JP2002313671A - Laminated ceramic electronic component, method of manufacturing the same, ceramic paste, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic paste suitable for forming a ceramic green layer for step absorption on a ceramic green sheet with high pattern accuracy and strong adhesion to inner electrodes so as to substantially eliminate the step caused by the thickness of the inner electrodes in manufacturing, for example, a laminated ceramic capacitor. SOLUTION: A ceramic paste containing a metal-organic compound in addition to ceramic powder, an organic solvent, and an organic binder, is used for forming a ceramic green layer 5 for step absorption on a main surface of a green sheet so as to substantially eliminate the step caused by the thickness of the inner electrodes 1. By the metal-organic compound, viscosity of the ceramic paste is increased and adhesion to the inner electrodes 1 is strengthened. Structural defects are difficult to occur in a laminated ceramic electronic component such as the obtained laminated ceramic capacitor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic electronic component, a method for manufacturing the same, and a ceramic paste and a method for manufacturing the same, and more particularly, to a method for removing a step caused by a thickness of an internal circuit element film formed between ceramic layers. A multilayer ceramic electronic component having a step absorbing ceramic layer formed with a negative pattern of an internal circuit element film pattern for absorbing, a method for manufacturing the same, and a step-absorbing ceramic layer are advantageously used. The present invention relates to a ceramic paste and a method for producing the same.

[0002]

2. Description of the Related Art When manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, a plurality of ceramic green sheets are prepared and these ceramic green sheets are stacked. Depending on the function of the multilayer ceramic electronic component to be obtained, internal circuits such as conductor films and resistor films for forming capacitors, resistors, inductors, varistors, filters, etc., on specific ceramic green sheets An element film is formed.

In recent years, electronic devices such as mobile communication devices have been reduced in size and weight. In such electronic devices, for example, when a multilayer ceramic electronic component is used as a circuit element, such electronic devices have been described. There has been a strong demand for miniaturized and lightweight ceramic electronic components. For example, in the case of a multilayer ceramic capacitor, demands for miniaturization and large capacity are increasing.

When a multilayer ceramic capacitor is to be manufactured, typically, a ceramic slurry is prepared by mixing a dielectric ceramic powder, an organic binder, a plasticizer and an organic solvent, and this ceramic slurry is used as a release agent. Coated with silicone resin, etc.
For example, by applying a doctor blade method or the like on a support such as a polyester film, for example, a thickness of several tens μm
m is formed into a sheet shape to form a ceramic green sheet, and then the ceramic green sheet is dried.

[0005] Next, a conductive paste is applied by screen printing on the main surface of the above-mentioned ceramic green sheet in a plurality of patterns spaced from each other,
By drying this, an internal electrode as an internal circuit element film is formed on the ceramic green sheet. FIG. 7 is a plan view showing a part of the ceramic green sheet 2 on which the internal electrodes 1 are formed at a plurality of locations as described above.

Next, after the ceramic green sheets 2 are peeled off from the support and cut into a suitable size, a predetermined number of them are stacked as shown in FIG. By stacking a predetermined number of ceramic green sheets on which no internal electrodes are formed, a green laminate 3 is manufactured.

After the green laminate 3 is pressed in the laminating direction, as shown in FIG. 8, it is cut into a size to become a laminate chip 4 for each multilayer ceramic capacitor. After passing through the binder step, it is subjected to a firing step, and finally an external electrode is formed, whereby a multilayer ceramic capacitor is completed.

In such a multilayer ceramic capacitor, in order to satisfy the demand for miniaturization and large capacity, it is necessary to increase the number of stacked ceramic green sheets 2 and internal electrodes 1 and to increase the number of ceramic green sheets 2.
It is necessary to reduce the thickness of the layer.

However, as the above-described multi-layering and thinning progress, the accumulation of the thicknesses of the internal electrode 1 results in the gap between the portion where the internal electrode 1 is located and the portion where it is not, or The difference in thickness between a portion where the electrodes 1 are arranged in a relatively large number in the stacking direction and a portion where the electrodes 1 are not so many becomes more remarkable. For example, as shown in FIG. With regard to, deformation occurs such that one of the main surfaces becomes convex.

If the deformation as shown in FIG. 8 occurs in the laminated chip 4, in a portion where the internal electrodes 1 are not located or in a portion where only a relatively small number of the internal electrodes 1 are arranged in the laminating direction, Since a relatively large strain is caused during the pressing process and the adhesion between the ceramic green sheets 2 is poor, structural defects such as delamination and minute cracks are caused by internal stress caused during firing. Likely to happen.

Further, the deformation of the laminated chip 4 as shown in FIG. 8 results in undesirably deforming the internal electrodes 1,
This may cause a short-circuit failure.

Such inconvenience causes a reduction in the reliability of the multilayer ceramic capacitor.

In order to solve the above-described problem, for example, as shown in FIG. 2, a ceramic green layer 5 for absorbing a step is formed in a region on the ceramic green sheet 2 where the internal electrode 1 is not formed. The step-absorbing ceramic green layer 5 can substantially eliminate the step due to the thickness of the internal electrode 1 on the ceramic green sheet 2 as disclosed in, for example, JP-A-56-94719 and JP-A-3-74820. And JP-A-9-106925.

As described above, by forming the step absorbing ceramic green layer 5, as shown in FIG. 1, when the raw laminate 3a is manufactured, the portion where the internal electrode 1 is located is the same as the portion where the internal electrode 1 is located. And the thickness difference between the portion where the internal electrodes 1 are arranged in a relatively large number in the stacking direction and the portion where the internal electrode 1 is not so much does not substantially occur.
As shown in FIG. 3, undesired deformation as shown in FIG. 8 is less likely to occur in the obtained laminated chip 4a.

As a result, problems such as the above-described structural defects such as delamination and minute cracks and short-circuit failure due to deformation of the internal electrode 1 can be suppressed, and the reliability of the obtained multilayer ceramic capacitor can be improved. Can be.

[0016]

The above-described ceramic green layer 5 for absorbing a step is formed of a ceramic green sheet 2.
Has the same composition as in the case of and is formed by applying a ceramic paste containing a dielectric ceramic powder, an organic binder, a plasticizer and an organic solvent.

Further, the step absorbing ceramic green layer 5
However, if the plane pattern and thickness cannot be precisely controlled, the above-mentioned functions are impaired. Therefore, the coating film made of the ceramic paste for the step absorption ceramic green layer 5 must have high shape retention before drying.

