001129580A JP 2002324432 A JP2002324432 A JP 2002324432A
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive material
- adhesive
- base material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば液晶パネ
ル、PDPパネル、ELパネル、ベアチップ実装などの電子
部品と回路板、回路板同士を接着固定すると共に、両者
の電極同士を電気的に接続する異方導電材テープに関
し、特に接着剤と基材の構成に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a liquid crystal panel, a PDP panel, an EL panel, and a bare chip mounted on a circuit board or a circuit board, and electrically connects both electrodes together. The present invention relates to an anisotropic conductive material tape, and particularly to a configuration of an adhesive and a base material.
【０００２】[0002]
【従来の技術】異方導電材テープによる接続方法とし
て、相対峙する電極間にフィルム状の接着剤である異方
導電部材を挟み、加熱加圧することにより接続を行うこ
とが行われている。フィルム状の接着材中には、電極間
の導通を得る為の導電粒子が混合され、樹脂としては、
熱可塑性樹脂、熱硬化性樹脂、または熱可塑性樹脂と熱
硬化性樹脂の混合系が用いられている（例えば、特開昭
５５−１０４００７号公報参照）。また、導電粒子を含
まず、樹脂のみからなる回路接続方法も知られている
（例えば、特開昭６０−２６２４３０号公報）。樹脂の
代表的なものには熱可塑性樹脂系としてスチレン樹脂
系、ポリエステル樹脂系があり、また熱硬化性樹脂系と
してはエポキシ樹脂系、シリコーン樹脂系が知られてい
る。熱可塑性樹脂系、熱硬化性樹脂系共に接続する為
に、加熱加圧が必要である。これは、熱可塑性樹脂系で
は、樹脂を流動させ被着体との密着力を得る為に、また
熱硬化性樹脂系では、更に樹脂の硬化反応を行う為であ
る。近年、接続信頼性の面から、熱可塑性樹脂と熱硬化
性樹脂の混合系、熱硬化性樹脂系が主流となっており、
被接続体の反りや伸びを防ぐために異方導電材の接続時
の接続温度の低温化が要求されるようになり、また、異
方導電材の接続用途の拡大や液晶パネル、PDPパネル、E
Lパネル、ベアチップ実装などの需要拡大に伴い接続時
のタクトタイムの短時間化の要求が、強くなされるよう
になっている。最近では、上記熱硬化性樹脂系であるエ
ポキシ樹脂系、シリコーン樹脂系より更に低温度・短時
間で接続することが可能な反応性の高い熱ラジカル系が
脚光を浴びている。この熱ラジカル系は主にアクリル系
接着剤で構成されている。異方導電材の基材は、接着剤
を被接続部材に転写させる為、ポリ４弗化エチレン樹脂
などのフッ素系樹脂およびシリコーン系処理剤で処理し
たＰＥＴ（ポリエチレンテレフタレート樹脂）、ＰＰ
（ポリプロピレン樹脂）などが使用されている。しかし
ながら、電子部品のコンパクト化により、LCDパネルの
額縁が狭くなり、異方導電材テープの幅も１．０〜３．
０mmと細くなってきている。そこで、ポリ４弗化エチレ
ン樹脂などの強度が小さく伸び易い基材は被接続部材転
写時に基材と共に異方導電材であるフィルム状接着剤が
伸び、フィルム状接着剤の厚みが薄くなったり、幅が細
くなってしまう。一方、近年は転写性を付与するために
シリコーン処理したPP及びＰＥＴなどが基材として用い
られている。しかしながら、このようなシリコーン処理
した基材の場合、被接続部材へのシリコーンの転写の可
能性がある。このシリコーンの転写により異方導電材で
あるフィルム状接着剤の本来の特性である密着性を低下
させる場合がある。さらに、接着剤の低応力化を図り、
接着剤の相溶性に効果のあるシリコーン樹脂を異方導電
材であるフィルム状接着剤の材料として使用した場合は
シリコーン処理した基材はフィルム状接着剤との密着力
が強くなってしまい接続部材への転写がしにくくなって
しまう。2. Description of the Related Art As a connection method using an anisotropic conductive material tape, a connection is made by sandwiching an anisotropic conductive member, which is a film-like adhesive, between opposing electrodes and applying heat and pressure. In the film-like adhesive, conductive particles for obtaining conduction between the electrodes are mixed, and as the resin,
A thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin is used (for example, see Japanese Patent Application Laid-Open No. 55-104007). Also, a circuit connection method that does not include conductive particles and is made of only resin is also known (for example, Japanese Patent Application Laid-Open No. 60-262430). Typical examples of the resin include a styrene resin type and a polyester resin type as a thermoplastic resin type, and an epoxy resin type and a silicone resin type as a thermosetting resin type. Heating and pressurizing is required to connect both the thermoplastic resin system and the thermosetting resin system. This is because in the case of a thermoplastic resin system, the resin is caused to flow to obtain an adhesive force with an adherend, and in the case of a thermosetting resin system, the resin is further cured. In recent years, from the viewpoint of connection reliability, a mixed system of a thermoplastic resin and a thermosetting resin, a thermosetting resin system has become mainstream,
