JP2002313972A - Electric component assembly body and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut down manufacturing processes, to reduce packaging costs, and to provide an inexpensive electronic component assembly body and the manufacturing method of the electronic component assembly body by joining an electronic component onto a packaging substrate, and at the same time, by enclosing the joined sections using a closing member. SOLUTION: An electrode 11a of the electronic component 11 and an electrode 12a of the packaging substrate 12 are heated and pressurized at the same time, and also at the same time, the closing member 15 supplied to the outer- peripheral section on the active surface of the electronic equipment 11 and the upper surface of the packaging substrate 12 are heated and pressurized, thus joining the electronic component 11 to the packaging substrate 12, thus surrounding and closing the junction section between the electronic component 11 and the packaging substrate 12 by the active surface of the closing member 15 and the electronic component 11 on the upper surface of the packaging substrate 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component assembly in which an active surface of a mounting board on which electronic components are mounted is hermetically sealed and a method of manufacturing the electronic component assembly.

[0002]

2. Description of the Related Art In recent years, the production of electronic components has continued to increase.
Accordingly, various and various package forms have been proposed. In particular, a chip size package that realizes small size and light weight is considered to be important. Conventionally, in the case of electronic components such as SAW filters, if moisture or foreign matter in the air is present on the active surface, the circuit may be corroded and broken, so the SAW filter is mounted on a cavity type ceramic substrate using a wire bonding method. Or
In some cases, after conducting bonding by a flip chip method, a lid, which is a metal plate, is applied to a ceramic substrate with a glass material or solder to seal the SAW filter.

Hereinafter, the above-described conventional electronic component assembly and a method of manufacturing the electronic component assembly will be described with reference to the drawings.

FIGS. 8A to 8D show a method of manufacturing an electronic component assembly by a flip chip method.
41 is an electronic component such as a SAW filter, 42 is a mounting substrate such as a ceramic material, 43 is an Au projection electrode for connection, 44 is a sealing lid such as a metal plate, 45 is a sealing material such as glass or solder. is there.

First, in FIG. 8A, an electronic component 41 such as a SAW filter having a rectangular plate shape has an electrode 41a on a lower surface which is an active surface, and this electrode 41a is made of a conductive material such as Au. The formed protruding electrodes 43 are joined. Also, the mounting plate 42 in the form of a square plate made of a ceramic material or the like has a convex portion on the entire outer peripheral portion of the upper surface, and the bottom surface of the concave portion surrounded by the convex portion is the mounting portion 42b of the electronic component 41. When the electronic component 41 is attached, the mounting substrate 4 is connected to the protruding electrode 43 joined to the active surface of the electronic component 41 so as to be mutually connectable.
Two electrodes 42a are provided on the mounting portion 42b.

[0006] Next, as shown in FIG.
1 is positioned so that the protruding electrode 43 can be bonded to the electrode 42a of the mounting substrate 42, and then the protruding electrode 43 bonded to the electronic component 41 and the electrode 42a of the mounting substrate 42 are heated while being pressurized. Protruding electrode 43 and electrode 42
a. Next, a sealing material 45 such as glass or solder is supplied by printing, transfer, plating, or the like to the entire upper portion of the outer peripheral convex portion on the upper surface of the mounting substrate 42 on which the electronic component 41 is mounted.

[0007] Thereafter, as shown in FIG. 8 (c), a plate-like lid 44 made of a metal material or the like is attached to the electronic component 41.
Is mounted on the upper surface of the sealing material 45 supplied to the upper portion of the outer peripheral protrusion on the upper surface of the mounting substrate 42 on which is mounted while being heated and pressed. As a result, the space surrounded by the lower surface of the lid 44, the inner surface of the concave portion on the upper surface of the mounting substrate 42, and the sealing material 45 is sealed, and the electronic components 4 mounted in this space are sealed.
1 will be sealed.

Next, an example of the wire bonding method will be described.

FIGS. 9A to 9D show a method of manufacturing an electronic component assembly by a wire bonding method, in which reference numeral 51 denotes an electronic component such as a SAW filter, 52 denotes a mounting board made of a ceramic material or the like, and 54 denotes a mounting substrate. Is a sealing lid such as a metal plate; 55 is a sealing material such as glass or solder;
Is a wire such as an Au wire, and 57 is a die bond material.

First, in FIG. 9A, an electronic component 51 such as a SAW filter having a rectangular plate shape has an electrode 51a on an upper surface which is an active surface. Also,
A rectangular plate-shaped mounting substrate 52 made of a ceramic material or the like has a convex portion on the entire outer peripheral portion of the upper surface, and a bottom surface of a concave portion surrounded by the convex portion has a mounting portion 52 of the electronic component 51.
b. A step is formed on the outer periphery of the mounting portion 52b between the outer peripheral projection of the mounting substrate 52 and the mounting portion 52b.
2a is provided.

Next, as shown in FIG. 9B, the lower surface of the electronic component 51 is
With a die bond material 57. Thereafter, both ends of the wire 56 such as an Au wire are thermocompression-bonded to the electrode 51 a of the electronic component 51 and the electrode 52 a at the step inside the concave portion of the mounting board 52.
Next, a sealing material 55 such as glass or solder is provided on the entire upper portion of the outer peripheral convex portion on the upper surface of the mounting board 52 on which the electronic component 51 is mounted.
Is supplied by a printing, transfer, plating method or the like.

Thereafter, as shown in FIG. 9C, a plate-like lid 54 made of a metal material or the like is attached to the electronic component 51.
Is mounted on the upper surface of the sealing material 55 supplied above the outer peripheral convex portion of the mounting substrate 52 on which the is mounted, while heating and pressing the same. As a result, the space surrounded by the lower surface of the lid 54, the inner surface of the concave portion on the upper surface of the mounting substrate 52, and the sealing material 55 is sealed, and the electronic components 5 mounted in this space are sealed.
1 will be sealed.