In order to secure such a high shape retention, it is a general idea to take a measure of increasing the solid content concentration in the ceramic paste to increase the viscosity of the ceramic paste.

However, increasing the viscosity by increasing the amount of the organic binder or reducing the amount of the organic solvent undesirably increases the spinnability of the ceramic paste and increases the precision of printing for forming the step-absorbing ceramic green layer 5. It becomes difficult to carry out the step continuously or repeatedly.

As another problem, in order to form the above-described step-absorbing ceramic green layer 5 with high precision by printing or the like, it is necessary to improve the dispersibility of the ceramic powder in the ceramic paste.

In connection with this, for example, Japanese Patent Application Laid-Open No. 3-74
No. 820 discloses that in order to obtain a ceramic paste,
Although the dispersing process using this roll is disclosed, it is difficult to obtain the excellent dispersibility as described above by the dispersing process using only three rolls.

On the other hand, in JP-A-9-106925, a ceramic slurry for the ceramic green sheet 2 is prepared by mixing a dielectric ceramic powder, an organic binder, and a first organic solvent having a low boiling point. This is used for forming the ceramic green sheet 2, and the ceramic slurry is mixed with a second organic solvent having a boiling point higher than the boiling point of the above-mentioned first organic solvent. It is described that a ceramic paste for the step-absorbing ceramic green layer 5 is prepared by replacing the first organic solvent having a boiling point with a second organic solvent having a high boiling point.

Therefore, in the ceramic paste obtained as described above, at least two mixing steps are performed, so that the dispersibility of the ceramic powder is improved to some extent. ,
Since it is carried out in a state containing an organic binder, the viscosity of the slurry or paste at the time of mixing is high, and for example, in a dispersing machine using a medium such as a ball mill, the dispersibility of the ceramic powder is improved. Has limitations.

As described above, the ceramic paste used to form an extremely thin ceramic layer such as the step absorbing ceramic green layer 5 having a thickness equal to the thickness of the internal electrode 1 is excellent with respect to the ceramic powder contained therein. Dispersibility is required, and the requirement for such excellent dispersibility becomes more severe as the thickness of the internal electrode 1 decreases.

Also, the step absorbing ceramic green layer 5
Even if the dispersibility of the ceramic powder is poor, the ceramic green sheet 2
However, when the thickness of the ceramic green sheet 2 is reduced, the effect of covering the dispersibility by such a ceramic green sheet 2 can hardly be expected.

From the above, as the size and capacity of the multilayer ceramic capacitor increase, the ceramic powder in the step absorbing ceramic green layer 5 needs to have higher dispersibility.

In order to increase the dispersion efficiency of the ceramic powder in the mixing step, it is conceivable to lower the viscosity of the ceramic paste. In order to reduce the viscosity, the amount of the low-boiling organic solvent described above must be reduced. If it increases, another problem that a long time is required to remove the organic solvent having a low boiling point after the dispersion treatment is encountered.

The ceramic green layer 5 for absorbing a step is provided.
In the multilayer ceramic capacitor obtained by firing the green laminate 3a, the green laminate 3a includes the ceramic green sheets 2, the internal electrodes 1, and the step absorbing ceramic green layer 5. Although it is composed of three types of constituent materials, these three types of constituent materials undergo volume shrinkage in the binder removal step and the subsequent firing step. Therefore, a stress is generated due to a difference in physical properties of these three types of constituent materials, and this also causes a structural defect.

In the technique described in Japanese Patent Application Laid-Open No. 9-106925, the organic binder contained in the ceramic paste forming the step absorbing ceramic green layer 5 is as follows:
Since it is the same as the organic binder contained in the ceramic slurry forming the ceramic green sheet 2, it is dissolved in the same organic solvent. Therefore, when the ceramic green sheet 2 is stacked on the dried ceramic green layer 5 for step absorption, the organic binder contained in the dried ceramic green layer 5 for step absorption is dissolved by the organic solvent contained in the ceramic green sheet 2. Thus, the step absorbing ceramic green layer 5 may be attacked by the organic solvent. Also in this regard, the ceramic paste described in JP-A-9-106925 is not necessarily suitable as a ceramic paste used to form an extremely thin ceramic layer such as the step absorbing ceramic green layer 5.

Although the above description has been made in relation to the multilayer ceramic capacitor, the same problem is encountered in other multilayer ceramic electronic components such as a multilayer inductor other than the multilayer ceramic capacitor.

Accordingly, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component and a multilayer ceramic electronic component obtained by this manufacturing method, which can solve the above-described problems. .

Another object of the present invention is to provide a ceramic paste suitable for forming an extremely thin ceramic green layer such as the above-described step-absorbing ceramic layer, and a method of manufacturing the same.

[0033]

The present invention is first directed to a method for manufacturing a multilayer ceramic electronic component. In this manufacturing method, basically, the following steps are performed.

First, a ceramic slurry, a conductive paste, and a ceramic paste are prepared.

Next, the ceramic green sheet obtained by molding the ceramic slurry and the conductive paste are partially applied to the main surface of the ceramic green sheet so as to provide a step due to the thickness thereof. Formed on the main surface of the ceramic green sheet and applying a ceramic paste to a region where the internal circuit element film is not formed so as to substantially eliminate a step due to the thickness of the internal circuit element film. A plurality of composite structures including the step-absorbing ceramic green layer are produced.

Next, a green laminate is produced by stacking the plurality of composite structures.

Then, the green laminate is fired.

In a method for manufacturing a multilayer ceramic electronic component having such basic steps,
As a ceramic paste for forming the step absorption ceramic green layer, a ceramic paste further containing an organic metal compound in addition to the ceramic powder, the organic solvent and the organic binder is used.

As the organometallic compound, an organometallic compound in which a carbon atom of an organic group is directly bonded to a metal atom, an organometallic complex such as a metal carbonyl, a metal alkoxide, or acetyl acetate can be used.

The organic metal compound preferably contains the same metal component as the metal component of the ceramic powder contained in the ceramic paste.

When a ceramic paste containing the above-mentioned ceramic powder, organic solvent, organic binder and organometallic compound is produced, it is preferable to produce it through the following steps.

That is, a primary dispersion step in which a primary mixture containing at least a ceramic powder and a first organic solvent is dispersed, and at least an organic binder and an organometallic compound are added to the primary mixture after the primary dispersion step. And a secondary dispersion step of dispersing the secondary mixture. here,
It should be noted that the organic binder is added at the stage of the secondary dispersion process. Further, in addition to the above-described first organic solvent, a second organic solvent having a relative evaporation rate lower than that of the first organic solvent is used, and the second organic solvent is added at the stage of the primary dispersion step. May be added at the stage of the secondary dispersion step, or may be added at the stage of the secondary dispersion step while being added at the stage of the primary dispersion step. Then, finally, after the secondary dispersion step, a removal step of selectively removing the first organic solvent is performed by heat-treating the secondary mixture.