In order to prevent warpage and elongation of the connected object, it is required to lower the connection temperature when connecting the anisotropic conductive material.In addition, the connection application of the anisotropic conductive material has been expanded, and liquid crystal panels, PDP panels, E
With the growing demand for L-panel and bare chip mounting, demands for shorter tact time at the time of connection have been increasing. In recent years, hot radical systems having high reactivity, which can be connected at a lower temperature and in a shorter time than those of the above-mentioned thermosetting resin systems such as epoxy resin systems and silicone resin systems, have been spotlighted. This thermal radical system is mainly composed of an acrylic adhesive. The base material of the anisotropic conductive material is made of PET (polyethylene terephthalate resin), PP treated with a fluorine-based resin such as polytetrafluoroethylene resin and a silicone-based treatment agent in order to transfer the adhesive to the member to be connected.
(Polypropylene resin) or the like is used. However, with the downsizing of the electronic components, the frame of the LCD panel has become narrower, and the width of the anisotropic conductive material tape has also become 1.0 to 3.
It is getting thinner at 0mm. Therefore, for a base material such as polytetrafluoroethylene resin, which has a small strength and is easily stretched, the film adhesive which is an anisotropic conductive material is stretched together with the base material at the time of transfer of the connected member, and the thickness of the film adhesive is reduced. The width becomes thin. On the other hand, in recent years, PP, PET, and the like, which have been subjected to silicone treatment to impart transferability, have been used as substrates. However, in the case of such a siliconized substrate, there is a possibility that the silicone is transferred to the member to be connected. The transfer of the silicone may reduce the adhesiveness, which is the original property of the film adhesive as the anisotropic conductive material. Furthermore, the stress of the adhesive is reduced,
If a silicone resin that is effective for the compatibility of the adhesive is used as the material of the film adhesive, which is an anisotropic conductive material, the silicone-treated base material has a strong adhesion to the film adhesive, and the connection member It is difficult to transfer it to
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記欠点に
鑑みなされたもので、異方導電材テープの異方導電材で
あるフィルム状接着剤が被接続部材に不具合無く転写
し、異方導電材の特性を損なうことのない異方導電材テ
ープを提供することを目的とした。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and a film-like adhesive which is an anisotropic conductive material of an anisotropic conductive material tape is transferred to a member to be connected without trouble. An object of the present invention is to provide an anisotropic conductive material tape which does not impair the properties of the conductive material.
