JP2002299385A - Film carrier tape for mounting electronic component and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting an electronic component which can properly convey an insulating film and can prevent occurrence of a product fault, and to provide a method for manufacturing the same. SOLUTION: The film carrier tape for mounting the electronic component comprises a wiring pattern 13, made of a conductive layer 12 on the surface of the continuous insulating film 11 and a plurality of sprocket holes 14, provided at both sides of the pattern 12 to mount the component on the pattern 13. The carrier tape further comprises dummy wirings 15, provided intermittently at the peripheries of the holes 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an IC or LS
1. Field of the Invention The present invention relates to a film carrier tape for mounting an electronic component such as I, and a method for manufacturing the same.

[0002]

2. Description of the Related Art With the development of the electronics industry, IC
Although demand for printed wiring boards on which electronic components such as (integrated circuits) and LSIs (large-scale integrated circuits) are mounted has been rapidly increasing, there has been a demand for smaller, lighter, and more sophisticated electronic devices.
As a method of mounting these electronic components, a mounting method using a film carrier tape for mounting electronic components such as a TAB tape, a T-BGA tape, an ASIC tape, and a COF tape has recently been adopted. In particular, the importance thereof has increased in the electronic industry using a liquid crystal display device (LCD), such as a personal computer and a mobile phone, which requires high definition, thinness, and a narrow frame area of a liquid crystal screen. ing.

[0003] As a method of manufacturing this film carrier tape for mounting electronic parts, generally, a long insulating film having sprocket holes on both sides in the width direction is continuously conveyed while a plurality of wirings are provided on the insulating film. Form a pattern or the like.

In addition, it has been desired that such a film carrier tape for mounting electronic parts be thinner in accordance with the miniaturization of electronic equipment and the like. In recent years, an insulating film having a relatively thin film thickness has been used. Things have been suggested.

However, as described above, the film carrier tape for mounting electronic components forms a wiring pattern and the like while continuously transporting the insulating film. Therefore, if the thickness of the insulating film is small, the insulating film is deformed during transport. There is a problem that it cuts or cuts. Also, the strength of the sprocket hole cannot be secured sufficiently,
The sprocket holes are deformed at the time of transportation, and there is a problem that a wiring pattern, a solder resist pattern and the like cannot be formed at a predetermined position with high accuracy, and that electronic components cannot be mounted with high accuracy.

In order to solve such a problem, for example, as disclosed in Japanese Patent Application Laid-Open No. 5-29394, dummy wires are provided around sprocket holes of the insulating film to reduce the strength of the insulating film. Secured structures have been proposed.

[0007]

However, in such a structure, since the dummy wiring is formed in a band shape in a relatively wide area around the sprocket hole, the dummy wiring is compared with the area where the wiring pattern is formed. In this case, there is a problem that the rigidity of the region becomes too large, and the film carrier tape is broken or deformed, or a conveyance failure occurs.

In the above-described structure, since the dummy wiring is formed up to the end in the width direction of the insulating film, the dummy wiring comes into contact with a guide or the like provided on the transport path and is scraped, so that the metal piece becomes a wiring pattern. There is also a problem that a product defect occurs such as a short circuit caused by adhesion.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a film carrier tape for mounting electronic parts, which can satisfactorily convey an insulating film and prevent the occurrence of product defects, and a method for manufacturing the same.

[0010]

According to a first aspect of the present invention, there is provided a wiring pattern made of a conductive layer on the surface of a continuous insulating film, and a plurality of sprockets provided on both sides of the wiring pattern. Having a hole, in the electronic component mounting film carrier tape in which the electronic component is mounted on the wiring pattern, wherein dummy wiring is provided intermittently around each of the plurality of sprocket holes. Electronic component mounting film carrier tape.

According to a second aspect of the present invention, in the first aspect, there is provided a film carrier tape for mounting electronic parts, wherein a predetermined interval is provided between an end of the insulating film in the width direction and the dummy wiring. It is in.