In the present invention, the ceramic slurry used for forming the ceramic green sheet is a ceramic powder having substantially the same composition as the ceramic powder contained in the ceramic paste for forming the step absorbing ceramic green layer. It is preferred to include.

Further, in a specific embodiment of the present invention, the ceramic powder contained in each of the ceramic slurry and the ceramic paste is a dielectric ceramic powder. In this case, when the internal circuit element films are the internal electrodes arranged so as to form a capacitance therebetween, a multilayer ceramic capacitor can be manufactured.

In another specific embodiment of the present invention, the ceramic powder contained in the ceramic slurry and the ceramic powder contained in the ceramic paste are both magnetic ceramic powders. In this case, the internal circuit element film is
When the coil conductor film extends in a coil shape, a laminated inductor can be manufactured.

The present invention is also directed to a multilayer ceramic electronic component obtained by the above-described manufacturing method.

The present invention is also directed to a ceramic paste as described above and a method for producing the same.

[0048]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described.
A method for manufacturing a multilayer ceramic capacitor will be described.
The method for manufacturing the multilayer ceramic capacitor according to this embodiment can be described with reference to FIGS. 1 to 3 described above.

In carrying out this embodiment, a ceramic slurry for the ceramic green sheet 2, a conductive paste for the internal electrode 1, and a ceramic paste for the step-absorbing ceramic green layer 5 are prepared.

The above-mentioned ceramic slurry is prepared by mixing a dielectric ceramic powder, an organic binder, a plasticizer, and an organic solvent having a relatively low boiling point. In order to obtain the ceramic green sheet 2 from this ceramic slurry, the ceramic slurry is formed by a doctor blade method or the like on a support (not shown) such as a polyester film coated with a silicone resin or the like as a release agent. And then dried. Each thickness of the ceramic green sheet 2 after drying is, for example, several tens of μm.

The ceramic green sheet 2 as described above
Of the internal electrodes 1 on the main surface of the
Is formed with a thickness of, for example, about 3 μm after drying. The internal electrode 1 is formed, for example, by applying a conductive paste by screen printing or the like and drying the conductive paste. Each of the internal electrodes 1 has a predetermined thickness. Therefore, a step is generated on the ceramic green sheet 2 due to the thickness.

Next, in order to substantially eliminate the step due to the thickness of the internal electrode 1, a step-absorbing ceramic is provided on the main surface of the ceramic green sheet 2 where the internal electrode 1 is not formed. A green layer 5 is formed. The step absorbing ceramic green layer 5 includes the internal electrode 1.
Is formed by applying the above-mentioned ceramic paste by screen printing or the like with the negative pattern described above, and then dried. The ceramic paste used here is a feature of the present invention,
The details will be described later.

In the above description, the step absorbing ceramic green layer 5 is formed after the internal electrode 1 is formed.
Conversely, the internal electrode 1 may be formed after the step absorption ceramic green layer 5 is formed.

As described above, the composite structure 6 as shown in FIG. 2, in which the internal electrode 1 and the step absorbing ceramic green layer 5 are formed on the ceramic green sheet 2,
After the composite structure 6 is peeled off from the support, a plurality of these composite structures 6 are cut into an appropriate size, a predetermined number of the composite structures 6 are stacked, and an internal electrode and a step-absorbing ceramic green layer are formed above and below the composite structure 6. By stacking the ceramic green sheets that have not been formed, a green laminate 3a as partially shown in FIG. 1 is produced.

After the green laminate 3a is pressed in the laminating direction, as shown in FIG. 3, the green laminate 3a is cut into a size to be a laminate chip 4a for each multilayer ceramic capacitor. After passing through the binder step, it is subjected to a firing step, and finally an external electrode is formed, whereby a multilayer capacitor is completed.

As described above, by forming the step absorption ceramic green layer 5, as shown in FIG. 1, a portion where the internal electrode 1 is located and a portion where the internal electrode 1 is not located in the green laminate 3a. 3 or between the portion where the internal electrodes 1 are arranged in a relatively large number in the stacking direction and the portion where the internal electrodes 1 are not so formed, substantially no difference occurs, and as shown in FIG. And undesired deformation hardly occurs. As a result, in the obtained multilayer ceramic capacitor, problems such as structural defects such as delamination and minute cracks and short-circuit failure can be suppressed.

The present invention is characterized in that the ceramic paste for forming the step absorbing ceramic green layer 5 contains an organometallic compound.

Examples of the organometallic compound include zinc octylate, zinc naphthenate, copper naphthenate, manganese octylate, manganese naphthenate, tetraethyl titanate, tetrabutyl titanate, titanium naphthenate,
Butoxyaluminum, magnesium naphthenate, magnesium octylate, octyl alcoholate of aluminum or magnesium, balsamic iridium sulfide,
Palladium balsam sulfide, palladium abietate, chromium naphthenate, chromium abietate, or the like can be used.

Preferably, an organometallic compound containing the same metal component as the metal component of the ceramic powder contained in the ceramic paste is used. Thereby, it is possible to ensure that the characteristics of the multilayer ceramic electronic component such as the multilayer ceramic capacitor to be obtained are not impaired.

In many cases, the planar pattern and the thickness of the step absorbing ceramic green layer 5 are strongly affected by the viscosity and rheology of the ceramic paste used for forming the same. In order to precisely control the planar pattern and thickness of the ceramic paste coating, it is necessary to enhance the shape retention of the coating before drying. The organometallic compound has a large effect on increasing the viscosity of the ceramic paste and can enhance the shape retention of the coating film, and thus functions as an excellent additive in controlling the coating pattern and thickness of the ceramic paste.

Further, the organometallic compound not only has a large effect of increasing the viscosity, but also has a feature of being strongly bonded to another metal surface. In general, in a multilayer ceramic electronic component such as a multilayer ceramic capacitor, if the bonding between the internal circuit element film such as the internal electrode 1 and the surrounding ceramic portion is insufficient, the internal or external components may be cut or degreased or fired. A gap is formed between the circuit element film and the surrounding ceramic portion, which tends to cause poor electrical characteristics. It is highly likely that similar defects occur between the internal circuit element film such as the internal electrode 1 and the step absorbing ceramic green layer 5.