【０００４】[0004]
【課題を解決するための手段】本発明は、フィルム状接
着剤と基材からなり、基材の接着剤面とその背面の両方
にフッ素処理を施した基材からなる異方導電材テープで
ある。そして、基材の引張り強さが１２ｋｇ／ｍｍ2以
上、基材の伸びが、６０〜２００％、基材の厚みが１０
０μｍ以下の基材からなる異方導電材テープである。異
方導電材テープの基材（３）の基材接着剤面（４）にフ
ッ素処理を施すことにより塗布されたフィルム状接着剤
（２）を比較的低い加熱加圧により被接続部材に転写す
ることが可能である。フッ素処理を施した基材（３）を
用いることにより、シリコーンで処理した基材を用いた
場合に起こる可能性のあるシリコーンの接続部材への転
写はなく、異方導電材の特徴である良好な密着力が得ら
れる。また、フッ素処理を施した基材は異方導電材の材
料としてシリコーン樹脂を用いた場合にもフィルム状接
着剤（２）を比較的低い加熱加圧により被接続部材に転
写することが可能である。一方、基材背面（５）に基材
の接着剤面（４）よりさらに転写性の良いフッ素処理を
施すことにより、異方導電材をテープ状にした場合に、
フィルム状接着剤（２）が基材背面（５）に転写するこ
とを防ぐ事が可能となる。基材（３）の引張り強度は１
２ｋｇ／ｍｍ2以上、基材（３）の伸びは６０〜２００
％の範囲にすることにより、基材が強度を持ち、伸びが
小さいため、異方導電材であるフィルム状接着剤（２）
を接続部材に転写する前のプロセスにおいて、フィルム
状接着剤（２）が伸びたり、厚みが薄くなったり、幅が
細くなったりすることを防止できる。また、基材（３）
の厚みはハンドリング及び環境面から１００μｍ以下が
望ましい。SUMMARY OF THE INVENTION The present invention relates to an anisotropic conductive material tape comprising a film adhesive and a substrate, and having both the adhesive surface and the back surface of the substrate treated with fluorine. is there. And, the tensile strength of the substrate is 12 kg / mm 2 or more, the elongation of the substrate is 60 to 200%, and the thickness of the substrate is 10%.
This is an anisotropic conductive material tape made of a substrate having a size of 0 μm or less. The film adhesive (2) applied by subjecting the base adhesive surface (4) of the base (3) of the anisotropic conductive material tape to a fluorine treatment is transferred to the member to be connected by relatively low heat and pressure. It is possible to By using the fluorine-treated base material (3), there is no transfer of silicone to the connecting member, which may occur when using the base material treated with silicone, which is a good characteristic of the anisotropic conductive material. High adhesion is obtained. In addition, even when a silicone resin is used as the material of the anisotropic conductive material, the film-like adhesive (2) can be transferred to the member to be connected by relatively low heat and pressure even when the fluorine-treated base material is a silicone resin. is there. On the other hand, when the back surface (5) of the base material is subjected to a fluorine treatment having better transferability than the adhesive surface (4) of the base material, when the anisotropic conductive material is formed into a tape,
It is possible to prevent the film adhesive (2) from being transferred to the back surface (5) of the substrate. The tensile strength of the substrate (3) is 1
2 kg / mm 2 or more, elongation of the substrate (3) is 60 to 200
%, Since the base material has strength and low elongation, the film adhesive (2) which is an anisotropic conductive material
In the process before transferring to the connecting member, it is possible to prevent the film-like adhesive (2) from being stretched, thinned, and narrowed. Also, the substrate (3)
Is preferably 100 μm or less from the viewpoint of handling and environment.
【０００５】[0005]
【発明の実施の形態】図面を参照し、本発明をさらに具
体的に説明する。図1は本発明の異方導電材テープの一
実施例を説明する断面模式図である。図2は、図1の異方
導電材テープの部分拡大図である。本発明の異方導電材
テープ（１）は、基材（３）上に塗布された異方導電材
であるフィルム状接着剤（２）からなり、高精細化され
た電子部品の接続に用いるため無機物または有機物の異
物及び汚染を防ぐため、基材が接着剤の外側となる構造
を示している。本発明に用いられるフィルム状接着剤
（２）は、高信頼性を有する熱硬化性樹脂系であるエポ
キシ樹脂系、接着剤の低応力化を図り、接着剤の相溶性
に効果のあるシリコーン樹脂系、これらより更に低温度
・短時間で接続することが可能なアクリル系接着剤を用
いたラジカル系等であるが、これらに制限するものでは
ない。さらに、本発明の異方導電材テープに用いられる
基材（３）は、引張り強度及び異方導電材を横成する接
着剤の剥離性の面からフッ素処理したＰＰ、ＯＰＰ（延
伸ポリプロピレン樹脂）、ＰＥＴ（ポリエチレンテレフ
タレート樹脂）、ＰＩ（ポリイミド樹脂）などを用いる
が、これらに制限するものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described more specifically with reference to the drawings. FIG. 1 is a schematic cross-sectional view illustrating one embodiment of the anisotropic conductive material tape of the present invention. FIG. 2 is a partially enlarged view of the anisotropic conductive material tape of FIG. The anisotropic conductive material tape (1) of the present invention is composed of a film-like adhesive (2) which is an anisotropic conductive material applied on a substrate (3), and is used for connecting high-definition electronic components. Therefore, the structure in which the base material is outside the adhesive is shown in order to prevent foreign substances and contamination of inorganic or organic substances. The film-like adhesive (2) used in the present invention is a highly-reliable thermosetting resin-based epoxy resin, a silicone resin which reduces the stress of the adhesive and has an effect on the compatibility of the adhesive. Examples include, but are not limited to, a radical system using an acrylic adhesive which can be connected at a lower temperature and for a shorter time than these. Further, the base material (3) used for the anisotropic conductive material tape of the present invention is made of fluorinated PP or OPP (stretched polypropylene resin) from the viewpoint of tensile strength and releasability of an adhesive laying over the anisotropic conductive material. , PET (polyethylene terephthalate resin), PI (polyimide resin), and the like, but are not limited thereto.