A third aspect of the present invention is the film carrier for mounting electronic parts according to the first or second aspect, wherein a plurality of auxiliary sprocket holes are formed outside the sprocket holes in the width direction. On the tape.

According to a fourth aspect of the present invention, in the third aspect, the wiring pattern and the sprocket holes formed on both sides of the wiring pattern are arranged in a plurality of rows in the width direction. Electronic component mounting film carrier tape.

A fifth aspect of the present invention is the film carrier tape for mounting electronic components according to any one of the first to fourth aspects, wherein a reinforcing film is provided on a back surface of the insulating film. .

According to a sixth aspect of the present invention, a wiring pattern comprising a conductive layer is provided on a surface of a continuous insulating film, and a plurality of sprocket holes provided on both sides in the width direction of the wiring pattern. In the method for manufacturing an electronic component mounting film carrier tape on which electronic components are mounted, a resist pattern is formed on the conductive layer and etched to form the wiring pattern and to surround the plurality of sprocket holes. And a method of intermittently forming a dummy wiring.

According to a seventh aspect of the present invention, in the sixth aspect, a dummy wiring resist pattern for forming a dummy wiring and a wiring pattern resist pattern for forming the wiring pattern are formed in the same step. A method for producing a film carrier tape for mounting electronic components, characterized in that:

According to an eighth aspect of the present invention, in the sixth aspect, the dummy wiring resist pattern for forming the dummy wiring and the wiring pattern resist pattern for forming the wiring pattern are formed in separate steps. Forming a film carrier tape for mounting electronic parts.

A ninth aspect of the present invention is the method for manufacturing a film carrier tape for mounting electronic parts according to the eighth aspect, wherein at least the dummy wiring resist pattern is formed by a transfer method.

According to a tenth aspect of the present invention, in the sixth aspect, an auxiliary sprocket hole is formed outside a width direction of the sprocket hole, and the conductive layer is formed in a region of the insulating film other than the auxiliary sprocket hole. Forming a resist layer on the entire surface of the conductive layer, and patterning the resist layer to form a dummy wiring resist pattern for forming a dummy wiring and a wiring pattern for forming the wiring pattern And a method for manufacturing a film carrier tape for mounting electronic components, wherein a resist pattern for electronic components is formed at the same time.

In the electronic component mounting film carrier tape according to the present invention, by forming dummy wirings around the sprocket holes, the rigidity in the width direction of the tape becomes substantially uniform and the tape can be transported reliably. The product can be easily manufactured without causing the tape to be bent, deformed, or poorly transported.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a film carrier tape for mounting electronic parts according to an embodiment of the present invention will be described together with a method for manufacturing the same. In the following embodiments, TAB tape, C
Although an OF tape will be described as an example, it goes without saying that which embodiment of the present invention is adopted for each of the TAB tape and the COF tape is not limited to the following embodiment.

FIG. 1 is a front view and a sectional view showing a film carrier tape for mounting electronic components according to the first embodiment.

As shown in FIG. 1A, a film carrier tape 10 for mounting electronic components according to the present embodiment comprises a conductive layer 12 provided on one side of a tape-shaped insulating film 11.
And a sprocket hole 14 provided on both sides of the wiring pattern 13 in the width direction. Dummy wirings 15 are provided around the sprocket holes 14 intermittently.

Further, at the center of the wiring pattern 13,
As shown in FIG. 1B, each of the device holes 1
6 are provided. This device hole 16
Is provided by penetrating the insulating film 11 using, for example, punching or the like, like the sprocket hole 14. In some cases, as shown in FIG. 1C, there is no device hole 16 and the insulating film 11 remains in a portion where the IC is mounted.

