JP2002302535A - Antimicrobial epoxy resin composition for floor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an antimicrobial epoxy resin composition for floors excellent in antimicrobial properties. SOLUTION: This antimicrobial epoxy resin composition for floors comprises (a) a polyepoxy compound, (b) a cyclic organophosphate compound represented by the general formula (1) (wherein R1 , R2 and R3 are each independently hydrogen atom or a 1-18C linear or branched alkyl group; R4 represents hydrogen atom or methyl group; n is 1 or 2 and when n is 1, M represents hydrogen atom or an alkali metal atom and when n is 2, M represents an alkaline earth metal atom or zinc atom) and (c) a polyamine compound as a curing agent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antibacterial epoxy resin composition for floors capable of providing a cured epoxy resin for floors having excellent antibacterial properties.

[0002]

BACKGROUND OF THE INVENTION Epoxy resins have been used as floor coatings or flooring materials because they have a high hardness and a beautiful painted surface, but have the problem of insufficient antibacterial properties. there were. For example, in humid places such as kitchens, bathrooms, wash basins, etc., or places where humidity is likely to increase, such as futons and beds, bacteria and fungi easily propagate and become unsanitary. In particular, in recent years, the airtightness of buildings has been high, and air-conditioning has become widespread, which has provided a favorable growth environment for bacteria and fungi, enabling the growth of microorganisms throughout the year. In general, microorganisms are proliferating not only in humid places but also in living rooms, which poses a serious problem in hygiene such as causing food poisoning, atopic skin diseases and other allergic symptoms. Particularly in medical facilities, food manufacturing factories, kitchens, nurseries, kindergartens, nursing homes, etc., demands for more hygiene are increasing. Under such circumstances, epoxy resin compositions used as floor coating materials or floor materials are required to have excellent antibacterial properties.

Accordingly, it is an object of the present invention to provide an antibacterial epoxy resin composition for floors having excellent antibacterial properties.

[0004]

Means for Solving the Problems As a result of extensive studies, the present inventors have found that an epoxy resin composition containing a polyepoxy compound, a cyclic organic phosphate compound and a polyamine compound as a curing agent has the above object. It has been found that this can be achieved.

That is, the present invention has been made on the basis of the above findings, and is directed to a polyepoxy compound (a) and a cyclic organic phosphate compound (b) represented by the following general formula (1):
And an antibacterial epoxy resin composition for floors, characterized by containing a polyamine compound (c) as a curing agent.

[0006]

Embedded image (Wherein, R ₁ , R ₂ and R ₃ each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 18 carbon atoms, R ₄ represents a hydrogen atom or a methyl group, n
Represents 1 or 2, when n is 1, M represents a hydrogen atom or an alkali metal atom, and when n is 2, M represents an alkaline earth metal atom or a zinc atom. )

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The floor antibacterial epoxy resin composition of the present invention will be described below in detail.