【０００６】異方導電材は、相対峙する被接続部材の密
着及び電気的特性を有すもので、ある程度異方導電材の
転写性が必要である。接続部材がシリコーン等の有機物
質で汚染されていると密着力が低下したり、異方導電材
を用いた接続においては用途及び需要拡大に伴い、タク
トタイムの向上が求められており異方導電材の転写性が
強く要求されているが、シリコーン処理ではこれらの要
求には十分ではなかった。基材の処理をシリコーン処理
からフッ素処理にすることにより転写性に優れ、密着力
を損なわない異方導電材を供給することが可能となる。
一方、シリコーン系樹脂を使用した場合、シリコーン処
理した基材に密着力が高く、転写性が損なわれてしまう
がフッ素処理を施した基材を用いることによりシリコー
ン系樹脂を使用しても良好な転写性を得られる。[0006] The anisotropic conductive material has close contact and electrical characteristics of the connected members facing each other, and needs to have a certain degree of transferability of the anisotropic conductive material. If the connecting member is contaminated with an organic substance such as silicone, the adhesive force will decrease.In connection using an anisotropic conductive material, the tact time is required to be improved due to the expansion of applications and demand. Although transferability of the material is strongly required, silicone treatment has not been sufficient for these requirements. By changing the treatment of the base material from the silicone treatment to the fluorine treatment, it becomes possible to supply an anisotropic conductive material which is excellent in transferability and does not impair the adhesion.
On the other hand, when a silicone-based resin is used, the adhesion to the silicone-treated substrate is high, and transferability is impaired. Transferability can be obtained.
【０００７】さらに、基材の物性値である基材の引張り
強度は１２ｋｇ／ｍｍ2以上で、基材の伸びは６０〜２
００％の範囲とすることにより、基材に物理的強度が得
られ、フィルム状接着剤の伸びに伴う、薄膜化、幅方向
に細くなることを防ぐことが可能である。また、基材の
厚みは１００μｍ以下にすることにより、ハンドリング
及び環境面での対応が可能となる。Further, the tensile strength of the base material, which is the physical property value of the base material, is 12 kg / mm 2 or more, and the elongation of the base material is 60 to 2 kg / mm 2.
When the content is in the range of 00%, physical strength is obtained in the base material, and it is possible to prevent the base material from becoming thinner and becoming thinner in the width direction due to the elongation of the film adhesive. By setting the thickness of the base material to 100 μm or less, handling and environmental measures can be performed.
