JP2002321086A - Alloy magnetic powder for brazing - Google Patents

Alloy magnetic powder for brazing

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Publication number
JP2002321086A
JP2002321086A JP2001128338A JP2001128338A JP2002321086A JP 2002321086 A JP2002321086 A JP 2002321086A JP 2001128338 A JP2001128338 A JP 2001128338A JP 2001128338 A JP2001128338 A JP 2001128338A JP 2002321086 A JP2002321086 A JP 2002321086A
Authority
JP
Japan
Prior art keywords
brazing
magnetic powder
ppm
alloy magnetic
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001128338A
Other languages
Japanese (ja)
Other versions
JP3862968B2 (en
Inventor
Mikiya Yamana
幹也 山名
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Special Steel Co Ltd
Original Assignee
Sanyo Special Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Special Steel Co Ltd filed Critical Sanyo Special Steel Co Ltd
Priority to JP2001128338A priority Critical patent/JP3862968B2/en
Publication of JP2002321086A publication Critical patent/JP2002321086A/en
Application granted granted Critical
Publication of JP3862968B2 publication Critical patent/JP3862968B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an alloy magnetic powder which prevents pinholes from generating in a brazing metal after brazing. SOLUTION: This alloy magnetic powder for brazing comprises a Ni-based alloy containing Cr: 16.0-23.0%, Si: 7.0-12.0%, and H: 0.5-30 ppm by mass %.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ろう付け後のろう
接金属中へのピンホール発生を防止したろう付け用合金
粉末に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing alloy powder which prevents pinholes from being generated in a brazing metal after brazing.

【0002】[0002]

【従来の技術】従来、ステンレス鋼材を使用した部材を
接合する場合に、2つの部材の継手をニッケルろうを使
用したろう付けにより接合することがある。このニッケ
ルろうはJISにも規定されているように、ニッケルを
主成分として、B,Si,Cr,Fe,P等の添加物を
含んだ合金として形成されている。また、ニッケルろう
材として、例えば特開平11−114692号公報に開
示されているように、ぬれ性が良好で、連続した脆化相
が生じることなく、クラックの発生を防止することがで
き、かつ靱性に富む接合部組織を得ることができるニッ
ケルろう材およびこのろう材を用いたろう付け方法とし
て、粉末状ニッケルろうに、Ni,Cr,Ni−Cr合
金、SUS(ステンレス鋼)のうち選ばれた金属粉末を
1重量%以上10重量%未満添加したニッケルろう材、
およびその使用するろう付け方法が知られている。
2. Description of the Related Art Conventionally, when joining members using a stainless steel material, a joint of two members may be joined by brazing using nickel brazing. This nickel solder is formed as an alloy containing nickel as a main component and containing additives such as B, Si, Cr, Fe, and P as specified in JIS. Also, as disclosed in, for example, Japanese Patent Application Laid-Open No. H11-114692, the nickel brazing material has good wettability, can prevent the generation of cracks without generating a continuous embrittlement phase, and As a nickel brazing material capable of obtaining a tough joint structure and a brazing method using the brazing material, powdered nickel brazing was selected from Ni, Cr, Ni-Cr alloy, and SUS (stainless steel). Nickel brazing material to which metal powder is added in an amount of 1% by weight or more and less than 10% by weight,
And the brazing method used are known.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上述し
た特許公報においては、確かにぬれ性が良好で、連続し
た脆化相が生じることなく、クラックの発生を防止する
ことができるかもしれないが、水素量を制御することに
より、ろう接金属中に微小なピンホールが発生すること
を防止した、ろう接性の点において十分でなく、特にピ
ンホールの発生を防止する点おいて不十分であるという
問題がある。
However, in the above-mentioned patent publication, although the wettability is certainly good, a continuous embrittlement phase may not be generated, and the generation of cracks may be prevented. Controlling the amount of hydrogen prevented the generation of minute pinholes in the brazing metal, which was not sufficient in terms of brazing properties, and in particular was insufficient in preventing the generation of pinholes. There is a problem.

【0004】[0004]

【課題を解決するための手段】上述したような問題を解
消するために、発明者らは鋭意開発を進めた結果、合金
粉末中の水素量を合金成分として適正な値に制御するこ
とにより、ろう付け後のろう接金属中への微小なピンホ
ールの発生を防止して、ろう接性の安定、向上を図るこ
とが可能なろう付け用合金粉末を提供することにある。
その発明に要旨とするところは、質量%で、Cr:1
6.0〜23.0%、Si:7.0〜12.0%、H:
0.5〜30ppm、を含有するNi基合金からなるこ
とを特徴とするろう付け用合金粉末にある。
Means for Solving the Problems In order to solve the above-mentioned problems, the inventors have intensively developed and as a result, by controlling the amount of hydrogen in the alloy powder to an appropriate value as an alloy component, An object of the present invention is to provide a brazing alloy powder capable of preventing the generation of minute pinholes in a brazing metal after brazing and stabilizing and improving brazing properties.
The gist of the invention is that in mass%, Cr: 1
6.0 to 23.0%, Si: 7.0 to 12.0%, H:
A brazing alloy powder comprising a Ni-based alloy containing 0.5 to 30 ppm.

【0005】[0005]

【発明の実施の形態】以下、本発明に係るろう付け用合
金成分組成の限定理由を述べる。 Cr:16.0〜23.0% Crは、耐食性を向上させる元素である。しかし、1
6.0%未満では効果が得られない。一方、23.0%
を超えると靱性や加工性が劣化するので上限を23.0
%とした。 Si:7.0〜12.0% Siは、固溶強化元素であり、かつ脱酸剤である。しか
し、12.0%を超えると加工性を低下させるので、そ
の上限を12.0%とした。
BEST MODE FOR CARRYING OUT THE INVENTION The reasons for limiting the brazing alloy composition according to the present invention will be described below. Cr: 16.0 to 23.0% Cr is an element that improves corrosion resistance. However, 1
If it is less than 6.0%, no effect can be obtained. On the other hand, 23.0%
If it exceeds 300, the toughness and workability deteriorate, so the upper limit is 23.0.
%. Si: 7.0 to 12.0% Si is a solid solution strengthening element and is a deoxidizing agent. However, if it exceeds 12.0%, the workability deteriorates. Therefore, the upper limit is set to 12.0%.

【0006】H:0.5〜30ppm Hは、多量に存在するとろう接金属中にピンホールが発
生しクラックを発生すると共に、ろう接面の接合におい
て未接合部があり、ろう接性が悪い。従って、その効果
を得るためには、30ppm以下にする必要がある。し
かし、0.5ppm未満にすることは製造上難しくコス
トを上昇させるのみであり、かつ、逆にピンホールを発
生しクラックを発生し、ろう接面の接合において未接合
部があり、ろう接性が悪いので、その下限を0.5pp
mとした。上述した成分組成を含有するNi基合金から
なり、その他の元素についても、効果の見られる元素に
ついては、特に限定されることなく任意に数%程度添加
しても良い。
H: 0.5 to 30 ppm When H is present in a large amount, a pinhole is generated in the brazing metal to cause cracks, and there is an unbonded portion in the joining of the brazing surfaces, so that the brazing property is poor. . Therefore, in order to obtain the effect, the content needs to be 30 ppm or less. However, reducing the content to less than 0.5 ppm is difficult in manufacturing and only raises the cost. Conversely, pinholes and cracks are generated, and there is an unjoined portion in the joining of the brazing surfaces. Is lower, the lower limit is 0.5pp
m. It is made of a Ni-based alloy containing the above-described component composition, and as for the other elements, the elements having the effect can be arbitrarily added by about several% without any particular limitation.

【0007】[0007]

【実施例】Ni基合金を溶製した後、N2 ガスを使用し
たガス噴霧法により粉化し、そのままガス雰囲気中で冷
却してNi基ろう材粉末2000kgを製造した。次い
で、前記粉末を−150〜+30μmに分級した500
kg/バッチを真空炉中、脱ガスを行った。その結果を
表1のNo.1〜3に示す。また、上記同様に、Ni基
合金を溶製した後、50〜500ppm水素還元炉雰囲
気中で水素量を増加させた。その結果を表1のNo.4
〜6に示す。
EXAMPLE After smelting a Ni-based alloy, it was pulverized by a gas atomization method using N 2 gas, and cooled in a gas atmosphere to produce 2000 kg of Ni-based brazing filler metal powder. Subsequently, the powder was classified into -150 to +30 m,
kg / batch was degassed in a vacuum furnace. The results are shown in Table 1. 1 to 3. Further, similarly to the above, after melting the Ni-based alloy, the amount of hydrogen was increased in a 50 to 500 ppm hydrogen reduction furnace atmosphere. The results are shown in Table 1. 4
To # 6.

【0008】また、Ni基合金をN2 ガス中の水素量を
1〜200ppmであるように調整したN2 ガスを使用
したガス噴霧法により粉化し、そのままガス雰囲気中で
冷却してNi基ろう材粉末2000kgを製造した。そ
の結果を表1のNo.7〜10に示す。なお、ピンホー
ル評価方法として、ろう接面の断面ミクロ組織を5ケ所
観察し、ピンホールの有無を確認した。その時の基準と
して、以下のように定めた。 ○:ピンホールが無し(0個) ×:ピンホールが有り(1個以上)
In addition, a Ni-based alloy is powdered by a gas spraying method using N 2 gas in which the amount of hydrogen in N 2 gas is adjusted to be 1 to 200 ppm, and cooled as it is in a gas atmosphere. 2000 kg of material powder was produced. The results are shown in Table 1. 7 to 10. In addition, as a pinhole evaluation method, the cross-sectional microstructure of the brazing surface was observed at five places to confirm the presence or absence of a pinhole. The criteria at that time were set as follows. ○: No pinhole (0) ×: Pinhole (1 or more)

【0009】さらに、ろう接性として、以下のように定
めた。ろう接面の断面ミクロ組織を5ケ所観察し、基材
との接合状態を確認した。その時の基準として、以下の
ように定めた。 ○:剥離が無し(0個) ×:未接合部が有り(1個以上)
Further, the brazing property was determined as follows. The microstructure of the cross section of the brazing surface was observed at five places to confirm the bonding state with the base material. The criteria at that time were set as follows. ○: No peeling (0 pieces) ×: There is an unbonded part (1 or more pieces)

【0010】[0010]

【表1】 [Table 1]

【0011】表1に示すように、No.1,4、No.
7〜9は本発明例であり、No.2、3No.5〜6、
No.10は比較例である。No.2、3はHが0.
2,0.3ppmと低いために逆にピンホールが発生
し、ろう接面の接合において未接合部があり、ろう接性
が悪い。No.5、6はHが42,32ppmと高く、
また、No.10も35ppmと高いために、ピンホー
ルが発生し、ろう接面の接合において未接合部があり、
ろう接性が悪い。これに対し、本発明はいずれもピンホ
ールの発生が少なく、ろう接面の接合において剥離が見
られずろう接性に優れていることが判る。
As shown in Table 1, as shown in FIG. 1,4, No.
Nos. 7 to 9 are examples of the present invention. 2, 3 No. 5-6,
No. 10 is a comparative example. No. 2 and 3 have H = 0.
On the contrary, since it is as low as 2 and 0.3 ppm, pinholes are generated, and there is an unjoined portion in joining of the brazing surfaces, so that the brazing property is poor. No. 5 and 6 have a high H of 42,32 ppm,
In addition, No. Since 10 is also as high as 35 ppm, pinholes are generated, and there is an unjoined portion in joining the brazing surfaces,
Poor solderability. On the other hand, it can be seen that in the present invention, the occurrence of pinholes is small, and no peeling is observed in the joining of the brazing surfaces, and the brazing properties are excellent.

【0012】[0012]

【発明の効果】以上述べたように、本発明により、合金
粉末中の水素量を適正な値に制御することにより、ろう
接金属中のピンホールの発生を防止し、ろう接面の接合
において剥離のない接合部を形成し、ろう付け後のろう
接性の安定、向上を図ることが出来る極めて優れた効果
を奏するものである。
As described above, according to the present invention, by controlling the amount of hydrogen in the alloy powder to an appropriate value, the generation of pinholes in the brazing metal is prevented, and the bonding of the brazing surfaces is improved. An extremely excellent effect of forming a joint without peeling and stabilizing and improving the brazing property after brazing is achieved.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 質量%で、 Cr:16.0〜23.0%、 Si:7.0〜12.0%、 H:0.5〜30ppm、 を含有するNi基合金からなることを特徴とするろう付
け用合金粉末。
1. A Ni-based alloy containing, by mass%, Cr: 16.0 to 23.0%, Si: 7.0 to 12.0%, and H: 0.5 to 30 ppm. Alloy powder for brazing.
JP2001128338A 2001-04-25 2001-04-25 Brazing alloy powder Expired - Lifetime JP3862968B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001128338A JP3862968B2 (en) 2001-04-25 2001-04-25 Brazing alloy powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001128338A JP3862968B2 (en) 2001-04-25 2001-04-25 Brazing alloy powder

Publications (2)

Publication Number Publication Date
JP2002321086A true JP2002321086A (en) 2002-11-05
JP3862968B2 JP3862968B2 (en) 2006-12-27

Family

ID=18977049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001128338A Expired - Lifetime JP3862968B2 (en) 2001-04-25 2001-04-25 Brazing alloy powder

Country Status (1)

Country Link
JP (1) JP3862968B2 (en)

Also Published As

Publication number Publication date
JP3862968B2 (en) 2006-12-27

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