As the insulating film 11, a material having flexibility, chemical resistance and heat resistance can be used. Examples of the material of the insulating film 11 include:
For example, polyester, polyamide, polyimide, polyether sulfone, liquid crystal polymer and the like,
Particularly, a wholly aromatic polyimide having a biphenyl skeleton (for example, trade name: Upilex; Ube Industries, Ltd.) is preferable. The thickness of the insulating film 11 is generally 12.5 to 75 μm, preferably 12.5 to 75 μm.
５０50 μm.

Each of the wiring patterns 13 has a size substantially corresponding to the size of the electronic component to be mounted, and is provided continuously on the surface of the insulating film 11. The wiring pattern 13 is formed by patterning a conductive layer 12 provided on the surface of the insulating film 11, such as a conductive foil made of copper or aluminum.

The dummy wiring 15 is formed around each sprocket hole 14. The size of the dummy wiring 15 is not particularly limited as long as it is not large enough to be continuous with the adjacent dummy wiring 15. However, the dummy wiring 15 must not extend to the width direction end of the insulating film 11. Is preferred. That is, it is preferable that a predetermined interval be provided between the dummy wiring 15 and the width direction end of the insulating film 11. Furthermore, the insulating film 1
It is preferable that the dummy wirings 15 on both sides in the width direction are formed to have substantially the same shape, that is, to have a substantially uniform cross-sectional structure in the width direction of the insulating film 11.

Here, the dummy wiring 15 refers to the conductive layer 12.
Is a wiring that is provided discontinuously with the wiring pattern 13 formed by patterning.

By providing such dummy wirings 15 intermittently for each sprocket hole 14, the rigidity can be improved to such an extent that the insulating film 11 can be transported reliably, and the rigidity of the insulating film 11 may be too large. Absent. Therefore, the insulating film 11 can be reliably and satisfactorily conveyed at the time of tape production, and no failure such as breakage or deformation occurs.

Also, the dummy wiring 15 is not provided to the end,
By providing an interval between the dummy wiring 15 and the end in the width direction of the insulating film 11, it is possible to prevent a short circuit or the like of the wiring pattern 13 from occurring. That is, when the insulating film 11 is transported at the time of manufacturing, the dummy wiring 15 comes into contact with a guide or the like provided on the transporting path, and a metal piece is generated. It can be prevented from occurring.

Further, since the rigidity of the entire tape does not become too large, the tape itself can freely follow the transport path even when the transport path is curved, so that the tape can be transported appropriately. Can be.

Further, a solder resist layer 17 is formed on the wiring pattern 13 by applying a solder resist material coating solution by a screen printing method.

The electronic component mounting film carrier tape manufactured in this manner is used, for example, in a process of mounting the electronic components while being conveyed, and the electronic components are mounted. Since the dummy wiring 15 is provided, the sprocket hole 14
The strength can be ensured to such an extent that the part is not deformed, and the electronic component can be mounted with high accuracy.

FIG. 2 is a sectional view showing a film carrier tape for mounting electronic parts according to the second embodiment.

As shown in FIG. 2, the film carrier tape 10A for mounting electronic components according to the present embodiment is basically the same as the first embodiment except that the reinforcing film 18 is provided on the back surface of the insulating film 11. Therefore, the same parts are denoted by the same reference numerals, and overlapping description will be omitted.

When the film carrier tape for mounting electronic parts is manufactured, the reinforcing film 18 is used as the insulating film 11.
And formed on the back surface of At this time, the reinforcing film 18
Is formed on the whole or a part of the back surface of the insulating film 11.

The reinforcing film 18 is preferably fixed with an adhesive or the like so that it can be removed after the film carrier tape for mounting electronic parts is manufactured. Of course, if necessary, it may be used as a film carrier tape for mounting electronic components while being adhered to the back surface of the insulating film 11.

As described above, according to the present embodiment, by providing the reinforcing film 18 on the back surface of the insulating film 11, a desired strength can be obtained when the film carrier tape for mounting electronic parts is manufactured, and the sprocket is provided. The strength of the hole 14 can be further improved. Also,
When used as a film carrier tape for mounting electronic components while being adhered to the back surface of the insulating film 11, a desired strength can be secured when mounting the electronic components. Needless to say, the reinforcing film 18 may be provided on a film carrier tape for mounting electronic components having the device holes 16.