[0013]

However, in the above-described configuration, after the electrodes of the electronic component and the electrodes of the mounting board are joined together, these joints and each electrode are sealed by covering the mounting board. Therefore, it is difficult to reduce the mounting cost.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and to join the electrodes of an electronic component to the electrodes of a mounting board and to seal these joints and each electrode with a sealing member. Accordingly, the manufacturing process can be shortened, the mounting cost can be reduced, and a low-cost electronic component assembly and a method for manufacturing the electronic component assembly can be provided.

[0015]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, an electronic component having an electrode, a mounting substrate having an electrode to which the electrode of the electronic component is joined, and the electronic component disposed on an outer peripheral portion of the mounting substrate The electrode of the electronic component and the electrode of the mounting board and the sealing member capable of sealing the joint between them simultaneously with joining the electrode to the electrode of the mounting board. To provide an electronic component assembly.

According to a second aspect of the present invention, the sealing member is a sealing material disposed between the entire outer peripheral portion of the mounting board and the entire outer peripheral portion of the electronic component. Electronic component assembly.

According to a third aspect of the present invention, the sealing member seals the entire outer surface of the electronic component, and seals between an end surface of the coating and the entire outer peripheral portion of the mounting board. An electronic component assembly according to the first aspect, comprising a material.

According to a fourth aspect of the present invention, the mounting board is a flat member, and the covering portion is a concave member made of a moisture and heat resistant material.
An electronic component assembly according to an aspect is provided.

According to a fifth aspect of the present invention, the mounting substrate is a concave member, and the covering portion is a flat member made of a moisture and heat resistant material.
An electronic component assembly according to an aspect is provided.

According to a sixth aspect of the present invention, there is provided the electronic component assembly according to the second or third aspect, wherein the sealing material is a metal.

According to the seventh aspect of the present invention, the electronic component having the electrode is connected to the mounting substrate having the electrode which can be joined to the electrode of the electronic component. Align so that it can be joined to the electrode, and then pressurize while heating the electrode of the electronic component and the electrode of the mounting board, and simultaneously use the sealing member to join the electronic component to the mounting board. A method of manufacturing an electronic component assembly, comprising sealing the electrode of the electronic component, the electrode of the mounting board, and a joint thereof.

According to an eighth aspect of the present invention, the sealing material as the sealing member is provided on the surface of the electronic component around the active surface of the electronic component, or on the mounting board,
Or supplying the electronic component and both sides on the mounting substrate, and then, simultaneously with joining the electronic component to the mounting substrate, the sealing material and the electronic component and the mounting substrate, the electrode of the electronic component and the The method for manufacturing an electronic component assembly according to the seventh aspect, wherein the electrodes of the mounting board and the joints thereof are sealed.

According to a ninth aspect of the present invention, the electronic component is positioned with respect to the mounting board so that the electrodes of the electronic component can be joined to the electrodes of the mounting board. The electrodes of the component and the electrodes of the mounting substrate are temporarily joined, and a sealing material as a sealing member is supplied on the mounting substrate around the electronic component before and after or at the same time. With respect to the mounting board, the covering portion is aligned so as to cover the entire outer surface of the electronic component temporarily bonded to the mounting board, and the electronic component is completely bonded to the mounting board at the same time. The electronic component assembly according to the seventh aspect, wherein the sealing material, the mounting board, and the covering portion seal the electrode of the electronic component, the electrode of the mounting board, and a joint thereof. To provide a method.

According to a tenth aspect of the present invention, the non-active surface of the electronic component is adhered to a cover, which is a sealing member,
Before or after this or at the same time, a sealing material as a sealing member is supplied on the covering portion around the electronic component, and then the covering portion is mounted on the mounting board, and the electrodes of the electronic component and the mounting board are mounted on the mounting board. The electrodes are aligned so that they can be joined, and the electronic component is joined to the mounting board.At the same time, the sealing material, the mounting board, and the covering portion allow the electrodes of the electronic component and the electrodes of the mounting board and A method for manufacturing an electronic component assembly according to the seventh aspect, wherein the joints are sealed.

According to an eleventh aspect of the present invention, there is provided the method of manufacturing an electronic component assembly according to the ninth aspect, wherein the sealing material is supplied to the cover portion side or both sides of the mounting board and the cover portion. provide.

According to a twelfth aspect of the present invention, there is provided the method of manufacturing an electronic component assembly according to the tenth aspect, wherein the sealing material is supplied to the mounting board or to both sides of the mounting board and the covering portion. provide.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component assembly and a method of manufacturing the electronic component assembly according to an embodiment of the present invention will be described in detail with reference to the drawings.

FIGS. 1A and 1B are a cross-sectional view of the electronic component assembly 1 according to the first embodiment of the present invention and a perspective plan view of the mounting substrate 12 seen from below.

1 (a) and 1 (b), an electronic component 11 such as a square plate-shaped SAW filter has a plurality of electrodes 11a on a lower surface which is an active surface, and each electrode 11a has a conductive material. The bump electrode 13 formed of Au is joined. Further, the mounting plate 12 in the form of a square plate made of a ceramic material or the like has a plurality of electrodes 12a on the upper surface.
2a is joined to each protruding electrode 13. The sealing material 15, which is a sealing member, is disposed between the entire outer peripheral portion of the mounting board 12 and the entire outer peripheral portion of the electronic component 11. Further, each electrode 11a and each protruding electrode 13 of the electronic component 11 and each electrode 12a of the mounting substrate 12 and their joint portion are surrounded by the entire sealing material 15 and the active surface of the electronic component 11 and the upper surface of the mounting substrate 12, Sealed.

Next, a method of manufacturing the electronic component assembly 1 according to the first embodiment will be described.

In FIG. 2A, when the active surface of the electronic component 11 is mounted on the upper surface of the mounting substrate 12, each electrode 12a on the upper surface of the mounting substrate 12 has a corresponding projection connected to the active surface of the electronic component 11. It is arranged so that it can be joined to the electrode 13.

