JP2002323392A - Package for pressure detector and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized and highly sensitive pressure detector not causing ceramic green sheets for a ceramic plate to bend in manufacture and capable of accurately detecting external pressure. SOLUTION: In this package for the pressure detector, a semiconductor element 5 is mounted on one principal surface of a ceramic substrate 1 while a first metallized electrode 9 for capacitance formation is provided on the other principal surface thereof, and the ceramic plate 3 having, on its inside principal surface, a second metallized electrode 10 confronting the metallized electrode 9 is sintered and united in a flexible state with the other principal surface of the ceramic substrate 1 via a ceramic frame body 2 so as to form a closed space bordering this principal surface. An auxiliary ceramic frame body 4 having a shape corresponding to the frame body 2 is layered on the outside principal surface of the ceramic plate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure detecting device package used for a pressure detecting device for detecting pressure and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a capacitance type pressure detecting device has been known as a pressure detecting device for detecting pressure. As shown in a sectional view of FIG. 5, for example, a capacitance type pressure sensing element 32 and a package 38 are provided on a wiring board 31 made of a ceramic material or a resin material.
And a semiconductor element 39 for operation housed in the computer. The pressure-sensitive element 32 is made of, for example, an electrically insulating material such as a ceramic material.
An insulating substrate 34 having a concave portion with
An insulating plate 36, which is joined in a flexible state so as to form a closed space between the insulating base 34 and the upper surface of the insulating substrate 34, and the other electrode 35 for forming a capacitance is attached to the lower surface, Each of the electrodes 33 and 35 for forming a capacitance is composed of an external lead terminal 37 for electrically connecting the electrode to the outside, and each of the capacitances is formed by bending the insulating plate 36 according to an external pressure. The capacitance formed between the forming electrodes 33 and 35 changes. An external pressure can be detected by arithmetically processing the change in the capacitance by the arithmetic semiconductor element 39.

[0003]

However, according to the conventional pressure detecting device, the pressure-sensitive element 32 and the semiconductor element 39 are not provided.
Are separately mounted on the wiring board 31, which increases the size of the pressure detection device and the pressure detection electrode.
The wiring between 33 and 35 and the semiconductor element 39 becomes longer,
There is a problem that the sensitivity is low because an unnecessary capacitance is formed between the long wires.

Accordingly, the applicant of the present application has previously filed Japanese Patent Application No. 2001-860.
38. A ceramic substrate having a mounting portion on one main surface on which a semiconductor element is mounted, and a plurality of metallized wirings disposed on the surface and inside of the ceramic substrate and electrically connected to respective electrodes of the semiconductor element. A ceramic plate sintered and integrated with the ceramic base in a flexible state so as to form a sealed space between the conductor and the other main surface of the ceramic base; and a ceramic plate adhered to the surface of the ceramic base in the closed space. A first metallized electrode for forming a capacitance electrically connected to one of the metallized wiring conductors, and is adhered to the inner surface of the ceramic plate so as to face the first metallized electrode, A package for a pressure detecting device comprising a second metallized electrode for forming a capacitance electrically connected to another one is proposed.

According to the pressure detecting device package,
A first metallization electrode for forming a capacitance is provided on the other main surface of a ceramic substrate having a mounting portion on which a semiconductor element is mounted on one main surface, and a first metallization electrode for forming a capacitance opposing the first metallization electrode is provided. The ceramic plate having the second metallized electrode on the inner main surface is joined in a flexible state so as to form a sealed space between the ceramic plate and the other main surface of the ceramic base, so that the semiconductor element is accommodated. The pressure-sensitive element is formed integrally with the package, and as a result, the pressure detecting device can be reduced in size, and the wiring for connecting the electrode for pressure detection and the semiconductor element is shortened. Unnecessary capacitance can be reduced.

The package for a pressure detecting device proposed in Japanese Patent Application No. 2001-86038 is manufactured by using a ceramic green sheet laminating method. Specifically, a flat ceramic green sheet for a ceramic substrate is used. A ceramic green sheet having a through hole for forming a closed space and a flat ceramic green sheet for a ceramic plate are prepared, and these ceramic green sheets are used for metallized wiring conductors, first metallized electrodes and second metallized electrodes. The metallized paste is printed and applied. Thereafter, the ceramic green sheets on which the metallized paste is printed and applied are vertically laminated and pressed to form a green ceramic molded body for a package. By firing the body at high temperature Had been produced.