The polyepoxy compound of the component (a) of the present invention includes, for example, polyglycidyl ether compounds of mononuclear polyhydric phenol compounds such as hydroquinone, resorcin, pyrocatechol and phloroglucinol; dihydroxynaphthalene, biphenol, methylene Bisphenol (bisphenol F), methylene bis (orthocresol), ethylidene bisphenol, isopropylidene bisphenol (bisphenol A), isopropylidene bis (orthocresol), tetrabromobisphenol A, 1,3-bis (4-hydroxycumylbenzene), 1,4-bis (4-hydroxycumylbenzene), 1,1,3-tris (4-hydroxyphenyl)
Butane, 1,1,2,2-tetra (4-hydroxyphenyl) ethane, thiobisphenol, sulfobisphenol, oxybisphenol, phenol novolak,
Polyglycidyl ether compounds of polynuclear polyphenol compounds such as orthocresol novolak, ethylphenol novolak, butylphenol novolak, octylphenol novolak, resorcinol novolak, terpene diphenol; ethylene glycol, propylene glycol, butylene glycol, hexanediol, polyglycol, thiol Diglycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol,
Polyglycidyl ethers of polyhydric alcohols such as bisphenol A-ethylene oxide adducts; maleic acid, fumaric acid, itaconic acid, succinic acid, glutaric acid, suberic acid, adipic acid, azelaic acid, sebacic acid, dimer acid, trimer acid, Phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, trimesic acid, pyromellitic acid,
Homopolymers or copolymers of glycidyl esters and glycidyl methacrylates of aliphatic, aromatic or alicyclic polybasic acids such as tetrahydrophthalic acid, hexahydrophthalic acid, endmethylenetetrahydrophthalic acid;
N-diglycidylaniline, bis (4- (N-methyl-
Polyepoxy compounds having a glycidylamino group such as N-glycidylamino) phenyl) methane; vinylcyclohexene diepoxide, dicyclopentanedienedepoxide, 3,4-epoxycyclohexylmethyl-
3,4-epoxycyclohexanecarboxylate,
3,4-epoxy-6-methylcyclohexylmethyl-
Polyepoxidized products of cyclic olefin compounds such as 6-methylcyclohexanecarboxylate and bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate; epoxidized conjugated dienes such as epoxidized polybutadiene and epoxidized styrene-butadiene copolymer Heterocyclic compounds such as polymers and triglycidyl isocyanurate are exemplified. These epoxy compounds may be those internally crosslinked by a prepolymer of terminal isocyanate.

The polyepoxy compound preferably has an epoxy equivalent of 100 to 2,000, more preferably 150 to 1500. If the epoxy equivalent is less than 100, the curability may decrease, and if it is more than 2000, sufficient physical properties may not be obtained.

[0010] Among the above polyepoxy compounds, a polyglycidyl ether compound of an alkylidene bisphenol represented by the following general formula (2) is preferred because of its excellent physical properties.

[0011]

Embedded image (Wherein, R ₅ and R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and p represents 0 to 10
Represents )

In the above general formula (2), R ₅ and R
Examples of the alkyl group having 1 to 10 carbon atoms represented by ₆ include linear or branched alkyl groups such as methyl, ethyl, propyl, butyl, amyl, hexyl, heptyl, octyl, nonyl, and decyl.

The cyclic organic phosphate compound represented by the above general formula (1) of the component (b) of the present invention is used as an antibacterial agent which is contained in an epoxy resin composition to exhibit antibacterial properties of a cured product. It is. In the above general formula (1), R ₁ , R ₂ and R _{3 each have} 1 to 1 carbon atoms.
As the linear or branched alkyl group of 8, methyl,
Ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl, amyl, tert-amyl, hexyl, octyl, 2-ethylhexyl, isooctyl, tert-octyl, nonyl, decyl, dodecyl, tridecyl, isotridecyl, tetradecyl, hexadecyl, Octadecyl and the like.

In the general formula (1), examples of the alkali metal atom represented by M include sodium, potassium and lithium, and examples of the alkaline earth metal atom include calcium, magnesium, barium and strontium. In particular, those in which M is an alkali metal atom or a zinc atom have a large effect and are preferable.

Accordingly, as specific examples of the cyclic organic phosphate compound represented by the general formula (1), the following compound No. 1 to No. 8 is given.

[0016]

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[0017]

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[0018]

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[0019]

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[0020]

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[0021]

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[0022]

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[0023]

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The amount of the cyclic organic phosphoric ester compound to be added is 0.001 to 100 parts by mass based on the total mass of the polyepoxy compound (a) and the polyamine compound (c).
The amount is preferably 10 parts by mass, particularly preferably 0.005 to 5 parts by mass. If the added amount is less than 0.001 part by mass, a sufficient antibacterial effect cannot be obtained, and if it exceeds 10 parts by mass, the effect is not so much improved and it is economically disadvantageous.

The above-mentioned cyclic organic phosphate compound preferably has a particle diameter of 500 nm or less, particularly preferably 200 nm or less. If the particle diameter exceeds 500 nm, the number of fine particles per surface of the cured product decreases, and the antibacterial property decreases.

The effect of the epoxy resin composition of the present invention can be improved by using known inorganic and / or organic antibacterial agents and fungicides in addition to the cyclic organic phosphate compound. And the antimicrobial spectrum can be broadened.