Next, as shown in FIG. 2B, Sn-Pb based solder, In
The sealing material 15 such as a system solder or an insulating epoxy resin is printed, transferred, plated, or the like, so that the supply height of the sealing material 15 is higher than the height of the electrode 11 a of the electronic component 11, the projection electrode 13, and the electrode 12 a of the mounting board 12. Supplied to be almost the same as or slightly higher than the total height. Here, electronic component 1
When the electronic component 11 is mounted on the mounting substrate 12, the sealing material 15 supplied to the outer peripheral portion of the active surface of the electronic component 11 is filled with the respective electrodes 11 a of the electronic component 11, the respective projecting electrodes 13 joined to the electronic component 11, and the mounting substrate. The supply area of the sealing material 15 is set on the active surface of the electronic component 11 and the mounting substrate 1 so as to secure a distance that does not make contact with each of the electrodes 12a.
2 is disposed on the upper surface.

Further, the sealing material 15 is used for the electronic component 11.
When the electronic component 11 is mounted on the mounting substrate 12 instead of the method of supplying only to the outer peripheral portion of the active surface of the mounting substrate 1,
The sealing material is applied only to the portion of the upper surface of the electronic component 11 that can be joined to the outer peripheral portion of the active surface of the electronic component 11 by the sealing material 15, or to the active surface portion of the electronic component 11 and the upper surface of the mounting substrate 12. 15 may be supplied.

Next, as shown in FIG. 2C, the electronic component 11 is mounted on the mounting substrate 12 so that each protruding electrode 13 bonded to the electronic component 11 can be bonded to each electrode 12a of the mounting substrate 12. After that, each protruding electrode 13 and each electrode 12a of the mounting substrate 12 are pressurized while being heated.
At the same time, the sealing material 15 supplied to the outer periphery of the active surface of the electronic component 11 and the portion of the upper surface of the mounting substrate 12 which can be joined to the sealing material 15 are pressed while being heated. Thereby, as shown in FIG. 2D, each protruding electrode 13 joined to the electronic component 11 and each electrode 12a of the mounting board 12 are formed.
Are joined and at the same time the entire sealing material 15 and the electronic component 1
The space surrounded by the active surface 1 and the upper surface of the mounting substrate 12 is sealed, and the electronic components 1 in this space are sealed.
The respective electrodes 11a, the respective protruding electrodes 13, the respective electrodes 12a of the mounting substrate 12, and their joints are hermetically sealed.

In the method of joining the electrodes 11a of the electronic component 11 and the electrodes 12a of the mounting board 12, a method of using Au, which is a conductive material, for the projecting electrodes 13 has been described. Each electrode 11a of the electronic component 11 and each electrode 12a of the mounting board 12 can be joined using a conductive adhesive or the like.

According to the first embodiment, two steps conventionally performed separately, namely, a step of joining an electrode of an electronic component and an electrode of a mounting board, and a step of joining these electrodes and each electrode. The step of sealing can be performed simultaneously. That is, each of the protruding electrodes 13 bonded to the electronic component 11 and each of the electrodes 12a of the mounting substrate 12 are pressurized while being heated, and at the same time, the sealing material 15 supplied to the outer peripheral portion of the active surface of the electronic component 11 and the mounting substrate 12 By pressing while heating the upper surface of the electronic component 11, each protruding electrode 13 bonded to the electronic component 11 and each electrode 12 a of the mounting board 12 are bonded, and at the same time, each electrode 11 a of the electronic component 11 and each protruding electrode 13 The electrodes 12a of the mounting substrate 12 and their joints are surrounded and sealed by the entire sealing material 15, the active surface of the electronic component 11, and the upper surface of the mounting substrate 12. Therefore, the manufacturing process can be shortened, and the mounting cost can be reduced.

Furthermore, by synchronizing these two steps,
The electrodes 11a of the electronic component 11, the protruding electrodes 13 and the electrodes 12a of the mounting board 12 are joined and sealed at the same time. As before, the time when these electrodes and their joints are not sealed can be eliminated, so that each electrode 1 of the electronic component 11 can be eliminated.
This makes it possible to make the electrodes 1a and the electrodes 12a of the mounting substrate 12 and their joints hardly deteriorate due to corrosion or the like.

Further, the supply height of the sealing material 15 depends on the electrodes 11 a and the protruding electrodes 13 of the electronic component 11 and the mounting substrate 12.
The sealing material 15 is supplied to the outer peripheral portion of the active surface of the electronic component 11 so as to be substantially the same as or slightly higher than the total height of the electrodes 12 a of the electronic component 11. The space between the electronic component 11 and the mounting board 12 can be filled with only the active surface of the electronic component 11 and the electronic component mounting surface of the plate-shaped mounting board 12 and the sealing material 15. Since the joining portion and each electrode can be surrounded and sealed, the concavo-convex portion and the lid of the mounting substrate used to seal the joining portion of the electronic component and the mounting substrate and each electrode are unnecessary, The shape of the mounting substrate can be simplified, and the quality of the electronic component assembly can be stabilized.

Further, for example, in an electronic component assembly manufactured by the conventional flip chip method, the electrodes of the electronic component and the electrodes of the mounting board are joined only by the joining, and are supported by other members. According to the first embodiment, each of the protruding electrodes 13 joined to each of the electrodes 11a of the electronic component 11 and the mounting substrate 1 are not provided.
2 is supported by bonding of the electronic component 11 and the mounting substrate 12 via the sealing material 15 in addition to the bonding of the electrodes 12a.
The bonding between the electrodes 11a and the electrodes 12a of the mounting board 12 can be further stabilized, and the quality of the electronic component assembly can be stabilized.

The present invention is not limited to the above embodiment, but can be implemented in various other modes. For example, an electronic component assembly using a cavity type mounting board will be described as an electronic component assembly according to the second embodiment of the present invention.

FIGS. 3A and 3B are a cross-sectional view of the electronic component assembly 2 using a cavity type mounting board and a transparent plan view of the mounting board 22 seen from above.

3 (a) and 3 (b), an electronic component 21 such as a square plate-shaped SAW filter has a plurality of electrodes 21a on the upper surface which is an active surface, and each electrode 21a has a conductive material. The projection electrode 23 formed of Au is joined. Further, a rectangular plate-shaped mounting substrate 22 formed of ceramic or the like has a plurality of electrodes 22a on the lower surface.
a is joined to each protruding electrode 23. The mounting substrate 24 on a rectangular plate formed of a moisture-resistant and heat-resistant material such as ceramic has a convex portion 24 formed over the entire outer peripheral portion of the upper surface.
The sealing material 25 is disposed between the entire upper portion of the convex portion 24a and the entire outer peripheral portion of the lower surface of the mounting board 22. Furthermore, on the inner surface of the concave portion 24b surrounded by the convex portion 24a of the mounting substrate 24, the lower surface of the mounting substrate 22, and the entire sealing material 25, the entire electronic component 21, each protruding electrode 23, each electrode 22a of the mounting substrate 22, The joint is enclosed and sealed. In the second embodiment, the sealing member is a sealing material 25 and a mounting board 24 that is a covering portion.
It consists of.

Next, a method of manufacturing the electronic component assembly 2 according to the second embodiment will be described.

In FIG. 4A, when the active surface of the electronic component 21 is mounted on the upper surface of the mounting substrate 22, each electrode 22a on the upper surface of the mounting substrate 22 is connected to the respective active surface of the electronic component 21. They are arranged so that they can be joined to the protruding electrodes 23. The electronic component 21 is mounted on the mounting board 2
After the alignment with respect to 2, the respective protruding electrodes 23 and the respective electrodes 22a of the mounting substrate 22 are pressurized, and the active surface of the electronic component 21 is temporarily joined to the upper surface of the mounting substrate 22. Here, the temporary bonding means that both the electronic component 21 and the mounting board 22 can be moved by gripping and moving either the electronic component 21 or the mounting board 22, and the electronic component 21 or the mounting board 22 can be moved. FIG. 4 shows a joint that can release the joint between the electronic component 21 and the mounting board 22 by applying an external force to the electronic component 21 without breaking the electronic component 21 and the mounting board 22.

Next, as shown in FIG. 4B, a sealing material 25 such as Sn-Pb-based solder, In-based solder, or insulating epoxy resin is printed on the outer peripheral portion of the upper surface of the mounting substrate 22, transferred, and transferred. Alternatively, the sealing material 25 is supplied by a plating method or the like. Here, when the electronic component 21 is attached to the mounting substrate 22, the sealing material 25 supplied to the outer peripheral portion of the upper surface of the mounting substrate 22 is used for the electrodes 21 a of the electronic component 21 and the electronic component 2.
1 so that the projection electrodes 23 and the electrodes 22a of the mounting board 22 are not in contact with each other.
The supply area of the sealing material 25 is arranged on the upper surface of the mounting substrate 22.

Next, as shown in FIG. 4 (c), the upper portion of the upper surface outer peripheral convex portion 24a of the rectangular plate-shaped mounting substrate 24 is supplied to the lower surface outer peripheral portion of the mounting substrate 22 to which the electronic components 21 are temporarily bonded. After being positioned so as to be able to be joined to the sealing material 25 thus formed, at least the upper part of the projection 24 a of the mounting substrate 24 and the lower part of the sealing material 25 are pressurized while being heated. At the same time, each protruding electrode 23 bonded to the electronic component 21 temporarily bonded to the mounting substrate 22 and each electrode 22a of the mounting substrate 22 are heated. Thereby, as shown in FIG. 4D, each protruding electrode 2 bonded to the electronic component 21 is formed.
3 and the electrodes 22a of the mounting substrate 22 are permanently joined, and the space surrounded by the sealing material 25 and the lower surface of the mounting substrate 22 and the inner surface of the concave portion 24b of the mounting substrate 24 is sealed. The whole 21, each protruding electrode 23, each electrode 22 a of the mounting board 22, and their joints are sealed. Here, the actual bonding is to apply heat to each of the protruding electrodes 23 and the respective electrodes 22a of the mounting board 22 which are bonded to the electronic component 21 in the above-mentioned temporary bonding state. This indicates a joint in which it is difficult to release the joined state by applying an external force.

In supplying the sealing material 25,
Supply height of sealing material 25 and outer peripheral projection 24 of mounting substrate 24
The sum of the height from the top surface to the bottom surface of the concave portion 24b is the height of the electrode 21a of the electronic component 21, the height of the protruding electrode 23,
The height of the electrode 22a of the mounting substrate 22, the thickness of the electronic component 21, and the bottom of the concave portion 24b of the mounting substrate 24 indicate the electronic component 2
It should be approximately the same as or slightly higher than the sum of the heights to one inactive surface.

According to the second embodiment, for example, the area between the end of the active surface of the electronic component 21 and each electrode 21 a is narrow, and the sealing material 25 is supplied to the outer peripheral portion of the active surface of the electronic component 21. In a case where it is not possible to perform sealing, or in a case where it is necessary to seal not only the joint between the electronic component 21 and the mounting board 22 and each electrode but also the entire electronic component 21, etc. By using the plate-shaped mounting board 22 having the tee-type mounting board 24 and the electrode 22a, two steps conventionally performed separately, namely, a step of joining the electrode of the electronic component and the electrode of the mounting board, The step of sealing these joints and each electrode can be performed simultaneously. That is, the electrode 21a of the electronic component 21 and the mounting substrate 2
At the same time as joining the two electrodes 22a, the supply height of the sealing material 25 and the recess 24
b The sum of the heights to the bottom surface is the electrode 21a of the electronic component 21.
, The height of the protruding electrode 23, the height of the electrode 22 a of the mounting board 22, the thickness of the electronic component 21, and the mounting board 2
4 so as to be equal to or slightly higher than the total height from the bottom surface of the concave portion 24b to the inactive surface of the electronic component 21.
Since the sealing material 25 is supplied to the outer peripheral portion of the surface of the mounting substrate 22 having the electrodes 22a, the protrusions 2 of the mounting substrate 24
4a and the entire outer peripheral portion of the surface of the mounting board 22 having the electrodes 22a can be filled without gaps with the sealing material 25, and the entire sealing material 25 and the surface of the mounting board 22 having the electrodes 22a and On the inner surface of the concave portion 24b of the mounting substrate 24, the entire electronic component 21 and each electrode 22a of the mounting substrate 22 and their joints can be surrounded and hermetically sealed. Therefore, the manufacturing process can be shortened, and the mounting cost can be reduced.
The junction between the electronic component and the mounting board and the unevenness of the mounting board having the electrodes used to seal each electrode are not required, and the shape of the mounting board can be simplified. It is possible to stabilize quality.