However, in a package for a pressure detecting device proposed in Japanese Patent Application No. 2001-86038, a flat ceramic green sheet for a ceramic base, a ceramic green sheet having a through hole for forming an enclosed space, and a ceramic green sheet having a through hole are formed. When laminating and pressing the flat plate-shaped ceramic green sheet, the portion of the ceramic green sheet for the ceramic plate that closes the through hole is easily bent toward the ceramic green sheet for the ceramic substrate due to the pressure at the time of lamination. However, there is a problem that its manufacture is extremely difficult.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object that a ceramic green sheet for a ceramic plate does not bend at the time of its manufacture, and is small in size and high in sensitivity. An object of the present invention is to provide a package for a pressure detection device capable of accurately detecting external pressure.

[0009]

According to the present invention, there is provided a pressure sensing device package comprising a ceramic base having a mounting portion on one side of which a semiconductor element is mounted, and a surface and an interior of the ceramic base. A plurality of metallized wiring conductors to which each electrode of the semiconductor element is electrically connected, and a ceramic frame interposed between the other main surface of the ceramic base and the other main surface so as to form a sealed space. A ceramic plate that is sintered and integrated in a flexible state, and a first metallized electrode for forming a capacitance that is adhered to the surface of the ceramic substrate in an enclosed space and is electrically connected to one of the metallized wiring conductors And a second metallized electrode for forming a capacitance, which is attached to the inner main surface of the ceramic plate so as to face the first metallized electrode and is electrically connected to another one of the metallized wiring conductors. A package for a pressure sensing device comprising Te, ceramic plate, is characterized in that the auxiliary insulating wall having a shape corresponding to the insulating wall on the outer main surface is laminated.

Further, according to the method of manufacturing a package for a pressure detecting device of the present invention, a ceramic substrate having a mounting portion on which a semiconductor element is mounted on one main surface is provided between the other main surface and the other main surface. A method for manufacturing a package for accommodating a pressure sensing element, wherein a ceramic plate is sintered and integrated in a flexible state via a ceramic frame so as to form an enclosed space, wherein a flat ceramic green for a ceramic base is provided. A sheet, a ceramic green sheet for a ceramic frame having a through hole for forming an enclosed space, a flat ceramic green sheet for a ceramic plate, and an auxiliary shape corresponding to the ceramic green sheet for the ceramic frame. A step of preparing a ceramic green sheet for a ceramic frame; and a step of preparing a ceramic green sheet and a ceramic for a ceramic substrate. The ceramic green sheet for the ceramic frame, the ceramic green sheet for the ceramic plate, and the ceramic green sheet for the auxiliary ceramic frame are sequentially laminated to form a ceramic green sheet for the ceramic base and a ceramic green sheet for the ceramic plate. Forming a green ceramic molded body for a package having a closed space corresponding to the thickness of a ceramic green sheet for a ceramic frame between the ceramic frame and a step of firing the green ceramic molded body for the package It is characterized by the following.

According to the pressure detecting device package of the present invention, since the ceramic plate has the auxiliary ceramic frame of a shape corresponding to the ceramic frame laminated on the outer main surface thereof, each ceramic green to be a package is formed. When stacking the sheets, the ceramic green sheet for the ceramic plate is subjected to substantially even pressure from above and below by the ceramic green sheet for the ceramic frame and the ceramic green sheet for the auxiliary ceramic frame, so that bending occurs. Therefore, it is possible to provide a compact and high-sensitivity package for a pressure detecting device having a sealed space at a predetermined interval between the ceramic base and the ceramic plate.

According to the method of manufacturing a package for a pressure detecting device of the present invention, a flat ceramic green sheet for a ceramic base and a ceramic green for a ceramic frame having a through hole for forming a closed space are provided. A raw ceramic for a package is formed by laminating and stacking a sheet, a flat ceramic green sheet for a ceramic plate, and a ceramic green sheet for an auxiliary ceramic frame having a shape corresponding to the ceramic green sheet for the ceramic frame. Since the ceramic body is formed, pressure is applied to the ceramic green sheets for the ceramic plates substantially uniformly from above and below by the ceramic green sheets for the ceramic frame and the ceramic green sheets for the auxiliary ceramic frame during the lamination. Therefore, no bending occurs, and therefore It is possible to provide a high sensitivity of package pressure detecting apparatus compact having a closed space of a predetermined distance between the ceramic substrate and the ceramic plate.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a pressure detection device package according to the present invention.
1 is a ceramic base, 2 is a ceramic frame, 3 is a ceramic plate, 4 is an auxiliary ceramic frame, and 5 is a semiconductor element.

The ceramic base 1 has a concave portion 1a for accommodating the semiconductor element 5 in the center of the lower surface, and is made of a ceramic such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic. It is a substantially rectangular laminate made of a material, and is formed by laminating a plurality of ceramic green sheets and firing them.

In the ceramic base 1, the center of the bottom surface of the concave portion 1a formed in the center of the lower surface is a mounting portion 1b on which the semiconductor element 5 is mounted, and the semiconductor element 5 is mounted on the mounting portion 1b. The semiconductor element 5 is sealed by filling the recess 1a with a resin sealing material 6 such as an epoxy resin. In this example, the semiconductor element 5 is sealed by filling a resin sealing material 6 in the recess 1a. However, the semiconductor element 5 is provided with a lid made of metal or ceramic on the lower surface of the ceramic base 1 in the recess 1a. It may be sealed by joining so as to close.

A plurality of metallized wiring conductors 7 connected to the respective electrodes of the semiconductor element 5 are led out from the mounting portion 1b. The metallized wiring conductor 7 and the respective electrodes of the semiconductor element 5 are connected to the solder bumps 8 and the like. By bonding via a conductive bonding member made of a conductive material, each electrode of the semiconductor element 5 and each metallized wiring conductor 7 are electrically connected, and the semiconductor element 5 is fixed to the mounting portion 1b. In this example, the electrodes of the semiconductor element 5 and the metallized wiring conductors 7 are connected via the solder bumps 8, but the electrodes of the semiconductor element 5 and the metallized wiring conductors 7 are connected to each other by another type of electric wire such as a bonding wire. May be connected by a dynamic connection means.

The metallized wiring conductor 7 functions as a conductive path for electrically connecting each electrode of the semiconductor element 5 to an external electric circuit and a first metallized electrode 9 and a second metallized electrode 10, which will be described later. Is led out to the lower surface of the outer periphery of the ceramic base 1, and another part is electrically connected to the first metallized electrode 9 and the second metallized electrode 10. Each electrode of the semiconductor element 5 is electrically connected to the metallized wiring conductor 7 via a conductive bonding material, and the semiconductor element 5 is sealed with a resin sealing material 6. The semiconductor element 5 housed inside by joining a portion led out to the lower surface of the outer periphery of the insulating base 1 to a wiring conductor of an external electric circuit board via a conductive joining material such as solder.
Are electrically connected to an external electric circuit.

The metallized wiring conductor 7 is made of metallized metal powder such as tungsten, molybdenum, copper, silver, etc., and is mixed with a metal powder such as tungsten by adding an appropriate organic binder, solvent, plasticizer, dispersant and the like. The metallized paste thus obtained is applied in a predetermined pattern to a ceramic green sheet for the ceramic substrate 1 by employing a conventionally known screen printing method, and is fired to form a predetermined pattern on the inside and the surface of the ceramic substrate 1. Formed. In order to prevent the metallized wiring conductor 7 from being oxidized and corroded and to improve the bonding between the metallized wiring conductor 7 and a conductive bonding material such as solder, the exposed surface of the metallized wiring conductor 7 is usually formed on the exposed surface. If,
Nickel plating layer with thickness of about 1-10 μm and thickness of 0.1
A gold plating layer of about 3 μm is sequentially applied.

A first metallized electrode 9 for forming a capacitance is attached to the center of the upper surface of the ceramic substrate 1. The first metallized electrode 9 is for forming a capacitance for a pressure-sensitive element together with a second metallized electrode 10 of the ceramic plate 3 described later, and is formed in a substantially circular pattern, for example. One of the metallized wiring conductors 7a is connected to the first metallized electrode 9 so that the electrode of the semiconductor element 5 is connected to the metallized wiring conductor 7a via a conductive bonding material such as a solder bump 8. When connected, the electrode of the semiconductor element 5 and the first metallized electrode 9
And are electrically connected.

The first metallized electrode 9 is made of metallized metal powder such as tungsten, molybdenum, copper, silver or the like, and is mixed with a metal powder such as tungsten by adding an appropriate organic binder, solvent, plasticizer and dispersant. The metallized paste thus obtained is printed and applied to a ceramic green sheet for the ceramic substrate 1 by employing a conventionally known screen printing method, and is fired to form a ceramic substrate 1.
Is formed in a predetermined pattern at the center of the upper surface of the.

On the upper surface of the ceramic substrate 1, a thickness of 0.01 to 5 m is provided so as to surround the first metallized electrode 9.
About m m of ceramic frame 2 are sintered and integrated. The ceramic frame 2 is made of the same ceramic material as the ceramic base 1, and the ceramic base 1 and the ceramic plate 3
Functions as a spacer member for providing a sealed space at a predetermined interval between the ceramic base 1 and the ceramic base 1, and has a substantially square outer shape similar to that of the ceramic base 1. A circular through hole 2a for forming a closed space is formed. The ceramic frame 2
If the thickness is less than 0.01 mm, the risk that the first metallized electrode 9 and the second metallized electrode 10 come into contact with each other and short-circuit when the ceramic plate 3 bends under pressure increases. If it exceeds 5 mm, the distance between the first metallized electrode 9 and the second metallized electrode 10 becomes too wide, and the sensitivity of the built-in pressure-sensitive element becomes low. Therefore, the thickness of the ceramic frame 2 is 0.01 to 5
mm. Such a ceramic frame 2 is formed by laminating a ceramic green sheet for a ceramic frame 2 having a through hole on a ceramic green sheet for a ceramic substrate 1 and firing the same to form a first metallized layer on the upper surface of the ceramic substrate 1. The electrodes are sintered and integrated so as to surround the electrode 9.

On the upper surface of the ceramic frame 2, a substantially flat ceramic plate 3 is sintered and integrated in a flexible state so as to form a closed space with the ceramic substrate 1. The ceramic plate 3 is a substantially rectangular flat plate having a thickness of 0.01 to 5 mm and made of the same ceramic material as the ceramic base 1, and functions as a so-called pressure detecting diaphragm that bends toward the ceramic base 1 according to an external pressure. .

The ceramic plate 3 has a thickness of 0.01.
If it is less than 5 mm, its mechanical strength will be small, so that when a large external pressure is applied thereto, there is a great risk of being destroyed.
If it exceeds m, it becomes difficult to bend under a small pressure, and it is unsuitable as a diaphragm for pressure detection. Therefore, the thickness of the ceramic plate 3 is preferably in the range of 0.01 to 5 mm.

The ceramic plate 3 is formed by laminating a flat ceramic green sheet for the ceramic plate 3 on a ceramic green sheet for the ceramic frame 2 together with a ceramic green sheet for the auxiliary ceramic frame 4 to be described later. By firing this, a sealed space is formed between the ceramic frame 2 and the ceramic base 1 so as to be sintered and integrated in a flexible state.

A substantially circular second metallized electrode 10 for forming a capacitance is attached to the lower surface of the ceramic plate 3 so as to face the first metallized electrode 9. The second metallized electrode 10 functions as an electrode for forming a capacitance for a pressure-sensitive element together with the first metallized electrode 9 described above. The other one of the metallized wiring conductors 7b is connected to the second metallized electrode 10 so that the electrode of the semiconductor element 5 is connected to the metallized wiring conductor 7b via a conductive bonding member such as a solder bump 8. When connected, the electrode of the semiconductor element 5 and the second metallized electrode 10 are electrically connected.

At this time, the first metallized electrode 9 and the second metallized electrode 10 are opposed to each other with a closed space formed between the ceramic base 1 and the ceramic plate 3 interposed therebetween.
A predetermined capacitance is formed between them according to the area of the first metallized electrode 9 or the second metallized electrode 10 and the distance between the first metallized electrode 9 and the second metallized electrode 10. When an external pressure is applied to the upper surface of the ceramic plate 3, the ceramic plate 3 bends toward the ceramic base 1 according to the applied pressure, and the distance between the first metallized electrode 9 and the second metallized electrode 10 changes. As a result, the capacitance between the first metallized electrode 9 and the second metallized electrode 10 changes, so that it functions as a pressure-sensitive element that senses a change in external pressure as a change in capacitance. Then, the change in the capacitance is transmitted to the semiconductor element 5 housed in the recess 1a via the metallized wiring conductors 7a and 7b, and the magnitude of the external pressure is known by performing arithmetic processing on the semiconductor element 5. be able to.

The second metallized electrode 10 is made of metallized metal powder such as tungsten, molybdenum, copper or silver. The metallized powder such as tungsten is mixed with an appropriate organic binder, solvent, plasticizer or dispersant. The obtained metallized paste is printed and applied on a ceramic green sheet for the ceramic plate 3 by employing a conventionally known screen printing method, and is baked to form a predetermined surface facing the first metallized electrode 9 on the lower surface of the ceramic plate 3. It is formed into a pattern.

Furthermore, in the present invention, an auxiliary ceramic frame 4 having a shape corresponding to the shape of the ceramic frame 2 is sintered and integrated on the upper surface of the ceramic plate 3. The auxiliary ceramic frame 4 is made of the same ceramic material as the ceramic substrate 1 and has a ceramic green sheet for the auxiliary ceramic frame 4 having a through hole similar to the ceramic green sheet for the ceramic frame 2.
The ceramic green sheet for the ceramic frame 2 is stacked and laminated together with the ceramic green sheet for the ceramic frame 2, and is sintered to be integrated with the upper surface of the ceramic plate 3 by firing. At this time, since the laminating pressure is applied to the ceramic green sheet for the ceramic plate 3 by the ceramic green sheet for the ceramic frame 2 and the ceramic green sheet for the auxiliary ceramic frame 4 substantially uniformly from above and below, the flexure occurs. Therefore, it is possible to provide a compact and high-sensitivity package for a pressure detecting device having a sealed space at a predetermined interval between the ceramic base 1 and the ceramic plate 3.

As described above, according to the pressure detecting device package of the present invention, the first metallized electrode for forming the capacitance is formed on the other main surface of the ceramic base 1 on which the semiconductor element 5 is mounted on one main surface. 9 and a ceramic plate 3 having a second metallized electrode 10 for forming a capacitance facing the first metallized electrode 9 on the inner main surface is formed between the ceramic plate 3 and the other main surface of the ceramic base 1. Since it is bonded by sintering and integrating with the ceramic base 1 in a flexible state so as to be formed, the container accommodating the semiconductor element 5 and the pressure-sensitive element are integrated, and as a result, the pressure detecting device is reduced in size. Can be Further, since the first metallized electrode 9 and the second metallized electrode 10 for forming the capacitance are connected to the semiconductor element 5 via the metallized wiring conductors 7a and 7b provided on the ceramic base 1, the first metallized electrode 9 and the second metallized electrode 9 are connected. And the second metallized electrode 10 can be connected to the semiconductor element 3 at a short distance. As a result, unnecessary capacitance generated between these metallized wiring conductors 7a and 7b can be reduced to provide a highly sensitive pressure detecting device. Can be provided.

Thus, according to the above-described package for a pressure detecting device, the semiconductor element 5 is mounted on the mounting portion 1b, and each electrode of the semiconductor element 5 and the metallized wiring conductor 7 are electrically connected. By sealing the element 5, a pressure detection device which is small in size, has high sensitivity, and can accurately detect external pressure is provided.

Next, the manufacturing method of the present invention for manufacturing the above-described package for a pressure detecting device will be described by way of an example in which a plurality of packages are manufactured simultaneously.

First, as shown in the sectional view of FIG. 2, the ceramic green sheets 11a, 11b,
11c, a ceramic green sheet 12 for the ceramic frame 2, and a ceramic green sheet for the ceramic plate 3.
13 and a ceramic green sheet 14 for the auxiliary ceramic frame 4 are prepared. The ceramic green sheets 11a, 11b, 11c, 12, 13, and 14 are provided with a plurality of package regions, some of which are shown in the drawing.

The ceramic green sheet 11a for the ceramic base 1 has a through hole A for forming the concave portion 1a and a through hole B for leading the metallized wiring conductor 7 to the lower surface.
Have through-holes C and D, which serve as lead-out paths for the metallized wiring conductor 7, and are substantially flat. The ceramic green sheet 12 for the ceramic frame 2 has a through hole E for forming a closed space between the ceramic base 1 and the ceramic plate 3 and a through hole F for leading out a metallized wiring conductor 7. The ceramic green sheet 13 for the ceramic plate is substantially flat. Further, the ceramic green sheet for the auxiliary ceramic frame 4 has a through hole G corresponding to the through hole E.

Such a ceramic green sheet 11a
・ 11b ・ 11c ・ 12 ・ 13 ・ 14 are, for example, ceramic base 1
If the ceramic frame 2, the ceramic plate 3, and the auxiliary ceramic frame 4 are made of an aluminum oxide sintered body, aluminum oxide, silicon oxide, magnesium oxide,
An appropriate organic binder, a solvent, a plasticizer, and a dispersant are added to a ceramic raw material powder such as calcium oxide to form a slurry, which is then formed into a sheet by using a well-known doctor blade method. It is formed by performing a punching process or a cutting process.

Next, as shown in the sectional view of FIG. 3, the metallized paste 17 for the metallized wiring conductor 7, the metallized paste 19 for the first metallized electrode 9, and the ceramic green sheets 11a, 11b, 11c, 12 and 13 The metallized paste 20 for the second metallized electrode 10 is printed and applied in a predetermined pattern.

Next, as shown in the sectional view of FIG.
Ceramic green sheet 11a ・ 11b ・ 11c ・ 12 ・ 13 ・
After the layers 14 are stacked one on top of the other by thermocompression bonding, as shown in the sectional view of FIG. 4 (b), they are cut to obtain a green ceramic molded body 21 for a package. When the ceramic green sheets 11a, 11b, 11c, 12, 13, and 14 are stacked one on top of the other and thermocompression-bonded, these ceramic green sheets 11a
・ All of 11b ・ 11c ・ 12 ・ 13 ・ 14 may be simultaneously laminated and thermocompression bonded.
a, 11b, 11c, and 12 are laminated, and ceramic green sheets 13 and 14 are laminated, and then these pre-laminated ceramic green sheets 11a, 11b,
11c.12 and 13.14 may be laminated by thermocompression bonding. At this time, the ceramic green sheet 13 for the ceramic plate 3
Are stacked in a state sandwiched between ceramic green sheets 12 and 14 having substantially the same shape, so that the stacking pressure is applied substantially uniformly from above and below by the ceramic green sheets 12 and 14, and therefore, the stack is bent by the stacking pressure. Does not occur.

Finally, the green ceramic molded body 21 for a package is fired at a high temperature to complete the pressure sensing device package of the present invention shown in FIG.

As described above, according to the method for manufacturing a package for a pressure detecting device of the present invention, the ceramic plate 3
A compact and high-sensitivity package for a pressure detecting device having a sealed space at a predetermined interval between the ceramic base 1 and the ceramic plate 3 without bending the ceramic green sheet for use can be provided.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the present invention.

[0040]

As described above, according to the pressure detecting device package of the present invention, since the auxiliary ceramic frame having a shape corresponding to the ceramic frame is laminated on the outer main surface of the ceramic plate. When stacking the ceramic green sheets to be packaged, pressure is applied to the ceramic green sheets for the ceramic plates substantially uniformly from above and below by the ceramic green sheets for the ceramic frame and the ceramic green sheets for the auxiliary ceramic frame. For the pressure detecting device, which is small in size, has high sensitivity, and can accurately detect external pressure, having a sealed space at a predetermined interval between the ceramic substrate and the ceramic plate. Package can be provided.

According to the method of manufacturing a package for a pressure detecting device of the present invention, a flat ceramic green sheet for a ceramic base and a ceramic green for a ceramic frame having a through hole for forming a closed space are provided. A sheet, a flat ceramic green sheet for a ceramic plate, and a ceramic green sheet for an auxiliary ceramic frame having a shape corresponding to the ceramic green sheet for the ceramic frame are sequentially laminated to form a green sheet for a package. Since the ceramic body is formed, pressure is applied to the ceramic green sheet for the ceramic plate at the time of lamination by the ceramic green sheet for the ceramic frame and the ceramic green sheet for the auxiliary ceramic frame substantially uniformly from above and below. Therefore, no bending occurs, and Small with a closed space of a predetermined distance between the Mick substrate and the ceramic plate, with high sensitivity, it is possible to provide a pressure sensing device package capable of detecting the external pressure accurately.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a package for a pressure detecting device according to the present invention.

FIG. 2 is a cross-sectional view for explaining a manufacturing method of the present invention for manufacturing the pressure detection device package shown in FIG. 1;

FIG. 3 is a cross-sectional view for explaining a manufacturing method of the present invention for manufacturing the pressure detection device package shown in FIG. 1;

FIGS. 4A and 4B are cross-sectional views illustrating a manufacturing method of the present invention for manufacturing the pressure detecting device package shown in FIG. 1;

FIG. 5 is a sectional view showing a conventional pressure detecting device.

[Explanation of symbols]

1. Ceramic substrate 2. Ceramic frame 3. Ceramic plate 4. Auxiliary ceramic frame 5. ····· Semiconductor element 7 ····························································· First metallized electrode ································································································································································ ..... Ceramic green sheet for auxiliary ceramic frame 4 21 ......... Green ceramic molded body for package

Claims (2)

[Claims] 1. A ceramic base having a mounting portion on which a semiconductor element is mounted on one main surface, and electrodes of the semiconductor element provided on and inside the ceramic base are electrically connected. A plurality of metallized wiring conductors and a ceramic sintered and integrated in a flexible state via a ceramic frame so as to form a sealed space between the other main surface of the ceramic base and the other main surface. Plate, a first metallized electrode for forming a capacitance, which is attached to the surface of the ceramic substrate in the closed space and is electrically connected to one of the metallized wiring conductors, and an inner main surface of the ceramic plate. A second metallization electrode for forming a capacitance, which is attached to face the first metallization electrode and is electrically connected to another one of the metallization wiring conductors; Package A package for a pressure detecting device, wherein an auxiliary ceramic frame having a shape corresponding to the ceramic frame is laminated on an outer main surface of the ceramic plate. 2. A ceramic base having a mounting portion on which a semiconductor element is mounted on one main surface, with a ceramic frame interposed between the other main surface and the other main surface so as to form a sealed space. What is claimed is: 1. A method for manufacturing a package for accommodating a pressure detecting element comprising a ceramic plate sintered and integrated in a flexible state, comprising: a flat ceramic green sheet for the ceramic base; and a through hole for forming the closed space. A ceramic green sheet for the ceramic frame, having a flat ceramic green sheet for the ceramic plate, and a ceramic green sheet for an auxiliary ceramic frame having a shape corresponding to the ceramic green sheet for the ceramic frame. Preparing a ceramic green sheet for the ceramic substrate and a ceramic green for the ceramic frame The ceramic green sheet for the ceramic plate and the ceramic green sheet for the auxiliary ceramic frame are sequentially laminated, and the ceramic green sheet for the ceramic base and the ceramic green sheet for the ceramic plate are stacked in sequence. Forming a green ceramic molded body for a package having a closed space corresponding to the thickness of the ceramic green sheet for the ceramic frame; and firing the green ceramic molded body for the package. Manufacturing method for a pressure detection device package.