JP2002313892A - Rotary member and substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce trouble required for adjusting the centroid position of a rotary member. SOLUTION: An interruption plate 20 includes a circular main body plate 201 having an opening 24 in the center, and a connection boss 202 disposed on the upper face of the main body plate 201. In the connection boss 202, a balancer storage groove 206 storing a metallic balancer ring 205 is formed. The balancer ring 205 is stored in the balancer storage groove 206 with allowance and it can be displaced along the upper face of the main body plate 201 within the range of the allowance. Four adjusting screws 60 for adjusting the position of the balancer ring 205 in the balancer storage groove 206 are arranged so that they pass through the balancer storage groove 206 from the outer peripheral face of the connection boss 202. The balancer ring 205 is pushed to a desired position and it can be displaced by the adjusting screws 60 by adjusting the screwing quantity of the adjusting screws 60 into the through holes 61.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor wafer,
A substrate processing apparatus for performing processing using a processing fluid on various substrates such as a glass substrate for a liquid crystal display device, a glass substrate for a plasma display panel, and a substrate for a magnetic / optical disk, and a rotation provided in the substrate processing device Regarding members.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus for supplying a processing liquid (chemical solution or pure water) to a substrate to perform a surface treatment of the substrate is used. In a single-wafer-type substrate processing apparatus that processes substrates one by one, for example, a spin chuck that holds and rotates the substrate horizontally is provided. While the substrate is rotated in a horizontal plane by the spin chuck, By supplying the processing liquid to the surface of the substrate, the surface of the substrate is processed by the processing liquid. After the treatment with the treatment liquid, a drying process is performed in which the substrate is rotated at a high speed by a spin chuck, and the treatment liquid attached to the surface of the substrate is shaken off by centrifugal force and dried.

In such a single-wafer-type substrate processing apparatus, in order to perform good processing on the substrate, a blocking plate is provided at a position close to the upper surface of the substrate held by the spin chuck so as to face the upper surface of the substrate. May be placed. This blocking plate is attached to the lower end of a rotating shaft rotatable around a vertical axis, and is rotated in the same direction at substantially the same speed as the substrate rotated by the spin chuck while performing processing on the substrate. . Thus, the air flow near the upper surface of the substrate is prevented from being disturbed, and favorable processing can be performed on the upper surface of the substrate.

[0004]

The center of gravity of the blocking plate must coincide with the center of rotation. If the center of gravity of the blocking plate does not coincide with the center of rotation, vibration of the blocking plate occurs when the blocking plate is rotated, and the rotary shaft supporting the blocking plate and the rotary drive for rotating the rotating shaft This is because uneven wear may occur in the mechanism, and the life of the rotating shaft and the rotation drive mechanism may be shortened. Further, if vibration occurs in the blocking plate, the airflow near the upper surface of the substrate may be disturbed.

However, it is difficult to manufacture the shielding plate with high accuracy so that the center of gravity coincides with the center of rotation, and even if it can be manufactured with high accuracy, the shielding plate may be bent due to bending or the like. It causes eccentricity. Further, if the blocking plate is made of a material having high rigidity in order to prevent such bending, the cost of the blocking plate increases. Conventionally, a plurality of balancers are appropriately arranged on the upper surface of the shield plate in order to match the center of gravity of the shield plate with the center of rotation. However, before the center of gravity of the blocking plate coincides with the center of rotation, the positions of the plurality of balancers must be changed many times, and each time the balancer is changed, the balancer must be attached to and detached from the upper surface of the blocking plate. The adjustment work was troublesome.

Accordingly, an object of the present invention is to solve the above-mentioned technical problems and to provide a rotating member (blocking plate) capable of easily adjusting the position of the center of gravity and a substrate processing apparatus provided with the rotating member. That is.

[0007]

According to the first aspect of the present invention, a processing fluid is supplied to a substrate (W) rotating in a substantially horizontal plane to perform processing. A rotating member (20) that is used in a substrate processing apparatus to be applied and that is opposed to a position close to the upper surface of the substrate and that is rotated about a substantially vertical rotation axis, and a balance adjustment built in the rotating member; A rotating member comprising: a member (205); and a position adjusting mechanism (60, 61) for adjusting a position of the balance adjusting member with respect to the rotation axis.