FIG. 3 is a front view and a sectional view showing a film carrier tape for mounting electronic components according to a third embodiment.

As shown in FIGS. 3A and 3B, the film carrier tape 1 for mounting electronic components according to the present embodiment
0B is basically the same as Embodiment 1 described above except that the auxiliary sprocket hole 19 is provided outside the sprocket hole 14 in the width direction. Omitted.

The auxiliary sprocket hole 19 has a rectangular, circular, or oval shape and is provided outside the insulating film 11 in the width direction. Finally, the auxiliary sprocket hole 19 is cut out to form a film carrier tape for mounting electronic parts.

If the auxiliary sprocket holes 19 are used for positioning in a photolithography process when manufacturing a film carrier tape for mounting electronic components, it is possible to prevent the wiring pattern 13 from being short-circuited. This positioning will be described later in detail.

Also in this embodiment, a reinforcing film 18 may be provided on the back surface of the insulating film 11.

As shown in FIG. 3C, the device hole 16 may not be provided as in the first embodiment.

Further, as shown in FIG. 4, a dummy wiring 15A may be formed around the auxiliary sprocket hole 19, and the dummy wiring 15A may be formed similarly to the dummy wiring 15 provided around the sprocket hole 14. , Around the auxiliary sprocket hole 19. Further, it is preferable that a predetermined interval is provided between the width direction end of the insulating film 11 and the dummy wiring 15A.

As described above, the auxiliary sprocket hole 19
By providing the dummy wirings 15A intermittently around the auxiliary sprocket holes 19, the auxiliary sprocket holes 19 can be given a desired strength.
9 can be satisfactorily conveyed without being deformed.

FIG. 5 is a front view and a sectional view showing a film carrier tape for mounting electronic parts according to the fourth embodiment.

As shown in FIGS. 5A and 5B, the film carrier tape 1 for mounting electronic parts according to the present embodiment
0C is basically the same as Embodiment 3 except that the wiring pattern 13 and the sprocket holes 14 formed on both sides of the wiring pattern 13 are arranged in two rows in the width direction of the insulating film 11. Since they are the same, the same portions are denoted by the same reference numerals, and redundant description will be omitted.

That is, in this embodiment, the auxiliary sprocket holes 19 are provided outside the insulating film 11 in the width direction, and the wiring patterns 13 are formed inside the auxiliary sprocket holes 19 and on both sides of the wiring patterns 13. The sprocket holes 14 were arranged in two rows in the width direction. As a result, manufacturing costs can be reduced.

Further, a substantially uniform cross-sectional structure is obtained in the width direction.
The strength of the entire tape can be ensured, and the tape can be suitably transported.

Also in this embodiment, the reinforcing film 18 may be provided on the back surface of the insulating film 11, and if necessary, dummy wirings may be provided around the auxiliary sprocket holes 19 intermittently.

As described above, even if the wiring pattern 13 and the sprocket holes 14 provided on both sides of the wiring pattern 13 are arranged in two rows, the provision of the dummy wiring 15 ensures the rigidity of the insulating film 11. It can be improved to the extent that it can be transported, and the rigidity of the insulating film 11 does not become too large. Therefore, the insulating film 11 can be reliably and satisfactorily conveyed at the time of tape production, and no failure such as breakage or deformation occurs.

In this embodiment, the wiring pattern 13
And two rows of sprocket holes 14 provided on both sides of the wiring pattern 13, but a plurality of rows, for example, three or more rows may be arranged in parallel.

Although the modified examples of the structure of the film carrier tape for mounting electronic parts of the present invention have been described above, it is needless to say that the present invention is not limited to these.

Hereinafter, the method for manufacturing the above-described film carrier tape for mounting electronic components will be described in more detail by way of example.