Examples of the above-mentioned inorganic antibacterial agents and fungicides include metals such as silver, zinc and copper capable of imparting antibacterial and / or fungicide properties, or oxides, hydroxides and phosphoric acids thereof. Salts, thiosulfate salts, silicates and inorganic compounds carrying these, and more specifically, silver,
Examples thereof include zinc or copper zeolites, silver zirconium phosphate, silver hydroxyapatite, silver phosphate glass, silver phosphate ceramics, and silver calcium phosphate.

Examples of the organic antibacterial agents and fungicides include organic nitrogen sulfur antibacterial agents, organic bromide antibacterial agents, organic nitrogen antibacterial agents, and other antibacterial agents. Examples of the organic nitrogen sulfur-based antibacterial agent include alkylenebisthiocyanate compounds such as methylenebisthiocyanate, and 5-chloro-2-methyl-4-isothiazoline-3.
Isothiazoline compounds such as -one, 2-octyl-4-isothiazolin-3-one and 4,5-dichloro-2-octyl-4-isothiazolin-3-one; chloramine T, N, N-dimethyl-N '-( Sulfamide compounds such as fluorodichloromethylthio) -N'-phenylsulfamide, thiazole compounds such as 2- (4-thiocyanomethylthio) benzothiazole and 2-mercaptothiazole, 2-pyridinethiol-1-oxide and metals thereof Salt, 2- (4-thiazolyl) benzimidazole,
3,5-dimethyl-1,3,5-2H-tetrahydrothiadiazine-2-thione, N- (fluorodichloromethylthio) phthalimide, dithio-2,2'-bis (benzmethylamide) and the like. And organic bromide antibacterial agents include 2-bromo-2-nitropropane-1,3-diol, 1,1-dibromo-1-nitro-2-propanol, 2,2-dibromo-2-nitroethanol, −
Bromo-2-nitro-1,3-diacetoxypropane,
organic bromonitro compounds such as β-bromo-β-nitrostyrene and 5-bromo-5-nitro-1,3-dioxane; organic bromocyano compounds such as 2,2-dibromo-3-cyanopropionamide; and 1,2-bis (Bromoacetoxy) ethane, 1,4-bis (bromoacetoxy)-
2-butene, bromoacetic acid compounds such as bromoacetamide, organic bromosulfone compounds such as bistribromomethylsulfone, and the like.
S-Triazine compounds such as hexahydro-1,3,5-triethenyl-s-triazine, hexahydro-1,3,5-tris (2-hydroxyethyl) -s-triazine, N, 4-dihydroxy-α-oxobenzene Halogenated oxime compounds such as ethaneimidoyl chloride and α-chloro-o-acetoxybenzoaldoxime; chlorinated isocyanuric acid compounds such as trichloroisocyanurate and sodium dichloroisocyanurate; and carbamic acid compounds such as 2-methylcarbonylaminobenzimidazole. , 1- [2- (2,4-dichlorophenyl)]-
Imidazole compounds such as 2 '-[(2,4-dichlorophenyl) methoxy] ethyl-3- (2-phenylethyl) -1H-imidazolium chloride; amide compounds such as 2-chloroacetamide; N- (2-hydroxypropyl ) Amino alcohol compounds such as aminomethanol and 2- (hydroxymethylamino) ethanol;
Nitrile compounds such as 5,6-tetrachloroisophthalonitrile and the like, and other antibacterial agents include sodium benzoate, ethyl benzoate, propyl benzoate, isopropyl benzoate, isobutyl parahydroxybenzoate, and parahydroxybenzoic acid. Butyl, ethyl parahydroxybenzoate, propyl parahydroxybenzoate, dehydroacetic acid and the like.

Among the above-mentioned inorganic or organic antibacterial agents that may be used in combination, oxides or hydroxides of alkaline earth metals and oxides or hydroxides of zinc are preferable, and zinc oxide and hydroxide are particularly preferable. The effect of calcium hydroxide is large and preferable.

The amount of the above-mentioned alkaline earth metal oxide or hydroxide or zinc oxide or hydroxide is preferably from 0.001 to 10 parts by mass per 100 parts by mass of the epoxy resin composition of the present invention. It is part by mass, more preferably 0.005 to 5 parts by mass. The amount added is 0.001
If the amount is less than 10 parts by mass, a sufficient effect cannot be obtained. If the amount exceeds 10 parts by mass, the effect is not so much improved, and the properties of the obtained cured product are adversely affected.

The alkaline earth metal oxide or hydroxide or zinc oxide or hydroxide is preferably used in powder form from the viewpoint of dispersibility in the epoxy resin composition. Although there is no particular limitation, it is preferable to use those having an average particle size of 0.1 to 100 μm so as not to deteriorate the physical properties of the cured product. When used in the form of a powder, the powder can be directly blended with the epoxy resin composition, but if necessary, can be dispersed in a solvent or a liquid additive or used as a paste.

In the epoxy resin composition of the present invention, the polyamine compound (c) is blended as a curing agent and used as a floor paint or floor material.

The polyamine compound as the component (c) of the present invention is, for example, a compound having two or more primary or secondary amino groups in the molecule, for example, an alkylenediamine such as ethylenediamine and hexamethylenediamine;
Polyalkylene polyamines such as diethylenetriamine, triethylenetetramine and tetraethylenepentamine;
Alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4-diamino3.6-diethylcyclohexane, isophoronediamine; heterocyclic polyamines such as 1,4-bis (3-aminopropyl) piperazine; m-xylyl Aromatic amines such as diamine, diaminodiphenylmethane and diaminodiphenylsulfone;
These may be used alone or as a mixture. In particular, m-xylylenediamine is preferable because it has excellent curability, solvent resistance, and corrosion resistance of the cured coating film.

Further, the polyamine compound may be a modified product of the above-described polyamine compound, such as an epoxide addition modified product, an amidated modified product, a Mannich modified product, and a ketimine modified product. The epoxide addition modified product is a polyamine compound, phenyl glycidyl ether, butyl glycidyl ether, bisphenol A
-It is produced by reacting glycidyl ethers such as diglycidyl ether and bisphenol F-diglycidyl ether or various epoxy compounds such as glycidyl esters of carboxylic acid by a conventional method. The amidated modified product is produced by reacting a polyamine compound with a carboxylic acid such as dimer acid by a conventional method. The Mannich-modified product is a polyamine compound and aldehydes such as formaldehyde and phenols having at least one aldehyde reaction site in a nucleus such as phenol, cresol, xylenol, tertiary butylphenol, and resorcinol by a conventional method. It is produced by reacting. The modified ketimine is produced by reacting a polyamine compound with acetone or methyl isobutyl ketone by a conventional method.

In the polyamine compound, the number of active hydrogens in the polyamine compound is preferably 0.7 to 3.0, more preferably 0.9 to 2.0, based on the epoxy group of the polyepoxy compound (a). It is used at a ratio of five.
If the number of active hydrogens in the polyamine compound is less than 0.7, a large amount of unreacted epoxy groups will remain, resulting in insufficient curing. Further, if the number of active hydrogens in the polyamine compound exceeds 3.0, it is not only wasteful but also deteriorates the physical properties of the cured product.

The epoxy resin composition of the present invention may contain, as a solvent, ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, propylene glycol monomethyl ether acetate and cyclohexanone; tetrahydrofuran, 1,2- Ethers such as dimethoxyethane and 1,2-diethoxyethane; esters such as ethyl acetate and n-butyl acetate; alcohols such as iso- or n-butanol, iso- or n-propanol and amyl alcohol; benzene, Aromatic hydrocarbons such as toluene and xylene; carbon tetrachloride, chloroform, trichloroethylene,
Halogenated aliphatic hydrocarbons such as methylene chloride; halogenated aromatic hydrocarbons such as chlorobenzene; aniline, triethylamine, pyridine, dioxane, acetic acid, acetonitrile, carbon disulfide and the like can be used, but the epoxy resin composition of the present invention , Terpene-based hydrocarbon oils such as turpentine, D-limonene, and pinene; high-boiling paraffinic oils such as mineral spirits, swazol # 310 (manufactured by Cosmo Matsuyama Oil Co., Ltd.), and Solvesso # 100 (manufactured by Exxon Chemical Co., Ltd.) It is dissolved or dispersed in a solvent (aliphatic hydrocarbon as a main component, and may contain alicyclic or aromatic hydrocarbons. Here, a high boiling point is a substance containing 90% or more of components having a boiling point of 150 ° C. or more). It is preferable to use these solvents because danger and harmfulness can be reduced. Further, these solvents can be optionally used as a mixed solvent of two or more kinds.

The amount of the solvent used is from 0 to 200 with respect to 100 parts by mass of the total amount of the polyepoxy compound and the curing agent.
It is parts by mass, preferably 30 to 150 parts by mass. If the used amount exceeds 200 parts by mass, it is volatile and dangerous.
It is not preferable because it causes harm and the like.

Further, the epoxy resin composition of the present invention comprises:
By using monoglycidyl ethers as a reactive diluent, physical properties such as impact resistance can be improved.
As these monoglycidyl ethers, for example,
Monoglycidyl ethers such as phenol, cresol, ethylphenol, propylphenol, p-tert-butylphenol, p-tert-amylphenol, hexylphenol, octylphenol, nonylphenol, dodecylphenol, octadecylphenol or terpenephenol, especially carbon Monoglycidyl ethers of phenol obtained by nucleus substitution with an aliphatic or alicyclic hydrocarbon group having 4 or more atoms are preferable because of their excellent solubility in weak solvents.

Further, the epoxy resin composition of the present invention includes:
Non-reactive diluents such as dioctyl phthalate, dibutyl phthalate, benzyl alcohol and coal tar can be used in combination.

Further, the epoxy resin composition of the present invention may contain, if necessary, glass fiber, carbon fiber, cellulose, silica sand, cement, kaolin, clay, aluminum hydroxide, bentonite, talc, silica, and fine powder silica. , Titanium dioxide, carbon black, graphite,
Fillers or pigments such as iron oxides, bituminous substances, calcium carbonate; thickeners; thixotropic agents; flame retardants;
Rust inhibitors; conventional additives such as colloidal silica and colloidal alumina may be added, and further, conventional additives such as antioxidants, ultraviolet absorbers, hindered amine light stabilizers, xylene resins, petroleum resins, etc. Can be used in combination.

The epoxy resin composition of the present invention is particularly suitable for being applied to a hard floor made of concrete, cement mortar, various metals, etc., that is, used for a hard floor finishing material. When the base is neatly ground before the application, and when the base is applied, it is preferable that the base be subjected to a treatment such as degreasing, derusting, and polishing, and then applied.

The method of preparing the epoxy resin composition of the present invention includes a method of mixing each component at the time of coating, a method of mixing a polyepoxy compound, an antibacterial agent and a filler in advance, and mixing a curing agent at the time of coating. And a method in which all components are mixed in advance and applied.

[0043]

EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited to these examples.

Synthesis Example 1 (Curing Agent A) 1.5 mol (204 g) of metaxylenediamine and 1.5 mol (141 g) of phenol were mixed by stirring.
1 mol of 37% formalin while cooling to below ℃
(81 g) was added dropwise, and after the addition, the mixture was heated to 90 ° C. and reacted for 1 hour. After the completion of the reaction, the mixture was dehydrated under reduced pressure, and 372 g having a viscosity of 250
A meta-xylene diamine Mannich compound (curing agent A) having an active hydrogen equivalent of 74 mPa · s / 25 ° C. was obtained.

Synthesis Example 2 (Curing Agent B) 1 mol (166 g) of isophoronediamine and 1.39 mol (150 g) of benzyl alcohol were mixed with stirring.
While cooling to 70 ° C. or lower, 0.09 mol of bisphenol A type epoxy resin (epoxy equivalent 190) (34.
2 g) was added dropwise, and after the addition, the temperature was raised to 90 ° C. and reacted for 1 hour. After completion of the reaction, salicylic acid 0.15 mol (20.7 mol)
g) was added and mixed and dissolved for 30 minutes to obtain 374.9 g of an isophoronediamine adduct compound (curing agent B) having a viscosity of 400 mPa · s / 25 ° C. and an active hydrogen equivalent of 98.

Example 1 A sample compound (antibacterial agent) shown in Table 1 below was added in an amount of 0.5 to 100 parts by mass of an epoxy resin compound obtained by mixing the raw materials shown in Formulation 1 below.
0.5 part by mass of zinc oxide and 0.5 part by mass of zinc oxide, and 40 parts by mass of the curing agent A obtained in Synthesis Example 1 were mixed.
A cured product (test piece) of 0 × 40 × 1 mm was prepared. Using the test pieces, the antibacterial properties of the bacteria shown in Table 1 were evaluated by the following test methods. The results are shown in Table 1 below. [Test Method] A bacterial culture was applied onto a test piece, a polyethylene wrap film was adhered to the test piece, and the sample was stored at 35 ° C. for 24 hours. Thereafter, the test piece and the bacterial solution of the polyethylene film were washed away, and the number of surviving bacteria was measured by a pour plate method using an SCDLP agar medium, and evaluated according to the following criteria. ◎: Only less than 0.1% of the number of bacteria before the test survived. Good: 0.1% or more and less than 1% of the number of bacteria before the test are alive. Δ: 1% or more but less than 10% of the bacteria before the test are alive. X: 10% or more of the number of bacteria before the test is alive.

[Formulation 1] parts by mass bisphenol A type epoxy resin (epoxy equivalent 200) 50.0 pigment (chromium oxide) 7.5 calcium carbonate 40.0 leveling agent (silicone) 1.5 antifoaming agent 1.0

[0048]

[Table 1]

Example 2 In the same manner as in Example 1, the above formulation 1
With respect to 100 parts by mass of the epoxy resin compound obtained by blending the raw materials shown in (1), 0.5 parts by mass of the sample compound (antibacterial agent) shown in Table 2 below and 0.5 parts by mass of zinc oxide were mixed. The curing agent B obtained in Synthesis Example 2 was used
0 parts by mass were mixed to prepare a cured product (test piece) of 40 × 40 × 1 mm. Using this test piece, the antibacterial property was evaluated in the same manner as in Example 1. The results are shown in Table 2 below.

[0050]

[Table 2]

As shown in the above tables, when the zinc oxide alone was added as an antibacterial agent and when no antibacterial agent was added, the antibacterial properties of the epoxy resin composition were insufficient.
In contrast, when the cyclic organic phosphate compound according to the present invention was blended, excellent antibacterial properties were confirmed.

[0052]

The epoxy resin composition of the present invention can provide a cured product having excellent antibacterial properties, and is useful as a raw material for floor coatings or floor materials.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 63/00 C08L 63/00 C E04F 15/12 E04F 15/12 C F-term (Reference) 4H011 AA02 BA01 BB17 BC16 BC18 BC19 DA01 DH03 4J002 CD001 CD051 DE058 DE108 EN077 EU137 EV247 EW046 FD147 FD186 GB00 GL00 4J036 AA00 AD08 DC06 DC09 DC10 DC38 DD04 FA04 JA01

Claims (3)

[Claims] 1. A polyepoxy compound (a), a cyclic organophosphate compound (b) represented by the following general formula (1):
And a polyamine compound (c) as a curing agent. Embedded image (Wherein, R ₁ , R ₂ and R ₃ each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 18 carbon atoms, R ₄ represents a hydrogen atom or a methyl group, n
Represents 1 or 2, when n is 1, M represents a hydrogen atom or an alkali metal atom, and when n is 2, M represents an alkaline earth metal atom or a zinc atom. ) 2. The antibacterial epoxy resin composition for floors according to claim 1, wherein the polyepoxy compound (a) is a polyepoxy compound represented by the following general formula (2). Embedded image (Wherein, R ₅ and R ₆ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and p represents 0 to 10
Represents ) 3. The antibacterial epoxy resin composition for floors according to claim 1, further comprising an oxide or hydroxide of an alkaline earth metal or an oxide or hydroxide of zinc.