【０００８】[0008]
【実施例】次に実施例により本発明を具体的に説明する
が、本発明はこの実施例に限定されるものではない。 （１）異方導電材テープの作製 異方導電材の接着剤として、シリコーン系とエポキシ系
をそれぞれ用いた。シリコーン系としては、フィルム形
成材としてフェノキシ樹脂（高分子量エポキシ樹脂、重
量平均分子量45000）４０ｇとシリコーン系樹脂である
両末端エポキシ変性シリコーン樹脂２０ｇ、硬化促進剤
（マイクロカプセル型潜在性硬化剤を含有する液状エポ
キシ樹脂、エポキシ当量１８５）を４０ｇ添加し、酢酸
エチル／トルエン＝１／１重量比の３０重量％溶液を作
製し、これに平均粒径２．５μｍのＮｉ粉を５体積％添
加し、異方導電材の接着剤溶液を得た。また、エポキシ
系としては、フィルム形成材としてフェノキシ樹脂（高
分子量エポキシ樹脂）４０ｇとエポキシ樹脂（液状ビス
フェノールＡ型エポキシ樹脂）２０ｇ、硬化促進剤（マ
イクロカプセル型潜在性硬化剤を含有する液状エポキシ
樹脂、エポキシ当量１８５）を４０ｇ添加し、酢酸エチ
ル／トルエン＝１／１重量比の３０重量％溶液を作製
し、これに平均粒径２．５μｍのＮｉ粉を５体積％添加
し、異方導電材の接着剤溶液を得た。この溶液を厚み５
０μmの基材にロールコータで塗布し、１１０℃、２０
分乾燥し、厚み５０μm、長さ５０mの異方導電材フィル
ムを得た。基材としてポリエチレンテレフタレートフィ
ルム（ＰＥＴ：実施例１，３、比較例１、２）、延伸ポ
リプロピレンフィルム（ＯＰＰ：実施例２）、ポリ四弗
化エチレンフィルム（テフロン（登録商標）：比較例
３）を用い、表１に示すようにこの両面の接着剤面及び
基材背面にあらかじめフッ素処理またはシリコーン処理
した。得られた異方導電材フィルムは、さらに幅１．５
mmにスリットして、異方導電材テープを得た。シリコー
ン処理は、トーレシリコーン社製の紫外線硬化型を用い
た。フッ素処理は、ダイキン工業株式会社製のユニダイ
ンＴＧを用いた。Next, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples. (1) Production of anisotropic conductive material tape A silicone-based and an epoxy-based adhesive were used as adhesives for the anisotropic conductive material. As the silicone resin, 40 g of a phenoxy resin (high-molecular-weight epoxy resin, weight-average molecular weight: 45,000) as a film-forming material, 20 g of a silicone-based epoxy resin modified at both ends, and a curing accelerator (containing a microcapsule type latent curing agent) 40 g of a liquid epoxy resin having an epoxy equivalent of 185) was prepared to prepare a 30% by weight solution of ethyl acetate / toluene = 1/1 by weight, and 5% by volume of Ni powder having an average particle size of 2.5 μm was added thereto. Thus, an adhesive solution of an anisotropic conductive material was obtained. As the epoxy resin, 40 g of a phenoxy resin (high molecular weight epoxy resin) and 20 g of an epoxy resin (liquid bisphenol A type epoxy resin) as a film forming material, a curing accelerator (a liquid epoxy resin containing a microcapsule type latent curing agent) , Epoxy equivalent 185) was added to prepare a 30% by weight solution of ethyl acetate / toluene = 1/1 by weight, to which 5% by volume of Ni powder having an average particle size of 2.5 μm was added. An adhesive solution of the material was obtained. This solution is applied to a thickness of 5
Coated on a 0 μm substrate with a roll coater,
After drying, an anisotropic conductive material film having a thickness of 50 μm and a length of 50 m was obtained. As substrates, polyethylene terephthalate film (PET: Examples 1 and 3, Comparative Examples 1 and 2), stretched polypropylene film (OPP: Example 2), polytetrafluoroethylene film (Teflon (registered trademark): Comparative Example 3) As shown in Table 1, the adhesive surface on both surfaces and the back surface of the substrate were preliminarily treated with fluorine or silicone. The obtained anisotropic conductive material film further has a width of 1.5
By slitting to an mm, an anisotropic conductive material tape was obtained. For the silicone treatment, an ultraviolet curing type manufactured by Toray Silicone Co., Ltd. was used. For the fluorine treatment, Unidyne TG manufactured by Daikin Industries, Ltd. was used.