FIG. 6 shows a manufacturing method according to one embodiment.
This manufacturing method will be described using the electronic component mounting film carrier tape according to the first embodiment.

In such a manufacturing method, first, FIG.
As shown in (a), a conductive layer 12 is formed on an insulating film 11.
Prepare a material formed with.

The conductive layer 12 may be directly laminated on the surface of the insulating film 11 (for example, trade name: ESPANEX; Nippon Steel Chemical Co., Ltd.), or by thermocompression bonding using an adhesive or the like. May be formed. The thickness of the conductive layer 12 is, for example, 3 to 35 μm, and preferably 5 to 18 μm.
μm. Note that the conductive layer 12 is preferably an electrolytic copper foil or an electrolytic plated copper layer.

Next, as shown in FIG. 6B, a sprocket hole 14 is formed through the insulating film 11 and the conductive layer 12 by punching or the like. The sprocket holes 14 may be formed from the front surface of the insulating film 11 or may be formed from the back surface of the insulating film 11.

Next, as shown in FIG. 6C, using a general photolithography method, a photoresist material coating solution is applied over the region on the conductive layer 12 where the wiring pattern 13 is to be formed. Photoresist layer 20
To form Further, after positioning the insulating film 11 by inserting positioning pins into the sprocket holes 14, the photoresist material coating layer 20 is patterned by exposing and developing through the photomask 21 to obtain a pattern shown in FIG. A resist pattern 22 for a wiring pattern as shown in d) is formed.

Next, as shown in FIG. 6D, a resist material coating solution is partially applied around each of the sprocket holes 14 using, for example, a transfer method.
A dummy wiring resist pattern 23 for forming the dummy wiring 15 is formed. The method for forming the dummy wiring resist pattern 23 is not limited to the transfer method.
Any method can be used as long as it can be partially applied around each of the sprocket holes 14.

Here, as described above, when the photoresist material coating layer 20 is exposed and developed, positioning pins are inserted into the sprocket holes 14 to position the insulating film 11 and the photomask 21. . At this time, if the coating liquid or the like adheres to the sprocket hole 14, the coating liquid is scattered by the positioning pins to the area to be the wiring pattern 13, and the wiring pattern 1
3 may be short-circuited. However, in the present embodiment, since the sprocket holes 14 and the dummy wirings 15 are formed separately, the photoresist material coating layer 20 is not formed around the sprocket holes 14.
The coating liquid does not adhere to the sprocket holes 14. Therefore, it is possible to prevent the occurrence of a product defect such as a short circuit of the wiring pattern 13 due to the adhesion of the coating liquid or the like in the sprocket hole 14.

The dummy wiring resist pattern 23
May be formed before the wiring pattern resist pattern 22 is formed, or may be separately formed by a transfer method before the sprocket holes 14 are formed.

Next, the wiring pattern resist pattern 2
The conductive layer 12 is dissolved and removed with an etchant using the resist pattern 2 and the dummy wiring resist pattern 23 as a mask pattern, and the wiring pattern resist pattern 22 and the dummy wiring resist pattern 23 are further dissolved and removed with an alkaline solution or the like. As a result, a wiring pattern 13 and a dummy wiring 15 are formed as shown in FIG.

As shown in FIG. 6F, the solder resist layer 17 is formed by using, for example, a screen printing method.

As described above, the dummy wiring resist pattern 23 is the same as the wiring pattern resist pattern 2.
Since the photoresist material coating liquid is not mixed into the sprocket holes 14 by forming it in a process different from the step 2, the photoresist material coating liquid is used by the wiring pattern 13 when positioning using the positioning pins. It is possible to prevent the occurrence of a defect such as a short circuit which is scattered on the top.

When the sprocket holes 14 are not used for positioning in the photolithography process, for example, when a device for positioning is used by a sensor or the like, a photoresist material coating solution is applied to the entire surface of the conductive layer 12 by applying a solution. The wiring pattern 13 and the dummy wiring 15 may be formed simultaneously.