[0008] The alphanumeric characters in parentheses indicate corresponding components in the embodiment described later. Hereinafter, the same applies in this section. According to the present invention, a position adjusting mechanism for adjusting the position of the balance adjusting member is provided, and the position of the balance adjusting member is adjusted by the position adjusting mechanism, for example, with the center of gravity of the rotating member as the center of rotation. Can be matched. Therefore, as compared with the conventional method of arranging a plurality of balancers to adjust the position of the center of gravity of the rotating member (for example, the blocking plate), the time required for the adjustment operation can be reduced, and the time required for the adjustment operation can be reduced. Can be shortened.

Further, since the balance adjusting member is built in the rotating member and is not exposed to the outside, there is no possibility of being corroded by the processing fluid. Therefore, the balance adjustment member can be configured to be relatively heavy using a metal material or the like, and when the balance adjustment member is configured to be relatively heavy, the center of gravity of the rotating member is largely displaced from the rotation center. However, it is possible to make the center of gravity coincide with the center of rotation. According to a second aspect of the present invention, the position adjustment mechanism includes at least three adjustment screws (60) for contacting the balance adjustment member and displacing the balance adjustment member from a direction intersecting the rotation axis. May be included.

The balance adjusting member may be a ring-shaped member formed so as to surround a predetermined axis parallel to the rotation axis of the rotation member. Good. The invention according to claim 4 is a substrate processing apparatus for performing processing using a processing fluid on a substrate,
A substrate holding / rotating means (11) for holding and rotating the substrate substantially horizontally, and a processing fluid supply means (13, 14, 2) for supplying a processing fluid to the substrate held by the substrate holding / rotating means
2, 23, 25, 26) and a rotating member (20) according to any one of claims 1 to 3.

According to the present invention, the same effect as the effect described in relation to the first aspect can be obtained. Further, in the case where the rotating member is a blocking plate having a lower surface having a flat surface substantially parallel to the upper surface of the substrate, vibration of the blocking plate when the blocking plate is rotated can be suppressed. The effect that turbulence near the upper surface can be prevented from being generated and that the substrate can be favorably processed can be obtained.

[0012]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an illustrative sectional view for explaining a configuration of a substrate processing apparatus according to one embodiment of the present invention. The substrate processing apparatus is for performing a surface treatment with a processing liquid on a semiconductor wafer (hereinafter, simply referred to as a “wafer”) W, which is an example of a substrate. The surface treatment for the wafer W is performed, for example, by
A cleaning process for cleaning the surface of the wafer W with a chemical solution or pure water may be used.

The substrate processing apparatus comprises a processing cup (not shown) provided with a spin chuck 11 which holds a wafer W substantially horizontally and rotates about a vertical axis passing substantially the center of the held wafer W. I have. Spin chuck 11
Is connected to the drive shaft of the motor 12 to be rotated. The drive shaft of the motor 12 is a hollow shaft, into which a lower nozzle 13 capable of supplying a processing liquid is inserted. This lower surface nozzle 13
It has a discharge port at a position close to the center of the lower surface of the wafer W held by the spin chuck 11, and has a form of a central axis nozzle that supplies a processing liquid from the discharge port toward the center of the lower surface of the wafer W. ing. The lower surface nozzle 13 is supplied with a processing liquid from a processing liquid supply source (not shown) via a processing liquid supply valve 14.

Above the spin chuck 11, a blocking plate 20 is provided so as to face the upper surface of the wafer W held by the spin chuck 11. The blocking plate 20 is attached to a lower end of a support shaft 21 arranged on the rotation axis of the wafer W. The support shaft 21 is rotatably held near the tip of an arm 40 connected to the lifting drive mechanism 30. The lower surface 20a of the blocking plate 20 is a flat surface substantially parallel to the upper surface of the wafer W.

The support shaft 21 is formed in a hollow shape, and a processing liquid nozzle 22 for supplying a processing liquid to the upper surface of the wafer W is inserted therein. The processing liquid nozzle 22 is supplied with a processing liquid from a processing liquid supply source via a processing liquid supply valve 23. The processing liquid supplied to the processing liquid nozzle 22 is supplied from the tip of the processing liquid nozzle 22 to the upper surface of the wafer W via an opening 24 (see FIG. 2) formed at the center of the lower surface 20a of the blocking plate 20. Is done.