Therefore, when an organometallic compound is added to the ceramic paste for the step absorbing ceramic green layer 5, a gap between the internal circuit element film such as the internal electrode 1 and the surrounding step absorbing ceramic green layer 5 is formed. In the cutting, degreasing, or firing step, so that it is difficult to form a gap between the internal circuit element film such as the internal electrode 1 and the surrounding stepped ceramic green layer 5. Can be.

In the present invention, the ceramic paste for the step absorbing ceramic green layer 5 is preferably
It is manufactured by the following method.

That is, in order to produce a ceramic paste, a primary dispersion step of performing a dispersion treatment of a primary mixture containing at least a ceramic powder and a first organic solvent;
A secondary dispersion step of subjecting the secondary mixture obtained by adding at least an organic binder and an organometallic compound to the primary mixture having undergone the secondary dispersion step to a dispersion treatment.

As described above, in the primary dispersion step, since the organic binder has not been added yet, the dispersion treatment can be performed under a low viscosity, and therefore, it is easy to enhance the dispersibility of the ceramic powder. In the primary dispersion step, the air adsorbed on the surface of the ceramic powder is replaced by the first organic solvent, and the ceramic powder can be sufficiently wetted with the first organic solvent. Can be sufficiently disintegrated.

In the secondary dispersion step, as described above,
The organic binder can be sufficiently and uniformly mixed while maintaining the high dispersibility of the ceramic powder obtained in the primary dispersion step, and a further pulverizing effect of the ceramic powder can be expected.

In this preferred production method, a second organic solvent having a lower relative evaporation rate than the first organic solvent is used in addition to the above-mentioned first organic solvent. This second organic solvent may be added at the stage of the primary dispersion step, added at the stage of the secondary dispersion step, or added at the stage of the primary dispersion step, Additional inputs may be made at the stage.

Finally, after the secondary dispersion step, 2
The first organic solvent is selectively removed by heat-treating the next mixture.

As described above, the removal of the first organic solvent requires 2
Since it is performed after the secondary dispersion step, it is possible to keep the viscosity of the secondary mixture relatively low even at the stage of the secondary dispersion step, and thus to maintain the dispersion efficiency relatively high. And the solubility of the organic binder added at the stage of the secondary dispersion step as described above can be increased.

The ceramic paste obtained as described above contains substantially only the second organic solvent as the organic solvent, even if the first organic solvent may slightly remain. Since the second organic solvent has a lower relative evaporation rate than the first organic solvent, the drying rate of the ceramic paste can be suppressed to a predetermined value or less, and for example, screen printing can be applied without any problem.

In the primary dispersion step and the secondary dispersion step which are carried out in the above-mentioned preferred production method, the dispersion treatment can be carried out by applying an ordinary dispersion processor using a medium such as a ball mill.

In this production method, there are various kinds of organic solvents used as the first organic solvent or the second organic solvent, and in consideration of the relative evaporation rate of the organic solvent, the first organic solvent is used. What is necessary is just to select what is used as an organic solvent and what is used as a 2nd organic solvent.

Examples of such organic solvents include ketones such as methyl ethyl ketone, methyl isobutyl ketone and acetone, hydrocarbons such as toluene, benzene, xylene and normal hexane, methanol, ethanol, isopropanol, butanol and amyl alcohol. Alcohols, ethyl acetate, butyl acetate, esters such as isobutyl acetate, diisopropyl ketone, ethyl cellosolve, butyl cellosolve, cellosolve acetate, methyl cellosolve acetate, butyl carbitol, cyclohexanol, pine oil, dihydroterpineol, Ketones such as isophorone, terpineol, propylene glycol, dimethyl phthalate, esters, hydrocarbons, alcohols, chlorinated hydrocarbons such as methylene chloride,
And mixtures thereof.

More preferably, as the first organic solvent, an organic solvent having a relative evaporation rate at 20 ° C. of 100 or more, more preferably 150 or more, is selected. This is because the removal of the first organic solvent in the removal step is quickly completed. The relative evaporation rate is a relative evaporation rate when the evaporation rate of normal butyl acetate (boiling point: 126.5 ° C.) is set to 100.

The relative evaporation rate suitable for the first organic solvent is 1
Examples of the organic solvent having a molecular weight of 00 or more include methyl ethyl ketone (relative evaporation rate: 465), methyl isobutyl ketone (145), acetone (720), toluene (195), benzene (500), and methanol (37).
0), ethanol (203), isopropanol (205), ethyl acetate (525), isobutyl acetate (152), butyl acetate (100), and mixtures thereof.

On the other hand, more preferably, as the second organic solvent, an organic solvent having a relative evaporation rate at 20 ° C. of 50 or less is selected. This is for improving the screen printability.

The relative evaporation rate suitable for the second organic solvent is 5
Examples of the organic solvent of 0 or less include diisopropyl ketone (relative evaporation rate 49), methyl cellosolve acetate (40), cellosolve acetate (24), butyl cellosolve (10), and cyclohexanol (1).
0 or less), pine oil (10 or less), dihydroterpineol (10 or less), isophorone (10 or less), terpineol (10 or less), propylene glycol (10 or less), dimethyl phthalate (10 or less) ,
Butyl carbitol (up to 40) and mixtures thereof.

In selecting each of the first and second organic solvents, it is also possible to use the boiling point instead of the relative evaporation rate as described above. Each of the organic solvents is easy to select. In the case of using the boiling point, if the combination in which the boiling point of the former is lower than the boiling point of the latter is selected as the first and second organic solvents, the relative evaporation rate of the former is generally larger than the relative evaporation rate of the latter. Different combinations can be selected.

The boiling points of some of the organic solvents mentioned above are shown in parentheses, and methyl ethyl ketone (79.6 ° C.), methyl isobutyl ketone (118.0 ° C.), acetone (56.1 ° C.) ° C), toluene (111.0 ° C), benzene (79.6 ° C), methanol (64.5 ° C), ethanol (78.5 ° C), isopropanol (82.5 ° C), ethyl acetate (77.1 ° C).
° C), isobutyl acetate (118.3 ° C), diisopropyl ketone (143.5 ° C), methyl cellosolve acetate (143 ° C), cellosolve acetate (156.2)
C), butyl cellosolve (170.6 C), cyclohexanol (160 C), pine oil (195-225).
° C), dihydroterpineol (210 ° C), isophorone (215.2 ° C), terpineol (219.0 ° C).
° C), propylene glycol (231.8 ° C), and dimethyl phthalate (282.4 ° C). The first and second organic solvents may be selected based on such boiling points. .

When the combination of the first and second organic solvents is selected based on the difference between the boiling points as described above, the difference between the boiling point of the first organic solvent and the boiling point of the second organic solvent is 50 ° C. or more. Preferably, there is. This is to make it easier to selectively remove only the first organic solvent by a heat treatment in the removing step.

The above-mentioned second organic solvent having a high boiling point preferably has a boiling point of 150 ° C. or more, and has a boiling point of about 200 to 250 ° C. in consideration of screen printability. Is more preferred. If the temperature is lower than 150 ° C., the ceramic paste is easy to dry, so that the clogging of the mesh of the printing pattern easily occurs,
On the other hand, if it exceeds 250 ° C., the printed coating film is difficult to dry,
Therefore, it takes a long time for drying.

The organic binder used in the ceramic paste is preferably one that dissolves in an organic solvent at room temperature. Examples of such organic binders include polyacetals such as polyvinyl butyral and polybutyl butyral, modified celluloses such as poly (meth) acrylates, ethyl cellulose, alkyds, vinylidenes, polyethers, and epoxy resins. , Urethane resins, polyamide resins, polyimide resins, polyamide imide resins, polyester resins, polysulfone resins, liquid crystal polymers, polyimidazole resins, polyoxazoline resins, and the like.

The addition amount of the organic binder is selected from 1 to 20% by weight, preferably from 3 to 10% by weight, based on the ceramic powder.

In the above-described primary dispersion step, the primary mixture preferably contains an organic dispersant. That is, in the primary mixture, the first organic solvent or the first and second
If the organic dispersant is added in a state diluted with the organic solvent, the dispersibility of the ceramic powder is further improved.

The above-mentioned organic dispersant is not particularly limited, but from the viewpoint of dispersibility, the molecular weight is preferably 10,000 or less. Anionic, cationic, or nonionic may be used, but polyacrylic acid or its ammonium salt,
Polyacrylic acid ester copolymers, polyethylene oxide, polyoxyethylene alkyl amyl ether, fatty acid diethanol amide, polyethylene imine, and copolymers of polyoxypropylene monoallyl monobutyl ether and maleic anhydride (and styrene) are preferred.

The amount of the organic dispersant added is 0.1 to 5% by weight, preferably 0.5 to 2.
0% by weight.

The ceramic powder contained in the ceramic paste preferably has substantially the same composition as the ceramic powder contained in the ceramic slurry used for forming the ceramic green sheet 2. This is because the sinterability between the step absorbing ceramic green layer 5 and the ceramic green sheet 2 is matched.

It should be noted that having substantially the same composition as described above means that the main components are the same. For example,
Even if minor components such as trace addition metal oxide and glass are different,
It can be said that they have substantially the same composition. Also,
If the ceramic powder contained in the ceramic green sheet 2 has a temperature characteristic of the capacitance that satisfies the B characteristic stipulated by the JIS standard and the X7R characteristic stipulated by the EIA standard, the step-absorbing ceramic green layer 5 is used. The ceramic powder contained in the ceramic paste may have different sub-components as long as they have the same main component and satisfy the B characteristics and the X7R characteristics.

FIG. 4 is a view for explaining a method of manufacturing a multilayer inductor according to another embodiment of the present invention. FIG. 5 is a perspective view showing the appearance of the multilayer inductor manufactured by this method. FIG. 2 is an exploded perspective view showing elements constituting a raw laminate 13 prepared for obtaining a laminate chip 12 provided in 11.

The green laminate 13 includes a plurality of ceramic green sheets 14, 15, 16, 17,.
9 and these ceramic green sheets 14 to 19
Are obtained by laminating.

The ceramic green sheets 14 to 19 are
It is obtained by shaping a ceramic slurry containing a magnetic ceramic powder by a doctor blade method or the like and drying. Each thickness of the ceramic green sheets 14 to 19 is, for example, 10 to 30 μm after drying.

Among the ceramic green sheets 14 to 19, the ceramic green sheets 15 to 1 positioned in the middle
8, a coil conductor film extending in a coil shape and a step absorbing ceramic green layer are formed as described in detail below.

First, the coil conductor film 20 is formed on the ceramic green sheet 15. Coil conductor film 20
Is formed such that its first end reaches the edge of the ceramic green sheet 15. A via-hole conductor 21 is formed at the second end of the coil conductor film 20.

To form such a coil conductor film 20 and via-hole conductor 21, for example, after forming a through-hole for via-hole conductor 21 in ceramic green sheet 15 by a method such as laser or punching, coil conductor film 20 is formed. And a conductive paste that becomes the via-hole conductor 21 is applied by screen printing or the like,
Drying is performed.

Further, in order to substantially eliminate the step due to the thickness of the coil conductor film 20, a step absorption area on the main surface of the ceramic green sheet 15 where the coil conductor film 20 is not formed is provided. A ceramic green layer 22 is formed. Ceramic green layer for step absorption 2
2 is formed by applying the ceramic paste containing the magnetic ceramic powder, which is a feature of the present invention, by screen printing or the like, and drying the paste.

Next, the coil conductor film 23, the via-hole conductor 24 and the step absorbing ceramic green layer 25 are formed on the ceramic green sheet 16 in the same manner as described above. First of the coil conductor film 23
Is connected to the second end of the coil conductor film 20 via the via-hole conductor 21 described above. The via-hole conductor 24 is formed at the second end of the coil conductor film 23.

Next, on the ceramic green sheet 17, a coil conductor film 26, a via-hole conductor 27 and a step difference absorbing ceramic green layer 28 are similarly formed. The first end of the coil conductor film 26 is connected to the second end of the coil conductor film 23 via the via-hole conductor 24 described above. The via-hole conductor 27 is formed of the coil conductor film 2.
6 formed at the second end.

The above-described lamination of the ceramic green sheets 16 and 17 is repeated a plurality of times as necessary.

Next, a coil conductor film 29 and a step absorbing ceramic green layer 30 are formed on the ceramic green sheet 18. The first end of the coil conductor film 29 is connected to the second end of the coil conductor film 26 via the via-hole conductor 27 described above. Coil conductor film 29
Is formed such that its second end reaches the edge of the ceramic green sheet 18.

The above-described coil conductor films 20, 23,
The thickness of each of 26 and 29 is, for example, about 30 μm after drying.

Such a ceramic green sheet 14
In the raw laminated body 13 obtained by laminating a plurality of composite structures each including-to 19, a plurality of coil conductor films 20, 23, 26 and 29 each extending in a coil shape are formed in the via-hole conductors 21, 24 and 27. , A plurality of turns of the coil conductor are formed as a whole.

By firing the green laminate 13, a laminate chip 12 for the laminated inductor 11 shown in FIG. 5 is obtained. Although the raw laminate 13 is shown in FIG. 4 as one for obtaining one laminated chip 12, it is manufactured for obtaining a plurality of laminated chips and is cut. Thereby, a plurality of stacked chips may be taken out.

Next, as shown in FIG. 5, the opposite ends of the laminated chip 12 are provided with the above-described coil conductor film 2.
External electrodes 30 and 31 are formed so as to be respectively connected to the first end of C.O. and the second end of coil conductor film 29, whereby multilayer inductor 11 is completed.

In the multilayer ceramic capacitor described with reference to FIGS. 1 to 3 or the multilayer inductor 11 described with reference to FIGS. 4 and 5, the ceramic green sheet 2 or 14 to 19 or the ceramic green layer 5 for absorbing a step is provided. Or, as the ceramic powder contained in 22, 25, 28 and 30, typically, oxide ceramic powder such as alumina, zirconia, magnesia, titanium oxide, barium titanate, lead zirconate titanate, ferrite-manganese, etc. , Silicon carbide, silicon nitride, and non-oxide ceramic powders such as sialon. The average particle diameter of the powder is preferably 5 μm or less, more preferably 1 μm, spherical or pulverized.

Hereinafter, the present invention will be described based on experimental examples.
This will be described more specifically.

[0106]

[Experimental Example] An experimental example relates to a multilayer ceramic capacitor, and was carried out to confirm the effect of adding an organometallic compound to a ceramic paste for a ceramic green layer for absorbing a level difference.

1. Preparation of Ceramic Powder First, barium carbonate (BaCO ₃ ) and titanium oxide (TiO ₂ ) were weighed to have a molar ratio of 1: 1 and wet-mixed using a ball mill, followed by dehydration drying. Next, after calcining at a temperature of 1000 ° C. for 2 hours, the resultant was pulverized to obtain a dielectric ceramic powder.

2. Preparation of Ceramic Slurry and Preparation of Ceramic Green Sheet 100 parts by weight of the previously prepared ceramic powder, 7 parts by weight of polyvinyl butyral (medium polymerized product), and D as a plasticizer
3 parts by weight of OP (dioctyl phthalate), 30 parts by weight of methyl ethyl ketone, 20 parts by weight of ethanol, and 20 parts by weight of toluene were mixed with a zirconia ball 60 having a diameter of 1 mm.
The mixture was put into a ball mill together with 0 parts by weight, and wet-mixed for 20 hours to obtain a ceramic slurry.

The ceramic slurry was formed into a ceramic green sheet by applying a doctor blade method, and dried at 80 ° C. for 5 minutes. The thickness of the obtained ceramic green sheet was about 10 μm.

3. Preparation of conductive paste 100 parts by weight of metal powder of Ag / Pd = 70/30, 4 parts by weight of ethyl cellulose, 2 parts by weight of alkyd resin, and 3 parts by weight of Ag metal resinate (17.5% as Ag)
Parts by weight) and 35 parts by weight of butyl carbitol acetate were kneaded with a three-roll mill, and 35 parts by weight of terpineol was added to adjust the viscosity.

[0111] 4. Preparation of Ceramic Paste for Ceramic Green Layer for Absorbing Step (1) Examples 1 to 3 100 parts by weight of dielectric ceramic powder prepared above, 70 parts by weight of methyl ethyl ketone (relative evaporation rate 465), and zirconia having a diameter of 1 mm 600 parts by weight of boulder,
The mixture was charged into a ball mill and wet-mixed for 16 hours. Next, 40 parts by weight of terpineol having a boiling point of 220 ° C. (relative evaporation rate of 10 or less), 10 parts by weight of ethylcellulose, and 0.5 part by weight of an organometallic compound are added to the same pot, and mixed for 16 hours. Thus, a ceramic slurry mixture was obtained.

Examples of the above organometallic compounds include those described in Example 1.
In Example 2, tetraethyl titanate was used, Example 2 used tetrabutyl titanate, and Example 3 used titanium naphthenate.

Next, the above-mentioned ceramic slurry mixture was distilled under reduced pressure in an evaporator for 2 hours in a warm bath at 60 ° C., thereby completely removing methyl ethyl ketone to obtain a ceramic paste.

(2) Comparative Example 100 parts by weight of the dielectric ceramic powder prepared above, 70 parts by weight of methyl ethyl ketone (relative evaporation rate 465), and 600 parts by weight of a zirconia ball having a diameter of 1 mm were mixed with each other.
The mixture was charged into a ball mill and wet-mixed for 16 hours. Next, 40 parts by weight of terpineol having a boiling point of 220 ° C. (relative evaporation rate of 10 or less) and the organic binder 10 were placed in the same pot.
And the mixture was further mixed for 16 hours to obtain a ceramic slurry mixture.

Next, the above-mentioned ceramic slurry mixture was distilled under reduced pressure in an evaporator for 2 hours in a hot bath at 60 ° C., thereby completely removing methyl ethyl ketone to obtain a ceramic paste.

5. Production of Multilayer Ceramic Capacitor In order to form internal electrodes on the main surface of the ceramic green sheet prepared above, a conductive paste was screen-printed and dried at 80 ° C. for 10 minutes. The dimensions, shape and position of the internal electrodes were set so as to be compatible with the laminated chip obtained in a later step. Next, in order to form a step absorption ceramic green layer on the main surface of the ceramic green sheet, each ceramic paste according to Examples 1 to 3 and Comparative Example was screen-printed and dried at 80 ° C. for 10 minutes. The thickness of each of the internal electrode and the step absorption ceramic green layer was set to about 3 μm after drying.

Next, as described above, 200 ceramic green sheets forming the internal electrodes and the step-absorbing ceramic green layer are sandwiched between several tens of ceramic green sheets not provided with the internal electrodes and the like. To produce a raw laminate, and this laminate is
It was hot-pressed at 80 ° C. under a pressure of 1000 kg / cm ² .

Next, the above-mentioned green laminate was cut by a cutting blade so as to have a size of 3.2 mm in length × 1.6 mm in width × 1.6 mm in thickness after firing, so that a plurality of laminates were cut. I got a body chip.

Next, on the firing setter on which a small amount of zirconia powder was sprayed, the above-mentioned plurality of laminated chips were aligned, and the temperature was raised from room temperature to 250 ° C. over 24 hours to remove the organic binder. Next, the laminated chip was put into a firing furnace and fired at a maximum of 1300 ° C. for a profile of about 20 hours.

Next, the obtained sintered body chip was placed in a barrel, and after polishing the end face, external electrodes were provided at both ends of the sintered body to complete a multilayer ceramic capacitor as a sample.

6. Evaluation of Characteristics Various characteristics were evaluated for the ceramic pastes and multilayer ceramic capacitors according to Examples 1 to 3 and Comparative Examples described above. The results are shown in Table 1.

[0122]

[Table 1]

The characteristics evaluation in Table 1 was performed as follows.

"Degree of dispersion": The particle size distribution of the ceramic powder was measured using an optical diffraction type particle size distribution analyzer, and calculated from the obtained particle size distribution. That is, the previously prepared ceramic powder is dispersed in water using an ultrasonic homogenizer, ultrasonic waves are applied until the particle diameter does not become smaller any more, and the particle diameter of D90 at that time is recorded, and this is recorded. The limit particle size was used. On the other hand, the ceramic paste was diluted in ethanol, and the particle size distribution of D90 in the particle size distribution was recorded, which was used as the particle size of the paste. Then, the degree of dispersion was calculated based on the equation: degree of dispersion = (granule diameter of paste / critical particle diameter) −1. If the numerical value of the dispersion is +, the closer to 0 the value is, the better the dispersibility is. If the numerical value is-, the larger the absolute value is, the better the dispersibility is.

"Solid content": Approximately 1 g of the ceramic paste was precisely weighed and calculated from the weight after being left at 150 ° C. for 3 hours in a convection oven.

"Viscosity": The viscosity of the ceramic paste is
1. Using a Tokyo Keiki E-type viscometer at 20 ° C.
The measurement was performed by applying a rotation of 5 rpm.

"Print bleeding": Using a stainless steel screen of 100 μm width / 100 μm pitch, 400 mesh and 50 μm thickness on a 96% alumina substrate,
A printed film for evaluation was formed by printing the emulsion at a thickness of 20 μm and drying at 80 ° C. for 10 minutes, and the value was obtained by subtracting 100 μm from the line width measured by a non-contact type laser surface roughness meter.

"Ra (surface roughness)": The above "print thickness"
And the surface roughness Ra, that is, the value obtained by averaging the absolute value of the deviation between the center line and the roughness curve obtained by averaging the undulation, It was determined from the measurement result by a laser surface roughness meter.

"Structural defect defect rate": When abnormalities were observed in the appearance inspection of the sintered chip for the obtained multilayer ceramic capacitor and the inspection by an ultrasonic microscope, the internal structural defects were confirmed by polishing. (Number of sintered chips with structural defects) / (total number of sintered chips) was defined as the structural defect defect rate.

Further, among the structural defects, those which are caused by abnormalities observed in the inspection by the appearance inspection are expressed as “appearance defect rate of structural defects”, and those which are caused by the abnormalities observed in the inspection by the ultrasonic microscope are “ Internal defect rate ". The adhesion between an internal circuit element film such as an internal electrode and a step absorbing ceramic green layer affects internal structural defects.

As can be seen from Table 1, Examples 1 to 3
It shows excellent characteristics as compared with the comparative example.

More specifically, according to Examples 1 to 3 using a ceramic paste to which an organometallic compound was added, compared to Comparative Examples using a ceramic paste containing no organometallic compound, Since the viscosity of the ceramic powder can be increased without impairing the dispersibility of the ceramic powder and the solid content of the same level, the printing bleeding is small, and the surface roughness and the defect rate of structural defects are excellent.

Regarding the defect rate of the structural defect described above, Example 1
In Nos. To 3, the defect rate of internal structural defects is particularly low, and most of the structural defects are external structural defects. This indicates that the organometallic compound has a significant effect on internal structural defects, and that the addition of the organometallic compound to the ceramic paste for the step-absorbing ceramic green layer is effective in suppressing structural defects.

On the other hand, in the comparative example, the overall structural defect rate is higher than in Examples 1 to 3 by the increased internal structural defect rate.

In the above experimental examples, the dielectric ceramic powder was used as the ceramic powder contained in the ceramic paste according to the present invention. However, in the present invention, the electrical characteristics of the ceramic powder used were used. Therefore, a ceramic paste that can be expected to have the same effect can be obtained by using, for example, magnetic ceramic powder, insulating ceramic powder, or piezoelectric ceramic powder.

[0136]

As described above, according to the present invention, since the ceramic paste for forming the step absorbing ceramic green layer contains an organometallic compound,
The viscosity of the ceramic paste can be increased, and when a ceramic paste is applied to form a step absorption ceramic green layer on a dried ceramic green sheet, the applied pattern and thickness can be stabilized. .

Further, the organometallic compound not only has a large effect of increasing the viscosity, but also has a feature that it is strongly bonded to another metal surface. Therefore, it is possible to increase the adhesive force between the internal circuit element film and the peripheral step absorbing ceramic green layer, and in the cutting, degreasing or firing step, the internal circuit element film and the peripheral step absorbing ceramic layer. It is possible to make it difficult to generate a gap between the green layer.

From the above, according to the present invention,
In the multilayer ceramic electronic component, a step-absorbing ceramic green layer is formed on a main surface of the ceramic green sheet and in a region where the internal circuit element film is not formed so as to substantially eliminate a step due to the thickness of the internal circuit element film. Therefore, by using the ceramic paste as described above, structural defects such as cracks and delaminations are less likely to occur, and a multilayer ceramic electronic component can be manufactured with high reliability.

Further, according to the present invention, it is possible to sufficiently cope with the demand for miniaturization and weight reduction of a multilayer ceramic electronic component, and when the present invention is applied to a multilayer ceramic capacitor, It is possible to advantageously reduce the size and increase the capacity, and when the present invention is applied to a multilayer inductor, it is possible to advantageously reduce the size and increase the inductance of the multilayer inductor.

In the present invention, when producing the ceramic paste, at least the ceramic powder and the first
Primary dispersion step of dispersing a primary mixture containing an organic solvent, and a secondary dispersion step of dispersing a secondary mixture obtained by adding at least an organic binder and an organometallic compound to the primary mixture after the primary dispersion step. And a second organic solvent having a relative evaporation rate smaller than that of the first organic solvent and a primary mixture and / or
Or, after the step of including the secondary mixture, and after the secondary dispersion step, by performing a heat treatment of the secondary mixture, a removal step of selectively removing the first organic solvent is performed,
The dispersibility of the ceramic powder contained in the ceramic paste can be improved.

In the method for manufacturing a multilayer ceramic electronic component according to the present invention, the ceramic slurry used for forming the ceramic green sheets is contained in the ceramic paste for forming the step absorbing ceramic green layer. By including the ceramic powder having substantially the same composition as the powder, the sintering properties of the ceramic green sheet and the step absorbing ceramic green layer can be matched, and cracks due to such mismatch in sintering properties and The occurrence of delamination can be prevented.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically illustrating a part of a green laminate 3a for explaining a method of manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention, which is of interest to the present invention. .

FIG. 2 is a plan view showing a part of the composite structure 6 manufactured in the method for manufacturing the multilayer ceramic capacitor shown in FIG.

FIG. 3 is a cross-sectional view schematically showing a multilayer chip 4a manufactured in the method for manufacturing the multilayer ceramic capacitor shown in FIG.

FIG. 4 is an exploded perspective view showing elements constituting a raw laminate 13 prepared for manufacturing a multilayer inductor according to another embodiment of the present invention.

FIG. 5 is a perspective view showing the appearance of a multilayer inductor 11 including a multilayer chip 12 obtained by firing the raw multilayer body 13 shown in FIG.

FIG. 6 is a cross-sectional view schematically illustrating a part of a green laminate 3 for explaining a method of manufacturing a conventional multilayer ceramic capacitor that is interesting to the present invention.

7 is a plan view showing a part of a ceramic green sheet 2 on which an internal electrode 1 is formed, which is manufactured in the method for manufacturing a multilayer ceramic capacitor shown in FIG.

8 is a cross-sectional view schematically showing a multilayer chip 4 manufactured in the method for manufacturing the multilayer ceramic capacitor shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Internal electrode (internal circuit element film) 2, 14-19 Ceramic green sheet 3a, 13 Raw laminated body 4a, 12 Laminated chip 5, 22, 25, 28, 30 Ceramic green layer for step difference absorption 6 Composite structure 11 Multilayer inductors (multilayer ceramic electronic components) 20, 23, 26, 29 Coil conductor film (internal circuit element film)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shin Miyazaki 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (Reference) 5E001 AB03 AD02 AH01 AH09 AJ01 AJ02 5E062 DD04 5E070 AA01 AB02 CB13 5E082 AB03 BC32 EE04 FG26 FG54 LL01 LL02 MM24

Claims (12)

[Claims] 1. A ceramic green sheet obtained by preparing a ceramic slurry, a conductive paste, and a ceramic paste, and forming the ceramic slurry, and providing a step on the main surface of the ceramic green sheet due to its thickness. And an internal circuit element film formed by partially applying the conductive paste, and the main surface of the ceramic green sheet so as to substantially eliminate a step due to the thickness of the internal circuit element film. Producing a plurality of composite structures, comprising a step absorption ceramic green layer formed by applying the ceramic paste to a region where the internal circuit element film is not formed, and stacking the plurality of the composite structures. To produce a raw laminate, and firing the raw laminate A method of manufacturing a multilayer ceramic electronic component comprising the steps of: forming a multilayer ceramic electronic component, wherein the ceramic paste includes a ceramic powder, an organic solvent, an organic binder, and an organic metal compound. Manufacturing method of electronic components. 2. The method according to claim 1, wherein the organometallic compound contains the same metal component as the metal component of the ceramic powder. 3. The step of preparing the ceramic paste, comprising: at least including a ceramic powder and a first organic solvent.
A first dispersion step of dispersing the next mixture; a second dispersion step of dispersing a second mixture obtained by adding at least the organic binder and the organometallic compound to the first mixture after the first dispersion step; A step of including a second organic solvent having a lower relative evaporation rate than the first organic solvent in the primary mixture and / or the secondary mixture; and after the secondary dispersion step, heat-treating the secondary mixture. 3. The method of manufacturing a multilayer ceramic electronic component according to claim 1, further comprising a removing step of selectively removing the first organic solvent. 4. The production of a multilayer ceramic electronic component according to claim 1, wherein said ceramic slurry includes a ceramic powder having substantially the same composition as said ceramic powder contained in said ceramic paste. Method. 5. The ceramic powder contained in each of the ceramic slurry and the ceramic paste,
The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 4, wherein both are a dielectric ceramic powder. 6. The multi-layer ceramic electronic component according to claim 5, wherein the internal circuit element films are internal electrodes arranged so as to form a capacitance therebetween, and the multilayer ceramic electronic component is a multilayer ceramic capacitor. A manufacturing method of the multilayer ceramic electronic component according to the above. 7. The ceramic powder contained in each of the ceramic slurry and the ceramic paste,
5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein both are magnetic ceramic powders. 8. The method for manufacturing a multilayer ceramic electronic component according to claim 7, wherein the internal circuit element film is a coil conductor film extending in a coil shape, and the multilayer ceramic electronic component is a multilayer inductor. 9. A multilayer ceramic electronic component obtained by the manufacturing method according to claim 1. 10. An internal circuit element film formed by partially applying a conductive paste on a main surface of a ceramic green sheet so as to produce a step due to the thickness of the ceramic green sheet for manufacturing a multilayer ceramic electronic component. A ceramic paste used to form a step-absorbing ceramic green layer in a region where the internal circuit element film is not formed on the main surface of the ceramic green sheet so as to substantially eliminate a step due to the thickness of the ceramic green sheet. A ceramic paste containing a ceramic powder, an organic solvent, an organic binder, and an organometallic compound. 11. An internal circuit element film formed by partially applying a conductive paste on a main surface of a ceramic green sheet to produce a step due to the thickness of the ceramic green sheet for manufacturing a multilayer ceramic electronic component. A method for producing a ceramic paste used for forming a step-absorbing ceramic green layer in a region where the internal circuit element film is not formed on the main surface of the ceramic green sheet so as to substantially eliminate a step due to the thickness of the ceramic green sheet And comprising at least a ceramic powder and a first organic solvent.
A first dispersion step of dispersing the next mixture; a second dispersion step of dispersing a second mixture obtained by adding at least an organic binder and an organometallic compound to the first mixture after the first dispersion step; A step of including a second organic solvent having a relative evaporation rate smaller than that of the organic solvent in the primary mixture and / or the secondary mixture; and after the secondary dispersion step, heat-treating the secondary mixture. And a removing step of selectively removing the first organic solvent. 12. A ceramic paste obtained by the production method according to claim 11.