FIG. 7 shows a manufacturing method according to another embodiment. This manufacturing method will be described using the electronic component mounting film carrier tape according to the third embodiment.

In such a manufacturing method, first, FIG.
As shown in (a), the sprocket holes 14, the device holes 16 and the auxiliary sprocket holes 19 are formed through the insulating film 11 by punching or the like.

Next, as shown in FIG. 7B, the conductive layer 12 is formed on the insulating film 11 in a portion other than the region where the auxiliary sprocket holes 19 are provided.

Next, as shown in FIG. 7C, a photoresist material application solution is applied to the entire surface of the conductive layer 12 by photolithography to form a photoresist material application layer 20, and a photomask is formed. Exposure via 21
By performing development, a resist pattern 22 for a wiring pattern and a resist pattern 23 for a dummy wiring as shown in FIG. 7D are simultaneously formed. That is, the dummy wiring resist pattern 23 is formed around the sprocket hole.

To form a resist pattern for patterning the conductive layer 12 as described above, positioning pins are inserted into the auxiliary sprocket holes 19 to position the insulating film 11 and the photomask 21. Therefore, as in the case of the above-described manufacturing method, a short circuit or the like of the wiring pattern 13 due to positioning by the positioning pins can be prevented. Further, since the sprocket holes 14 are not used for positioning, there is no problem even if the photoresist material coating liquid adheres to the sprocket holes 14.
A resist pattern for forming the wiring pattern 13 and the dummy wiring 15 can be simultaneously formed, and the manufacturing process can be simplified.

Of course, also in this case, the dummy wiring resist pattern 23 may be formed by a transfer method or the like in a step different from the step of forming the wiring pattern 13.

Next, the conductive layer 12 not covered with the wiring pattern resist pattern 22 and the dummy wiring resist pattern 23 is removed by etching and dissolving.
Further, the wiring pattern 13 and the dummy wiring 15 are simultaneously formed as shown in FIG. 7E by dissolving and removing the wiring pattern resist pattern 22 and the dummy wiring resist pattern 23 with an alkaline solution or the like.

Thereafter, as shown in FIG. 7F, a solder resist layer 17 is formed on the wiring pattern 13. Here, the solder resist layer 17 is formed by patterning using, for example, a photolithography method.

Finally, both end portions where the auxiliary sprocket holes 19 are formed are cut to obtain a film carrier tape for mounting electronic parts.

In the manufacturing method described above, the insulating film 11
Since the auxiliary sprocket hole 19 is provided in the first layer, a photoresist material coating solution can be applied to the entire surface of the conductive layer 12, so that the manufacturing process can be simplified. Further, since the conductive layer 12 is not formed in a region of the insulating film 11 corresponding to the auxiliary sprocket hole 19, the wiring pattern 13 is formed without contacting a guide provided on a transport path or the like without generating a metal piece. Short circuits and the like can be prevented.

FIG. 8 shows a manufacturing method according to another embodiment. This manufacturing method will be described using the electronic component mounting film carrier tape according to the third embodiment.

In such a manufacturing method, first, FIG.
As shown in (a), a conductive layer 12 is formed on the entire surface of an insulating film 11.

Next, as shown in FIG. 8B, auxiliary sprocket holes 19 and sprocket holes 14 are formed through the conductive layer 12 and the insulating film 11 by punching or the like.

Next, as shown in FIG. 8C, the auxiliary sprocket hole 1 is formed by photolithography.
By applying a photoresist material coating solution on the conductive layer 12 in the region except for the region 9 to form a photoresist material coating layer 20 and exposing and developing through a photomask 21,
A resist pattern 22 for a wiring pattern and a resist pattern 23 for a dummy wiring as shown in FIG.

Next, as shown in FIG. 8D, a dummy wiring resist pattern 23A is formed around each of the auxiliary sprocket holes 19 by using a transfer method or the like.