Between the inner surface of the support shaft 21 and the processing liquid nozzle 22, there is provided a nitrogen gas flow passage through which a nitrogen gas for drying the wafer flows. The nitrogen gas flow passage is provided with a nitrogen gas supply source. Nitrogen gas is supplied via a nitrogen gas valve 25 and a nitrogen gas supply pipe 26. The nitrogen gas supplied to the nitrogen gas flow passage is blown out from the opening 24 of the blocking plate 20 toward the upper surface of the wafer W. The lifting drive mechanism 30 includes a support tube 31, a hollow lifting shaft 32 held by the support tube 31 so as to be able to move up and down, and a lifting shaft 3
2 is provided with a ball screw mechanism 33 for lifting and lowering the ball 2. The lower end of the lifting shaft 32 is fixed to a bracket 34, which is fixed to a nut 33 a of a ball screw mechanism 33. The screw shaft 33b of the ball screw mechanism 33 is driven to rotate by a motor 33c. Therefore, the motor 33c is rotated forward /
By reversing, the elevating shaft 32 moves up and down, and the arm 40 attached to the tip of the elevating shaft 32 moves up and down. Reference numeral 35 denotes a bellows for preventing the treatment liquid from entering.

A rotary shaft 41 is inserted through the elevating shaft 32. The rotating shaft 41 is rotatably held by bearings 42 and 43 disposed at the upper and lower ends of the elevating shaft 32, respectively. The lower end of the rotating shaft 41 is connected via a coupling 44 to a rotating shaft of a motor 45 attached to the bracket 34. A pulley 46 is fixed to the upper end of the rotating shaft 41.
Is wound around a timing belt 47 arranged in the internal space of the arm 40. The timing belt 47 is connected to the pulley 2 fixed to the support shaft 21 of the blocking plate 20.
It is also wrapped around 7. Therefore, when the motor 45 is driven to rotate, the rotational force of the motor 45 is
1 and the support shaft 21 via the timing belt 47 and the like.
And the blocking plate 20 rotates about a substantially vertical axis together with the support shaft 21. In this way,
A rotation drive mechanism for the blocking plate 20 is configured.

When the wafer W is loaded into the spin chuck 11, the blocking plate 20 is largely retracted above the spin chuck 11. When the wafer W is held by the spin chuck 11, the rotation of the wafer W held by the spin chuck 11 is started. Further, when the lifting / lowering drive mechanism 30 lowers the arm 40, the blocking plate 20 is brought closer to the upper surface of the wafer W held by the spin chuck 11, and the lower surface 20 a of the blocking plate 20 and the upper surface of the wafer W are fixed to a predetermined position. Interval. Then, the motor 45 is urged, and the blocking plate 20 is moved near the spin chuck 1 near the wafer W.
1 and rotated in the same direction at substantially the same speed as the substrate rotated. While the wafer W and the blocking plate 20 are rotating, the processing liquid is supplied to the upper and lower surfaces of the wafer W from the processing liquid supply nozzle 22 and the lower surface nozzle 13 near the center of the blocking plate 20, and the upper and lower surfaces of the wafer W A cleaning treatment with a treatment liquid is performed. At this time, since the blocking plate 20 is disposed so as to face the upper surface of the wafer W, the processing liquid supplied to the upper surface of the wafer W is prevented from rebounding and scattering outside.

After the cleaning process, the lifting / lowering drive mechanism 30 further lowers the arm 40, so that the blocking plate 20
Is brought closer to the surface of the wafer W. At the same time, the wafer W and the blocking plate 20 are both rotated at a high speed, and in this state, nitrogen gas is supplied from near the center of the blocking plate 20 to the space between the wafer W and the blocking plate 20. This allows the space between the upper surface of the wafer W and the lower surface 20a of the blocking plate 20 to be filled with the nitrogen gas, so that the wafer W can be dried well without leaving traces of the processing liquid on the upper surface of the wafer W. Can be.

FIG. 2 is a plan view showing the structure of the blocking plate 20, and FIG. 3 is a cross-sectional view taken along the line III-III in FIG. The blocking plate 20 includes a circular main body plate 201 having an opening 24 in the center, and a connection boss 202 provided on the upper surface of the main body plate 201. The connection boss 202 is formed in a flat cylindrical shape, and the hollow portion 203 communicates with the opening 24 of the main body plate 201. The connection boss 202
One end of the dowel 52 is press-fitted into four dowel holes 51 formed in the peripheral portion of the lower surface (the contact surface with the upper surface of the main body plate 201). By press-fitting into dowel holes 53 formed at positions corresponding to 51, they are positioned and fixed on the upper surface of main body plate 201. Eight through holes 54 are formed in the peripheral portion of the connection boss 202, and eight female screws (not shown) are formed on the upper surface of the main body plate 201 at positions corresponding to the through holes 54. The body plate 201 and the connection boss 202 are fixed by bolt screws using the through holes 54 and the female screws. With the connection boss 202 attached to the lower surface of the support shaft 21, the hollow portion of the connection boss 202 and the support shaft 21
This allows the tip of the processing liquid nozzle 22 (see FIG. 1) inserted into the hollow portion of the support shaft 21 to be disposed near the opening 24 of the main body plate 201. ing.

On the upper surface of the connecting boss 202, an O-ring (not shown) for sealing between the support shaft 21 and the connecting boss 202 is provided inside a peripheral portion where the dowel hole 54 is formed.
Is formed therein.
Further, inside the seal accommodation groove 204, a balancer accommodation groove 206 accommodating a metal balancer ring 205 is formed. Further inside the balancer housing groove 206,
An auxiliary balancer accommodating groove 207 capable of accommodating an auxiliary balancer (not shown) is formed.
A screw hole 208 for fixing the auxiliary balancer is formed in the bottom surface of the reference numeral 07.

The balancer ring 205 is accommodated in the balancer accommodating groove 206 with a margin, and can be displaced along the upper surface of the main body plate 201 within the margin. Four adjustment screws 60 for adjusting the position of the balancer ring 205 in the balancer housing groove 206 are provided to penetrate from the outer peripheral surface of the connection boss 202 to the balancer housing groove 206. That is,
The connection boss 202 has through holes 61 formed at four positions shifted from each other by 90 degrees in plan view. The inner surface of the through hole 61 is threaded, and the adjusting screw 6
0 can be screwed in. The adjustment screw 60 is connected to the balancer ring 205 by the balancer housing groove 20.
6, the tip thereof is formed to have a length in contact with the outer peripheral surface of the balancer ring 205. Therefore, by adjusting the screwing amount of each adjustment screw 60 into the through hole 61, the balancer ring 2
05 can be displaced by pushing it to a desired position. In addition, the balancer ring 205 can be fixed at that position by contacting the respective adjustment screws 60 with the outer peripheral surface of the balancer ring 205 and holding the balancer ring 205 from all sides with the respective adjustment screws 60.

The position of the balancer ring 205 is adjusted using, for example, a dedicated jig so that the center of gravity of the blocking plate 20 and the center of rotation are aligned. The dedicated jig is a device that can rotate the blocking plate 20 about the same point as the rotation center when attached to the support shaft 21 and can measure the vibration generated in the blocking plate 20 at that time. .
Using this jig, the vibration generated in the blocking plate 20 when the blocking plate 20 is rotated is measured, and each adjusting screw 60 is adjusted based on the measurement result, and the balancer ring 205 is adjusted in the direction in which the vibration is suppressed. Is displaced. Then, when the position of the balancer ring 205 having the smallest vibration is found, the position adjustment of the balancer ring 205 is completed, and in this state, the center of gravity of the blocking plate 20 and the rotation center are almost coincident.

When the position of the balancer ring 205 is adjusted by using this dedicated jig, for example, an appropriate weight is arranged on the connecting boss 202 so as to hit the direction in which vibration is suppressed. After removing the weight, the balancer ring 205 may be displaced in that direction. Further, it is not always necessary to perform position adjustment using a jig, for example, by measuring vibration when the blocking plate 20 is attached to the support shaft 21 and rotated, or
The position of the balancer ring 205 may be adjusted by observing the state of the blocking plate 20 and reducing the vibration of the blocking plate 20.

In any case, according to the configuration of this embodiment, the position of the balancer ring 205 can be easily adjusted by adjusting the screwing amounts of the four adjustment screws 60, The center of gravity of the blocking plate 20 can be made coincident with the center of rotation. Therefore, as compared with the conventional method of adjusting the position of the center of gravity of the blocking plate by arranging a plurality of balancers, the work required for the adjustment work can be reduced, and the time required for the adjustment work can be shortened.

Further, since the balancer ring 205 is not exposed when the blocking plate 20 is mounted on the support shaft 21, even if the balancer ring 205 is made of metal, the balancer ring 205 is corroded by a processing liquid (particularly a chemical liquid). There is no fear. Therefore, since the balancer ring 205 can be made of a relatively heavy metal material, the position of the balancer ring 205 can be adjusted even when the center of gravity of the main body plate 201 and the connection boss 202 is largely displaced from the center of rotation. By properly adjusting, the center of gravity of the blocking plate 20 and the center of rotation can be matched.

In this embodiment, when it is not possible to make the center of gravity of the blocking plate 20 coincide with the center of rotation only by adjusting the position of the balancer ring 205, the auxiliary balancer is attached to the auxiliary balancer accommodating groove 207. By adjusting the position of the balancer ring 205, the center of gravity of the blocking plate 20 can be surely matched with the center of rotation. As described above, one embodiment of the present invention has been described, but the present invention can be embodied in other forms. For example, in the above-described embodiment, a configuration in which four adjustment screws 60 for adjusting the position of the balancer ring 205 are provided has been described as an example.
The position 05 can be adjusted if at least three adjustment screws are provided. For example, if the adjustment screw is 3
In the case of a book, these three adjustment screws are preferably arranged at equal angular intervals of 120 ° in plan view in FIG.

In the above-described embodiment, the blocking plate 20 is taken as an example of the rotating member. However, other than the blocking plate 20, for example, it is disposed to face the surface of the wafer W, and the surface of the wafer W is scrubbed. The present invention may be applied to a scrub rotation brush to be cleaned. In this case, by matching the center of gravity of the scrub rotation brush with the rotation center, the vibration of the scrub rotation brush can be suppressed, so that the effect that the surface cleaning of the wafer W can be favorably performed by the scrub cleaning brush is obtained. Can be. Of course, the effect of reducing the labor and time required for adjustment work for adjusting the center of gravity of the scrub rotation brush to the center of rotation can also be obtained.

The substrate to be processed by the substrate processing apparatus is not limited to the wafer W, but may be another type of substrate such as a glass substrate for a liquid crystal display, a glass substrate for a plasma display panel, and a substrate for a magnetic / optical disk. You may. In addition, various design changes can be made within the scope of the matters described in the claims.

[Brief description of the drawings]

FIG. 1 is an illustrative cross-sectional view for explaining a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view showing a configuration of a blocking plate.

FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Spin chuck 13 Lower surface nozzle 14 Processing liquid supply valve 20 Cutoff plate 21 Support shaft 22 Processing liquid nozzle 23 Processing liquid supply valve 24 Opening 25 Nitrogen gas valve 26 Nitrogen gas supply pipe 60 Adjusting screw 61 Through hole 201 Main body plate 202 Connecting boss 203 Hollow Part 205 balancer ring 206 balancer receiving groove W wafer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenji Fujii 4-chome, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto-shi, Kyoto 1 Dai-Nippon Screen Manufacturing Co., Ltd. (72) Inventor Ryuichi Hanyama Kyoto 1-chome Tenjin Kita-cho, Kamigyo-ku, Kyoto-shi, Japan 1 Dai Nippon Screen Manufacturing Co., Ltd. (72) Inventor Tomoyuki Furumura 4-chome Tenjin, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto, Kyoto No. 1 Kitamachi 1 Dainippon Screen Mfg. Co., Ltd. F term (reference) 5F031 CA02 HA48 HA59 MA23 5F043 AA01 EE08 EE35 5F046 JA02 JA16 LA04 LA08

Claims (4)

[Claims] 1. A substrate processing apparatus for supplying a processing fluid to a substrate rotating in a substantially horizontal plane and performing processing thereon, and a substantially vertical rotation axis which is opposed to and located at a position close to an upper surface of the substrate. A rotation member that is rotated around, comprising: a balance adjustment member built in the rotation member; and a position adjustment mechanism for adjusting a position of the balance adjustment member with respect to the rotation axis. Element. 2. The apparatus according to claim 1, wherein the position adjusting mechanism includes at least three adjusting screws for abutting on the balance adjusting member and displacing the balance adjusting member from a direction intersecting the rotation axis. The rotating member according to claim 1. 3. The balance adjusting member according to claim 1, wherein the balance adjusting member is a ring-shaped member formed in a ring shape so as to surround a predetermined axis parallel to a rotation axis of the rotating member. A rotating member according to claim 1. 4. A substrate processing apparatus for performing processing using a processing fluid on a substrate, comprising: a substrate holding and rotating means for holding and rotating the substrate substantially horizontally; and a processing means for processing the substrate held by the substrate holding and rotating means. A substrate processing apparatus comprising: a processing fluid supply unit configured to supply a fluid; and the rotating member according to claim 1.