【０００９】（２）評価 試験として接着剤と基材の仕
様の組み合わせにおいて被接続部材へのシリコーン転
写、転写性及び異方導電材の伸びにより評価を行った。
シリコーン転写は接続部材に異方導電材を仮圧着（９０
℃、１ＭＰａ、５秒）し、ＸＭＡ（Ｘ線マイクロアナラ
イザ）にてシリコーンの転写の確認が出来なかったもの
は、○で、そうでないものは×で示した。転写性は同様
に接続部材に異方導電材を仮圧着（９０℃、１ＭＰａ、
５秒）し、良好に転写できたものは、○で、そうでない
ものは×で示した。一方、異方導電材テープの伸びはテ
ープを５ｃｍ切り取り、その先端に１００ｇの重りを付
けてつるし、重りを付ける前の長さと重りを付けた後の
長さを測定し、伸びなかったものは○で、そうでないも
のは×で示した。これらの評価結果を表1に示した。(2) Evaluation As a test, evaluation was made on silicone transfer to a member to be connected, transferability, and elongation of an anisotropic conductive material in a combination of specifications of an adhesive and a base material.
Silicone transfer is performed by temporarily crimping an anisotropic conductive material (90
C., 1 MPa, for 5 seconds), and the results of XMA (X-ray microanalyzer) for which transfer of the silicone could not be confirmed were indicated by "O", and those not determined by "X". The transferability is similarly determined by temporarily pressing an anisotropic conductive material on the connecting member (90 ° C., 1 MPa,
5 seconds), those that were successfully transferred were indicated by ○, and those that were not transferred were indicated by x. On the other hand, the elongation of the anisotropic conductive material tape was measured by cutting off the tape by 5cm, attaching a 100g weight to the end of the tape, measuring the length before applying the weight and the length after applying the weight. ○, those not so are indicated by ×. Table 1 shows the results of these evaluations.
【００１０】[0010]
【表１】 [Table 1]
【００１１】実施例１のシリコーン系樹脂、基材はＰＥ
Ｔ、接着剤面及び背面ともにフッ素処理を施した基材を
使用した場合、シリコーン転写、異方導電材の転写性及
び伸び試験においてすべての試験項目で良好な結果が得
られた。同様に実施例２、３の組み合わせにおいても良
好な結果が得られた。一方、比較例1においては、実施
例1と同様の評価を行ったが、シリコーンの転写が確認
された。比較例２においては転写性が悪く、シリコーン
の転写評価も不可能であった。さらに、比較例3では異
方導電材テープの伸びが確認された。[0011] The silicone resin of Example 1 and the substrate is PE
In the case of using a base material subjected to fluorine treatment for both T and the adhesive surface and the back surface, good results were obtained in all test items in silicone transfer, transferability of anisotropic conductive material, and elongation test. Similarly, good results were obtained with the combination of Examples 2 and 3. On the other hand, in Comparative Example 1, the same evaluation as in Example 1 was performed, but transfer of silicone was confirmed. In Comparative Example 2, transferability was poor, and transfer evaluation of silicone was impossible. Further, in Comparative Example 3, the elongation of the anisotropic conductive material tape was confirmed.
【００１２】[0012]
【発明の効果】本発明によれば、フィルム状の接着剤と
接着剤面あるいは接着剤面と背面の両方にフッ素処理を
施した基材を用い、基材の引張り強度は１２ｋｇ／ｍｍ
2以上で、基材の伸びは６０〜２００％の範囲、基材厚
みを１００μｍ以下にすることにより、被接続部材に対
して良好な転写性を有し、優れた信頼性を有する異方導
電材テープを提供することが可能である。According to the present invention, a film-like adhesive and a substrate which has been subjected to fluorine treatment on the adhesive surface or on both the adhesive surface and the back surface are used, and the tensile strength of the substrate is 12 kg / mm.
By setting the elongation of the base material to 2 or more, the elongation of the base material in the range of 60 to 200%, and the base material thickness of 100 μm or less, the anisotropic conductive material has good transferability to the connected member and excellent reliability. It is possible to provide a material tape.
【図1】 本発明の異方導電材テープの全体構成を示す
断面模式図。FIG. 1 is a schematic cross-sectional view showing the overall configuration of an anisotropic conductive material tape of the present invention.
【図2】 本発明の異方導電材テープの一部分を示す断
面模式図。FIG. 2 is a schematic cross-sectional view showing a part of the anisotropic conductive material tape of the present invention.