Next, the conductive layer 12 is dissolved and removed with an etchant using the wiring pattern resist pattern 22 and the dummy wiring resist patterns 23 and 23A as a mask pattern.
8 and the dummy wiring resist patterns 23 and 23A are dissolved and removed with an alkaline solution or the like to obtain FIG.
The wiring pattern 13 and the dummy wirings 15, 15 as shown in FIG.
A is formed.

Note that, as in this embodiment, the insulating film 1
Even when the conductive layer 12 is provided on the entire surface of the substrate 1, the conductive layer 12 around the auxiliary sprocket hole 19 may be completely removed by etching without providing the dummy wiring resist pattern 23A. Absent.

After that, a solder resist layer 17 is formed on the wiring pattern 13 as shown in FIG.

Lastly, both side edges of the insulating film 11 in which the auxiliary sprocket holes 19 are formed are cut to obtain a film carrier tape for mounting electronic parts.

Even by such a manufacturing method, if the auxiliary sprocket hole 19 is used for positioning, it is possible to prevent a short circuit or the like of the wiring pattern 13 due to the positioning by the positioning pin.

Further, since there is a predetermined distance between the end of the insulating film 11 in the width direction and the dummy wiring 15A, the wiring pattern 13 can be formed without contacting a guide provided on a transport path or the like without generating a metal piece. Short circuits and the like can be prevented.

FIG. 9 shows a manufacturing method according to another embodiment. This manufacturing method will be described using the electronic component mounting film carrier tape according to the third embodiment.

In such a manufacturing method, first, FIG.
As shown in (a), a conductive layer 12 is formed on the insulating film 11 in a region excluding the auxiliary sprocket holes 19.

Next, as shown in FIG. 9B, only the auxiliary sprocket holes 19 are formed through the insulating film 11 by punching or the like.

Next, as shown in FIG. 9C, a photoresist material application solution is applied on the conductive layer 12 by photolithography to form a photoresist material application layer 20, and a photomask 21 is formed. Exposure and development are performed through the steps to simultaneously form a resist pattern 22 for a wiring pattern and a resist pattern 23B for a dummy wiring as shown in FIG. 9D. The dummy wiring resist pattern 23B may be formed only in a portion to be the dummy wiring 15, or may be provided up to the sprocket hole 14.

Next, the wiring pattern resist pattern 2
Using the resist pattern 2 and the dummy wiring resist pattern 23B as a mask pattern, the conductive material layer 12 is removed by dissolving the photoresist material coating layer 20 with an etchant. As shown in FIG. 9E, the wiring pattern 13 and the dummy wiring 15 are simultaneously formed.

Thereafter, as shown in FIG. 9F, the dummy wiring 15 and the insulating film 11 are formed by punching or the like.
To form a sprocket hole 14.

Thereafter, a coating solution of a photo solder resist material is applied onto the wiring pattern 13 and then patterned to form a solder resist layer 17.

Finally, both end portions of the insulating film 11 in which the auxiliary sprocket holes 19 are formed are cut to obtain a film carrier tape for mounting electronic parts.

[0097]

As described above, according to the present invention, by providing dummy wires intermittently around sprocket holes, the rigidity of the entire tape is improved to such an extent that it can be transported reliably, and the rigidity is increased. Because it does not become too much, it does not cause tape breakage, deformation, transport failure, etc.
Products can be easily manufactured. Further, since a metal piece is not generated due to contact with a guide provided on a transport path or the like, a short circuit of a wiring pattern can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a film carrier tape for mounting electronic components according to a first embodiment of the present invention, in which FIG.
Is a plan view, and (b) and (c) are cross-sectional views.

FIG. 2 is a cross-sectional view showing another example of a film carrier tape for mounting electronic components according to Embodiment 2 of the present invention.