Furthermore, by synchronizing these two steps,
The respective electrodes 21a of the electronic component 21 and the respective protruding electrodes 23 and the respective electrodes 22a of the mounting board 22 are sealed at the same time when they are joined. Since it is possible to eliminate the time during which these electrodes and their joints are not hermetically sealed before the process, each electrode 21a of the electronic component 21 and each electrode 22a of the mounting board 22 and their joints Can be hardly deteriorated by corrosion or the like.

Further, as a method of manufacturing an electronic component assembly according to the third embodiment of the present invention, another case using a cavity type mounting board will be described.

FIGS. 5A and 5B are a cross-sectional view of the electronic component assembly 3 using a cavity type mounting board and a transparent plan view of the mounting board 32 seen from below.

In FIGS. 5A and 5B, an electronic component 31 such as a square plate-shaped SAW filter has a plurality of electrodes 31a on the lower surface which is an active surface, and each electrode 31a has a conductive material. The projection electrode 33 formed of Au is joined. The rectangular plate-shaped mounting substrate 32 made of ceramic or the like has a convex portion 32b on the entire outer peripheral portion of the upper surface.
A plurality of electrodes 32a are provided on the bottom surface of the concave portion 32c surrounded by b, and each of the electrodes 32a is joined to each of the protruding electrodes 33. Further, a rectangular plate-shaped mounting substrate 34 made of a moisture-resistant and heat-resistant material such as ceramics is used.
A non-active surface of the electronic component 31 is bonded to the lower surface of the mounting substrate 32 with a die bond material 37, and a sealing material 35 is disposed between the entire outer peripheral portion of the lower surface of the mounting substrate 34 and the entire upper portion of the projection 32b of the mounting substrate 32. ing. Furthermore, the entire electronic component 31, the protruding electrodes 33, the respective electrodes 32a of the mounting substrate 32, and their joints are surrounded by the lower surface of the mounting substrate 34, the inner surface of the concave portion 32c of the mounting substrate 32, and the entire sealing material 35. Have been. In the third embodiment, the sealing member is constituted by a sealing material 35 and a mounting board 34 which is a covering portion.

Next, a method of manufacturing the electronic component assembly 3 according to the third embodiment will be described.

As shown in FIGS. 6A and 6B, a die bonding material 37 is provided on the upper surface of the mounting plate 34 having a rectangular plate shape.
To bond the non-active surface of the electronic component 31. afterwards,
A sealing material 3 such as Sn-Pb-based solder, In-based solder, or insulating epoxy resin is provided on the entire outer peripheral portion of the upper surface of the mounting board 34.
5 is supplied by printing, transferring, or plating.

Next, in FIG. 6 (c), the bottom surface of the concave portion 32c surrounded by the outer peripheral convex portion 32b on the upper surface of the mounting plate 32 in the form of a rectangular plate serves as a joint portion of the electronic component 31. Each electrode 32a of the mounting substrate 32 is provided on the bottom surface of the concave portion 32c so as to be able to join with each of the protruding electrodes 33 joined to the active surface of the electronic component 31 at the time of joining. The upper part of the convex part 32b of the mounting substrate 32 is formed so as to be able to join with the lower part of the sealing material 35 supplied to the outer peripheral part of the lower surface of the mounting substrate 34 to which the electronic component 31 is adhered.

In supplying the sealing material 35,
The supply height of the sealing material 35 and the outer peripheral convex portion 32 of the mounting substrate 32
b, the sum of the heights from the top surface to the bottom surface of the recess 32c is the height of the electrode 31a of the electronic component 31, the height of the protruding electrode 33,
The height of the electrode 32a of the mounting board 32, the thickness of the electronic component 31, and the total thickness of the die bonding material 37 are set to be substantially the same or slightly higher.

Next, the electronic component 31 is mounted on the mounting board 32 so that each protruding electrode 33 bonded to the electronic component 31 bonded to the mounting board 34 can be bonded to each electrode 32 a of the mounting board 32. After the alignment, the respective protruding electrodes 33 and the respective electrodes 32a of the mounting substrate 32 are pressurized while being heated.
At the same time, pressure is applied while heating at least the upper part of the convex part 32b of the mounting substrate 32 and the lower part of the sealing material 35. As a result, as shown in FIG. 6D, each protruding electrode 33 bonded to the electronic component 31 and each electrode 3 of the mounting board 32 are formed.
2a is joined, and the space surrounded by the sealing material 35 and the lower surface of the mounting substrate 34 and the inner surface of the concave portion 32c of the mounting substrate 32 is sealed, and the entire electronic component 31 and each projecting electrode 33 in this space are mounted. The electrodes 32a of the substrate 32 and their joints are sealed.

According to the third embodiment, for example, the region between the end of the active surface of the electronic component 31 and each electrode 31a is narrow, and the sealing material 35 is supplied to the outer peripheral portion of the active surface of the electronic component 31. In the case where it is not possible to perform the sealing, or when it is necessary to seal not only the joint between the electronic component 31 and the mounting board 32 and each electrode but also the entire electronic component 31, By using the cavity type mounting substrate 32 having the electrode 32a and the plate-shaped mounting substrate 34, two processes conventionally performed separately, that is, a process of joining an electrode of an electronic component and an electrode of the mounting substrate are performed. And the step of sealing these joints and each electrode can be performed simultaneously. That is, when the electrodes 31a of the electronic component 31 and the electrodes 32a of the mounting board 32 are joined together, the sum of the supply height of the sealing material 35 and the height from the upper surface of the outer peripheral projection 32b to the bottom of the recess 32c of the mounting board 32 is equal to the electronic resistance. The height of the electrode 31 a of the component 31, the height of the protruding electrode 33, the height of the electrode 32 a of the mounting board 32, the thickness of the electronic component 31 and the total thickness of the die bonding material 37 are substantially the same or slightly higher. In addition, since the sealing material 35 is supplied to the outer peripheral portion of the bonding surface of the electronic component 31 of the mounting board 34, the entire upper portion of the convex portion 32b of the mounting substrate 32 and the entire outer peripheral portion of the bonding surface of the electronic component 31 of the mounting substrate 34 Can be filled with a sealing material 35 without any gap, and the entire sealing material 35, the inner surface of the recess 32c of the mounting board 32, and the electronic component 3 of the mounting board 34
One adhesive surface is used for the entire electronic component 31 and the electrode 3
It is possible to surround and hermetically surround 2a and their joints. Therefore, the manufacturing process can be shortened, and the mounting cost can be reduced.

Further, by synchronizing these two steps,
The respective electrodes 31a of the electronic component 31, the respective protruding electrodes 33, and the respective electrodes 32a of the mounting board 32 are joined and sealed at the same time. Since it is possible to eliminate the time during which these electrodes and their joints are not sealed as before the process, each electrode 31a of the electronic component 31 and each electrode 32a of the mounting board 32 and their joints Can be hardly deteriorated by corrosion or the like.

Further, for example, as in a method of manufacturing an electronic component assembly using a conventional flip-chip method, each electrode of an electronic component and each electrode of a mounting board are joined only to each other. In an electronic component assembly manufactured by a joining method that is not supported by a member,
When a temperature cycle test is performed on the electronic component assembly, a stress is generated due to a difference in thermal expansion between the electronic component and the mounting board, and the stress concentrates on a joint portion between the electronic component and the mounting board, and the temperature increases. -40 in cycle test
Under a temperature condition of from about 80 ° C. to about 80 ° C., there is a problem in that if the number of cycles exceeds 500, there is a danger that the bonding at the bonding portion may be broken. However, according to the third embodiment, each of the protruding electrodes 33 bonded to each of the electrodes 31a of the electronic component 31 and each of the electrodes 32a of the mounting board 32 are bonded to the mounting board 32 in addition to the bonding. Sealing material 3
Mounting board 34 and electronic component 31 joined via
Of the electronic component 3 caused by a temperature change.
The stress generated by the difference in thermal expansion between the mounting board 3 and the mounting board 32 is not concentrated on the joint between the electrodes 31a of the electronic component 31 and the electrodes 32a of the mounting board 32.
4 and the electronic component 31 via the die bond material 37 can be dispersed, so that the bonding between the electrodes 31a of the electronic component 31 and the electrodes 32a of the mounting substrate 32 can be further stabilized, It is possible to stabilize the quality of the component assembly.

Further, modifications of the second and third embodiments will be described.

FIG. 7A shows an electronic component assembly using a square plate-shaped mounting substrate 24 instead of the cavity type mounting substrate 24 in the second embodiment of FIG. (B) is an electronic component assembly using a rectangular plate-shaped mounting substrate 32 instead of the cavity type mounting substrate 32 in the third embodiment of FIG.

According to the modified examples of the second embodiment and the third embodiment described above, without using the cavity type mounting substrate, the mounting plates 22 and 24 or 32 having a rectangular plate shape without uneven portions are used. And 34, the supply height of the sealing material 25 is determined by the height of the electrode 21a of the electronic component 21, the height of the protruding electrode 23, and the height of the electrode 22a of the mounting substrate 22.
And the height of the electronic component 21 and the sum of the height from the upper surface of the mounting board 24 to the inactive surface of the electronic component 21 are substantially the same or slightly higher.
5 is supplied to the outer peripheral portion of the surface of the mounting substrate 22 having the electrodes 22a, or the supply height of the sealing material 35 is equal to the height of the electrodes 31a of the electronic component 31, the height of the protruding electrodes 33, and the mounting substrate. The height of the electrode 32a and the electronic component 31
The sealing material 35 is supplied to the outer peripheral portion of the bonding surface of the electronic component 31 of the mounting board 34 so as to be substantially the same as or slightly higher than the sum of the thickness of the mounting board 22 and the thickness of the die bonding material 37. The entire outer peripheral portion of the surface having each electrode 22a and the entire upper peripheral portion of the upper surface of the mounting substrate 24 are filled with the sealing material 25 without any gap, or the entire outer peripheral portion of the bonding surface of the mounting substrate 34 to which the electronic component 31 is bonded and the mounting substrate 32 Between the entire outer peripheral portion of the surface having each of the electrodes 32a can be filled with the sealing material 35 without any gap, and the entire electronic component 21 or 31 and each protruding electrode 23 or 33 and the mounting board 22 or 3
It becomes possible to seal each of the two electrodes 22a or 32a and their joints.

It is to be noted that by appropriately combining any of the various embodiments described above, the effects of the respective embodiments can be achieved.

[0066]

According to the first aspect of the present invention, when the electronic component assembly joins the electrodes of the electronic component and the electrodes of the mounting board, the electrodes of the electronic component and the electrodes of the mounting board are simultaneously formed. And by providing a sealing member capable of sealing the joints thereof, two steps conventionally performed separately, namely, a step of joining an electrode of an electronic component and an electrode of a mounting board, and a step of joining these electrodes and By performing the step of sealing the electrodes simultaneously, the electronic component assembly can be manufactured. Therefore, the manufacturing process of the electronic component assembly can be shortened, the mounting cost can be reduced, and a low-cost electronic component assembly can be provided.

Further, since the two steps are performed simultaneously, heating during the electrode bonding step and the sealing step are performed simultaneously, so that the heating time in the entire manufacturing process of the electronic component assembly is shortened. Therefore, the thermal effect on the electronic component and the mounting board can be reduced, and the quality of the electronic component assembly can be stabilized.

According to the second aspect of the present invention, the electronic component assembly includes the sealing material, which is a sealing member disposed between the entire outer peripheral portion of the mounting board and the entire outer peripheral portion of the electronic component. Conventionally, the uneven portion and the lid of the mounting board used to seal the joint between the electronic component and the mounting board and each electrode are not required, and the active surface of the electronic component and the electronic component of the mounting board are simply used. Since the active surface of the electronic component can be sealed with the component bonding surface and the sealing material, the shape of the mounting substrate can be simplified, and the quality of the electronic component assembly can be stabilized. .

According to the third to fifth aspects of the present invention, for example, when it is impossible to supply a sealing material to the outer peripheral portion of the active surface of the electronic component, or at the joint between the electronic component and the mounting board In a case where it is necessary to seal not only the respective electrodes but also the entire electronic component, the electronic component assembly includes a coating portion covering the entire outer surface of the electronic component, By providing a sealing member composed of a sealing material that seals between the end surface of the portion and the entire outer peripheral portion of the mounting board, the electrodes of the electronic component and the electrodes of the mounting board are joined at the same time as the bonding of the mounting board. The entire electronic component, the electrodes of the mounting board, and the joint between them can be sealed with the electronic component bonding surface, the covering portion, and the sealing material.

According to the sixth aspect of the present invention, by using a metal such as solder as the sealing material, excellent moisture resistance can be obtained.
By heating, it can be easily melted, and it becomes possible to easily perform joining with high hermeticity using the above sealing material.

According to the seventh to twelfth aspects of the present invention,
Conventionally, two steps, which have been separately performed, namely, a step of joining an electrode of an electronic component and an electrode of a mounting board, and a step of sealing these joints and each electrode, are performed simultaneously. A component assembly can be manufactured. Therefore, the manufacturing process of the electronic component assembly can be shortened, the mounting cost can be reduced, and a low-cost electronic component assembly can be provided.

Further, since the two steps are simultaneously performed, the heating in the electrode bonding step and the sealing step are performed simultaneously, so that the heating time in the entire manufacturing process of the electronic component assembly is shortened. Therefore, the thermal effect on the electronic component and the mounting board can be reduced, and the quality of the electronic component assembly can be stabilized.

In addition to the above effects, according to the second aspect or the eighth aspect of the present invention, the bonding of each electrode of the electronic component and each electrode of the mounting board is in addition to the bonding thereof. Therefore, since the electronic component and the mounting substrate are also supported by bonding via the sealing material, the bonding between each electrode of the electronic component and each electrode of the mounting substrate can be further stabilized. In addition, the quality of the electronic component assembly can be stabilized.

Further, in addition to the effects described above, according to the tenth aspect of the present invention, the bonding between each of the protruding electrodes bonded to each of the electrodes of the electronic component and each of the electrodes of the mounting board is performed by In addition to the bonding of the electronic component and the covering part that is joined to the mounting board via the sealing material and the electronic component, the electronic component and the mounting board generated by a temperature change The stress generated due to the difference in thermal expansion between the electrodes of the electronic component and the junction of the electrodes of the mounting board without concentrating on each electrode,
It is also possible to disperse the bonding portion between the covering part and the electronic component, and to stabilize the bonding between each electrode of the electronic component and each electrode of the mounting board, and to improve the quality of the electronic component assembly. Can be stabilized.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams showing an electronic component assembly according to a first embodiment of the present invention, wherein FIG. 1A is a cross-sectional view of the electronic component assembly, and FIG. It is the see-through | perspective top view which performed see-through.

FIGS. 2A, 2B, and 2C are diagrams illustrating a method for manufacturing an electronic component assembly according to the first embodiment of the present invention. FIGS. d) is a sectional view of the electronic component assembly.

3A and 3B are diagrams showing an electronic component assembly using a cavity type mounting board according to a second embodiment of the present invention, wherein FIG. 3A is a cross-sectional view of the electronic component assembly, and FIG. FIG. 3 is a perspective plan view of a mounting board having electrodes of a component assembly as seen through from above.

FIG. 4 is a diagram showing a method of manufacturing an electronic component assembly using a cavity type mounting board according to a second embodiment of the present invention, wherein (a), (b), and (c) show electronic components; FIG. 3D is a cross-sectional view of the component and the mounting board, and FIG.

5A and 5B are diagrams showing an electronic component assembly using a cavity type mounting board according to a third embodiment of the present invention, wherein FIG. 5A is a cross-sectional view of the electronic component assembly, and FIG. FIG. 4 is a perspective plan view of a mounting substrate having electrodes of a component assembly, seen through from a lower surface.

FIG. 6 is a diagram showing a method of manufacturing an electronic component assembly using a cavity type mounting board according to a third embodiment of the present invention, wherein (a), (b), and (c) show electronic components; FIG. 3D is a cross-sectional view of the component and the mounting board, and FIG. 4D is a cross-sectional view of the electronic component assembly.

FIG. 7A is a sectional view of a modification of the electronic component assembly according to the second embodiment of the present invention, and FIG.
It is sectional drawing of the modification of the electronic component assembly concerning embodiment.

FIGS. 8A and 8B are diagrams showing a method of manufacturing an electronic component assembly using a conventional flip chip method, in which FIGS. 8A and 8B are cross-sectional views of an electronic component and a mounting board, and FIG. 8C is an electronic component assembly. FIG. 4D is a perspective plan view of the mounting board of the electronic component assembly in FIG.

FIGS. 9A and 9B are diagrams showing a method of manufacturing an electronic component assembly using a conventional wire bonding method, wherein FIGS.
5C is a cross-sectional view of the electronic component and the mounting board, FIG. 5C is a cross-sectional view of the electronic component assembly, and FIG. 5D is a transparent plan view of the electronic component assembly in FIG.

[Explanation of symbols]

11: electronic component, 11a: electrode of electronic component 11, 12 ...
Mounting substrate, 12a: Electrode of mounting substrate 12, 13: Protruding electrode, 15: Sealing material, 21: Electronic component, 21a: Electrode of electronic component 21, 22: Mounting substrate, 22a: Mounting substrate 22
Electrodes 23, projecting electrodes 24, mounting board 24a, outer circumferential projections of mounting board 24, 24b recesses of mounting board 24,
25 ... sealing material, 31 ... electronic parts, 31a ... electronic parts 3
Reference numeral 1 denotes an electrode, 32: mounting substrate, 32a: electrode of mounting substrate 32, 32b: outer peripheral projection of mounting substrate 32, 32c: recess of mounting substrate 32, 33: protruding electrode, 34: mounting substrate, 35
... sealing material, 37 ... die bonding material, 41 ... electronic parts,
41a: electrode of electronic component 41, 42: mounting board, 42a
... electrodes of the mounting substrate 42, 43 ... projecting electrodes, 44 ... covers, 4
Reference numeral 5: sealing material, 51: electronic component, 51a: electronic component 51
Electrode 52, mounting substrate 52a, electrode of mounting substrate 52, lid 55, sealing material 56, wire 57
Die bond material.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuyuki Tomita 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E336 AA04 BB01 CC51 DD26 DD39 EE01 GG30

Claims (12)

[Claims] An electronic component (11, 21, 31) having electrodes (11a, 21a, 31a) and said electronic component (1).
1, 21, 31) of the electrodes (11a, 21a, 31)
a) a mounting board (12, 22, 32) having electrodes (12a, 22a, 32a) to be joined, and an electronic component (11, 22) arranged on the outer periphery of the mounting board (12, 22, 32). 21, 31) of the electrodes (11a, 21)
a, 31a) to the electrodes (12a, 22a, 32a) of the mounting board (12, 22, 32) and simultaneously the electrodes (11, 21, 31) of the electronic component (11, 21, 31).
a, 21a, 31a) and the mounting boards (12, 22, 3)
2) The sealing members (15, 24, 2) capable of sealing the electrodes (12a, 22a, 32a) and their joints.
5, 34, 35). 2. The sealing material (15) disposed between the entire outer peripheral portion of the mounting board (12) and the entire outer peripheral portion of the electronic component (11). 2. The electronic component assembly according to claim 1. 3. The sealing member (24, 25, 34, 3)
5) a covering portion (24, 34) covering the entire outer surface of the electronic component (21, 31), an end face of the covering portion (24, 34), and an entire outer peripheral portion of the mounting board (22, 32). The electronic component assembly according to claim 1, further comprising a sealing material (25, 35) for sealing the space between the electronic components. 4. The electronic device according to claim 3, wherein the mounting substrate is a flat member, and the covering portion is a concave member made of a moisture-resistant and heat-resistant material. Parts assembly. 5. The electronic device according to claim 3, wherein the mounting board is a concave member, and the covering portion is a flat member made of a moisture-resistant and heat-resistant material. Parts assembly. 6. The sealing material (15, 25, 35),
The electronic component assembly according to claim 2, wherein the electronic component assembly is a metal. 7. An electronic component (11, 21, 31) having electrodes (11a, 21a, 31a) is connected to the electronic component (1).
1, 21, 31) of the electrodes (11a, 21a, 31)
a) The electrodes (11a, 21) of the electronic component (11, 21, 31) are mounted on a mounting substrate (12, 22, 32) having electrodes (12a, 22a, 32a) that can be joined to the electronic component (11, 21, 31).
a, 31a) are aligned so that they can be joined to the electrodes (12a, 22a, 32a) of the mounting board (12, 22, 32), and then the electronic components (11, 21,.
31) and the electrodes (12a, 22a) of the mounting substrate (12, 22, 32).
a, 32a) while applying pressure while heating the electronic component (1).
1, 21, 31) to the mounting board (12, 22, 32)
And a sealing member (15, 24, 25, 3)
4, 35) using the electronic component (11, 21, 31).
Of the electrodes (11a, 21a, 31a) and the electrodes (12a, 22a, 3a) of the mounting substrate (12, 22, 32).
2a) and a method for manufacturing an electronic component assembly, characterized by sealing the joints thereof. 8. The sealing material (15), which is the sealing member (15), is placed on the surface of the electronic component (11) around the active surface of the electronic component (11) or on the mounting board (12). Surface, or both sides on the electronic component (11) and on the mounting substrate (12), and thereafter, the electronic component (11) is bonded to the mounting substrate (12) and simultaneously with the sealing material (15). The electronic component (1) is formed by the electronic component (11) and the mounting board (12).
The method for manufacturing an electronic component assembly according to claim 7, wherein the electrode (11a) of (1), the electrode (12a) of the mounting substrate (12), and a joint thereof are sealed. 9. The electronic component (21) is mounted on the mounting substrate (22), and the electrode (21a) of the electronic component (21) is connected to the electrode (22) of the mounting substrate (22).
a) The electrode (21a) of the electronic component (21) and the mounting board (22) are aligned so that they can be joined to the electronic component (21).
Are temporarily bonded, and before or after this, or simultaneously, the mounting substrate (2) around the electronic component (21).
2) Supply a sealing material (25) as a sealing member (25) on the top, and then cover (24) as a sealing member (25)
With respect to the mounting board (22),
Is positioned so as to cover the entire outer surface of the electronic component (21) temporarily bonded to the mounting board (22), and the electronic component (21) is mounted on the mounting board (22).
And at the same time, the sealing material (25), the mounting board (22), and the covering portion (24) allow the electrode (21a) of the electronic component (21) and the electrode (21) of the mounting board (22). 22. The method for manufacturing an electronic component assembly according to claim 7, wherein 22a) and a joint thereof are sealed. 10. An inactive surface of the electronic component (31) is adhered to a cover (34) serving as a sealing member (34),
A sealing material (35), which is a sealing member (35), is supplied onto the covering (34) around the electronic component (31) before or after this or at the same time, and then the covering (32) is attached to the mounting board ( 32), the electrode (31a) of the electronic component (31) and the electrode (32a) of the mounting board (32) are aligned so that they can be joined to each other. At the same time as bonding the electronic component (31), the electrode (31a) of the electronic component (31) and the mounting substrate (32) are formed by the sealing material (35), the mounting substrate (32), and the covering portion (34). The electrodes (32a) and their joints are hermetically sealed.
3. The method for manufacturing an electronic component assembly according to claim 1. 11. The electronic component assembly according to claim 9, wherein the sealing material (25) is supplied to the cover portion (24) or to both sides of the mounting board (22) and the cover portion (24). Production method. 12. The electronic component assembly according to claim 10, wherein the sealing material (35) is supplied to the mounting substrate (32) or to both sides of the mounting substrate (32) and the covering portion (34). Production method.