１．異方導電材テープ ２．フィルム状接着剤 ３．基材 ４．基材接着剤面 ５．基材背面 1. 1. Anisotropic conductive material tape 2. film adhesive Base material 4. 4. Base material adhesive surface Substrate back
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小島 実 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮事業所内 Ｆターム(参考） 4F100 AT00B BA02 CB02A EJ01 GB41 JG01A JK02B JK08B JL01 JL05 JL14B YY00B 4J004 AA10 AA11 AA13 CA04 CA06 CC02 CD01 DB02 FA05 5G307 HA02 HB00 HC01 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Minoru Kojima 1150 Goshomiya, Shimodate-shi, Ibaraki Pref. YY00B 4J004 AA10 AA11 AA13 CA04 CA06 CC02 CD01 DB02 FA05 5G307 HA02 HB00 HC01
Claims (2)
のフィルム状接着剤の接着剤面とその背面の両方にフッ
素処理を施した基材からなる異方導電材テープ。1. An anisotropic conductive material tape comprising a film adhesive and a substrate, wherein both the adhesive surface and the back surface of the film adhesive of the substrate have been subjected to fluorine treatment.
２ｋｇ／ｍｍ2以上、基材の伸び６０〜２００％、基材
の厚み １００μｍ以下の基材からなる異方導電材テー
プ。2. The tensile strength of the substrate according to claim 1,
An anisotropic conductive material tape made of a base material having a thickness of 2 kg / mm 2 or more, a base material elongation of 60 to 200%, and a base material thickness of 100 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001129580A JP2002324432A (en) | 2001-04-26 | 2001-04-26 | Anisotropic conductive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001129580A JP2002324432A (en) | 2001-04-26 | 2001-04-26 | Anisotropic conductive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002324432A true JP2002324432A (en) | 2002-11-08 |
Family
ID=18978085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001129580A Pending JP2002324432A (en) | 2001-04-26 | 2001-04-26 | Anisotropic conductive tape |
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| Country | Link |
|---|---|
| JP (1) | JP2002324432A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005330296A (en) * | 2003-06-20 | 2005-12-02 | Hitachi Chem Co Ltd | Connecting method of adhesive material tape |
| JP2006294915A (en) * | 2005-04-12 | 2006-10-26 | Hitachi Chem Co Ltd | Adhesive film for semiconductor, substrate for mounting semiconductor chip, and semiconductor device |
| JP2008179682A (en) * | 2007-01-24 | 2008-08-07 | Sony Chemical & Information Device Corp | Anisotropically electroconductive adhesive and electric installation |
| JP2009256673A (en) * | 2008-03-28 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive film with support |
| JPWO2021019932A1 (en) * | 2019-07-29 | 2021-02-04 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03285977A (en) * | 1990-04-02 | 1991-12-17 | Three Bond Co Ltd | Anisotropic electrically conductive filmy adhesive |
| JPH05154857A (en) * | 1991-12-05 | 1993-06-22 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film |
-
2001
- 2001-04-26 JP JP2001129580A patent/JP2002324432A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03285977A (en) * | 1990-04-02 | 1991-12-17 | Three Bond Co Ltd | Anisotropic electrically conductive filmy adhesive |
| JPH05154857A (en) * | 1991-12-05 | 1993-06-22 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005330296A (en) * | 2003-06-20 | 2005-12-02 | Hitachi Chem Co Ltd | Connecting method of adhesive material tape |
| JP2006294915A (en) * | 2005-04-12 | 2006-10-26 | Hitachi Chem Co Ltd | Adhesive film for semiconductor, substrate for mounting semiconductor chip, and semiconductor device |
| JP2008179682A (en) * | 2007-01-24 | 2008-08-07 | Sony Chemical & Information Device Corp | Anisotropically electroconductive adhesive and electric installation |
| JP2009256673A (en) * | 2008-03-28 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive film with support |
| JPWO2021019932A1 (en) * | 2019-07-29 | 2021-02-04 | ||
| JP7359210B2 (en) | 2019-07-29 | 2023-10-11 | 株式会社村田製作所 | Crystal oscillators, electronic components and electronic equipment |
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