FIG. 3 is a schematic configuration diagram showing an example of a film carrier tape for mounting electronic components according to Embodiment 3 of the present invention;
(A) is a plan view, and (b) and (c) are cross-sectional views.

FIG. 4 is a schematic configuration diagram showing another example of a film carrier tape for mounting electronic components according to Embodiment 3 of the present invention.

FIG. 5 is a schematic configuration diagram showing a film carrier tape for mounting an electronic component according to a fourth embodiment of the present invention, and (a).
Is a plan view, and (b) is a sectional view.

FIG. 6 is a cross-sectional view illustrating an example of a method for manufacturing a film carrier tape for mounting electronic components according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating an example of a method for manufacturing a film carrier tape for mounting electronic components according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating an example of a method for manufacturing a film carrier tape for mounting electronic components according to another embodiment of the present invention.

FIG. 9 is a cross-sectional view illustrating an example of a method for manufacturing a film carrier tape for mounting electronic components according to another embodiment of the present invention.

[Explanation of symbols]

10, 10A, 10B, 10C Film carrier tape for mounting electronic components 11 Insulating film 12 Conductive layer 13 Wiring pattern 14 Sprocket hole 15, 15A Dummy wiring 16 Device hole 17 Solder resist layer 18 Reinforcement film 19 Auxiliary sprocket hole 20 Photoresist material coating Layer 21 Photomask 22 Wiring pattern resist pattern 23, 23A, 23B Dummy wiring resist pattern

Claims (10)

[Claims] An electronic device having a wiring pattern made of a conductive layer on a surface of a continuous insulating film and a plurality of sprocket holes provided on both sides of the wiring pattern, wherein an electronic component is mounted on the wiring pattern. A film carrier tape for electronic component mounting, wherein dummy wirings are intermittently provided around each of the plurality of sprocket holes. 2. The film carrier tape for mounting electronic parts according to claim 1, wherein a predetermined interval is provided between an end in the width direction of the insulating film and the dummy wiring. 3. The film carrier tape for mounting electronic parts according to claim 1, wherein a plurality of auxiliary sprocket holes are formed outside the width direction of the sprocket holes. 4. The film carrier according to claim 3, wherein the wiring pattern and the sprocket holes formed on both sides of the wiring pattern are arranged in a plurality of rows in the width direction. tape. 5. The film carrier tape for mounting electronic parts according to claim 1, wherein a reinforcing film is provided on a back surface of the insulating film. 6. A wiring pattern formed of a conductive layer on a surface of a continuous insulating film, and a plurality of sprocket holes provided on both sides in a width direction of the wiring pattern, wherein an electronic component is mounted on the wiring pattern. In the method for manufacturing a film carrier tape for mounting electronic components, a resist pattern is formed on the conductive layer and etched to form the wiring pattern and dummy wiring intermittently around the plurality of sprocket holes. A method for producing a film carrier tape for mounting electronic components, comprising a step of forming. 7. The electronic component according to claim 6, wherein a dummy wiring resist pattern for forming a dummy wiring and a wiring pattern resist pattern for forming the wiring pattern are formed in the same step. Manufacturing method of film carrier tape for mounting. 8. The electronic device according to claim 6, wherein a resist pattern for forming a dummy wiring for forming a dummy wiring and a resist pattern for forming a wiring pattern for forming the wiring pattern are formed in different steps. Manufacturing method of film carrier tape for component mounting. 9. The method according to claim 8, wherein at least the resist pattern for the dummy wiring is formed by a transfer method. 10. The conductive layer according to claim 6, wherein an auxiliary sprocket hole is formed outside the width direction of the sprocket hole, and the conductive layer is formed in a region of the insulating film other than the auxiliary sprocket hole. Forming a resist layer on the entire surface of the substrate and patterning the resist layer, thereby simultaneously forming a resist pattern for forming a dummy wiring and a resist pattern for forming a wiring pattern for forming a dummy wiring. A method for producing a film carrier tape for mounting electronic components, comprising: